Coil arrangement for generating a plasma and semiconductor process apparatus

Abstract

The application provides a coil device for generating plasma in a semiconductor process equipment and the semiconductor process equipment, which comprises a coil structure and a fixing and cooling assembly for fixing and cooling the coil structure, wherein the fixing and cooling assembly comprises a fixing body made of an insulating material, a cooling space is formed in the fixing body, and the coil structure is fixedly arranged in the cooling space; an air inlet and an air outlet are arranged on the fixing body and are communicated with the cooling space, the air inlet is used for conveying cooling gas into the cooling space, the air outlet is used for discharging the cooling gas in the cooling space, and a turbulence structure is further arranged in the cooling space to change the flowing direction of the gas in the cooling space and improve the gas distribution uniformity in the cooling space. The coil device and the semiconductor process equipment provided by the application can improve the cooling efficiency and the cooling uniformity of the coil, reduce the oxidation speed of the coil, and thus prolong the service life of the coil.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a coil device for generating plasma in semiconductor process equipment and semiconductor process equipment. Background Technology

[0002] Inductively coupled plasma (ICP) sources are commonly used in the semiconductor field for dry etching and thin film deposition. ICP sources generate plasma by using a high-frequency electromagnetic field produced by a high-frequency current passing through a coil to excite gas. They can operate at relatively low chamber pressures and feature high plasma density and minimal damage to the workpiece.

[0003] Existing coils typically use copper as the main body, plated with gold, silver, or other metals. This provides good conductivity and allows for long-term operation at 100°C. However, existing coil supports for fixing the coil, such as… Figure 1 As shown, it includes an insulating plate 11, which is fixedly connected to the coil 13 by screws 12. Existing coil supports are generally made of resin material, which has poor thermal conductivity and temperature resistance, and is not equipped with a cooling structure, resulting in the heat generated by the coil not being released in time, thus causing the coil to oxidize and affecting its conductivity. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a coil device for generating plasma in semiconductor process equipment and semiconductor process equipment, which can improve the cooling efficiency and cooling uniformity of the coil, reduce the oxidation rate of the coil, and thus extend the service life of the coil.

[0005] To achieve the objectives of this invention, a coil device for generating plasma in a semiconductor process apparatus is provided, comprising a coil structure and a fixing and cooling assembly for fixing and cooling the coil structure, wherein...

[0006] The fixed cooling assembly includes a fixed body made of insulating material, and a cooling space is formed in the fixed body. The coil structure is fixedly installed in the cooling space. The fixed body is provided with an air inlet and an air outlet that communicate with the cooling space. The air inlet is used to supply cooling gas into the cooling space. The air outlet is used to discharge the cooling gas from the cooling space.

[0007] A turbulence structure is also provided in the cooling space to change the gas flow direction in the cooling space, thereby improving the uniformity of gas distribution in the cooling space.

[0008] Optionally, the fixing body includes a first fixing ring, a second fixing ring, a first connecting ring, and a second connecting ring constituting the cooling space, wherein the first fixing ring and the second fixing ring are disposed opposite to each other, the first connecting ring is connected between the first fixing ring and the second fixing ring and is located at the outer periphery of both; the second connecting ring is connected between the first fixing ring and the second fixing ring and is located at the inner periphery of both.

[0009] The coil structure is arranged around the second connecting ring;

[0010] The air inlet and air outlet are located on the first connecting ring.

[0011] Optionally, the turbulence structure includes a first turbulence element and a second turbulence element, wherein the first turbulence element is disposed near the air inlet to cause a portion of the cooling gas flowing through the first turbulence element to flow toward the edge region of the cooling space;

[0012] The second baffle is positioned near the air outlet to direct a portion of the cooling gas flowing through the second baffle toward the central region of the cooling space.

[0013] Optionally, there is one air outlet; there are two air inlets, which are symmetrically arranged on both sides of the air outlet along its axial direction.

[0014] The first aerodynamic component includes two first arc-shaped strips, both of which extend circumferentially along the first connecting ring and are spaced apart from each other. The two first arc-shaped strips are respectively opposite to the two air inlets, and the two ends of each first arc-shaped strip are located on both sides of the axial direction of the opposite air inlet.

[0015] Optionally, the second agitator includes two second arc-shaped strips, both of which extend circumferentially along the first connecting ring and are spaced apart from each other, and the two second arc-shaped strips are respectively located on both sides of the air outlet axially.

[0016] Optionally, the first arc-shaped strip and the second arc-shaped strip are concentrically arranged and distributed at different positions in the circumferential direction of the first connecting ring, and the radial thickness of the second arc-shaped strip is greater than the radial thickness of the first arc-shaped strip.

[0017] Optionally, the coil structure includes at least one set of coil groups, the coil groups including a first sub-coil group and a second sub-coil group, the first sub-coil group including at least one first planar coil located in a first plane perpendicular to the axis of the coil group, the second sub-coil group including at least one second planar coil located in a second plane parallel to the first plane, the first planar coil and the second planar coil being connected in series, and the orthographic projection of the second planar coil on the first plane being either mirror-symmetric or mirror-asymmetric with the first planar coil;

[0018] The first planar coil and the second planar coil are respectively fixed on the first fixing ring and the second fixing ring.

