electronic components

Abstract

Provided is an electronic component including: a capacitor array in which a plurality of multilayer capacitors including a main body and first and second external electrodes are stacked; a first metal frame including a first support portion attached to the first external electrode, a first mounting portion located below the first external electrode and having a first protrusion protruding downward, and a first connection portion connecting the first support portion to the first mounting portion; a second metal frame including a second support portion attached to the second external electrode, a second mounting portion located below the second external electrode and having a second protrusion protruding downward, and a second connection portion connecting the second support portion to the second mounting portion; and an encapsulation portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protrusions formed at predetermined intervals.

Description

[0001] This application is a divisional application of the invention patent application "Electronic Component and Board Thereon Mounted Thereon" filed on August 21, 2020, with application number 202010849197.1. Technical Field

[0002] This disclosure relates to an electronic component and a board on which the electronic component is mounted. Background Technology

[0003] Multilayer capacitors are used in a variety of electronic devices due to their small size and high capacitance.

[0004] Recently, due to the rapid rise of environmentally friendly and electric vehicles, electric drive systems in automobiles are increasing, thus increasing the demand for multilayer capacitors required for automobiles.

[0005] For use as automotive components, high levels of thermal, electrical, and mechanical reliability are required, thus the performance requirements for multilayer capacitors are gradually increasing.

[0006] Therefore, a multilayer capacitor structure that is highly resistant to vibration and deformation is needed.

[0007] To improve vibration and deformation resistance, an electronic component with the following structure is disclosed: a multilayer capacitor is mounted on a plate using a metal frame at predetermined intervals.

[0008] In addition, a stacked capacitor array with multiple multilayer capacitors is disclosed to improve the capacity of the product.

[0009] However, when the aforementioned metal frame is applied to such a capacitor array, the capacitor array is relatively heavier than a single stacked capacitor, which may cause the metal frame to be unable to stably support the capacitor array.

[0010] To address this problem, a structure is disclosed that encapsulates a capacitor array with an external resin material and forms protrusions on the lower surface of the capacitor array to support it.

[0011] However, in existing technology, only one protrusion is applied to the lower surface of the external resin material. Therefore, when electronic components are mounted on the board, the flatness of the encapsulation formed by the external resin material may be distorted, resulting in reduced positional accuracy of the electronic components. Summary of the Invention

[0012] One aspect of the present invention is to provide an electronic component in which a metal frame structure is used and a board on which the electronic component is mounted, wherein a capacitor array including multiple multilayer capacitors is used in the electronic component, the metal frame stably supports the capacitor array, and when the electronic component is mounted on the board, the flatness of the encapsulation portion is prevented from being distorted, so as to prevent the positional accuracy of the electronic component from being reduced.

[0013] According to one aspect of the present invention, an electronic component includes: a capacitor array having a plurality of multilayer capacitors, each of the plurality of multilayer capacitors including a body and a first external electrode and a second external electrode respectively disposed at both ends of the body in a first direction, the plurality of multilayer capacitors being stacked in at least one of a second direction intersecting the first direction and a third direction perpendicular to the first direction and the second direction; a first metal frame including a first support portion attached to the first external electrode of the capacitor array, a first mounting portion located below the first external electrode and having a downwardly projecting first protrusion, and a first connecting portion connecting the first support portion to the first mounting portion; a second metal frame including a second support portion attached to the second external electrode of the capacitor array, a second mounting portion located below the second external electrode and having a downwardly projecting second protrusion, and a second connecting portion connecting the second support portion to the second mounting portion; and an encapsulation portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a plurality of protrusions on the lower surface of the encapsulation portion, the plurality of protrusions being spaced at predetermined intervals.

[0014] The lower end of each of the plurality of protrusions may be located below the first mounting portion and the second mounting portion.

[0015] The plurality of protrusions may include one protrusion near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion.

[0016] The plurality of protrusions may include two or more protrusions near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion, the two or more protrusions being spaced apart from each other in the first direction.

[0017] Each of the plurality of protrusions may be located at the center of the encapsulation portion in the first direction. Each of the plurality of protrusions may be arranged at a position offset from the center of the encapsulation portion in the first direction.

[0018] The plurality of protrusions may be arranged on the lower surface of the encapsulation portion in a diagonal arrangement relative to the second direction.

[0019] The plurality of protrusions may have any of the following shapes: triangular, semi-circular, and quadrilateral, wherein the triangular shape has a pointed lower end, the semi-circular shape has a raised lower end, and the quadrilateral shape has a flat lower end.

[0020] The lowest point of the plurality of protrusions may be arranged at a height lower than or equal to the height of the first mounting portion and the second mounting portion in the third direction.

[0021] The plurality of multilayer capacitors may be arranged side-by-side in the second direction. The first connecting portion may include a first vertical portion extending upward from one end of the first mounting portion in the third direction, a first horizontal portion extending horizontally from the first vertical portion in the first direction, and a second vertical portion extending downward from one end of the first horizontal portion in the third direction and having one end connected to the first support portion. The second connecting portion may include a third vertical portion extending upward from one end of the second mounting portion in the third direction, a second horizontal portion extending horizontally from the third vertical portion in the first direction, and a fourth vertical portion extending downward from one end of the second horizontal portion in the third direction and having one end connected to the second support portion. The first external electrode is attached to the upper surface of the first support portion, and the second external electrode is attached to the upper surface of the second support portion.

[0022] The second vertical portion may be spaced apart from the first external electrode, and the fourth vertical portion may be spaced apart from the second external electrode.

[0023] A conductive bonding layer may be disposed on each of the upper surfaces of the first support portion and the second support portion.

