Intelligent power module and terminal device having the same

Abstract

The application discloses an intelligent power module and a terminal device with the same, and belongs to the technical field of power modules.The intelligent power module comprises a package body, a power chip and a control IC chip are arranged in the package body, the power chip is electrically connected with the control IC chip, power pins and control IC pins are led out from opposite two sides of the package body respectively, the power pins are connected with the power chip, the control IC pins are connected with the control IC chip, and a bottom surface of the package body is a heat dissipation surface; the package body is provided with a first step at a side of the heat dissipation surface adjacent to the power pins, a mesa of the first step is lower than the heat dissipation surface, and a first creepage protrusion is arranged on the first step.The intelligent power module according to the embodiment of the application has the advantages of safe creepage distance, good heat dissipation and the like without damaging the integrity of the heat sink.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an intelligent power module and a terminal device having the same. Background Art

[0002] Intelligent power modules (IPMs) in the related art have short creepage distances between the power pins and the heat sink, as well as between the control IC pins and the heat sink. This typically requires grooving the heat sink to increase creepage distances and comply with safety regulations. However, the power module's structural space is limited, resulting in a small heat dissipation area. Grooving the heat sink reduces the contact area of ​​the IPM, thus reducing heat dissipation capacity. Furthermore, the complex process of grooving the heat sink compromises its integrity and reduces its structural strength. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an intelligent power module that does not require damage to the integrity of the heat sink and has advantages such as safe creepage distance and good heat dissipation.

[0004] The present invention also provides a terminal device with an intelligent power module.

[0005] To achieve the above-mentioned objectives, an embodiment of the first aspect of the present invention provides an intelligent power module, comprising: a package body, wherein a power chip and a control IC chip are arranged in the package body, the power chip is electrically connected to the control IC chip, power pins and control IC pins are respectively led out from two opposite side surfaces of the package body, the power pins are connected to the power chip, and the control IC pins are connected to the control IC chip, and the bottom surface of the package body is a heat dissipation surface; the package body has a first step on a side of the heat dissipation surface adjacent to the power pin, the table of the first step is lower than the heat dissipation surface, and a first creepage protrusion is provided on the first step.

[0006] The intelligent power module according to the embodiment of the present invention does not need to destroy the integrity of the heat sink and has the advantages of safe creepage distance and good heat dissipation.

[0007] According to some specific embodiments of the present invention, a height of the first creepage protrusion in the thickness direction of the package body is smaller than a distance from the first step to the heat dissipation surface.

[0008] According to some specific embodiments of the present invention, there are multiple power pins, and the multiple power pins are arranged along the length direction of the package body; the first creepage protrusion is a ridge extending along the length direction of the package body.

[0009] According to some embodiments of the present application, the package has a second step adjacent to one side of the control IC pins, the second step has a lower height than the heat dissipation surface, and a second creepage bump is arranged on the second step.

[0010] According to some embodiments of the present application, the control IC pins are multiple, and the multiple control IC pins are arranged along the length direction of the package, and the second creepage bump is a ridge extending along the length direction of the package.

[0011] According to some embodiments of the present application, the ridge is one, or the ridge is multiple, and the multiple ridges are arranged along the width direction of the package.

[0012] Further, the multiple ridges have different heights in the thickness direction of the package.

[0013] According to some embodiments of the present application, the height of the ridge closer to the heat dissipation surface is greater, or the height of the ridge closer to the heat dissipation surface is smaller.

[0014] According to some embodiments of the second aspect of the present application, a terminal device is provided, comprising: the intelligent power module according to the embodiments of the first aspect of the present application; a heat sink, which is attached to the heat dissipation surface of the intelligent power module; and a controller, which is electrically connected to the intelligent power module.

[0015] The terminal device according to the embodiments of the present application does not need to damage the integrity of the heat sink, and has the advantages of safe creepage distance, good heat dissipation, and the like.

[0016] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be understood through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a schematic diagram of the assembly of an intelligent power module and a heat sink in the prior art;

[0019] Figure 2 is a schematic diagram of the structure of an intelligent power module according to the embodiments of the present application;

[0020] Figure 3 is a schematic diagram of the structure inside an intelligent power module according to the embodiments of the present application;

[0021] Figure 4is a schematic diagram of assembling an intelligent power module and a heat sink according to an embodiment of the present invention;

[0022] Figure 5 FIG. 4 is a partial schematic diagram of the first step of an intelligent power module according to an embodiment of the present invention.

