A signal transceiver device and a manufacturing method thereof

Abstract

The application provides a signal transceiver device and a manufacturing method thereof. The signal transceiver device comprises a conductor box, an inner part of the conductor box having a cavity; a first substrate covering an opening of the cavity, a side surface of the first substrate away from the cavity having an antenna; a side of the first substrate towards the cavity having a metal ground, the metal ground being electrically connected with the conductor box; and a second substrate fixed at a bottom of the cavity, a side surface of the second substrate towards the first substrate having a radio frequency front-end circuit, the radio frequency front-end circuit being electrically connected with the antenna. The distance between the antenna and the radio frequency front-end circuit is short, reducing the loss of signals in the transmission process. Moreover, the first substrate can form a shielding structure with the conductor box, not only avoiding the antenna from being interfered by the radio frequency front-end circuit, but also avoiding the radio frequency front-end circuit from being interfered by external electromagnetic signals, enhancing the anti-interference ability of the signal transceiver device.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more specifically, to a signal transceiver device and its manufacturing method. Background Technology

[0002] In existing microwave signal transceivers, high-gain reflector antennas placed on the ground are typically used for signal reception and processing. The signal is then connected to the radio frequency front-end circuit via a cable for further signal processing, which undoubtedly leads to significant transmission loss.

[0003] To reduce transmission loss, existing technologies integrate the RF front-end circuit and the feed device of the reflector antenna using a single-layer or multi-layer dielectric substrate. Although this reduces transmission loss, it results in poor encapsulation and susceptibility to electromagnetic interference in practical use. Summary of the Invention

[0004] In view of the above, this application provides a signal transceiver device and its manufacturing method, as follows:

[0005] A signal transceiver device, comprising:

[0006] A conductor box, the conductor box having an interior cavity;

[0007] A first substrate covers the opening of the cavity, and an antenna is provided on the surface of the first substrate facing away from the cavity; a metal ground is provided on the side of the first substrate facing the cavity, and the metal ground is electrically connected to the conductor box.

[0008] The second substrate is fixed to the bottom of the cavity. The surface of the second substrate facing the first substrate has a radio frequency front-end circuit, which is electrically connected to the antenna.

[0009] Preferably, in the above-described signal transceiver device, the first substrate and the second substrate are electrically connected through a third substrate, so that the radio frequency front-end circuit is electrically connected to the antenna.

[0010] Preferably, in the above-described signal transceiver device, the third substrate is perpendicular to the first substrate and the second substrate;

[0011] The third substrate has differential microstrip lines, which are electrically connected to the antenna and the radio frequency front-end circuit.

[0012] Preferably, in the above-mentioned signal transceiver device, the antenna includes: a first antenna signal line and a second antenna signal line arranged symmetrically;

[0013] The differential microstrip line includes: a feed signal line and a feed ground line located on opposite sides of the third substrate; one end of the feed signal line is electrically connected to the first antenna signal line, and the other end is electrically connected to the radio frequency front-end circuit; the feed ground line is electrically connected to the second antenna signal line.

[0014] Preferably, the above-described signal transceiver device has a rectangular groove that penetrates the first substrate;

[0015] The end of the third substrate facing the first substrate is adapted to the rectangular groove and can be inserted and fixed in the rectangular groove.

[0016] Preferably, in the above-described signal transceiver device, the surface of the first substrate facing away from the cavity has a patterned metal layer, and the patterned metal layer has hollowed-out gaps to form antenna signal lines and antenna ground lines.

[0017] The perforated gap includes a first gap and a second gap that are opposite each other, and there is a gap between the first gap and the second gap.

[0018] Preferably, in the above-described signal transceiver device, the middle region of the first substrate has a rectangular groove that penetrates the first substrate, and the rectangular groove is used to connect, fix and electrically connect to the power supply structure.

[0019] The first gap and the second gap are symmetrical about the direction of extension of the rectangular groove.

