A radiant cooling system that can be used outdoors

Abstract

The present invention discloses a radiation cooling system that can be used outdoors, including a radiation cooling component, an anti-condensation component and a temperature control device; the anti-condensation component is closely attached to the cooling surface of the radiation cooling component. Among them, the semiconductor refrigeration element in the radiation cooling component is provided with a cooling temperature control device, and is combined with the heat dissipation of the radiation cooling paint to serve as the cold source of the system; a double-layer hollow infrared film is used to wrap the support frame, and a closed gas layer is formed between the two layers of film, which covers the lower surface of the metal plate in the radiation cooling component, and separates the low-temperature cold source from the indoor humid air, serving as an anti-condensation component. This technical solution can not only allow outdoor high-temperature thermal radiation to penetrate the double-layer hollow infrared film and be taken away by the low-temperature cold source, thereby improving the radiation cooling capacity; it can also maintain the outdoor air contact surface temperature above the outdoor air dew point temperature to avoid condensation; at the same time, it can provide cooling in time according to the outdoor thermal environment and personnel needs, improve cooling efficiency, and save energy, be low-carbon and environmentally friendly.

Description

Technical Field

[0001] The invention relates to the technical field of outdoor refrigeration, and in particular to a radiation cooling system that can be used outdoors. Background Art

[0002] In recent years, high temperatures have frequently occurred in my country in summer and have lasted for a long time. As people yearn for a better life and improve their quality of life, the requirements for outdoor thermal environment and thermal comfort continue to increase. Outdoor air-conditioning technology has emerged and developed rapidly. However, there is currently no effective solution to the outdoor cooling problem.

[0003] Traditional air conditioning systems cool down the entire space by taking away cold air through air circulation, and then cool down the human body in the space through indoor cold air. A large amount of cold air is consumed in the air but not effectively used by the human body, resulting in energy waste. It is not suitable for open places such as corridors, outdoor dining venues, outdoor travel or camping, outdoor pavilions, bus stations, etc. Even if air conditioning is performed all day, it is difficult to achieve thermal comfort, and air conditioning consumes a lot of energy and has high power distribution costs, which does not meet the design concept of energy saving and environmental protection. The radiant cooling air conditioning system uses radiant heat exchange to allow the cold air to be directly used by the human body, without the need for an intermediate medium, with higher energy saving and comfort, and can also be used in outdoor places.

[0004] Radiant cooling systems are more prone to condensation at the end of the metal plate and limited cooling capacity. According to statistics, the average temperature in most parts of the country in summer reaches 35°C, and the highest temperature in some areas even reaches above 40°C. The dew point temperature of outdoor air is high. Since the surface temperature of the metal plate is lower than the dew point temperature of the outdoor air, the water vapor in the air will condense into water droplets, which is more likely to form local "artificial rain" in high humidity areas and breed bacteria. The condensation heat is released during the condensation of water vapor, resulting in cooling loss, and it also affects the infrared emission performance of the emission layer on the surface of the metal plate. Therefore, it is urgent to develop a radiant cooling system with anti-condensation effect. In addition, the traditional radiant cooling system needs to manually adjust the cooling output according to the personnel's perception of the ambient temperature, which is easy to cause cooling loss. It is urgent to design a temperature-controlled radiant cooling system that overcomes the above problems.

[0005] In summary, in view of people's yearning for a better life and the improvement of quality of life, it is urgent to study energy-saving and low-carbon radiant cooling systems with anti-condensation components that can be used outdoors. Summary of the invention

[0006] The purpose of the present invention is to provide a radiation cooling system that can be used outdoors to solve the problems of condensation on the metal plate surface, limited cooling capacity and high cost of cold source transportation in outdoor environments in existing outdoor radiation cooling systems.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A radiation cooling system, characterized in that it includes a radiation cooling component, an anti-condensation component and a temperature control device; the anti-condensation component is closely attached to the cooling surface of the radiation cooling component, and the temperature control device is electrically connected to the radiation cooling component.

