A rack-mounted server liquid cooling and air cooling dual configuration integrated device

Abstract

The present invention relates to a rack-mounted server liquid cooling and air cooling dual configuration integrated device, belonging to the field of server heat dissipation technology, including a chassis, a butterfly card module, a memory module, a fan, a hard disk module, a battery, a mainboard and two CPUs are installed on the chassis, the fan is located between the memory module and the hard disk module, and a liquid cooling system module is also installed on the chassis, the liquid cooling system module includes a plurality of hard disk cold plates installed on the side of the hard disk module and a plurality of memory cold plates installed on the side of the memory module, and the CPU is covered with a CPU cold plate, and one end of all the hard disk cold plates is connected through a water divider, and all the memory cold plates are divided into three groups, and both ends of each group of memory cold plates are connected through a water divider. The present invention integrates an integrated liquid cooling heat dissipation module in a limited device space to achieve synergistic heat dissipation with the original fan air cooling configuration of the server, solves the problem of high frequency rotation speed caused by the fan on the basis of meeting the high power heat dissipation requirements of the server, and can reduce maintenance and repair costs.

Description

Technical Field

[0001] The invention relates to a liquid cooling and air cooling dual configuration integrated device for a rack-type server, belonging to the technical field of server heat dissipation. Background Art

[0002] With the rapid application and promotion of Internet technology, the demand for various servers has increased rapidly, and the heat dissipation problem of high-power, large-storage, and high-performance servers has become increasingly prominent. With the increase in heat dissipation demand, the traditional air-cooled heat dissipation of servers has limited internal space as a standard device, and it is impossible to meet the heat dissipation demand by increasing the number of fans, which makes the high power consumption, high speed, and high noise of fans prominent. Liquid cooling is a heat exchange cooling method that takes away heat by physically contacting the liquid cooling medium with the components with heat dissipation requirements. At present, the commonly used liquid cooling method in the field of server heat dissipation adopts the method of immersing the entire server in the liquid cooling medium to achieve heat exchange; there is also a method of using a separate liquid cooling plate attached to the surface of a single module to achieve heat dissipation of a single module. Immersion liquid cooling technology solves the heat dissipation problem to a certain extent by immersing the entire machine in a server cabinet filled with coolant, but it is expensive and requires high use conditions. At the same time, it is extremely difficult to repair and maintain, and the overall liquid medium needs to be emptied before it can be carried out. Therefore, a low-cost heat dissipation method that can meet the high-power heat dissipation demand of the server and facilitate maintenance and repair is urgently needed in this field. Summary of the invention

[0003] The purpose of the present invention is to provide a rack-mounted server liquid cooling and air cooling dual configuration integrated device in order to solve the above-mentioned problems.

[0004] The present invention is achieved through the following technical solutions:

[0005] That is, a rack-mounted server liquid cooling and air cooling dual configuration integrated device, including a chassis, a butterfly card module, a memory module, a fan, a hard disk module, a battery, a mainboard and two CPUs are installed on the chassis, the fan is located between the memory module and the hard disk module, the chassis is also equipped with a liquid cooling system module, the liquid cooling system module includes a plurality of hard disk cold plates installed on the side of the hard disk module and a plurality of memory cold plates installed on the side of the memory module, the CPU is covered with a CPU cold plate, one end of all the hard disk cold plates are connected through a water divider, all the memory cold plates are divided into three groups, and both ends of each group of memory cold plates are connected through a water divider;

[0006] The adjacent water dividers at the same end of the three groups of memory cold plates are connected by pipes, the two CPU cold plates are connected by pipes, and the water dividers on the hard disk module are connected to the adjacent water dividers of the two groups of memory cold plates on both sides through pipes. One of the CPU cold plates is connected to a liquid inlet pipe, and the water divider at the outer end of one of the outer groups of memory cold plates is connected to a liquid outlet pipe, and the other CPU cold plate is connected to the water divider at the outer end of an adjacent group of memory cold plates through a pipe.

