Atomizing core preparation method and electronic cigarette atomizer

Abstract

The present invention is applicable to the field of electronic cigarette atomizers, and provides a method for preparing an atomization core and an electronic cigarette atomizer. The method for preparing the atomization core includes: preparing a ceramic substrate; printing or spraying electrode paste on the ceramic substrate, and the electrode paste is sintered to form electrodes. There are two electrodes, and the two electrodes enclose an atomization surface; spraying a heating film on the atomization surface to form an atomization core. In the method for preparing the atomization core provided by the present invention, the coating of the electrodes will not affect the subsequent preparation of the heating film, thereby ensuring the forming quality of the heating film and further ensuring the atomization effect of the atomization core.

Description

Technical Field

[0001] The present invention belongs to the field of electronic cigarette atomizers, and particularly relates to a method for preparing an atomization core and an electronic cigarette atomizer. Background Art

[0002] The atomization core is applied to an electronic cigarette and includes a liquid guiding structure and a heating structure. The liquid guiding structure is generally a porous ceramic, which guides the e-liquid to the heating structure, and the heating structure causes the e-liquid to undergo a phase change and atomize by heating. The heating structure includes a heating body and an electrode. The heating body can be a heating wire or a heating film, and the electrode can be in the shape of a filament or a sheet.

[0003] For the atomization core involved in the present invention, the heating body is a heating film, and the electrode is a sheet structure covering the heating film. In the existing design, for the preparation of the atomization core, generally, a ceramic substrate is first prepared, then a heating film is added to the ceramic substrate, and then an electrode is covered. The electrode is generally covered on the heating film by screen printing or spraying processes. During the screen printing or spraying process, it is easy to exceed the design area, resulting in situations such as clogging of the heating film pores, which in turn affects the atomization effect of the atomization core. Summary of the Invention

[0004] An object of the present invention is to overcome the above-mentioned deficiencies of the prior art and provide a method for preparing an atomization core and an electronic cigarette atomizer, aiming to solve the adverse effects of electrode preparation on the heating film in the existing preparation method.

[0005] The present invention provides a method for preparing an atomization core, including:

[0006] S1: Prepare a ceramic substrate;

[0007] S2: Print or spray electrode paste on the atomization substrate, and the electrode paste forms an electrode after sintering. There are two electrodes, and the two electrodes enclose an atomization surface;

[0008] S3: Spray a heating film on the atomization surface to form an atomization core.

[0009] Optionally, in step S3, a transition film is sprayed on the atomization surface and then a heating film is sprayed. The transition film is a titanium or chromium metal film.

[0010] Optionally, in step S1, the ceramic slurry is shaped and sintered at 600 - 650 °C to form a ceramic substrate;

[0011] In step S2, the sintering temperature is 500 - 550 °C;

[0012] In step S3, a heating film is sprayed on the atomization surface, and after annealing at 300 - 500 °C in nitrogen or vacuum, an atomization core is formed.

[0013] Optionally, in step S1, the ceramic slurry is shaped and then sintered at 900-1100° C. to form a ceramic matrix;

[0014] In step S2, the sintering temperature is 700-900°C;

[0015] In step S3, a heating film is sprayed on the atomizing surface, and an atomizing core is formed after annealing at 500-700° C. in nitrogen or vacuum.

[0016] Optionally, between step S1 and step S2, the method further includes: ultrasonically cleaning the ceramic substrate and then drying it; and between step S2 and step S3, the method further includes: plasma cleaning the ceramic substrate covered with the electrode.

[0017] Optionally, in step S3: the thickness of the heating film is not greater than 10 microns.

[0018] Optionally, in step S3: a heating film is sprayed on the ceramic substrate by a precision spraying process or a magnetron sputtering coating process or an evaporation coating process.

[0019] Optionally, a horizontal projection of the heating film is placed in the ceramic matrix and a distance exists between the side of the heating film and the ceramic matrix.

[0020] Optionally, the ceramic matrix includes a substrate and a boss that are integrally arranged, the electrode and the heating film are arranged on a surface of the boss that is away from the substrate, and a gap is left between the boss and an edge of the substrate.

