A device for automatically removing defective products in chip detection

Abstract

This invention discloses an automatic defective chip rejection device for chip inspection, relating to the chip manufacturing field. It includes a drive motor and a turntable. The turntable is fixed to the output end of the drive motor, and multiple sets of mounting brackets surround the outer side of the turntable. Each mounting bracket houses a chip holder, and the chip holder contains a chip. A support frame is mounted on one side of the drive motor. Before chip inspection, airflow from a jet nozzle is injected into the mounting bracket through an air inlet and then enters multiple nozzles along a conduit within the mounting bracket. The airflow is sprayed onto the chip through the nozzles, cleaning the outer surface of the chip. During the cleaning process, the negative pressure of the air pump extends to the suction mechanism through a movable tube and a fixed air tube. The negative pressure generated by the suction mechanism draws in air above the chip, adsorbing and collecting any blown-up impurities, thereby effectively reducing impurities adhering to the chip and minimizing chip damage.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing, specifically to an automatic defective chip rejection device for chip inspection. Background Technology

[0002] In electronics, an integrated circuit chip is a method of miniaturizing circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer. An integrated circuit chip is an electronic component that includes a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring, and at least one guard ring. After the integrated circuit chip is manufactured, it is generally inspected using a production line-type testing device to test the electrical characteristics of the chip. During the testing process, if a chip is found to be unqualified, it needs to be rejected by the device.

[0003] However, existing rejection devices typically use negative pressure adsorption to reject chips. During the rejection process, negative pressure draws the chip into the pipe and forces it through the pipe to the collection box. However, the existing adsorption method does not adequately protect the chip. As the chip moves through the pipe, especially at bends, it is prone to colliding with the inner wall of the pipe, which can easily cause secondary damage. Furthermore, dust can easily enter the device along with the chip during the adsorption process, resulting in a large amount of impurities adhering to the outside of the chip and causing chip damage. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide an automatic defective chip rejection device for chip inspection, so as to solve the technical problems of chip collision with pipelines during the chip feeding process and impurities entering the device with the chip and damaging the chip.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic defective chip rejection device for chip inspection, comprising a drive motor and a turntable. The turntable is fixed to the output end of the drive motor, and multiple sets of mounting brackets surround the outer side of the turntable. Each set of mounting brackets contains a chip holder, and the chip holder contains a chip. A support frame is mounted on one side of the drive motor, and the top of the support frame extends above a set of chip holders and connects to a detection mechanism. A fixed air pipe connected to the detection mechanism is installed inside the support frame. A suction nozzle is provided at the bottom of the detection mechanism, the suction nozzle being aligned with the chip and located below and in sync with the suction mechanism. A jetting mechanism is located below the mounting bracket, and a jetting pipe is connected to the top of the jetting mechanism. The jetting pipe is aligned with the bottom of the mounting bracket. An air inlet is opened at the bottom of the mounting bracket, and conduits are connected to both sides of the air inlet. The conduits extend to both sides of the chip clip and have nozzles. An air pump is installed at the bottom of the jetting mechanism, and the output end of the air pump faces upward and is aligned with the jetting pipe. An air bladder is connected inside the jetting mechanism above the output end of the air pump. Multiple sets of leakage holes are opened on the inner wall of the air bladder. A movable air guiding mechanism is connected to the input end of the air pump, and the movable air guiding mechanism extends into the interior of the support frame and connects to the bottom end of the fixed air pipe.

[0006] By adopting the above technical solution, it is possible to conveniently perform pipeline testing on multiple sets of chips. After testing, the chips are cleaned by the jet and suction mechanisms to remove impurities from the outside of the chips, and the suction mechanism absorbs the impurities. If a chip problem is detected, the chip can be continuously separated from the chip holder. After the mounting bracket is removed, the chip falls into the jet pipe for recycling. Under the action of airflow, the damage to the chip during its fall is reduced.

[0007] The present invention is further configured such that the detection mechanism includes a cylinder and an air suction mechanism, the air suction mechanism is connected to a fixed air pipe through a hose, the cylinder is fixed to the top of the support frame, and the output end of the support frame is fixedly connected to the top of the air suction mechanism, and the air suction mechanism is movably connected to the support frame.

[0008] By adopting the above technical solution, the position of the suction mechanism can be moved by the cylinder, and during the movement, the suction mechanism can easily adsorb the chip.