[0024] The plurality of multilayer capacitors may be arranged side-by-side in the second direction and in two rows in the third direction. The first connecting portion may include a fifth vertical portion extending upward in the third direction from one end of the first mounting portion, a third horizontal portion extending horizontally in the first direction from the fifth vertical portion, and a sixth vertical portion extending upward in the third direction from one end of the third horizontal portion and having one end connected to the first support portion. The second connecting portion may include a seventh vertical portion extending upward in the third direction from one end of the second mounting portion, a fourth horizontal portion extending horizontally in the first direction from the seventh vertical portion, and an eighth vertical portion extending upward in the third direction from one end of the fourth horizontal portion and having one end connected to the second support portion. The first external electrode in the lower first row may be attached to the lower surface of the first support portion, the first external electrode in the upper second row may be attached to the upper surface of the first support portion, and the second external electrode in the first row may be attached to the lower surface of the second support portion, and the second external electrode in the second row may be attached to the upper surface of the second support portion.

[0025] The sixth vertical portion may be spaced apart from the first external electrode in the first row below, and the eighth vertical portion may be spaced apart from the second external electrode in the first row below.

[0026] A conductive bonding layer may be disposed on each of the upper and lower surfaces of the first support portion and on each of the upper and lower surfaces of the second support portion.

[0027] Each of the first protrusion and the second protrusion may be configured as multiple protrusions.

[0028] The body of each of the plurality of multilayer capacitors includes: a dielectric layer; and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and the dielectric layer being located between the first inner electrode and the second inner electrode, and the first inner electrode and the second inner electrode being exposed through two surfaces of the body in the first direction such that one end of the first inner electrode is connected to the first outer electrode and one end of the second inner electrode is connected to the second outer electrode.

[0029] The first external electrode includes a first head and a first strip, and the second external electrode includes a second head and a second strip. The first head and the second head are respectively disposed on two surfaces of the body in the first direction, and the first strip and the second strip extend from the first head and the second head to a portion of the lower surface of the body.

[0030] The first support portion of the first metal frame is attached to the first strip portion of the first external electrode, and the second support portion of the second metal frame is attached to the second strip portion of the second external electrode.

[0031] According to another aspect of this disclosure, a board on which electronic components are mounted includes: a board having a first pad pattern and a second pad pattern spaced apart from each other on an upper surface of the board, and electronic components mounted such that the first protrusion and the second protrusion contact the first pad pattern and the second pad pattern of the board, respectively. Attached Figure Description

[0032] The above and other aspects, features and other advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0033] Figure 1 This is a schematic perspective view of a multilayer capacitor applied to embodiments of this disclosure;

[0034] Figure 2A and 2B These are respectively shown as applied to Figure 1 A plan view of the first and second internal electrodes of a multilayer capacitor.

[0035] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I';

[0036] Figure 4 This is a perspective view showing an electronic component according to an embodiment of the present disclosure;

[0037] Figure 5 It is shown Figure 4 A perspective view of the bottom surface of the encapsulation portion;

[0038] Figure 6 and Figure 7 These are perspective views showing examples of variations of the protrusion;

[0039] Figure 8 It is shown Figure 4 A perspective view of the electronic components without the encapsulation.

[0040] Figure 9 It is shown Figure 4 Perspective view of the first and second metal frames in the design;

[0041] Figure 10 It is along Figure 4 A cross-sectional view taken from line I-I';

[0042] Figure 11This is a perspective view showing an electronic component according to another embodiment of the present disclosure;

[0043] Figure 12 It is shown Figure 11 A perspective view of the bottom surface of the encapsulation portion;

[0044] Figure 13 It is shown Figure 11 A perspective view of the electronic components without the encapsulation.

[0045] Figure 14 It is shown Figure 13 A perspective view showing the removal of a row of multilayer capacitors on the top side of the electronic components;

[0046] Figure 15 It is shown Figure 11 Perspective view of the first and second metal frames in the design;

[0047] Figure 16 It is along Figure 11 A cross-sectional view taken from line I-I';

[0048] Figure 17 and Figure 18 They are shown respectively Figure 10 Another form of cross-sectional view of the protrusion in the middle; and

[0049] Figure 19 This is a schematic cross-sectional view showing an electronic component mounted on a board according to an embodiment of the present disclosure. Detailed Implementation

[0050] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0051] However, this disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0052] Throughout this specification, it will be understood that when an element (such as a layer, region, or wafer (substrate)) is referred to as being "on" another element, "connected" to another element, or "bonded" to another element, the element may be directly "on" said other element, "connected" to said other element, or "bonded" to said other element, or other elements may be present in between. In contrast, when an element is referred to as being "directly on" another element, "directly connected" to another element, or "directly bonded" to another element, no elements or layers may be present in between. Similar notations always indicate similar elements. As used herein, the term "and / or" includes any one or two or more of the associated listed items, and all combinations thereof.

[0053] It will be apparent that although the terms first, second, third, etc., may be used herein to describe various components, assemblies, regions, layers, and / or parts, these components, assemblies, regions, layers, and / or parts should not be limited to these terms. These terms are used only to distinguish one component, assembly, region, layer, or part from another component, assembly, region, layer, or part. Therefore, without departing from the teachings of the exemplary embodiments, the first component, first assembly, first region, first layer, or first part discussed below may be referred to as a second component, second assembly, second region, second layer, or second part.

[0054] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein to describe the relationship between one element and another, as shown in the accompanying drawings. It will be understood that the spatial relative terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” of other elements or features would then be positioned as being “below” or “under” said other elements or features. Therefore, the term “above” may include both above and below orientations depending on the specific orientation of the drawings. The device may be otherwise positioned (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0055] The terminology used herein describes particular embodiments only and is not intended to limit this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that, when used in the specification, the terms “comprising” and / or “including” enumerate the presence of the stated features, integers, steps, operations, components, elements, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, elements, and / or groups thereof.