[0020] Preferably, in the above-described signal transceiver device, the first substrate and the second substrate are electrically connected through a third substrate, the third substrate having a feed signal line electrically connected to the antenna;

[0021] The ports of the radio frequency front-end circuit include: a radio frequency input terminal, a DC input terminal, and a radio frequency output terminal;

[0022] The radio frequency input terminal is electrically connected to the feed signal line; a bias circuit is electrically connected between the radio frequency input terminal and the DC input terminal;

[0023] A grounded coplanar waveguide, a matching network, and a filter assembly are electrically connected between the RF input terminal and the RF output terminal; the grounded coplanar waveguide is connected between the RF input terminal and the matching network, and the filter assembly is electrically connected between the matching network and the RF output terminal.

[0024] Preferably, in the above-described signal transceiver device, the surface of the first substrate facing away from the cavity has a patterned metal layer, and the patterned metal layer has hollowed-out gaps to form the antenna signal line and the antenna ground line of the antenna.

[0025] The antenna signal line is electrically connected to the radio frequency front-end circuit.

[0026] The first substrate is fixed to the conductor box by the first fixing screw, and the antenna ground wire is electrically connected to the conductor box by the first fixing screw.

[0027] A method for manufacturing a signal transceiver includes:

[0028] A conductor box is provided, the conductor box having an interior cavity;

[0029] A second substrate is fixed at the bottom of the cavity;

[0030] The first substrate is fixed to the opening of the cavity;

[0031] The first substrate has an antenna on its surface away from the cavity; the first substrate has a metal ground on its surface facing the cavity, and the metal ground is electrically connected to the conductor box; the second substrate has a radio frequency front-end circuit on its surface facing the first substrate, and the radio frequency front-end circuit is electrically connected to the antenna.

[0032] As described above, this application provides a signal transceiver device and its manufacturing method. The signal transceiver device includes: a conductor box with an internal cavity; a first substrate covering the opening of the cavity; an antenna on the surface of the first substrate facing away from the cavity; a metal ground on the side of the first substrate facing the cavity, the metal ground being electrically connected to the conductor box; and a second substrate fixed to the bottom of the cavity, the surface of the second substrate facing the first substrate having a radio frequency (RF) front-end circuit, the RF front-end circuit being electrically connected to the antenna. The first substrate directly covers the conductor box, while the second substrate is located inside the conductor box. This results in a shorter distance between the antenna on the first substrate and the RF front-end circuit on the second substrate, significantly reducing signal loss during transmission.

[0033] Furthermore, the first substrate can form a shielding structure with the conductor box, preventing the antenna located outside the cavity from being interfered with by the radio frequency front-end circuit, and at the same time preventing the radio frequency front-end circuit from being interfered with by external electromagnetic signals, thereby enhancing the integration effect and anti-interference capability of the signal transceiver device. The signal transceiver device can be used in a variety of environments and has a wider range of applications. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0035] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0036] Figure 1 This is a schematic diagram of the structure of a signal transceiver device provided in an embodiment of this application;

[0037] Figure 2A A top view of one surface of a third substrate provided in an embodiment of this application;

[0038] Figure 2B A top view of another surface of a third substrate provided in an embodiment of this application;

[0039] Figure 2C A top view of a first substrate provided in an embodiment of this application;

[0040] Figure 2D for Figure 2C Enlarged schematic diagram of region E1 in the middle;

[0041] Figure 2E This is a top view of a second substrate provided in an embodiment of this application;

[0042] Figure 3 A three-dimensional view of a signal transceiver device after assembly, provided in an embodiment of this application;

[0043] Figure 4 A schematic diagram of the output gain of an antenna provided in an embodiment of this application;

[0044] Figure 5 A schematic diagram of the output gain of a radio frequency front-end circuit provided in an embodiment of this application;

[0045] Figures 6-9 for Figure 1 The signal transceiver shown measures the radiation patterns at different frequency bands.