[0007] The present invention aims to solve the heat dissipation problem of servers with high power consumption, large storage capacity and high performance. Traditional air cooling of servers has the problems of high power consumption, high rotation speed and severe noise. The heat dissipation cost of immersion liquid cooling technology is high and difficult to overhaul and maintain. The present invention integrates an integrated liquid cooling module in a limited device space without changing the original structure and configuration, so as to achieve synergistic heat dissipation with the original fan air cooling configuration of the server, solve the problem of high frequency rotation speed caused by the fan on the basis of meeting the high power heat dissipation requirements of the server, and effectively reduce the maintenance and overhaul costs. The basic idea of ​​mainly using liquid cooling for heat dissipation and using fan cooling as redundant configuration is to control the circulation flow mode of the liquid cooling medium in the liquid cooling system to achieve internal and external energy interaction of the server and meet the heat dissipation requirements of the server.

[0008] A further improvement of the present invention is that the hard disk module includes a plurality of hard disks arranged in a line, and a hard disk cold plate is closely disposed on one side of each hard disk;

[0009] The memory module includes multiple memory bars arranged in a line, and a memory cold plate is closely attached to one side of each memory bar. All memory bars are divided into three groups, and two CPUs are located between two adjacent groups of memory bars. Each hard disk and each memory bar has its own independent cooling structure, and the hard disk cold plate is closely attached to the side of the hard disk, and the memory cold plate is closely attached to the side of the memory bar, so that the cooling and heat dissipation of the hard disk and memory bar are more direct, with better effect and higher efficiency.

[0010] A further improvement of the present invention is that all the pipes are connected to each other through quick-connect plugs. In the present invention, multiple pipes are used, and the connection between the pipes adopts quick-connect plugs, which makes disassembly and assembly faster and more convenient.

[0011] A further improvement of the present invention is that the interfaces for connecting the pipes on the water distributor on the hard disk module are located at both ends of the water distributor. The coolant enters from one end of the water distributor, then flows through each hard disk cold plate, and finally flows out from the other end of the water distributor, thereby ensuring the cooling effect on each hard disk.

[0012] A further improvement of the present invention is that the interfaces for connecting the pipes on the three water distributors at the outer ends of the three groups of memory cold plates are located at both ends of the water distributors. The coolant enters from one end of the water distributor at the outer ends of the three groups of memory cold plates, then flows through each memory bar, and then flows out from one end of the water distributor at the outer ends of the three groups of memory cold plates, thereby ensuring the cooling effect on each memory bar.

[0013] A further improvement of the present invention is that the two ends of the three groups of memory cold plates and the hard disk cold plate are mounted on the chassis through a liquid cooling bracket, so that the memory cold plate and the hard disk cold plate can be easily disassembled and assembled on the chassis, and the mounting structure is simple and reliable.

[0014] A further improvement of the present invention is that the water inlet and outlet of the liquid cooling module at the ends of the liquid inlet pipe and the liquid outlet pipe are installed on the chassis through a consolidation valve block. The water inlet and outlet of the liquid cooling module at the ends of the liquid inlet pipe and the liquid outlet pipe are fixedly installed using the above structure, which is simple and reliable.

[0015] A further improvement of the present invention is that the hard disk is installed on the chassis through a guide member on the bottom surface of the chassis. The guide member plays a guiding role in the disassembly and assembly of the hard disk, making the disassembly and assembly convenient.

[0016] A further improvement of the present invention is that the guide member is made of plastic material, so as to avoid scratches on the hard disk during disassembly and assembly.

[0017] A further improvement of the present invention is that upper ends of all hard disk cold plates are connected by bolts and provided with upper covers, so that all hard disk cold plates can be disassembled and assembled as a whole, and the disassembly and assembly is efficient and quick.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention aims to solve the heat dissipation problem of servers with high power consumption, large storage capacity and high performance. Traditional air cooling of servers has the problems of high power consumption, high rotation speed and severe noise. The heat dissipation cost of immersion liquid cooling technology is high and difficult to overhaul and maintain. The present invention integrates an integrated liquid cooling module in a limited device space without changing the original structure and configuration, so as to achieve synergistic heat dissipation with the original fan air cooling configuration of the server, solve the problem of high frequency rotation speed caused by the fan on the basis of meeting the high power heat dissipation requirements of the server, and effectively reduce the maintenance and overhaul costs. The basic idea of ​​mainly using liquid cooling for heat dissipation and using fan cooling as redundant configuration is to control the circulation flow mode of the liquid cooling medium in the liquid cooling system to achieve internal and external energy interaction of the server and meet the heat dissipation requirements of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a specific implementation mode of the present invention.

