Mini LED patch detection method and related device

Abstract

The application provides a Mini LED patch detection method and related equipment, the method comprises the following steps: controlling a 2D camera to move to a first predetermined position and a second predetermined position, and performing face array 2D snapshot on a first reference Mark point and a second reference Mark point on a workpiece; correcting the moving path of a 3D camera and the 2D camera; controlling the 3D camera and the 2D camera to perform 3D image acquisition and 2D image acquisition on the chip on the workpiece according to the corrected moving path; performing defect detection on each 3D image and 2D image collected respectively, and storing the detection result in a serial number dictionary; and performing data fusion on each 3D image data and 2D image data, and storing the 3D image data and the 2D image data of each workpiece under the same bit number. The application has the beneficial effect that the 3D camera scanning outputs height data and chip surface difference data, quantifies the inclination degree of inclination and warping, and can improve the detection precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of patch detection, in particular to a MiniLED patch detection method and related equipment. BACKGROUND

[0002] At present, MiniLED patch detection is divided into pre-furnace detection and post-furnace detection after patching. The difference between the two is that the solder paste morphology on the pad changes after passing through the furnace, the chip height value decreases, and the temperature is different. The same is that the detection indicators are the same, the position degree of the chip relative to the pad: X, Y, angle deviation, the height of the chip top surface relative to the substrate and the warping and tilting of the chip top surface, the positive and negative polarity of the chip, whether there is a chip on the pad, obvious dirt and foreign matter around the pad and on the chip. In MiniLED patch detection, the workpiece is conveyed to the detection station by a belt, and the positioning accuracy of the photoelectric sensor is about 2mm and about 1 degree of inclination. The workpiece area includes multiple specifications from 150mm*150mm to 300mm*300mm, the MiniLED chip size is 0.18mm*0.1mm, and the positive and negative electrode feature size is 0.04mm*0.04mm.

[0003] The difficulty of MiniLED patch detection lies in the requirement of high detection accuracy, fast speed and large amount of detection data. Therefore, a new MiniLED patch detection method needs to be proposed. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a MiniLED patch detection method and related equipment to improve the detection accuracy of MiniLED patch.

[0005] To solve the above technical problems, the technical scheme adopted by the present application is as follows: a MiniLED patch detection method, comprising,

[0006] controlling the 2D camera to move to a first predetermined position and a second predetermined position, and performing face array 2D snapshot on a first reference Mark point and a second reference Mark point on the workpiece to obtain a photo containing the first reference Mark point and a photo containing the second reference Mark point;

[0007] Comparing the positions of the first reference Mark point and the second reference Mark point in the photos with the taught reference positions, calculating the position deviation of the current workpiece, and correcting the movement path of the 3D camera and the 2D camera according to the position deviation of the current workpiece;

[0008] controlling the 3D camera and the 2D camera to perform 3D image acquisition and 2D image acquisition on the chip on the workpiece according to the corrected movement path;

[0009] Respectively, each 3D image and 2D image collected for defect detection, and the detection results are stored in the serial number dictionary;

[0010] Each 3D image data and 2D image data are fused, and the 3D image data and 2D image data of each workpiece are stored under the same bit number.

[0011] Further, according to the position of the first reference Mark point and the second reference Mark point in the photo and the reference position of the teaching, the position deviation of the current workpiece is calculated, and the moving path of the 3D camera and the 2D camera is corrected according to the position deviation of the current workpiece, which specifically includes,

[0012] The camera coordinates of the first reference Mark point M1 and the second reference Mark point M2 are calculated;

[0013] The position change of the workpiece coordinate system established by the first reference Mark point M1 and the second reference Mark point M2 and the reference workpiece coordinate system of the teaching is calculated, and the calculation formula is:

[0014] A=tan -1 ((y m2 -y m1 ) / (x m2 -x m1 ))-tan -1 ((y c2 -y c1 ) / (x c2 -x c1 ))

[0015] The start point and the end point of the corrected scanning path are calculated, and the calculation formula of the start point and the end point of the scanning path is the same, and the calculation formula of the start point of the scanning path is:

[0016]

[0017] Wherein, A is an angle, (x w1 ,y w1 ) is the photographing position of the reference M1, (x m1 ,y m1 ) is the camera coordinate of the workpiece reference M1 during teaching, (x m2 ,y m2 ) is the camera coordinate of the workpiece reference M2 during teaching, (x c1 ,y c1 ) is the camera coordinate of the workpiece reference M1, (x c2 ,y c2 ) is the camera coordinate of the workpiece reference M2, (x w1 ,y w1) is the photographed position coordinate of the workpiece reference M1 in the world coordinate system, (x star1 ,y star1 ) is the photographed position start point of the teaching scanning path, (x cstar1 ,y cstar1 ) is the corrected photographed position start point of the scanning path.