[0046] Figure 10 for Figure 1 The diagram shows the electric field intensity distribution of the antenna signal line of the signal transceiver device. Detailed Implementation

[0047] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0048] In existing technologies, there are four main methods for integrating the radio frequency front-end circuit with the antenna:

[0049] The first method involves designing the antenna and RF front-end circuit directly on the same printed circuit board, integrating all circuit components onto this single board. This approach achieves an output gain exceeding 10dBic and noise less than 2dB, but it is also larger in size, has poorer packaging, and weaker anti-interference capabilities.

[0050] The second approach involves using an inverted-F antenna and a power amplifier (PA) on a dielectric substrate to achieve miniaturized integration, but its packaging is also poor and its anti-interference capability is weak.

[0051] The third approach integrates a circularly polarized patch antenna and an LNA circuit on a multilayer dielectric substrate with a high dielectric constant, achieving an output gain of 28.5 dBic in the L-band. However, multilayer circuit boards are susceptible to interference from external electromagnetic signals in practical applications, which can lead to instability during testing and application.

[0052] The fourth method involves exciting a dielectric resonant antenna through slot coupling, with the antenna also serving as a cover for the entire module. This achieves good packaging characteristics and effectively solves the packaging problem. However, the high-dielectric-constant dielectric substrate is expensive, requires high processing precision, and is complex to assemble. Furthermore, integrating the antenna and RF front-end circuitry into the same sealed space makes the antenna susceptible to electromagnetic interference from the RF front-end circuitry.

[0053] To address the problems of existing signal transceiver devices, this application provides a signal transceiver device comprising: a conductor box having a cavity inside; a first substrate covering the opening of the cavity, with an antenna on the surface of the first substrate facing away from the cavity; a metal ground on the side of the first substrate facing the cavity, the metal ground being electrically connected to the conductor box; and a second substrate fixed to the bottom of the cavity, with a radio frequency (RF) front-end circuit on the surface of the second substrate facing the first substrate, the RF front-end circuit being electrically connected to the antenna. This signal transceiver device can serve as a microwave signal transceiver terminal, enabling miniaturization and improving the integration of microwave signal transceiver terminals.

[0054] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0055] refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a signal transceiver device provided in an embodiment of this application.

[0056] A signal transceiver device is provided, comprising: a conductor box 00 having a cavity inside; a first substrate 10 covering the opening of the cavity, the first substrate 10 having an antenna on its surface opposite to the cavity; the first substrate 10 having a metal ground on its surface facing the cavity, the metal ground being electrically connected to the conductor box 00; and a second substrate 20 fixed to the bottom of the cavity, the second substrate 20 having a radio frequency front-end circuit on its surface facing the first substrate 10, the radio frequency front-end circuit being electrically connected to the antenna.

[0057] The first substrate 10 directly covers the conductor box 00, while the second substrate 20 is located inside the conductor box 00. In this case, the distance between the antenna on the first substrate 10 and the RF front-end circuit on the second substrate 20 is short, greatly reducing signal loss during transmission. Furthermore, the first substrate 10 can form a shielding structure with the conductor box 00, preventing interference from the RF front-end circuit to the antenna located outside the cavity, and simultaneously preventing interference from external electromagnetic signals to the RF front-end circuit, thus improving integration efficiency and anti-interference capability. The first substrate 10, the second substrate 20, and the third substrate 30 described below are all single-layer dielectric substrates, each comprising a dielectric layer and patterned metal layers on opposite surfaces of the dielectric layer.

[0058] The metal layer on the side of the first substrate 10 facing the cavity is a metal ground, which is connected to the conductor box 00 and forms an electromagnetic shielding device with the conductor box 00. The second substrate 20 located inside the conductor box 00 is in an electromagnetic shielding environment, and its radio frequency front-end circuit is not affected by external cluttered signals. Therefore, it can be used in a variety of environments and has a wider range of applications.

