Preparation Method and Design Method of Hollow Rod Wall Waveguide Device Based on CGA Packaging

Abstract

The present invention relates to the technical field of transmission line waveguides, and particularly to a preparation method of a hollow rod wall waveguide device based on CGA packaging, which comprises the following steps: providing a first copper metal layer having a feed hole, the first copper metal layer having opposite first and second surfaces; bonding a carrier plate to the first surface of the first copper metal layer; sequentially forming a titanium metal layer and a copper metal layer from bottom to top on the second surface of the first copper metal layer; coating a photoresist dry film on the upper surface of the copper metal layer, performing photolithography and etching to form a patterned copper metal layer to expose a part of the titanium metal layer; using the patterned copper metal layer as a mask, etching away the patterned copper metal layer and forming a patterned titanium metal layer; identifying the patterned titanium metal layer, and performing screen positioning to brush conductive silver paste; identifying the patterned titanium metal layer, positioning the positions of the copper column pads and completing the column grid array packaging and stud implantation of the copper columns according to the design drawings; providing a second copper metal layer having a feed hole; performing dotting with silver paste on the top surface of the copper columns to weld them to the second copper metal layer.

Description

Technical Field

[0001] The present invention relates to the technical field of transmission line waveguides, and particularly relates to a preparation method and a design method for a hollow rod wall waveguide device based on CGA packaging. Background Art

[0002] With the development of transmission lines to date, they have played an important role in various civilian and military systems such as radio communication, broadcasting, navigation, and radar. Due to the wide range of applications and importance of transmission lines in various fields, it is of great significance to achieve high-performance transmission lines that are easy to process and have low losses.

[0003] Existing transmission lines, such as microstrip lines and waveguides, have been widely used in radio systems of various frequency bands. Microstrip lines are easy to construct various microwave circuit elements and can be combined with other microwave devices to form small planar and integrated microwave circuit units. However, they cannot be used in high-power transmission systems, are not suitable for long-distance transmission lines, and at high frequencies, the microstrip line feeding network will have relatively high ohmic losses and dielectric losses, as well as stray radiation and leakage in the form of surface waves. A waveguide refers to a hollow metal waveguide with various cross-sectional shapes. It has neither dielectric loss nor radiation loss, has advantages such as a large power capacity, small conductor and dielectric losses, and a simple structure that is easy to manufacture, and is easy to achieve broadband and high-gain performance, and is widely used in aerospace and radar communication systems, etc. However, there are problems such as a large weight and inconvenience for system integration, and high-precision preparation and mass production in the millimeter-wave / terahertz high-frequency field are still challenging. The substrate integrated waveguide SIW (Substrate Integrated Waveguide), which has a similar structure and propagation characteristics to traditional waveguides, has good advantages at high frequencies, with characteristics such as low loss, low radiation, and high power capacity. However, its structure is difficult to design as flexibly as a microstrip line. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the above-mentioned prior art and provide a preparation method for a hollow rod wall waveguide device based on CGA packaging.

[0005] To solve the above technical problems, the present invention provides a preparation method for a hollow rod wall waveguide device based on CGA packaging, including the following steps:

[0006] Provide a first copper metal layer having a feed hole, the first copper metal layer having opposite first and second surfaces;

[0007] Bond a carrier plate to the first surface of the first copper metal layer;

[0008] Form a titanium metal layer and a copper metal layer on the second surface of the first copper metal layer in sequence from bottom to top;

[0009] Coat a photolithographic dry film on the upper surface of the copper metal layer, perform photolithography and etching to form a patterned copper metal layer, so as to expose a part of the titanium metal layer;

[0010] Using the patterned copper metal layer as a mask, etch away the patterned copper metal layer and form a patterned titanium metal layer;

[0011] Identify the patterned titanium metal layer and perform screen positioning to brush conductive silver paste;

[0012] Identify the patterned titanium metal layer, position the positions of the copper pillar pads and complete the column grid array packaging and implanting of the copper pillars according to the design drawings. The copper pillars are arranged periodically, and an air gap is formed between adjacent copper pillars to form a transmission channel;

[0013] Provide a second copper metal layer having a feed hole;

[0014] Apply silver paste on the top surface of the copper pillar for spot gluing to weld it to the second copper metal layer.

