A press-pack IGBT sub-module test adapter and test equipment

Abstract

The application provides a press contact type IGBT sub-module test adapter and test equipment, the press contact type IGBT sub-module test adapter includes: upper clamp and lower clamp, the lower clamp is suitable for being arranged opposite to the upper clamp;The upper clamp includes: negative electrode substrate, positive electrode substrate and inductance connection substrate which are stacked and spaced apart;The lower clamp includes: lower substrate, the lower substrate is suitable for setting IGBT sub-module and test diode;The negative electrode substrate is suitable for being electrically connected with the emitter of the IGBT sub-module, the positive electrode substrate is suitable for being electrically connected with the cathode of the test diode, and the lower substrate is suitable for being electrically connected with the anode of the test diode, the collector of the IGBT sub-module and the inductance connection substrate.The test diode can be arranged in the adapter, the effective length of the power loop is reduced, the power parasitic inductance is reduced, the overvoltage and oscillation phenomenon in the switching process are reduced, and the accuracy of the test result is improved.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, specifically to a crimp-type IGBT sub-module test adapter and test equipment. Background Technology

[0002] Insulated-gate bipolar transistors (IGBTs), as a typical representative of power electronic devices, have wide applications in modern power electronics. They combine the advantages of metal-oxide-semiconductor field-effect transistors (MOSFETs)—high input impedance, low control power, simple drive circuits, high switching speed, and low switching losses—with the advantages of bipolar junction transistors (BJTs)—high current density, low saturation voltage drop, and strong current handling capability. Therefore, they are ideal switching devices in the field of power electronics and are currently widely used in motor frequency converters, wind power converters, photovoltaic inverters, high-frequency welding machine inverters, and other fields.

[0003] With the continuous increase in capacitance, increasingly higher demands are being placed on the performance and reliability of insulated-gate bipolar transistors (IGBTs). Electrical characteristic testing of IGBTs can detect their performance and reliability. Existing electrical characteristic testing equipment typically includes an adapter and a voltage application device. Based on the testing principle of electrical testing, a test diode is required in the electrical characteristic testing equipment, and this test diode is electrically connected to the adapter.

[0004] However, existing electrical characteristic testing equipment introduces a large parasitic inductance in the power loop during the testing process, affecting the accuracy of the test results. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of existing IGBT electrical characteristic testing equipment that generates large power circuit parasitic inductance, thereby providing a press-fit IGBT sub-module test adapter and test equipment.

[0006] This invention provides a press-fit IGBT sub-module test adapter, comprising: an upper clamp and a lower clamp, the lower clamp being adapted to be disposed opposite to the upper clamp; the upper clamp comprising: a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate stacked and spaced apart; the lower clamp comprising: a lower substrate, the lower substrate being adapted to carry an IGBT sub-module and a test diode; the negative electrode substrate being adapted to be electrically connected to the emitter of the IGBT sub-module, the positive electrode substrate being adapted to be electrically connected to the cathode of the test diode, and the lower substrate being adapted to be electrically connected to the anode of the test diode, the collector of the IGBT sub-module, and the inductor connection substrate.

[0007] Optionally, the press-fit IGBT sub-module test adapter further includes: a first electrical connector, the first electrical connector being adapted to be located between the upper clamp and the lower clamp, the two ends of the first electrical connector being adapted to contact the cathode of the test diode and the positive substrate respectively; and a second electrical connector, the second electrical connector being adapted to be located between the upper clamp and the lower clamp, the two ends of the second electrical connector being adapted to contact the lower substrate and the inductor connection substrate respectively.

[0008] Optionally, the lower clamp further includes: a test assembly; the test assembly includes: an upper insulating plate and a lower insulating plate arranged at relative intervals, and fasteners for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electrical connector is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the lower substrate, and the lower insulating plate has a receiving cavity penetrating the lower insulating plate, and the test diode is adapted to be embedded in the receiving cavity.

[0009] Optionally, the fastener is adapted to penetrate the upper insulating plate, the lower insulating plate, and the lower substrate.

[0010] Optionally, the negative electrode substrate, positive electrode substrate, and inductor connection substrate are stacked sequentially, with a first insulating plate between the positive electrode substrate and the negative electrode substrate, and a second insulating plate between the inductor connection substrate and the positive electrode substrate; the upper clamp is provided with a second through hole penetrating the inductor connection substrate and the second insulating plate, and a third through hole penetrating the inductor connection substrate, the second insulating plate, the positive electrode substrate, and the first insulating plate sequentially, one end of the first electrical connector being adapted to be located in the second through hole, and the other end of the first electrical connector being adapted to be located in the first through hole; the upper clamp further includes: a gate-emitter assembly located in the third through hole and connected to the negative electrode substrate, the gate-emitter assembly including an emitter probe, one end of the emitter probe being electrically connected to the negative electrode substrate, and the emitter probe extending along the third through hole and adapted to be electrically connected to the emitter of the IGBT sub-module.

[0011] Optionally, the gate-emitter assembly further includes a gate probe and an insulating connection portion; the insulating connection portion is located between one end of the gate probe and the negative electrode substrate, and the other end of the gate probe away from the insulating connection portion is adapted to contact the gate of the IGBT sub-module.

[0012] Optionally, the first electrical connector is fixedly connected to the positive electrode substrate at one end of the second through hole, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be detachably disposed from the test component.

[0013] Optionally, one end of the first electrical connector can be detachably disposed from the positive electrode substrate, and the other end of the first electrical connector is adapted to be fixedly connected to the upper insulating plate.

[0014] Optionally, a first limiting member is provided on the side surface of the positive electrode substrate facing the inductor connection substrate, and the first limiting member is located in the second through hole; the first limiting member has a first limiting hole penetrating through the first limiting member, and the end of the first electrical connector facing away from the upper insulating plate is adapted to be inserted into the first limiting hole.

[0015] Optionally, the cross-sectional area of ​​the second through hole is greater than or equal to the area of ​​the orthographic projection of the test component onto the lower substrate.

[0016] Optionally, the lower clamp further includes: an upper substrate located on a portion of the surface of the lower substrate; the upper substrate is provided with a first groove and a second groove, the first groove being adapted to be located directly below the second through hole and adapted to place the test component in the first groove, the second groove being adapted to be located directly below the third through hole and adapted to place the IGBT sub-module in the second groove; one end of the second electrical connector is adapted to contact the surface of the lower substrate on the side of the upper substrate.

[0017] Optionally, the number of the second grooves is several.

