A grinding and polishing device for accurately controlling the grinding and polishing depth

Abstract

The present invention discloses a grinding and polishing device for accurately controlling the grinding and polishing depth, which includes a rotary grinding device, a material pressing device, and a displacement sensor. The rotary grinding device includes a turntable and a first driving mechanism. The surface of the turntable has a rough layer, and the first driving mechanism is connected to the center of the turntable, and the first driving mechanism can drive the turntable to rotate; the material pressing device is arranged on the rotary grinding device, the material pressing device includes a material pressing telescopic member and a second driving mechanism, the displacement sensor is arranged on the material pressing telescopic member, the material pressing end of the material pressing telescopic member faces the turntable, and the second driving mechanism can drive the material pressing telescopic member to approach or move away from the turntable so that the material pressing end presses or leaves the sample placed on the turntable, and the displacement sensor can move with the material pressing telescopic member to sense the displacement amount of the material pressing telescopic member. The present invention can obtain the displacement amount of the material pressing telescopic member through the displacement sensor, and then obtain the grinding and polishing depth of the sample, which is beneficial to accurately controlling the grinding and polishing depth and avoiding over-grinding and damaging the sample.

Description

Technical Field

[0001] The present invention relates to the technical field of product inspection, and particularly to a grinding and polishing device for accurately controlling the grinding and polishing depth. Background Art

[0002] DPA (Destructive Physical Analysis) refers to randomly extracting an appropriate number of samples from a production batch of components and using a series of non-destructive and destructive methods to inspect whether the design, structure, materials, and manufacturing quality of the components meet the requirements of the intended use and relevant specifications. DPA is an extremely important method for inspecting the quality of MLCC (Multi-layer Ceramic Capacitors) products. Generally, the MLCC samples need to be ground and polished and then placed under a microscope to take pictures, and then the internal structure of the samples is analyzed to determine whether they are defective products.

[0003] Currently, the main method for grinding and polishing samples is still manual grinding and polishing, that is, sandpaper is fixed above the grinding disc of the grinding and polishing machine, and the grinding disc drives the sandpaper to rotate. The operator holds the sample by hand, presses the grinding and polishing surface against the sandpaper, grinds it a few times, and then places the sample under the microscope to observe whether it has been ground to the position that needs to be analyzed. If it has not been ground to the required position, it is continued to be ground on the sandpaper of the grinding disc until it is roughly ground to the position that needs to be analyzed under the microscope. This method requires full human participation, consumes a lot of manpower, and cannot control the grinding and polishing depth. It is easy to have errors in determining the grinding and polishing depth by using a microscope. If the grinding is too deep, the sample will be scrapped.

[0004] Therefore, it is necessary to provide a new grinding and polishing device for accurately controlling the grinding and polishing depth to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a grinding and polishing device for accurately controlling the grinding and polishing depth, which can obtain the displacement of the pressure-feeding telescopic member through a displacement sensor, and then obtain the grinding and polishing depth of the sample, which is beneficial to accurately controlling the grinding and polishing depth and avoiding over-grinding and damaging the sample.

[0006] To achieve the above purpose, the present invention provides a grinding and polishing device for accurately controlling the grinding and polishing depth, including:

[0007] A rotating and grinding device, the rotating and grinding device includes a turntable and a first driving mechanism, the surface of the turntable has a rough layer, the first driving mechanism is connected to the center of the turntable, and the first driving mechanism can drive the turntable to rotate;

[0008] A blanking device and a displacement sensor. The blanking device is arranged on the rotary grinding device. The blanking device includes a blanking telescopic member and a second driving mechanism. The displacement sensor is arranged on the blanking telescopic member. The blanking end of the blanking telescopic member faces the turntable. The second driving mechanism can drive the blanking telescopic member to approach or move away from the turntable so that the blanking end presses or leaves the sample placed on the turntable. The displacement sensor can move with the blanking telescopic member to sense the displacement of the blanking telescopic member.

[0009] When the displacement sensed by the displacement sensor reaches a preset value, the second driving mechanism stops driving the blanking telescopic member to continue approaching the turntable to press the sample.