[0015] Column grid array (CGA) packaging further expands the packaging size and increases the number of pins on the one hand. It is a device packaging type that can mass-produce more than 1000 I / O numbers, and has the following advantages: better anti-fatigue performance, better heat dissipation performance, and at the same time has high temperature resistance, high voltage resistance and good anti-humidity performance, etc. Moreover, the packaging structure of the CGA device can effectively shorten the signal path, reduce the parasitic effect, and improve the signal speed and quality.

[0016] On the other hand, CGA packaging can meet the requirements of high-performance FPGA and other fields, especially aerospace applications, for high performance, high density and high reliability of devices. The hollow rod wall waveguide based on the CGA packaging process has advantages such as low loss, wide bandwidth, high reliability and good heat dissipation performance.

[0017] In a better embodiment, the thickness of the first copper metal layer is 0.4 - 0.8 mm, preferably 0.5 mm, and the thickness of the second copper metal layer is 0.4 - 0.8 mm, preferably 0.5 mm.

[0018] It should be noted that in the present invention, considering the later stacked devices, the thinner the thickness of the first copper metal layer and the second copper metal layer, the better. However, when the thickness of the first copper metal layer and the second copper metal layer is less than 0.4 mm, it becomes too soft to be processed. Therefore, it is required that the thickness of the first metal layer and the second metal layer should be above 0.4 mm; without considering its stacking, a thicker thickness can be selected, and it is not limited to 0.4 - 0.8 mm;

[0019] In some other embodiments, the thicknesses of the first copper metal layer and the second copper metal layer can be the same or different;

[0020] In a better embodiment, after forming the patterned titanium metal layer, the carrier substrate is removed, and a film is pasted on the first surface.

[0021] In a better embodiment, the carrier substrate is a glass carrier substrate.

[0022] In a better embodiment, the thickness of the titanium metal layer is 0.05 - 0.15 μm, preferably 0.1 μm; the thickness of the copper metal layer is 0.8 - 1.2 μm, preferably 1 μm.

[0023] In a better embodiment, before providing the first copper metal layer and the second copper metal layer, surface planarization treatment and punching of positioning holes are sequentially performed on both of them.

[0024] In a better embodiment, the surface planarization treatment is performed by means of CMP chemical polishing.

[0025] In a better embodiment, the center distance between two adjacent copper pillars is ≥ 0.1 mm.

[0026] In a better embodiment, the diameter of the copper pillar is 0.4 - 0.6 mm, preferably 0.5 mm, and the height is 1.4 - 1.6 mm, preferably 1.5 mm.

[0027] The hollow rod - wall waveguide based on the column - grid - array (CGA) packaging process is a new type of waveguide form. It uses a row of CGA copper pillars periodically punched on the dielectric to replace the traditional waveguide metal wall, and can confine the electromagnetic wave within a certain space range to propagate forward. Compared with the traditional rectangular waveguide, the hollow rod - wall waveguide based on the column - grid - array (CGA) packaging process has the advantages of being easy to mass - produce and integrate, light weight, low cost, etc., and also has the low - loss propagation characteristics similar to those of the rectangular waveguide. The biggest difference from the traditional substrate - integrated waveguide is that the hollow rod - wall waveguide based on the column - grid - array (CGA) packaging process does not use traditional dielectric filling, but only air filling. Therefore, compared with the substrate - integrated waveguide, the dielectric loss in the hollow rod - wall waveguide based on the column - grid - array (CGA) packaging process can be ignored, and it is easier to achieve low - loss transmission and high - efficiency devices.

