A low-orbit satellite terminal communication power amplifier structure

Abstract

The present invention discloses a low-orbit satellite terminal communication power amplifier structure, comprising a plurality of functional modules that are independently arranged and can be combined and disassembled with each other: a radio frequency amplifier module: an radio frequency power chip and a filter device are arranged inside to amplify the radio frequency signal energy; a power supply control module: installed below the radio frequency amplifier module and electrically connected to the radio frequency amplifier module and the heat dissipation system module to power and control the radio frequency amplifier and the heat dissipation system; a heat dissipation system module: installed on top of the radio frequency amplifier module to achieve active and passive heat dissipation of the heating components in the radio frequency amplifier module. The present invention designs the radio frequency amplifier module, the power supply control module and the heat dissipation system module as modules, which are independent of each other and can be connected or disassembled with each other, are easy to repair and replace, are suitable for mass production, and solve the problems of difficult maintenance and poor interchangeability.

Description

Technical Field

[0001] The present invention relates to the technical field of low-orbit satellite terminal communications, and in particular to a low-orbit satellite terminal communications power amplifier structure within the Ku or Ka frequency band. Background Art

[0002] Low-orbit satellite communication systems offer advantages such as wide bandwidth, low latency, and global coverage. Because their transmission signals are mostly in the Ka or Ku bands, which are relatively high frequencies, corresponding satellite communication terminals can be miniaturized and portable, enhancing their market competitiveness. The corresponding RF signal amplifier, an essential component of satellite communication terminals, has parameters such as size and performance that directly impact the terminal's size and performance. Therefore, designing a universal, compact, high-power RF signal amplifier is essential.

[0003] Currently, there are few products available on the market that fit this niche. The only similar invention currently available is "Chassis, Power Amplifiers, and Communications Equipment," which uses contact conduction for heat dissipation, resulting in low heat conduction efficiency. Furthermore, the lack of modular design results in poor repairability and replacement. Furthermore, the heat dissipation device fails to optimize the shape of the heat dissipation teeth, and the electromagnetic isolation between the RF circuit board and the power supply circuit board is insufficiently reliable. Other related products also have numerous drawbacks. Typically, high-power products are bulky and custom-made, making them difficult to use and maintain. Furthermore, due to their high power, they often use water cooling, which further increases overall power consumption and reduces heat dissipation efficiency.

[0004] In view of the above, the present invention integrates various technologies to invent a small power amplifier structure for low-orbit satellite terminal communications, with an effective working power of about 10W and a corresponding heat dissipation of about 60W. Summary of the Invention

[0005] The present invention aims to provide a low-orbit satellite terminal communication power amplifier structure within the Ku or Ka frequency band, which solves the above-mentioned technical problems existing in the existing power amplifier.

[0006] The present invention provides a low-orbit satellite terminal communication power amplifier structure, comprising a plurality of independent functional modules that can be combined and split into two or more modules, namely:

[0007] RF amplifier module: It contains RF power chips and filter components to amplify RF signal energy.

[0008] Power supply control module: installed below the RF amplifier module and electrically connected to the RF amplifier module and the heat dissipation system module to realize power supply and control of the RF amplifier and the heat dissipation system;

[0009] Heat dissipation system module: installed on the top of the RF amplifier module to achieve active and passive heat dissipation of the heating components in the RF amplifier module;

[0010] The radio frequency amplifier module, the power supply control module and the heat dissipation system module are connected by screws to form a rectangular parallelepiped power amplifier structure.

[0011] As a further improvement of the present invention, the RF amplifier module includes a RF packaging shell, which has a layered structure, with an upper layer stacked with a RF circuit board a, an absorbing material, an upper cover and a packaging cover; a lower layer stacked with a RF circuit board b and a lower cover; the RF circuit board a and the RF circuit board b are separated by a metal structure; and also includes standard interfaces arranged on the opposite side walls of the RF packaging shell.

[0012] As a further improvement of the present invention, a matching groove is opened on the top of the RF packaging shell corresponding to the position of the protruding power chip on the RF circuit board a, and the gap between the power chip and the corresponding groove is filled through a brazing process to achieve a good heat conduction structure.

