An ultrasonic imaging apparatus, imaging method, and imaging device

Abstract

The application relates to the technical field of ultrasonic application, and discloses an ultrasonic imaging device, an imaging method and an imaging apparatus, which comprise an ultrasonic surface array, a trigger circuit, a receiving circuit and an imaging circuit; the ultrasonic surface array is used for sending ultrasonic waves to a target object and receiving reflected waves formed by the target object reflecting the ultrasonic waves; the trigger circuit is connected with the ultrasonic surface array and is used for sending a trigger signal to the ultrasonic surface array; the receiving circuit is connected with the ultrasonic surface array and is used for obtaining the reflected waves received by the ultrasonic surface array and converting the reflected waves into reflected signals; the imaging circuit is connected with the receiving circuit and is used for performing low-resolution imaging processing on the reflected signals to obtain a low-resolution image, performing high-resolution processing on an abnormal area in the low-resolution image to obtain a high-resolution image, replacing the abnormal area with the high-resolution image to obtain a target image, and improving the imaging efficiency; and the resolution of the image of the abnormal part is ensured while reducing the algorithm consumption for obtaining the image.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of ultrasonic application, and in particular to an ultrasonic imaging device, an imaging method and an imaging apparatus. BACKGROUND

[0002] In the field of ultrasonic imaging technology, a full-focus imaging algorithm is commonly used to image reflected waves formed by the reflection of ultrasonic waves by a target object. However, current ultrasonic sensors save reflected signals corresponding to the reflected waves in digital form, and then input the reflected signals into a server running a full-focus imaging algorithm for imaging, which results in low imaging efficiency. Moreover, the full-focus imaging algorithm for ultrasonic waves has a very large amount of computation, for example, a full-focus algorithm for 64 chips requires 64 excitations for each chip, and each pixel point requires 64x64 fetching and addition operations. Therefore, if a 1024x1024 image needs to be imaged, 1024x1024x64x64 operation instructions need to be fetched and added, which results in huge consumption of computing power. SUMMARY

[0003] The present application aims to provide an ultrasonic imaging device, an imaging method and an imaging apparatus to solve the problems of low imaging efficiency and huge consumption of computing power in the prior art.

[0004] To achieve the above-mentioned purpose, the present application provides an ultrasonic imaging device, comprising:

[0005] An ultrasonic surface array is configured to send ultrasonic waves to a target object and receive reflected waves formed by the reflection of the ultrasonic waves by the target object.

[0006] A trigger circuit is connected to the ultrasonic surface array and configured to send a trigger signal to the ultrasonic surface array.

[0007] A receiving circuit is connected to the ultrasonic surface array and configured to obtain the reflected waves received by the ultrasonic surface array and convert them into reflected signals.

[0008] An imaging circuit is connected to the receiving circuit and configured to perform low-resolution imaging processing on the reflected signals to obtain a low-resolution image, perform high-resolution processing on an abnormal area in the low-resolution image to obtain a high-resolution image, replace the abnormal area with the high-resolution image, and obtain a target image.

[0009] In the scheme, the ultrasonic surface array includes at least one ultrasonic transducer arranged in a matrix form on the array panel; the ultrasonic transducer is connected with the trigger circuit, so that the trigger circuit converts the trigger signal in the form of electric energy into mechanical energy in the form of ultrasonic waves; the ultrasonic transducer is also connected with the receiving circuit, so that the receiving circuit converts the reflected wave in the form of mechanical energy into the reflected signal in the form of electric energy.

[0010] In the scheme, the trigger circuit includes a power supply E, transistors VT1 and VT2, wherein the positive pole of the power supply E is connected with the collector c of the transistor VT1 and the collector c of the transistor VT2 respectively, the negative pole of the power supply E is connected with the emitter e of the transistor VT1 and the emitter of the transistor VT2 respectively, the positive pole of the power supply E is also connected with the positive pole of the piezoelectric crystal, the negative pole of the power supply E is connected with the negative pole of the piezoelectric crystal, the base b of the transistor VTI is connected with the positive pole of the piezoelectric crystal and the negative pole of the power supply E respectively, and the base b of the transistor VT2 is connected with the collector c of the transistor VT1 and the positive pole of the power supply E respectively.

[0011] The power supply E is a direct current power supply, a resistor R1 is connected in series between the collector c of the transistor VT1 and the positive pole of the power supply E, a resistor R2 is connected in series between the collector c of the transistor VT2 and the positive pole of the power supply E, and the transistor VT2 and the ultrasonic transducer are connected in parallel with each other; the resistor R1 and the resistor R2 are connected in parallel with each other, wherein the resistance value of the resistor R1 is greater than the resistance value of the resistor R2.

[0012] In the scheme, the receiving circuit includes a working power supply T, transistors VT3, VT4 and VT5, and an ultrasonic receiving integrated chip CX; the working power supply T is connected with the transistors VT3, VT4 and VT5 respectively, and the transistors VT3, VT4 and VT5 are connected in sequence to form an amplification circuit; the amplification circuit is connected with the ultrasonic transducer, and is used for amplifying the reflected wave received by the ultrasonic transducer to form an amplified electric signal; the ultrasonic receiving integrated chip CX is connected with the amplification circuit, and is used for receiving the amplified electric signal and converting it into a reflected signal capable of low-resolution imaging processing and high-resolution imaging processing.

[0013] The imaging circuit is a single-chip microcomputer running a full-focus imaging system, and the imaging circuit is connected with the ultrasonic receiving integrated chip CX.

[0014] To achieve the above-mentioned purpose, the application further provides an ultrasonic imaging method running in the ultrasonic imaging device, and the method comprises the following steps.

[0015] The control trigger circuit sends ultrasonic waves to the target object through the ultrasonic surface array, the receiving circuit receives reflected waves formed by the target object reflecting the ultrasonic waves, and converts the reflected waves into reflected signals;

[0016] The imaging circuit performs low-resolution imaging processing on the reflected signals to obtain a low-resolution image, identifies abnormal pixels in the low-resolution image, and delimits an abnormal area according to the positions of the abnormal pixels in the low-resolution image through the imaging circuit;

[0017] The imaging circuit performs high-resolution imaging processing on the abnormal area to obtain a high-resolution image, and replaces the abnormal area in the low-resolution image with the high-resolution image to obtain a target image.

[0018] In the above scheme, before the control trigger circuit sends ultrasonic waves to the target object through the ultrasonic surface array, the method further comprises:

[0019] Receiving low-resolution parameters and high-resolution parameters sent by the user terminal, and inputting the low-resolution parameters and high-resolution parameters into the imaging circuit, wherein the low-resolution parameters are used to define the resolution of low-resolution imaging processing, and the high-resolution parameters are used to define the resolution of high-resolution imaging processing.

[0020] In the above scheme, the control trigger circuit sends ultrasonic waves to the target object through the ultrasonic surface array, the receiving circuit receives reflected waves formed by the target object reflecting the ultrasonic waves, and converts the reflected waves into reflected signals, comprising:

[0021] The trigger circuit sends a trigger signal to the ultrasonic surface array, so that the ultrasonic surface array sends ultrasonic waves to the target object according to the trigger signal;

[0022] The receiving circuit listens whether the ultrasonic surface array receives the reflected waves reflected by the target object;

[0023] If yes, the receiving circuit converts the reflected waves into reflected signals, and sends a trigger signal to the ultrasonic surface array again until all ultrasonic transducers in the ultrasonic surface array have sent ultrasonic waves;

[0024] If no, calculate the time difference between the current time and the time when the trigger circuit sends the ultrasonic waves, and determine whether the time difference exceeds a preset alarm threshold;

[0025] If the alarm threshold is exceeded, an alarm signal is sent to the user terminal;

[0026] If the alarm threshold is not exceeded, the receiving circuit continues to listen whether the reflected waves are received.