[0019] Optionally, the first sub-coil group includes a plurality of first planar coils, the plurality of first planar coils having the same shape and being spaced apart from each other, and the first ends of the plurality of first planar coils being evenly distributed along the circumferential direction of the coil group;

[0020] The second sub-coil group includes a plurality of second planar coils, which are identical in shape and spaced apart from each other. The first ends of the plurality of second planar coils are evenly distributed along the circumferential direction of the coil group.

[0021] Each of the first planar coils corresponds to one of the second planar coils. The first ends of the first planar coils are connected in parallel, the first ends of the second planar coils are connected in parallel, and the second ends of the first planar coils are connected in series with the second ends of the second planar coils, respectively.

[0022] Optionally, there are N first planar coils, where N is an even number greater than or equal to 2; the N first planar coils are divided into N / 2 pairs of first coils in the circumferential direction of the coil group, each pair of first coils includes two adjacent first planar coils, and a first extension segment is connected between the first ends of the two adjacent first planar coils to connect them in parallel; the first extension segments in the N / 2 pairs of first coils are connected in parallel.

[0023] There are N second planar coils; the N second planar coils are divided into N / 2 pairs of second coils in the circumferential direction of the coil group. Each pair of second coils includes two adjacent second planar coils, and a second extension section is connected between the first ends of the two adjacent second planar coils to connect them in parallel; the second extension sections in the N / 2 pairs of second coils are connected in parallel.

[0024] Optionally, the coil device further includes a connection structure, the connection structure including a first connection component and a second connection component, wherein the first connection component is electrically connected to a first end of a plurality of first planar coils in the first sub-coil group; the second connection component is used to electrically connect the first ends of a plurality of second planar coils in the second sub-coil group;

[0025] One of the first connection component and the second connection component is used for electrical connection to the input terminal of the radio frequency source, and the other of the first connection component and the second connection component group is used for electrical connection to the output terminal of the radio frequency source.

[0026] Optionally, the first connecting assembly includes N / 2 first connecting strips and a first parallel member, wherein one end of each of the N / 2 first connecting strips is electrically connected to the first extension section of each of the N / 2 pairs of first coils, and the other end of each of the N / 2 first connecting strips passes through the first fixing ring and is detachably electrically connected to the first parallel member located on the side of the first fixing ring away from the cooling space.

[0027] The second connecting assembly includes N / 2 second connecting strips and a second parallel member, wherein one end of each of the N / 2 second connecting strips is electrically connected to the second extension section of each of the N / 2 pairs of second coils, and the other end of each of the N / 2 second connecting strips passes through the first fixing ring and is detachably electrically connected to the second parallel member located on the side of the first fixing ring away from the cooling space.

[0028] One of the first parallel component and the second parallel component is used to be electrically connected to the input terminal of the radio frequency source, and the other of the first parallel component and the second parallel component is used to be electrically connected to the output terminal of the radio frequency source.

[0029] Optionally, both the first parallel member and the second parallel member include N / 2 strip-shaped forks. The first ends of the N / 2 strip-shaped forks are connected together near the center of the cooling space and are electrically connected to each other. The second ends of the N / 2 strip-shaped forks extend radially along different directions of the cooling space relative to their respective first ends. The second ends of the N / 2 strip-shaped forks in the first parallel member are detachably electrically connected to the other ends of the N / 2 first connecting strips. The second ends of the N / 2 strip-shaped forks in the second parallel member are detachably electrically connected to the other ends of the N / 2 second connecting strips.

[0030] Optionally, a connecting segment is provided between the second end of each of the first planar coils and the second end of the corresponding second planar coil to connect them in series, wherein the extending direction of the connecting segment is parallel to the axis of the coil group.

[0031] Optionally, a first coil groove is provided on the surface of the first fixing ring adjacent to the cooling space, and the orthographic projection of the first coil groove on the first plane is adapted to at least one first planar coil to accommodate at least a portion of the first planar coil; a second coil groove is provided on the surface of the second fixing ring adjacent to the cooling space, and the orthographic projection of the second coil groove on the second plane is adapted to at least one second planar coil to accommodate at least a portion of the second planar coil.

[0032] Optionally, the coil group consists of two groups, which are of different sizes and are nested together; the turbulence structure is disposed between the two groups of coil groups.

[0033] Optionally, the insulating material includes ceramics.

[0034] Optionally, the cooling gas includes compressed air.

[0035] As another technical solution, the present invention also provides a semiconductor process apparatus, including a radio frequency source, a reaction chamber, the coil device provided by the present invention, an air intake device, and an air extraction device, wherein a dielectric window is provided at the top of the reaction chamber, and the coil device is disposed above the dielectric window; the radio frequency source is used to provide radio frequency power to the coil structure; the air intake device is used to provide the cooling gas to the air intake port; and the air extraction device is used to extract the cooling gas from the cooling space.

[0036] The present invention has the following beneficial effects:

[0037] The coil device for generating plasma in the semiconductor process equipment provided by the present invention forms a cooling space capable of accommodating the coil structure through a fixed body, and supplies cooling gas into the cooling space through an air inlet and discharges the cooling gas from the cooling space through an air outlet. This allows the cooling gas to flow in the cooling space and carry away the heat generated by the coil structure during the flow. At the same time, by setting a turbulence structure in the cooling space to change the gas flow direction, the uniformity of gas distribution in the cooling space can be improved, thereby effectively improving the cooling efficiency and cooling uniformity of the coil structure, reducing the oxidation rate of the coil structure, and thus extending the service life of the coil structure.