[0021] The present invention further provides an electronic cigarette atomizer, comprising an atomizer core, wherein the atomizer core is an atomizer core prepared by the atomizer core preparation method described above.

[0022] The atomizer core preparation method provided by the present invention places the electrode coating step before the heating film plating step. Under this setting, the silk screen printing or spraying of the electrode will not affect the subsequent preparation of the heating film, thereby ensuring the molding quality of the heating film and further ensuring the atomization effect of the atomizer core.

[0023] The electronic cigarette atomizer provided by the present invention uses a heating film and an electrode as a structural form for heating the atomized liquid in the atomizing core, which has the advantages of a large atomizing area and uniform temperature, ensuring a high amount of smoke without the occurrence of carbon deposition and liquid leakage, and avoiding problems such as burnt smell. In addition, since there is no uneven thermal stress on the atomizing surface under high-temperature operation, the risk of fracture of the ceramic matrix and short circuit of the heating film is effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0025] Figure 1 It is a schematic diagram of the method for preparing the atomization core in Embodiment 1 of the present invention;

[0026] Figure 2 It is the second structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0027] Figure 3 is Figure 2 The disassembly schematic diagram of the structure;

[0028] Figure 4 It is the first structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0029] Figure 5 It is the third structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0030] Figure 6 It is the fourth structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0031] Figure 7 It is the fifth structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0032] Figure 8 It is the sixth structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0033] Figure 9 It is the seventh structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode;

[0034] Figure 10 It is the eighth structural schematic diagram of the atomization core in Embodiment 1 of the present invention, where the dashed line is the boundary position of the electrode.

[0035] Explanation of the reference numerals in the drawings:

[0036] 10. Ceramic matrix; 20. Electrode; 30. Heating film. Detailed implementation manners

[0037] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] It should be noted that the orientation terms such as left, right, up and down in the embodiments of the present invention are only relative concepts to each other or are referenced based on the normal use state of the product, and should not be considered restrictive.

[0039] Embodiment 1

[0040] Please refer to Figures 1 to 10 , this application provides a method for preparing an atomization core. The prepared atomization core includes a ceramic matrix 10, electrodes 20 and a heating film 30. There are two electrodes 20, which are spaced apart and arranged on both ends of the upper surface of the ceramic matrix 10. The heating film 30 is arranged on the side of the electrodes 20 facing away from the ceramic matrix 10 and simultaneously covers the two electrodes 20 and the area of the ceramic matrix 10 between the two electrodes 20.

[0041] The ceramic matrix 10 has an atomization area. In this embodiment, the atomization area is arranged on the upper surface of the ceramic matrix. The ceramic matrix is used to conduct the atomization liquid to the atomization area. The ceramic matrix has a plurality of micropores, and the pore walls of each micropore form a capillary phenomenon to be able to guide and transport the atomization liquid to the atomization area.

[0042] In this embodiment, the atomization liquid is the e-liquid of an electronic cigarette. In other embodiments, the atomization liquid can also be other liquids that need to be heated and atomized.

[0043] The heating film 30 is placed in the atomization area. When powered on, the heating film 30 generates heat to heat the atomization liquid in the atomization area to make it atomize. There are two electrodes, which are located on both sides of the heating film 30. It can be understood that the two electrodes correspond to the anode and the cathode. When the heating film is powered on, the current flows from the anode to the cathode. Through the structure and position arrangement of the anode and the cathode, the direction and distribution of the current in the heating layer 121 are controlled.

[0044] The heating film 30 is in the shape of a film and is approximately two-dimensional. This setting is beneficial to improving the temperature rise efficiency of the atomization core, and the heating power is more uniform, and the atomization temperature is more stable. Thus, it ensures a high amount of smoke of the atomization core and at the same time does not produce the phenomena of carbon deposition and liquid leakage, and avoids problems such as burnt smell. In addition, since the heating film 30 is in the shape of a film, the heat distribution is relatively balanced when it is powered on, thus avoiding the risk of fracture of the ceramic matrix 10 caused by uneven thermal stress or the risk of open circuit to the heating film 30 itself.