[0027] In the above scheme, the steps of identifying abnormal pixels in the low-resolution image and delineating abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit include:

[0028] Extract pixels from the low-resolution image and obtain the pixel values ​​of the pixels;

[0029] Identify pixels whose pixel values ​​exceed a preset abnormal threshold and set the pixels as abnormal pixels;

[0030] Identify pixels whose pixel values ​​belong to a preset abnormal range and set the pixels as the abnormal pixels;

[0031] Identify edge pixels among the abnormal pixels, and delineate the boundary of the location of the abnormal pixel on the low-resolution image along the edge pixels to delineate the abnormal region containing the abnormal pixel on the low-resolution image.

[0032] In the above scheme, the step of replacing the abnormal regions in the low-resolution image with the high-resolution image to obtain the target image includes:

[0033] Delete abnormal regions in the low-resolution image to form a blank image with blank areas;

[0034] The high-resolution image is inserted into the blank area, thereby converting the blank image into the target image.

[0035] To achieve the above objectives, the present invention also provides an ultrasonic imaging device, installed in the ultrasonic imaging equipment, comprising:

[0036] An ultrasonic control module is connected to a triggering circuit and a receiving circuit, respectively. It is used to control the triggering circuit to send ultrasonic waves to the target object through an ultrasonic array, and to receive the reflected waves formed by the ultrasonic waves reflected by the target object through the receiving circuit, and to convert the reflected waves into reflected signals.

[0037] An anomaly identification module, connected to an imaging circuit, is used to perform low-resolution imaging processing on the reflected signal through the imaging circuit to obtain a low-resolution image, identify abnormal pixels in the low-resolution image, and delineate an abnormal region based on the position of the abnormal pixels in the low-resolution image through the imaging circuit.

[0038] An image replacement module, connected to an imaging circuit, is used to perform high-resolution imaging processing on the abnormal region through the imaging circuit to obtain a high-resolution image, and then replace the abnormal region in the low-resolution image with the high-resolution image to obtain a target image.

[0039] The present invention provides an ultrasonic imaging device, imaging method, and imaging apparatus. By integrating an ultrasonic array, a trigger circuit, a receiving circuit, and an imaging circuit into one ultrasonic imaging device, the imaging circuit can perform imaging processing to obtain low-resolution images, high-resolution images, and finally the target image when it receives the reflected signal transmitted by the receiving line, thereby improving imaging efficiency.

[0040] Low-resolution images are obtained by performing low-resolution imaging processing on the reflected signals according to low-resolution parameters, thereby reducing computing power consumption and improving image acquisition efficiency. By identifying abnormal pixels in the low-resolution images, abnormal regions in the low-resolution images are identified, thereby achieving the technical effect of preliminary anomaly identification.

[0041] High-resolution images are obtained by performing high-resolution imaging on abnormal areas using high-resolution parameters, thereby improving the resolution and clarity of the images corresponding to the abnormal parts of the target object. This makes it easier for users to identify the abnormal parts and situations, thus reducing the computing power consumption of image acquisition while ensuring the resolution of the images of the abnormal parts.

[0042] The anomaly detection module enables the imaging circuit to perform low-resolution imaging processing on the reflected signal according to the low-resolution parameters to obtain a low-resolution image. This reduces computing power consumption and improves image acquisition efficiency. By identifying abnormal pixels in the low-resolution image, abnormal regions in the low-resolution image are identified, thus achieving the technical effect of preliminary anomaly detection.

[0043] The image replacement module is used by the imaging circuit to perform high-resolution imaging on the abnormal area using high-resolution parameters to obtain a high-resolution image. This improves the resolution and clarity of the image corresponding to the abnormal part of the target object, so that the user can identify the abnormal part and the abnormal situation. In this way, the computing power consumption of image acquisition is reduced while ensuring the resolution of the image of the abnormal part is maintained. Attached Figure Description

[0044] Figure 1 This is a schematic block diagram of the structure of an embodiment of the ultrasonic imaging device of the present invention;

[0045] Figure 2 This is a schematic block diagram of the ultrasonic array and its ultrasonic transducer, trigger circuit and receiving circuit in Embodiment 1 of the ultrasonic imaging device of the present invention;

[0046] Figure 3 This is a circuit diagram of an optional embodiment of the trigger circuit in Embodiment 1 of the ultrasonic imaging device of the present invention;

[0047] Figure 4This is a circuit diagram of a preferred embodiment of the trigger circuit in Embodiment 1 of the ultrasonic imaging device of the present invention;

[0048] Figure 5 This is a circuit diagram of a preferred embodiment of the receiving circuit in Embodiment 1 of the ultrasonic imaging device of the present invention;

[0049] Figure 6 This is a circuit diagram of the receiving circuit and the imaging circuit in Embodiment 1 of the ultrasonic imaging device of the present invention;

[0050] Figure 7 This is a flowchart of Embodiment 2 of the ultrasonic imaging method of the present invention;

[0051] Figure 8 This is a flowchart illustrating the specific method of Embodiment 3 of the ultrasonic imaging method of the present invention;

[0052] Figure 9 This is a schematic block diagram of a computer chip module with computer instructions running, as shown in Embodiment 4 of the ultrasonic imaging device of the present invention.

[0053] Figure 10 This is a schematic block diagram of the structure of the ultrasonic imaging device according to Embodiment 4 of the present invention when it is installed in an ultrasonic imaging device.

[0054] Figure label:

[0055] 1. Ultrasonic imaging equipment 2. Ultrasonic imaging device

[0056] 11. Ultrasonic array; 12. Trigger circuit; 13. Receiver circuit; 14. Imaging circuit.

[0057] 21. Parameter setting module; 22. Ultrasonic control module; 23. Anomaly identification module

[0058] 24. Image replacement module M, ultrasonic transducer Detailed Implementation

[0059] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention.

[0060] Example 1:

[0061] Please see Figure 1 An ultrasonic imaging device 1 according to this embodiment includes:

[0062] The ultrasonic array 11 is used to send ultrasonic waves to a target object and receive reflected waves formed by the target object reflecting the ultrasonic waves.

[0063] Trigger circuit 12, connected to the ultrasonic array 11, is used to send trigger signals to the ultrasonic array 11;

[0064] The receiving circuit 13 is connected to the ultrasonic array 11 and is used to acquire the reflected wave received by the ultrasonic array 11 and convert it into a reflected signal.

[0065] The imaging circuit 14 is connected to the receiving circuit 13 and is used to perform low-resolution imaging processing on the reflected signal to obtain a low-resolution image, perform high-resolution processing on abnormal regions in the low-resolution image to obtain a high-resolution image, and replace the abnormal regions with the high-resolution image to obtain a target image.

[0066] This application integrates an ultrasonic imaging device 1, consisting of an ultrasonic array 11, a trigger circuit 12, a receiving circuit 13, and an imaging circuit 14, into a single unit. This allows the imaging circuit 14 to perform imaging processing upon receiving the reflected signal transmitted by the receiving line, thereby obtaining low-resolution and high-resolution images, and ultimately the target image, thus improving imaging efficiency.