[0009] The present invention is further configured such that the suction mechanism comprises a suction groove and a suction tube, and the suction nozzle is fixed at the bottom end of the suction tube. Detection rods are installed on both sides of the suction tube, and the detection rods are connected to external detection equipment. A filter screen is installed inside the detection mechanism above the suction tube, and the filter screen is detachably connected to the suction mechanism.

[0010] By adopting the above technical solution, it is convenient to draw in impurities ejected from the outside of the chip by the suction mechanism, and to adsorb the impurities through the filter screen.

[0011] The invention is further configured such that a collection box is connected to one side of the jet mechanism, and a discharge groove is provided on the inner wall of the jet mechanism above the airbag. The airbag is inclined, the discharge groove is aligned with the lowest end of the airbag, and the discharge groove extends to the top of the collection box.

[0012] By adopting the above technical solution, the chip can be easily slid down from above the airbag into the collection box, and the chip can be collected through the collection box.

[0013] The present invention is further configured such that the shape of the chip clip matches the shape of the chip, and a semi-squeezed mesh is provided on the outer side of the chip clip, and the semi-squeezed mesh is aligned with the nozzle, and the shape of the nozzle also matches the shape of the chip clip.

[0014] By adopting the above technical solution, it is convenient to fix and limit different chips.

[0015] The invention is further configured such that the movable air guiding mechanism includes a movable tube and a movable rod. The movable tube is connected to the input end of the air pump via a flexible hose. One end of the movable tube extends into the interior of the support frame and is aligned with the bottom end of the fixed air tube. A vent hole is provided at the top end of the movable tube aligned with the fixed air tube. The end of the movable tube extends to the outside of the support frame. The outside of the movable rod extends to the outside of the jet mechanism. The movable rod is located inside the jet mechanism and connected to a limiting seat. A spring is sleeved on the outside of the movable rod. The two ends of the spring are respectively fixed to the outside of the movable tube and the limiting seat.

[0016] By adopting the above technical solution, the airflow of the fixed air tube can be cut off by the movement of the movable air guiding mechanism, so that the chip can be separated from the air intake mechanism.

[0017] The invention is further configured such that a connecting rod is installed on the connecting arm between the turntable and the mounting bracket, the connecting rod extends in the opposite direction of the turntable rotation, and a top plate is connected to the bottom end of the connecting rod, and the top plate contacts and presses the movable rod.

[0018] By adopting the above technical solution, the position of the movable air guide mechanism can be controlled by the rotation of the turntable, which pushes the movable rod through the top plate after the mounting bracket leaves the jet pipe.

[0019] In summary, the present invention has the following main beneficial effects:

[0020] 1. This invention, through its jetting mechanism, air pump, airbag, and leak hole, allows for the adsorption of chips after a problem is detected during chip inspection. Once the mounting bracket is away from the jetting pipe, the chip detaches and falls into the pipe. The airflow pushes the chip, reducing the impact of its fall. When the chip lands on the airbag, the gas inside further reduces the impact force, effectively minimizing damage during chip intake and solving the problem of chip collisions with pipes during unloading.

[0021] 2. This invention, through its jetting mechanism, mounting bracket, and suction mechanism, allows the airflow from the jetting pipe to enter the mounting bracket through the air inlet before chip inspection. The airflow then travels along the conduit within the mounting bracket to the multi-nozzle, where it is sprayed onto the chip to clean its outer surface. During this cleaning process, the negative pressure from the air pump extends through the movable and fixed air pipes to the suction mechanism. This negative pressure draws in air above the chip, adsorbing and collecting any blown-up impurities. This effectively reduces impurities adhering to the chip, minimizing chip damage and solving the problem of impurities damaging the chip when they enter the device. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the side cross-sectional structure of the present invention;

[0024] Figure 3 For the present invention Figure 2 A partial structural diagram at point A in the middle;

[0025] Figure 4 This is a schematic diagram of the internal structure of the air intake mechanism of the present invention;

[0026] Figure 5 This is a schematic diagram of the suction nozzle structure of the present invention;

[0027] Figure 6 This is a schematic diagram of the internal structure of the jet mechanism of the present invention;

[0028] Figure 7 This is a schematic diagram of the movable tube installation structure of the present invention;

[0029] Figure 8 This is a schematic diagram of the connection structure between the movable tube and the fixed air tube of the present invention;

[0030] Figure 9 This is a schematic diagram of the movable rod and extrusion plate structure of the present invention;

[0031] Figure 10 This is a schematic diagram of the connecting rod structure of the present invention;

[0032] Figure 11 This is a schematic diagram of the chip clip structure of the present invention;

[0033] Figure 12 This is a schematic diagram of the chip clip mounting structure of the present invention;

[0034] Figure 13 This is a partial cross-sectional view of the mounting bracket of the present invention.