[0022] Figure 2 It is a structural schematic diagram of a liquid cooling system module (first perspective) according to a specific embodiment of the present invention.

[0023] Figure 3 It is a structural schematic diagram of a liquid cooling system module (second perspective) according to a specific embodiment of the present invention.

[0024] Figure 4 It is a structural schematic diagram of liquid cooling of a hard disk module according to a specific embodiment of the present invention.

[0025] Figure 5 It is a schematic diagram of the exploded structure of liquid cooling of a hard disk module according to a specific embodiment of the present invention.

[0026] In the figure: 1. butterfly card module, 2. chassis, 3. memory module, 4. fan, 5. liquid inlet pipe, 6. hard disk module, 7. battery, 8. mainboard, 9. water inlet and outlet of liquid cooling module, 10. consolidation valve block, 11. liquid outlet pipe, 12. water distributor, 13. memory cold plate, 14. quick connect plug, 15. hard disk cold plate, 16. CPU cold plate, 17. liquid cooling bracket, 18. front window bracket, 19. bottom plate, 20. guide, 21. hard disk, 22. upper cover. DETAILED DESCRIPTION

[0027] The specific implementation modes of the present invention are further described in detail below with reference to the accompanying drawings.

[0028] like Figures 1 to 5 A rack-mounted server liquid cooling and air cooling dual configuration integrated device shown includes a chassis 2, on which a butterfly card module 1, a memory module 3, a fan 4, a hard disk module 6, a battery 7, a mainboard 8 and two CPUs are installed, the fan 4 is located between the memory module 3 and the hard disk module 6, and a liquid cooling system module is also installed on the chassis 2. The liquid cooling system module includes a plurality of hard disk cold plates 15 installed on the side of the hard disk module 6 and a plurality of memory cold plates 13 installed on the side of the memory module 3. The CPU is covered with a CPU cold plate 16, and one end of all the hard disk cold plates 15 is connected through a water divider 12, and all the memory cold plates 13 are divided into three groups, and both ends of each group of memory cold plates 13 are connected through a water divider 12;

[0029] The adjacent water dividers 12 at the same end of the three groups of memory cold plates 13 are connected by pipes, the two CPU cold plates 16 are connected by pipes, and the water dividers 12 on the hard disk module 6 are connected to the adjacent water dividers 12 of the two groups of memory cold plates 13 on both sides through pipes, one of the CPU cold plates 16 is connected to the liquid inlet pipe 5, the water divider 12 at the outer end of one outer group of memory cold plates 13 is connected to the liquid outlet pipe 11, and the other CPU cold plate 16 is connected to the water divider 12 at the outer end of an adjacent group of memory cold plates 13 through a pipe.

[0030] The present invention aims to solve the heat dissipation problem of high-power, large-storage, and high-performance servers. Traditional air-cooling heat dissipation of servers has the problems of high power consumption, high rotation speed, and severe noise. The heat dissipation cost of immersion liquid cooling technology is high, and overhaul and maintenance are difficult. The present invention integrates an integrated liquid cooling heat dissipation module in a limited device space without changing the original structure and configuration, thereby achieving coordinated heat dissipation with the original 4-fan air-cooling configuration of the server, solving the problem of high-frequency rotation speed caused by the fan on the basis of meeting the high-power heat dissipation requirements of the server, and effectively reducing maintenance and overhaul costs.