[0056] In the following description, embodiments of the present disclosure will be illustrated with reference to schematic diagrams showing embodiments of the present disclosure. In the drawings, variations in the shapes shown may be estimated, for example, due to manufacturing techniques and / or tolerances. Therefore, embodiments of the present disclosure should not be construed as limited to specific shapes in the areas shown herein, but should be interpreted as including shape variations due to manufacturing processes. The following embodiments may also be constituted by one or a combination thereof.

[0057] The contents of this disclosure described below may have various configurations, and only the required configurations are presented herein, but are not limited thereto.

[0058] An electronic component according to an embodiment of the present disclosure includes: a capacitor array in which a plurality of multilayer capacitors are stacked in at least one of a second direction intersecting a first direction and a third direction perpendicular to the first and second directions, the plurality of multilayer capacitors including a body and a first external electrode and a second external electrode respectively formed at both ends of the body in the first direction; a first metal frame including a first support portion coupled to the first external electrode of the capacitor array, a first mounting portion located below the first external electrode and having a downwardly projecting first protrusion, and a first connecting portion connecting the first support portion to the first mounting portion; a second metal frame including a second support portion coupled to the second external electrode of the capacitor array, a second mounting portion located below the second external electrode and having a downwardly projecting second protrusion, and a second connecting portion connecting the second support portion to the second mounting portion; and an encapsulation portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protrusions formed at predetermined intervals.

[0059] When directions are defined to clearly describe the embodiments in this disclosure, X, Y, and Z in the drawings indicate the length direction (or first direction), width direction (or second direction), and thickness direction (or third direction) of the multilayer capacitor and electronic components, respectively.

[0060] Here, in the embodiments, the Z direction can be used to have the same meaning as the stacking direction of dielectric layers stacked on top of each other.

[0061] Figure 1 This is a schematic perspective view illustrating a multilayer capacitor applied to embodiments of the present disclosure. Figure 2A and Figure 2B This shows the application to Figure 1 A plan view of the first and second internal electrodes of a multilayer capacitor. Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0062] First, refer to Figures 1 to 3The structure of a multilayer capacitor 100 applied to an electronic component according to an embodiment will be described.

[0063] Reference Figures 1 to 3 According to an embodiment, the multilayer capacitor 100 includes a body 110 and a first external electrode 131 and a second external electrode 132 respectively formed on both ends of the body 110 in the X direction.

[0064] Multiple dielectric layers 111 forming the body 110 are stacked in the Z direction and then sintered, and adjacent dielectric layers 111 of the body 110 are integrated, such that the boundaries between them may not be obvious without the use of a scanning electron microscope (SEM).

[0065] In addition, the main body 110 includes a plurality of dielectric layers 111 and a first inner electrode 121 and a second inner electrode 122 having different polarities and arranged alternately in the Z direction, and the dielectric layers 111 are inserted between the first inner electrode 121 and the second inner electrode 122.

[0066] In addition, the main body 110 may include an active region and cover regions 112 and 113, the active region serving as a portion that contributes to the formation of a capacitor, and the cover regions 112 and 113 being formed on the upper and lower portions of the active region in the Z direction as edge portions.

[0067] The shape of the aforementioned body 110 is not limited and may have a hexahedral shape. The body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in the Z direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the X direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other.

[0068] The dielectric layer 111 may include ceramic powder, such as BaTiO3-based ceramic powder.

[0069] BaTiO3-based ceramic powder can be in which Ca or Zr is partially dissolved in BaTiO3 (Ba 1-x Ca x TiO3, Ba(Ti 1-y Ca y O3、(Ba 1-x Ca x (Ti) 1-y Zr y O3, Ba(Ti 1-y Zr y O3, etc., but the embodiments disclosed herein are not limited thereto.

[0070] In addition, ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can also be added to the dielectric layer 111 together with the ceramic powder.

[0071] Ceramic additives may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc.

[0072] The first inner electrode 121 and the second inner electrode 122 are electrodes to which charges of different polarities are applied, formed on the dielectric layer 111 and stacked in the Z direction, and the first inner electrode 121 and the second inner electrode 122 may be alternately arranged inside the body 110 so as to be opposite each other in the Z direction and a single dielectric layer 111 is inserted between the first inner electrode 121 and the second inner electrode 122.

[0073] In this case, the first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by a dielectric layer 111 inserted therebetween.

[0074] Furthermore, embodiments of this disclosure show and describe a structure in which the inner electrodes are stacked in the Z direction. However, embodiments of this disclosure are not limited thereto and can be applied as needed to a structure in which the inner electrodes are stacked in the Y direction.

[0075] One end of the first inner electrode 121 and one end of the second inner electrode 122 can be exposed through the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0076] The ends of the first inner electrode 121 and the second inner electrode 122, which are alternately exposed by the third surface 3 and the fourth surface 4 of the body 110, can respectively contact and be electrically connected to the first outer electrode 131 and the second outer electrode 132 (described later) disposed at both ends of the body 110 in the X direction.

[0077] According to the above configuration, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, charge accumulates between the first internal electrode 121 and the second internal electrode 122.

[0078] In this case, the capacitance of the multilayer capacitor 100 is proportional to the overlap area between the first inner electrode 121 and the second inner electrode 122 that overlap in the Z direction in the active region.

[0079] Furthermore, there are no particular limitations on the materials used to form the first internal electrode 121 and the second internal electrode 122. For example, the first internal electrode and the second internal electrode can be formed using a noble metal material or a conductive paste formed using at least one of nickel (Ni) and copper (Cu).

[0080] In this case, methods such as screen printing or gravure printing of conductive paste can be used, but this disclosure is not limited thereto.

[0081] The first external electrode 131 and the second external electrode 132 are provided with voltages of different polarities, and the first external electrode and the second external electrode are respectively disposed at both ends of the body 110 in the X direction and are in contact with and electrically connected to the exposed ends of the first internal electrode 121 and the second internal electrode 122.