[0045] The electrode 122 is layered and in surface contact with the heating film 30. This setting is beneficial to the miniaturization of the atomization core 10 on the one hand, and can effectively reduce the contact resistance between the electrode 122 and the heating layer 121 on the other hand.

[0046] The atomizing core preparation method provided in this embodiment includes:

[0047] S1: Prepare the ceramic substrate 10;

[0048] S2: Print or spray electrode paste on the ceramic substrate 10. The electrode paste is sintered to form electrodes 20. There are two electrodes 20, and the two electrodes 20 enclose an atomizing surface;

[0049] S3: Spray and deposit a heating film 30 on the atomizing surface to form an atomizing core.

[0050] In this embodiment, after the ceramic paste is sintered to form the ceramic substrate 10, electrode paste is coated on the upper surface of the ceramic substrate 10. After the electrode paste is coated on the ceramic substrate 10, it is sintered and solidified on the ceramic substrate 10 to form electrodes 20. Then, a heating film 30 is sprayed and deposited on the atomizing surface to form an atomizing core.

[0051] In this embodiment, the electrodes 20 are covered on the ceramic substrate 10, and the two electrodes 20 enclose an atomizing surface. The heating film 30 is sprayed and deposited on the atomizing surface. The two electrodes 20 enclosing the atomizing surface means that the area where the two electrodes 20 are located and the interval area between the two electrodes 20 together constitute the atomizing surface. The heating film 30 is sprayed and deposited on the atomizing surface. The heating film 30 can completely cover or partially cover the atomizing surface (that is, the heating film 30 is covered on the two electrodes 20 and the area of the ceramic substrate 10 between the two electrodes 20). In the case where the heating film 30 partially covers the atomizing surface, the heating film 30 at least covers the interval area between the two electrodes and contacts the two electrodes in a butting or overlapping manner to achieve electrical connection. From the perspective of heating the atomizing core, the atomizing area of the ceramic substrate 10 can be simply understood as the atomizing surface here.

[0052] The connection between the heating film 30 and the ceramic substrate 10 is approximately a crystal combination, which is more tightly combined and improves the heating and heat transfer efficiency. The exposed area between the two electrodes of the heating film 30 and the ceramic substrate 10 is fully covered to ensure that the atomizing core has a large heating area to guarantee the atomizing efficiency. The heating film 30 covers the exposed area between the two electrodes of the ceramic substrate 10 and extends to the positions of the two electrodes 20 to ensure the electrical connection between the heating film 30 and the two electrodes 20. The heating film 30 completely covers or partially covers the electrodes 20 to ensure that the contact between the heating film 30 and the electrodes 20 is a surface contact, thereby ensuring the structural connection stability and electrical connection quality between the heating film 30 and the electrodes 20. In other embodiments, the heating film 30 and the electrodes 20 can also be in butt contact with each other, which is not limited uniquely here.

[0053] When the heating film 30 covers both the electrode 20 and the exposed area of ​​the ceramic substrate 10 between the electrode 20 (the electrode 20 is sandwiched between the heating film 30 and the ceramic substrate 10), the external device is directly electrically connected to the heating film 30 to achieve power connection of the heating film 30. When the electrode 20 is not completely covered by the heating film 30, the external device can be electrically connected to the electrode to achieve power connection of the heating film 30.

[0054] The atomizer core preparation method provided in this embodiment places the coating step of the electrode 20 before the coating step of the heating film 30. Under this setting, the silk-screen printing or spraying of the electrode 20 will not affect the subsequent preparation of the heating film 30, thereby ensuring the molding quality of the heating film 30 and further ensuring the atomization effect of the atomizer core.

[0055] In this embodiment, the ceramic substrate 10 is an existing porous ceramic, which can be obtained by hot pressing or injection molding of ceramic slurry and then sintering. The ceramic slurry includes the following raw materials in parts by weight: 200 to 250 parts of ceramic powder, 200 to 250 parts of low-temperature glass powder, 160 to 170 parts of pore formers, 300 to 330 parts of adhesives, and 160 to 170 parts of surfactants.

