Metal wire grid polarizer and preparation method thereof, and display device

Abstract

A metal wire grid polarizer (1), a preparation method, and a display device. The metal wire grid polarizer (1) comprises a base substrate (11) and a plurality of metal wire grids (12); the base substrate (11) has a plurality of binding areas (14) and a plurality of binding alignment areas (15); the plurality of metal wire grids (12) are arranged on the base substrate (11), the plurality of metal wire grids (12) are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids (12) on the base substrate (11) do not overlap with the plurality of binding areas (14) and the plurality of binding alignment areas (15). The metal wire grids (12) are prevented from blocking light during the binding process, so that the alignment process proceeds smoothly and the binding accuracy is achieved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of display technology, and in particular to a metal wire grid polarizer, a method for preparing the metal wire grid polarizer, and a display device including the metal wire grid polarizer. Background Art

[0002] The largest screen device that we can touch in our daily life is TV products. With the change of consumer consumption concept, TV has begun to develop in the direction of intelligence and large screen. For many consumers, 55-inch TV may be the standard, but more and more manufacturers have begun to launch 65-inch, 75-inch, and 80-inch large-screen TVs. It can be foreseen that the screen area of ​​TV will increase. The production capacity of large-size LCD screens continues to rise, and the market competition is more intense.

[0003] Currently, when a circuit board and a flexible circuit board are bound to a display substrate or a light control substrate, the presence of a metal wire grid polarizer on the back of the display substrate or the light control substrate makes it impossible to carry out the alignment process, making it difficult to achieve accurate binding. Summary of the invention

[0004] The embodiments of the present disclosure provide a metal wire grid polarizer, a method for preparing the metal wire grid polarizer, and a display device including the metal wire grid polarizer, which can achieve binding accuracy.

[0005] In one embodiment of the present disclosure, a metal wire grid polarizer is provided, comprising:

[0006] A substrate base having a plurality of binding regions and a plurality of binding alignment regions;

[0007] A plurality of metal wire grids are disposed on the base substrate, the plurality of metal wire grids are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids on the base substrate do not overlap with the plurality of binding areas and the plurality of binding alignment areas.

[0008] In one embodiment of the present disclosure, the metal wire grid extending to the binding area and the binding alignment area through orthographic projection includes at least two sub-metal wire grids arranged at intervals, and the metal wire grid polarizer further includes:

[0009] A plurality of transparent wire grids are arranged on the same surface of the base substrate as the plurality of metal wire grids, and the plurality of transparent wire grids are arranged in parallel with the metal wire grids, and two ends of at least one of the plurality of transparent wire grids are respectively connected to two sub-metal wire grids located on the same straight line.

[0010] In one embodiment of the present disclosure, the metal wire grid polarizer further comprises:

[0011] A plurality of first shielding portions, located at the light-emitting side of the metal wire grid, wherein the edge of the binding area is located within the orthographic projection of the first shielding portion on the base substrate;

[0012] A plurality of second shielding portions are located at the light-emitting side of the metal wire grid, and the edge of the binding alignment area is located within the orthographic projection of the second shielding portion on the base substrate.

[0013] In one embodiment of the present disclosure, the metal wire grid is an aluminum wire grid, and the transparent wire grid is a transparent resin wire grid.

[0014] In one embodiment of the present disclosure, a method for preparing a metal wire grid polarizer is provided, comprising:

[0015] Providing a substrate substrate, the substrate substrate having a plurality of binding areas and a plurality of binding alignment areas;

[0016] A plurality of metal wire grids are formed on the base substrate. The plurality of metal wire grids are arranged in parallel with each other, and the orthographic projections of the plurality of metal wire grids on the base substrate do not overlap with the plurality of binding areas and the plurality of binding alignment areas.

[0017] In one embodiment of the present disclosure, a plurality of metal wire grids are formed on the substrate, including:

[0018] forming a metal layer on the base substrate;

[0019] Performing patterning on the metal layer to remove a portion of the metal layer so that an orthographic projection of the remaining metal layer on the substrate does not overlap with the binding area and the binding alignment area;

[0020] The metal layer is patterned again to form a plurality of metal wire grids.

[0021] In one embodiment of the present disclosure, after removing part of the metal layer, the preparation method further comprises:

[0022] forming a transparent resin layer in the via hole formed by removing the metal layer from the base substrate, wherein the thickness of the transparent resin layer is the same as the thickness of the metal layer;

[0023] While the metal layer is patterned again to form a plurality of metal wire grids, the transparent resin layer is patterned to form a plurality of transparent wire grids.