[0038] The semiconductor process equipment provided by the present invention, by employing the above-mentioned coil device provided by the present invention, can effectively improve the cooling efficiency and cooling uniformity of the coil structure, reduce the oxidation rate of the coil structure, and thus extend the service life of the coil structure. Attached Figure Description

[0039] Figure 1An exploded view of an existing coil support for fixing the coil;

[0040] Figure 2A This is a schematic diagram of the coil structure used in this embodiment;

[0041] Figure 2B This is a schematic diagram of the structure of a single coil group used in this embodiment;

[0042] Figure 2C This is a schematic diagram of the orthographic projection of the multiple first planar coils used in this embodiment onto a first plane;

[0043] Figure 2D This is a schematic diagram of the orthographic projection of the first ends of multiple first planar coils connected in parallel on a first plane in this embodiment;

[0044] Figure 3 This is an overall structural diagram of the fixed cooling assembly used in this embodiment;

[0045] Figure 4 This is a radial cross-sectional view of the fixed cooling assembly used in this embodiment;

[0046] Figure 5 This is an axial sectional view of the fixed cooling assembly used in this embodiment;

[0047] Figure 6 This is a structural diagram of the first and second connecting strips used in this embodiment;

[0048] Figure 7 This is an exploded view of the coil device provided in this embodiment;

[0049] Figure 8 This is a schematic diagram of the structure of the semiconductor process equipment provided in this embodiment. Detailed Implementation

[0050] To enable those skilled in the art to better understand the technical solution of the present invention, the coil device for generating plasma and the semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0051] Please refer to the following: Figures 2A to 3 This embodiment provides a coil device for generating plasma in a semiconductor process apparatus, comprising a coil structure 3 and a fixed cooling assembly 2. The coil structure 3 can have various structures, for example, such as... Figure 2A As shown, coil structure 3 includes two coil groups (3a, 3b), which are of different sizes and nested together. In practical applications, the number of coil groups can be single or more than three, with each group having different sizes and nested together.

[0052] In some alternative embodiments, such as Figure 2B As shown, a single coil group includes a first sub-coil group and a second sub-coil group. The first sub-coil group includes at least one first planar coil 31 located in a first plane perpendicular to the axis of the coil group. The second sub-coil group includes at least one second planar coil 32 located in a second plane parallel to the first plane. The first planar coil 31 and the second planar coil 32 are connected in series. The orthographic projection of the second planar coil 32 on the first plane is either mirror-symmetric or mirror-asymmetric with the second planar coil 32.

[0053] The term "mirror image" refers to a situation where the orthographic projection of the first planar coil 31 onto the first plane (hereinafter referred to as "first projection A") and the orthographic projection of the second planar coil 32 onto the first plane (hereinafter referred to as "second projection B") have the same or similar shapes, but are arranged in opposite directions. Specifically, both first projection A and second projection B have two sides parallel to the first plane, one with a front shape and the other with a back shape. The term "symmetrical" means that all parameters of the front shape of one of the first projections A and the other with the back shape of the other are completely identical. The term "asymmetrical" means that the front shape of one of the first projections A and the other with a back shape is similar to the other with some parameters different.

[0054] By making the orthographic projection of the second planar coil 32 on the first plane mirror-symmetric or mirror-asymmetric with the second planar coil 32, the radial current distribution difference that exists when there is only one set of first sub-coil group or second sub-coil group can be compensated, thereby improving the radial uniformity of the coupling energy generated below the coil structure 3, thereby improving the radial uniformity of the free radical and ion density distribution in the plasma.

[0055] In some alternative embodiments, such as Figure 2B and Figure 2CAs shown, the first sub-coil group includes multiple first planar coils 31, which are identical in shape and spaced apart from each other. The first ends 311 of the multiple first planar coils 31 are evenly distributed along the circumference of the coil group. The second sub-coil group includes multiple second planar coils 32, which are identical in shape and spaced apart from each other. The first ends 321 of the multiple second planar coils 32 are evenly distributed along the circumference of the coil group. Furthermore, the multiple first planar coils 31 and the multiple second planar coils 32 correspond one-to-one. The first ends 311 of the multiple first planar coils 31 are connected in parallel, the first ends 321 of the multiple second planar coils 32 are connected in parallel, and the second ends 312 of the multiple first planar coils 31 are connected in series with the second ends 322 of the multiple second planar coils 32.

[0056] Specifically, the shapes of the first planar coil 31 and the second planar coil 32 are both, for example, involutes. For any one of the first planar coils 31, after its first end 311 is rotated clockwise or counterclockwise around the axis of the coil group by a certain angle, it will coincide with the first end 311 of the adjacent first planar coil 31. For example... Figure 2C The diagram shows eight first planar coils 31, in which the first end 311 of any one first planar coil 31 will coincide with the first end 311 of the adjacent first planar coil 31 after rotating 45° clockwise or counterclockwise around the axis of the coil group.

[0057] Since the multiple first planar coils 31 have the same shape, the projection formed by the multiple first planar coils 31 on the first plane has angular symmetry, that is, the projection is symmetrical in the circumferential direction of the coil group. This avoids differences in current distribution in the circumferential direction, thereby improving the angular distribution uniformity of plasma density and improving process uniformity. Similarly, the projection formed by the multiple second planar coils 32 on the second plane also has angular symmetry.