[0056] Among them, the ceramic powder includes one or more of diatomaceous earth, cordierite, alumina, silicon oxide, silicon carbide, silicon nitride, quartz sand, corundum sand, glass sand, kaolin, clay, and spray granulation. The pore-forming agent includes one or more of polystyrene, polymethyl methacrylate, polyurethane, polypropylene, polyvinyl chloride, carbon powder, carbon powder, carbonate, nitrate, ammonium salt, sawdust, flour, corn flour, starch and soybean powder. The adhesive includes one or more of paraffin, beeswax, polyethylene wax, polyethylene wax, and polypropylene wax. The surfactant includes at least one of stearic acid and oleic acid.

[0057] The weight proportions of the components of the ceramic slurry may also be: 200-300 parts of the main material, 50-80 parts of the thermal conductive filler, 200-250 parts of the first binder, 170-220 parts of the pore former, 240-330 parts of the plasticizer, and 30-40 parts of stearic acid.

[0058] Among them, the main material is at least one of diatomaceous earth, alumina, zirconium oxide, silicon carbide and silicon nitride; the thermally conductive filler is at least one of a first metal powder and carbon powder, the first metal powder is at least one of copper powder, platinum powder, aluminum powder and silver powder, and the thermally conductive filler is used to improve the thermal conductivity of the porous ceramic body; the first binder is glass powder, and the glass powder includes at least one of SiO2, Li2O, ZnO, BaO, K2O and Na2O; the pore-forming agent is PMMA; the plasticizer is at least one of paraffin and beeswax.

[0059] Those skilled in the art can also select other raw materials and ratios to prepare the ceramic substrate 10, which is not limited herein.

[0060] The electrode paste can be a paste with good electrical conductivity such as silver paste, platinum paste, aluminum paste, etc. The electrode paste can be coated on the ceramic substrate 10 by screen printing or spraying process. After the electrode paste is coated on the ceramic substrate 10, it is sintered and cured to form the electrode 20.

[0061] The heating film 30 material can be gold, silver, platinum, gold-silver alloy, silver-platinum alloy, nickel, nickel-chromium alloy, iron-chromium-aluminum alloy, stainless steel alloy, etc., which is not limited herein. The heating film 30 can be coated on the atomizing surface by precision spraying process, magnetron sputtering coating or evaporation coating process.

[0062] Using the precision spraying process to prepare the heating film 30 has high precision, simple operation, high film preparation efficiency and low cost. The precision spraying process can be plasma thermal spraying, arc thermal spraying, supersonic thermal spraying, cold spraying, electron gun plus ion gun assisted coating, etc. The thickness of the heating film 30 prepared by the precision spraying process can be 1 to 10 microns.

[0063] Using magnetron sputtering coating and evaporation coating, a film with stronger adhesion can be obtained, and the thickness of the prepared heating film 30 can be 0.01 to 10 microns.

[0064] In another embodiment of the present application, before step S3, a transition film is sprayed on the atomizing surface, and the transition film is a titanium or chromium metal film. The transition film uses PVD technology to coat the titanium paste or chromium paste on the atomizing surface. The setting of the transition film can not only enhance the adhesion between the heating film 30 and the ceramic substrate 10, but also prevent the heating film 30 from reacting with the silicon material in the ceramic substrate 10 to generate silicide at the high temperature when the atomizer works.

[0065] In another embodiment of the present application, between step S1 and step S2, it further includes: ultrasonic cleaning the ceramic substrate 10 and then drying it; between step S2 and step S3, it further includes: plasma cleaning the ceramic substrate 10 coated with the electrode 20.

[0066] Specifically, the preparation method of the atomizing core includes:

[0067] Preparing the ceramic substrate 10: shaping the ceramic slurry and sintering it at 600 - 650 °C to form the ceramic substrate 10;

[0068] Ultrasonic cleaning the ceramic substrate 10 and then drying it;

[0069] Printing or spraying the electrode paste on the ceramic substrate 10 and then sintering it at 500 - 550 °C to form the first embryo;

[0070] Perform plasma cleaning on the first embryo body;

[0071] Deposit a transition film and a heating film 30 on the first embryo body in sequence, and form an atomizing core after annealing at 300 - 500 °C in nitrogen or vacuum.