[0024] In one embodiment of the present disclosure, a plurality of metal wire grids are formed on the substrate, including:

[0025] forming a metal layer on the base substrate;

[0026] forming a protective layer on a side of the metal layer facing away from the base substrate;

[0027] Performing patterning on the metal layer and the protective layer to remove part of the metal layer and part of the protective layer, so that the orthographic projections of the remaining metal layer and the remaining protective layer on the substrate do not overlap with the binding area and the binding alignment area;

[0028] The metal layer and the protection layer are patterned again to form a plurality of metal wire grids.

[0029] In one embodiment of the present disclosure, after removing part of the metal layer and part of the protective layer, the preparation method further comprises:

[0030] forming a transparent resin layer in the via hole formed by removing the metal layer and the protective layer of the base substrate, wherein the thickness of the transparent resin layer is the same as the sum of the thickness of the metal layer and the thickness of the protective layer;

[0031] While the metal layer and the protective layer are patterned again to form a plurality of metal wire grids, the transparent resin layer is patterned to form a plurality of transparent wire grids.

[0032] In one embodiment of the present disclosure, a plurality of metal wire grids are formed on the substrate, including:

[0033] forming a metal layer on the base substrate;

[0034] performing patterning on the metal layer to form a plurality of metal wire grids;

[0035] The plurality of metal wire grids are patterned to remove partial segments of some of the metal wire grids, so that the orthographic projections of the remaining metal wire grids on the substrate do not overlap with the binding area and the binding alignment area.

[0036] In one embodiment of the present disclosure, the preparation method further comprises:

[0037] A first shielding portion and a second shielding portion are formed on the light-emitting side of the metal wire grid, the edge of the binding area is located within the orthographic projection of the first shielding portion on the base substrate, and the edge of the binding alignment area is located within the orthographic projection of the second shielding portion on the base substrate.

[0038] In one embodiment of the present disclosure, a display device is provided, comprising:

[0039] A display panel comprising the metal wire grid polarizer described above;

[0040] A light control panel, comprising the metal wire grid polarizer described above;

[0041] The display panel is located on the light emitting side of the light control panel.

[0042] In one embodiment of the present disclosure, the display panel further includes:

[0043] A first array substrate, provided on a side of the base substrate away from the metal wire grid or a side of the metal wire grid away from the base substrate;

[0044] A first liquid crystal layer is provided on a side of the first array substrate away from the base substrate;

[0045] The color filter substrate is arranged on a side of the first liquid crystal layer away from the array substrate.

[0046] In one embodiment of the present disclosure, the light control panel further includes:

[0047] A second array substrate is provided on a side of the base substrate away from the metal wire grid or a side of the metal wire grid away from the base substrate;

[0048] The second liquid crystal layer is arranged on a side of the second array substrate away from the base substrate.

[0049] In an embodiment of the present disclosure, the multiple binding areas and the multiple binding alignment areas of the display panel and the multiple binding areas and the multiple binding alignment areas of the light control panel are located on two opposite sides of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing detailed example embodiments with reference to the accompanying drawings, in which:

[0051] Figure 1 It is a schematic structural diagram of an exemplary embodiment of a metal wire grid polarizer of the present invention;

[0052] Figure 2 for Figure 1 A partial enlarged schematic diagram of the part indicated by H in the figure;

[0053] Figure 3 In accordance with Figure 1 A schematic cross-sectional view of section II in FIG.

[0054] Figure 4 A schematic flow chart of an exemplary embodiment of a method for preparing a metal wire grid polarizer according to the present invention;

[0055] Figure 5is a cross-sectional view after a transparent resin layer is formed on a base substrate;

[0056] Figure 6 is a schematic diagram of the microstructure of the metal wire grid formed when the transparent resin layer is not filled;

[0057] Figure 7 for Figure 6 Schematic cross-sectional view of ;

[0058] Figure 8 Schematic diagram of the microstructure of the metal wire grid formed after filling the transparent resin layer;

[0059] Fig. 9 for Figure 8 Schematic cross-sectional view of ;

[0060] Fig.10 It is a schematic structural diagram of an exemplary embodiment of a display device of the present invention.

[0061] The main components in the figure are described as follows:

[0062] 1. Metal wire grid polarizer; 11. Base substrate; 12. Metal wire grid; 13. Transparent wire grid; 14. Binding area; 15. Binding alignment area; 16. Metal layer; 17. Transparent resin layer; 18. First shielding part; 19. Second shielding part;

[0063] 2. Display panel; 21. First array substrate; 22. First liquid crystal layer; 23. Color filter substrate;

[0064] 3. Light control panel; 31. Second array substrate; 32. Second liquid crystal layer. DETAILED DESCRIPTION

[0065] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0066] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0067] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0068] The present invention first provides a metal wire grid polarizer, referring to Figure 1 , Figure 2 and Figure 3 The structure schematic diagram of an exemplary embodiment of the metal wire grid polarizer of the present invention is shown, and the metal wire grid polarizer 1 may include a base substrate 11, a plurality of metal wire grids 12 and a plurality of transparent wire grids 13; the base substrate 11 has a plurality of binding areas 14 and a plurality of binding alignment areas 15; the plurality of metal wire grids 12 are arranged on the base substrate 11, and the plurality of metal wire grids 12 are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids 12 on the base substrate 11 have no overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15.