[0035] In the diagram: 1. Drive motor; 2. Feeding mechanism; 3. Unloading mechanism; 4. Turntable; 401. Mounting bracket; 402. Air inlet; 403. Conduit; 404. Nozzle; 5. Support frame; 6. Detection mechanism; 7. Cylinder; 8. Jet mechanism; 801. Jet pipe; 802. Unloading trough; 9. Chip holder; 901. Semi-squeezed screen; 10. Processing mechanism; 11. Connecting rod; 1101. Top plate; 12. Movable rod; 13. Collection box; 14. Suction mechanism; 1401. Suction slot; 1402. Suction tube; 1403. Filter screen; 15. Suction nozzle; 1501. Slot; 16. Detection rod; 17. Fixed air pipe; 18. Air pump; 19. Movable tube; 20. Airbag; 2001. Leakage hole. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] The embodiments of the present invention will now be described.

[0038] An automatic defective chip rejection device, as shown in the figure, includes a drive motor 1 and a turntable 4. The turntable 4 is fixed on the output end of the drive motor 1, and multiple sets of mounting brackets 401 surround the outer side of the turntable 4. Each set of mounting brackets 401 has a chip holder 9 installed inside, and the chip holder 9 has a chip installed inside. A feeding mechanism 2, a discharging mechanism 3, and a processing mechanism 10 are sequentially installed around the outer side of the turntable 4. The feeding mechanism 2 moves each set of chips from the conveyor belt to the mounting brackets 401 of the turntable 4 by suction cups. After the chip is aligned with the chip holder 9, the chip is installed in the chip holder 9. Then, the drive motor 1 is started, and the output end of the drive motor 1 drives the turntable 4 to rotate. The turntable 4 drives the multiple sets of mounting brackets 401 to rotate, and the mounting brackets 401 carry the chip into the processing mechanism 10 for processing.

[0039] A support frame 5 is installed on one side of the drive motor 1, and the top of the support frame 5 extends above a set of chip clips 9 and is connected to a detection mechanism 6. The detection mechanism 6 includes a cylinder 7 and a suction mechanism 14. The suction mechanism 14 is connected to a fixed air pipe 17 via a hose. The cylinder 7 is fixed to the top of the support frame 5, and the output end of the support frame 5 is fixedly connected to the top of the suction mechanism 14. The suction mechanism 14 is movably connected to the support frame 5. The suction mechanism 14 consists of a suction groove 1401 and a suction tube 1402, and a suction nozzle 15 is fixed to the bottom end of the suction tube 1402. Detection rods 16 are installed on both sides of the suction tube 1402. The detection rods 16 are connected to external detection equipment. The top of the suction tube 1402 is located at the suction position. The internal structure of mechanism 14 is equipped with a filter screen 1403, which is detachably connected to the suction mechanism 14. The internal structure of support frame 5 is equipped with a fixed air pipe 17 connected to the detection mechanism 6. A suction nozzle 15 is located at the bottom of the detection mechanism 6, aligned with the chip. A jetting mechanism 8 is located below the suction mechanism 14 and simultaneously below the mounting frame 401. A jetting pipe 801 is connected to the top of the jetting mechanism 8, aligned with the bottom of the mounting frame 401. An air inlet 402 is located at the bottom of the mounting frame 401, and conduits 403 are connected to both sides of the air inlet 402. The conduits 403 extend to both sides of the chip clip 9, where nozzles 404 are located. An air pump 18 is installed at the bottom, with its output end facing upwards and aligned with the jet pipe 801. The chip is moved to the bottom of the detection mechanism 6. At this time, the suction mechanism 14 is located directly above the chip, and the bottom end of the mounting bracket 401 is in contact with the jet pipe of the jet mechanism 8. The airflow ejected from the jet pipe 801 enters the mounting bracket 401, cleaning the impurities attached to the outside of the chip and blowing them away. At the same time, the input end of the air pump 18 is connected to the movable tube 19 through a flexible hose. The negative pressure generated by the air pump 18 extends through the movable tube 19 into the fixed air tube 17. The fixed air tube 17 is connected to the suction mechanism 14 through a flexible hose. After the negative pressure enters the suction mechanism 14, it draws outside air through the suction tube 1402. During the suction process, impurities blown up by the chip are adsorbed and brought into the suction mechanism 14. The filter 1403 then adsorbs the inhaled impurities, effectively cleaning the impurities on the outside of the chip, ensuring the chip's cleanliness and reducing damage. After cleaning, the cylinder 7 pushes the suction mechanism 14 downward, and the nozzle 15 fits against the chip, sucking the chip up and fitting it against the nozzle 15. The slot 1501 continues to draw outside air into the suction mechanism 14. Then, the chip is tested by the detection rod 16. After the test, if the chip is intact, it is put back into the chip holder 9. If a problem is detected, the chip is adsorbed again.