[0082] The first external electrode 131 may include a first head 131a and a first strip 131b.

[0083] The first head 131a is disposed on the third surface 3 of the body 110 and contacts the end of the first inner electrode 121 exposed to the outside through the third surface 3 of the body 110, so as to physically connect and electrically connect the first inner electrode 121 to the first outer electrode 131.

[0084] The first strip 131b is a portion that extends from the first head 131a to a part of the first surface 1 of the body 110.

[0085] In this case, the first strip 131b may extend further from the first head 131a to a portion of the second surface 2, the fifth surface 5, and the sixth surface 6 of the body 110 to improve adhesion strength.

[0086] The second external electrode 132 may include a second head 132a and a second strip 132b.

[0087] The second head 132a is disposed on the fourth surface 4 of the body 110 and contacts the end of the second inner electrode 122 exposed to the outside through the fourth surface 4 of the body 110, so as to physically and electrically connect the second inner electrode 122 to the second outer electrode 132.

[0088] The second strip 132b is a portion that extends from the second head 132a to a part of the first surface 1 of the body 110.

[0089] In this case, the second strip 132b may extend further from the second head 132a to a portion of the second surface 2, the fifth surface 5 and the sixth surface 6 of the body 110 to improve adhesion strength.

[0090] In an embodiment, the first external electrode 131 and the second external electrode 132 are configured as sintered electrodes, the sintered electrodes comprising at least one metal component selected from copper (Cu) and nickel (Ni), and excluding noble metals.

[0091] Furthermore, the first external electrode 131 and the second external electrode 132 are formed using a sintered metal containing copper, and the first plating layer and the second plating layer can be further formed on the surface of the first external electrode and the surface of the second external electrode.

[0092] In addition, the first plating layer includes a first nickel plating layer covering the surface of the first external electrode 131 and a first tin (Sn) plating layer covering the first nickel plating layer, and the second plating layer includes a second nickel plating layer covering the surface of the second external electrode 132 and a second tin (Sn) plating layer covering the second nickel plating layer.

[0093] Figure 4 This is a perspective view illustrating an electronic component according to an embodiment of the present disclosure. Figure 5 It is shown Figure 4 A perspective view of the bottom surface of the encapsulation portion. Figure 8 It is shown Figure 4 A perspective view of the electronic components without the encapsulation. Figure 9 It is shown Figure 4 Perspective view of the first and second metal frames in the design. Figure 10 It is along Figure 4 The cross-sectional view taken from line I-I'.

[0094] Reference Figure 4 , Figure 5 , Figure 8 , Figure 9 and Figure 10 The electronic component according to the embodiment includes a capacitor array in which two multilayer capacitors 100 are stacked in the Y direction (second direction), a first metal frame 140 connected to a first external electrode 131 of the capacitor array, a second metal frame 150 connected to a second external electrode 132 of the capacitor array, and an encapsulation portion 160.

[0095] The first metal frame 140 includes a first support portion 145, a first mounting portion 141, and a first connecting portion.

[0096] The first support portion 145 (the portion that is attached to the first strip portion 131b of the two first external electrodes 131) is electrically and physically connected to the first strip portion 131b of the two first external electrodes 131.

[0097] When mounted on a board, the first mounting portion 141 (the portion located below the two first external electrodes 131 in the Z direction) can be used as a connection terminal.

[0098] In addition, the first mounting part 141 is provided with a first protrusion 141a that protrudes downward on the lower surface.

[0099] When electronic components are mounted on the board, the first protrusion 141a is configured to contact the pad pattern for laser soldering.

[0100] In the embodiment, two first protrusions 141a are shown and described as being spaced apart from each other in the Y direction, but the first protrusions may be configured as only one first protrusion or three or more first protrusions on the lower surface of the first mounting portion.

[0101] The first connecting portion is the portion that connects the first support portion 145 to the first mounting portion 141, and may include a first vertical portion 142 extending upward from one end of the first mounting portion 141, a first horizontal portion 143 extending horizontally from the first vertical portion 142, and a second vertical portion 144 extending downward from one end of the first horizontal portion 143 and having one end connected to the first support portion 145.

[0102] According to the stepped structure of the first connection, the load transmitted from the capacitor array is distributed through the first metal frame 140 to support the capacitor array more stably, and the elastic force of the first metal frame 140 is increased to further reduce the vibration transmitted from the capacitor array.

[0103] In this case, the first strip portion 131b of the first external electrode 131 can be attached to the upper surface of the first support portion 145.

[0104] The second metal frame 150 includes a second support portion 155, a second mounting portion 151, and a second connecting portion.

[0105] The second support portion 155 (the portion that is attached to the second strip portion 132b of the two second external electrodes 132) can be electrically and physically connected to the second strip portion 132b of the two second external electrodes 132.

[0106] When mounted on a board, the second mounting portion 151 (the portion located below the two second external electrodes 132 in the Z direction) can be used as a connection terminal.

[0107] In addition, the second mounting part 151 is provided with a second protrusion 151a that protrudes downward on the lower surface.

[0108] When electronic components are mounted on the board, the second protrusion 151a is configured to contact the pad pattern for laser soldering.

[0109] In the embodiment, two second protrusions 151a are shown and described as being spaced apart from each other in the Y direction, but the second protrusions may be configured as only one second protrusion or three or more second protrusions on the lower surface of the second mounting portion.

[0110] The second connecting portion is the portion that connects the second support portion 155 to the second mounting portion 151, and may include a third vertical portion 152 extending upward from one end of the second mounting portion 151, a second horizontal portion 153 extending horizontally from the third vertical portion 152, and a fourth vertical portion 154 extending downward from one end of the second horizontal portion 153 and having one end connected to the second support portion 155.

[0111] According to an exemplary embodiment, the second vertical portion 144 and the fourth vertical portion 154 may be spaced apart from the first external electrode 131 and the second external electrode 132, respectively.