[0069] In this example embodiment, the orthographic projections of the plurality of metal wire grids 12 on the base substrate 11 may be the orthographic projections of the plurality of metal wire grids 12 on the plane where the plurality of binding regions 14 and the plurality of binding alignment regions 15 of the base substrate 11 are located.

[0070] The orthographic projections of the plurality of metal wire grids 12 on the base substrate 11 do not overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15. This avoids the metal wire grids 12 blocking light during the binding process, allowing the alignment process to proceed smoothly and achieving binding accuracy.

[0071] In this example embodiment, the base substrate 11 may be a glass substrate. The base substrate 11 has a display area and a non-display area, and two binding areas 14 and two binding alignment areas 15 are provided in the non-display area, the two binding areas 14 are located between the two binding alignment areas 15, and the area of ​​the two binding areas 14 is larger than the area of ​​the two binding alignment areas 15. The binding area 14 is used to bind to a circuit board or a flexible circuit board, and the binding alignment area 15 is used to set an alignment mark. Of course, in other example embodiments of the present invention, the base substrate 11 may be a flexible substrate. The number and size of the binding areas 14 and the binding alignment areas 15 can be set as needed.

[0072] In this example embodiment, a plurality of metal wire grids 12 are arranged on a side of the base substrate 11 opposite to the plurality of binding areas 14 and the plurality of binding alignment areas 15, the width of the metal wire grid 12 is nanometer-level, the length of the metal wire grid 12 is macroscopic-level, and polarization can be performed. The metal wire grid 12 may be an aluminum wire grid. That is, the plurality of metal wire grids 12 and the plurality of binding areas 14 and the plurality of binding alignment areas 15 are arranged on opposite sides of the base substrate 11. The orthographic projection of the metal wire grid 12 on the base substrate 11 does not overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15, that is, there is no orthographic projection of the metal wire grid 12 on the base substrate 11 in the plurality of binding areas 14 and the plurality of binding alignment areas 15, so that the metal wire grid 12 whose orthographic projection extends to the plurality of binding areas 14 and the plurality of binding alignment areas 15 is cut off to form two sub-metal wire grids, three sub-metal wire grids, four sub-metal wire grids or more sub-metal wire grids.

[0073] In this example embodiment, a plurality of transparent wire grids 13 are also disposed on the same surface of the base substrate 11 where the plurality of metal wire grids 11 are disposed. The plurality of transparent wire grids 13 are disposed in parallel with the metal wire grids 11, and the two ends of the transparent wire grid 13 are connected between two sub-metal wire grids located on the same straight line, that is, the transparent wire grid 13 reconnects the above-mentioned truncated sub-metal wire grids located on the same straight line to form one wire grid. The transparent wire grid 13 may be a transparent resin wire grid. It should be noted that, in the case where a metal wire grid 12 is truncated at two locations to form three sub-metal wire grids, two transparent wire grids 13 connect the three sub-metal wire grids to form one wire grid. Similarly, in the case where there are three truncations, three transparent wire grids 13 are required for connection. The transparent wire grid 13 does not affect the transmittance of light, and avoids the collapse and missing of the metal wire grid 12.

[0074] In addition, in other exemplary embodiments of the present invention, the metal wire grid 12 may be arranged on the same surface as the binding area 14 and the binding alignment area 15. In this case, the metal wire grid 12 is not arranged in the plurality of binding areas 14 and the plurality of binding alignment areas 15, and a plurality of transparent wire grids 13 may be arranged in the plurality of binding areas 14 and the plurality of binding alignment areas 15, and the two ends of the transparent wire grid 13 are connected to two sub-metal wire grids located on the same straight line.

