A liquid cooling system for a server chip

Abstract

The application relates to a server chip liquid cooling system, belonging to the technical field of server cooling, which comprises a base plate arranged on a server mainboard chip, a water cooling plate with a box structure arranged on the base plate, two sets of liquid cooling circulation mechanisms, two kinds of cooling liquids with different densities circulating in the two sets of liquid cooling circulation mechanisms, the two sets of liquid cooling circulation mechanisms being connected with two water cooling plates, the internal spaces of the two water cooling plates being communicated through connecting pipe one and connecting pipe two, one of the water cooling plates being connected with water inlet pipe one and water inlet pipe two, and the other water cooling plate being connected with water outlet pipe one and water outlet pipe two. The lower-layer cooling liquid with a larger density is phase changed to exchange heat, the upper-layer cooling liquid flows to exchange heat, the two heat exchange modes are combined, the cooling effect of the chip is better and the efficiency is higher, so that higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature are obtained, and the computing density and performance are greatly improved.

Description

Technical Field

[0001] This invention relates to a liquid cooling system for server chips, belonging to the field of server cooling technology. Background Technology

[0002] With the development of high-performance computing, the increasing density of data centers, and the growing requirements for energy conservation and environmental protection, single air cooling can no longer meet the heat dissipation needs of servers. Cooling systems are evolving towards water cooling, liquid cooling, and hybrid air-water cooling. In hybrid air-water cooling systems, water cooling is used to dissipate heat from high-power components, removing most of the server's heat, while the remaining low-power components are cooled by air. This type of cooling system has the advantages of high economy, high heat dissipation efficiency, and environmental friendliness.

[0003] As electronic chips become increasingly powerful, they generate significant amounts of heat. Given the rapid pace of development in the computer industry, their dimensions are shrinking, leading to a geometric increase in heat flux density. Conventional air cooling methods are no longer sufficient. Currently, most solutions employ water cooling. Traditional water-cooled plates typically use copper or aluminum to create cold plates and fins for heat exchange with water. Conventional cold plate heatsinks are rectangular or stepped, and these products, along with similar products, exhibit poor heat transfer efficiency. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned problems by providing a server chip liquid cooling system that solves the problems and shortcomings of current server air cooling and conventional water cooling plate cooling methods. It provides better cooling effect and higher efficiency, thereby achieving higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, which greatly improves computing density and performance.

[0005] This invention is achieved through the following technical solution:

[0006] A server chip liquid cooling system includes a substrate covering a server motherboard chip, a water-cooled plate with a box structure covering the substrate, and two sets of liquid cooling circulation mechanisms. Two coolants with different densities circulate in the two sets of liquid cooling circulation mechanisms, and each set of liquid cooling circulation mechanisms is connected to two water-cooled plates.

[0007] The internal spaces of the two water-cooled plates are connected by connecting pipe 1 and connecting pipe 2. One water-cooled plate is connected to water inlet pipe 1 and water inlet pipe 2, and the other water-cooled plate is connected to water outlet pipe 1 and water outlet pipe 2.

[0008] This invention features two sets of liquid cooling circulation mechanisms, each containing a different type of coolant with varying densities. These coolants stratify within the water-cooling plate. The denser coolant enters from the bottom of the plate and does not circulate; it is only replenished when the amount of denser coolant is insufficient. The less dense coolant enters from the top and circulates. The denser coolant in the lower layer adheres closely to the high-temperature chip, continuously vaporizing and rising through the less dense coolant. Because the less dense coolant is constantly circulating, its temperature is lower. The denser coolant, upon passing through the less dense coolant, liquefies and falls back into the lower layer of the water-cooling plate. This combination of phase change heat transfer in the lower layer and flow heat transfer in the upper layer results in better and more efficient chip cooling, leading to higher equipment heat exchange efficiency, a higher energy efficiency ratio, and a lower chip surface temperature, significantly improving computing density and performance.

[0009] A further improvement of the present invention is that the first end of the water inlet pipe is provided with a water inlet, the first end of the water outlet pipe is provided with a water outlet, the second end of the water inlet pipe is provided with a water inlet, and the second end of the water outlet pipe is provided with a water outlet.

[0010] Water inlet 1, water outlet 1, water inlet 2, and water outlet 2 are all installed on the same edge of the server motherboard.

[0011] A further improvement of the present invention is that the first water inlet pipe is connected to the center of the top of the water-cooled plate, the first connecting pipe is connected to the center of the top of the water-cooled plate near the inlet / outlet, and the first connecting pipe is connected to the top of the water-cooled plate away from the inlet / outlet. The coolant with lower density flows in from the top of the water-cooled plate, avoiding mixing with the coolant with higher density, thus preventing any impact on the heat exchange and cooling effect of the coolant on the chip.