[0040] The input end of the air pump 18 is connected to a movable air guiding mechanism, which includes a movable pipe 19 and a movable rod 12. The movable pipe 19 is connected to the input end of the air pump 18 via a hose. One end of the movable pipe 19 extends into the interior of the support frame 5 and aligns with the bottom end of the fixed air pipe 17. A vent hole is provided at the top of the movable pipe 19 where it aligns with the fixed air pipe 17. The end of the movable pipe 19 extends to the outside of the support frame 5. The outside of the movable rod 12 extends to the outside of the jet mechanism 8. The movable rod 12 is located inside the jet mechanism 8 and connected to a limit seat. A spring is sleeved on the outside of the movable rod 12. The two ends of the spring are fixed to the outside of the movable pipe 19 and the limit seat, respectively. A connecting rod 11 is installed on the connecting arm between the turntable 4 and the mounting frame 401. The connecting rod 11 extends in the opposite direction of the rotation of the turntable 4. The bottom end of the connecting rod 11 is connected to a top plate 1101. 01 contacts and squeezes the movable rod 12, starts the drive motor 1, drives the chip clip 9 without the chip and the mounting bracket 401 to move out from under the detection mechanism 6, so that the chip is aligned with the jet pipe 801. At this time, the connecting rod 11 installed on the outside of the turntable 4 moves to the outside of the jet mechanism 8, the top plate 1101 is attached to the movable rod 12 and squeezes the movable rod 12 into the jet mechanism 8. At this time, the movable rod 12 drives the movable tube 19 to move, so that the end of the movable tube 19 is pushed out from the support frame 5. The connection between the fixed air pipe 17 and the movable tube 19 is cut off, and negative pressure is no longer provided in the fixed air pipe 17. The connection between the movable tube 19 and the fixed air pipe 17 moves to the outside of the support frame 5 to suck in outside air, so as to avoid the air pump 18 from stopping. At this time, there is no negative pressure in the suction mechanism 14, the chip is no longer attached to the nozzle 15, and falls into the jet pipe 801 under the action of gravity.

[0041] An airbag 20 is connected to the inside of the jet mechanism 8 above the output end of the air pump 18. Multiple sets of leakage holes 2001 are opened on the inner wall of the airbag 20. A collection box 13 is connected to one side of the jet mechanism 8. A feeding groove 802 is opened on the inner wall of the jet mechanism 8 above the airbag 20. The airbag 20 is tilted and the feeding groove 802 is aligned with the lowest end of the airbag 20 and extends to the top of the collection box 13. The airflow ejected from the jet pipe 801 will support the chip and reduce the impact when the chip falls. When the chip comes into contact with the airbag 20, the gas in the airbag 20 will also effectively reduce the impact of chip feeding and effectively protect the chip, avoiding secondary damage to the chip during the chip feeding process. The chip that falls on the airbag 20 will slide along the airbag 20 and enter the collection box 13 through the feeding groove 802.

[0042] Please see Figure 1 and Figure 3The shape of the chip clip 9 matches the shape of the chip, and a semi-squeezable mesh 901 is provided on the outer side of the chip clip 9. The semi-squeezable mesh 901 is aligned with the nozzle 404, and the shape of the nozzle 404 also matches the shape of the chip clip 9, which can clamp and fix different chips.