[0067] Preferred, such as Figure 2 As shown, the ultrasonic array 11 includes at least one ultrasonic transducer M, which is arranged in a matrix on the array plate. The ultrasonic transducer M is connected to the trigger circuit 12, causing the trigger circuit 12 to convert the trigger signal, which exists in the form of electrical energy, into mechanical energy, which exists in the form of ultrasonic waves. The ultrasonic transducer M is also connected to the receiving circuit 13, causing the receiving circuit 13 to convert the reflected wave, which exists in the form of mechanical energy, into a reflected signal, which exists in the form of electrical energy. The ultrasonic transducer M is a split-type ultrasonic sensor, comprising: a piezoelectric ceramic ultrasonic sensor (model T40-16) for transmitting ultrasonic waves—ultrasonic transducer M1, and a piezoelectric ceramic ultrasonic sensor (model R40-16) for receiving ultrasonic waves—ultrasonic transducer M2.

[0068] Optional, such as Figure 3 As shown, the trigger circuit 12 includes: a power supply E, which is a pulse power supply for sending pulse voltage. One end of the power supply E is connected to the first pole p of the ultrasonic transducer M1, and the other end of the power supply E is connected to the second pole q of the ultrasonic transducer M1. The pulse frequency of the power supply E is 40 kHz. The power supply E sends a 40 kHz pulse electrical signal to the ultrasonic transducer M1 as a trigger signal to cause the ultrasonic transducer M1 to send a 40 kHz ultrasonic signal.

[0069] Preferred, such as Figure 4 As shown, the trigger circuit 12 includes: a power supply E, transistors VT1 and VT2, wherein the positive terminal of the power supply E is connected to the collector c of transistor VT1 and the collector c of transistor VT2, respectively; the negative terminal of the power supply E is connected to the emitter e of transistor VT1 and the emitter of transistor VT2, respectively; the positive terminal of the power supply E is also connected to the positive terminal of the piezoelectric crystal; the negative terminal of the power supply E is connected to the negative terminal of the piezoelectric crystal; the base b of transistor VT1 is connected to the positive terminal of the piezoelectric crystal and the negative terminal of the power supply E, respectively; and the base b of transistor VT2 is connected to the collector c of transistor VT1 and the positive terminal of the power supply E, respectively.

[0070] The power supply E is a DC power supply. A resistor R1 is connected in series between the collector c of transistor VT1 and the positive terminal of power supply E, and a resistor R2 is connected in series between the collector c of transistor VT2 and the positive terminal of power supply E. Transistor VT2 and ultrasonic transducer M1 are connected in parallel. Resistors R1 and R2 are connected in parallel, wherein the resistance of resistor R1 is greater than the resistance of resistor R2. Transistors VT1 and VT2 are NPN transistors.

[0071] In this embodiment, by connecting the resistor R2 in series with the base b of VT2, the voltage at the collector c of VT2 and the first electrode p of the ultrasonic transducer M1 is rapidly increased. By connecting the resistor R1 in series with the collector c of VT1, the voltage at the collector c of VT1 and the base b of VT2 is slowly increased. The power supply E applies a voltage to the first electrode p of the ultrasonic transducer M1, the voltage value of which is the rated voltage value of the power supply E. At this time, the trigger circuit 12 will be in the first deformation stage, that is, the ultrasonic transducer M1 will generate a reverse piezoelectric effect due to the voltage at its positive electrode, thereby causing the ultrasonic transducer M1 to deform in the first direction, and the mechanical vibration generated by the first deformation will generate the ultrasonic wave.

[0072] As the voltage at the base b of VT2 rises to a preset conduction threshold (e.g., 0.7V), the collector c and emitter e of transistor VT2 conduct, connecting the power supply E, resistor R2, and transistor VT2 in series to form a circuit. The voltage at the collector e of VT2 and on the ultrasonic transducer M1 will drop to 0. However, the base b of VT2 remains above the conduction threshold because VT1 is still in the off state. At this time, due to the feedback coupling characteristics of the ultrasonic transducer M1, during the second deformation process of the ultrasonic transducer M1, the voltage at the second terminal q of the ultrasonic transducer M1 and the base b of VT1 connected to the second terminal q will gradually increase. When the voltage at the base b of VT1 rises to the preset conduction threshold (e.g., 0.7V), the collector c and emitter e of transistor VT1 conduct, thereby connecting V... When the voltage at the base b of T2 drops to 0, the trigger circuit 12 will enter the second deformation stage, that is, the ultrasonic transducer M1 will undergo a second deformation in the opposite direction to the first direction due to the absence of voltage applied between the first electrode p and the second electrode q (in this embodiment, the second deformation is the process of the ultrasonic transducer M1 recovering from the first deformation to its original shape), and the ultrasonic waves will be generated by the mechanical vibration caused by the second deformation. Finally, during the second deformation process, VT1 will gradually reduce the voltage at the base b of VT2 due to the conduction of its collector and emitter. When the ultrasonic transducer M1 completes the second deformation, the voltage at the base b of VT1 will drop to 0, and the voltage at the base b of VT2 will recover to below the conduction threshold or even recover to 0, causing the trigger circuit 12 to re-enter the first deformation stage.

[0073] Power supply E, through transistors VT1 and VT2, enables trigger circuit 12 to enter the first deformation stage and the second deformation stage, thereby sending a square wave trigger signal to ultrasonic transducer M1.

[0074] Furthermore, such as Figure 4 As shown, a diode D1 is connected in series between the second electrode q of the ultrasonic transducer M1 and the negative electrode of the power supply E. The negative electrode of the diode D1 is connected to the second electrode q, and the positive electrode of the diode D1 is connected to the negative electrode of the power supply E. This is to prevent the voltage generated on the second electrode q of the ultrasonic transducer M1 during the second deformation from forming a current that could impact the power supply E, thereby ensuring circuit safety.

[0075] Furthermore, such as Figure 4 As shown, a switch S is connected in series between R1 and the resistor R2 and the positive terminal of the power supply E, which is used to control the power supply E to output voltage to the ultrasonic transducer M1.

[0076] Furthermore, such as Figure 4 As shown, capacitor C1 is connected to the positive and negative terminals of the power supply E respectively, and is used to filter stray current in the trigger circuit 12.

[0077] For example, the ultrasonic transducer M1 is a T40-16 piezoelectric ceramic ultrasonic sensor, and the oscillation waveform at its two ends is approximately a square wave, with the voltage amplitude close to the rated voltage of the power supply E. The rated voltage of the power supply E is 9V, the operating current is approximately 25mA, and the trigger signal is 40kHz.

[0078] In this embodiment, the first deformation and the second deformation are thickness deformation type, or length deformation type, or volume deformation type, or thickness shear type, or planar shear type.

[0079] Preferred, such as Figure 5 As shown, the receiving circuit 13 includes: a power supply T, transistors VT3, VT4, and VT5, and an ultrasonic receiving integrated chip CX;

[0080] The operating power supply T is connected to transistors VT3, VT4, and VT5 respectively, and transistors VT3, VT4, and VT5 are connected in sequence to form an amplification circuit. The amplification circuit is connected to the ultrasonic transducer M2 to amplify the reflected wave received by the ultrasonic transducer M2 to form an amplified electrical signal. The ultrasonic receiving integrated chip CX is connected to the amplification circuit to receive the amplified electrical signal and convert it into a reflected signal capable of low-resolution imaging processing and high-resolution imaging processing.

[0081] In this embodiment, transistors VT3, VT4, and VT5 are NPN transistors, and the ultrasonic receiving integrated chip CX is a CX20106A infrared remote control receiving integrated chip. This chip can be used in ultrasonic processing circuits. It integrates functions such as amplification, limiting, bandpass filtering, peak detection, shaping, and comparison, and has high sensitivity and anti-interference capability. The seventh pin of the CX20106A chip is connected to INT0 of the imaging circuit 14. When no ultrasonic wave is received, the seventh pin outputs a high level of about 4.1V without generating an interruption. When an ultrasonic wave with a center frequency of 40KHz or similar is received, a low transition is generated. Therefore, the reflected wave can be effectively acquired and recorded. The imaging circuit 14 is a hardware and software module based on a microcontroller.