[0018] Optionally, a plurality of the second grooves are arranged around the first groove, and the plurality of the second grooves are centrally symmetrically distributed.

[0019] Optionally, the second electrical connector is fixedly connected to the lower substrate on the side of the upper substrate, and the other end of the second electrical connector facing away from the lower substrate is adapted to be separable from the inductor connection substrate; or, the second electrical connector is fixedly connected to the inductor connection substrate, and the other end of the second electrical connector facing away from the inductor connection substrate is adapted to be separable from the surface of the lower substrate on the side of the upper substrate.

[0020] Optionally, the first electrical connector is a rigid component or an elastic component; when the first electrical connector is a rigid component, the first electrical connector includes a metal post; when the first electrical connector is an elastic component, the first electrical connector includes a spring probe; the second electrical connector is a rigid component or an elastic component; when the second electrical connector is a rigid component, the second electrical connector includes a metal post; when the second electrical connector is an elastic component, the second electrical connector includes a spring probe.

[0021] The present invention also provides a crimped IGBT submodule testing device, including the above-mentioned crimped IGBT submodule testing adapter.

[0022] Optionally, the press-fit IGBT sub-module testing equipment further includes: an inductor coil, one end of which is electrically connected to the inductor connection substrate; a power supply, the positive terminal of which is electrically connected to the other end of the inductor coil and the positive substrate, and the negative terminal of which is electrically connected to the negative substrate; and a driving unit, which is electrically connected to the gate of the IGBT sub-module and the negative substrate.

[0023] The technical solution of this invention has the following advantages:

[0024] 1. The press-fit type IGBT sub-module test adapter provided by the present invention includes an upper clamp and a lower clamp. The lower clamp is adapted to be disposed opposite to the upper clamp. The upper clamp includes a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate stacked and spaced apart. The lower clamp includes a lower substrate. On one hand, the lower substrate is adapted to carry the IGBT sub-module and be electrically connected to the collector of the IGBT sub-module. The negative electrode substrate is adapted to be electrically connected to the emitter of the IGBT sub-module, thereby reducing the complexity of the leads during electrical characteristic testing and reducing the lead length, thus reducing parasitic inductance. On the other hand, the lower substrate is also adapted to carry a test diode and be electrically connected to the anode of the test diode. The positive electrode substrate is adapted to be electrically connected to the cathode of the test diode, allowing the test diode to be disposed inside the adapter. This eliminates the need for long leads to achieve electrical connection between the test diode and the adapter, reducing the effective length of the power circuit, thereby reducing power parasitic inductance, reducing overvoltage and oscillation phenomena during switching, and improving the accuracy of test results.

[0025] 2. The pressure-fit IGBT sub-module test adapter provided by this invention includes a test-support component in the lower fixture. The lower insulating plate is fixed on the lower substrate, and the lower insulating plate has a receiving cavity. The test-support diode is adapted to be embedded in the receiving cavity, which avoids horizontal displacement of the test-support diode and improves the stability of the test-support diode on the lower substrate. This ensures a stable electrical connection between the anode of the test-support diode and the lower substrate, which is beneficial for ensuring the smooth progress of electrical characteristic testing. The test-support diode is restricted between the upper and lower insulating plates by fasteners to press-fit the test-support diode for electrical characteristic testing. Since the structure of the test-support component remains constant during the test, the test-support diode is always in a press-fit state with constant pressure, avoiding repeated pressure application and depressurization of the test-support diode during the electrical characteristic test, thus improving the lifespan of the test-support diode. At the same time, the force on the test-support diode can be controlled by adjusting the distance between the upper and lower insulating plates by fasteners, which has great flexibility. In addition, the structure of the test-support component is simple, and when problems such as test-support diode failure occur during the test, the test-support diode can be replaced in time, which is beneficial for improving test efficiency.

[0026] 3. The press-fit type IGBT sub-module test adapter provided by the present invention has a first electrical connector located at one end of the second through hole and fixedly connected to the positive electrode substrate. The other end of the first electrical connector facing away from the positive electrode substrate is adapted to be separably disposed from the auxiliary test component. Before applying pressure to the adapter, the upper and lower clamps need to be aligned, specifically in the alignment of the first electrical connector with the first through hole in the auxiliary test component, so as to ensure that after the adapter is subjected to force, the first electrical connector passes through the first through hole and contacts the cathode of the auxiliary test diode. At this time, the first electrical connector will not come into contact with other conductive components, ensuring the smooth progress of the test process.

[0027] 4. The press-fit type IGBT sub-module test adapter provided by the present invention has one end of the first electrical connector separable from the positive electrode substrate, and the other end of the first electrical connector adapted to be fixedly connected to the upper insulating plate. A first limiting member is provided on the side surface of the positive electrode substrate facing the second insulating plate, and the first limiting member is located in the second through hole. The end of the first electrical connector away from the upper insulating plate is adapted to be inserted into the first limiting hole of the first limiting member, which serves to fix the first electrical connector and prevent the first electrical connector from tilting when pressure is applied to the adapter, thus avoiding poor contact between the first electrical connector and the positive electrode substrate and ensuring the electrical connection effect between the first electrical connector and the positive electrode substrate.

[0028] 5. The press-fit type IGBT sub-module test adapter provided by the present invention has one end of the first electrical connector separable from the positive electrode substrate, and the other end of the first electrical connector adapted to be fixedly connected to the upper insulating plate. The cross-sectional area of ​​the second through hole is greater than or equal to the area of ​​the orthographic projection of the test component on the lower substrate. Before applying pressure to the adapter, the upper and lower clamps need to be aligned so that the end of the first electrical connector facing away from the upper insulating plate passes through the second through hole and only contacts the positive electrode substrate. By limiting the size of the second through hole as described above, the risk of the first electrical connector contacting the inductor connection substrate while contacting the positive electrode substrate is effectively reduced, thereby ensuring the smooth progress of the test process.

[0029] 6. The press-fit type IGBT sub-module test adapter provided by the present invention includes an upper substrate located on a portion of the surface of the lower substrate, wherein the upper substrate is provided with a first groove and a second groove, the test component is adapted to be placed in the first groove, and the IGBT sub-module is adapted to be placed in the second groove, thereby defining the position of the test component and the IGBT sub-module in the adapter and fixing the test component and the IGBT sub-module, so that the test component tube and the IGBT sub-module can be stably fixed in the adapter throughout the test process, ensuring the smooth progress of the test process.