[0058] In some alternative embodiments, such as Figure 2B As shown, a connecting segment 34 connects the second end 312 of each first planar coil 31 and the second end 322 of the corresponding second planar coil 32, for connecting them in series. The extending direction of the connecting segment 34 is parallel to the axis of the coil group. Of course, in practical applications, other arbitrary methods can also be used to connect the first planar coil 31 and the corresponding second planar coil 32 in series.

[0059] In some alternative embodiments, such as Figure 2D As shown, assume that there are N first planar coils 31, where N is an even number greater than or equal to 2, for example, N is greater than or equal to 6 and less than or equal to 10. Figure 2DIn the middle, N = 8. The N first planar coils 31 are divided into N / 2 pairs of first coil pairs along the circumferential direction of the coil group, for example... Figure 2D The eight first planar coils 21 are divided into four pairs of first coil pairs (two pairs in a row). Each pair of first coil pairs includes two adjacent first planar coils (31a, 31b), and the first ends (311a, 311b) of the two adjacent first planar coils (31a, 31b) are connected by a first extension segment 33 to connect them in parallel; and the first extension segments 33 in the N / 2 pairs of first coil pairs are connected in parallel.

[0060] In some preferred embodiments, an RF feed point or an RF feed point is provided at the midpoint of each first extension segment 33. This ensures that the lengths of two adjacent first planar coils (31a, 31b) are the same, thereby ensuring that the current flows through the first planar coils (31a, 31b) along the same path.

[0061] The parallel connection of the first ends 321 of the multiple second planar coils 32 is the same as the parallel connection of the first ends 311 of the multiple first planar coils 31 described above. Specifically, there are N second planar coils 32; the N second planar coils 32 are divided into N / 2 pairs of second coil pairs in the circumferential direction of the coil group. Each pair of second coil pairs includes two adjacent second planar coils 32, and a second extension segment is connected between the first ends 321 of the two adjacent second planar coils 32 to connect them in parallel; the second extension segments in the N / 2 pairs of second coil pairs are connected in parallel.

[0062] It should be noted that the parallel connection of the first ends 321 of the multiple second planar coils 32 and the parallel connection of the first ends 311 of the multiple first planar coils 31 can also be any other method, such as the direct parallel connection of the first ends 321 of the multiple second planar coils 32.

[0063] The fixed cooling assembly 2 is used to fix and cool the coil structure 3. The following is an example... Figure 2A Taking the coil structure 3 shown as an example, a detailed description of the specific implementation of the fixed cooling assembly 2 will be provided. Specifically, please refer to [the relevant documentation / reference needed]. Figures 3 to 5 The fixed cooling assembly 2 includes a fixed body 21 made of insulating material, preferably ceramic, which has a thermal conductivity of 33 W / mk and good thermal conductivity and temperature resistance, thereby helping to improve the heat dissipation efficiency of the coil structure 3.

[0064] And, as Figure 4As shown, a cooling space 22 is formed within the fixed body 21, and the coil structure 3 is fixedly disposed within this cooling space 22. Furthermore, the fixed body 21 is provided with an air inlet 215 and an air outlet 216 communicating with the cooling space 22. The air inlet 215 is used to supply cooling gas into the cooling space 22; the air outlet 216 is used to discharge the cooling gas from the cooling space 22. By supplying cooling gas into the cooling space 22 through the air inlet 215 and discharging it through the air outlet 216, the cooling gas can flow within the cooling space 22, carrying away the heat generated by the coil structure 3 during the flow. This effectively improves the cooling efficiency and uniformity of the coil structure 3, reduces the oxidation rate of the coil structure 3, and thus extends the service life of the coil structure 3.

[0065] like Figure 4 As shown, a turbulence-inducing structure 5 is also provided in the cooling space 22. This turbulence-inducing structure 5 can change the gas flow direction in the cooling space 22 to improve the uniformity of gas distribution in the cooling space 22.

[0066] In some alternative embodiments, such as Figure 3 As shown, the aforementioned fixed body 21 includes a first fixed ring 212, a second fixed ring 214, a first connecting ring 213, and a second connecting ring 211 constituting the aforementioned cooling space 22. The first fixed ring 212 and the second fixed ring 214 are arranged opposite to each other. Specifically, both the first fixed ring 212 and the second fixed ring 214 are generally disc-shaped, and the planes on which their discs lie are parallel to each other, for example, they can also be parallel to the aforementioned first plane. Figure 5 As shown, the first connecting ring 213 is connected between the first fixing ring 212 and the second fixing ring 214, and is located at the outer periphery of both; the first connecting ring 213 is also connected between the first fixing ring 212 and the second fixing ring 214, and is located at the inner periphery of both. Thus, the cooling space 22 formed by the first fixing ring 212, the second fixing ring 214, the first connecting ring 213, and the second connecting ring 211 is an annular space, and the coil structure 3 is arranged around the second connecting ring 214 within this annular space.

[0067] In some alternative embodiments, such as Figure 5As shown, the first planar coil 31 and the second planar coil 32 in the above-described coil structure 3 are respectively fixed to the first fixing ring 212 and the second fixing ring 214. This ensures both the stability of the first planar coil 31 and the second planar coil 32 and maintains a certain axial distance between them to prevent arcing due to excessive proximity. However, the axial distance should not be too large, otherwise the compensation effect for current distribution differences between the first and second planar coils 31 and 32 will fail. In some preferred embodiments, the axial distance between the first planar coil 31 and the second planar coil 32 is greater than or equal to 4 mm and less than or equal to 20 mm, preferably 10 mm. By setting the axial distance within this range, arcing due to excessive proximity between the first and second planar coils 31 and 32 can be avoided, while also achieving the compensation effect for current distribution differences between them.

