Laser engraving device and method based on five-axis engraving machine

By utilizing the laser engraving device and method of a five-axis precision engraving machine, and employing a priority avoidance algorithm and a thermal impact monitoring grid, combined with an independent cooling system and dual-table collaborative scheduling, the path conflict and thermal superposition problems in multi-head laser engraving are solved, achieving high-precision and high-efficiency laser engraving processing.

CN122210239APending Publication Date: 2026-06-16DONGGUAN DIOR CNC EQUIP CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN DIOR CNC EQUIP CO LTD
Filing Date
2026-04-29
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

Existing multi-head laser engraving technology suffers from problems such as laser processing component path conflicts, equipment collision damage caused by thermal dose superposition, and reduced processing accuracy. Furthermore, it lacks an efficient dual-workpiece stage collaborative scheduling mechanism, which fails to fully utilize the efficiency of the dual-stage.

Method used

A five-axis CNC engraving machine is used to adjust the path of laser processing components through a priority avoidance algorithm, establish a heat-affected zone monitoring grid and adjust process parameters in real time, and configure an independent cooling system and a dual-table collaborative scheduling mechanism to achieve seamless switching.

Benefits of technology

It effectively avoids the risk of collision between multiple laser processing components, improves processing quality and precision, extends equipment lifespan, and increases processing efficiency.

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Abstract

The application discloses a laser engraving processing device and method based on a five-axis engraving machine, relates to the field of laser engraving equipment control, and loads a three-dimensional CAD model and a process task of a workpiece to be processed, distributes the process task to machining paths of each laser processing assembly, respectively predicts time-space collision of paths of five laser processing assemblies, adjusts speed or paths of low-priority laser processing assemblies through a priority avoidance algorithm when collision risk is predicted, and generates a collision-free pre-planned path. Through reasonable path planning and a collision avoidance mechanism, the application effectively avoids collision risk between multiple laser processing assemblies and guarantees stability of a machining process. Through establishment of a thermal influence monitoring grid and a thermal dose accumulation model, laser machining parameters are adjusted in real time, workpiece deformation caused by thermal dose superposition is avoided, and machining quality is improved. A focal point dynamic following mechanism ensures that the focal point is always in an optimal machining position, and further improves engraving precision.
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