[0030] 7. The press-fit IGBT sub-module test adapter provided by the present invention has a plurality of second grooves, which are suitable for placing IGBT sub-modules. That is, the adapter can perform electrical performance tests on multiple IGBT sub-modules simultaneously, shortening the test time and improving the test efficiency. At the same time, the IGBT sub-modules are connected in parallel, so when one IGBT sub-module fails, it will not affect the other IGBT sub-modules, thus improving the reliability and stability of the test.

[0031] 8. The press-fit IGBT sub-module test adapter provided by the present invention has a plurality of second grooves arranged around the first groove, and the plurality of second grooves are centrally symmetrically distributed, so that the distance between the test diode located in the first groove and the IGBT sub-module located in each of the second grooves is equal, thereby making the parasitic inductance generated by the power circuit of each IGBT sub-module consistent and uniformly distributed. This ensures that the parasitic inductance has the same impact on each IGBT sub-module during batch testing, which is beneficial for the selection of IGBT sub-modules. During the process of applying pressure to the adapter, the IGBT sub-modules located in each of the second grooves can share the pressure, and the centrally symmetrical distribution of the IGBT sub-modules ensures that the pressure distributed on each IGBT sub-module is balanced, avoiding the test failure of some IGBT sub-modules and inaccurate test results caused by uneven pressure, thus improving the reliability and stability of the test.

[0032] 9. The pressure-fit IGBT sub-module testing equipment provided by the present invention effectively reduces the effective length of the power circuit by placing the test diode in the adapter, thereby reducing the power parasitic inductance, reducing overvoltage and oscillation phenomena during the switching process, and improving the accuracy of the test results. Attached Figure Description

[0033] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is a front view of the crimped IGBT sub-module test adapter provided in an embodiment of the present invention;

[0035] Figure 2 for Figure 1 The front view of the upper clamp is shown;

[0036] Figure 3 for Figure 1 The top view of the upper clamp shown;

[0037] Figure 4 for Figure 1 The diagram shows the structure of the gate-emitter assembly;

[0038] Figure 5 for Figure 1 The front view of the lower clamp is shown;

[0039] Figure 6 for Figure 1 Top view of the lower clamp shown;

[0040] Figure 7 for Figure 1 The diagram shows the structure of the test component.

[0041] Figure 8 for Figure 1 The main view of the test component shown;

[0042] Figure 9 This is a test circuit diagram of the crimped IGBT sub-module test equipment provided in an embodiment of the present invention;

[0043] Figure 10 This is a schematic diagram of the electrical connection of the crimped IGBT sub-module testing equipment provided in an embodiment of the present invention.

[0044] Explanation of reference numerals in the attached figures:

[0045] 1-Upper clamp; 11-Negative electrode substrate; 12-First insulating plate; 13-Positive electrode substrate; 14-Second insulating plate; 15-Inductor connection substrate; 16-Second through hole; 17-Third through hole; 18-Gate-emitter assembly; 181-Emitter probe; 182-Gate probe; 183-Insulating connection part; 19-Insulating pin; 2-Lower clamp; 21-Lower substrate; 22-Upper substrate; 221-First groove; 222-Second groove; 23-Test component; 231-Upper insulating plate; 232-First through hole; 233-Lower insulating plate; 234-Receiving cavity; 235-Fastener; 3-First electrical connector; 4-Second electrical connector; 5-First limiting member; 6-Second limiting member; 7-Drive unit. Detailed Implementation

[0046] As described in the background section, existing IGBT electrical characteristic testing equipment generates a large power loop parasitic inductance during the testing process, which affects the accuracy of the test results.

[0047] Existing electrical characteristic testing equipment typically employs an adapter and a pressure application device. The chip under test (DUT) is placed within the adapter, and the pressure application device electrically connects the DUT's emitter, collector, and gate to the adapter. Leads are then used to electrically connect the adapter to other components of the electrical characteristic testing equipment for testing. In other words, the adapter provides the electrical connection between the DUT and the testing equipment, avoiding direct connections between the DUT and other components, thus reducing lead complexity, lead length, and parasitic inductance. Based on the testing principle, electrical characteristic testing equipment requires a companion diode, electrically connected to the adapter. However, because the companion diode is independently located outside the adapter, its electrical connection requires a long lead, resulting in significant power loop parasitic inductance and affecting the accuracy of the test results.

[0048] Based on this, the present invention provides a press-fit IGBT sub-module test adapter, comprising: an upper clamp and a lower clamp, the lower clamp being adapted to be disposed opposite to the upper clamp; the upper clamp comprising: a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate stacked and spaced apart; the lower clamp comprising: a lower substrate adapted to support the IGBT sub-module and a test diode; the negative electrode substrate being adapted to be electrically connected to the emitter of the IGBT sub-module, the positive electrode substrate being adapted to be electrically connected to the cathode of the test diode, and the lower substrate being adapted to be electrically connected to the anode of the test diode, the collector of the IGBT sub-module, and the inductor connection substrate. The press-fit IGBT sub-module test adapter provided by the present invention reduces power parasitic inductance, which is beneficial to improving the accuracy of test results.

[0049] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0051] See Figure 1This embodiment provides a press-fit IGBT sub-module test adapter, including: an upper clamp 1 and a lower clamp 2, the lower clamp 2 being adapted to be disposed opposite to the upper clamp 1; the upper clamp 1 includes: a negative electrode substrate 11, a positive electrode substrate 13, and an inductor connection substrate 15 stacked and spaced apart; the lower clamp 2 includes: a lower substrate 21, the lower substrate 21 being adapted to carry the IGBT sub-module and a test diode; the negative electrode substrate 11 is adapted to be electrically connected to the emitter of the IGBT sub-module, the positive electrode substrate 13 is adapted to be electrically connected to the cathode of the test diode, and the lower substrate 21 is adapted to be electrically connected to the anode of the test diode, the collector of the IGBT sub-module, and the inductor connection substrate 15.

[0052] In the aforementioned press-fit IGBT sub-module test adapter, the lower substrate 21 is adapted to support the IGBT sub-module and is electrically connected to the collector of the IGBT sub-module, while the negative substrate 11 is adapted to be electrically connected to the emitter of the IGBT sub-module. This reduces the complexity of the leads during electrical characteristic testing, decreases the lead length, and reduces parasitic inductance. The lower substrate 21 is also adapted to support a test diode and is electrically connected to the anode of the test diode, while the positive substrate 13 is adapted to be electrically connected to the cathode of the test diode. This allows the test diode to be placed inside the adapter, eliminating the need for long leads to achieve electrical connection between the test diode and the adapter. This reduces the effective length of the power circuit, thereby reducing power parasitic inductance, decreasing overvoltage and oscillation during switching, and improving the accuracy of test results. Based on the principle of electrical characteristic testing, the lower substrate 21 is electrically connected to the inductor connection substrate 15.