[0082] Specifically, such as Figure 5As shown, the amplification circuit includes: a power supply T, transistors VT3, VT4, and VT5, capacitors C2 to C5, and resistors R3 to R10; the base b of transistor VT3 is connected to the first terminal p of ultrasonic transducer M2, the second terminal q of ultrasonic transducer M2 is connected to the negative terminal of power supply T, the collectors c of transistors VT3, VT4, and VT5 are respectively connected to the positive terminal of power supply T, and the ultrasonic receiving integrated chip CX is also connected to the collectors c of transistors VT3, VT4, and VT5, the positive and negative terminals of the power supply, and the imaging circuit 14; the emitters e of transistors VT3, VT4, and VT5 are respectively connected to the second terminal q of ultrasonic transducer M2 and the negative terminal of power supply T, the base b of transistor VT4 is connected to the collector c of transistor VT3, and the base b of transistor VT5 is connected to the collector c of transistor VT4, the emitter e, the ultrasonic receiving integrated chip CX, and the positive terminal of power supply T. The transistor VT3 has its collector (c) connected to the positive terminal of the ultrasonic receiver integrated chip CX and the working power supply T. Resistors R4 and R9 are connected in series between the collector (c) of the transistor VT3 and the positive terminal of the ultrasonic receiver integrated chip CX and the working power supply T. Resistors R5 and R9 are connected in series between the collector (c) of the transistor VT4 and the positive terminal of the ultrasonic receiver integrated chip CX and the working power supply T. Resistors R8 and R9 are connected in series between the collector (c) of the transistor VT5 and the positive terminal of the ultrasonic receiver integrated chip CX and the working power supply T. Resistor R6 is connected in series between the emitter (e) of the transistor VT4 and the working power supply T. Resistors R7, R8, and R9 are connected in series between the base (b) of the transistor VT5 and the positive terminal of the working power supply T and the ultrasonic receiver integrated chip CX. Capacitor C4 is connected in series between the base (b) of the transistor VT5 and the negative terminal of the working voltage T. Capacitor C3 is connected in series between the base (b) of the transistor VT5 and the collector (c) of the transistor VT4. Resistor R10 and capacitor C5 are connected in series between the ultrasonic receiver integrated chip CX and the negative terminal of the working power supply T.

[0083] A resistor R3 and a capacitor C2 are connected between the first pole p and the second pole q of the ultrasonic transducer M2 to eliminate stray AC current in the ultrasonic transducer M2.

[0084] In this step, the ultrasonic transducer M2 is an R40-16 transducer with a resonant frequency of 40kHz. Therefore, after frequency selection by the ultrasonic transducer M2, interference signals outside 40kHz in the reflected wave are attenuated, retaining only the effective signal resonating at 40kHz, and sending it to the base b of VT3. At this time, transistor VT3 will enter the conducting state. When VT3 is conducting, the operating power supply T will form a current through R4. Since the current on the collector c of VT3 is the sum of the currents at the base b and emitter e of VT3, amplification of the reflected wave is achieved. The current on the collector c of VT3 will then flow through the base b of VT4. The base b causes VT4 to enter the conducting state. Since the current at the collector c of VT4 is the sum of the currents at the base b and the emitter e of VT4, the reflected wave is amplified a second time through VT4. Since the current flowing through R9 is the sum of the currents at the collector c of transistor VT3 and the collector c of transistor VT4, the reflected wave is amplified a third time. Finally, the currents that have undergone the first, second, third, and fourth amplifications of the reflected wave are set as the amplified electrical signal, and the amplified electrical signal flows into the ultrasonic receiving integrated chip CX to achieve the technical effect of faithfully reproducing the received reflected wave.

[0085] Furthermore, the first pin of the ultrasonic receiving integrated chip CX is connected to the collector c of transistors VT3, VT4 and VT5, so that the amplification circuit sends an amplified electrical signal to the ultrasonic receiving integrated chip CX.

[0086] The fifth pin of the ultrasonic receiver integrated chip CX is connected to the positive terminal of the working power supply T, and is used to receive the working current sent by the working power supply T to ensure the normal operation of the ultrasonic receiver integrated chip CX.

[0087] Preferred, such as Figure 6 As shown, the imaging circuit 14 is a microcontroller running a full-focus imaging system, and the imaging circuit 14 is connected to the ultrasonic receiver integrated chip CX.

[0088] Optionally, a server running a full-focus imaging system is used as the imaging circuit 14, and the CPU chip of the server is connected to the ultrasonic receiver integrated chip CX.

[0089] In this step, the CX20106A chip is used as the ultrasonic receiving integrated chip. The seventh pin of the CX20106A chip is connected to INT0 of the imaging circuit 14. When no ultrasonic wave is received, the seventh pin outputs a high level of about 4.1V and does not generate an interrupt. When an ultrasonic wave with a center frequency of 40KHz or similar is received, a low transition is generated. Therefore, the reflected wave can be effectively acquired and recorded. The imaging circuit 14 is a hardware and software module based on a microcontroller.

[0090] The described full-focus imaging system enables highly accurate imaging of defects through data acquisition methods and imaging techniques. This makes ultrasonic testing more accurate in both quantitative and qualitative defect identification. The full-focus technology employs full-matrix capture (FMC) to acquire data from the detection area. The FMC (full-matrix acquisition) is a specific data acquisition process utilizing the ultrasonic array 11.

[0091] A microcontroller is an integrated circuit chip that uses very large-scale integrated circuit (VLSI) technology to integrate a central processing unit (CPU) with data processing capabilities, random access memory (RAM), read-only memory (ROM), various I / O ports and interrupt systems, timers / counters, and other functions (and may also include display driver circuits, pulse width modulation circuits, analog multiplexers, A / D converters, etc.) onto a single silicon chip, forming a small but complete microcomputer system. The STM32F407IGT6 model, packaged in an LQFP176, can be used as the microcontroller.

[0092] Example 2:

[0093] Please see Figure 7 An ultrasonic imaging method according to this embodiment, operating in the ultrasonic imaging device 1, includes:

[0094] S102: The control trigger circuit 12 sends ultrasonic waves to the target object through the ultrasonic array 11, and receives the reflected waves formed by the ultrasonic waves reflected by the target object through the receiving circuit 13, and converts the reflected waves into reflected signals.

[0095] S103: The imaging circuit 14 performs low-resolution imaging processing on the reflected signal to obtain a low-resolution image, identifies abnormal pixels in the low-resolution image, and delineates abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit 14.

[0096] S104: The abnormal region is processed by the imaging circuit 14 to obtain a high-resolution image, and the abnormal region in the low-resolution image is replaced by the high-resolution image to obtain the target image.

[0097] In an exemplary embodiment, the ultrasonic array 11 is triggered by the trigger circuit 12 to send ultrasonic waves to the target object, and the reflected waves reflected by the target object are received by the receiving circuit 13 of the ultrasonic array 11.

[0098] The imaging circuit 14 summarizes the reflected signals to form a sampled signal matrix S, wherein the element values ​​in the sampled signal matrix represent the reflected signal parameter values, and the element values ​​have a first mark representing the ultrasonic transducer M that transmits the ultrasonic wave, and a second mark representing the ultrasonic transducer M that receives the reflected wave.

[0099] The imaging circuit 14 performs low-resolution imaging processing on the reflected signal according to the low-resolution parameters to obtain a low-resolution image, thereby reducing computing power consumption and improving image acquisition efficiency. By identifying abnormal pixels in the low-resolution image, abnormal areas in the low-resolution image are identified, thereby achieving the technical effect of preliminary anomaly identification.