[0028] The present invention provides a design method for a hollow rod - wall waveguide device, which uses the hollow rod - wall waveguide device prepared by the preparation method of the hollow rod - wall waveguide device based on CGA packaging as described in any one of the above, and designs by the following steps:

[0029] Determine the range of the long side and the short side of the waveguide according to the designed antenna operating frequency band, then determine the waveguide size and the pitch of the column - grid - array copper pillars according to the design of the traditional substrate - integrated waveguide, and finally determine the long - side size of the waveguide and the pitch of the copper pillars;

[0030] Design the feeding of the waveguide. According to the operating frequency band, use the standard waveguide WR15 in the 60G band for feeding. The feeding structure is a U-shaped structure;

[0031] Design resonators with two lengths and determine the parameters. Set two sets of column grid array copper columns in the resonator and adjust the distance between the two sets of column grid array copper columns. This model can be used to test the Q value of a single frequency point;

[0032] Design a T-shaped power divider and determine the parameters;

[0033] Design a 3dB coupler and determine the parameters;

[0034] Design a 1×4 radiating slot model to make it radiate externally, determine the slot size, and adjust the distance between the end slot and the copper column as well as the horizontal and vertical distances between adjacent slots;

[0035] Design a short-circuit model, which is used to test the above-mentioned designed devices using the TRL calibration method when testing the above-mentioned devices.

[0036] In summary, the present application includes at least one of the following beneficial technical effects:

[0037] The present invention provides a hollow rod wall waveguide device. In the design, the dimensions and spacing of the CGA copper columns in the antenna are emphasized. In terms of processing, the present invention adopts the column grid array (CGA) packaging process. Compared with the traditional processing process, it effectively overcomes the inevitable error defects in welding technologies such as the traditional diffusion welding process, and realizes a processing error within 50um. The loss of the present invention is less than 0.002dB / mm, and at the same time, it realizes full coverage of the W band. Moreover, due to the hollow structure, the heat dissipation effect is good, which has incomparable advantages compared with the traditional SIW. The present invention gives full play to the characteristics of the antenna structure and the processing technology advantages brought by the structure, and realizes the advantages of low loss, wide frequency band, and high heat dissipation. Therefore, it has wide application value. The present invention designs a variety of devices based on the column grid array (CGA) packaging process, and in the later work, the size of the device can also be changed by stacking, as well as the design of more complex devices such as filters. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a top view structural schematic diagram for explaining a hollow rod wall waveguide device provided by an embodiment of the present invention;

[0039] Figure 2 - Figure 13 is a sectional view of a manufacturing method of a hollow rod wall waveguide device provided by an embodiment of the present invention;

[0040] Figure 14is the design flow chart of the hollow waveguide device provided by the present invention;

[0041] Figure 15 is the present invention Figure 1 the feeding structure in the illustrated embodiment;

[0042] Figure 16 is the present invention Figure 1 the top view of the straight waveguide in the illustrated embodiment;

[0043] Figure 17 is the present invention Figure 1 the top view of the T-shaped power divider in the illustrated embodiment;

[0044] Figure 18 is the present invention Figure 1 the top view of the resonant cavity in the illustrated embodiment;

[0045] Figure 19 is the present invention Figure 1 the top view of the 3dB coupler in the illustrated embodiment;

[0046] Figure 20 is the present invention Figure 1 the top view of the 1×4 radiation slot in the illustrated embodiment;

[0047] Figure 21 is the present invention Figure 1 the top view of the short circuit in the illustrated embodiment;

[0048] Figure 22 is the schematic diagram of the through hole structure formed by TGV processing in a preferred embodiment of the present invention;

[0049] Figure 23 is the present invention Figure 1 the reflection diagram of the straight waveguide in the illustrated embodiment;

[0050] Figure 24 is the present invention Figure 1 the loss diagram of the straight waveguide within the bandwidth in the illustrated embodiment.

[0051] Explanation of reference numerals: 10, the first copper metal layer; 11, the first surface; 12, the second surface; 13, the test hole; 14, the feeding hole; 20, the copper column; 30, the second copper metal layer; 40, the carrier plate; 50, the titanium metal layer; 51, the patterned titanium metal layer; 60, the copper metal layer; 61, the patterned copper metal layer; 70, the photoresist dry film; 80, the conductive silver paste. Detailed implementation manners

[0052] The following further describes the present invention in conjunction with the attached Figure 1-24 drawings and specific implementation manners.