[0018] Further, the control 3D camera and 2D camera collect 3D images and 2D images of the chips on the workpiece according to the corrected movement path, the size of the workpiece is 200mm x 220mm, the image size collected by the 2D camera each time is 7.5mm x 7.5mm, 23 3D scanning lines are set for each workpiece, and 20 times of snapshot are set for each 3D scanning line.

[0019] Further, the collected each 3D image and 2D image are detected for defects respectively, and the detection results are stored in the serial number dictionary, specifically including,

[0020] In the collected 2D image, the pad and the chip are approximately rectangular, the rectangular close operation and open operation combination are used to filter interference and extract the rectangle; linear gray scale enhancement is performed on different gray scales of the pad and the chip respectively to separate the pad; in the pad area, the chip is extracted, and the polarity feature is extracted; in the pad adjacent area, defects are detected;

[0021] In the collected 3D image, whether the height of the pad and the chip in the 3D image is normal is detected, and whether the plane of the pad and the chip is inclined is detected.

[0022] The detection results of the 2D image and the 3D image are stored in the serial number dictionary.

[0023] Further, after the 3D image and the 2D image are collected, further comprising calculating the chip position number of the MiniLED in the 3D image and the 2D image, specifically:

[0024] Calculating the coordinates in the camera coordinate system of the first RGB chip group in the unit scanning field of view;

[0025] Calculating the coordinates of the first RGB chip group in the world coordinate system;

[0026] Converting the coordinates of the first RGB chip group in the world coordinate system into the coordinates in the workpiece coordinate system;

[0027] In the workpiece coordinate system, the RGB chip groups are equally spaced in rows and columns, and thus the row and column numbers of the RGB chip groups on the workpiece are calculated;

[0028] According to the consistent order of the RGB groups, the chip position number of the MiniLED is generated according to the configuration setting.

[0029] Further, the 3D image data and the 2D image data are fused, and the 3D image data and the 2D image data of each workpiece are stored under the same bit number, specifically including,

[0030] When each 3D camera scan completes a 3D image, the 2D image data collected by the corresponding 2D camera is fused to the 3D image data scanned by each scan line, and the fused data is stored under the same bit number.

[0031] Further, the detection method after the MiniLED patching further includes,

[0032] The image data with defects detected is screened out and stored in the serial number dictionary according to the bit number.

[0033] The application also provides a detection device after MiniLED patching, which comprises,

[0034] The reference Mark point acquisition module is used for controlling the 2D camera to move to a first predetermined position and a second predetermined position, and performing face array 2D snapshot on a first reference Mark point and a second reference Mark point on the workpiece to obtain a photo containing the first reference Mark point and a photo containing the second reference Mark point.

[0035] The movement path correction module is used for comparing the positions of the first reference Mark point and the second reference Mark point in the photos with the taught reference positions, calculating the position deviation of the current workpiece, and correcting the movement path of the 3D camera and the 2D camera according to the position deviation of the current workpiece.

[0036] The image acquisition module is used for controlling the 3D camera and the 2D camera to perform 3D image acquisition and 2D image acquisition on the chip on the workpiece according to the corrected movement path.

[0037] The defect detection module is used for respectively performing defect detection on each 3D image and 2D image collected, and storing the detection results in the serial number dictionary.

[0038] The data fusion module is used for fusing the 3D image data and the 2D image data, and storing the 3D image data and the 2D image data of each workpiece under the same bit number.

[0039] The application also provides a computer device, which comprises a memory and a processor, the memory stores a computer program, and the processor implements the detection method after MiniLED patching when executing the computer program.

[0040] The application further provides a storage medium storing a computer program, which can realize the MiniLED patch detection method as described above when executed by a processor.

[0041] The application has the beneficial effect that whether there is a foreign matter in the detection image is detected through a 2D camera to collect a planar image, and 3D scanning is performed through the camera to output height data and chip surface difference data, so that the inclination degree of inclination and warping is quantified, and the detection accuracy can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on these drawings.