[0100] High-resolution images are obtained by performing high-resolution imaging on abnormal areas using high-resolution parameters. This improves the resolution and clarity of the images corresponding to the abnormal parts of the target object, making it easier for users to identify the abnormal parts and situations. This method reduces the computational cost of image acquisition while maintaining the resolution of the images of abnormal parts. By replacing the abnormal areas with high-resolution images to obtain the target image, users can quickly locate the abnormal parts of the target object by combining the non-abnormal areas summarized from the low-resolution images. It also helps to determine the positional and connection relationships between the abnormal parts and the normal parts of the target object, facilitating the identification and analysis of the abnormal parts and situations of the target object.

[0101] Example 3:

[0102] This embodiment is a specific application scenario of the above embodiment two. Through this embodiment, the method provided by the present invention can be explained more clearly and specifically.

[0103] The following describes the method provided in this embodiment using an ultrasonic imaging device 1 operating an ultrasonic imaging method as an example. The method involves sending ultrasonic waves to a target object, receiving reflected waves, converting the reflected waves into reflected signals, generating a low-resolution image based on the reflected signals, identifying abnormal regions within the image, generating a high-resolution image based on the abnormal regions, and replacing the abnormal regions with the high-resolution image. It should be noted that this embodiment is merely exemplary and does not limit the scope of protection of this invention.

[0104] Figure 8This is a flowchart of a specific method for ultrasonic imaging provided in an embodiment of the present invention, which specifically includes steps S201 to S204.

[0105] S201: Receive low-resolution parameters and high-resolution parameters sent by the user terminal, and record the low-resolution parameters and high-resolution parameters into the imaging circuit 14, wherein the low-resolution parameters are used to define the resolution of low-resolution imaging processing, and the high-resolution parameters are used to define the resolution of high-resolution imaging processing.

[0106] To enable configurable settings for the resolutions of low-resolution and high-resolution imaging processing, this step defines the resolution of the low-resolution imaging processing by receiving low-resolution parameters sent by the user terminal, and defines the resolution of the high-resolution imaging processing by receiving high-resolution parameters sent by the user terminal, thereby achieving custom resolution settings for low-resolution and high-resolution imaging processing.

[0107] S202: The control trigger circuit 12 sends ultrasonic waves to the target object through the ultrasonic array 11, and receives the reflected waves formed by the ultrasonic waves reflected by the target object through the receiving circuit 13, and converts the reflected waves into reflected signals.

[0108] In order to obtain the reflected wave formed by the ultrasonic wave reflected by the target object, this step uses the trigger circuit 12 to send ultrasonic waves to the target object through the ultrasonic array 11, and receives the reflected wave reflected by the target object through the receiving circuit 13 of the ultrasonic array 11.

[0109] In this embodiment, ultrasonic waves are transmitted to the target object through an ultrasonic array 11, and the reflected waves reflected by the target object are received. The ultrasonic array 11 is an 8×8 array probe with 64 ultrasonic transducers M. (The experimental instrument is a domestically produced fully focused phased array 3D real-time imaging system, equipped with an 8×8 array probe with a single crystal size of 3M. Its working principle is as follows: First, the first ultrasonic transducer M of the probe is excited to emit ultrasonic waves, and all ultrasonic transducers M receive and store the ultrasonic echo signals. Then, other ultrasonic transducers M are excited in sequence to emit ultrasonic waves, and all ultrasonic transducers M receive the echoes and store them in sequence, until the last ultrasonic transducer M is excited and all ultrasonic transducers M have received the signals, resulting in a dataset containing 64×64=4096 A-scan signals.)

[0110] In a preferred embodiment, the control triggering circuit 12 sends ultrasonic waves to the target object via the ultrasonic array 11, and the receiving circuit 13 receives the reflected waves formed by the ultrasonic waves reflected by the target object, and converts the reflected waves into a reflected signal, including:

[0111] S21: A trigger signal is sent to the ultrasonic array 11 through the trigger circuit 12, so that the ultrasonic array 11 sends ultrasonic waves to the target object according to the trigger signal.

[0112] In this step, a trigger signal is sent to the trigger circuit 12 of the ultrasonic array 11 via the communication connection, causing the trigger circuit 12 to sequentially excite each ultrasonic transducer M1 in the ultrasonic array 11 to emit ultrasonic waves. The trigger circuit 12 and the receiving circuit 13 are respectively connected to each ultrasonic transducer M1 in the ultrasonic array 11. The trigger circuit 12 is the circuit in the ultrasonic array 11 used to trigger the ultrasonic transducer M1 to generate ultrasonic waves.

[0113] S22: The receiving circuit 13 monitors whether the ultrasonic array 11 receives the reflected wave reflected by the target object.

[0114] In this step, the receiving circuit 13 is a circuit that obtains the reflected wave through the ultrasonic transducer M2 of the ultrasonic array 11. It is used to monitor whether the receiving circuit 13 receives the reflected wave through the ultrasonic transducer M2 of the ultrasonic array 11, and to monitor the feedback and reception of the reflected wave.

[0115] S23: If so, the reflected wave is converted into a transmission signal by the receiving circuit 13, and S21 is executed again to send a trigger signal to the ultrasonic array 11 until all the ultrasonic transducers M in the ultrasonic array 11 have transmitted ultrasonic waves.

[0116] In this step, the reflected wave is obtained from the ultrasonic array 11, and the reflected wave is converted into a reflected signal in the form of an electrical signal by the receiving circuit 13, so that low-resolution and high-resolution images can be generated from the reflected wave in the future.

[0117] S24: If not, calculate the time difference between the current time and the time when the trigger circuit 12 sends the ultrasonic wave, and determine whether the time difference exceeds the preset alarm threshold.

[0118] In this step, the transmission timestamp is obtained from the trigger circuit 12, wherein the transmission timestamp represents the time when the trigger circuit 12 transmits the ultrasonic wave. The time difference between the current time and the transmission timestamp is calculated by a preset calculation thread. If this time difference exceeds the alarm threshold, an alarm signal is generated and the operation of sending the trigger signal to the ultrasonic array 11 is terminated.

[0119] S25: If the alarm threshold is exceeded, an alarm signal is sent to the user terminal.

[0120] S26: If the alarm threshold is not exceeded, then S22 is executed to continue monitoring whether the receiving circuit 13 receives the reflected wave.

[0121] S203: The imaging circuit 14 performs low-resolution imaging processing on the reflected signal to obtain a low-resolution image, identifies abnormal pixels in the low-resolution image, and delineates abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit 14.

[0122] To reduce the computational power consumed in identifying abnormal areas and improve the identification speed of such areas, this step uses imaging circuit 14 to summarize the reflected signals to form a sampled signal matrix S. The element values ​​in the sampled signal matrix represent the reflected signal parameter values. The element values ​​have a first mark representing the ultrasonic transducer M that sends the ultrasonic wave and a second mark representing the ultrasonic transducer M that receives the reflected wave.

[0123] The imaging circuit 14 performs low-resolution imaging processing on the reflected signal according to the low-resolution parameters to obtain a low-resolution image, thereby reducing computational power consumption and improving image acquisition efficiency. By identifying abnormal pixels in the low-resolution image, abnormal areas are identified, achieving a preliminary anomaly identification effect. It should be noted that the imaging circuit 14 refers to a microcontroller running a total focusing imaging system (TFM). The total focusing imaging system uses special data acquisition methods and imaging techniques to achieve highly accurate imaging of defects, making ultrasonic testing more accurate in both quantitative and qualitative defect identification. The total focusing technology employs full matrix acquisition (FMC) to acquire data from the detection area. The FMC (full matrix acquisition) is a specific data acquisition process using the ultrasonic array 11. For an array probe with N ultrasonic transducers M (e.g., wafers), each ultrasonic transducer M is sequentially excited, and all ultrasonic transducers M simultaneously receive signals. These data are organized into a matrix S containing all acquired signals. Sij represents the A-scan signal emitted by ultrasonic transducer Mi and received by ultrasonic transducer Mj. The matrix S is processed to generate a display image as the detection result. Total Focusing Method (TFM) is a post-processing algorithm used to process the FMC dataset.