[0072] Sinter the ceramic slurry using a low-temperature sintering process at a temperature of 600 - 650 °C. The sintering temperature of the electrode slurry is adjusted according to the temperature of the ceramic slurry and is set to 500 - 550 °C. Anneal at 300 - 500 °C after depositing the heating film 30. This setting helps to reduce energy consumption and product cost while ensuring the finished product quality of the atomizing core.

[0073] The preparation method of the atomizing core can also be:

[0074] Prepare a ceramic substrate 10: Shape the ceramic slurry and sinter it at 900 - 1100 °C to form the ceramic substrate 10;

[0075] Perform ultrasonic cleaning on the ceramic substrate 10 and then dry it;

[0076] Print or spray silver paste on the ceramic substrate 10 and then sinter it at 700 - 900 °C to form the first embryo body;

[0077] Perform plasma cleaning on the first embryo body;

[0078] Deposit a transition film and a heating film 30 on the first embryo body in sequence, and form an atomizing core after annealing at 500 - 700 °C in nitrogen or vacuum.

[0079] The ceramic slurry is sintered at 900 - 1100 °C. At this sintering temperature, most commercially available ceramic slurries can be selected for the ceramic slurry. The sintering temperature of the electrode slurry is adjusted according to the temperature of the ceramic slurry and is set to 700 - 900 °C. Anneal at 500 - 700 °C after depositing the heating film 30. This temperature setting is reasonable to ensure the finished product quality of the atomizing core.

[0080] In another embodiment of the present application, the thickness of the heating film 30 is not greater than 10 micrometers. The heating film 30 has through film pores, and the film pores communicate with the micro pores to jointly guide the atomized liquid to approach the film pores and leave the film pores after being heated and atomized by the heating film 30. The thickness of the heating film 30 is below 10 micrometers, making the heating film 30 approximately a two-dimensional surface. This setting is conducive to improving the temperature rise efficiency of the heating film 30, making the heating power more uniform, and the atomization temperature more stable, so that the atomized smoke is delicate and the taste is stable. Those skilled in the art can set the pore diameter of the micro pores to 0.01μm, 0.05μm, 0.1μm, 0.16μm, 0.18μm, 0.24μm, 0.29μm, 0.35μm, 0.36μm, 0.41μm, 0.45μm, 0.48μm, 0.50μm, 0.55μm, 0.60μm, 0.62μm, 0.68μm, 0.70μm, 0.77μm, 0.80μm, 0.88μm, 0.90μm, 0.95μm, 1.0μm, 1.3μm, 1.55μm, 1.68μm, 1.7μm, 1.86μm, 2.0μm, 2.6μm, 3.0μm, 3.2.0μm, 3.67.0μm, 4.0μm, 4.32μm, 4.46μm, 4.8μm, 5.0μm, 5.33μm, 5.76μm, 6.0μm, 6.3μm, 6.5μm, 6.75μm, 7.0μm, 7.3μm, 7.8μm, 8.0μm, 8.45μm, 8.77μm, 9.0μm, 9.2μm, 9.44μm, 9.5μm, 9.8μm, 10μm, etc., which is not uniquely limited herein.

[0081] In another embodiment of the present application, both the anode and the cathode are rectangular and symmetrically arranged on both sides of the ceramic substrate 10 along the length direction. Generally, the anode and the cathode are set to be of equal thickness. The anode and the cathode are rectangular, so that the anode and the cathode have the same cross-sectional size along the width direction of the ceramic substrate 10. The anode and the cathode are symmetrically arranged along the length direction of the ceramic substrate 10, so as to ensure that the anode and the cathode have the same distance in each cross-section along the width direction of the ceramic substrate 10, and thus ensure the uniform distribution of current between the anode and the cathode along the width direction of the ceramic substrate 10.

[0082] In another embodiment of the present application, the heating film 30 is a symmetric figure and is symmetrically arranged along the center line of the width direction of the ceramic substrate 10. The heating film 30 is symmetrically arranged, and the anode and the cathode are symmetrically arranged on both sides of the heating film 30, so as to ensure that when the heating film 30 is energized, the current flows from the anode to the cathode direction and its distribution is symmetrically arranged along the center line of the width direction of the ceramic substrate 10, which is conducive to the uniform distribution of heat.