[0059] like Figure 1 As shown, the first substrate 10 and the second substrate 20 are electrically connected through the third substrate 30, so that the radio frequency front-end circuit is electrically connected to the antenna.

[0060] Using a third substrate 30 instead of a cable, the antenna located on the first substrate 10 is electrically connected to the radio frequency front-end circuit located on the second substrate 20. While ensuring signal transmission, the third substrate 30 can also support the first substrate 10.

[0061] refer to Figures 2A-2B As shown, Figure 2A A top view of one surface of a third substrate provided in an embodiment of this application. Figure 2B This is a top view of another surface of a third substrate provided in an embodiment of this application. The third substrate 30 is perpendicular to the first substrate 10 and the second substrate 20. The third substrate 30 has a differential microstrip line 32, which is electrically connected to the antenna and the radio frequency front-end circuit.

[0062] The antenna and the radio frequency front-end circuit are electrically connected using the differential microstrip line 32. Compared with the traditional cable connection, the differential microstrip line 32 has a higher integration. Using the differential microstrip line 32 to replace the traditional cable to connect the antenna and the radio frequency front-end circuit can also reduce the transmission distance between the signal received in the antenna and the radio frequency front-end circuit, thereby reducing the impact of electromagnetic interference during transmission.

[0063] refer to Figures 2C-2D , Figure 2C This is a top view of a first substrate provided in an embodiment of this application. Figure 2D for Figure 2C An enlarged schematic diagram of region E1 in the middle, combined with Figures 2A-2DAs shown, the antenna includes: a first antenna signal line 111 and a second antenna signal line 112 symmetrically arranged; the differential microstrip line 32 includes: a feed signal line 321 and a feed ground line 322 located on opposite sides of the third substrate 30; one end of the feed signal line 321 is electrically connected to the first antenna signal line 111, and the other end is electrically connected to the radio frequency front-end circuit; the feed ground line 322 is electrically connected to the second antenna signal line 112.

[0064] In this embodiment, the first antenna signal line 111 and the second antenna signal line 112 are symmetrically distributed. The first antenna signal line 111 is electrically connected to the feed signal line 321 of the third substrate 30, and the second antenna signal line 112 is electrically connected to the feed ground line 322 of the third substrate 30. The other end of the feed signal line 321 is electrically connected to the radio frequency front-end circuit. The feed signal line 321 and the feed ground line 322 are located on opposite sides of the third substrate 30, and are not connected to each other. The feed signal line 321 and the feed ground line 322 form a differential feed structure, which can improve integration and reduce the size of the device.

[0065] This application uses the differential microstrip line 32 for power feeding. Compared with the traditional single-port power feeding method, it can reverse the cancellation of unwanted signals collected by the antenna signal after entering the differential microstrip line 32, thereby reducing the interference of noise signals and other unwanted signals on the system. At the same time, when connecting the antenna to the radio frequency front-end circuit, the use of the differential microstrip line 32 improves the overall integration and avoids the need for additional balun conversion structures, thereby reducing its complexity, reducing costs and improving efficiency.

[0066] The signal transceiver has a rectangular slot 15 penetrating the first substrate 10; the third substrate 30 faces one end of the first substrate 10. Figure 2A and Figure 2B The upper end of the third substrate 30 is adapted to the rectangular groove 15 and can be inserted and fixed in the rectangular groove 15.

[0067] One end of the third substrate 30 ( Figure 2A and Figure 2B The lower end of the third substrate 30 is fixed to the second substrate 20 by a countersunk screw 34, and the other end is inserted into the rectangular groove 15 of the first substrate 10 to fix the first substrate 10 and the second substrate 20. The rectangular groove 15 of the first substrate 10 is located in the middle position, so the third substrate 30 can also support the first substrate 10.