[0124] In a preferred embodiment, the steps of identifying abnormal pixels in the low-resolution image and delineating abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit include:

[0125] S3-01: Extract pixels from the low-resolution image and obtain the pixel value of the pixel.

[0126] In this step, the pixel value is a value assigned by the computer when the image is digitized. It represents the average brightness information of a small square in the original image, or the average reflectance (transmission) density information of that small square, or the grayscale value of that small square, which ranges from 0 to 255, a total of 256 levels. Values ​​that appear whiter have larger values, close to or equal to 255, while values ​​that appear blacker have smaller values, close to or equal to 0. A pixel is a unit of resolution, and the pixel value can also be referred to as the effective maximum resolution supported by the camera.

[0127] S3-02: Identify pixels whose pixel values ​​exceed a preset abnormal threshold and set the pixels as abnormal pixels.

[0128] In this step, the pixel value of the damaged part of the target object in the image will be higher than the pixel value of the surrounding undamaged parts in the image. Therefore, by setting an abnormal threshold, the damaged parts in the low-resolution image can be identified to improve the damage identification efficiency.

[0129] S3-03: Identify pixels whose pixel values ​​belong to a preset abnormal range and set the pixels as the abnormal pixels.

[0130] In this step, the pixel is designated as the abnormal pixel by marking the coordinates corresponding to the pixel and recording the marked coordinates into a preset exception stack.

[0131] S3-04: Identify edge pixels among the abnormal pixels, and delineate the boundary of the location of the abnormal pixel on the low-resolution image along the edge pixels, so as to delineate the abnormal region containing the abnormal pixel on the low-resolution image.

[0132] In this step, the regions on the low-resolution image containing all coordinates in the anomaly stack are identified, as well as the coordinates located at the edges of these regions. The anomaly pixels corresponding to these edge coordinates are then designated as edge pixels. These edge pixels are concatenated to form a closed loop, serving as the contour of the region containing the anomaly pixels. The area enclosed by this contour is designated as the anomaly region, thus separating the abnormal portions from the non-abnormal portions of the low-resolution image.

[0133] In a preferred embodiment, the steps of identifying abnormal pixels in the low-resolution image and delineating abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit include:

[0134] S3-11: Divide the low-resolution image into at least one sub-image, extract pixels from the sub-image, and obtain the pixel value of the pixel.

[0135] In this step, the low-resolution image is divided into several sub-images based on its length and height. The pixel value is a value assigned by the computer when the image is digitized. It represents the average brightness information of a small square in the original image, or the average reflectance (transmission) density information of that small square, or the grayscale value of that small square. This grayscale value ranges from 0 to 255, a total of 256 levels. Values ​​that appear whiter are larger, close to or equal to 255, while values ​​that appear blacker are smaller, close to or equal to 0. A pixel is a unit of resolution, and the pixel value can also be referred to as the effective maximum resolution supported by the camera.

[0136] S3-12: Identify pixels whose pixel values ​​exceed a preset abnormal threshold and set the pixels as abnormal pixels.

[0137] In this step, the pixel value of the damaged part of the target object in the image will be higher than the pixel value of the surrounding undamaged parts in the image. Therefore, by setting an abnormal threshold, the damaged parts in the low-resolution image can be identified to improve the damage identification efficiency.

[0138] S3-13: Identify pixels whose pixel values ​​belong to a preset abnormal range and set the pixels as the abnormal pixels.

[0139] In this step, the pixel is designated as the abnormal pixel by marking the coordinates corresponding to the pixel and recording the marked coordinates into a preset exception stack.

[0140] S3-14: Define the sub-image containing the abnormal pixel as the abnormal region.

[0141] In this step, the coordinates of the abnormal pixels are obtained from the abnormal stack, and the sub-images with the coordinates in the low-resolution image are set as the abnormal regions. Therefore, this step does not require identifying boundary pixels and delineating abnormal regions, but directly sets the regions with the abnormal pixels as abnormal regions to improve the efficiency of abnormal region acquisition.

[0142] In a preferred embodiment, the steps of identifying abnormal pixels in the low-resolution image and delineating abnormal regions based on the location of the abnormal pixels in the low-resolution image using the imaging circuit include:

[0143] S3-21: Divide the low-resolution image into at least one sub-image, extract all pixels in the sub-image, and obtain the pixel value of each pixel.

[0144] In this step, the low-resolution image is divided into several sub-images based on its length and height. The pixel value is a value assigned by the computer when the image is digitized. It represents the average brightness information of a small square in the original image, or the average reflectance (transmission) density information of that small square, or the grayscale value of that small square. This grayscale value ranges from 0 to 255, a total of 256 levels. Values ​​that appear whiter are larger, close to or equal to 255, while values ​​that appear blacker are smaller, close to or equal to 0. A pixel is a unit of resolution, and the pixel value can also be referred to as the effective maximum resolution supported by the camera.

[0145] S3-22: Calculate the pixel value of each pixel using a preset calculation model to obtain the sub-pixel result.

[0146] In this step, the calculation model has a target formula, which is used to add or weightedly add the pixel values ​​to obtain the sub-pixel result.

[0147] S3-23: Determine whether the sub-pixel result exceeds the preset total abnormal threshold; if yes, determine that the pixel in the sub-image is an abnormal pixel; if no, determine that the pixel in the sub-image is a normal pixel.

[0148] In this step, if the sub-pixel results of a sub-image exceed the total anomaly threshold, it indicates that all pixels in the sub-image are anomalies.

[0149] S3-24: Set the sub-image with the abnormal pixels as the position of the abnormal image in the low-resolution image, and set the sub-image as the abnormal region.

[0150] In this step, for areas in the image that appear abnormal, the pixel values ​​in the sub-images are summed to avoid the situation where a pixel in a sub-image is judged as an abnormal pixel due to errors or other reasons, which would lead to the sub-image containing the abnormal pixel being judged as an abnormal area and causing inaccurate judgment of abnormal areas.

[0151] S204: The abnormal region is processed by the imaging circuit 14 to obtain a high-resolution image, and the abnormal region in the low-resolution image is replaced by the high-resolution image to obtain the target image.

[0152] To identify abnormal regions in low-resolution images, high-resolution imaging processing is subsequently performed on these regions to improve the clarity of the abnormalities, allowing users to observe the abnormal parts. This step uses high-resolution parameters to perform high-resolution imaging on the abnormal regions to obtain high-resolution images, thereby improving the resolution and clarity of the images corresponding to the abnormal parts of the target object. This enables users to identify the abnormal parts and situations, thus reducing the computational power consumption of image acquisition while ensuring the resolution of the images of the abnormal parts.

[0153] To facilitate user observation of the correlation between abnormal areas and other normal areas, thereby improving the comprehensiveness of abnormal observation, this step involves replacing the abnormal area with a high-resolution image to obtain the target image. This allows the user to quickly locate the abnormal area on the target object by combining the non-abnormal areas summarized from the low-resolution image, as well as the positional and connection relationships between the abnormal area and the normal areas of the target object. This provides convenience for users to identify and analyze the abnormal areas and their conditions on the target object.