[0010] Optionally, the blanking device further includes a sample fixing plate, a third driving mechanism and a telescopic connecting member. The third driving mechanism is connected to the sample fixing plate through the telescopic connecting member. The third driving mechanism is used to drive the telescopic connecting member to move to drive the sample fixing plate to approach or move away from the turntable. The sample fixing plate is provided with sample limiting holes. The blanking end of the blanking telescopic member is aligned with the sample limiting holes.

[0011] When the sample fixing plate moves to a distance from the turntable that is a predetermined value, a sample can be placed in the sample limiting holes. The predetermined value is at least smaller than the thickness of the sample.

[0012] Optionally, when the sample is placed in the sample limiting holes, the gap area between the sample and the inner wall of the sample limiting holes is at least smaller than the contact area of the blanking telescopic member for contacting the sample.

[0013] Optionally, the blanking device further includes a mounting plate and a fourth driving mechanism. The second driving mechanism and the third driving mechanism are connected to the mounting plate. The fourth driving mechanism is used to drive the mounting plate to rotate to drive the blanking telescopic member connected to the second driving mechanism and the sample fixing plate connected to the third driving mechanism through the telescopic connecting member to rotate, and the rotation direction is opposite to the rotation direction of the turntable.

[0014] Optionally, there are multiple sample limiting holes on the sample fixing plate. The number of the second driving mechanism, the blanking telescopic member and the displacement sensor is the same as the number of the sample limiting holes, and each blanking telescopic member corresponds to one sample limiting hole.

[0015] Optionally, the sample fixing disk, the turntable and the mounting disk are all circular. A plurality of the sample limiting holes are arranged in a circumferential array with the center of the sample fixing disk as the center of the circle; a plurality of the second driving mechanisms and the pressing telescopic member are arranged in a circumferential array with the center of the mounting disk as the center of the circle; the third driving mechanism is connected to the center of the mounting disk.

[0016] Optionally, the pressing device further includes a housing. The second driving mechanism is arranged inside the housing. The pressing telescopic member passes through the bottom of the housing. The displacement sensor is a laser distance sensor, and the displacement sensor senses the change in the distance from the bottom of the housing to determine the displacement of the pressing telescopic member.

[0017] Optionally, a pressure detection member is provided at the pressing end of the pressing telescopic member, and the pressure detection member is used to detect the pressure of the pressing telescopic member on the sample.

[0018] Optionally, the grinding and polishing device includes a grinding and polishing table. The turntable and the first driving mechanism are arranged on the grinding and polishing table. A water supply device is provided on the grinding and polishing table. The water supply device includes a water outlet, and the water outlet is aligned with the turntable. The water of the water supply device can flow from the water outlet to the turntable.

[0019] Optionally, the grinding and polishing table is provided with a groove, and the turntable protrudes from the groove. The groove is used to receive the water flowing down from the turntable.

[0020] In the grinding and polishing equipment of the present invention, the second driving mechanism drives the pressing telescopic member to press the sample placed on the turntable, and the first driving mechanism can drive the turntable to rotate. The contact surface between the turntable and the sample is a rough surface, so as to realize the grinding and polishing of the sample. The pressing telescopic member is connected with a displacement sensor, and the displacement sensor is used to sense the displacement of the pressing telescopic member. The grinding and polishing depth of the sample can be obtained through the displacement. When the displacement of the pressing telescopic member reaches a preset value, it can be considered that the sample has been ground and polished to the target depth, and the second driving mechanism stops driving the pressing telescopic member to continue approaching the turntable to relieve the pressure applied to the sample. The present invention can obtain the displacement of the pressing telescopic member through the displacement sensor, and then obtain the grinding and polishing depth of the sample. When the displacement reaches the preset value, the second driving mechanism is stopped from driving the pressing telescopic member, which is beneficial to accurately control the grinding and polishing depth and avoid damaging the sample due to excessive grinding and polishing. Description of the Drawings

[0021] Figure 1 is a schematic three-dimensional structure diagram of the grinding and polishing equipment according to an embodiment of the present invention.

[0022] Figure 2 is a schematic three-dimensional view from the bottom perspective of the grinding and polishing device according to an embodiment of the present invention.

[0023] Figure 3 It is a three-dimensional schematic diagram of the blank holding device according to an embodiment of the present invention.

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the blank holding device according to an embodiment of the present invention with some structures hidden.