[0068] In some preferred embodiments, such as Figure 7 As shown, a first coil groove (not shown) is provided on the surface of the first fixing ring 212 adjacent to the cooling space 22, and a second coil groove 214a is provided on the surface of the second fixing ring 214 adjacent to the cooling space 22. The orthographic projection of the first coil groove onto the first plane is adapted to each of the first planar coils 31 to accommodate at least a portion of the first planar coils 31, for example, as... Figure 5 As shown, a portion of the first planar coil 31 in the coil structure 3 is embedded in the first coil groove, while the remaining portion protrudes relative to the surface of the first fixing ring 212 adjacent to the cooling space 22. Similarly, the orthographic projection of the second coil groove 214a onto the second plane is adapted to each of the second planar coils 32 to accommodate at least a portion of the second planar coils 32. The first and second coil grooves 214a define the positions of the first and second planar coils 31 and 32, and prevent deformation due to their thinness. Preferably, the axial depth of the first and second planar coils 31 and 32 embedded in the first and second coil grooves 214a is 2.5 mm.

[0069] In some alternative embodiments, such as Figure 4As shown, the coil device also includes multiple coil fixing members 4, such as fixing strips. These multiple coil fixing members 4 are spaced apart along the circumference of the coil group. Each coil fixing member 4 can press multiple first planar coils 31 onto the first fixing ring 212 or multiple second planar coils 32 onto the second fixing ring 214 in the radial direction of the coil group, thereby achieving fixation between the coils and the fixing rings. In practical applications, the number and distribution density of the coil fixing members 4 can be selected according to the size of each coil group. For example, for two coil groups, the inner coil group can use four coil fixing members 4, and the outer coil group can use eight coil fixing members 4.

[0070] In some alternative embodiments, the coil fixing member 4 is made of an engineering plastic such as polyetheretherketone (PEEK), which has the characteristics of high temperature resistance, easy processing and high mechanical strength.

[0071] In some alternative embodiments, such as Figure 4 As shown, the air inlet 215 and air outlet 216 are disposed on the first connecting ring 213. This allows cooling gas to enter from one side of the cooling space 22 and exit from the other side. In some preferred embodiments, the cooling gas is compressed air (e.g., at room temperature). By introducing air with a certain pressure into the cooling space 22, the gas flow rate can be increased, thereby further improving the cooling effect on the coil structure 3. Alternatively, the air outlet 216 can be connected to a suction device to extract cooling gas from the cooling space 22, thereby increasing the gas discharge rate and further improving the gas flow rate.

[0072] In some alternative embodiments, such as Figure 4 As shown, the aforementioned turbulence structure 5 includes a first turbulence element 51 and a second turbulence element 52. The first turbulence element 51 is positioned near the air inlet 215 to direct a portion of the cooling gas flowing through it toward the edge region of the cooling space 22. The second turbulence element 52 is positioned near the air outlet 216 to direct a portion of the cooling gas flowing through it toward the center region of the cooling space 22. The specific gas flow direction in the cooling space 22 is as follows: Figure 4 As indicated by the arrows in the diagram. With the help of the first and second baffles 51, the cooling gas can be diffused to the central and edge regions of the cooling space 22, thereby improving the uniformity of gas distribution in the cooling space 22 and ensuring that the heat generated by different parts of the coil structure 2 can be carried away.

[0073] In some alternative embodiments, such as Figure 4As shown, there is one air outlet 216 and two air inlets 215, symmetrically arranged on both sides of the air outlet 216 along its axial direction. This allows cooling gas to simultaneously enter the cooling space 22 through both air inlets 215 and flow towards the opposite air outlet 216. Furthermore, the first airflow deflector 51 includes two first arc-shaped strips, each extending circumferentially along the first connecting member 213 and spaced apart from each other. Each first arc-shaped strip is opposite to one of the two air inlets 215, with both ends of each first arc-shaped strip located on opposite sides of the axial direction of the opposing air inlet 215; for example, the air inlet 215 is opposite to the middle position of each first arc-shaped strip. Thus, as... Figure 4 As shown by the arrows, the cooling gas near each first arc strip will split into two paths and flow towards both ends of the first arc strip under the obstruction of the first arc strip, thereby diffusing to the edge area of ​​the cooling space 22.

[0074] Further optional, such as Figure 4 As shown, the second aerodynamic element 52 includes two second arc-shaped strips, both extending circumferentially along the first connecting ring 213 and spaced apart from each other. The two second arc-shaped strips are located on opposite sides of the air outlet 216 in the axial direction, for example, the air outlet 216 and the two second arc-shaped strips are spaced opposite each other. Thus, as... Figure 4 As shown by the arrows, the cooling gas near each second arc strip will be divided into two paths and dispersed to the inside and outside of the second arc strip due to the obstruction of the second arc strip. The path that disperses to the inside of the second arc strip will converge to the central area of ​​the cooling space 22.