[0023] Reference numerals:

[0024] Existing technology:

[0025] Intelligent power module 1', heat sink 20', package 100', power pin 400', control IC pin 500',

[0026] The present invention:

[0027] Intelligent power module 1, package 100, power chip 200, control IC chip 300, power pin 400,

[0028] Control IC pin 500, first step 110, first creepage bump 111, second step 120,

[0029] The second creepage protrusion 121 , the ridge 10 , and the heat sink 20 . DETAILED DESCRIPTION

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0032] In the description of the present invention, "plurality" means two or more.

[0033] In the description of the present invention, a first feature being “on” or “under” a second feature may include the first and second features being in direct contact with each other, or the first and second features not being in direct contact with each other but being in contact with each other via another feature therebetween.

[0034] In the description of the present invention, “on”, “above” and “above” a first feature of a second feature include the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0035] First, an intelligent power module 1 ′ in the prior art is described.

[0036] like Figure 1 As shown, the power chip 200' in the prior art power module 1' generates significant heat during operation. This heat is transferred to the bottom surface of the package 100', forming a heat dissipation surface. This heat dissipation surface can exchange heat through contact with the heat sink 20'. The control IC pins 500' and power pins 400' are encapsulated in the package 100' and extended from opposite sides of the package 100'. The heat dissipation surface is relatively close to the control IC pins 500' and the power pins 400'. To ensure insulation between the control IC pins 500' and the heat dissipation surface, and to prevent electrical conduction from the heat dissipation surface to the heat sink 20', creepage distances must be increased to comply with safety regulations. Grooving the heat sink 20' is necessary, but this reduces the contact area between the heat sink 20' and the heat dissipation surface, resulting in a reduced heat dissipation area. Furthermore, the side of the heat sink 20' facing away from the fins is thinner, making machining more difficult and reducing the structural strength of the heat sink 20'.

[0037] The following describes an intelligent power module 1 according to an embodiment of the present invention.

[0038] like Figure 2-Figure 5 As shown, according to an embodiment of the present invention, an intelligent power module 1 is provided, which includes a package body 100 .

[0039] The package 100 houses a power chip 200 and a control IC chip 300. The power chip 200 is electrically connected to the control IC chip 300. Power pins 400 and control IC pins 500 extend from opposite sides of the package 100, respectively. The power pins 400 connect to the power chip 200, while the control IC pins 500 connect to the control IC chip 300. The bottom surface of the package 100 serves as a heat sink. The package 100 has a first step 110 on the side of the heat sink adjacent to the power pin 400. The top surface of the first step 110 is lower than the heat sink, and a first creepage bump 111 is provided on the first step 110.

[0040] For example, the bottom surface of the first step 110 forms a certain height difference with the heat dissipation surface, so that when the power pins 400 and the control IC pins 500 are extended from the side of the package 100, they are separated by a certain distance from the heat dissipation surface in the thickness direction of the package 100. The heat dissipation surface can be installed in conjunction with the heat sink 20, or it can be used to dissipate heat independently. The package 100 can be made of epoxy resin, which has certain insulation and pressure resistance, providing protection for the power chip 200 and control IC chip 300 inside. The control IC pins 500 and power pins 400 are respectively connected to external circuits to form an electrical circuit.

[0041] According to the intelligent power module 1 of the embodiment of the present invention, a first step 110 is formed by the package body 100. This creates a certain height difference between the power pin 400 and the heat dissipation surface along the thickness direction of the package body 100. The first step 110 increases the creepage distance between the power pin 400 and along the edge of the package body 100. Furthermore, the first step 110 provides sufficient space for the first creepage bump 111. When the heat dissipation surface is attached to the heat sink 20, the first creepage bump 111 does not contact the surface of the heat sink 20.

[0042] Furthermore, by constructing the first creepage protrusion 111, the creepage distance of the cross-sectional edge of the first step 110 is longer, thereby providing greater insulation between the power pin 400 and the heat dissipation surface and preventing the occurrence of creepage. The power pin 400 can be extended from the side surfaces of the two long sides of the package 100, creating a larger heat dissipation area on the bottom surface of the package 100. For example, the bottom surface of the package 100 is provided with a heat dissipation copper plate, which is exposed from the bottom surface of the package 100. The first creepage protrusion 111 can prevent current from being conducted along the edge of the package 100 to the heat dissipation surface, thereby increasing the creepage distance and improving the insulation effect. In this way, when the heat dissipation surface is attached to the heat sink 20, the surface of the heat sink 20 can completely cover the heat dissipation surface of the package 100, ensuring good heat dissipation. The overall structure of the heat sink 20 does not need to be grooved, and its integrity is not damaged. The package material is relatively easy to process, making it easier to form the first step 110 and the first creepage protrusion 111.

[0043] Therefore, the intelligent power module 1 according to the embodiment of the present invention does not need to destroy the integrity of the heat sink 20 and has the advantages of safe creepage distance and good heat dissipation.