[0112] According to the stepped structure of the second connection, the load transmitted from the capacitor array is distributed by the second metal frame 150 to support the capacitor array more stably, and the elastic force of the second metal frame 150 is increased to further reduce the vibration transmitted from the capacitor array.

[0113] In this case, the second strip portion 132b of the second external electrode 132 can be attached to the upper surface of the second support portion 155.

[0114] In addition, the first conductive bonding layer 191 is disposed between the first external electrode 131 and the first support portion 145, while the second conductive bonding layer 192 is disposed between the second external electrode 132 and the second support portion 155.

[0115] The first conductive bonding layer 191 may be disposed between the first strip portion 131b of the first external electrode 131 and the first support portion 145 of the first metal frame 140.

[0116] Furthermore, the first conductive bonding layer 191 may be formed using the same metal composition as the first strip portion 131b of the first external electrode 131 as the main component.

[0117] The second conductive bonding layer 192 may be disposed between the second strip portion 132b of the second external electrode 132 and the second support portion 155 of the second metal frame 150.

[0118] Furthermore, the second conductive bonding layer 192 may be formed using the same metal composition as the second strip portion 132b of the second external electrode 132 as the main component.

[0119] Encapsulation portion 160 can encapsulate the capacitor array to expose the first mounting portion 141 of the first metal frame 140 and the second mounting portion 151 of the second metal frame 150.

[0120] The encapsulation portion 160 can be used to improve moisture resistance reliability and can be formed using resin materials such as epoxy resin or silica-based epoxy molding compound (EMC), but the embodiments disclosed herein are not limited thereto.

[0121] In this case, multiple protrusions 161 and 162 are formed on the lower surface of the encapsulation portion 160.

[0122] The protrusion is located between the encapsulation portion 160 and the plate to stably support the weight of the capacitor array when the electronic components are mounted on the plate.

[0123] Furthermore, in the embodiment, protrusions 161 and 162 are configured as a plurality of protrusions formed on the lower surface of the encapsulation portion to prevent the flatness of the encapsulation portion 160 from being distorted when the electronic components are mounted on the board, thereby preventing a reduction in the positional accuracy of the electronic components.

[0124] Furthermore, the lowest ends of the plurality of protrusions 161 and 162 may preferably be arranged at a height lower than or equal to the height of the first mounting portion 141 and the second mounting portion 151 in order to stably support the encapsulation portion.

[0125] Additionally, the plurality of protrusions 161 and 162 may be configured as protrusions near each of two edges opposite each other in the Y direction on the lower surface of the encapsulation portion.

[0126] In this case, each of the protrusions 161 and 162 may be located at the center of the encapsulation portion 160 in the X direction (first direction).

[0127] However, embodiments of this disclosure are not limited thereto, and each of the protrusions 161 and 162 may be located at a position offset from the center of the encapsulation portion 160 in a first direction, and if necessary, the protrusions may be sequentially formed in positions in the Y direction other than positions opposite each other.

[0128] For example, such as Figure 6 As shown, each of the two protrusions 161 and 162 may be formed on the lower surface of the encapsulation portion 160 so as to be arranged diagonally relative to the Y direction.

[0129] In addition, such as Figure 7 As shown, according to embodiments of the present disclosure, protrusions 161a, 161b, 162a and 162b may be provided as two or more protrusions on the lower surface of the encapsulation portion 160 near two edges opposite each other in the Y direction and spaced apart from each other in the X direction.

[0130] In addition, Figure 7 The illustration shows two protrusions spaced apart from each other in the X direction near one edge of the encapsulation, but embodiments of this disclosure are not limited thereto. Optionally, three or more protrusions may be spaced apart from each other near one edge of the encapsulation.

[0131] Furthermore, in embodiments, the plurality of protrusions 161 and 162 may have a triangular shape with a pointed lower end, but embodiments of this disclosure are not limited thereto. For example, as Figure 17 As shown, the protrusion 163 may have a semi-circular shape, with a raised lower end. Optionally, as... Figure 18As shown, the protrusion 164 may have a quadrilateral shape with a flat lower surface. Additionally, according to embodiments of this disclosure, the plurality of protrusions 161 and 162 may be sheets having a predetermined thickness in the Y direction.

[0132] Figure 11 This is a perspective view illustrating an electronic component according to another embodiment of the present disclosure. Figure 12 It is shown Figure 11 A perspective view of the bottom surface of the encapsulation portion. Figure 13 It is shown Figure 11 The electronic components in the image have had their encapsulation removed from the perspective view. Figure 14 It is shown Figure 13 The electronic components in the diagram have had a row of multilayer capacitors removed from the top. (Perspective view) Figure 15 It is shown Figure 11 Perspective view of the first and second metal frames in the design. Figure 16 It is along Figure 11 The cross-sectional view taken from line I-I'.

[0133] Here, the structure of the multilayer capacitor is similar to that of the embodiment described above, and therefore its detailed description will be omitted to avoid repetition. For example, the first protrusion 171a and the second protrusion 181a, protrusions 161' and 162' according to this embodiment are the same as the first protrusion 141a and the second protrusion 151a, protrusions 161 and 162 according to the embodiment described above, and their detailed description will be omitted here. In addition, the shape of the first metal frame and the second metal frame having a structure different from that of the above embodiment, as well as the arrangement structure of the plurality of stacked capacitors, will be described in detail with reference to the accompanying drawings.

[0134] Reference Figures 11 to 16 In the capacitor array according to the embodiment, a plurality of multilayer capacitors 100 arranged side by side in the Y direction (a second direction intersecting the first direction) are arranged in two rows in the Z direction (a third direction).

[0135] Here, in an embodiment, the capacitor array has a structure in which four multilayer capacitors 100 are arranged in a 2×2 array.