[0053] Certain directional terms used hereinafter to describe the drawings, such as "inner", "outer", "above", "below" and other directional terms, will be understood to have their normal meanings and refer to those directions involved when normally viewing the drawings. Unless otherwise specified, the directional terms described in this specification are basically in accordance with the conventional directions understood by those skilled in the art.

[0054] The terms "first", "the first", "second", "the second" and their similar terms used in the present invention do not represent any order, quantity or importance in the present invention, but are used to distinguish one component from other components.

[0055] Please refer to Figure 1 , Figure 1 , which is a top view structural schematic diagram of a hollow rod-wall waveguide device provided by an embodiment of the present invention. It can be a structural schematic diagram obtained by looking down from one side of the first copper metal layer 10, or a structural schematic diagram obtained by looking down from one side of the second copper metal layer 30; an embodiment of the present invention provides a hollow rod-wall waveguide device, which includes: a first copper metal layer 10, a plurality of copper pillars 20, and a second copper metal layer 30; before each process, the first copper metal layer 10 and the second copper metal layer 30 are first drilled with test holes 13 and feed holes 14, and the feed holes 14 on the first copper metal layer 10 are matched with the feed holes 14 on the second copper metal layer 30; in this embodiment, the copper pillars 20 are completed by a column grid array packaging and implanting process, and both ends of the copper pillars 20 are respectively fixed on the second copper metal layer 30 and the first copper metal layer 10. The first copper metal layer 10 has opposite first surface 11 and second surface 12, and its surface facing the second copper metal layer 30 is the second surface 12. The second surface 12 has a patterned titanium metal layer 51, which has a marking function when implementing screen printing of conductive silver paste 80 and aligning the solder joints of the copper pillars 20 in the column grid array, so that the processing error is controlled within 50 μm.

[0056] Figures 2 to 13 is a cross-sectional view of a manufacturing method of a hollow rod-wall waveguide device based on CGA packaging provided by an embodiment of the present invention;

[0057] An embodiment of the present invention provides a preparation method of a hollow rod-wall waveguide device, including the following steps:

[0058] Specifically, please refer to Figure 2 , to provide a first copper metal layer 10 having a feed hole. The first metal 10 has opposite first surface 11 and second surface 12, and the thickness of the first copper metal layer 10 is 0.5 mm;

[0059] Before bonding the carrier board 40 to the first copper metal layer 10, perform a surface planarization process on the first copper metal layer 10; the surface planarization process is carried out by means of CMP chemical polishing.

[0060] Please refer to Figure 3 , laser drilling. Perform laser drilling on the first copper metal layer 10. The hole is a test hole 13, through which the flange is passed and the first copper metal layer 10 is fixed for testing. The laser drilling can be carried out by means of high-energy laser.

[0061] Please refer to Figure 4 , bond a carrier board 40 on the first surface 11 of the first copper metal layer 10. The carrier board 40 is a glass carrier board, such as B270 glass.

[0062] Please refer to Figure 5 , form a titanium metal layer 50 and a copper metal layer 60 in sequence from bottom to top on the second surface 12 of the first copper metal layer 10. The thickness of the titanium metal layer 50 is 0.5 μm; the thickness of the copper metal layer 60 is 1 μm. The method for forming the foregoing metal layers can be PVD. A thinner titanium metal layer is selected to reduce processing errors and avoid affecting the test results.

[0063] Please refer to Figure 6 , coat a photoresist dry film 70 on the upper surface of the copper metal layer 60.

[0064] Please refer to Figure 7 , perform photolithography and etching to form a patterned copper metal layer 61 to expose part of the titanium metal layer 50.

[0065] Please refer to Figure 8 , using the patterned copper metal layer 61 as a mask, etch away the patterned copper metal layer 61 and part of the titanium metal layer 50 and form a patterned titanium metal layer 51. Metal titanium is on the metal copper substrate, and its color is easy to identify, adhere to, and has little impact on signal transmission.

[0066] Please refer to Figure 9 , remove the carrier board 40 and apply a film on the first surface 11. Specifically, a high-temperature yellow tape can be used to apply a film on the first surface 11 to play an insulating role, isolate metal ions from passing through the holes, and short-circuit the upper and lower metal layers.