[0154] In a preferred embodiment, the step of performing high-resolution imaging processing on the abnormal region to obtain a high-resolution image includes:

[0155] S4-01: Obtain the reflection signal that generates the abnormal region from the imaging circuit 14 and set it as an abnormal signal.

[0156] In this step, the imaging circuit 14 identifies the element values ​​of abnormal pixels in the abnormal region within the acquired signal matrix S, and sets these element values ​​as abnormal values. The reflected signal corresponding to the abnormal value is then set as the abnormal signal. For example, if s1,2 in S are abnormal values, it indicates that the abnormal signal is a reflected signal sent by ultrasonic transducer M numbered 1 and received by ultrasonic transducer M numbered 2.

[0157] S4-02: The imaging circuit 14 is invoked to perform high-resolution imaging processing on the abnormal signal to obtain a high-resolution image.

[0158] In this step, the imaging circuit 14 performs high-resolution imaging processing on the outliers in the acquired signal matrix S according to the high-resolution parameters to obtain the high-resolution image, thereby achieving the technical effect of high-resolution imaging of the outlier signal.

[0159] In a preferred embodiment, the step of replacing the abnormal regions in the low-resolution image with the high-resolution image to obtain the target image includes:

[0160] S4-11: Delete the abnormal regions in the low-resolution image to form a blank image with blank regions.

[0161] In this embodiment, the pixels of the low-resolution image are stored in a low-resolution stack, and the low-resolution image is obtained by rendering the pixels in the low-resolution stack.

[0162] In this step, by deleting abnormal pixels in the low-resolution image, when the pixels in the low-resolution stack are rendered again, a blank image without the abnormal pixels will be obtained, wherein the abnormal pixels will form the blank area at the original location of the low-resolution image.

[0163] S4-12: Insert the high-resolution image into the blank area, so that the blank image is converted into the target image.

[0164] In this step, the pixels of the high-resolution image are inserted into the low-resolution stack, wherein the pixels of the high-resolution image correspond one-to-one with the abnormal pixels, so that when the pixels of the low-resolution stack are rendered again, the target image will be obtained by filling the empty area with the pixels of the high-resolution image.

[0165] Example 4:

[0166] Please see Figure 9 and Figure 10 An ultrasonic imaging device 2 of this embodiment is installed in the ultrasonic imaging equipment 1 and includes:

[0167] The ultrasonic control module 22 is connected to the trigger circuit 12 and the receiving circuit 13 respectively. It is used to control the trigger circuit 12 to send ultrasonic waves to the target object through the ultrasonic array 11, and to receive the reflected waves formed by the ultrasonic waves reflected by the target object through the receiving circuit 13, and convert the reflected waves into reflected signals.

[0168] Anomaly identification module 23, connected to imaging circuit 14, is used to perform low-resolution imaging processing on the reflected signal through imaging circuit 14 to obtain a low-resolution image, identify abnormal pixels in the low-resolution image, and delineate abnormal regions according to the position of the abnormal pixels in the low-resolution image through imaging circuit 14.

[0169] The image replacement module 24 is connected to the imaging circuit 14 and is used to perform high-resolution imaging processing on the abnormal area through the imaging circuit 14 to obtain a high-resolution image, and replace the abnormal area in the low-resolution image with the high-resolution image to obtain the target image.

[0170] In this embodiment, the ultrasonic imaging device 2 is installed in the ultrasonic imaging equipment 1 and is used to control the ultrasonic array 11, the trigger circuit 12, the receiving circuit 13 and the imaging circuit 14.

[0171] Optionally, the ultrasonic imaging device 2 further includes:

[0172] The parameter setting module 21, connected to the imaging circuit 14, is used to receive low-resolution parameters and high-resolution parameters sent by the user terminal, and to input the low-resolution parameters and high-resolution parameters into the imaging circuit 14. The low-resolution parameters are used to define the resolution of low-resolution imaging processing, and the high-resolution parameters are used to define the resolution of high-resolution imaging processing.

[0173] It should be noted that the ultrasonic control module 22 is a computer chip that runs a control trigger circuit 12 to send ultrasonic waves to the target object through the ultrasonic array 11, and receives the reflected waves formed by the ultrasonic waves reflected by the target object through the receiving circuit 13, and converts the reflected waves into reflected signals.

[0174] The anomaly identification module 23 is a computer chip that runs computer instructions to perform low-resolution imaging processing on the reflected signal through the imaging circuit 14 to obtain a low-resolution image, identify abnormal pixels in the low-resolution image, and delineate an abnormal region according to the position of the abnormal pixel in the low-resolution image through the imaging circuit 14.

[0175] The image replacement module 24 is a computer chip that runs computer instructions to perform high-resolution imaging processing on the abnormal area through the imaging circuit 14 to obtain a high-resolution image, and replace the abnormal area in the low-resolution image with the high-resolution image to obtain a target image.

[0176] The parameter setting module 21 is a computer chip that runs computer instructions to receive low-resolution and high-resolution parameters sent by the user terminal and input the low-resolution and high-resolution parameters into the imaging circuit 14.

[0177] The computer chip is a 64-bit x86 processor, which may be an Intel Core i7-1185G7 processor, an Intel Core i7 6800K processor, or an Intel Core i7 4790 processor.

[0178] In summary, the ultrasonic imaging device 2 provided in this application uses the ultrasonic control module 22 to enable the trigger circuit 12 to control the ultrasonic array 11 to send ultrasonic waves to the target object, and uses the receiving circuit 13 of the ultrasonic array 11 to receive the reflected waves reflected by the target object.

[0179] The anomaly detection module 23 enables the imaging circuit 14 to perform low-resolution imaging processing on the reflected signal according to the low-resolution parameters to obtain a low-resolution image, thereby reducing computing power consumption and improving image acquisition efficiency; by identifying abnormal pixels in the low-resolution image, the abnormal areas in the low-resolution image are identified, thereby achieving the technical effect of preliminary anomaly detection.

[0180] The image replacement module 24 is used by the imaging circuit 14 to perform high-resolution imaging on the abnormal area using high-resolution parameters to obtain a high-resolution image. This improves the resolution and clarity of the image corresponding to the abnormal part of the target object, making it easier for the user to identify the abnormal part and the abnormal situation. This reduces the computing power consumption of image acquisition while ensuring the resolution of the image of the abnormal part. By replacing the abnormal area with the high-resolution image to obtain the target image, the user can quickly locate the abnormal part of the abnormal area on the target object by combining it with the non-abnormal area summarized by the low-resolution image, as well as the positional relationship and connection relationship between the abnormal part and the normal part of the target object. This provides convenience for the user to identify and analyze the abnormal part of the target object and its situation.