[0068] The first substrate 10 has a patterned metal layer on the surface away from the cavity, the patterned metal layer having a cutout 12 to form an antenna signal line 11 and an antenna ground line 16; wherein, the cutout 12 includes a first cutout 121 and a second cutout 122 opposite to each other, and there is a gap 17 between the first cutout 121 and the second cutout 122.

[0069] The antenna signal line 11 includes a first antenna signal line 111 and a second antenna signal line 112. The antenna ground line 16 includes a first antenna ground line 161 composed of a metal layer surrounded by the perforated slot 12 and a second antenna ground line 162 composed of a metal layer outside the perforated slot 12. A gap 17 exists between the first slot 121 and the second slot 122, and the first antenna ground line 161 and the second antenna ground line 162 are connected through a metal layer corresponding to the area of ​​the gap 17. When the antenna signal line 11 receives interference signals of other frequencies, an induced current is generated at the first antenna ground line 161. This induced current flows from the area of ​​the gap 17 to the second antenna ground line 162, and then flows through the metallized via 14 located on the second antenna ground line 162 to the conductor box 00, thereby reducing the influence of interference signals.

[0070] The middle region of the first substrate 10 has a rectangular groove 15 that runs through the first substrate 10. The rectangular groove 15 is used to connect, fix and electrically connect to the power supply structure 32. The first gap 121 and the second gap 122 are symmetrical based on the extension direction of the rectangular groove 15.

[0071] The feeding structure 32 includes the aforementioned feeding signal line 321 and feeding ground line 322. The antenna ground line 16 is isolated from the antenna signal line 11 by a perforated gap 12. The signals received by the first antenna signal line 111 and the second antenna signal line 112 are transmitted to the RF input terminal 22 on the second substrate 20 through the feeding signal line 321 and the feeding ground line 322, respectively.

[0072] like Figure 2C and Figure 2D As shown, a T-shaped structure is present at the end of the antenna signal line 12, thereby achieving a good impedance matching effect. Furthermore, the T-shaped structure increases the total area of ​​the antenna signal line 12, improving its signal reception and transmission capabilities.

[0073] The first slot 121 and the second slot 122 are symmetrically arranged, as they are used to enhance the signal reception capabilities of the first antenna signal line 111 and the second antenna signal line 112, respectively. The symmetrical arrangement of the first slot 121 and the second slot 122 ensures that the frequency ranges of the signals received by the first antenna signal line 111 and the second antenna signal line 112 are similar or even the same, thereby enhancing the anti-interference capability of the signal transceiver.

[0074] refer to Figure 2E , Figure 2E This figure shows a top view of a second substrate provided in an embodiment of this application. A radio frequency (RF) front-end circuit is integrated on the second substrate 20. The first substrate 10 and the second substrate 20 are electrically connected via a third substrate 30. The third substrate 30 has a feed signal line 321 electrically connected to the antenna. The ports of the RF front-end circuit include: an RF input terminal 22, a DC input terminal 21, and an RF output terminal 25. The RF input terminal 22 is electrically connected to the feed signal line 321. A bias circuit 26 is electrically connected between the RF input terminal 22 and the DC input terminal 21. A grounded coplanar waveguide 27, a matching network 28, and a filter assembly 24 are electrically connected between the RF input terminal 22 and the RF output terminal 25. The grounded coplanar waveguide 27 is electrically connected between the RF input terminal 22 and the matching network 28, and the filter assembly 24 is electrically connected between the matching network 28 and the RF output terminal 25. The matching network component 28 includes a low-noise amplifier 23, which is electrically connected between a grounded coplanar waveguide 27 and a filter component 24 based on the set matching network component 28. The matching network 28 and the bias circuit 26 serve the low-noise amplifier 23.

[0075] The radio frequency front-end circuit is located on the second substrate 20, wherein the radio frequency output terminal 25 and the DC input terminal 21 are respectively connected to the connection port through the conductor box 00, thereby enabling the reception of DC voltage and the transmission of data from the outside. To ensure the electromagnetic shielding effect of the conductor box 00, a 3.5mm SMA connector is selected for the connection port outside the conductor box 00.