[0012] A further improvement of the present invention is that the second connecting pipe is connected to the bottom of the two water-cooling plates. The denser coolant flows in from the bottom of the water-cooling plates, preventing it from mixing with the denser coolant and thus affecting the heat exchange and cooling effect of the coolant on the chip.

[0013] A further improvement of the present invention is that the second water inlet pipe and the second water outlet pipe are connected to the bottom of the water-cooling plate. The denser coolant flows in from the bottom of the water-cooling plate, preventing it from mixing with the less dense coolant and thus affecting the heat exchange and cooling effect on the chip.

[0014] A further improvement of the present invention is that the first water inlet pipe and the second water inlet pipe are fixed by pipe clamps, which are installed on the base plate by screws. Since the first and second water inlet pipes are relatively long, pipe clamps are used for limiting and fixing them to prevent accidental scattering of the pipes.

[0015] A further improvement of the present invention is that the water-cooled plate is provided with a heat sink assembly, which includes multiple vertical plates and multiple heat exchange tubes for connecting the vertical plates. Providing a heat sink assembly within the water-cooled plate further enhances the strong convection heat transfer and heat dissipation effects.

[0016] A further improvement of the present invention is that the vertical plate has multiple serrations on its side surface. This increases the disturbance intensity to the coolant and enhances the convective heat transfer effect.

[0017] A further improvement of the present invention is that an interface four is provided at the center of the top of the water-cooled plate. A water inlet pipe one and a connecting pipe one extend into the internal space of the water-cooled plate through interface four. A nozzle is installed at the end of the water inlet pipe one and the connecting pipe one inside the water-cooled plate, and the nozzle is connected to the water outlet pipe one and the connecting pipe one. The coolant with a lower density is sprayed into the water-cooled plate through the nozzle, increasing the turbulence intensity and enhancing the convective heat transfer effect.

[0018] A further improvement of the present invention is that the bottom two sides of the water-cooled plate are provided with interface one and interface two, and the top one side of the water-cooled plate is provided with interface three, with interface three and interface two located on the same side of the water-cooled plate. Interface one connects to water inlet pipe two and connecting pipe two, interface two connects to water outlet pipe two and connecting pipe two, and interface three connects to water outlet pipe one and connecting pipe one, which facilitates the reasonable positioning of the connection between the pipes and the water-cooled plate.

[0019] Compared with the prior art, the beneficial effects of this invention are:

[0020] This invention features two sets of liquid cooling circulation mechanisms, each containing a different type of coolant with varying densities. These coolants stratify within the water-cooling plate. The denser coolant enters from the bottom of the plate and does not circulate; it is only replenished when the amount of denser coolant is insufficient. The less dense coolant enters from the top and circulates. The denser coolant in the lower layer adheres closely to the high-temperature chip, continuously vaporizing and rising through the less dense coolant. Because the less dense coolant is constantly circulating, its temperature is lower. The denser coolant, upon passing through the less dense coolant, liquefies and falls back into the lower layer of the water-cooling plate. This combination of phase change heat transfer in the lower layer and flow heat transfer in the upper layer results in better and more efficient chip cooling, leading to higher equipment heat exchange efficiency, a higher energy efficiency ratio, and a lower chip surface temperature, significantly improving computing density and performance. Attached Figure Description

[0021] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural schematic diagram of a specific embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the cross-sectional structure of the water-cooled plate according to a specific embodiment of the present invention.

[0024] In the diagram: 1. Server motherboard; 2. Base plate; 3. Water-cooled plate; 4. Inlet 1; 5. Inlet pipe 1; 6. Outlet 1; 7. Outlet pipe 1; 8. Connecting pipe 1; 9. Pipe clamp; 10. Screw; 11. Inlet 2; 12. Inlet pipe 2; 13. Outlet 2; 14. Outlet pipe 2; 15. Heat sink assembly; 16. Vertical plate; 17. Serrated edge; 18. Heat exchange tube; 19. Nozzle; 20. Connecting pipe 2; 21. Interface 1; 22. Interface 2; 23. Interface 3; 24. Interface 4. Detailed Implementation

[0025] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0026] like Figure 1 , Figure 2 The server chip liquid cooling system shown includes a substrate 2 covering the chip on the server motherboard 1, a water-cooled plate 3 with a box structure covering the substrate 2, and two sets of liquid cooling circulation mechanisms. Two coolants with different densities circulate in the two sets of liquid cooling circulation mechanisms, and each set of liquid cooling circulation mechanisms is connected to two water-cooled plates 3.