[0043] The working principle of this invention is as follows: When testing chips, the feeding mechanism 2 first moves each group of chips from the conveyor belt to the mounting bracket 401 of the turntable 4 via suction cups. After the chip is aligned with the chip holder 9, the chip is installed in the chip holder 9. Then, the drive motor 1 is started, and the output end of the drive motor 1 drives the turntable 4 to rotate. The turntable 4 drives the multiple mounting brackets 401 to rotate. The mounting brackets 401 carry the chip into the processing mechanism 10 for processing until the chip is brought to the bottom of the testing mechanism 6. At this time, the suction mechanism 14 is located directly above the chip, and the bottom end of the mounting bracket 401 is in contact with the jet pipe of the jet mechanism 8. The air inlet 402 is aligned with the jet pipe 801. At this time, the air pump 18 is started. The output end of the air pump 18 first sends airflow into the airbag 20. The airflow causes the airbag 20 to expand and then passes through the leakage hole 2001 into the jet pipe 801. Inside 01, airflow enters the air inlet 402 through the jet pipe 801, and passes through the nozzles 404 located on both sides of the chip clip 9 via the conduit 403. The airflow passes through the semi-squeezed mesh 901 to blow air onto the outside of the chip, cleaning the impurities attached to the outside of the chip and blowing them up. At the same time, the input end of the air pump 18 is connected to the movable tube 19 through a hose. The negative pressure generated by the air pump 18 extends into the fixed air tube 17 through the movable tube 19. The fixed air tube 17 is connected to the suction mechanism 14 through a hose. After the negative pressure enters the suction mechanism 14, it draws in outside air through the suction tube 1402. At this time, it can adsorb the impurities blown up by the chip, allowing the impurities to enter the suction mechanism 14. The inhaled impurities are then adsorbed by the filter screen 1403, thereby effectively cleaning the impurities on the outside of the chip, ensuring the cleanliness of the chip, and reducing damage to the chip.

[0044] Then, the cylinder 7 is activated to push the suction mechanism 14 downward, bringing the nozzle 15 closer to the chip. Driven by the airflow on both sides and the negative pressure inside the suction tube 1402, the chip is sucked in, causing the chip to adhere to the outside of the nozzle 15. The cylinder 7 is then activated to drive the suction mechanism 14 upward, thereby pulling the chip out of the chip holder 9. The chip is then electrically tested by the detection rods 16 on both sides of the nozzle 15, which facilitates chip removal, avoids blockage, and improves efficiency.

[0045] After the chip testing is completed, if the chip is without problems, the cylinder 7 is activated to push the chip back into the chip holder 9, the air pump 18 is turned off, and the suction nozzle 15 no longer adsorbs the chip. Then, the drive motor 1 is activated to move the next set of chips to the area below the testing mechanism 6. If a chip with a problem is detected, when the chip is adsorbed outside the suction nozzle 15, the drive motor 1 is activated directly. The drive motor 1 moves the chip holder 9 (without a chip) and the mounting bracket 401 from below the testing mechanism 6, aligning the chip with the jet pipe 801. At this time, the connecting rod 11 installed on the outside of the turntable 4 moves to the outside of the jet mechanism 8, the top plate 1101 and the movable rod 12 are pressed together and inserted into the jet mechanism 8. At this time, the movable rod 12 moves the movable tube 19, causing the end of the movable tube 19 to be pushed out of the support frame 5. The connection between the fixed air pipe 17 and the movable tube 19 is cut off, and negative pressure is no longer provided in the fixed air pipe 17. The connection with the fixed air tube 17 is moved to the outside of the support frame 5 to draw in outside air, preventing the air pump 18 from stopping. At this time, there is no negative pressure in the suction mechanism 14, and the chip is no longer adsorbed on the suction nozzle 15. Under the action of gravity, it falls into the jet pipe 801, and the airflow ejected from the jet pipe 801 will support the chip and reduce the impact when the chip falls. When the chip comes into contact with the air bag 20, the gas in the air bag 20 will also effectively reduce the impact of chip feeding, effectively protecting the chip and avoiding secondary damage to the chip during the chip feeding process. The chip that falls on the air bag 20 will slide along the air bag 20 and enter the collection box 13 through the feeding groove 802 for chip recycling, improving chip recycling efficiency. After the chip is recycled, the top plate 1101 separates from the movable rod 12, and the movable tube 19 returns to its original position and reconnects with the fixed air tube 17 under the pull of the spring, which facilitates subsequent chip testing.