[0053] Specifically, the lower substrate 21 can be made of copper busbars, and further, the lower substrate 21 can be made of a good conductor with high electrical conductivity, such as copper.

[0054] In this embodiment, see Figure 1The press-fit IGBT sub-module test adapter further includes: a first electrical connector 3, adapted to be located between the upper clamp 1 and the lower clamp 2, with both ends of the first electrical connector 3 adapted to contact the cathode of the test diode and the positive substrate 13, respectively; and a second electrical connector 4, adapted to be located between the upper clamp 1 and the lower clamp 2, with both ends of the second electrical connector 4 adapted to contact the lower substrate 21 and the inductor connection substrate 15, respectively. The first electrical connector 3 enables electrical connection between the cathode of the test diode and the positive substrate 13, while the second electrical connector 4 enables electrical connection between the lower substrate 21 and the inductor connection substrate 15. The lengths of the first electrical connector 3 and the second electrical connector 4 are adapted to ensure that during testing, while both ends of the first electrical connector 3 are in contact with the cathode of the test diode and the positive substrate 13, both ends of the second electrical connector 4 are in contact with the lower substrate 21 and the inductor connection substrate 15, respectively.

[0055] Further, the first electrical connector 3 is either a rigid or elastic component; when the first electrical connector 3 is a rigid component, it includes a metal pillar; when the first electrical connector 3 is an elastic component, it includes a spring probe. The second electrical connector 4 is either a rigid or elastic component; when the second electrical connector 4 is a rigid component, it includes a metal pillar; when the second electrical connector 4 is an elastic component, it includes a spring probe. When both the first electrical connector 3 and the second electrical connector 4 are rigid components, the length of the first electrical connector 3 must strictly correspond to the length of the second electrical connector 4; when one of the first electrical connector 3 and the second electrical connector 4 is an elastic component, the length of the compressed elastic component corresponds to that of the rigid component; when both the first electrical connector 3 and the second electrical connector 4 are elastic components, the lengths of the compressed first electrical connector 3 and the second electrical connector 4 correspond. Preferably, both the first electrical connector 3 and the second electrical connector 4 are elastic components.

[0056] Furthermore, the number of the first electrical connector 3 is one or more. Preferably, the number of the first electrical connector 3 is multiple. If the number of the first electrical connector 3 is one, then if the first electrical connector 3 does not contact the cathode of the test diode and / or the positive substrate 13, then the electrical connection between the cathode of the test diode and the positive substrate 13 cannot be achieved, resulting in the inability to perform the electrical characteristic test normally. Multiple first electrical connectors 3 can reduce the probability of electrical connection failure between the cathode of the test diode and the positive substrate 13, ensuring that the electrical characteristic test can be performed normally.

[0057] Furthermore, the number of the second electrical connector 4 is one or more. Preferably, the number of the second electrical connector 4 is multiple. If the number of the second electrical connector 4 is one, then if the second electrical connector 4 does not contact the lower substrate 21 and / or the inductor connection substrate 15, then an electrical connection between the lower substrate 21 and the inductor connection substrate 15 cannot be achieved, resulting in the inability to perform electrical characteristic tests normally. Multiple second electrical connectors 4 can reduce the probability of electrical connection failure between the lower substrate 21 and the inductor connection substrate 15, ensuring that electrical characteristic tests can be performed normally.

[0058] As an optional implementation, the surfaces of the first electrical connector 3 and the second electrical connector 4 are plated with gold to reduce contact resistance, thereby reducing the parasitic resistance of the adapter; furthermore, the first electrical connector 3 and the second electrical connector 4 are made of oxygen-free copper material.

[0059] During the electrical characteristic testing of IGBT sub-modules, it is necessary to press the test diode. Existing electrical characteristic testing equipment involves applying and removing pressure to the test diode at the beginning and end of each test. Repeated pressing of the test diode can damage it and affect its service life.

[0060] In this embodiment, see Figure 5 The lower clamp 2 further includes: a testing component 23; such as Figures 7-8As shown, the accompanying test assembly 23 includes: an upper insulating plate 231 and a lower insulating plate 233 arranged at relative intervals, and a fastener 235 for connecting the upper insulating plate 231 and the lower insulating plate 233; the upper insulating plate 231 is provided with a first through hole 232, and the first electrical connector 3 is adapted to pass through the first through hole 232; the lower insulating plate 233 is adapted to be fixed on the lower substrate 21, and the lower insulating plate 233 has a receiving cavity 234 penetrating the lower insulating plate, and the accompanying test diode is adapted to be embedded in the receiving cavity 234. The internal structure of the auxiliary diode prevents horizontal displacement and improves its stability on the lower substrate 21, ensuring a stable electrical connection between the anode of the auxiliary diode and the lower substrate 21, which is beneficial for the smooth conduct of electrical characteristic tests. The auxiliary diode is confined between the upper insulating plate 231 and the lower insulating plate 233 by fasteners 235 for pressure fitting, thus facilitating electrical characteristic testing. Since the structure of the auxiliary component 23 remains constant during testing, the auxiliary diode is always under pressure, avoiding repeated pressure application and depressurization, thus extending its lifespan. Furthermore, the force on the auxiliary diode can be controlled by adjusting the distance between the upper and lower insulating plates 231 and 233 using fasteners 235; a smaller distance results in a greater force on the auxiliary diode. In addition, the simple structure of the auxiliary component 23 allows for timely replacement of the auxiliary diode in case of failure during testing, improving testing efficiency.

[0061] Specifically, the fasteners 235 are multiple and arranged around the center of the auxiliary testing component 23 to make the pressure distribution of the auxiliary testing diode more uniform. For example... Figures 7-8 As shown, the fasteners 235 are located at the four corners of the test component 23. The fasteners 235 can be bolts.

[0062] Furthermore, as an optional implementation method, such as Figures 7-8 As shown, the upper insulating plate 231 has a third groove of a certain depth on the side facing the lower insulating plate 233. The top of the auxiliary diode is embedded in the third groove. The third groove further restricts the auxiliary diode, improves the stability of the auxiliary diode, and reduces the distance between the upper insulating plate 231 and the lower insulating plate 233, thereby reducing the longitudinal dimension of the auxiliary component 23. This is beneficial to reducing the longitudinal dimension of the adapter and realizing the miniaturization of the adapter.