[0043] Figure 1 The MiniLED patch detection method flow chart of the embodiment of the present application;

[0044] Figure 2 The MiniLED patch detection device block diagram of the embodiment of the present application;

[0045] Figure 3 The MiniLED patch detection method specific implementation flow chart of the embodiment of the present application;

[0046] Figure 4 The image data processing flow chart of the MiniLED patch detection method of the embodiment of the present application. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0048] It should be noted that the description of "first", "second" and the like in the present application is only for the purpose of description and cannot be understood as indicating or implying the relative importance of the technical features indicated or implying the number of technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0049] As shown in Figure 1 The first embodiment of the present application is a MiniLED patch detection method, comprising,

[0050] S10, control the 2D camera to move to the first predetermined position and the second predetermined position, and perform face array 2D snapshot on the first reference Mark point and the second reference Mark point on the workpiece, to obtain a photo containing the first reference Mark point and a photo containing the second reference Mark point;

[0051] S20, comparing the positions of the first reference Mark point and the second reference Mark point in the photos with the reference positions of the teaching, calculating the position deviation of the current workpiece, and correcting the moving path of the 3D camera and the 2D camera according to the position deviation of the current workpiece;

[0052] S30, control the 3D camera and the 2D camera to collect 3D images and 2D images of the chips on the workpiece according to the corrected moving path;

[0053] S40, respectively detecting defects of each collected 3D image and 2D image, and storing the detection results in a serial number dictionary;

[0054] S50, data fusion of each 3D image data and 2D image data, and storage of 3D image data and 2D image data of each workpiece under the same bit number.

[0055] Further, in step S20, according to the positions of the first reference Mark point and the second reference Mark point in the photos and the reference positions of the teaching, the position deviation of the current workpiece is calculated, and the moving path of the 3D camera and the 2D camera is corrected according to the position deviation of the current workpiece, which specifically comprises,

[0056] Calculate the coordinates of the first reference Mark point M1 and the second reference Mark point M2 in the camera coordinate system;

[0057] The position change of the workpiece coordinate system established by the first reference Mark point M1 and the second reference Mark point M2 and the position of the reference workpiece coordinate system of the teaching is calculated; the calculation formula is:

[0058] A = tan -1 ((y m2 -y m1 ) / (x m2 -x m1 ))-tan -1 ((y c2 -y c1 ) / (x c2 -x c1 ))

[0059] The start point and the end point of the corrected scanning path photographing position are calculated, and the calculation formula of the start point and the end point of the scanning path photographing position is the same, and the calculation formula of the start point of the scanning path photographing position is:

[0060]

[0061] Wherein, A is an angle, (x w1 ,y w1 ) is the photographing position of the reference M1, (x m1 ,y m1 ) is the coordinate of the workpiece reference M1 in the camera coordinate system during teaching, (x m2 ,y m2 ) is the coordinate of the workpiece reference M2 in the camera coordinate system during teaching, (x c1 ,y c1 ) is the coordinate of the workpiece reference M1 in the camera coordinate system, (x c2 ,y c2 ) is the coordinate of the workpiece reference M2 in the camera coordinate system, (x w1 ,y w1 ) is the photographing position coordinate of the workpiece reference M1 in the world coordinate system, (x star1 ,y star1 ) is the start point of the scanning path photographing position during teaching, and (x cstar1 ,y cstar1 ) is the start point of the corrected scanning path photographing position.

[0062] The mechanical positioning gap of the workpiece is 2mm, the scanning path is 200mm long, the angle error is ±0.5°, and the unit scanning field is 7.5mm x 7.5mm. If the scanning path is not corrected, the chip will be offset from the unit scanning field. The correction of the scanning path makes the start point and the end point of the photographing position on the scanning path follow the position change of the workpiece reference M1 and M2, and according to the current position (x c1 ,y c1 ) of M1 and M2, (x c2 ,y c2) and the teaching reference position (x m1 ,y m1 ), (x m2 ,y m2 ) are calculated, the start and end points of the photographing position on the scanning path are corrected, and the intermediate photographing positions are calculated at equal intervals. The photographing positions of the reference M1 (x w1 ,y w1 ), the photographing positions of the reference M2 (x w2 ,y w2 ). The start point of the photographing position on the teaching scanning path (x star1 ,y star1 )...(x starn ,y starn ), the end point of the photographing position on the scanning path (x end1 ,y end1 )...(x endn ,y endn ). The start point of the photographing position on the corrected scanning path (x cstar1 ,y cstar1 )...(x cstarn ,y cstarn ), the end point of the photographing position on the scanning path (x cend1 ,y cend2 )...(x cendn ,y cendn ).