[0025] Figure 5 It is a three-dimensional structural schematic diagram of the blank holding device according to an embodiment of the present invention with another part of the structure hidden. Specific Embodiments

[0026] In order to elaborate in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is described in detail in conjunction with the embodiments and with reference to the accompanying drawings.

[0027] Please refer to Figure 1 、 Figure 2 and Figure 4 , the present invention discloses a polishing device for accurately controlling the polishing depth, including a rotary polishing device 1, a blank holding device 2 and a displacement sensor 5. Among them, the rotary polishing device 1 includes a turntable 13 and a first driving mechanism 14. The surface of the turntable 13 has a rough layer. The first driving mechanism 14 is connected to the center of the turntable 13, and the first driving mechanism 14 can drive the turntable 13 to rotate; the blank holding device 2 is arranged on the rotary polishing device 1. The blank holding device 2 includes a blank holding telescopic member 23 and a second driving mechanism 8. The displacement sensor 5 is arranged on the blank holding telescopic member 23. The blank holding end 231 of the blank holding telescopic member 23 faces the turntable 13. The second driving mechanism 8 can drive the blank holding telescopic member 23 to approach or move away from the turntable 13 so that the blank holding end 231 presses or leaves the sample placed on the turntable 13. The displacement sensor 5 can move with the blank holding telescopic member 23 to sense the displacement amount of the blank holding telescopic member 23; when the displacement amount sensed by the displacement sensor 5 reaches a preset value, the second driving mechanism 8 stops driving the blank holding telescopic member 23 to continue approaching the turntable 13 to press the sample.

[0028] The polishing device of the present invention drives the blank holding telescopic member 23 to press the sample placed on the turntable 13 through the second driving mechanism 8. The first driving mechanism 14 can drive the turntable 13 to rotate, and the contact surface between the turntable 13 and the sample is a rough surface, thereby realizing the polishing of the sample. The blank holding telescopic member 23 is connected with a displacement sensor 5, and the displacement sensor 5 is used to sense the displacement amount of the blank holding telescopic member 23. The polishing depth of the sample can be obtained through the displacement amount. When the displacement amount of the blank holding telescopic member 23 reaches the preset value, it can be considered that the sample has been polished to the target depth, and the second driving mechanism 8 then stops driving the blank holding telescopic member 23 to continue approaching the turntable 13 to relieve the pressure applied to the sample. The present invention can obtain the displacement amount of the blank holding telescopic member 23 through the displacement sensor 5, and then obtain the polishing depth of the sample. When the displacement amount reaches the preset value, the second driving mechanism 8 is stopped from driving the blank holding telescopic member 23, which is beneficial to accurately controlling the polishing depth and avoiding over-polishing and damaging the sample.

[0029] It is understandable that the shape of the material pressing telescopic member 23 can be diverse, as long as it can press the sample under the drive of the second drive mechanism 8. Preferably, the material pressing telescopic member 23 can be rod-shaped, perpendicular to the turntable 13, and the second drive mechanism 8 can drive the material pressing telescopic member 23 to move up and down.

[0030] Specifically, the first drive mechanism 14 can be a rotary drive motor, and its output end is connected to the center of the turntable 13, so as to be able to drive the turntable 13 to rotate around its center; the second drive mechanism 8 can be a drive cylinder, which can make the material pressing telescopic member 23 move closer to or away from the turntable 13.

[0031] Specifically, the rough layer on the turntable 13 can be formed by sandpaper, that is, sandpaper is glued to the surface of the turntable 13.

[0032] Furthermore, the polishing equipment of the present invention can control the polishing operation through a controller. Before the polishing operation starts, a corresponding preset value is set according to the target polishing depth. The controller judges whether the current polishing depth reaches the target value according to the displacement amount transmitted by the displacement sensor 5. If it reaches, the second drive mechanism 8 is used to control the material pressing telescopic member 23 to stop pressing down on the sample to apply pressure, so that the sample cannot be polished by the turntable 13 continuously, thereby achieving the effect of accurately controlling the polishing depth.