[0013] As a further improvement of the present invention, the sealing of the upper cavity of the RF packaging shell is achieved by a laser welding process between the packaging cover and the RF packaging shell.

[0014] As a further improvement of the present invention, the power supply control module includes a power supply control shell, a power supply control circuit board is installed in the power supply control shell, and the top and bottom of the power supply control shell are respectively covered with a power supply shell upper cover and a power supply shell lower cover; it also includes a power supply control interface tooling that is detachably mounted on the side of the power supply control shell and electrically connected to the power supply control circuit board, and a pluggable power supply control interface installed on the power supply control interface tooling; it also includes a through-hole capacitor installed on the power supply control shell, one end of the through-hole capacitor extends into the power supply control shell and is electrically connected to the power supply control circuit board, and the other end extends to the outside of the power supply control shell and is electrically connected to the cooling fan in the cooling system module.

[0015] As a further improvement of the present invention, there are multiple power supply control interface fixtures, and the power supply connector models on each power supply control interface fixture are different.

[0016] As a further improvement of the present invention, the heat dissipation system module includes a heat dissipation structure, a heat dissipation fan, and a heat dissipation cover; the horizontal width of the RF amplifier module is smaller than the width of the power supply control module; the heat dissipation structure is L-shaped, with one end pressing on the top of the RF amplifier module and the other end pressing on the top of the power supply control module to cover the RF amplifier module; the heat dissipation cover is sealed on the exposed side of the heat dissipation structure to form a heat dissipation duct in the heat dissipation structure, and the heat dissipation fan is installed on the heat dissipation structure facing the heat dissipation duct to blow air into the heat dissipation duct for active heat dissipation.

[0017] As a further improvement of the present invention, a plurality of heat dissipation teeth are provided in the heat dissipation structure corresponding to the positions of the heat dissipation ducts, and the ratio between the tooth spacing between two adjacent heat dissipation teeth and the thickness of the heat dissipation teeth is close to 3.

[0018] As a further improvement of the present invention, the tooth spacing of the heat dissipation teeth is 3.5 mm, and the thickness of the heat dissipation teeth is 1.2 mm.

[0019] As a further improvement of the present invention, the heat dissipation fan is installed at an end of the heat dissipation structure away from the radio frequency amplifier module.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The low-orbit satellite terminal communication power amplifier structure provided by the present invention designs the radio frequency amplifier module, power supply control module and heat dissipation system module into modules, which are independent of each other and can be connected or disassembled to each other. This not only solves the problems of difficult maintenance and poor interchangeability, but also is suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural diagram of the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0023] Figure 2 It is a structural diagram of the radio frequency amplifier module in the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0024] Figure 3 This is an exploded structural diagram of the radio frequency amplifier module in the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0025] Figure 4 It is a structural diagram of the power supply control module in the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0026] Figure 5 This is an exploded structural diagram of the power supply control module in the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the heat dissipation system module in the low-orbit satellite terminal communication power amplifier structure of the present invention;

[0028] Figure 7 It is an exploded structural diagram of the heat dissipation system module in the low-orbit satellite terminal communication power amplifier structure of the present invention.

[0029] Among them: 1. Packaging cover; 2. Upper cover; 3. Absorbing material; 4. RF circuit board a; 5. Standard interface; 6. RF packaging shell; 7. RF circuit board b; 8. Lower cover; 9. Power supply shell upper cover; 10. Power supply control circuit board; 11. Power supply control shell; 12. Power supply control interface tooling; 13. Power supply control interface; 14. Feedthrough capacitor; 15. Power supply shell lower cover; 16. Heat dissipation cover a; 17. Heat dissipation structure; 18. Heat dissipation cover b; 19. Cooling fan. DETAILED DESCRIPTION

[0030] Hereinafter, example embodiments will be described more fully with reference to the accompanying drawings, but the example embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art.

[0031] In the absence of conflict, the embodiments of the present invention and the features thereof may be combined with each other.