[0067] Please refer to Figure 10 , identify the patterned titanium metal layer 51 and apply conductive silver paste 80 by means of copper mesh positioning brush.

[0068] Please refer to Figure 11, identify the patterned titanium metal layer 51, locate the pad positions of the copper pillars 20 and complete the column grid array packaging and implanting of the copper pillars according to the design drawings to form CGA copper pillars. The center distance between two adjacent copper pillars 20 is ≥ 0.1 mm. Preferably, in the waveguide device provided by the present invention, the adjacent distance of the CGA copper pillars is preferably between 0.1 - 0.5 mm. The diameter of the copper pillar is 0.5 mm and the height is 1.5 mm. At this size, the constraints of device loss and processing difficulty can be effectively balanced. The higher the height of the copper pillar, although the loss is smaller, the processing difficulty is greater at the same time. The CGA copper pillar has a great advantage in terms of loss, which is not possessed by the traditional waveguide metal wall. Therefore, a smaller size can be selected for implementation;

[0069] Please refer to Figure 12 、 Figure 13 , apply silver paste for dotting on the top surface of the copper pillar 20 for welding to the second copper metal layer 30. The second copper metal layer 30 has a feed hole matching the first copper metal layer 10. The thickness of the second copper metal layer 30 is 0.5 mm.

[0070] As another implementation, in order to further improve the processing accuracy, the present invention provides another embodiment, which uses the TGV (Through Glass Via) technology to fabricate the upper and lower plates based on glass copper plating, that is, to form the first metallization layer and the second metallization layer, similar to the first copper metal layer and the second copper metal layer in the foregoing embodiment, and then implement the column grid array packaging and implanting of the copper pillars. Among them, the TGV technology is a wafer-level three-dimensional packaging interconnection technology, which has excellent high-frequency electrical characteristics, simple process flow, does not require deposition of an insulating layer, has strong mechanical stability, small warpage and low cost, and is widely used in radio frequency components, optoelectronic integration, etc.

[0071] The cross-section of the processed plate is as Figure 22 shown. This structure is applied to the waveguide transition part. Its side wall has a certain protrusion structure. Since its θ angle is only 2° to 3°, the influence on the waveguide is small, so it can be ignored. Among them, the middle part is glass, and from the glass surface from the inside to the outside are a titanium layer and a copper layer. Among them, the titanium layer is the intermediate layer between the copper layer and the glass, used to enhance the adhesion between them. Its thickness is 0.1 μm; the thickness of the copper layer is 5 μm.

[0072] Refer to Figure 14 , the present invention provides a design method for a hollow rod wall waveguide device. The hollow rod wall waveguide device is fabricated by using the preparation method of the hollow rod wall waveguide device as described above, and the following steps are used for design:

[0073] Determine the range of the long side and short side of the waveguide according to the operating frequency band of the designed antenna, and then further determine the waveguide size and the spacing of CGA copper posts according to the design of the traditional substrate integrated waveguide. Finally, the long side size of the waveguide is determined to be 3.44 mm, and the copper post spacing is 0.5 mm;

[0074] Perform a feeding design for the waveguide. According to the operating frequency band, the present invention uses the standard waveguide WR15 in the 60G band for feeding. This feeding structure is a U-shaped structure, which has a good feeding effect and is convenient for processing;

[0075] Design resonators with two lengths and determine the parameters. There are two groups of copper posts in the resonator. By controlling the distance between the two groups of copper posts, a good resonance effect is achieved at 61.5 GHz;

[0076] Design a T-shaped power divider and determine the parameters. Adjust the reflection of the T-shaped power divider by adding two groups of copper posts to achieve a good reflection effect;

[0077] Design a 3dB coupler and determine the parameters. Adjust the coupling effect in the coupler through the waist pinching structure and the coupling slot length;

[0078] Design a 1×4 radiation slot model to make it radiate externally and determine the slot size. By adjusting the distance between the end slot and the copper post and the horizontal and vertical distances between adjacent slots, a good matching and radiation effect is achieved;

[0079] Design a short-circuit model, which is used to test the above-mentioned devices using the TRL calibration method when testing the above-mentioned devices and reduce errors.