[0033] Please refer to Figure 3 and Figure 5 , in some embodiments, the material pressing device 2 further includes a sample fixing plate 22, a third drive mechanism 9 and a telescopic connecting member 24. The third drive mechanism 9 is connected to the sample fixing plate 22 through the telescopic connecting member 24. The third drive mechanism 9 is used to drive the telescopic connecting member 24 to move to drive the sample fixing plate 22 to approach or move away from the turntable 13. The sample fixing plate 22 is provided with a sample limiting hole 221, and the material pressing end 231 of the material pressing telescopic member 23 is aligned with the sample limiting hole 221; when the sample fixing plate 22 moves to a distance from the turntable 13 that is a predetermined value, a sample can be placed in the sample limiting hole 221, and the predetermined value is at least less than the thickness of the sample.

[0034] It is understandable that the third drive mechanism 9 can be a drive cylinder, the telescopic connecting member 24 is rod-shaped and perpendicular to the turntable 13, and the sample fixing plate 22 is parallel to the turntable 13. The third drive mechanism 9 can drive the telescopic connecting member 24 and the sample fixing plate 22 to move closer to or away from the turntable 13.

[0035] Specifically, when the sample fixing plate 22 descends to a distance from the turntable 13 equal to a predetermined value, the sample is placed in the sample limiting hole 221, which can limit the sample in the sample fixing plate 22 and prevent the sample from detaching from the corresponding area. Among them, the predetermined value should be at least less than the thickness of the sample. Preferably, the distance between the sample fixing plate 22 and the turntable 13 should not be 0, that is, there should be a gap between the sample fixing plate 22 and the turntable 13, and the predetermined value should be set according to the thickness of the sample after grinding and polishing to prevent the sample from being unable to be limited due to a decrease in thickness after grinding and polishing.

[0036] Further, when the sample is placed in the sample limiting hole 221, the gap area between the sample and the inner wall of the sample limiting hole 221 is at least smaller than the contact area of the pressing and telescoping member 23 for contacting the sample. When the frictional force between the pressing and telescoping member 23 and the sample cannot counteract the frictional force between the rough layer of the turntable 13 and the sample, the inner wall of the sample limiting hole 221 can block the movement of the sample, keeping the sample always below the pressing and telescoping member 23.

[0037] Please refer to Figure 4 , preferably, the pressing device 2 further includes a mounting plate 7 and a fourth driving mechanism 6. The second driving mechanism 8 and the third driving mechanism 9 are connected to the mounting plate 7. The fourth driving mechanism 6 is used to drive the mounting plate 7 to rotate, so as to drive the pressing and telescoping member 23 connected to the second driving mechanism 8 and the sample fixing plate 22 connected to the third driving mechanism 9 through the telescoping connecting member 24 to rotate, and the rotation direction is opposite to that of the turntable 13.

[0038] It can be understood that the fourth driving mechanism 6 can be a rotary driving motor, and its output end is connected to the center of the mounting plate 7, thereby driving the mounting plate 7 to rotate around its center. The second driving mechanism 8 and the pressing and telescoping member 23 are vertically arranged on the mounting plate 7, and the third driving mechanism 9, the telescoping connecting member 24 and the sample fixing plate 22 are also vertically arranged on the mounting plate 7. By driving the mounting plate 7 to rotate, the sample can also rotate, and the rotation direction is opposite to that of the turntable 13, thus accelerating the grinding and polishing speed and being beneficial to improving the grinding and polishing efficiency.

[0039] Please refer to Figures 1 to 5 , further, there are multiple sample limiting holes 221 on the sample fixing plate 22. The number of the second driving mechanism 8, the pressing and telescoping member 23 and the displacement sensor 5 is the same as the number of the sample limiting holes 221, and each pressing and telescoping member 23 corresponds to a sample limiting hole 221 respectively.

[0040] Specifically, the sample fixing plate 22, the turntable 13 and the mounting plate 7 are all circular. The multiple sample limiting holes 221 are arranged in a circumferential array with the center of the sample fixing plate 22 as the center of the circle; the multiple second driving mechanisms 8 and the pressing and telescoping members 23 are arranged in a circumferential array with the center of the mounting plate 7 as the center of the circle; the third driving mechanism 9 is connected to the center of the mounting plate 7.

[0041] Through the above arrangement, the grinding and polishing equipment of the present invention can perform grinding and polishing operations on multiple samples at the same time, thereby improving the grinding and polishing efficiency of multiple samples.