[0032] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0033] The terms used herein are used only to describe specific embodiments and are not intended to limit the present invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms "comprising" and / or "made of" are used in this specification, the presence of the features, integers, steps, operations, elements, and / or components is specified, but the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof is not precluded.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be understood to have an idealized or overly formal meaning unless expressly defined as such herein.

[0035] Example 1

[0036] To address the challenges of difficult repair and poor replacement of damaged components in low-orbit satellite terminal communication power amplifiers, an embodiment of the present invention provides a low-orbit satellite terminal communication power amplifier structure. To facilitate a better understanding of the technical solution for those skilled in the art, the present invention provides a detailed description of the low-orbit satellite terminal communication power amplifier structure, with reference to the accompanying drawings.

[0037] like Figure 1 As shown, the present invention provides a low-orbit satellite terminal communication power amplifier structure. The entire device is only about 65mm×58mm×140mm in size and includes multiple functional modules that are independently arranged and can be combined and split with each other. Each functional module implements different functions. Specifically, the multiple functional modules are:

[0038] RF amplifier module: It has RF power chips and filter components inside to amplify RF signal energy, conduct heat for the power chip, and shield high-frequency signals.

[0039] Power supply control module: installed below the RF amplifier module and electrically connected to the RF amplifier module and the heat dissipation system module to realize power supply and control of the RF amplifier and the heat dissipation system;

[0040] Heat dissipation system module: installed on the top of the RF amplifier module to achieve active and passive heat dissipation of the heating components in the RF amplifier module;

[0041] The radio frequency amplifier module, the power supply control module and the heat dissipation system module are connected by screws to form a rectangular power amplifier structure.

[0042] The low-orbit satellite terminal communication power amplifier structure provided by the present invention designs the radio frequency amplifier module, power supply control module and heat dissipation system module into modules, which are independent of each other and can be connected or disassembled to each other. This not only solves the problems of difficult maintenance and poor interchangeability, but also is suitable for mass production.

[0043] Example 2

[0044] like Figure 2 and Figure 3As shown, in this embodiment, the RF amplifier module includes an RF packaging shell 6, which has a accommodating cavity inside. A metal structure is arranged in the accommodating cavity so that the RF packaging shell 6 forms a layered structure, and the metal structure is made of a metal material that can shield electromagnetic signals; of course, the metal structure can be a separate structure from the RF packaging shell 6 and be independently arranged, or it can be an integrated structure with the RF packaging shell 6, and the two are made of the same material; an RF circuit board a4, an absorbing material 3, an upper cover 2 and a packaging cover 1 are stacked in the cavity of the upper layer of the RF packaging shell 6, and the absorbing material 3 covers the top of the RF circuit board a4, and then the upper cover 2 is installed on the absorbing material 3, and the upper cover 2 is fixed by screws, and the RF circuit board a4, the absorbing material 3 and the upper cover 2 are all located in the cavity of the upper layer of the RF packaging shell 6; finally, the packaging cover 1 is arranged on the top of the upper cavity and is sealed and fixed to the top edge of the RF packaging shell 6. Specifically, the packaging cover 1 and the RF packaging shell 6 are welded and sealed by a laser welding process to achieve the sealing of the RF packaging shell 6 and the packaging cover 1, thereby achieving the sealing of the upper cavity.

[0045] The structure of the upper layer of the RF packaging shell 6 of the present invention is designed with a stacked structure of absorbing material 3, upper cover 2, and packaging cover 1 to protect the RF circuit board a4. Combined with the laser welding process, the upper cavity of the RF packaging shell 6 is sealed, effectively preventing the leakage of RF signals and achieving perfect electromagnetic shielding.