[0009] The radiation refrigeration component includes a semiconductor refrigeration element, a thermal insulation layer, a radiation refrigeration coating and a metal plate; the radiation refrigeration component is a refrigeration system formed by a combination of multiple semiconductor refrigeration elements, which does not require the use of refrigerants, has a short response time, and can achieve intermittent or continuous refrigeration; the semiconductor refrigeration element is wrapped by a thermal insulation layer and is tightly attached to the upper surface of the metal plate as a whole; the hot end surface of the semiconductor refrigeration element is coated with a radiation refrigeration coating as a heat dissipation material of the semiconductor refrigeration element; when the hot end dissipates heat, the radiation refrigeration coating can quickly dissipate the heat of the hot end to the surrounding environment, saving heat dissipation power consumption, improving refrigeration efficiency, and saving energy and protecting the environment; the anti-condensation component includes a double-layer hollow infrared film and its supporting frame and a closed gas layer, a double-layer hollow infrared film, a ... The membrane includes an upper radiation cooling membrane and a lower air contact membrane. The double-layer hollow infrared membrane wraps the supporting frame, and a closed gas layer is formed between the two membranes; the radiation cooling membrane covers the lower surface of the metal plate in the radiation cooling component to separate the low-temperature cold source from the indoor humid air; the temperature control device includes an outdoor environment thermal parameter and personnel thermal demand monitoring instrument, a parameter setting instrument, a parameter control instrument, a temperature sensor and a semiconductor refrigeration element. The parameter setting instrument is connected to the outdoor environment thermal parameter and personnel thermal demand monitoring instrument, the parameter control instrument is connected to the cooling temperature controller of the semiconductor refrigeration element, and the temperature sensor is respectively connected to the cooling temperature controller of the semiconductor refrigeration element and the outdoor environment thermal parameter and personnel thermal demand monitoring instrument.

[0010] Furthermore, in the temperature control device, the outdoor environment thermal parameter and personnel thermal demand monitor is used to collect the outdoor environment temperature and body surface parameters of personnel in the area as input variables; the parameter setting instrument includes a display screen to set the upper and lower limits of the environment thermal parameters and personnel thermal demand; the parameter controller is a control algorithm, which regulates the cooling temperature of the semiconductor refrigeration element according to the parameter calculation of the outdoor environment thermal parameter and personnel thermal demand monitor and the parameter setting instrument; the temperature sensor measures the cooling temperature of the semiconductor refrigeration element as an output, promptly feeds back the measurement results, and promptly adjusts the cooling capacity according to the changes in the environment and personnel parameters.

[0011] Preferably, the thermal insulation layer is made of polyurethane foam plastic, which has good thermal insulation performance; the thermal insulation layer is wrapped around the temperature-controlled semiconductor refrigeration element radiation cooling device to prevent heat and cold from being lost to the surroundings.

[0012] Preferably, the metal plate material may be aluminum, aluminum iron, etc., which has a higher thermal conductivity to achieve a higher cooling capacity.

[0013] Furthermore, the enclosed gas layer is an insulating layer formed by dry gas.

[0014] Preferably, the enclosed gas layer is a gas layer including dry air, nitrogen or argon, forming an insulating layer with a very small thermal conductivity. The closed sandwich structure is filled with a static dry gas layer, which can effectively reduce the overall thermal conductivity and improve the overall thermal resistance, so that the double-layer hollow infrared film and its supporting frame have the characteristics of low thermal conductivity, high thermal resistance and high infrared transmittance as a whole; and an appropriate amount of desiccant is added to the enclosed gas layer, and the desiccant absorbs water vapor in the interlayer air, so that the interlayer air can remain in a non-condensing state when being cooled, reducing the risk of condensation in the system and improving the cooling capacity of the radiation air-conditioning system.

[0015] Preferably, the radiation cooling film is closely attached to the lower surface of the metal plate, has an emissivity of >0.8 in the 5-15μm band, a film thickness of 10-100μm, and a surface temperature equal to that of the metal plate. Its high transmittance to infrared thermal radiation allows outdoor high-temperature thermal radiation to penetrate the double-layer hollow infrared film and be taken away by the low-temperature cold source, thereby improving the radiation cooling capacity.

[0016] Preferably, the transmittance of the air contact membrane in the 5-15 μm band is greater than 0.7, and the thermal resistance of thermal conductivity is very small. Its high thermal resistance to heat conduction isolates the radiant cooling surface from the indoor humid air to avoid direct contact with the air, thereby indirectly increasing the temperature of the lower surface of the cooling surface in contact with the air, and can maintain the temperature of the outdoor air contact surface above the outdoor air dew point temperature to prevent condensation.

[0017] Furthermore, the radiation cooling system provided by the present invention is powered by photovoltaic panels or batteries.

[0018] The radiant cooling system technical solution provided by the present invention has the following beneficial effects:

[0019] (1) It is proposed to cover the surface of the radiation cooling component with a double-layer hollow infrared film to separate the surface of the radiation cooling component from the surface in contact with the outdoor air. As an anti-condensation component of the radiation cooling system, the humid air in the environment is separated from the low-temperature cold source, which can prevent condensation and significantly improve the cooling capacity of the system. It can effectively reduce the heat damage to outdoor personnel in extremely high temperature weather, maximize the thermal comfort of outdoor workers and consumers, and create a safe and good outdoor environment.