[0044] In some specific embodiments of the present invention, Figure 4 As shown, the height of the first creepage protrusion 111 in the thickness direction of the package body 100 is smaller than the distance from the first step 110 to the heat dissipation surface.

[0045] When the heat dissipation surface is attached to the heat sink 20, the surface of the heat sink 20 attached to the heat dissipation surface exceeds the edge of the heat dissipation surface. The first creepage protrusion 111 can form a certain gap with the heat sink 20 to prevent the power pin 400 from contacting the heat sink 20 and generating creepage.

[0046] In some specific embodiments of the present invention, Figure 2 As shown, there are a plurality of power pins 400 , which are arranged along the length direction of the package body 100 . The first creepage protrusion 111 is a ridge 10 extending along the length direction of the package body 100 .

[0047] Specifically, multiple power pins 400 are distributed along a long side of the package 100 and spaced apart, fully utilizing the space within the package 100. The power pins 400 all exit the package 100 from the same side. For example, the cross-sectional shape of the first creepage bump 111 is consistent along its length, resulting in a relatively large creepage distance from each power pin 400 to the heat sink. This ensures good insulation between the current flowing through each power pin 400 and the heat sink, ensuring safety and reliability.

[0048] In some specific embodiments of the present invention, the package body 100 has a second step 120 on a side of the heat dissipation surface adjacent to the control IC pin 500 . The surface of the second step 120 is lower than the heat dissipation surface. A second creepage bump 121 is disposed on the second step 120 .

[0049] Thus, a certain height difference is formed between the bottom surface of the second step 120 and the heat dissipation surface, ensuring that the control IC pin 500, when extended from the side of the package 100, is spaced a certain distance from the heat dissipation surface in the thickness direction of the package 100. By constructing the second step 120 and the second creepage protrusion 121, an undulating structure is formed on the stepped surface forming the second step 120, extending the creepage distance from the control IC pin 500 to the heat dissipation surface and also preventing creepage between the control IC pin 500 and the heat dissipation surface.

[0050] In some specific embodiments of the present invention, Figure 2 As shown, there are a plurality of control IC pins 500 , and the plurality of control IC pins 500 are arranged along the length direction of the package body 100 . The second creepage protrusion 121 is a ridge 10 extending along the length direction of the package body 100 .

[0051] Specifically, the control IC pins 500 are extended from the package 100 along the long side opposite the power pins 400. Multiple control IC pins 500 are spaced apart along the other long side of the package 100, with the power pins 400 and control IC pins 500 extending from opposite sides of the package 100, fully utilizing the space within the package 100. For example, the cross-sectional shape of the second creepage bump 121 is consistent at all points along its length, ensuring that the creepage distance from each control IC pin 500 to the heat sink is equal. This ensures that the current at each control IC pin 500 is well insulated from the heat sink, ensuring safety and reliability.

[0052] Furthermore, if Figure 3 、 Figure 4 and Figure 5 As shown, the cross section of the ridge 10 is configured as a trapezoid, a triangle, or a rectangle.

[0053] The cross-section of the rib 10 is triangular, trapezoidal, or rectangular, which is convenient for processing. Furthermore, the rib 10 configured as a trapezoid, triangle, or rectangle can extend the creepage distance and provide good insulation. When the rib 10 is configured as a trapezoid or triangle and multiple ribs are provided, large gaps can form between adjacent ribs 10, making conduction difficult. A rectangular cross-section of the rib 10 can provide a greater creepage distance, thereby saving space while ensuring the required creepage distance.

[0054] In some specific embodiments of the present invention, Figure 3 and Figure 4 As shown, there is one ridge 10 , or there are multiple ridges 10 , and the multiple ridges 10 are arranged along the width direction of the package body 100 .

[0055] Among them, the number of ridges 10 can be selected according to the width of the first step 110 and the second step 120. When the width of the first step 110 and the second step 120 is small, only one ridge 10 can be set. When the width of the first step 110 and the second step 120 is large, multiple ridges 10 can be set. The multiple ridges 10 are arranged at intervals in the width direction of the first step 110 or the second step 120 where they are located.

[0056] When there is only one ridge 10, a certain gap exists between the ridge 10 and the sidewall of the first step 110, ensuring a longer creepage distance between the power pin 400 or the control IC pin 500 and the heat sink. When there are multiple ridges 10, creepage grooves are formed between adjacent ridges 10, and between the sidewall of the first step 110 or the second step 120 and the innermost ridge 10. This creates a greater creepage distance between adjacent ridges 10, as well as between the sidewall of the first step 110 or the second step 120 and adjacent ridges 10, resulting in better insulation.