[0076] The matching network component 28 includes a low-noise amplifier 23 for amplifying the signal received by the antenna. The low-noise amplifier 23 used is an ATF-54143 model, which has a gain exceeding 16dB in the 1-2GHz range but requires a +5V power supply. Therefore, the DC input terminal 21 is used to provide voltage to the low-noise amplifier 23.

[0077] The signal received by the antenna is amplified by the low-noise amplifier 23 in the matching network 28 and then transmitted to the filter assembly 24 to eliminate clutter. The filter assembly 24 is a surface acoustic wave filter (SAW) of model TA2727AA3112. All other components in the RF front-end circuit are 0603 packaged components.

[0078] The DC input terminal 21 is connected to the grounded coplanar waveguide assembly 27 and the matching network assembly 28 via the bias circuit assembly 26. The grounded coplanar waveguide assembly 27 provides the operating voltage for the antenna. The matching network assembly 28 provides the operating voltage for the low-noise amplifier 23.

[0079] Since the RF front-end circuit is located on the second substrate 20, which is composed of a single-layer PCB board covered with metal layers on both sides, the side closest to the conductor box 00 is a fully covered metal layer connected to the conductor box 00 by conductive adhesive. The metal layer on the side facing away from the bottom of the cavity has a patterned third gap 29, which separates the metal layer on the side facing away from the bottom of the cavity, forming multiple unconnected metal layer blocks. Some of these metal layer blocks are interconnected and integrate the circuit elements of the RF front-end circuit described above, forming the RF front-end circuit. The metal layer blocks outside the RF front-end circuit have multiple metallized vias 14 penetrating the second substrate 20, connecting the metal layer blocks outside the RF front-end circuit to the other side of the metal layer of the second substrate 20, and connecting them to the conductor box 00 by conductive adhesive, thereby achieving better grounding performance.

[0080] refer to Figure 3 , Figure 3 This is a three-dimensional view of a signal transceiver device after assembly according to an embodiment of this application. The first substrate 10 has a patterned metal layer on the surface away from the cavity. The patterned metal layer has a hollowed-out gap 12 to form an antenna signal line 11 and an antenna ground line 16. The first substrate 10 is fixed to the conductor box 00 by a first fixing screw 13, and the antenna ground line 16 is electrically connected to the conductor box 00 by the first fixing screw 13.

[0081] The first substrate 10 is fixed to the conductor box 00 using the first fixing screw 13. Since the side of the first substrate 10 facing the cavity has a metal ground, the metal ground is connected to the conductor box to form a shielding structure. At the same time, the first fixing screw 13 connects the antenna ground wire 16 to the conductor box 00. When the antenna signal line 11 receives an interference signal and generates an induced current, the induced current flows from the antenna ground wire 16 to the conductor box 00, thereby reducing the impact on the internal components.

[0082] The first substrate 10 has multiple metallized through holes 14, connecting the metal ground of the first substrate 10 to the antenna ground line 16. Therefore, conductive adhesive can be directly used to fix the first substrate 10 to the conductor box 00, thereby obtaining a stronger sealing effect. Similarly, when fixing the first substrate 10 with the first fixing screw 13, conductive adhesive can be filled at the connection position between the conductor box 00 and the first substrate 10 before fixing with the first fixing screw 13, thereby obtaining a better sealing effect and connection strength.

[0083] To demonstrate the signal reception and reception capabilities of the antenna used in this application and its compatibility with the RF front-end circuit module, the antenna module and the RF front-end circuit module were tested in an anechoic chamber, and the test data were plotted. Figures 4-9 The data chart shown.