[0046] The RF circuit board b7 and the lower cover 8 are stacked in the cavity of the lower layer of the RF packaging shell 6. The RF circuit board b is mainly used to supply power and control the RF circuit board a. It is installed on the lower side of the RF packaging shell 6 and fixed with the lower cover 8 by screws. The RF circuit board a4 and the RF circuit board b7 are separated by a metal structure; it also includes a standard interface 5, specifically SMA-K, arranged on the opposite side walls of the RF packaging shell 6. The two standard interfaces 5 are respectively the RF input and the RF output. There are standard SMA-K connectors on both sides of the RF signal input and output of the RF packaging shell 6. "IFi+CLK" is engraved on the shell on the RF input side, and "RFo" is engraved on the shell on the RF output side. The RF packaging shell 6 is designed with a flange structure and fixing threaded holes for connection with other modules. The present invention solves the problem of electromagnetic interference between circuits with different functions by designing the RF amplifier module in upper and lower layers and separating the RF circuit board a4 from the RF circuit board b7 with a metal structure, and can well achieve electromagnetic shielding.

[0047] Furthermore, in order to improve the thermal conductivity and facilitate the conduction of heat from the heating chip, a matching groove is opened on the top of the RF packaging shell 6 corresponding to the position of the protruding power chip on the RF circuit board a4, and the gap between the power chip and the corresponding groove is filled through a brazing process to achieve a good thermal conduction structure.

[0048] It's important to note that the primary components on RF circuit board a include RF power chips and filter components. The RF power chip is the primary heat-generating component in the system. RF circuit board a performs functions such as signal filtering, amplification, and control. RF circuit board a is mounted on the upper side of RF package housing 6, with components such as the power amplifier chip facing downward.

[0049] In a further implementation scheme of the low-orbit satellite terminal communication power amplifier structure provided by the present invention, a groove is designed on the RF packaging shell 6 to match the position design of the raised components, especially the power chip, on the RF circuit board a in the RF amplification module, and the gap between the power chip and the corresponding groove is filled by a brazing process. This process can realize the efficient conduction of the heat of the heat-generating power chip to the RF packaging shell 6, and further conduct it to the heat dissipation system module. This design solves the problem of heat conduction of the heating device, improves the heat conduction efficiency, and achieves more effective heat dissipation.

[0050] Example 3

[0051] like Figure 4 and Figure 5 As shown, in this embodiment, the power supply control module includes a power supply control shell 11, in which a power supply control circuit board 10 is installed, and the top and bottom of the power supply control shell 11 are respectively covered with a power supply shell upper cover 9 and a power supply shell lower cover 15; it also includes a power supply control interface tooling 12 that is detachably mounted on the side of the power supply control shell 11 and electrically connected to the power supply control circuit board 10, and a power supply control interface 13 that is pluggable and mounted on the power supply control interface tooling 12; it also includes a through-hole capacitor 14 that is inserted through the power supply control shell 11, and there are two through-hole capacitors 14 that are arranged side by side. One end of the through-hole capacitor 14 extends into the power supply control shell 11 and is electrically connected to the power supply control circuit board 10, and the other end extends to the outside of the power supply control shell 11 for electrical connection to the cooling fan 19 in the cooling system module.

[0052] The power supply control circuit board 10 mainly includes components such as a power chip and a temperature sensor. The power supply control circuit board 10 realizes the conversion of DC power supply voltage and supplies power to the cooling fan 19 of the RF amplifier module and the cooling system module. The power supply control circuit board 10 is installed on the power supply control housing 11. The upper cover 9 of the power supply control housing is fixed to the top of the power supply control circuit board 10 with screws, and the screws are connected to the power supply control housing 11; the lower cover 18 of the power supply housing is connected to the power supply control housing 11 with screws; the power supply control module is also designed with a power supply control interface tooling 12, which is connected to the power supply control housing 11 by screws for easy replacement. Different models of power supply control interfaces 13 can be replaced within its size range. The power supply control interface 13 used in this scheme is J30J-15ZK; in order to facilitate power supply to the cooling fan 19 in the cooling system module, two M2.5 threaded holes are reserved on the power supply control housing 11, and a through-hole capacitor 14 of M2.5 specification is installed. The through-hole capacitor 14 is connected to the power supply control circuit board 10 at one end inside the power supply control housing 11, and connected to the cooling fan 19 in the cooling system module at one end outside the power supply control housing 11.