[0063] Further, in step S30, the 3D camera and the 2D camera are controlled to collect 3D images and 2D images of the chips on the workpiece according to the corrected movement path, the size of the workpiece is 200mm x 220mm, the image size collected by the 2D camera each time is 7.5mm x 7.5mm, 23 3D scanning lines are set for each workpiece, and 20 times of snapshot are set for each 3D scanning line.

[0064] Further, in step S40, the collected 3D images and 2D images are respectively detected for defects, and the detection results are stored in a serial number dictionary, which specifically includes,

[0065] In the collected 2D images, the pads and the chips are approximately rectangular, and the rectangular close operation and open operation combination are used to filter interference and extract the rectangle; linear gray scale enhancement is performed on different gray scales of the pads and the chips to separate the pads; in the pad area, the chips are extracted, and the polarity feature is extracted; and in the pad adjacent area, defects are detected.

[0066] For the collected 3D images, whether the height of the pads and the chips in the 3D images is normal is detected, and whether the planes of the pads and the chips are inclined is detected.

[0067] The detection results of the 2D images and the 3D images are stored in the serial number dictionary.

[0068] Further, after the 3D image and the 2D image are collected, the chip position number of the MiniLED in the 3D image and the 2D image is calculated, specifically:

[0069] The coordinates of the first RGB chip group in the camera coordinate system are calculated in the unit scanning field of view;

[0070] The coordinates of the first RGB chip group in the world coordinate system are calculated;

[0071] The coordinates of the first RGB chip group in the world coordinate system are converted into the coordinates in the workpiece coordinate system; the calculation formula is:

[0072] B = tan -1 ((y c2 -y c1 ) / (x c2 -x c1 ))

[0073]

[0074] (x t ,y t ) is the coordinates of the RGB chip group in the workpiece coordinate system;

[0075] (x in ,y in ) is the coordinates of the first chip group in the camera coordinate system;

[0076] In the workpiece coordinate system, the RGB chip group has equal spacing in rows and columns, and thus the row and column numbers of the RGB chip group on the workpiece are calculated; the calculation formula is:

[0077]

[0078] RowIndex is the row number;

[0079] ColIndex is the column number;

[0080] Round is rounding a value to the nearest integer;

[0081] Abs is taking the absolute value of a value;

[0082] (x t ,y t ) is the coordinates of the chip group in the workpiece coordinate system;

[0083] (x org ,y org ) is the coordinates of the first chip group in the workpiece coordinate system;

[0084] SpaceX is the chip group column spacing under the workpiece coordinate system;

[0085] SpaceY is the chip group row spacing under the workpiece coordinate system;

[0086] According to the order of RGB group, the bit number of the chip of MiniLED is generated according to the configuration setting.

[0087] Further, in step S50, the data of each 3D image data and 2D image data is fused, and the 3D image data and 2D image data of each workpiece are stored under the same bit number, which specifically includes,

[0088] When each 3D camera scan completes a 3D image, the 2D image data collected by the corresponding 2D camera is fused into the 3D image data scanned by each scan line, and the fused data is stored under the same bit number.

[0089] The 3D and 2D field of view width is set to be the same 7.5mm, the same scan line is scanned, a scan line image data is merged, and is pushed to display. At the data structure level, LedPoint class, LedGroup class, and LedPlane class are created. LedPoint class corresponds to each detection data of the chip, the attributes include 2D items and 3D items, and the methods include Clone, 3D assignment, 2D assignment, display, and bit number generation. LedGroup class, the attributes include LedPoint class member dictionary containing RGB, chip group coordinates, row and column numbers, and the methods include member LedPoint class generation method, coordinate update, and display. LedPlane class, the attributes include LedGroup class member dictionary, row and column data, and group data, and the methods include LedGroup class dictionary generation method, adjacent chip group position update method, and display. Each workpiece corresponds to one LedPlane class dictionary, and each scan field of view corresponds to one LedPlane class in the workpiece dictionary according to the scan serial number. 2D and 3D data are different LedPlane class dictionary instances, but the ID of LedPoint class is calculated according to the bit number of the workpiece coordinate system, the bit number has uniqueness, and 2D and 3D data are merged according to the bit number.