[0084] refer to Figure 4 , Figure 4 This is a schematic diagram illustrating the output gain of an antenna provided in an embodiment of this application. Figure 4 The left ordinate represents the reflection coefficient S. 11 (dB), the right vertical axis is the maximum gain coefficient Gmax (dBi), and the horizontal axis is the frequency (GHz). The four curves in the figure are the simulated gain curve, the measured gain curve, the simulated reflection coefficient curve, and the measured reflection coefficient curve, respectively. Figure 4 The legend in the lower left corner shows the shape of each curve. The figure shows that the signal transceiver provided in this embodiment has narrow-band VSWR characteristics in the L-band, and test results indicate that when the reflection coefficient S... 11 When the gain is less than -10dB, its bandwidth is approximately 1.68-1.75GHz, and when the frequency is 1.7GHz, the gain effect is approximately 5dBi.

[0085] refer to Figure 5 , Figure 5 This is a schematic diagram illustrating the output gain of a radio frequency front-end circuit provided in an embodiment of this application. Figure 5The horizontal axis represents frequency (GHz), and the vertical axis represents output gain (dBic). The two curves represent the measured output gain curve and the simulated output gain curve, respectively. Figure 5 The legend in the lower left corner shows the shape of each curve. It can be seen that the signal transceiver provided in this embodiment has a gain exceeding 22dBic at a frequency of 1.7GHz, and an output gain exceeding 20dBic in the 1.68-1.72GHz band. This demonstrates that it can provide sufficient output gain.

[0086] In the above description, the filter component 24 located on the second substrate 20 has an insertion loss of -2dB at a frequency of 1.7GHz.

[0087] Figures 6-9 for Figure 1 The signal transceiver shown measures the radiation patterns at different frequency bands. Figure 6 and Figure 7 These represent the radiation patterns measured by the antenna in the 1680MHz and 1700MHz frequency bands, respectively.

[0088] Where M1 represents the simulated curve and M2 represents the measured curve. It can be seen that the antenna's signal reception capability exhibits a certain degree of symmetry and directionality, proving its good performance.

[0089] and Figure 8 and Figure 9 These represent the measured radiation patterns of the RF front-end circuit components in the 1680MHz and 1700MHz frequency bands, respectively.

[0090] Curve N1 in the figure represents the measured curve. It can be seen that the measured results exhibit a certain degree of symmetry and orientation, indicating good performance. Figures 6-7 The curves shown show that the two have good matching characteristics and high output gain.

[0091] Figure 10 for Figure 1 The diagram shows the electric field intensity distribution of the antenna signal line of the signal transceiver device.

[0092] As can be seen, the electric field strength is high at the antenna signal line 11, while the electric field strength is very low at other locations.

[0093] Based on the above embodiments of the signal transceiver device, another embodiment of this application provides a method for manufacturing the signal transceiver device, the method comprising:

[0094] A conductor box 00 is provided, the conductor box 00 having an interior cavity;

[0095] A second substrate 20 is fixed at the bottom of the cavity;

[0096] The first substrate 10 is fixed to the opening of the cavity;

[0097] The first substrate 10 has an antenna on its surface away from the cavity; the first substrate 10 has a metal ground on its surface facing the cavity, and the metal ground is electrically connected to the conductor box 00; the second substrate 20 has a radio frequency front-end circuit on its surface facing the first substrate 10, and the radio frequency front-end circuit is electrically connected to the antenna.

[0098] Optionally, the conductor box 00 is a metal box, and the material of the metal box can be a metal such as Cu, Al, or steel. When the conductor box 00 is a metal box, it can provide a good electromagnetic shielding effect, and at the same time, due to the high hardness of the metal material, it can also provide a strong protective effect.

[0099] The manufacturing method described in this application embodiment can prepare the signal transceiver device described in the above embodiment, and the prepared signal transceiver device has high integration and anti-electromagnetic interference performance.

[0100] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. Regarding the methods disclosed in the embodiments, since they correspond to the apparatus disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the apparatus section description.