[0075] In some preferred embodiments, such as Figure 4 As shown, the first arc-shaped strip and the second arc-shaped strip are concentrically arranged and distributed at different positions in the circumferential direction of the first connecting ring 213, and the radial thickness of the second arc-shaped strip is greater than the radial thickness of the first arc-shaped strip. Figure 4 As shown by the arrows, the first and second arc-shaped strips block the gas flow at different positions. Specifically, the outer circumferential surface of the first arc-shaped strip is used to block the gas flow, while one end face of the second arc-shaped strip is used to block the gas flow. Therefore, the radial thickness of the second arc-shaped strip should be larger than that of the first arc-shaped strip to increase its end face area.

[0076] In some alternative embodiments, such as Figure 5 As shown, the two ends of the second connecting ring 211 pass through the annular holes of the first fixing ring 212 and the second fixing ring 214, respectively, to prevent the cooling gas in the cooling space 22 from flowing directly out of the annular holes. At the same time, the second connecting ring 211 can also block the cooling gas from flowing directly to the outlet, allowing the cooling gas to diffuse further, and can be considered as a flow-blocking ring.

[0077] In some optional embodiments, the coil device further includes a connection structure comprising a first connection component and a second connection component. The first connection component is electrically connected to the first ends 311 of a plurality of first planar coils 31 in the first sub-coil group, thereby achieving parallel connection of the first ends 311 of the plurality of first planar coils 31. The second connection component is used to electrically connect the first ends 321 of a plurality of second planar coils 32 in the second sub-coil group, thereby achieving parallel connection of the first ends 321 of the plurality of second planar coils 32. Furthermore, one of the first and second connection components is used to electrically connect to the input terminal of a radio frequency (RF) source, and the other of the first and second connection components is used to electrically connect to the output terminal of the RF source. The RF source may include, for example, an RF power supply and a matching unit, or may only include an RF power supply. The first connection component is used to connect the first ends 311 of the plurality of first planar coils 31 in parallel to the input or output terminal of the RF source; the second connection component is used to connect the first ends 321 of the plurality of second planar coils 32 in parallel to the output or input terminal of the RF source.

[0078] For example, such as Figure 6 and Figure 7 As shown, the aforementioned first connecting component includes N / 2 first connecting strips 61 ( Figure 6 The first connecting assembly comprises N / 2 first connecting strips 61, one end of which is electrically connected to the first extension section 33 of the N / 2 pairs of first coils, and the other end of which passes through the first fixing ring 212 and is detachably electrically connected to the first parallel member located on the side of the first fixing ring 212 away from the cooling space 22. The second connecting assembly comprises N / 2 second connecting strips 62 and a second parallel member, one end of which is electrically connected to the second extension section of the N / 2 pairs of second coils, and the other end of which passes through the first fixing ring 212 and is detachably electrically connected to the second parallel member located on the side of the first fixing ring 212 away from the cooling space 22. In other words, both the first connecting strips 61 and the second connecting strips 62 extend to the side of the first fixing ring 212 away from the cooling space 22 and are detachably electrically connected to the first parallel member and the second parallel member, respectively. One of the first parallel component and the second parallel component is used to be electrically connected to the input terminal of the radio frequency source, and the other of the first parallel component and the second parallel component is used to be electrically connected to the output terminal of the radio frequency source.

[0079] In some alternative embodiments, such as Figure 7As shown, both the first and second parallel components include N / 2 strip-shaped forks 71. The first ends of the N / 2 strip-shaped forks 71 are connected together near the center of the cooling space 22 and are electrically connected to each other. The second ends of the N / 2 strip-shaped forks 71 extend radially relative to their respective first ends along different directions of the cooling space 22. Specifically, the second ends of the N / 2 strip-shaped forks 71 in the first parallel component extend above the other ends of the N / 2 first connecting bars 61, and a connecting post 72 is provided on this second end. Correspondingly, a plug 63 is provided on the other end of the first connecting bar 61. By inserting the connecting post 72 into the plug 63, an electrical connection can be achieved between the strip-shaped forks 71 and the first connecting bars 61. Similarly, in the second parallel component, the second ends of the N / 2 strip-shaped forks 71 extend above the other ends of the N / 2 second connecting strips 62, and a connecting post 72 is provided on the second end. Correspondingly, a plug 63 is provided on the other end of the second connecting strip 62. By inserting the connecting post 72 into the plug 63, an electrical connection can be achieved between the strip-shaped forks 71 and the second connecting strips 62. Of course, in practical applications, other detachable connection structures can also be used to achieve a detachable electrical connection between the second ends of the N / 2 strip-shaped forks and the other ends of the N / 2 first connecting strips 61 or the other ends of the N / 2 second connecting strips 62. In some optional embodiments, the above-mentioned detachable electrical connection can take various forms, such as plug-in, snap-fit, etc.

[0080] In one specific embodiment, such as Figure 7 As shown, N=8. In this case, the second ends of the eight first planar coils 31 are connected in series with the second ends of the eight second planar coils 32, one-to-one. The first ends 311 of the eight first planar coils 31 are connected in parallel in pairs through four first extension sections 33, and the first ends 321 of the eight second planar coils 32 are connected in parallel in pairs through four second extension sections. Four first connecting strips 61 are connected to four first extension sections 33, one-to-one, to realize the parallel connection of the first ends 311 of the eight first planar coils 31, and are electrically connected to the input or output terminal of the RF source through the four strip-shaped forks 71 in the first parallel connection. Four second connecting strips 62 are connected to four second extension sections, one-to-one, to realize the parallel connection of the first ends 321 of the eight second planar coils 32, and are electrically connected to the output or input terminal of the RF source through the four strip-shaped forks 71 in the second parallel connection.