[0080] This embodiment is a hollow rod wall waveguide based on CGA copper posts. This implementation uses a back-feed feeding with a center frequency of 61.5 GHz. In this embodiment, a design method of a hollow rod wall waveguide based on CGA copper posts is adopted, and the HFSS simulation software is used to design and simulate analyze this waveguide. The specific design steps are as follows:

[0081] Please refer to Figure 15 , Figure 15 For the feeding methods of all devices, the standard waveguide WR15 in the 60GHz band is used for feeding at the entrance. The energy is coupled into the device through the standard waveguide and the entrance. By optimization, the feeding port size bx is set to 2.658 mm, by is set to 1.163 mm, where the offset p1 of some copper posts is set to 0.700 mm, the offset p2 is set to 0.800 mm, the offset p3 is set to 0.736 mm, the offset p4 is set to 0.736 mm, the offset p5 is set to 0.88 mm, and the distance p6 from the center of the feeding port to the center of the outermost copper post is set to 2.626 mm.

[0082] Please refer toFigure 16 , Figure 16 It is the top view of the straight waveguide model. Appropriate CGA copper pillar sizes are selected. By optimizing the width of the waveguide with a hollow rod wall in the CGA copper pillar and controlling the spacing between adjacent CGA copper pillars in the same row, the electromagnetic wave passing rate in the straight waveguide is optimized. Among them, the diameter r of the CGA copper pillar in the straight waveguide is 0.5 mm, the center spacing d between adjacent CGA copper pillars in the same row is set to 0.5 mm. To ensure meeting the requirements of the processing technology and effective transmission of electromagnetic waves while optimizing reflection, the width w of the waveguide with a hollow rod wall in the CGA copper pillar is set to 3.44 mm, the height h is set to 2.5 mm, and the height of the CGA copper pillar is 1.5 mm. Figure 23 It is the reflection diagram of a 42 - mm - long waveguide with a hollow rod wall. The bandwidth with s11 < 20 dB is 13.11%. Figure 24 It is the loss of this waveguide. It can be seen that the overall loss of the waveguide within the frequency bandwidth is less than 0.01 dB.

[0083] Please refer to Figure 17 , Figure 17 It is the top view of the T - type power divider. The reflection of the T - type power divider is adjusted by two additional groups of copper pillars to achieve a good matching effect. The width of the waveguide with a hollow rod wall in the CGA copper pillar in the T - type power divider is also set to w, and the height is also set to h. For the T - type power divider, the window width w1 is 3.454 mm, the offset o1 of the inner CGA copper pillar is 1.190 mm, and the offset o2 of the outer CGA copper pillar is 1.602 mm.

[0084] Please refer to Figure 18 , Figure 18 It is the top view of the resonator model. The width of the waveguide with a hollow rod wall in the CGA copper pillar in the resonator is also set to w, and the height is also set to h. A resonator is formed by adding 4 pairs of copper pillars outside the straight waveguide. Through optimization, the cavity length cl is set to 6.25 mm, the offset o3 of the 4 pairs of copper pillars is 1 mm, and the inner - cavity width w2 is 2.04 mm.

[0085] Please refer to Figure 19 , Figure 19 It is the top view of the 3 - dB coupler. This coupler has four ports, two inputs and two outputs. The width of the waveguide with a hollow rod wall in the CGA copper pillar in the coupler is also set to w, and the height is also set to h. Through optimization, at the coupling point, the offset off1 is set to 0.301 mm, the offset off2 is set to 0.339 mm, the offset off3 is set to 0.483 mm, the offset o4 is set to 0.8 mm, and the offset o5 is set to 0.651 mm.

[0086] Please refer to Figure 20 , Figure 20It is a top view of a 1×4 radiating slot, where the width of the hollow rod wall waveguide of the CGA copper column is also set to w, and the height is also set to h. Through optimization, the length of each slot fx is set to 2.451 mm, the distance px between the centers of adjacent slots in the horizontal direction is 6.566 mm, and the distance py between the centers of adjacent slots in the vertical direction is 1.539 mm.