[0042] When polishing multiple samples, the controller can obtain the polishing depth of the corresponding sample through each displacement sensor 5 respectively, and can control the corresponding second drive mechanism 8 separately, that is, when the polishing depth of one of the samples reaches the target, the corresponding second drive mechanism 8 is controlled to stop driving the corresponding material pressing telescopic member 23 to continue pressing down the sample, which can not only ensure the polishing operation of other samples, but also avoid over-polishing of the samples that have completed the polishing operation.

[0043] See also Figure 1 , Figure 3 and Figure 5 In some embodiments, the pressing device 2 also includes a shell 21, the second driving mechanism 8 is disposed in the shell 21, the pressing telescopic member 23 passes through the bottom of the shell 21, the displacement sensor 5 is a laser ranging sensor, and the displacement sensor 5 senses the change in distance from the bottom of the shell 21 to determine the displacement of the pressing telescopic member 23.

[0044] Specifically, the distance measurement accuracy of the displacement sensor 5 is 0.0001 mm. The displacement sensor 5 can be disposed inside the housing 21 or outside the housing 21 , as long as it can sense the distance change between the displacement sensor 5 and the bottom of the housing 21 .

[0045] Furthermore, a pressure detection member is provided at the pressing end 231 of the pressing telescopic member 23, and the pressure detection member is used to detect the pressure of the pressing telescopic member 23 on the sample. By setting a preset pressure value, the controller can determine whether the pressure of the pressing telescopic member 23 on the sample reaches the preset pressure value through the pressure detection member.

[0046] See also Figure 1 and Figure 2 In some embodiments, the grinding device 1 includes a grinding table 12, a turntable 13 and a first driving mechanism 14 are arranged on the grinding table 12, a water supply device 11 is arranged on the grinding table 12, and the water supply device 11 includes a water outlet 111, the water outlet 111 is aligned with the turntable 13, and the water of the water supply device 11 can flow from the water outlet 111 to the turntable 13. When the sample is ground and polished, a large amount of heat will be generated due to friction, and the water of the water supply device 11 can cool the sample.

[0047] Specifically, the grinding table 12 is provided with a groove 121, and the rotating disk 13 is convexly arranged on the groove 121, and the groove 121 is used to receive the water flowing down from the rotating disk 13. By providing the groove 121, the water turbulence of the water supply device 11 can be avoided, and the outflowing water can be processed conveniently.

[0048] Furthermore, a water outlet may be provided in the groove 121, through which water is discharged.

[0049] The working process of the specific embodiments shown in the drawings of the present invention will be briefly described below to facilitate the understanding of the present invention; it should not be regarded as a limitation of the present invention.

[0050] First, the third driving mechanism 9 drives the telescopic connecting member 24 and the sample fixing plate 22 to descend to a position at a predetermined distance from the turntable 13.

[0051] Next, the sample is placed in the sample limiting hole 221 in the sample fixing plate 22 and contacts the rough layer of the turntable 13.

[0052] Next, the second driving mechanism 8 drives the pressing telescopic member 23 to approach the turntable 13 and applies pressure to the sample on the turntable 13 until the pressure value obtained by the pressure detecting member reaches the target value.

[0053] Next, the first driving mechanism 14 drives the turntable 13 to rotate, and the fourth driving mechanism 6 drives the mounting plate 7 to rotate, and the rotation directions of the turntable 13 and the mounting plate 7 are opposite (that is, one is clockwise and the other is counterclockwise).

[0054] Next, when it is judged by the displacement sensor 5 that the polishing depth of the sample reaches the preset value, the corresponding second driving mechanism 8 is controlled to stop driving the pressing telescopic member 23 to press the sample downward.

[0055] Next, when the polishing depths of all the samples reach the preset value, the first driving mechanism 14 stops driving the turntable 13 to rotate, and the second driving mechanism 8 and the third driving mechanism 9 drive the pressing telescopic member 23 and the sample fixing plate 22 away from the turntable 13.

[0056] The above-disclosed are only the preferred examples of the present invention and cannot be used to limit the scope of the rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention all fall within the scope covered by the present invention.