[0081] It should be noted that the above embodiments are based on Figure 2A Taking the coil structure 3 shown as an example, a detailed description of the specific implementation of the fixed cooling assembly 2 will be provided. However, the structure of the fixed cooling assembly is not limited to this. In practical applications, the structure of the corresponding components in the fixed cooling assembly can be adaptively changed according to different coil structures, and these changes all fall within the protection scope of this invention.

[0082] In summary, the coil device for generating plasma in the semiconductor process equipment provided in this embodiment forms a cooling space capable of accommodating the coil structure through a fixed body. Cooling gas is supplied to the cooling space through an air inlet and discharged from the cooling space through an air outlet. This allows the cooling gas to flow within the cooling space, carrying away the heat generated by the coil structure during the flow. Simultaneously, by setting a turbulence structure in the cooling space to change the gas flow direction, the uniformity of gas distribution in the cooling space can be improved. This effectively improves the cooling efficiency and uniformity of the coil structure, reduces the oxidation rate of the coil structure, and thus extends the service life of the coil structure.

[0083] As another technical solution, this embodiment also provides a semiconductor process equipment, such as... Figure 8 As shown, the semiconductor process equipment includes a radio frequency source 105 with an upper electrode, a reaction chamber 100, a coil device, an air intake device 104, and an air extraction device 105. A dielectric window 101 is provided at the top of the reaction chamber 100, and the coil device is disposed above the dielectric window 101. The coil device described in this embodiment is used; specifically, the coil device includes, for example, […]. Figure 7 The coil structure 3 and the fixed cooling assembly are included.

[0084] Radio frequency (RF) source 105 provides RF power to coil structure 3 to excite the process gas in reaction chamber 100 to form plasma. RF source 105 may include, for example, an RF power supply and a matching circuit, or may only include an RF power supply. Furthermore, a base 102 is provided in reaction chamber 100 for supporting the wafer, and this base 102 is electrically connected to the RF source 103 at the lower electrode. The RF source 103 applies an RF bias voltage to the base 102 to attract the plasma towards the wafer surface.

[0085] The aforementioned air intake device 104 is used to supply cooling gas to the air intake port 215; the air extraction device 106 is used to extract the cooling gas from the cooling space 22.

[0086] The semiconductor process equipment provided in this embodiment, by employing the coil device described above, can effectively improve the cooling efficiency and uniformity of the coil structure, reduce the oxidation rate of the coil structure, and thus extend the service life of the coil structure.

[0087] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A coil device for generating plasma in a semiconductor process apparatus, characterized in that, It includes a coil structure and a fixing and cooling assembly for fixing and cooling the coil structure, wherein, The fixed cooling assembly includes a fixed body made of insulating material, and a cooling space is formed in the fixed body. The coil structure is fixedly installed in the cooling space. The fixed body is provided with an air inlet and an air outlet that communicate with the cooling space. The air inlet is used to supply cooling gas into the cooling space. The air outlet is used to discharge the cooling gas from the cooling space. A turbulence structure is also provided in the cooling space to change the gas flow direction in the cooling space, thereby improving the uniformity of gas distribution in the cooling space. The turbulence structure includes a first turbulence element and a second turbulence element. The first turbulence element is located near the air inlet to cause a portion of the cooling gas flowing through the first turbulence element to flow toward the edge region of the cooling space. The second baffle is positioned near the air outlet to direct a portion of the cooling gas flowing through the second baffle toward the central region of the cooling space.

2. The coil device according to claim 1, characterized in that, The fixed body includes a first fixed ring, a second fixed ring, a first connecting ring, and a second connecting ring constituting the cooling space. The first fixed ring and the second fixed ring are disposed opposite to each other. The first connecting ring is connected between the first fixed ring and the second fixed ring and is located at the outer periphery of both. The second connecting ring is connected between the first fixed ring and the second fixed ring and is located at the inner periphery of both. The coil structure is arranged around the second connecting ring; The air inlet and air outlet are located on the first connecting ring.

3. The coil device according to claim 2, characterized in that, There is one air outlet; there are two air inlets, which are symmetrically arranged on both sides of the air outlet along its axial direction. The first aerodynamic component includes two first arc-shaped strips, both of which extend circumferentially along the first connecting ring and are spaced apart from each other. The two first arc-shaped strips are respectively opposite to the two air inlets, and the two ends of each first arc-shaped strip are located on both sides of the axial direction of the opposite air inlet.

4. The coil device according to claim 3, characterized in that, The second aerodynamic element includes two second arc-shaped strips, both of which extend circumferentially along the first connecting ring and are spaced apart from each other, and the two second arc-shaped strips are respectively located on both sides of the air outlet axially.

5. The coil device according to claim 4, characterized in that, The first arc-shaped strip and the second arc-shaped strip are concentrically arranged and distributed at different positions in the circumferential direction of the first connecting ring, and the radial thickness of the second arc-shaped strip is greater than the radial thickness of the first arc-shaped strip.