[0031] The hard disk module 6 includes a plurality of hard disks 21 arranged in a line, and a hard disk cold plate 15 is closely attached to one side surface of each hard disk 21;

[0032] The memory module 3 includes a plurality of memory bars arranged in a line, and a memory cold plate 13 is closely attached to one side of each memory bar. All memory bars are divided into three groups, and two CPUs are located between two adjacent groups of memory bars. Each hard disk 21 and each memory bar has its own independent cooling structure, and the hard disk cold plate 15 is closely attached to the side of the hard disk 21, and the memory cold plate 13 is closely attached to the side of the memory bar, so that the cooling and heat dissipation of the hard disk 21 and the memory bar is more direct, with better effect and higher efficiency.

[0033] Among them, all the pipes are connected to each other through the quick-connect plug 14. In the present invention, multiple pipes are used, and the connection between the pipes adopts the quick-connect plug 14, which makes the disassembly and assembly faster and more convenient.

[0034] The interfaces for connecting the pipes on the water divider 12 on the hard disk module 6 are located at both ends of the water divider 12. The coolant enters from one end of the water divider 12, then flows through each hard disk cold plate 15, and finally flows out from the other end of the water divider 12, ensuring the cooling effect on each hard disk 21.

[0035] A further improvement of the present invention is that the interfaces for connecting pipes on the three water distributors 12 at the outer ends of the three groups of memory cold plates 13 are located at both ends of the water distributors 12. The coolant enters from one end of the water distributor 12 at the outer ends of the three groups of memory cold plates 13, then flows through each memory bar, and then flows out from one end of the water distributor 12 at the outer ends of the three groups of memory cold plates 13, thereby ensuring the cooling effect on each memory bar.

[0036] Among them, the two ends of the three sets of memory cold plates 13 and the hard disk cold plate 15 are installed on the chassis 2 through the liquid cooling bracket 17. It is convenient to disassemble and assemble the memory cold plate 13 and the hard disk cold plate 15 on the chassis 2, and the installation structure is simple and reliable.

[0037] The liquid cooling module water inlet and outlet 9 at the ends of the liquid inlet pipe 5 and the liquid outlet pipe 11 are installed on the chassis 2 through the consolidation valve block 10. The liquid cooling module water inlet and outlet 9 of the liquid inlet pipe 5 and the liquid outlet pipe 11 are fixedly installed using the above structure, which is simple and reliable.

[0038] The hard disk 21 is installed on the chassis 2 through a guide member 20 made of plastic material on the bottom surface of the chassis 2. The guide member 20 guides the assembly and disassembly of the hard disk 21, making the assembly and disassembly convenient and preventing the hard disk 21 from being scratched during assembly and disassembly.

[0039] Among them, the upper ends of all the hard disk cold plates 15 are connected by bolts and provided with an upper cover plate 22. The overall disassembly and assembly of all the hard disk cold plates 15 can be realized, and the disassembly and assembly are efficient and fast.

[0040] Working principle:

[0041] The present invention aims to solve the heat dissipation problem of high-power, large-storage, and high-performance servers. Traditional air-cooling heat dissipation of servers has the problems of high power consumption, high rotation speed, and severe noise. The heat dissipation cost of immersion liquid cooling technology is high, and it is difficult to overhaul and maintain. The present invention integrates an integrated liquid cooling heat dissipation module in a limited device space without changing the original structure and configuration, thereby realizing collaborative heat dissipation with the original fan 4 air cooling configuration of the server, and solving the problem of high-frequency rotation speed caused by the fan on the basis of meeting the high-power heat dissipation requirements of the server, and can effectively reduce the maintenance and overhaul costs. The basic idea of ​​mainly using liquid cooling for heat dissipation and using fan 4 for heat dissipation as redundant configuration is to realize internal and external energy interaction of the server by controlling the circulation flow mode of the liquid cooling medium in the liquid cooling system, thereby meeting the heat dissipation requirements of the server.

[0042] The coolant enters through the liquid inlet pipe 5 and flows through two CPU cold plates 16 in sequence. After flowing out of the CPU cold plate 16, the coolant enters the adjacent water divider 12. Here, the coolant is divided into two paths. One path flows through a group of memory cold plates 13 and enters the water divider 12 on the hard disk module 6. The coolant flows through all the hard disk cold plates 15 through the water divider 12 and then passes through another group of memory cold plates 13, and finally flows out from the liquid outlet pipe 11.

