Semiconductor chip package testing apparatus
By linking the lifting chip testing device with the chip picking mechanism, automated testing of computer chip packaging and testing equipment is realized, solving the problems of high labor intensity and low efficiency caused by manual operation in the existing technology, and improving testing efficiency and safety.
CN115662913BActive Publication Date: 2026-06-23WENZHOU CITY UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WENZHOU CITY UNIV
- Filing Date
- 2022-09-22
- Publication Date
- 2026-06-23
Smart Images
Figure CN115662913B_ABST
Abstract
The application relates to a semiconductor chip packaging test device, which comprises a test table, a chip positioning detection device on the test table, a chip testing device above the chip positioning detection device, a transmission top plate, a current probe, a plurality of negative pressure elastic expansion pipes, a chip pickup mechanism, a pickup driving connecting rod, a pickup transmission gear set and a pickup arm.
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