[0087] Please refer to Figure 21 , which is the short-circuit top view in the embodiment of the present invention Figure 1 shown.

[0088] The present invention provides a hollow rod wall waveguide prepared based on a column grid array (CGA) packaging process and its design method. Devices such as adapters, power dividers, couplers, and waveguide slot antennas designed have the advantages of easy processing, low loss, wide frequency band, etc., and can be widely used in fields such as radar, satellites, and 5G communications.

[0089] As mentioned above, it is only a preferred specific embodiment of the present invention, but the design concept of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention who makes non-substantive modifications to the present invention using this concept shall fall within the scope of infringement of the present invention.

Claims

1. A preparation method of a hollow rod wall waveguide device based on CGA packaging, characterized in that, It includes the following steps: Provide a first copper metal layer having a feed hole, the first copper metal layer having opposite first and second surfaces; Bond a carrier board to the first surface of the first copper metal layer; Form a titanium metal layer and a copper metal layer in sequence from bottom to top on the second surface of the first copper metal layer; Coat a photoresist dry film on the upper surface of the copper metal layer, perform photolithography and etching to form a patterned copper metal layer to expose a part of the titanium metal layer; Using the patterned copper metal layer as a mask, etch away the patterned copper metal layer and form a patterned titanium metal layer; Identify the patterned titanium metal layer and perform screen positioning to brush conductive silver paste; Identify the patterned titanium metal layer, position the copper pillar pad positions and complete the column grid array packaging and implanting of copper pillars according to the design drawings. The copper pillars are arranged periodically, and an air gap is formed between adjacent copper pillars to form a transmission channel; Provide a second copper metal layer having a feed hole; Apply silver paste on the top surface of the copper pillars for gluing and welding on the second copper metal layer.

2. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 1, characterized in that: The thickness of the first copper metal layer is 0.4 - 0.8 mm, and the thickness of the second copper metal layer is 0.4 - 0.8 mm.

3. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging as described in claim 1, characterized in that: After forming the patterned titanium metal layer, remove the carrier board and apply a film on the first surface.

4. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 1, characterized in that: The carrier board is a glass carrier board.

5. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 1, characterized in that: The thickness of the titanium metal layer is 0.05 - 0.15 μm; the thickness of the copper metal layer is 0.8 - 1.2 μm.

6. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging as described in claim 1, characterized in that: Before providing the first copper metal layer and the second copper metal layer, perform surface planarization treatment and drilling of positioning holes on them in sequence.

7. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 6, characterized in that: The surface planarization treatment is carried out by means of CMP chemical polishing.

8. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 1, characterized in that: The center distance between adjacent two copper pillars ≥ 0.1 mm.

9. The manufacturing method of the hollow rod wall waveguide device based on CGA packaging according to claim 1, characterized in that: The diameter of the copper pillars is 0.4 - 0.6 mm, and the height is 1.4 - 1.6 mm.

10. A design method for a hollow rod wall waveguide device, characterized in that, A hollow rod wall waveguide device prepared by using the preparation method of a hollow rod wall waveguide device based on CGA packaging as described in any one of claims 1 - 9, and the following steps are adopted for design: Determine the ranges of the long side and the short side of the waveguide according to the designed antenna operating frequency band, and then determine the waveguide size and the spacing of the column grid array copper pillars according to the design of the traditional substrate integrated waveguide, and finally determine the long side size of the waveguide and the spacing of the copper pillars; Perform feed design on the waveguide, and use the standard waveguide WR15 in the 60G band for feeding according to the operating frequency band, and the feed structure is a U - type structure; Design two resonators with different lengths, determine the parameters, set two groups of column grid array copper pillars in the resonators, and adjust the distance between the two groups of column grid array copper pillars; Design a T - type power divider and determine the parameters; Design a 3dB coupler and determine the parameters; Design a 1×4 radiation slot model to make it radiate externally, determine the slot size, and adjust the distance between the end slot and the copper pillar and the horizontal and vertical distances between adjacent two slots; Design a short - circuit model, which is used for testing the above device using the TRL calibration method.

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