[0046] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. An automatic defective chip rejection device for chip inspection, comprising a drive motor (1) and a turntable (4), the turntable (4) being fixed on the output end of the drive motor (1), and having multiple sets of mounting brackets (401) surrounding the outer side of the turntable (4), each set of mounting brackets (401) having a chip holder (9) installed inside, and the chip holder (9) having a chip installed inside, characterized in that: A support frame (5) is installed on one side of the drive motor (1), and the top of the support frame (5) extends to the top of a set of chip clips (9) and is connected to a detection mechanism (6). A fixed air pipe (17) connected to the detection mechanism (6) is installed inside the support frame (5). A suction nozzle (15) is opened at the bottom of the detection mechanism (6). The suction nozzle (15) is aligned with the chip. An air jet mechanism (8) is set below the detection mechanism (6) and at the same time below the mounting frame (401). An air jet pipe (801) is connected to the top of the air jet mechanism (8). The air jet pipe (801) is aligned with the bottom of the mounting frame (401). The bottom of the mounting frame (401) is opened. There is an air inlet (402), and the air inlet (402) is connected to the two sides of the air inlet (403). The air inlet (403) extends to the two sides of the chip clip (9) and nozzles (404) are provided. An air pump (18) is installed at the bottom of the jet mechanism (8). The output end of the air pump (18) faces upward and is aligned with the jet pipe (801). An air bag (20) is connected inside the jet mechanism (8) above the output end of the air pump (18). Multiple sets of leakage holes (2001) are opened on the inner wall of the air bag (20). The input end of the air pump (18) is connected to a movable air guiding mechanism, and the movable air guiding mechanism extends into the interior of the support frame (5) and connects to the bottom end of the fixed air pipe (17).

2. The automatic defective chip rejection device according to claim 1, characterized in that: The detection mechanism (6) includes a cylinder (7) and an air intake mechanism (14). The air intake mechanism (14) is connected to a fixed air pipe (17) through a hose. The cylinder (7) is fixed to the top of the support frame (5), and the output end of the support frame (5) is fixedly connected to the top of the air intake mechanism (14). The air intake mechanism (14) is movably connected to the support frame (5).

3. The automatic defective chip rejection device according to claim 2, characterized in that: The suction mechanism (14) consists of a suction groove (1401) and a suction tube (1402), and the suction nozzle (15) is fixed at the bottom end of the suction tube (1402). Detection rods (16) are installed on both sides of the suction tube (1402), and the detection rods (16) are connected to external detection equipment. A filter screen (1403) is installed inside the suction mechanism (14) above the suction tube (1402), and the filter screen (1403) is detachably connected to the suction mechanism (14).

4. The automatic defective chip rejection device according to claim 1, characterized in that: A collection box (13) is connected to one side of the jet mechanism (8). A discharge groove (802) is provided on the inner wall of the jet mechanism (8) above the airbag (20). The airbag (20) is inclined. The discharge groove (802) is aligned with the lowest end of the airbag (20) and extends to the top of the collection box (13).

5. The automatic defective chip rejection device according to claim 1, characterized in that: The shape of the chip clip (9) matches the shape of the chip, and a semi-slotted mesh (901) is provided on the outer side of the chip clip (9), and the semi-slotted mesh (901) is aligned with the nozzle (404), and the shape of the nozzle (404) also matches the shape of the chip clip (9).

6. The automatic defective chip rejection device according to claim 1, characterized in that: The movable air guiding mechanism includes a movable tube (19) and a movable rod (12). The movable tube (19) is connected to the input end of the air pump (18) through a hose. One end of the movable tube (19) extends into the interior of the support frame (5) and is aligned with the bottom end of the fixed air tube (17). A vent hole is provided at the top end of the movable tube (19) aligned with the fixed air tube (17). The end of the movable tube (19) extends to the outside of the support frame (5). The outside of the movable rod (12) extends to the outside of the jet mechanism (8). The movable rod (12) is located inside the jet mechanism (8) and connected to a limit seat. A spring is sleeved on the outside of the movable rod (12). The two ends of the spring are respectively fixed to the outside of the movable tube (19) and the limit seat.

7. The automatic defective chip rejection device according to claim 6, characterized in that: A connecting rod (11) is installed on the connecting arm between the turntable (4) and the mounting bracket (401). The connecting rod (11) extends in the opposite direction of the rotation of the turntable (4), and the bottom end of the connecting rod (11) is connected to a top plate (1101). The top plate (1101) contacts and presses the movable rod (12).

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