[0181] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0182] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0183] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. An ultrasonic imaging apparatus, characterized by comprising: The application relates to an ultrasonic imaging device. The device comprises: an ultrasonic surface array for sending ultrasonic waves to a target object and receiving reflected waves formed by the target object reflecting the ultrasonic waves; a trigger circuit connected to the ultrasonic surface array for sending a trigger signal to the ultrasonic surface array; a receiving circuit connected to the ultrasonic surface array for obtaining the reflected waves received by the ultrasonic surface array and converting the reflected waves into reflected signals; an imaging circuit connected to the receiving circuit for performing low-resolution imaging processing on the reflected signals to obtain a low-resolution image, performing high-resolution processing on an abnormal area in the low-resolution image to obtain a high-resolution image, replacing the abnormal area with the high-resolution image to obtain a target image; the ultrasonic surface array comprises at least one ultrasonic transducer arranged in a matrix form on an array plate; the ultrasonic transducer is connected to the trigger circuit, so that the trigger circuit converts the trigger signal in the form of electric energy into mechanical energy in the form of ultrasonic waves; the ultrasonic transducer is also connected to the receiving circuit, so that the receiving circuit converts the reflected waves in the form of mechanical energy into reflected signals in the form of electric energy; the trigger circuit comprises a power supply E, transistors VT1 and VT2, wherein the positive pole of the power supply E is connected to the collector c of the transistor VT1 and the collector c of the transistor VT2 respectively, the negative pole of the power supply E is connected to the emitter e of the transistor VT1 and the emitter of the transistor VT2 respectively, the positive pole of the power supply E is also connected to the positive pole of a piezoelectric crystal, the negative pole of the power supply E is connected to the negative pole of the piezoelectric crystal, the base b of the transistor VTI is connected to the positive pole of the piezoelectric crystal and the negative pole of the power supply E respectively, and the base b of the transistor VT2 is connected to the collector c of the transistor VT1 and the positive pole of the power supply E respectively; the power supply E is a direct current power supply, a resistor R1 is connected in series between the collector c of the transistor VT1 and the positive pole of the power supply E, a resistor R2 is connected in series between the collector c of the transistor VT2 and the positive pole of the power supply E, and the transistor VT2 and the ultrasonic transducer are connected in parallel with each other; the resistor R1 and the resistor R2 are connected in parallel with each other, wherein the resistance value of the resistor R1 is greater than the resistance value of the resistor R2; a diode D1 is connected in series between the second pole q of the ultrasonic transducer M1 and the negative pole of the power supply E, wherein the negative pole of the diode D1 is connected to the second pole q, and the positive pole of the diode D1 is connected to the negative pole of the power supply E.

2. The ultrasonic imaging device of claim 1, characterized in that The receiving circuit comprises: a working power supply T, transistors VT3, VT4, VT5, and an ultrasonic receiving integrated chip CX; the working power supply T is connected with the transistors VT3, VT4 and VT5 respectively, and the transistors VT3, VT4 and VT5 are sequentially connected to form an amplifying circuit; the amplifying circuit is connected with the ultrasonic transducer, and is used for amplifying the reflected wave received by the ultrasonic transducer to form an amplified electric signal; the ultrasonic receiving integrated chip CX is connected with the amplifying circuit, and is used for receiving the amplified electric signal and converting it into a reflected signal capable of low-resolution imaging processing and high-resolution imaging processing; The imaging circuit is a single-chip microcomputer running a full-focus imaging system, and the imaging circuit is connected with the ultrasonic receiving integrated chip CX.

3. An ultrasonic imaging method, operating in the ultrasonic imaging device of any of claims 1-2, characterized by, Comprise: The control trigger circuit sends ultrasonic waves to a target object through an ultrasonic surface array, receives reflected waves formed by the target object reflecting the ultrasonic waves through a receiving circuit, and converts the reflected waves into reflected signals; Wherein, it comprises: sending a trigger signal to the ultrasonic surface array through the trigger circuit, so that the ultrasonic surface array sends ultrasonic waves to the target object according to the trigger signal; listening whether the ultrasonic surface array receives the reflected waves reflected by the target object through the receiving circuit; if yes, converting the reflected waves into reflected signals through the receiving circuit, and sending a trigger signal to the ultrasonic surface array again until the ultrasonic transducers in the ultrasonic surface array have all sent ultrasonic waves; if not, calculating the time difference between the current time and the time when the trigger circuit sends the ultrasonic waves, and determining whether the time difference exceeds a preset alarm threshold; if the time difference exceeds the alarm threshold, sending an alarm signal to the user end; if the time difference does not exceed the alarm threshold, continuing to listen whether the receiving circuit receives the reflected waves; wherein, a diode is connected in series between the second pole of the ultrasonic transducer and the negative pole of the power supply; the negative pole of the diode is connected with the second pole, and the positive pole of the diode is connected with the negative pole of the power supply; The imaging circuit performs low-resolution imaging processing on the reflected signals to obtain a low-resolution image, identifies abnormal pixels in the low-resolution image, and delimits an abnormal area according to the position of the abnormal pixels in the low-resolution image through the imaging circuit; The imaging circuit performs high-resolution imaging processing on the abnormal area to obtain a high-resolution image, and replaces the abnormal area in the low-resolution image with the high-resolution image to obtain a target image.

4. The ultrasonic imaging method of claim 3, wherein, Before the control trigger circuit sends ultrasonic waves to a target object through an ultrasonic surface array, the method further comprises: Receiving low-resolution parameters and high-resolution parameters sent by the user end, and inputting the low-resolution parameters and high-resolution parameters into the imaging circuit, wherein the low-resolution parameters are used to define the resolution of low-resolution imaging processing, and the high-resolution parameters are used to define the resolution of high-resolution imaging processing.

5. The ultrasonic imaging method of claim 3, wherein, The steps of identifying abnormal pixels in the low-resolution image and delimiting an abnormal area according to the position of the abnormal pixels in the low-resolution image through the imaging circuit comprise: extracting pixels in the low-resolution image and obtaining pixel values of the pixels; identifying pixels whose pixel values exceed a preset abnormal threshold, and setting the pixels as abnormal pixels; identifying pixels whose pixel values belong to a preset abnormal interval, and setting the pixels as abnormal pixels; identifying edge pixels in the abnormal pixels, and circumscribing a boundary of a position of the abnormal pixels on the low-resolution image along the edge pixels, so as to demarcate an abnormal area with the abnormal pixels on the low-resolution image.

6. The ultrasonic imaging method of claim 3, wherein, The step of replacing the abnormal area in the low-resolution image with the high-resolution image to obtain a target image comprises: deleting the abnormal area in the low-resolution image, so that the low-resolution image forms a blanking image with a blanking area; inserting the high-resolution image into the blanking area, so that the blanking image is converted into the target image.

7. An ultrasonic imaging apparatus installed in the ultrasonic imaging device of any one of claims 1-2, characterized by, comprise: an ultrasonic control module connected with a trigger circuit and a receiving circuit respectively, for controlling the trigger circuit to send ultrasonic waves to a target object through an ultrasonic surface array, and controlling the receiving circuit to receive reflected waves formed by the target object reflecting the ultrasonic waves and convert the reflected waves into reflected signals; wherein it comprises: sending a trigger signal to the ultrasonic surface array through the trigger circuit, so that the ultrasonic surface array sends ultrasonic waves to the target object according to the trigger signal; listening through the receiving circuit whether the ultrasonic surface array receives the reflected waves reflected by the target object; if yes, converting the reflected waves into reflected signals through the receiving circuit, and sending a trigger signal to the ultrasonic surface array again, until all ultrasonic transducers in the ultrasonic surface array have sent ultrasonic waves; if not, calculating a time difference between a current time and a time when the trigger circuit sends the ultrasonic waves, and determining whether the time difference exceeds a preset alarm threshold; if the time difference exceeds the alarm threshold, sending an alarm signal to a user end; if the time difference does not exceed the alarm threshold, continuing to listen whether the receiving circuit receives the reflected waves; wherein a diode is connected in series between a second pole of the ultrasonic transducer and a negative pole of the power supply; a negative pole of the diode is connected with the second pole, and a positive pole of the diode is connected with the negative pole of the power supply; an abnormality identification module connected with an imaging circuit, for performing low-resolution imaging processing on the reflected signals through the imaging circuit to obtain a low-resolution image, identifying abnormal pixels in the low-resolution image, and demarcating an abnormal area in the low-resolution image according to positions of the abnormal pixels in the low-resolution image through the imaging circuit; an image replacement module connected with the imaging circuit, for performing high-resolution imaging processing on the abnormal area through the imaging circuit to obtain a high-resolution image, and replacing the abnormal area in the low-resolution image with the high-resolution image to obtain a target image.

Images