[0063] Furthermore, such as Figure 6As shown, the fastener 235 can penetrate the upper insulating plate 231, the lower insulating plate 233 and the lower substrate 21 to fix the test component 23 on the lower substrate 21; or the fastener 235 can penetrate a portion of the depth of the upper insulating plate 231 and the lower insulating plate 233 to bond the lower insulating plate 233 to the lower substrate 21.

[0064] In one embodiment, such as Figure 2 As shown, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are stacked sequentially. A first insulating plate 12 is disposed between the positive electrode substrate 13 and the negative electrode substrate 11, and a second insulating plate 14 is disposed between the inductor connection substrate 15 and the positive electrode substrate 13. The upper clamp 1 is provided with a second through hole 16 penetrating the inductor connection substrate 15 and the second insulating plate 14, and a third through hole 17 sequentially penetrating the inductor connection substrate 15, the second insulating plate 14, the positive electrode substrate 13, and the first insulating plate 12. One end of the electrical connector 3 is adapted to be located in the second through hole 16, and the other end of the first electrical connector 3 is adapted to be located in the first through hole 232; the upper clamp 1 further includes: a gate-emitter assembly 18 located in the third through hole 17 and connected to the negative electrode substrate 11, the gate-emitter assembly 18 including an emitter probe 181, one end of the emitter probe 181 being electrically connected to the negative electrode substrate 11, the emitter probe 181 extending along the third through hole 17 and adapted to be electrically connected to the emitter of the IGBT sub-module. Specifically, the emitter probe 181 is disposed on the side surface of the negative electrode substrate 11 facing the positive electrode substrate 13 and does not contact the positive electrode substrate 13 and the inductor connection substrate 15, and the end of the emitter probe 181 facing away from the negative electrode substrate 11 is adapted to contact the emitter of the IGBT sub-module; further, one end of the emitter probe 181 is welded to the side surface of the negative electrode substrate 11 facing the positive electrode substrate 13. The first insulating plate 12 insulates the negative electrode substrate 11 from the positive electrode substrate 13, and the second insulating plate 14 insulates the positive electrode substrate 13 from the inductor connection substrate 15, to avoid leakage current affecting the test results during the test. It should be understood that the structure of the upper clamp 1 includes, but is not limited to, the above-described structure.

[0065] Specifically, such as Figures 2-3As shown, the negative electrode substrate 11 is connected to the first insulating plate 12, the first insulating plate 12 is connected to the positive electrode substrate 13, the positive electrode substrate 13 is connected to the second insulating plate 14, and the second insulating plate 14 is connected to the inductor connection substrate 15 via insulating pins 19. The negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 can be made of copper busbars; furthermore, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 can be made of high-conductivity conductors such as copper. Since copper not only has good conductivity and high hardness but also high temperature resistance, when the materials of the lower substrate 21, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are all copper, the adapter has good high-temperature resistance and is suitable for high-temperature testing of IGBT sub-modules. The first insulating plate 12 and the second insulating plate 14 can be made of high-insulation materials with high temperature resistance; furthermore, the materials of the first insulating plate 12 and the second insulating plate 14 are phenolic resin.

[0066] Furthermore, the sum of the length (or compressed length) of the first electrical connector 3 and the thickness of the diode under test is equal to the thickness of the inductor connection substrate 15, the thickness of the second insulating plate 14, and the length (or compressed length) of the second electrical connector 4. The second electrical connector 4 is positioned such that a certain gap exists between the lower substrate 21 and the inductor connection substrate 15 after pressure is applied to the adapter. During testing, the state of the IGBT sub-module, such as the tilt degree of the IGBT sub-module, can be monitored through this gap.

[0067] Specifically, such as Figure 4 As shown, the gate-emitter assembly 18 further includes a gate probe 182 and an insulating connection portion 183. The insulating connection portion 183 is located between one end of the gate probe 182 and the negative electrode substrate 11, and the other end of the gate probe 182 away from the insulating connection portion 183 is adapted to contact the gate of the IGBT sub-module. The insulating connection portion 183 is used to isolate the gate probe 182 and the negative electrode substrate 11, preventing the gate probe 182 and the emitter test probe from being electrically connected to the negative electrode substrate 11 simultaneously. Specifically, the insulating connection portion 183 is embedded in the negative electrode substrate 11, and one end of the gate probe 182 is embedded in the insulating connection portion 183 to a certain depth. One end of the gate probe 182 is fixed in the insulating connection portion 183 by bolts. The relative positions and number of the emitter probe 181 and the gate probe 182 are adapted to the relative positions and number of the emitter and gate of the IGBT sub-module. The lengths of the emitter probe 181 and the gate probe 182 are adapted to ensure that when the emitter probe 181 contacts the emitter of the IGBT sub-module, the gate probe 182 contacts the gate of the IGBT sub-module.

[0068] In a first embodiment, one end of the first electrical connector 3 is detachably disposed from the positive electrode substrate 13, and the other end of the first electrical connector 3 is adapted to be fixedly connected to the upper insulating plate 231. Specifically, one end of the first electrical connector is fixed in the first through hole. When pressure is applied to the adapter, one end of the first electrical connector contacts the cathode of the auxiliary diode, and the other end contacts the positive electrode substrate; after the pressure is unloaded, the first electrical connector separates from the positive electrode substrate and the cathode of the auxiliary diode.

[0069] Furthermore, to prevent the first electrical connector 3 from becoming misaligned when pressure is applied to the adapter, thus causing poor contact between the first electrical connector 3 and the positive electrode substrate 13, such as... Figure 3 As shown, a first limiting member 5 is provided on the surface of the positive electrode substrate 13 facing the inductor connection substrate 15. The first limiting member 5 is located in the second through hole 16 and has a first limiting hole that penetrates through it. The end of the first electrical connector 3 facing away from the upper insulating plate 231 is adapted to be inserted into the first limiting hole, which serves to fix the first electrical connector 3 and ensure the electrical connection between the first electrical connector 3 and the positive electrode substrate 13. The first limiting member 5 can be a spring-loaded contact finger.

[0070] Furthermore, the cross-sectional area of ​​the second through hole 16 is greater than or equal to the area of ​​the orthographic projection of the test component 23 onto the lower substrate. Before applying pressure to the adapter, the upper clamp 1 and the lower clamp 2 need to be aligned so that the end of the first electrical connector 3 facing away from the upper insulating plate 231 passes through the second through hole 16 and only contacts the positive electrode substrate 13. By limiting the cross-sectional area of ​​the second through hole 16 as described above, the risk of the first electrical connector 3 contacting the inductor connection substrate 15 while in contact with the positive electrode substrate 13 is effectively reduced, thereby ensuring the smooth progress of the test process.

