Automatic wafer film tearing mechanism

Abstract

The application discloses an automatic wafer film tearing mechanism, which comprises a tape supply module and a film tearing execution and workbench dust removal module; the tape supply module comprises a first mounting seat, a tape supply shaft fixed to the first mounting seat, a first tape winding shaft, a first tape clamping shaft, a second tape winding shaft, a tape far end winding shaft, a tape tensioning shaft, a second swing arm shaft, a waste tape collecting shaft and a first swing arm shaft. The application improves product production efficiency and enhances product delivery yield.

Description

TECHNICAL FIELD

[0001] The application relates to the field of packaging of semiconductor products, and particularly relates to an automatic wafer film tearing mechanism. BACKGROUND

[0002] After wafer film pasting, a manual operation mode is used to tear the film, a process flow is complex, a manual operation produces a large error, seriously influences outgoing quality, production efficiency is low, and individual operation skills have different influences on detection results, in a certain sense, higher requirements are put forward for production management, and production cost is increased. SUMMARY

[0003] The application aims to provide an automatic wafer film tearing mechanism, and through a tape supply module and a film tearing execution and workbench dust removal module, production efficiency is improved, and product outgoing yield is improved, so as to solve the problems in the background art.

[0004] The automatic wafer film tearing mechanism is achieved through the following technical scheme: comprising a tape supply module and a film tearing execution and workbench dust removal module.

[0005] The tape supply module comprises a first mounting seat, a tape supply shaft, a first tape winding shaft, a first tape clamping shaft, a second tape winding shaft, a tape distal end winding shaft, a tape tensioning shaft, a second swing arm shaft, a waste tape collection shaft and a first swing arm shaft fixed to the first mounting seat.

[0006] The tape distal end winding shaft, the second tape winding shaft, the first tape clamping shaft and the first tape winding shaft are sequentially fixed above the mounting seat from left to right; the tape tensioning shaft is arranged below the tape distal end winding shaft and the second tape winding shaft, and the tape supply shaft is arranged on one side of the tape tensioning shaft; the second swing arm shaft is arranged below the tape tensioning shaft, and the first swing arm shaft is arranged below the tape supply shaft; the waste tape collection shaft is arranged below one side of the second swing arm shaft.

[0007] As a preferred technical scheme, the film tearing execution and workbench dust removal module comprises a second mounting seat, a third swing arm shaft, a film pressing shaft, a third tape winding shaft and a wafer pressing plate fixed to the second mounting seat.

[0008] The third tape winding shaft is installed above the second mounting seat, and the wafer pressing plate is arranged at the front end of the second mounting seat; the film pressing shaft is arranged below the third tape winding shaft, and the third swing arm shaft is arranged behind the third tape winding shaft; a film tearing platform is arranged below the wafer pressing plate and is flush with the film pressing shaft.

[0009] As a preferred technical scheme, the front end of the film tearing platform is provided with a plasma cleaner.

[0010] The suction nozzle connecting rod is provided above the suction nozzle connecting rod.

[0011] The wafer film tearing can be automatically completed, the production efficiency of products is greatly improved, the product delivery yield is improved, and the problem that manual film tearing cannot be quickly and accurately performed is solved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0013] Figure 1 The schematic structural view of the adhesive tape supply module of the present application is shown in the figure;

[0014] Figure 2 The schematic structural view of the adhesive tape supply module of the present application is shown in the figure;

[0015] Figure 3 The schematic structural view of the film tearing execution and workbench dust removal module of the present application is shown in the figure;

[0016] Figure 4 The schematic structural view of the film tearing execution and workbench dust removal module of the present application is shown in the figure. DETAILED DESCRIPTION

[0017] All features disclosed in this specification, or all steps of any methods or processes disclosed, can be combined in any combination, except combinations where at least some of the features and / or steps are mutually exclusive.

[0018] As shown in the figure, Figure 1 — Figure 2 The automatic wafer film tearing mechanism of the present application includes an adhesive tape supply module 1 and a film tearing execution and workbench dust removal module 2.

[0019] The adhesive tape supply module 1 includes a first mounting seat, an adhesive tape supply shaft 11 fixed to the first mounting seat, a first adhesive tape winding shaft 12, a first adhesive tape clamping shaft 13, a second adhesive tape winding shaft 14, an adhesive tape distal end winding shaft 15, an adhesive tape tensioning shaft 16, a second swing arm shaft 17, a waste adhesive tape collection shaft 18, and a first swing arm shaft 19.

[0020] The tape distal winding shaft 15, the second tape winding shaft 14, the first tape clamping shaft 13, and the first tape winding shaft 12 are fixed above the mounting base from left to right; the tape tensioning shaft 6 is located below the tape distal winding shaft 15 and the second tape winding shaft 14, and the tape supply shaft 11 is located on one side of the tape tensioning shaft 6; the second swing arm shaft 17 is located below the tape tensioning shaft 6, and the first swing arm shaft 19 is located below the tape supply shaft 11; the waste tape collection shaft 18 is located in contact with the side below the second swing arm shaft 17.

[0021] like Figures 3-4 As shown, the film-tearing execution and workbench dust removal module 2 includes a second mounting base and a third swing arm shaft 21, a film-pressing shaft 22, a third tape winding shaft 23 and a wafer pressure plate 24 fixed on the second mounting base;

[0022] The third tape winding shaft 23 is installed above the second mounting base, and the wafer pressure plate 24 is located at the front end of the second mounting base; the film pressing shaft 22 is located below the third tape winding shaft 23, and the third swing arm shaft 21 is located behind the third tape winding shaft 23; the film tearing platform 26 is located below the wafer pressure plate 24 and is flush with the film pressing shaft 22.