6. The coil device according to claim 2, characterized in that, The coil structure includes at least one set of coil groups, the coil groups include a first sub-coil group and a second sub-coil group, the first sub-coil group includes at least one first planar coil located in a first plane perpendicular to the axis of the coil group, the second sub-coil group includes at least one second planar coil located in a second plane parallel to the first plane, the first planar coil and the second planar coil are connected in series, and the orthographic projection of the second planar coil on the first plane is either mirror-symmetric or mirror-asymmetric with the first planar coil; The first planar coil and the second planar coil are respectively fixed on the first fixing ring and the second fixing ring.

7. The coil device according to claim 6, characterized in that, The first sub-coil group includes a plurality of first planar coils, the plurality of first planar coils having the same shape and being spaced apart from each other, and the first ends of the plurality of first planar coils being evenly distributed along the circumferential direction of the coil group; The second sub-coil group includes a plurality of second planar coils, which are identical in shape and spaced apart from each other. The first ends of the plurality of second planar coils are evenly distributed along the circumferential direction of the coil group. Each of the first planar coils corresponds to one of the second planar coils. The first ends of the first planar coils are connected in parallel, the first ends of the second planar coils are connected in parallel, and the second ends of the first planar coils are connected in series with the second ends of the second planar coils, respectively.

8. The coil device according to claim 7, characterized in that, The first planar coil consists of N coils, where N is an even number greater than or equal to 2. The N first planar coils are divided into N / 2 pairs of first coils in the circumferential direction of the coil group. Each pair of first coils includes two adjacent first planar coils, and a first extension segment is connected between the first ends of the two adjacent first planar coils to connect them in parallel. The first extension segments in the N / 2 pairs of first coils are connected in parallel. There are N second planar coils; the N second planar coils are divided into N / 2 pairs of second coils in the circumferential direction of the coil group. Each pair of second coils includes two adjacent second planar coils, and a second extension section is connected between the first ends of the two adjacent second planar coils to connect them in parallel; the second extension sections in the N / 2 pairs of second coils are connected in parallel.

9. The coil device according to claim 8, characterized in that, The coil device further includes a connection structure, which includes a first connection component and a second connection component, wherein the first connection component is electrically connected to the first end of a plurality of first planar coils in the first sub-coil group; and the second connection component is used to electrically connect the first end of a plurality of second planar coils in the second sub-coil group. One of the first connection component and the second connection component is used for electrical connection to the input terminal of the radio frequency source, and the other of the first connection component and the second connection component group is used for electrical connection to the output terminal of the radio frequency source.

10. The coil device according to claim 9, characterized in that, The first connecting assembly includes N / 2 first connecting strips and a first parallel member, wherein one end of each of the N / 2 first connecting strips is electrically connected to the first extension section of each of the N / 2 pairs of first coils, and the other end of each of the N / 2 first connecting strips passes through the first fixing ring and is detachably electrically connected to the first parallel member located on the side of the first fixing ring away from the cooling space. The second connecting assembly includes N / 2 second connecting strips and a second parallel member, wherein one end of each of the N / 2 second connecting strips is electrically connected to the second extension section of each of the N / 2 pairs of second coils, and the other end of each of the N / 2 second connecting strips passes through the first fixing ring and is detachably electrically connected to the second parallel member located on the side of the first fixing ring away from the cooling space. One of the first parallel component and the second parallel component is used to be electrically connected to the input terminal of the radio frequency source, and the other of the first parallel component and the second parallel component is used to be electrically connected to the output terminal of the radio frequency source.

11. The coil device according to claim 10, characterized in that, Both the first parallel member and the second parallel member include N / 2 strip-shaped forks. The first ends of the N / 2 strip-shaped forks are connected together near the center of the cooling space and are electrically connected to each other. The second ends of the N / 2 strip-shaped forks extend in different radial directions of the cooling space relative to their respective first ends. The second ends of the N / 2 strip-shaped forks in the first parallel member are detachably electrically connected to the other ends of the N / 2 first connecting strips. The second ends of the N / 2 strip-shaped forks in the second parallel member are detachably electrically connected to the other ends of the N / 2 second connecting strips.

12. The coil device according to claim 7, characterized in that, A connecting segment is provided between the second end of each of the first planar coils and the second end of the corresponding second planar coil to connect them in series, and the extension direction of the connecting segment is parallel to the axis of the coil group.

13. The coil device according to any one of claims 6-12, characterized in that, A first coil groove is provided on the surface of the first fixing ring adjacent to the cooling space. The orthographic projection of the first coil groove on the first plane is adapted to at least one first planar coil to accommodate at least a portion of the first planar coil. A second coil groove is provided on the surface of the second fixing ring adjacent to the cooling space. The orthographic projection of the second coil groove on the second plane is adapted to at least one second planar coil to accommodate at least a portion of the second planar coil.

14. The coil device according to any one of claims 6-12, characterized in that, The coil group consists of two groups, which are of different sizes and are nested together; the turbulence structure is disposed between the two groups of coil groups.

15. The coil device according to claim 1, characterized in that, The insulating material includes ceramics.

16. The coil device according to claim 1, characterized in that, The cooling gas includes compressed air.

17. A semiconductor process apparatus, characterized in that, The device includes a radio frequency source, a reaction chamber, a coil device as described in any one of claims 1-16, an air intake device, and an air extraction device, wherein a dielectric window is provided at the top of the reaction chamber, and the coil device is disposed above the dielectric window; the radio frequency source is used to provide radio frequency power to the coil structure; the air intake device is used to provide the cooling gas to the air intake port; and the air extraction device is used to extract the cooling gas from the cooling space.

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