Claims

1. A polishing equipment for accurately controlling the polishing depth, characterized in that Comprising: A grinding device, the grinding device including a turntable and a first driving mechanism, the surface of the turntable having a rough layer, the first driving mechanism being connected to the center of the turntable, and the first driving mechanism being capable of driving the turntable to rotate; A material pressing device and a displacement sensor, the material pressing device being disposed on the grinding device, the material pressing device including a material pressing telescopic member and a second driving mechanism, the displacement sensor being disposed on the material pressing telescopic member, the material pressing end of the material pressing telescopic member facing the turntable, and the second driving mechanism being capable of driving the material pressing telescopic member to approach or move away from the turntable so that the material pressing end presses or leaves the sample placed on the turntable, and the displacement sensor being capable of moving with the material pressing telescopic member to sense the displacement amount of the material pressing telescopic member; When the displacement amount sensed by the displacement sensor reaches a preset value, the second driving mechanism stops driving the material pressing telescopic member to continue approaching the turntable to press the sample; The material pressing device further includes a sample fixing plate, a third driving mechanism, and a telescopic connecting member, the third driving mechanism and the sample fixing plate being connected through the telescopic connecting member, the third driving mechanism being used for driving the telescopic connecting member to move to drive the sample fixing plate to approach or move away from the turntable, the sample fixing plate being provided with sample limiting holes, and the material pressing end of the material pressing telescopic member being aligned with the sample limiting holes; When the sample fixing plate moves to a distance from the turntable being a predetermined value, a sample can be placed into the sample limiting holes, and the predetermined value is at least less than the thickness of the sample.

2. The grinding equipment for accurately controlling the grinding depth according to claim 1, characterized in that When the sample is placed in the sample limiting holes, the gap area between the sample and the inner wall of the sample limiting holes is at least less than the area of the contact surface of the material pressing telescopic member for contacting the sample.

3. The grinding equipment for accurately controlling the grinding depth according to claim 2, characterized in that The material pressing device further includes a mounting plate and a fourth driving mechanism, the second driving mechanism and the third driving mechanism being connected to the mounting plate, the fourth driving mechanism being used for driving the mounting plate to rotate to drive the material pressing telescopic member connected to the second driving mechanism and the sample fixing plate connected to the third driving mechanism through the telescopic connecting member to rotate, and the rotation direction being opposite to the rotation direction of the turntable.

4. The grinding equipment for accurately controlling the grinding depth according to claim 3, characterized in that A plurality of the sample limiting holes are provided on the sample fixing plate, the number of the second driving mechanism, the material pressing telescopic member, and the displacement sensor is the same as the number of the sample limiting holes, and each material pressing telescopic member corresponds to one sample limiting hole respectively.

5. The grinding equipment for accurately controlling the grinding depth according to claim 4, characterized in that The sample fixing plate, the turntable, and the mounting plate are all circular. A plurality of the sample limiting holes are arranged in a circumferential array with the center of the sample fixing plate as the center of the circle; a plurality of the second driving mechanisms and the pressing telescopic member are arranged in a circumferential array with the center of the mounting plate as the center of the circle; the third driving mechanism is connected to the center of the mounting plate.

6. The polishing equipment for accurately controlling the polishing depth according to claim 1, wherein the pressing device further includes a housing. The second driving mechanism is arranged inside the housing. The pressing telescopic member passes through the bottom of the housing. The displacement sensor is a laser distance sensor, and the displacement sensor senses the change in the distance from the bottom of the housing to determine the displacement amount of the pressing telescopic member.

7. The polishing equipment for accurately controlling the polishing depth according to claim 1, wherein a pressure detection member is provided at the pressing end of the pressing telescopic member, and the pressure detection member is used to detect the pressure of the pressing telescopic member on the sample.

8. The polishing equipment for accurately controlling the polishing depth according to claim 1, wherein the rotating and polishing device includes a rotating and polishing table. The turntable and the first driving mechanism are arranged on the rotating and polishing table. A water supply device is provided on the rotating and polishing table. The water supply device includes a water outlet, and the water outlet is aligned with the turntable. The water of the water supply device can flow from the water outlet to the turntable.

9. The polishing equipment for accurately controlling the polishing depth according to claim 8, wherein the rotating and polishing table is provided with a groove, and the turntable protrudes from the groove. The groove is used to receive the water flowing down from the turntable.

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