[0071] In a second embodiment, the first electrical connector 3 is fixedly connected to the positive electrode substrate 13 at one end of the second through hole 16, and the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 is adapted to be separably disposed from the auxiliary testing component 23. Before applying pressure to the adapter, the upper clamp 1 and the lower clamp 2 need to be aligned, specifically in the alignment of the first electrical connector 3 with the first through hole 232 in the auxiliary testing component 23, to ensure that after the adapter is subjected to force, the first electrical connector 3 passes through the first through hole 232 and contacts the cathode of the auxiliary testing diode. At this time, the first electrical connector 3 will not come into contact with other conductive components, ensuring the smooth progress of the test process. When pressure is applied to the adapter, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 contacts the cathode of the auxiliary testing component 23; after the pressure is unloaded, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 separates from the cathode of the auxiliary testing component 23.

[0072] As an optional implementation, the upper insulating plate 231 has a fourth groove on the side opposite to the lower insulating plate 233. The fastener 235 is located in the fourth groove, penetrates the upper insulating plate 231, and extends to at least a portion of the depth of the lower insulating plate 233. Specifically, when the fastener 235 is a bolt, the head of the bolt is located in the fourth groove, and the bolt shank penetrates the upper insulating plate 231 and extends to at least a portion of the depth of the lower insulating plate 233. When the size of the second through hole 16 is greater than or equal to the size of the orthographic projection of the test component 23 on the positive substrate 13, if the pressure applied to the adapter is large, the upper part of the test component 23 can be embedded in the second through hole 16 during the test, so that the end of the fastener 235 protruding from the upper insulating plate 231 contacts the positive substrate 13; however, if the fastener 235 penetrates the lower insulating plate 233 and the lower substrate 21, then the positive substrate 13 and the lower substrate 21 are electrically connected through the fastener 235, which causes the test diode to short-circuit; by setting the fourth groove, the fastener 235 does not protrude from the upper insulating plate 231, thus avoiding contact between the fastener 235 and the positive substrate 13, thereby avoiding electrical connection between the positive substrate 13 and the lower substrate 21, and ensuring the smooth progress of the test.

[0073] In one embodiment, such as Figures 5-6As shown, the lower clamp 2 further includes: an upper substrate 22 located on a portion of the surface of the lower substrate 21; the upper substrate 22 is provided with a first groove 221 and a second groove 222, the first groove 221 being adapted to be located directly below the second through hole 16 and adapted to place the test component 23, the second groove 222 being adapted to be located directly below the third through hole 17 and adapted to place the IGBT sub-module; one end of the second electrical connector 4 is adapted to contact the surface of the lower substrate 21 on the side of the upper substrate 22. The arrangement of the upper substrate 22 ensures the electrical connection between the lower substrate 21 and the anode of the test diode and the collector of the IGBT sub-module, while also defining the position of the test component 23 and the IGBT sub-module in the adapter, and fixing the test component 23 and the IGBT sub-module, so that the test component 23 and the IGBT sub-module can be stably fixed in the adapter throughout the testing process, ensuring the smooth progress of the testing process.

[0074] It should be understood that the shape and cross-sectional area of ​​the first groove 221 are adapted to the shape and cross-sectional area of ​​the test component 23 so that the test component 23 is embedded in the first groove 221; the shape and cross-sectional area of ​​the second groove 222 are adapted to the shape and cross-sectional area of ​​the IGBT sub-module so that the IGBT sub-module is embedded in the second groove 222; the thickness of the upper substrate 22 is less than the length or compressed length of the second electrical connector 4 so that after pressure is applied to the adapter, there is a certain gap between the upper substrate 22 and the inductor connection substrate 15. During the test, the state of the IGBT sub-module, such as the tilt degree of the IGBT sub-module, can be monitored through the gap between the upper substrate 22 and the inductor connection substrate 15.

[0075] Specifically, the upper substrate 22 can be fixed to the lower substrate 21 by bolts or welded to the lower substrate 21.

[0076] In a first embodiment, the depths of the first groove 221 and the second groove 222 are less than the thickness of the upper substrate 22, in which case the upper substrate 22 is conductive. The upper substrate 22 contacts the lower substrate 21 to achieve an electrical connection between the upper substrate 22 and the lower substrate 21. After the auxiliary testing component 23 is placed in the first groove 221, the anode of the auxiliary testing diode contacts the bottom surface of the first groove 221 to achieve an electrical connection between the anode of the auxiliary testing diode and the upper substrate 22, and subsequently, an electrical connection between the anode of the auxiliary testing diode and the lower substrate 21. After the IGBT sub-module is placed in the second groove 222, the collector of the IGBT sub-module contacts the bottom surface of the second groove 222 to achieve an electrical connection between the collector of the IGBT sub-module and the upper substrate 22, and subsequently, an electrical connection between the collector of the IGBT sub-module and the lower substrate 21. Specifically, the upper substrate 22 can be made of copper busbar; furthermore, the upper substrate 22 can be made of a good conductor with high electrical conductivity, such as copper.

[0077] In a second implementation, the depths of the first groove 221 and the second groove 222 can be equal to the thickness of the upper substrate 22, in which case the upper substrate 22 may not be conductive. After the auxiliary testing component 23 is placed in the first groove 221, the anode of the auxiliary testing diode directly contacts the lower substrate 21 to achieve electrical connection between the anode of the auxiliary testing diode and the lower substrate 21; after the IGBT sub-module is placed in the second groove 222, the collector of the IGBT sub-module directly contacts the lower substrate 21 to achieve electrical connection between the collector of the IGBT sub-module and the lower substrate 21.

[0078] As an optional implementation, the number of second grooves 222 is several. Since the gate-emitter assembly 18 extends along the third through hole 17, and the second groove 222 is adapted to be located directly below the third through hole 17, the gate-emitter assembly 18 and the second groove 222 are corresponding. During the test, the IGBT sub-modules located in the second groove 222 are electrically connected to the corresponding gate-emitter assembly 18, enabling the adapter to perform electrical performance tests on multiple IGBT sub-modules simultaneously, shortening the test time and improving the test efficiency. At the same time, the IGBT sub-modules are connected in parallel, so when one IGBT sub-module fails, it will not affect the other IGBT sub-modules, improving the reliability and stability of the test.