[0053] The power supply control module of the present invention solves the problem of power supply of the cooling fan 19 in the cooling system module by providing a power supply structure of two through-hole capacitors 14. Because the most important thing about the modular design is that each assembly can be carried out independently, this structure ensures the power supply of the cooling system module fan.

[0054] Specifically, for convenience and to improve the applicability of the amplifier structure, there are multiple power supply control interface tooling 12, and the power supply connector model on each power supply control interface tooling 12 is different, so that when the type of the power supply control interface 13 changes, the power supply control interface tooling 12 can be replaced to adapt to the new power supply control interface 13.

[0055] The power supply control module of the present invention is designed with a power supply control interface tool 12 , so that the user can easily replace different power supply control interfaces 13 by directly replacing the power supply control interface tool 12 .

[0056] Example 4

[0057] like Figure 6 and Figure 7As shown, in this embodiment, the heat dissipation system module includes a heat dissipation structure 17, a heat dissipation fan 19, and a heat dissipation cover; the width of the RF amplifier module in the horizontal direction is smaller than the width of the power supply control module, so that when the RF amplifier module is installed on the top of the power supply control module, a step structure is formed; the heat dissipation structure 17 is set in an L shape, which is just pressed on the step structure, and one end of the heat dissipation structure 17, that is, a free end, is pressed on the top of the RF amplifier module, and the other end, that is, the other free end, is pressed on the top of the power supply control module to cover the RF amplifier module. With this structural setting, the contact area between the heat dissipation system module and the RF amplifier module is increased, the heat conduction area is increased, the conduction efficiency is increased, the heat dissipation efficiency is improved, and it is beneficial to the heat dissipation of the RF amplifier module; the heat dissipation structure adopts an L-shaped design; the heat dissipation cover is sealed on The exposed open side of the heat dissipation structure 17 is used to form a heat dissipation duct in the heat dissipation structure 17; specifically, in this embodiment, since one side of the heat dissipation structure 17 is fitted with other components and is not exposed to the external environment, in this embodiment, heat dissipation covers are only provided on the top surface and the front side surface of the heat dissipation structure 17, which are heat dissipation cover a19 and heat dissipation cover b18 respectively. Thus, a closed structure is formed all around the heat dissipation structure 17, and a heat dissipation duct with open ends is formed in the heat dissipation structure 17; a heat dissipation fan 19 is installed on the heat dissipation structure 17 facing the heat dissipation duct, that is, one of the open ends of the heat dissipation duct, to blow air into the heat dissipation duct 19, and use the air flow to take away the heat on the heat dissipation teeth in the heat dissipation duct 19 and discharge it from the other open end, so as to actively dissipate heat and ensure heat dissipation efficiency.

[0058] It should be noted here that passive heat dissipation in the heat dissipation system module refers to heat dissipation by heat conduction when the heat dissipation system module is in contact with the RF amplifier module.

[0059] Further, such as Figure 7 As shown, a plurality of heat dissipation teeth are provided in the heat dissipation structure 17 corresponding to the position of the heat dissipation duct, and the ratio between the tooth spacing of two adjacent heat dissipation teeth and the thickness of the heat dissipation teeth is close to 3. It should be noted here that close to 3 means a ratio of about 3, which can be slightly greater than 3 or slightly less than 3.

[0060] The heat dissipation tooth structure of the heat dissipation structural component in the present invention is optimized and designed based on thermodynamic theory and fluid mechanics theory. The optimization parameters are a heat dissipation tooth thickness of 1.2 mm, a heat dissipation tooth spacing of 3.5 mm, or a ratio of the heat dissipation tooth spacing to the heat dissipation tooth thickness close to 3. Through the optimized design of the heat dissipation tooth structure, higher efficiency heat dissipation can be achieved at the same weight. Calculations show that after the heat dissipation teeth are optimized, the system temperature is reduced by 12°C, ensuring that the temperature of the entire machine is below 65°C under an ambient temperature of 25°C.

[0061] As an optional embodiment of the present invention, the tooth spacing of the heat dissipation teeth is 3.5 mm, and the thickness of the heat dissipation teeth is 1.2 mm.