[0027] The internal spaces of the two water-cooled plates 3 are connected by connecting pipe 1 8 and connecting pipe 2 20. One water-cooled plate 3 is connected to water inlet pipe 1 5 and water inlet pipe 2 12, and the other water-cooled plate 3 is connected to water outlet pipe 1 7 and water outlet pipe 2 14.

[0028] This invention features two sets of liquid cooling circulation mechanisms, each containing a different type of coolant with varying densities. These coolants are layered within the water-cooling plate 3. The denser coolant enters from the bottom of the water-cooling plate 3 and does not require circulation; it is only replenished when the amount of denser coolant is insufficient. The less dense coolant enters from the top of the water-cooling plate 3 and circulates. The denser coolant in the lower layer adheres closely to the high-temperature chip, continuously vaporizing and rising through the less dense coolant. Because the less dense coolant is constantly circulating, its temperature is lower. The denser coolant, upon passing through the less dense coolant, liquefies and falls back into the lower layer of the water-cooling plate 3. The lower layer of denser coolant undergoes phase change heat transfer, while the upper layer undergoes flow heat transfer. This combination of heat transfer methods results in better and more efficient chip cooling, leading to higher equipment heat exchange efficiency, a higher energy efficiency ratio, and a lower chip surface temperature, significantly improving computing density and performance.

[0029] Among them, the inlet pipe 15 is provided with inlet 4 at the end, the outlet pipe 17 is provided with outlet 6 at the end, the inlet pipe 22 is provided with inlet 211 at the end, and the outlet pipe 24 is provided with outlet 23 at the end.

[0030] Water inlet 14, water outlet 16, water inlet 21, and water outlet 23 are all installed on the same side edge of the server motherboard 1;

[0031] Water inlet pipe 5 is connected to the center of the top of water-cooled plate 3, and connecting pipe 8 is connected to the center of the top of water-cooled plate 3 near the inlet and outlet, and also to the top of water-cooled plate 3 away from the inlet and outlet. The coolant with lower density flows in from the top of water-cooled plate 3 to avoid mixing with the coolant with higher density, thus preventing any impact on the heat exchange and cooling effect on the chip.

[0032] Among them, the connecting pipe 20 is connected to the bottom of the two water-cooled plates 3. The denser coolant flows in from the bottom of the water-cooled plate 3 to avoid mixing with the denser coolant, thereby affecting the heat exchange and cooling effect of the coolant on the chip.

[0033] Water inlet pipe 2 12 and water outlet pipe 2 14 are connected to the bottom of water-cooled plate 3. The coolant with higher density flows into the bottom of water-cooled plate 3 to avoid mixing with the coolant with lower density, thereby affecting the heat exchange and cooling effect of the coolant on the chip.

[0034] Among them, water inlet pipe 1 5 and water inlet pipe 2 12 are fixed by pipe clamp 9. The pipe clamp 9 is installed on the base plate 2 by screw 10. Water inlet pipe 1 5 and water inlet pipe 2 12 are relatively long. Pipe clamp 9 is used to limit and fix them to prevent the pipes from accidentally falling apart.

[0035] The water-cooled plate 3 is equipped with a heat sink assembly 15, which includes multiple vertical plates 16 and multiple heat exchange tubes 18 for connecting the vertical plates 16. The heat sink assembly 15 is installed in the water-cooled plate 3 to further enhance the strong convection heat transfer and heat dissipation effect. The heat sink assembly 15 is coated with special materials, such as copper powder or graphite film, which is beneficial to improving the heat transfer effect.

[0036] The vertical plate 16 has multiple serrations 17 on its side to increase the disturbance intensity to the coolant and enhance the convective heat transfer effect.

[0037] The water-cooled plate 3 has an interface 24 at the top center. The water inlet pipe 5 and the connecting pipe 8 extend into the internal space of the water-cooled plate 3 through the interface 24. The ends of the water inlet pipe 5 and the connecting pipe 8 inside the water-cooled plate 3 are equipped with nozzles 19. The nozzles 19 are connected to the water outlet pipe 7 and the connecting pipe 8. The coolant with a lower density is sprayed into the water-cooled plate 3 through the nozzles to increase the disturbance intensity and enhance the convective heat transfer effect.

[0038] The bottom of the water-cooled plate 3 has two interfaces, one 21 and the other 22, and the top of the water-cooled plate 3 has one interface 23. Interface 23 and interface 22 are located on the same side of the water-cooled plate 3. Interface 21 connects to the inlet pipe 12 and the connecting pipe 20. Interface 22 connects to the outlet pipe 14 and the connecting pipe 20. Interface 23 connects to the outlet pipe 7 and the connecting pipe 8, which facilitates the reasonable connection between the pipes and the water-cooled plate 3.