[0136] In addition, the encapsulation portion 160' encapsulates the capacitor array and brings the first metal frame 170 and the second metal frame 180 out to the outside.

[0137] Additionally, the first connecting portion of the first metal frame 170 may include a fifth vertical portion 172 extending upward from one end of the first mounting portion 171, a third horizontal portion 173 extending horizontally from the fifth vertical portion 172, and a sixth vertical portion 174 extending upward from one end of the third horizontal portion 173 and having one end connected to the first support portion 175.

[0138] In addition, the second connection portion of the second metal frame 180 may include a seventh vertical portion 182 extending upward from one end of the second mounting portion 181, a fourth horizontal portion 183 extending horizontally from the seventh vertical portion 182, and an eighth vertical portion 184 extending upward from one end of the fourth horizontal portion 183 and having one end connected to the second support portion 185.

[0139] Additionally, the plurality of first external electrodes 131 in the lower first row can be attached to the lower surface of the first support portion 175, the plurality of first external electrodes 131 in the upper second row can be attached to the upper surface of the first support portion 175, and the plurality of second external electrodes 132 in the lower first row can be attached to the lower surface of the second support portion 185, and the plurality of second external electrodes 132 in the upper second row can be attached to the upper surface of the second support portion 185.

[0140] In this case, the third conductive bonding layer 193 may be disposed between the first strip portion of the first external electrode 131 of the multilayer capacitor arranged in the lower first row and the lower surface of the first support portion 175, while the fourth conductive bonding layer 195 may be disposed between the first strip portion of the first external electrode 131 of the multilayer capacitor arranged in the upper second row and the upper surface of the first support portion 175.

[0141] In addition, the fifth conductive bonding layer 194 may be disposed between the second strip portion of the second external electrode 132 of the multilayer capacitor arranged in the lower first row and the lower surface of the second support portion 185, while the sixth conductive bonding layer 196 may be disposed between the second strip portion of the second external electrode 132 of the multilayer capacitor arranged in the upper second row and the upper surface of the second support portion 185.

[0142] Figure 19 This is a schematic cross-sectional view showing an electronic component mounted on a board according to an embodiment of the present disclosure.

[0143] Reference Figure 19 According to an embodiment, a board on which electronic components are mounted includes a board 210 and a first pad pattern 221 and a second pad pattern 222 spaced apart from each other on the upper surface of the board 210.

[0144] In this configuration, while the electronic components are mounted on board 210, the first protrusion 141a of the first mounting portion 141 of the first metal frame 140 is positioned to contact and connect with the upper part of the first pad pattern 221, and the second protrusion 151a of the second mounting portion 151 of the second metal frame 150 is positioned to contact and connect with the upper part of the second pad pattern 222.

[0145] In one embodiment, electronic components including a metal frame can be mounted on the plate by laser welding a first protrusion and a second protrusion.

[0146] When multilayer capacitors according to existing technology are mounted on a board, the capacitor body and the board are in direct contact with each other through solder. Therefore, thermal or mechanical deformation that occurs in the board is directly transferred to the multilayer capacitor, making it difficult to ensure a high level of reliability.

[0147] However, in this embodiment, the first metal frame and the second metal frame are integrated into the two surfaces of the multilayer capacitor in the X direction to ensure the gap between the multilayer capacitor and the board on which the electronic components are mounted, preventing stress from the board from being directly transmitted to the multilayer capacitor, thus improving reliability.

[0148] Furthermore, according to existing technology, in electronic components with structures incorporating metal frames, solder is used to fix the pad patterns of the board and the metal frame of the multilayer capacitor.

[0149] In this situation, when soldering is performed to mount electronic components onto a board, the joint between the metal frame and the multilayer capacitor often melts and separates from each other due to the reflow soldering temperature.

[0150] In one embodiment, a protrusion is formed in the mounting portion, so that the protrusion and the pad pattern come into contact with each other and are laser welded together, thus the metal frame and the pad pattern are joined together.

[0151] Therefore, the installation density is increased in a limited space, and sufficient insulation distance is ensured between the left and right metal frames, thus ensuring insulation between adjacent electronic components, and solving the separation problem between the metal frames and multilayer capacitors caused by welding according to the prior art.

[0152] Furthermore, when the electronic component according to the embodiment is mounted on the board, the protrusion protruding from the lower surface of the encapsulation portion contacts the upper part of the board to check the mounting position of the electronic component, thus improving the positional accuracy when the electronic component is mounted on the board.

[0153] As described above, in an exemplary embodiment of the invention, the capacitor array is encapsulated by an encapsulation portion, and a plurality of protrusions are formed on the lower surface of the encapsulation portion. Thus, the metal frame stably supports the capacitor array and prevents the flatness of the encapsulation portion from being distorted when the electronic components are mounted on the board, and thus prevents the positional accuracy of the electronic components from being reduced.

[0154] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. An electronic component, comprising: A capacitor array having multiple multilayer capacitors, each of the multiple multilayer capacitors including a body and a first external electrode and a second external electrode, the first external electrode and the second external electrode including a first head and a second head respectively disposed on two surfaces of the body in a first direction, and a first strip portion and a second strip portion respectively extending from the first head and the second head to a portion of the lower surface of the body, the multiple multilayer capacitors being stacked in at least one of a second direction intersecting the first direction and a third direction perpendicular to the first direction and the second direction. The first metal frame includes a first support portion attached to the first strip portion of the first external electrode of the capacitor array, a first mounting portion located below the first external electrode, and a first connecting portion connecting the first mounting portion to the first support portion. The first connecting portion includes a first portion extending upward from the first mounting portion, a second portion extending horizontally from the first portion of the first connecting portion in the first direction, and a third portion extending upward or downward from the second portion of the first connecting portion and contacting the first support portion. The second metal frame includes a second support portion attached to the second strip portion of the second external electrode of the capacitor array, a second mounting portion located below the second external electrode, and a second connecting portion connecting the second mounting portion to the second support portion. The second connecting portion includes a first portion extending upward from the second mounting portion, a second portion extending horizontally from the first portion of the second connecting portion in the first direction, and a third portion extending upward or downward from the second portion of the second connecting portion and contacting the second support portion. as well as An encapsulation portion encapsulates the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame. The first external electrode and the second external electrode are formed using sintered electrodes containing at least one metal component. The first mounting portion and the second mounting portion extend in the first direction in directions opposite to each other, and The conductive bonding layer is disposed in the third-party direction between the first support portion and the first strip portion and between the second support portion and the second strip portion.