[0101] It should be noted that, in the description of this application, the drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments identify the same structures. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be intermediate elements. Furthermore, "on" means positioning an element on or below another element, but does not inherently mean positioning it above another element according to the direction of gravity.

[0102] The terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the middle.

[0103] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0104] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A signal transceiver device, characterized in that, include: A conductor box, the conductor box having an interior cavity; A first substrate covers the opening of the cavity, and an antenna is provided on the surface of the first substrate facing away from the cavity; a metal ground is provided on the side of the first substrate facing the cavity, and the metal ground is electrically connected to the conductor box. The second substrate is fixed to the bottom of the cavity. The side surface of the second substrate facing the first substrate has a radio frequency front-end circuit, which is electrically connected to the antenna. The first substrate and the second substrate are electrically connected through a third substrate, so that the radio frequency front-end circuit is electrically connected to the antenna; The third substrate is perpendicular to the first substrate and the second substrate; The third substrate has differential microstrip lines, which are electrically connected to the antenna and to the radio frequency front-end circuit. It has a rectangular groove that penetrates the first substrate; The end of the third substrate facing the first substrate is adapted to the rectangular groove and can be inserted and fixed in the rectangular groove.

2. The signal transceiver device according to claim 1, characterized in that, The antenna includes: a first antenna signal line and a second antenna signal line arranged symmetrically; The differential microstrip line includes: a feed signal line and a feed ground line located on opposite sides of the third substrate; one end of the feed signal line is electrically connected to the first antenna signal line, and the other end is electrically connected to the radio frequency front-end circuit; the feed ground line is electrically connected to the second antenna signal line.

3. The signal transceiver according to claim 1, characterized in that, The first substrate has a patterned metal layer on the surface opposite to the cavity, and the patterned metal layer has cutouts to form antenna signal lines and antenna ground lines; The perforated gap includes a first gap and a second gap that are opposite each other, and there is a gap between the first gap and the second gap.

4. The signal transceiver according to claim 3, characterized in that, The middle region of the first substrate has a rectangular groove that runs through the first substrate, and the rectangular groove is used to connect, fix and electrically connect to the power supply structure. The first gap and the second gap are symmetrical about the direction of extension of the rectangular groove.

5. The signal transceiver according to claim 1, characterized in that, The third substrate has a feed signal line that is electrically connected to the antenna; The ports of the radio frequency front-end circuit include: a radio frequency input terminal, a DC input terminal, and a radio frequency output terminal; The radio frequency input terminal is electrically connected to the feed signal line; a bias circuit is electrically connected between the radio frequency input terminal and the DC input terminal; A grounded coplanar waveguide, a matching network, and a filter assembly are electrically connected between the RF input terminal and the RF output terminal; the grounded coplanar waveguide is connected between the RF input terminal and the matching network, and the filter assembly is electrically connected between the matching network and the RF output terminal.

6. The signal transceiver according to claim 1, characterized in that, The first substrate has a patterned metal layer on the surface opposite to the cavity, and the patterned metal layer has hollowed-out gaps to form the antenna signal line and the antenna ground line of the antenna; The antenna signal line is electrically connected to the radio frequency front-end circuit. The first substrate is fixed to the conductor box by the first fixing screw, and the antenna ground wire is electrically connected to the conductor box by the first fixing screw.

7. A method for manufacturing a signal transceiver device as described in any one of claims 1-6, characterized in that, include: A conductor box is provided, the conductor box having an interior cavity; A second substrate is fixed at the bottom of the cavity; The first substrate is fixed to the opening of the cavity; The first substrate has an antenna on the surface of the side facing away from the cavity; the first substrate has a metal ground on the side facing the cavity, and the metal ground is electrically connected to the conductor box. The second substrate has a radio frequency front-end circuit on the side surface facing the first substrate, and the radio frequency front-end circuit is electrically connected to the antenna.

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