[0020] (2) In view of the high energy consumption and pollution of traditional outdoor air-conditioning systems, the present invention proposes an outdoor radiation cooling system with temperature control function. The semiconductor refrigeration element is pollution-free, noise-free, easy to install, and has a long service life. The cooling capacity of the system can be adjusted in time through the temperature control device according to the outdoor environment and personnel parameters, which is more humane and achieves the purpose of energy saving and carbon reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of a radiant cooling system that can be used outdoors.

[0023] Figure 2 It is a schematic diagram of the decomposition of the radiation cooling components and the anti-condensation components.

[0024] Figure 3 It is a cross-sectional schematic diagram of the radiation cooling component and the anti-condensation component.

[0025] Figure 4 Schematic diagram of temperature control for radiant cooling system.

[0026] Description of main components and symbols:

[0027] 1. Semiconductor refrigeration element; 2. Thermal insulation layer; 3. Radiant refrigeration coating; 4. Metal plate; 5. Radiant cooling film; 6. Support frame; 7. Sealed gas layer; 8. Air contact film. DETAILED DESCRIPTION

[0028] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] Example

[0030] Reference Figures 1 to 4, a radiation cooling system, characterized in that it includes a radiation cooling component, an anti-condensation component and a temperature control device; the anti-condensation component is closely attached to the cooling surface of the radiation cooling component, and the temperature control device is electrically connected to the radiation cooling component. The radiation cooling component includes a semiconductor cooling element 1, a thermal insulation layer 2, a radiation cooling coating 3 and a metal plate 4; the radiation cooling component is a refrigeration system formed by a combination of multiple semiconductor cooling elements, which does not require the use of refrigerants, has a short response time, and can achieve intermittent or continuous cooling; the semiconductor cooling element is wrapped by a thermal insulation layer and is closely attached to the upper surface of the metal plate as a whole, and the hot end surface of the semiconductor cooling element 1 is coated with a radiation cooling coating 3 as a heat dissipation material of the semiconductor cooling element. When the hot end dissipates heat, the radiation cooling coating 3 can quickly dissipate the heat of the hot end to the surrounding environment, and can cool the hot end temperature to about 5-10°C lower than the ambient temperature under direct sunlight during the day; the anti-condensation component includes a double-layer hollow infrared film and its supporting frame 6 and a closed gas layer The double-layer hollow infrared film includes an upper radiation cooling film 5 and a lower air contact film 8. The double-layer hollow infrared film wraps a supporting frame 6, and a closed gas layer 7 is formed between the two layers of film; the radiation cooling film 5 covers the lower surface of the metal plate 4 in the radiation cooling component to separate the low-temperature cold source from the indoor humid air; the temperature control device includes an outdoor environment thermal parameter and personnel thermal demand monitor, a parameter setting instrument, a parameter control instrument, a temperature sensor and a semiconductor refrigeration element. The parameter setting instrument is connected to the outdoor environment thermal parameter and personnel thermal demand monitor, the parameter control instrument is connected to the cooling temperature controller of the semiconductor refrigeration element 1, and the temperature sensor is respectively connected to the cooling temperature controller of the semiconductor refrigeration element 1 and the outdoor environment thermal parameter and personnel thermal demand monitor.

[0031] Reference Figure 4 The outdoor environment thermal parameter and personnel thermal demand monitoring instrument of the radiation cooling system is used to collect the outdoor environment temperature and the body surface parameters of the personnel in the area as input variables; the parameter setting instrument includes a display screen to set the upper and lower limits of the environment thermal parameters and the thermal demand of the personnel; the parameter controller is a control algorithm, which adjusts the cooling temperature of the semiconductor refrigeration element 1 according to the parameter calculation of the outdoor environment thermal parameter and personnel thermal demand monitoring instrument and the parameter setting instrument; the temperature sensor measures the cooling temperature of the semiconductor refrigeration element 1, and the measured cooling temperature is used as the output, and the measurement results are fed back in time to adjust the cooling capacity in time according to the changes in the environment and personnel parameters.

[0032] Before installation, the semiconductor refrigeration element 1 should be coated with thermal conductive silicone grease on the hot and cold end surfaces, and the grease should be evenly applied. The cold end of the semiconductor refrigeration element 1 should be close to the upper surface of the metal plate 4. After the semiconductor refrigeration element 1 is powered on, the radiation refrigeration component can start cooling and regulating.

[0033] The thermal insulation layer 2 is made of polyurethane foam plastic available on the market and is wrapped around the semiconductor refrigeration element 1 to reduce heat loss.

[0034] The metal plate 4 is an aluminum plate or an aluminum iron plate. The metal has a large thermal conductivity, which increases the heat transfer efficiency.

[0035] The radiation cooling film 5 (upper film) is made of infrared high emissivity material, with an emissivity of >0.8 in the 5-15μm band, and is closely attached to the lower surface of the metal plate. The film thickness is 10-100μm, and the thermal resistance is very small. Its surface temperature is equal to the surface temperature of the metal plate, and is used to absorb infrared radiation energy from the heat source.