[0079] Furthermore, a plurality of second grooves 222 are arranged around the first groove 221, and the plurality of second grooves 222 are centrally symmetrically distributed. The test diodes located in the first groove 221 are equidistant from the IGBT sub-modules located in each of the second grooves 222, thereby ensuring that the parasitic inductance generated by the power circuit of each IGBT sub-module is consistent and uniformly distributed. Consequently, the parasitic inductance has the same impact on each IGBT sub-module during batch testing, which is beneficial for the selection of IGBT sub-modules. During the application of pressure to the adapter, the IGBT sub-modules located in each of the second grooves 222 can share the pressure, and the centrally symmetrical distribution of the IGBT sub-modules ensures that the pressure distributed to each IGBT sub-module is balanced, avoiding local overvoltage or overheating of some IGBT sub-modules due to pressure imbalance, which could lead to test failure or inaccurate test results, thus improving the reliability and stability of the test. Figure 6 As shown, there are 6 second grooves 222, and they are centrally symmetrical.

[0080] Furthermore, the negative electrode substrate 11, the first insulating plate 12, the positive electrode substrate 13, the second insulating plate 14, and the inductor connection substrate 15 in the upper clamp 1, as well as the lower substrate 21 and the upper substrate 22 in the lower clamp 2, are all circular. This ensures that the distribution of parasitic inductance is uniform while reducing material consumption and improving the reliability of test results.

[0081] In a first embodiment, the second electrical connector 4 is fixedly connected to the lower substrate 21 on the side of the upper substrate 22, and the other end of the second electrical connector 4 facing away from the lower substrate is adapted to be separably disposed from the inductor connection substrate 15. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the lower substrate contacts the inductor connection substrate 15; after the pressure is released, the other end of the second electrical connector 4 facing away from the lower substrate separates from the inductor connection substrate 15. Further, a second limiting member 6 is provided on the inductor connection substrate 15, and the second limiting member 6 has a second limiting hole penetrating through the second limiting member 6. The end of the second electrical connector 4 facing away from the lower substrate 21 is adapted to be inserted into the second limiting hole.

[0082] As a second implementation method, such as Figure 2As shown, the second electrical connector 4 is fixedly connected to the inductor connection substrate 15, and the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be separably disposed from the surface of the lower substrate 21 on the side of the upper substrate 22. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 contacts the surface of the lower substrate 21 on the side of the upper substrate 22; after the pressure is released, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 separates from the surface of the lower substrate 21 on the side of the upper substrate 22. Further, as... Figure 6 As shown, a second limiting member 6 is provided on the surface of the lower substrate 21 on the side of the upper substrate 22. The second limiting member 6 has a second limiting hole that penetrates the second limiting member 6. The end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be inserted into the second limiting hole.

[0083] Specifically, the second limiting member 6 serves to fix the second electrical connector 4, ensuring the electrical connection between the second electrical connector 4 and the inductor connection substrate 15; the second limiting member 6 can be a spring-loaded contact finger. Furthermore, the second electrical connector 4 is adapted to surround the upper substrate 22.

[0084] This embodiment also provides a crimp-type IGBT submodule testing device, including the aforementioned crimp-type IGBT submodule testing adapter. The crimp-type IGBT submodule testing device possesses all the advantages of the crimp-type IGBT submodule testing adapter, which will not be elaborated further here.

[0085] In this embodiment, see Figure 10 The press-fit IGBT sub-module testing equipment further includes: an inductor coil, one end of which is electrically connected to the inductor connection substrate 15; a power supply, the positive terminal of which is electrically connected to the other end of the inductor coil and the positive substrate 13, and the negative terminal of which is electrically connected to the negative substrate 11; a driving unit 7, which is electrically connected to the gate of the IGBT sub-module and the negative substrate 11; a pressure applying device for applying pressure to the adapter; and a heating device adapted to be located below the lower substrate 21 for heating the IGBT sub-module during high-temperature testing.

[0086] Specifically, a lead is used to connect one end of the inductor coil to the inductor connection substrate 15, a lead is used to connect the positive terminal of the power supply to the other end of the inductor coil and the positive terminal of the power supply to the positive terminal substrate 13, a lead is used to connect the negative terminal of the power supply to the negative terminal substrate 11, and a lead is used to connect the driving unit 7 to the gate probe 182 and the driving unit 7 to the negative terminal substrate 11.

[0087] During testing, the auxiliary test component 23 and the auxiliary test diode are first fixed into the first groove 221 by fastener 235, and the pressure applied by the auxiliary test diode is controlled by controlling the fastener 235. The IGBT sub-module is then placed in the second groove 222. The upper clamp 1 and the lower clamp 2 are then aligned so that after pressure is applied to the adapter, the gate probe 182 can contact the gate, the emitter probe 181 can contact the emitter, the first electrical connector 3 can contact the cathode of the positive substrate 13 and the auxiliary test diode, and the second electrical connector 4 can contact the lower substrate 21 and the inductor connection substrate 15 located on the side of the upper substrate 22. Then, pressure is applied to the adapter by the pressure application device.

[0088] The test circuit of the press-fit type IGBT sub-module test equipment in this embodiment is as follows: Figures 9-10 As shown, the drive circuit provides drive signals to the IGBT sub-module, and the power circuit provides voltage to the IGBT sub-module for various electrical characteristic tests of the IGBT, such as switching tests and RBSOA tests. Specifically, the drive circuit is: drive unit 7—negative substrate 11—emitter probe 181 in the gate-emitter assembly 18—emitter of the IGBT sub-module—gate of the IGBT sub-module—gate probe 182 in the gate-emitter assembly 18—drive unit 7; the power circuit is: positive power supply—inductor coil—inductor connection substrate 15—second electrical connector 4—lower substrate 21—collector of the IGBT sub-module—emitter of the IGBT sub-module—emitter probe 181 in the gate-emitter assembly 18—negative substrate 11—negative power supply; the auxiliary test circuit is: inductor coil—inductor connection substrate 15—second electrical connector 4—lower substrate 21—anode of the auxiliary test diode—cathode of the auxiliary test diode—first electrical connector 3—positive substrate 13—inductor coil. During the test, the test diode is connected in parallel with the inductor coil. The current in the test diode is opposite to the current in the IGBT sub-module. During the switching process, the test diode and the IGBT sub-module are in a complementary coaxial state, which effectively cancels the stray inductance from the adapter itself and reduces interference from external signals.