[0039] Working principle:

[0040] This invention features two sets of liquid cooling circulation mechanisms, each containing a different type of coolant with varying densities. These coolants are layered within the water-cooling plate 3. The denser coolant enters from the bottom of the water-cooling plate 3 and does not require circulation; it is only replenished when the amount of denser coolant is insufficient. The less dense coolant enters from the top of the water-cooling plate 3 and circulates. The denser coolant in the lower layer adheres closely to the high-temperature chip, continuously vaporizing and rising through the less dense coolant. Because the less dense coolant is constantly circulating, its temperature is lower. The denser coolant, upon passing through the less dense coolant, liquefies and falls back into the lower layer of the water-cooling plate 3. The lower layer of denser coolant undergoes phase change heat transfer, while the upper layer undergoes flow heat transfer. This combination of heat transfer methods results in better and more efficient chip cooling, leading to higher equipment heat exchange efficiency, a higher energy efficiency ratio, and a lower chip surface temperature, significantly improving computing density and performance.

[0041] The coolant with higher density enters the two water-cooling plates 3 through inlet 11 and inlet pipe 12, and flows out through outlet pipe 14; the coolant with lower density enters the two water-cooling plates 3 through inlet pipe 5 and inlet 4, and flows out through outlet 7 and outlet pipe 6.

[0042] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0043] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0044] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid cooling system for server chips, comprising a base plate (2) arranged to cover the chips on a server main board (1), a water cooling plate (3) of a box structure arranged to cover the base plate (2), characterized in that, Two sets of liquid cooling circulation mechanisms are also included, two sets of liquid cooling circulation mechanisms are circulated by two kinds of different density cooling liquid, two sets of liquid cooling circulation mechanisms are connected including two water-cooled plates (3); The internal space of the two water-cooled plates (3) is communicated by the connecting pipe one (8) and the connecting pipe two (20), one of the water-cooled plates (3) is connected with the water inlet pipe one (5) and the water inlet pipe two (12), and the other water-cooled plate (3) is connected with the water outlet pipe one (7) and the water outlet pipe two (14).

2. The liquid cooling system for a server chip according to claim 1, wherein, The end of the water inlet pipe one (5) is provided with a water inlet one (4), the end of the water outlet pipe one (7) is provided with a water outlet one (6), the end of the water inlet pipe two (12) is provided with a water inlet two (11), and the end of the water outlet pipe two (14) is provided with a water outlet two (13). The water inlet one (4), the water outlet one (6), the water inlet two (11) and the water outlet two (13) are all installed on the same side edge of the server mainboard (1).

3. The liquid cooling system for a server chip according to claim 1, wherein, The water inlet pipe one (5) is communicated with the top center of the water-cooled plate (3), the connecting pipe one (8) is communicated with the top center of the water-cooled plate (3) close to the inlet and outlet, and the connecting pipe one (8) is communicated with the top of the water-cooled plate (3) away from the inlet and outlet.

4. The liquid cooling system for a server chip according to claim 1, wherein, The connecting pipe two (20) is communicated with the bottom of the two water-cooled plates (3).

5. The liquid cooling system for a server chip according to claim 1, wherein, The water inlet pipe two (12) and the water outlet pipe two (14) are communicated with the bottom of the water-cooled plate (3).

6. The liquid cooling system for a server chip according to claim 1, wherein, The water inlet pipe one (5) and the water inlet pipe two (12) are fixed by the pipe clamp (9), and the pipe clamp (9) is installed on the base plate (2) by the screw (10).

7. The liquid cooling system for a server chip according to claim 1, wherein, The water-cooled plate (3) is provided with a fin assembly (15) inside, and the fin assembly (15) comprises a plurality of vertical plates (16) and a plurality of heat exchange pipes (18) for connecting the vertical plates (16).

8. The liquid cooling system for a server chip according to claim 7, wherein, The side surface of the vertical plate (16) is provided with a plurality of sawteeth (17).

9. The liquid cooling system for server chips according to claim 1, wherein, The top center of the water-cooled plate (3) is provided with an interface four (24), the water inlet pipe one (5) and the connecting pipe one (8) extend into the internal space of the water-cooled plate (3) from the interface four (24), and the end of the water inlet pipe one (5) and the connecting pipe one (8) located in the water-cooled plate (3) is provided with a spray head (19), and the spray head (19) is connected with the water outlet pipe one (7) and the connecting pipe one (8).

10. The liquid cooling system for a server chip according to claim 1, wherein, The bottom of the water-cooled plate (3) is provided with an interface one (21) and an interface two (22) on both sides, and the top of the water-cooled plate (3) is provided with an interface three (23) on one side, and the interface three (23) and the interface two (22) are located on the same side of the water-cooled plate (3).

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