[0090] Further, the detection method of the MiniLED patch further includes,

[0091] The image data detected to have defects is screened out and stored in the sequence number dictionary according to the bit number.

[0092] As shown in Figure 3 the detection method of the MiniLED patch of the embodiment of the application is shown in the specific implementation flowchart;

[0093] As shown in Figure 4The figure data processing flow chart of the detection method after the Mini LED patch of the embodiment of the application is shown.

[0094] In this embodiment, whether there is a foreign matter in the detection image is detected by collecting a planar image by a 2D camera, and height data and chip surface difference data are output by 3D scanning of the camera, so as to quantify the inclination degree of inclination and warping, and improve the detection accuracy.

[0095] As shown in the figure, Figure 2 The application also provides a detection device after Mini LED patching, comprising,

[0096] The reference Mark point acquisition module 10 is used for controlling the 2D camera to move to a first predetermined position and a second predetermined position, and performing face array 2D snapshot on a first reference Mark point and a second reference Mark point on the workpiece, to obtain a photo containing the first reference Mark point and a photo containing the second reference Mark point;

[0097] The movement path correction module 20 is used for comparing the positions of the first reference Mark point and the second reference Mark point in the photos with the taught reference positions, calculating the position deviation of the current workpiece, and correcting the movement paths of the 3D camera and the 2D camera according to the position deviation of the current workpiece;

[0098] The image acquisition module 30 is used for controlling the 3D camera and the 2D camera to perform 3D image acquisition and 2D image acquisition on the chips on the workpiece according to the corrected movement paths;

[0099] The defect detection module 40 is used for respectively performing defect detection on each 3D image and 2D image collected, and storing the detection results in a serial number dictionary;

[0100] The data fusion module 50 is used for performing data fusion on each 3D image data and 2D image data, and storing the 3D image data and 2D image data of each workpiece under the same bit number.

[0101] The application also provides a computer device, which comprises a memory and a processor, the memory stores a computer program, and the processor implements the detection method after Mini LED patching as described above when executing the computer program.

[0102] The application also provides a storage medium, which stores a computer program, and the computer program can implement the detection method after Mini LED patching as described above when executed by a processor.

[0103] It should be noted that the specific implementation process of the detection device after the Mini LED patch can be clearly understood by those skilled in the art, and can refer to the corresponding description in the foregoing method embodiments. For the convenience and brevity of description, it will not be repeated here.

[0104] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A method for testing MiniLEDs after mounting, characterized in that: include, Control the 2D camera to move to the first and second predetermined positions and perform area array 2D aerial photography on the first and second reference mark points on the workpiece to obtain photos containing the first and second reference mark points. The position deviation of the current workpiece is calculated by comparing the positions of the first and second reference mark points in the photograph with the reference positions shown in the teaching, and the movement paths of the 3D camera and 2D camera are corrected based on the position deviation of the current workpiece. Control the 3D and 2D cameras to acquire 3D and 2D images of the chip on the workpiece according to the corrected movement path; Defect detection is performed on each acquired 3D and 2D image, and the detection results are stored in a sequence number dictionary. Each 3D image and 2D image data is fused together, and the 3D and 2D image data of each workpiece are stored under the same tag.

2. The inspection method after MiniLED patch mounting as described in claim 1, characterized in that: By comparing the positions of the first and second reference mark points in the photograph with the taught reference positions, the current workpiece's positional deviation is calculated. Based on this deviation, the movement paths of the 3D and 2D cameras are corrected. Calculate the camera coordinates of the first reference mark point M1 and the second reference mark point M2; Calculate the positional change between the workpiece coordinate system established by the first reference mark point M1 and the second reference mark point M2 and the taught reference workpiece coordinate system; the calculation formula is: A=tan -1 ((and m2 -and m1 ) / (x m2 -x m1 ))-so -1 ((and c2 -and c1 ) / (x c2 -x c1 )) Calculate the start and end points of the corrected scan path image position. The calculation formulas for the start and end points of the scan path image position are the same. The calculation formula for the start point of the scan path image position is: Where A is the angle, (x w1 ,y w1 (x) is the base M1 camera position, (x) m1 ,y m1 (x) represents the coordinates of the workpiece reference M1 in the camera coordinate system during teaching. m2 ,y m2 (x) represents the coordinates in the camera coordinate system during teaching of workpiece datum M2. c1 ,y c1 (x) represents the coordinates of the workpiece reference M1 in the camera coordinate system. c2 ,y c2 (x) represents the coordinates of the workpiece reference M2 in the camera coordinate system. w1 ,y w1 (x) represents the photographic position coordinates of workpiece datum M1 in the world coordinate system. star1 ,y star1 (x) represents the starting point of the scanning path for teaching, where (x) is the image capture location. cstar1 ,y cstar1 () represents the starting point of the image capture position in the corrected scan path.