[0083] In another embodiment of the present application, gaps are left between at least two sides in the length direction of the heating film 30 and the edges of the ceramic substrate 10. This setting facilitates the subsequent sealing and assembly operations of the atomization core. In addition, the projected size of the heating film 30 on the horizontal plane is smaller than that of the ceramic substrate 10, which is conducive to the centralized supply of the atomization liquid from the ceramic substrate 10 to the heating film 30, ensuring the rapid replenishment of the atomization liquid to a certain extent and thus improving the atomization efficiency.

[0084] In another embodiment of the present application, the heating film 30 is provided with the same width as the electrode 20, and gaps are left between them and the edges of the ceramic substrate 10 in the width direction. The width of the heating structure formed by the two electrodes 20 and the heating film 30 is smaller than the size of the ceramic substrate 10. Under the action of the same current, the heat is further concentrated, which is conducive to the centralized supply of liquid and thus improves the atomization efficiency of the atomization core.

[0085] In another embodiment of the present application, the heating film 30 is recessed towards the center along the two side edges (shown as the long sides of the heating film 30) in the width direction of the ceramic substrate 10, and the recess is located between the two electrodes 20. With this setting, the current distribution on the heating film 30 is denser at the center along the length direction of the ceramic substrate 10 than on both sides, thus achieving the effect of heat concentration at the center.

[0086] Figure 6 In the structure shown, the two long sides of the heating film 30 have a plurality of arc-shaped grooves recessed towards the middle at the positions between the two electrodes 20. There are three arc-shaped grooves on one side, and they are symmetrically arranged with respect to the center line of the ceramic substrate 10 in the length direction.

[0087] Figure 7 In the structure shown, rectangular grooves are formed at the positions between the two long sides of the heating film 30 and between the two electrodes 20.

[0088] Figure 9 In the structure shown, a single arc-shaped groove is formed at the positions between the two long sides of the heating film 30 and between the two electrodes 20.

[0089] Figure 10 In the structure shown, Figure 9 On the basis of the structure, through holes that penetrate up and down and extend along the length direction of the ceramic substrate 10 are formed at the center position of the heating film.

[0090] Those skilled in the art can also design the size and shape of the heating film 30 according to actual needs to adjust the current distribution.

[0091] In another embodiment of the present application, the ceramic substrate 10 includes a substrate integrally provided and a convex platform protruding from the substrate. The electrode 20 and the heating film 30 are provided on the surface of the convex platform facing away from the substrate, and a gap is left between the convex platform and the edge of the substrate. In other words, in the horizontal projection, the projected area of the convex platform is smaller than that of the substrate. The size of the atomization surface is smaller than that of the bottom plate.

[0092] The size of the boss is smaller than that of the substrate, achieving the effect of concentrating the atomization liquid of the substrate to the boss, ensuring the rapid replenishment of the atomization liquid on the atomization surface to a certain extent, and being beneficial to improving the atomization efficiency.

[0093] Figure 2 In the structure shown, the ceramic substrate 10 is a symmetric figure in the horizontal projection. The substrate is rectangular, the boss is arranged on the substrate, and the center lines of the substrate and the boss in the length direction coincide. The size of the boss in the length direction is smaller than that of the substrate, forming a step with the substrate.

[0094] Figure 4 In the structure shown, the ceramic substrate 10 is a symmetric figure in the horizontal projection. The substrate is rectangular, the boss is arranged on the substrate, and the center lines of the substrate and the boss in the length direction coincide. The size of the boss in the width direction is smaller than that of the substrate, forming a step with the substrate. Figure 5 In the structure shown, the ceramic substrate 10 is a symmetric figure in the horizontal projection. The substrate is rectangular, the boss is arranged on the substrate, and the center lines of the substrate and the boss in the length direction coincide. The sizes of the boss in the length and width directions are both smaller than that of the substrate, forming steps with the substrate.

[0095] Figure 6 In the structure shown, on Figure 5 the basis of the structure, the sides of the boss between the two electrodes 20 are recessed inward to form a plurality of semi-circular grooves, and the shape of the heating film 30 is adjusted according to the boss. This setting further improves the concentration of heat and atomization liquid. Figure 7 In the structure shown, the two sides of the ceramic substrate 10 in the width direction and the area between the two electrodes 20 are recessed toward the middle, and the recessed part is rectangular in shape. The area where the recess is located is the boss.