[0023] In this embodiment, a plasma cleaner 27 is provided at the front end of the film-tearing platform 15.

[0024] In this embodiment, a suction nozzle connecting rod 25 is installed above the suction nozzle connecting rod 25.

[0025] The working principle is as follows:

[0026] The tape supply module supplies tape, and the new tape is supplied according to... Figure 1 The winding method is as follows: the tape supply shaft extends the tape to the first swing arm shaft, then to the second swing arm shaft of the film tearing actuator, and then to the pressure shaft. The waste tape extends from the pressure shaft of the film tearing mechanism to the third tape winding shaft. The waste tape is conveyed to the first tape winding shaft of module one, from the first tape clamping shaft to the second tape winding shaft, then to the tape tensioning shaft, then to the tape far end winding shaft, then to the second swing arm shaft, and finally the waste tape is wound onto the waste tape winding shaft.

[0027] When the wafer is moved to the film tearing platform by the robot, the nozzle connecting rod is pulled down by the cylinder to make the wafer contact with the workbench, at this time the wafer pressing plate is pressed down by the cylinder to make the wafer and the film tearing platform closely adhere to each other; the pressing plate is lifted, at the same time the adhesive tape tensioning shaft is pushed from the initial lower limit position to the uppermost end by the cylinder to make the adhesive tape loose, the first adhesive tape clamping shaft is also loose, then the film pressing shaft moves from the left position to the right to make the adhesive tape adhere to the wafer film, the third swing arm shaft is pushed by the cylinder to make the adhesive tape and the film pressing shaft clamped, when the film pressing shaft moves to the rightmost end, the upper first adhesive tape clamping shaft is clamped and wound by the motor, the film pressing shaft moves back from the rightmost end to tear off the wafer film, and finally wound on the waste adhesive tape collecting shaft; after the film tearing operation is completed, the plasma cleaner of the workbench dust removal module starts to ventilate the workbench to achieve the dust removal effect.

[0028] The above merely illustrates the specific implementation of the present application, but the protection scope of the present application is not limited to this, any change or replacement without creative labor should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be limited by the protection scope defined in the claims.

Claims

1. An automatic wafer peeling mechanism, characterized in that: It includes a tape supply module (1) and a film tearing and workbench dust removal module (2); The tape supply module (1) includes a first mounting base and a tape supply shaft (11), a first tape winding shaft (12), a first tape clamping shaft (13), a second tape winding shaft (14), a tape distal winding shaft (15), a tape tensioning shaft (16), a second swing arm shaft (17), a waste tape collection shaft (18), and a first swing arm shaft (19) fixed on the first mounting base. The tape distal winding shaft (15), the second tape winding shaft (14), the first tape clamping shaft (13), and the first tape winding shaft (12) are fixed above the mounting base from left to right; the tape tensioning shaft (16) is located below the tape distal winding shaft (15) and the second tape winding shaft (14), and the tape supply shaft (11) is located on one side of the tape tensioning shaft (16); the second swing arm shaft (17) is located below the tape tensioning shaft (16), and the first swing arm shaft (19) is located below the tape supply shaft (11); the waste tape collection shaft (18) is located in contact with the side below the second swing arm shaft (17); The film tearing and workbench dust removal module (2) includes a second mounting base and a third swing arm shaft (21), a film pressing shaft (22), a third tape winding shaft (23), and a wafer pressing plate (24) fixed on the second mounting base. The third tape winding shaft (23) is installed above the second mounting base, and the wafer pressure plate (24) is located at the front end of the second mounting base; the film pressing shaft (22) is located below the third tape winding shaft (23), and the third swing arm shaft (21) is located behind the third tape winding shaft (23); the film tearing platform (26) is located below the wafer pressure plate (24) and is flush with the film pressing shaft (22); A suction nozzle rod (25) is installed above the film-tearing platform (26). The tape supply module supplies tape and winds new tape: the tape supply shaft extends the tape to the first swing arm shaft, then to the second swing arm shaft of the film tearing actuator, and then to the pressure shaft. The waste tape extends from the pressure shaft of the film tearing mechanism to the third tape winding shaft. The waste tape is conveyed to the first tape winding shaft of module one, from the first tape clamping shaft to the second tape winding shaft, then to the tape tensioning shaft, then to the tape far end winding shaft, then to the second swing arm shaft, and finally the waste tape is wound onto the waste tape winding shaft. When the wafer is transferred to the film-tearing platform by the robotic arm, the suction nozzle connecting rod is pulled down by the cylinder, bringing the wafer into contact with the worktable. At this time, the wafer pressure plate is pressed down by the cylinder, making the wafer and the film-tearing platform fit tightly together. The pressure plate is lifted, and at the same time, the tape tensioning shaft is pushed from the initial lower limit position to the uppermost position by the cylinder, causing the tape to loosen. The first tape clamping shaft is also released. Next, the film-pressing shaft moves from the left side to the right side, making the tape adhere to the wafer film. The third swing arm shaft is pushed by the cylinder, making the tape and the film-pressing shaft clamp together. When the film-pressing shaft moves to the rightmost end, the upper first tape clamping shaft clamps and is wound by the motor. The film-pressing shaft moves back from the rightmost end, tearing off the wafer film, and finally winding it onto the waste tape collection shaft.

2. The automatic wafer peeling mechanism according to claim 1, characterized in that: The front end of the film-tearing platform (26) is equipped with a plasma cleaner (27).

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