[0036] The air contact membrane 8 (lower membrane) is made of infrared high-transmittance material with a transmittance of >0.7 in the 5-15μm band. It is in direct contact with the outdoor air and at the same time isolates the heat exchange between the outdoor air and the metal plate surface, indirectly increasing the surface temperature of the air contact surface, greatly reducing the risk of condensation and reducing cold loss, and significantly improving the cooling capacity.

[0037] The support frame 6 is a wood frame to minimize thermal conductivity. The radiation cooling film 5 (upper infrared film) and the air contact film 8 (lower infrared film) are selected from infrared film materials with high emissivity and high transmittance currently available on the market. The upper radiation cooling film and the lower air contact film of the wood frame are sealed and wrapped with adhesive to prepare a double-layer film sandwich hollow structure.

[0038] The sealed gas layer 7 is a gas layer such as dry air, nitrogen or argon, and a proper amount of desiccant is added into the sealed gas layer.

[0039] The outdoor radiant cooling system may be powered by photovoltaic panels or batteries.

[0040] In this embodiment, the radiation cooling system that can be used outdoors has the characteristics of significantly reducing the risk of condensation at the radiation end, significantly improving the system's cooling capacity, energy saving, environmental protection, and automatic control. It is especially suitable for outdoor places in high humidity areas and can achieve energy saving and carbon reduction.

Claims

1. A radiant cooling system, characterized in that: It includes a radiation cooling component, an anti-condensation component and a temperature control device; The anti-condensation component is closely attached to the cooling surface of the radiation cooling component, and the temperature control device is electrically connected to the radiation cooling component; The radiation refrigeration component comprises a semiconductor refrigeration element, a thermal insulation layer, a radiation refrigeration coating and a metal plate; the radiation refrigeration component is a refrigeration system formed by combining a plurality of semiconductor refrigeration elements, the semiconductor refrigeration element is wrapped by a thermal insulation layer and is in close contact with the upper surface of the metal plate as a whole, and the hot end surface of the semiconductor refrigeration element is coated with a radiation refrigeration coating as a heat dissipation material of the semiconductor refrigeration element; the anti-condensation component comprises a double-layer hollow infrared film and its supporting frame and a closed gas layer, the double-layer hollow infrared film comprises an upper radiation cooling film and a lower air contact film, the double-layer hollow infrared film wraps the supporting frame, and a closed gas layer is formed between the two layers of film; the radiation cooling film covers the lower surface of the metal plate in the radiation refrigeration component, separating the low-temperature cold source from the indoor humid air; The temperature control device includes an outdoor environment thermal parameter and personnel thermal demand monitoring instrument, a parameter setting instrument, a parameter control instrument, a temperature sensor and a semiconductor refrigeration element. The parameter setting instrument is connected to the outdoor environment thermal parameter and personnel thermal demand monitoring instrument, the parameter control instrument is connected to the cooling temperature control instrument of the semiconductor refrigeration element, and the temperature sensor is respectively connected to the cooling temperature control instrument of the semiconductor refrigeration element and the outdoor environment thermal parameter and personnel thermal demand monitoring instrument; The metal plate material is aluminum or aluminum iron; The radiation cooling film is closely attached to the lower surface of the metal plate, has an emissivity of >0.8 in the 5-15 μm band, and a film thickness of 10-100 μm; the air contact film has a transmittance of >0.7 in the 5-15 μm band.

2. The radiant cooling system according to claim 1, characterized in that: The outdoor environment thermal parameter and personnel thermal demand monitoring instrument is used to collect the outdoor environment temperature and the body surface parameters of the personnel in the area as input variables; the parameter setting instrument includes a display screen to set the upper and lower limits of the environment thermal parameters and the thermal demand of the personnel; the parameter controller is a control algorithm, which adjusts the cooling temperature of the semiconductor refrigeration element according to the parameter calculation of the outdoor environment thermal parameter and personnel thermal demand monitoring instrument and the parameter setting instrument; the temperature sensor measures the cooling temperature of the semiconductor refrigeration element, and the measured cooling temperature is used as the output, and the measurement results are fed back in time to adjust the cooling capacity in time according to the changes in the environment and personnel parameters.

3. The radiant cooling system according to claim 1, characterized in that: The thermal insulation layer is made of polyurethane foam plastic.

4. The radiant cooling system according to claim 1, characterized in that: The enclosed gas layer is a heat-insulating layer formed by dry gas.

5. The radiant cooling system according to claim 1, characterized in that: The sealed gas layer is an insulating layer formed by air, nitrogen or argon gas, and a desiccant is contained in the sealed gas layer.

6. The radiant cooling system according to claim 1, characterized in that: The radiant cooling system is powered by photovoltaic panels or batteries.

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