[0096] Figure 8 In the structure shown, the two sides of the ceramic substrate 10 in the width direction and the area between the two electrodes 20 are recessed toward the middle. The recessed parts are semi-cylindrical and there are multiple ones. The area where the recess is located is the boss.

[0097] Figure 9 In the structure shown, the two sides of the ceramic substrate 10 in the width direction and the area between the two electrodes 20 are recessed toward the middle, and the recessed part is an arc-shaped groove. The area where the recess is located is the boss.

[0098] Figure 10 In the structure shown, on Figure 9 the basis of the structure, a through hole is provided in the middle of the heating film 30, and a blind hole is provided in the boss at the position of the through hole. This setting further improves the concentration of heat and atomization liquid.

[0099] Those skilled in the art can set the shape of the boss according to actual needs, and this is not uniquely limited here.

[0100] Embodiment 2

[0101] This embodiment provides an electronic cigarette atomizer, which includes an atomization core. The atomization core is prepared by the preparation method of Embodiment 1. Since the atomization core in this embodiment adopts all the technical solutions of Embodiment 1, it also has all the technical effects that the above technical solutions can bring, and will not be elaborated here.

[0102] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements or improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing an atomization core, characterized in that, it includes: S1: Prepare a ceramic substrate; S2: Print or spray electrode paste on the ceramic substrate, and the electrode paste forms electrodes after sintering. There are two electrodes, and the two electrodes enclose an atomization surface; S3: Spray a heating film on the atomization surface. The heating film completely covers or partially covers the electrodes to form an atomization core; the heating film is recessed laterally towards the center along two sides in the width direction of the ceramic substrate, and the recessed position of the heating film is between the two electrodes; the ceramic substrate includes a substrate and a convex platform integrally arranged, the electrodes and the heating film are arranged on the surface of the convex platform facing away from the substrate, the side of the convex platform between the two electrodes is recessed inward, and the recessed position of the convex platform corresponds to the recessed position of the heating film.

2. The method for preparing an atomization core according to claim 1, characterized in that, in step S3, a transition film is sprayed on the atomization surface and then a heating film is sprayed. The transition film is a titanium or chromium metal film.

3. The method for preparing an atomization core according to claim 1, characterized in that, in step S1, the ceramic slurry is shaped and sintered at 600 - 650 °C to form a ceramic substrate; in step S2, the sintering temperature is 500 - 550 °C; in step S3, a heating film is sprayed on the atomization surface, and after annealing at 300 - 500 °C in nitrogen or vacuum, an atomization core is formed.

4. The method for preparing an atomization core according to claim 1, characterized in that, in step S1, the ceramic slurry is shaped and sintered at 900 - 1100 °C to form a ceramic substrate; in step S2, the sintering temperature is 700 - 900 °C; in step S3, a heating film is sprayed on the atomization surface, and after annealing at 500 - 700 °C in nitrogen or vacuum, an atomization core is formed.

5. The method for preparing an atomization core according to claim 1, characterized in that, between step S1 and step S2, it further includes: ultrasonically cleaning the ceramic substrate and then drying it; between step S2 and step S3, it further includes: performing plasma cleaning on the ceramic substrate coated with the electrodes.

6. The method for preparing an atomization core according to claim 1, characterized in that, in step S3: the thickness of the heating film is not more than 10 microns.

7. The method for preparing an atomization core according to claim 1, characterized in that, in step S3: spray the heating film on the ceramic substrate by precision spraying process or magnetron sputtering coating or evaporation coating process.

8. The method for preparing an atomization core according to any one of claims 1 to 7, characterized in that, the horizontal projection of the heating film is placed inside the ceramic substrate and there is a gap between its side and the ceramic substrate.

9. The method for preparing an atomization core according to any one of claims 1 to 7, characterized in that, there is a gap between the edge of the convex platform and the substrate.

10. An electronic cigarette atomizer, characterized in that, it includes an atomization core, and the atomization core is the atomization core prepared by the method for preparing an atomization core according to any one of claims 1 - 9.

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