[0057] Furthermore, the heights of the multiple ridges 10 along the thickness direction of the package body 100 are unequal. It is understood that the unequal heights of at least two of the multiple ridges 10 along the thickness direction of the package body 100 do not necessarily mean that all ridges 10 have unequal heights. For example, one of the adjacent ridges 10 may be taller and the other shorter. This reduces the likelihood of conduction between adjacent ridges 10, further improving creepage safety. Furthermore, the unequal heights of the multiple ridges 10 make it less likely for moisture and dust to accumulate between adjacent ridges 10, effectively ensuring insulation between the power pins 400 and the heat dissipation surface, and between the control IC pins 500 and the conductive surface.

[0058] In some specific embodiments of the present invention, the closer the ridge 10 is to the heat dissipation surface, the greater the height is, or the closer the ridge 10 is to the heat dissipation surface, the smaller the height is.

[0059] The height of each ridge 10 gradually increases or decreases toward the heat dissipation surface, and processing is relatively convenient. The ridge 10 can adapt to the shape design of the radiator 20. Each ridge 10 has a large distance from the heat dissipation surface and the surface of the radiator 20 that contacts the heat dissipation surface, and adjacent ridges 10 are not easily conductive, which further prevents creepage and improves safety.

[0060] In some specific embodiments of the present invention, the power pin 400 and / or the control IC pin 500 are high-voltage side pins of the intelligent power module 1 .

[0061] The high-voltage side pins require a larger creepage distance. The first creepage protrusion 111 and the second creepage protrusion 121 are constructed by the first step 110 and the second step 120 of the package body 100, which has a good protection effect on the high-voltage side pins and improves the electrical safety at the power pins 400 and the control IC pins 500.

[0062] The following describes a terminal device according to an embodiment of the present invention.

[0063] The terminal device according to the embodiment of the present invention comprises the intelligent power module 1 according to the above embodiment of the present invention, a heat sink 20 and a controller. The heat sink 20 is attached to the heat dissipation surface of the intelligent power module 1. The controller is electrically connected to the intelligent power module 1.

[0064] The heat sink 20 may be an aluminum part. Since aluminum is a conductive part, the first creepage protrusion 111 and the second creepage protrusion 121 are provided in the intelligent power module to improve the insulation of the package 100 and prevent the heat sink 20 from being charged.

[0065] The terminal device according to the embodiment of the present invention utilizes the intelligent power module 1 according to the above embodiment of the present invention, without destroying the integrity of the heat sink 20 , and has the advantages of safe creepage distance and good heat dissipation.

[0066] Other structures and operations of the intelligent power module 1 and the terminal device according to the embodiment of the present invention are well known to those skilled in the art and will not be described in detail here.

[0067] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0068] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. An intelligent power module, characterized in that: include: A package body, wherein a power chip and a control IC chip are disposed within the package body, the power chip being electrically connected to the control IC chip, power pins and control IC pins being led out from two opposite sides of the package body, the power pins being connected to the power chip, and the control IC pins being connected to the control IC chip, and the bottom surface of the package body being a heat dissipation surface; The package body has a first step on a side of the heat dissipation surface adjacent to the power pin, the surface of the first step is lower than the heat dissipation surface, and a first creepage protrusion is provided on the first step; Among them, the first creepage protrusion is a ridge extending along the length direction of the package body, and there are multiple ridges. The multiple ridges are arranged along the width direction of the package body, and the heights of the multiple ridges in the thickness direction of the package body are not equal, and the closer the ridge is to the heat dissipation surface, the greater the height, or, the closer the ridge is to the heat dissipation surface, the smaller the height.

2. The intelligent power module according to claim 1, characterized in that: A height of the first creepage protrusion in the thickness direction of the package body is smaller than a distance from the first step to the heat dissipation surface.

3. The intelligent power module according to claim 1, wherein: There are multiple power pins, and the multiple power pins are arranged along the length direction of the package body; The first creepage protrusion is a ridge extending along the length direction of the package body.

4. The intelligent power module according to claim 1, wherein: The package body has a second step on a side of the heat dissipation surface adjacent to the control IC pin, the table surface of the second step is lower than the heat dissipation surface, and a second creepage protrusion is provided on the second step.

5. The intelligent power module according to claim 4, characterized in that: There are a plurality of control IC pins, and the plurality of control IC pins are arranged along the length direction of the package body. The second creepage protrusion is a ridge extending along the length direction of the package body.

6. The intelligent power module according to claim 3 or 5, characterized in that: The cross section of the ridge is configured as a trapezoid, a triangle or a rectangle.

7. A terminal device, characterized in that: include: The intelligent power module according to any one of claims 1 to 6; a heat sink, the heat sink being in contact with a heat dissipation surface of the intelligent power module; A controller is electrically connected to the intelligent power module.

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