[0043] The other path flows through the water distributor 12 , passes through a group of internal cold plates 13 , and finally flows out through the liquid outlet pipe 11 .

[0044] While the liquid cooling system module is running, the fan 4 is started to perform air cooling on the hard disk module 6 .

[0045] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0046] The terms "upper", "lower", "outer side", "inner side", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish the relative relationship in position if they exist, and do not need to be qualitative. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0047] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A rack-mounted server liquid cooling and air cooling dual configuration integrated device, comprising a chassis (2), on which a butterfly card module (1), a memory module (3), a fan (4), a hard disk module (6), a battery (7), a mainboard (8) and two CPUs are mounted, wherein the fan (4) is located between the memory module (3) and the hard disk module (6). It is characterized in that The chassis (2) is also provided with a liquid cooling system module, the liquid cooling system module comprising a plurality of hard disk cold plates (15) installed on the side of the hard disk module (6) and a plurality of memory cold plates (13) installed on the side of the memory module (3); the CPU is covered with a CPU cold plate (16); one end of all the hard disk cold plates (15) are connected via a water divider (12); all the memory cold plates (13) are divided into three groups; both ends of each group of memory cold plates (13) are connected via a water divider (12); The adjacent water dividers (12) at the same end of the three groups of memory cold plates (13) are connected through a pipeline, the two CPU cold plates (16) are connected through a pipeline, the water dividers (12) on the hard disk module (6) are connected to the adjacent water dividers (12) of the two groups of memory cold plates (13) on both sides through a pipeline, one of the CPU cold plates (16) is connected to a liquid inlet pipe (5), the water divider (12) at the outer end of one of the outer groups of memory cold plates (13) is connected to a liquid outlet pipe (11), and the other CPU cold plate (16) is connected to the water divider (12) at the outer end of an adjacent group of memory cold plates (13) through a pipeline; The hard disk module (6) comprises a plurality of hard disks (21) arranged in a line, and a hard disk cold plate (15) is closely attached to one side surface of each hard disk (21); The memory module (3) comprises a plurality of memory bars arranged in a line, a memory cold plate (13) being closely attached to one side surface of each memory bar, all the memory bars being arranged in three groups, and two CPUs being located between two adjacent groups of memory bars.

2. According to claim 1, a rack-mounted server liquid cooling and air cooling dual configuration integrated device, It is characterized in that All pipelines are connected to each other via quick-connect plugs (14).

3. According to claim 1, a rack-mounted server liquid cooling and air cooling dual configuration integrated device, It is characterized in that Interfaces for connecting pipes on the water distributor (12) on the hard disk module (6) are located at both ends of the water distributor (12).

4. The rack-mounted server liquid cooling and air cooling dual configuration integrated device according to claim 1, It is characterized in that Interfaces for connecting pipes on the three water distributors (12) at the outer ends of the three groups of internal cold plates (13) are located at both ends of the water distributors (12).

5. According to claim 1, a rack-mounted server liquid cooling and air cooling dual configuration integrated device, It is characterized in that The two ends of the three groups of memory cold plates (13) and the hard disk cold plate (15) are mounted on the chassis (2) via liquid cooling brackets (17).

6. The rack-mounted server liquid cooling and air cooling dual configuration integrated device according to claim 1, It is characterized in that The liquid cooling module water inlet and outlet (9) at the ends of the liquid inlet pipe (5) and the liquid outlet pipe (11) are mounted on the chassis (2) via a consolidation valve block (10).

7. The rack-mounted server liquid cooling and air cooling dual configuration integrated device according to claim 2, It is characterized in that The hard disk (21) is mounted on the chassis (2) via a guide member (20) on the bottom surface of the chassis (2).

8. The rack-mounted server liquid cooling and air cooling dual configuration integrated device according to claim 7, It is characterized in that The guide member (20) is made of plastic material.

9. The rack-mounted server liquid cooling and air cooling dual configuration integrated device according to claim 1, It is characterized in that An upper cover plate (22) is provided at the upper end of all hard disk cold plates (15) via bolt connection.

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