[0089] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A press-pack IGBT sub-module test adapter, characterized by, The application relates to a press-contact type IGBT sub-module test adapter. The upper clamp and the lower clamp are oppositely arranged; The upper clamp comprises a negative electrode substrate, a positive electrode substrate and an inductance connecting substrate which are arranged in layers and are spaced apart; The lower clamp comprises a lower substrate which is adapted to carry an IGBT sub-module and a test diode; the negative electrode substrate is adapted to be electrically connected with the emitter of the IGBT sub-module, the positive electrode substrate is adapted to be electrically connected with the cathode of the test diode, and the lower substrate is adapted to be electrically connected with the anode of the test diode, the collector of the IGBT sub-module and the inductance connecting substrate; The press-contact type IGBT sub-module test adapter further comprises: A first electric connecting member which is adapted to be located between the upper clamp and the lower clamp, and two ends of the first electric connecting member are adapted to be in contact with the cathode of the test diode and the positive electrode substrate respectively; A second electric connecting member which is adapted to be located between the upper clamp and the lower clamp, and two ends of the second electric connecting member are adapted to be in contact with the lower substrate and the inductance connecting substrate respectively; The lower clamp further comprises a test assembly; the test assembly comprises an upper insulating plate and a lower insulating plate which are oppositely and spaced apart, and a fastener for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electric connecting member is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the lower substrate, and the lower insulating plate has a containing cavity which penetrates through the lower insulating plate, and the test diode is adapted to be embedded in the containing cavity; the test diode is adapted to be arranged in the press-contact type IGBT sub-module test adapter.

2. The press-pack IGBT sub-module test adapter of claim 1, wherein, The fastener is adapted to penetrate through the upper insulating plate, the lower insulating plate and the lower substrate.

3. The crimp-type IGBT sub-module test adapter of claim 1, wherein, The negative electrode substrate, the positive electrode substrate and the inductance connecting substrate are arranged in layers in sequence, a first insulating plate is arranged between the positive electrode substrate and the negative electrode substrate, and a second insulating plate is arranged between the inductance connecting substrate and the positive electrode substrate; the upper clamp is provided with a second through hole which penetrates through the inductance connecting substrate and the second insulating plate, and a third through hole which penetrates through the inductance connecting substrate, the second insulating plate, the positive electrode substrate and the first insulating plate in sequence, and one end of the first electric connecting member is adapted to be located in the second through hole; The upper clamp further comprises a gate-emitter assembly which is located in the third through hole and is connected with the negative electrode substrate, and the gate-emitter assembly comprises an emitter probe, one end of the emitter probe is electrically connected with the negative electrode substrate, and the emitter probe extends along the third through hole and is adapted to electrically connect the emitter of the IGBT sub-module.

4. The crimp-type IGBT sub-module test adapter of claim 3, wherein, The gate-emitter assembly further comprises a gate probe and an insulating connecting part; the insulating connecting part is located between one end of the gate probe and the negative electrode substrate, and the other end of the gate probe which is away from the insulating connecting part is adapted to be in contact with the gate of the IGBT sub-module.

5. The crimp-type IGBT sub-module test adapter of claim 3, wherein, One end of the first electric connecting member which is located in the second through hole is fixedly connected with the positive electrode substrate, and the other end of the first electric connecting member which is away from the positive electrode substrate is adapted to be separably arranged with the test assembly.

6. The crimp-type IGBT sub-module test adapter of claim 3, wherein, One end of the first electric connecting piece is arranged separately from the positive electrode substrate, and the other end of the first electric connecting piece is adapted to be fixedly connected with the upper insulating plate.

7. The crimp-type IGBT sub-module test adapter of claim 6, wherein, The positive electrode substrate is provided with a first limiting piece on the side surface facing the inductance connecting substrate, and the first limiting piece is located in the second through hole; the first limiting piece has a first limiting hole penetrating through the first limiting piece, and one end of the first electric connecting piece away from the upper insulating plate is adapted to be inserted into the first limiting hole.

8. The crimp-type IGBT sub-module test adapter according to claim 6 or 7, characterized in that The cross-sectional area of the second through hole is greater than or equal to the area of the orthogonal projection of the auxiliary measuring component on the lower substrate.

9. The crimp-type IGBT sub-module test adapter of claim 3, wherein, The lower clamp further comprises: an upper substrate located on part of the surface of the lower substrate; the upper substrate is provided with a first groove and a second groove, the first groove is adapted to be located directly below the second through hole, the first groove is adapted to place the auxiliary measuring component, and the second groove is adapted to be located directly below the third through hole, and the second groove is adapted to place the IGBT sub-module; one end of the second electric connecting piece is adapted to be in contact with the lower substrate surface of the side of the upper substrate.

10. The press-pack IGBT sub-module test adapter of claim 9, wherein, The number of the second grooves is several.

11. The press-pack IGBT sub-module test adapter of claim 10, wherein, The several second grooves are arranged around the first groove, and the several second grooves are centrally symmetrically distributed.

12. The press-pack IGBT sub-module test adapter of claim 9, wherein, The second electric connecting piece is fixedly connected with the lower substrate of the side of the upper substrate, and the other end of the second electric connecting piece away from the lower substrate is adapted to be separately arranged with the inductance connecting substrate; or the second electric connecting piece is fixedly connected with the inductance connecting substrate, and the other end of the second electric connecting piece away from the inductance connecting substrate is adapted to be separately arranged with the lower substrate surface of the side of the upper substrate.

13. The crimp-type IGBT sub-module test adapter of claim 1, wherein, The first electric connecting piece is a rigid piece or an elastic piece; when the first electric connecting piece is a rigid piece, the first electric connecting piece comprises a metal column; when the first electric connecting piece is an elastic piece, the first electric connecting piece comprises a spring probe; The second electric connecting piece is a rigid piece or an elastic piece; when the second electric connecting piece is a rigid piece, the second electric connecting piece comprises a metal column; when the second electric connecting piece is an elastic piece, the second electric connecting piece comprises a spring probe.

14. A press-pack IGBT sub-module test apparatus characterized by comprising: The crimping type IGBT sub-module test adapter comprises the crimping type IGBT sub-module test adapter according to any one of claims 1 to 13.

15. The crimp-type IGBT sub-module test apparatus according to claim 14, characterized by, Further comprising: An inductance coil, one end of the inductance coil is electrically connected with the inductance connecting substrate; A power supply, the positive electrode of the power supply is electrically connected with the other end of the inductance coil and the positive electrode substrate, and the negative electrode of the power supply is electrically connected with the negative electrode substrate; A driving unit, the driving unit is electrically connected with the gate of the IGBT sub-module and the negative electrode substrate.

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