[0062] In order to prevent the power chip from heating up and affecting other components, the cooling fan 19 is installed at the end of the heat dissipation structure 17 away from the RF amplifier module, that is, the end pressed on the top of the power supply control module.

[0063] Furthermore, the selection of the specifications of the cooling fan 19 is based on the required air volume calculated based on the heat consumption of the entire machine. After calculation, this embodiment selects a 3.6W axial flow fan, which is installed on the heat dissipation structure 17 and adopts a blowing method. The installation position is away from the main heat source, that is, one end of the power chip. This design can prevent the heat generated by the heat source from causing damage to other parts.

[0064] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for purposes of limitation. In some embodiments, it will be apparent to those skilled in the art that, unless otherwise expressly indicated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the invention as set forth in the appended claims.

Claims

1. A low-orbit satellite terminal communication power amplifier structure, characterized in that: The entire device measures only about 65mm×58mm×140mm and includes multiple independent functional modules that can be combined and disassembled with each other, namely: RF amplifier module: It contains RF power chips and filter components to amplify RF signal energy. Power supply control module: installed below the RF amplifier module and electrically connected to the RF amplifier module and the heat dissipation system module to realize power supply and control of the RF amplifier and the heat dissipation system; Heat dissipation system module: installed on the top of the RF amplifier module to achieve active and passive heat dissipation of the heating components in the RF amplifier module; The radio frequency amplifier module, the power supply control module and the heat dissipation system module are connected by screws to form a rectangular parallelepiped power amplifier structure; The RF amplifier module includes an RF package housing having a layered structure, wherein an RF circuit board a, an absorbing material, an upper cover, and a package cover are stacked on the upper layer; an RF circuit board b and a lower cover are stacked on the lower layer; the RF circuit boards a and b are separated by a metal structure; and standard interfaces are provided on opposite side walls of the RF package housing; It is characterized in that a matching groove is opened on the top of the RF packaging shell corresponding to the position of the power chip protruding on the RF circuit board a, and the gap between the power chip and the corresponding groove is filled by a brazing process to achieve a good heat conduction structure; The sealing of the upper cavity of the RF packaging shell is achieved by laser welding between the packaging cover and the RF packaging shell; The power supply control module includes a power supply control shell, a power supply control circuit board is installed in the power supply control shell, and the top and bottom of the power supply control shell are respectively covered with a power supply shell upper cover and a power supply shell lower cover; it also includes a power supply control interface tooling that is detachably mounted on the side of the power supply control shell and electrically connected to the power supply control circuit board, and a pluggable power supply control interface mounted on the power supply control interface tooling; it also includes a through-hole capacitor arranged on the power supply control shell, one end of the through-hole capacitor extends into the power supply control shell and is electrically connected to the power supply control circuit board, and the other end extends outside the power supply control shell and is electrically connected to the cooling fan in the cooling system module; There are multiple power supply control interface fixtures, and the power supply connector models on each power supply control interface fixture are different; The heat dissipation system module includes a heat dissipation structure, a heat dissipation fan, and a heat dissipation cover; the horizontal width of the RF amplifier module is smaller than the width of the power supply control module; the heat dissipation structure is L-shaped, with one end pressing on the top of the RF amplifier module and the other end pressing on the top of the power supply control module to cover the RF amplifier module; the heat dissipation cover is sealed on the exposed side of the heat dissipation structure to form a heat dissipation duct in the heat dissipation structure, and the heat dissipation fan is installed on the heat dissipation structure facing the heat dissipation duct to blow air into the heat dissipation duct for active heat dissipation; A plurality of heat dissipation teeth are provided in the heat dissipation structure at positions corresponding to the heat dissipation air ducts, and a ratio between a tooth spacing between two adjacent heat dissipation teeth and a thickness of the heat dissipation teeth is close to 3; The tooth spacing of the heat dissipation teeth is 3.5 mm, and the thickness of the heat dissipation teeth is 1.2 mm; The heat dissipation fan is installed at one end of the heat dissipation structure away from the radio frequency amplifier module.

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