3. The inspection method after MiniLED patch mounting as described in claim 1, characterized in that: In the process of controlling the 3D camera and 2D camera to perform 3D and 2D image acquisition on the chip on the workpiece according to the calibrated movement path, the size of the workpiece is 200mm x 220mm, the size of each image acquired by the 2D camera is 7.5mm x 7.5mm, 23 3D scanning lines are set for each workpiece, each 3D scanning line is set to take 20 shots, and each scanning line has 20 shooting positions.

4. The inspection method after MiniLED patch mounting as described in claim 1, characterized in that: Defect detection is performed on each acquired 3D and 2D image separately, and the detection results are stored in a sequence dictionary, specifically including: In the acquired 2D image, both the pads and the chip are approximately rectangular. By combining the closing and opening operations of the rectangle, interference is filtered out and the rectangle is extracted. Linear gray-scale enhancement is performed on the different gray levels of the pads and the chip to separate the pads. In the pad area, the chip is extracted and its polarity features are extracted. Inspect for defects in the area adjacent to the solder pads; For the acquired 3D images, check whether the height of the pads and chips in the 3D images is normal, and check whether the planes of the pads and chips are tilted; The detection results of 2D and 3D images are stored in a sequence dictionary.

5. The inspection method after MiniLED patch mounting as described in claim 1, characterized in that: After acquiring the 3D and 2D images, the process also includes calculating the chip reference number of the MiniLED in the 3D and 2D images, specifically: Calculate the coordinates of the first RGB chipset in the camera coordinate system within the unit's scan field of view; Calculate the coordinates of the first RGB chipset in the world coordinate system; The coordinates of the first RGB chipset in the world coordinate system are transformed into coordinates in the workpiece coordinate system; In the workpiece coordinate system, the RGB chipset is spaced equally in rows and columns, and the row and column numbers of the RGB chipset on the workpiece can be calculated from this. Based on the consistent order of the RGB groups and the configuration settings, the chip reference number of the MiniLED is generated.

6. The inspection method after MiniLED patch mounting as described in claim 1, characterized in that: The data is fused from each 3D image and 2D image, storing the 3D and 2D image data of each workpiece under the same reference number. Specifically, this includes... When each 3D camera completes scanning of a 3D image, the 2D image data acquired by the corresponding 2D camera is fused into the 3D image data scanned by each scan line, and the fused data is stored under the same reference number.

7. The inspection method after MiniLED patch mounting as described in claim 6, characterized in that: It also includes, Defective image data is filtered out and stored in a sequence dictionary according to its bit number.

8. A detection device after MiniLED patch mounting, characterized in that: include, The reference mark point acquisition module is used to control the 2D camera to move to the first and second predetermined positions and to perform area array 2D aerial photography on the first and second reference mark points on the workpiece to obtain a photo containing the first reference mark point and a photo containing the second reference mark point. The motion path correction module is used to calculate the current workpiece's position deviation by comparing the positions of the first and second reference mark points in the photograph with the taught reference positions, and to correct the motion paths of the 3D and 2D cameras based on the current workpiece's position deviation. The image acquisition module is used to control the 3D camera and 2D camera to perform 3D and 2D image acquisition on the chip on the workpiece according to the corrected movement path. The defect detection module is used to perform defect detection on each acquired 3D and 2D image separately, and store the detection results in a sequence number dictionary; The data fusion module is used to fuse each 3D image data and 2D image data, storing the 3D image data and 2D image data of each workpiece under the same tag.

9. A computer device, characterized in that: The computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements the detection method after MiniLED patch mounting as described in any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium stores a computer program, which, when executed by a processor, can implement the detection method after MiniLED patch mounting as described in any one of claims 1 to 7.

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