2. The electronic component according to claim 1, wherein, The encapsulating portion has a plurality of protrusions on the lower surface of the encapsulating portion, and the plurality of protrusions are spaced apart by a predetermined interval.

3. The electronic component according to claim 2, wherein, The plurality of protrusions includes one protrusion near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion.

4. The electronic component according to claim 3, wherein, Each of the plurality of protrusions is located at the center of the encapsulation portion in the first direction.

5. The electronic component according to claim 3, wherein, Each of the plurality of protrusions is arranged at a position offset from the center of the encapsulation in the first direction.

6. The electronic component according to claim 3, wherein, The plurality of protrusions are arranged on the lower surface of the encapsulation portion in a diagonal configuration relative to the second direction.

7. The electronic component according to claim 2, wherein, The plurality of protrusions includes two or more protrusions near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion, the two or more protrusions being spaced apart from each other in the first direction.

8. The electronic component according to claim 2, wherein, The plurality of protrusions have any one of the following shapes: triangular, semi-circular, and quadrilateral, wherein the triangular shape has a pointed lower end, the semi-circular shape has a raised lower end, and the quadrilateral shape has a flat lower end.

9. The electronic component according to claim 2, wherein, The lowest point of the plurality of protrusions is arranged at a height that is lower than or equal to the height of the first mounting portion and the second mounting portion in the third direction.

10. The electronic component according to any one of claims 1-9, wherein, The plurality of multilayer capacitors are arranged side by side in the second direction. The first connecting portion includes a first vertical portion extending upward from one end of the first mounting portion on the third side, a first horizontal portion extending horizontally from the first vertical portion in the first direction, and a second vertical portion extending downward from one end of the first horizontal portion on the third side and having one end connected to the first support portion. The second connecting portion includes a third vertical portion extending upward from one end of the second mounting portion in the third direction, a second horizontal portion extending horizontally from the third vertical portion in the first direction, and a fourth vertical portion extending downward from one end of the second horizontal portion in the third direction and having one end connected to the second support portion. The first strip portion of the first external electrode is attached to the upper surface of the first support portion, and the second strip portion of the second external electrode is attached to the upper surface of the second support portion.

11. The electronic component according to claim 10, wherein, The second vertical portion is spaced apart from the first external electrode, and the fourth vertical portion is spaced apart from the second external electrode.

12. The electronic component according to claim 10, wherein, The conductive bonding layer is disposed on each of the upper surfaces of the first support portion and the second support portion.

13. The electronic component according to any one of claims 1-9, wherein, The plurality of multilayer capacitors are arranged side by side in the second direction and in two rows in the third direction. The first connecting portion includes a fifth vertical portion extending upward from one end of the first mounting portion in the third direction, a third horizontal portion extending horizontally from the fifth vertical portion in the first direction, and a sixth vertical portion extending upward from one end of the third horizontal portion in the third direction and having one end connected to the first support portion. The second connecting portion includes a seventh vertical portion extending upward from one end of the second mounting portion in the third direction, a fourth horizontal portion extending horizontally from the seventh vertical portion in the first direction, and an eighth vertical portion extending upward from one end of the fourth horizontal portion in the third direction and having one end connected to the second support portion. The first strip portion of the first external electrode in the first row on the lower side is attached to the lower surface of the first support portion, the first strip portion of the first external electrode in the second row on the upper side is attached to the upper surface of the first support portion, and the second strip portion of the second external electrode in the first row is attached to the lower surface of the second support portion, and the second strip portion of the second external electrode in the second row is attached to the upper surface of the second support portion.

14. The electronic component according to claim 13, wherein, The sixth vertical portion is spaced apart from the first external electrode in the first row below, and the eighth vertical portion is spaced apart from the second external electrode in the first row below.

15. The electronic component according to claim 13, wherein, The conductive bonding layer is disposed on each of the upper and lower surfaces of the first support portion and on each of the upper and lower surfaces of the second support portion.

16. The electronic component according to claim 1, wherein, The first mounting portion has a downwardly protruding first protrusion, and the second mounting portion has a downwardly protruding second protrusion.

17. The electronic component according to claim 16, wherein, Each of the first protrusion and the second protrusion is configured as a plurality of protrusions.

18. The electronic component according to claim 1, wherein, The body of each of the plurality of multilayer capacitors includes: Dielectric layer; and A first inner electrode and a second inner electrode are alternately stacked, with a dielectric layer between the first inner electrode and the second inner electrode, and the first inner electrode and the second inner electrode are exposed through two surfaces of the body in the first direction, such that one end of the first inner electrode is connected to the first outer electrode and one end of the second inner electrode is connected to the second outer electrode.

19. An electronic component, comprising: A capacitor array having multiple multilayer capacitors, each of the multiple multilayer capacitors including a body and a first external electrode and a second external electrode, the first external electrode and the second external electrode including a first head and a second head respectively disposed on two surfaces of the body in a first direction, and a first strip portion and a second strip portion respectively extending from the first head and the second head to a portion of the lower surface of the body, the multiple multilayer capacitors being stacked in at least one of a second direction intersecting the first direction and a third direction perpendicular to the first direction and the second direction. The first metal frame includes a first support portion attached to the first strip portion of the first external electrode of the capacitor array, a first mounting portion located below the first external electrode, and a first connecting portion connecting the first mounting portion to the first support portion. The first connecting portion includes a first portion extending upward from the first mounting portion, a second portion extending horizontally from the first portion of the first connecting portion in the first direction, and a third portion extending upward or downward from the second portion of the first connecting portion and contacting the first support portion. The second metal frame includes a second support portion attached to the second strip portion of the second external electrode of the capacitor array, a second mounting portion located below the second external electrode, and a second connecting portion connecting the second mounting portion to the second support portion. The second connecting portion includes a first portion extending upward from the second mounting portion, a second portion extending horizontally from the first portion of the second connecting portion in the first direction, and a third portion extending upward or downward from the second portion of the second connecting portion and contacting the second support portion. as well as An encapsulation portion encapsulates the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame. Wherein, the first external electrode and the second external electrode are formed using sintered electrodes containing at least one metal component, and The conductive bonding layer is disposed in the third-party direction between the first support portion and the first strip portion and between the second support portion and the second strip portion.

20. The electronic component according to claim 19, wherein, The encapsulating portion has a plurality of protrusions on the lower surface of the encapsulating portion, and the plurality of protrusions are spaced apart by a predetermined interval.

21. The electronic component according to claim 20, wherein, The plurality of protrusions includes one protrusion near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion.

22. The electronic component according to claim 21, wherein, Each of the plurality of protrusions is located at the center of the encapsulation portion in the first direction.

23. The electronic component according to claim 21, wherein, Each of the plurality of protrusions is arranged at a position offset from the center of the encapsulation in the first direction.

24. The electronic component according to claim 21, wherein, The plurality of protrusions are arranged on the lower surface of the encapsulation portion in a diagonal configuration relative to the second direction.

25. The electronic component according to claim 20, wherein, The plurality of protrusions includes two or more protrusions near each of two edges opposite to each other in the second direction on the lower surface of the encapsulation portion, the two or more protrusions being spaced apart from each other in the first direction.

26. The electronic component according to claim 20, wherein, The plurality of protrusions have any one of the following shapes: triangular, semi-circular, and quadrilateral, wherein the triangular shape has a pointed lower end, the semi-circular shape has a raised lower end, and the quadrilateral shape has a flat lower end.

27. The electronic component according to claim 20, wherein, The lowest point of the plurality of protrusions is arranged at a height that is lower than or equal to the height of the first mounting portion and the second mounting portion in the third direction.

28. The electronic component according to any one of claims 19-27, wherein, The plurality of multilayer capacitors are arranged side by side in the second direction. The first connecting portion includes a first vertical portion extending upward from one end of the first mounting portion on the third side, a first horizontal portion extending horizontally from the first vertical portion in the first direction, and a second vertical portion extending downward from one end of the first horizontal portion on the third side and having one end connected to the first support portion. The second connecting portion includes a third vertical portion extending upward from one end of the second mounting portion in the third direction, a second horizontal portion extending horizontally from the third vertical portion in the first direction, and a fourth vertical portion extending downward from one end of the second horizontal portion in the third direction and having one end connected to the second support portion. The first strip portion of the first external electrode is attached to the upper surface of the first support portion, and the second strip portion of the second external electrode is attached to the upper surface of the second support portion.

29. The electronic component according to claim 28, wherein, The second vertical portion is spaced apart from the first external electrode, and the fourth vertical portion is spaced apart from the second external electrode.

30. The electronic component according to claim 28, wherein, The conductive bonding layer is disposed on each of the upper surfaces of the first support portion and the second support portion.

31. The electronic component according to any one of claims 19-27, wherein, The plurality of multilayer capacitors are arranged side by side in the second direction and in two rows in the third direction. The first connecting portion includes a fifth vertical portion extending upward from one end of the first mounting portion in the third direction, a third horizontal portion extending horizontally from the fifth vertical portion in the first direction, and a sixth vertical portion extending upward from one end of the third horizontal portion in the third direction and having one end connected to the first support portion. The second connecting portion includes a seventh vertical portion extending upward from one end of the second mounting portion in the third direction, a fourth horizontal portion extending horizontally from the seventh vertical portion in the first direction, and an eighth vertical portion extending upward from one end of the fourth horizontal portion in the third direction and having one end connected to the second support portion. The first strip portion of the first external electrode in the first row on the lower side is attached to the lower surface of the first support portion, the first strip portion of the first external electrode in the second row on the upper side is attached to the upper surface of the first support portion, and the second strip portion of the second external electrode in the first row is attached to the lower surface of the second support portion, and the second strip portion of the second external electrode in the second row is attached to the upper surface of the second support portion.

32. The electronic component according to claim 31, wherein, The sixth vertical portion is spaced apart from the first external electrode in the first row below, and the eighth vertical portion is spaced apart from the second external electrode in the first row below.

33. The electronic component according to claim 31, wherein, The conductive bonding layer is disposed on each of the upper and lower surfaces of the first support portion and on each of the upper and lower surfaces of the second support portion.

34. The electronic component according to claim 19, wherein, The first mounting portion has a downwardly protruding first protrusion, and the second mounting portion has a downwardly protruding second protrusion.

35. The electronic component according to claim 34, wherein, Each of the first protrusion and the second protrusion is configured as a plurality of protrusions.

36. The electronic component according to claim 19, wherein, The body of each of the plurality of multilayer capacitors includes: Dielectric layer; and A first inner electrode and a second inner electrode are alternately stacked, with a dielectric layer between the first inner electrode and the second inner electrode, and the first inner electrode and the second inner electrode are exposed through two surfaces of the body in the first direction, such that one end of the first inner electrode is connected to the first outer electrode and one end of the second inner electrode is connected to the second outer electrode.

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