[0075] In this example embodiment, the metal wire grid polarizer may further include a plurality of first shielding portions 18 and a plurality of second shielding portions 19, wherein the number of the first shielding portions 18 is equal to the number of the binding regions 14. The number of the second shielding portions 19 is equal to the number of the binding alignment regions 15, so that the edge of each binding region 14 is shielded by a first shielding portion 18, and the edge of each binding alignment region 15 is also shielded by a second shielding portion 19. The first shielding portion 18 and the second shielding portion 19 may be disposed on the side of the substrate 11 facing away from the metal wire grid 12, that is, the first shielding portion 18 and the second shielding portion 19 are disposed on opposite sides of the substrate 11 with the metal wire grid 12. The first shielding portion 18 and the second shielding portion 19 are both configured in an annular shape. The edge of the binding area 14 is located within the orthographic projection of the first shielding portion 18 on the substrate 11, and the edge of the binding alignment area 15 is located within the orthographic projection of the second shielding portion 19 on the substrate 11; and the edge of the binding area 14 can be located in the middle position of the width direction of the orthographic projection of the first shielding portion 18 on the substrate 11, and the edge of the binding alignment area 15 can be located in the middle position of the width direction of the orthographic projection of the second shielding portion 19 on the substrate 11. The width of the first shielding portion 18 and the second shielding portion 19 is about 5 microns. The first shielding portion 18 and the second shielding portion 19 are used to remove the abnormal shielding caused by the edge metal wire grid 12 of the binding area 14 and the binding alignment area 15, thereby avoiding the uneven light caused by the abnormal metal wire grid 12.

[0076] Of course, it should be noted that when the metal wire grid 12, the binding area 14 and the binding alignment area 15 are arranged on the same side of the base substrate 11, the first shielding portion 18 and the second shielding portion 19 can also be arranged on the side of the metal wire grid 12 away from the base substrate 11. When the metal wire grid 12, the binding area 14 and the binding alignment area 15 are arranged on opposite sides of the base substrate 11, the first shielding portion 18 and the second shielding portion 19 can be arranged between the metal wire grid 12 and the base substrate 11. In short, as long as the first shielding portion 18 and the second shielding portion 19 are arranged on the light-emitting side of the metal wire grid 12, the abnormal shielding caused by the edge metal wire grid 11 of the binding area 14 and the binding alignment area 15 can be removed, thereby avoiding uneven light caused by the abnormality of the metal wire grid 12.

[0077] Furthermore, the present invention also provides a method for preparing a metal wire grid polarizer, referring to Figure 4 The schematic flow chart of an exemplary embodiment of a method for preparing a metal wire grid polarizer of the present invention is shown. The method for preparing a metal wire grid polarizer may include the following steps:

[0078] In step S10 , a base substrate 11 is provided. The base substrate 11 has a plurality of binding regions 14 and a plurality of binding alignment regions 15 .

[0079] In step S20 , a plurality of metal wire grids 12 are formed on the base substrate 11 . The plurality of metal wire grids 12 are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids 12 on the base substrate 11 do not overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15 .

[0080] The various steps of the method for preparing the metal wire grid polarizer of the present invention are described in detail below.

[0081] In step S10 , a base substrate 11 is provided. The base substrate 11 has a plurality of binding regions 14 and a plurality of binding alignment regions 15 .

[0082] In this exemplary embodiment, a base substrate 11 is provided. The base substrate 11 is provided with a display area and a non-display area located around the display area. Two binding areas 14 and two binding alignment areas 15 are provided in the non-display area.

[0083] In step S20 , a plurality of metal wire grids 12 are formed on the base substrate 11 . The plurality of metal wire grids 12 are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids 12 on the base substrate 11 do not overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15 .

[0084] In this exemplary embodiment, a metal layer 16 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set by deposition, sputtering or evaporation, and the metal layer 16 is an aluminum layer, and the thickness of the metal layer 16 is about 200nm. Then, the metal layer 16 is photolithographically removed to remove part of the metal layer 16, so that the orthographic projection of the remaining metal layer on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. In this way, the metal wire grid 12 is prevented from blocking the light in the subsequent binding process, so that the alignment process can proceed smoothly and the accuracy of the binding can be achieved.

[0085] Of course, in other exemplary embodiments of the present invention, a metal layer 16 may be formed on one side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, and then the metal layer 16 is photolithographically removed to remove part of the metal layer 16, so that the orthographic projection of the remaining metal layer on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. This avoids the metal wire grid 12 from blocking the light in the subsequent binding process, allowing the alignment process to proceed smoothly and achieving binding accuracy.

[0086] After removing part of the metal layer, refer to Figure 5As shown, a transparent resin layer 17 is formed on the side of the base substrate 11 where the metal layer is formed, and the transparent resin layer 17 is only filled in the via hole formed after removing part of the metal layer 16. The thickness of the transparent resin layer 17 is the same as that of the metal layer 16, which is about 200nm. The transparent resin layer 17 has a certain rigidity and can withstand the subsequent temperature of about 150°C.

[0087] After the metal layer is removed, there is a step difference between the metal layer 16 on the base substrate 11 and the base substrate 11. Due to the fine process conditions of nanoimprinting itself, a slight step difference may cause a large area of ​​the surrounding edge to produce line defects, and finally cause the metal wire grid 12 to collapse and be missing. Figure 6 and Figure 7 The schematic diagram of the microstructure of the metal wire grid formed when the transparent resin layer is not filled is shown. From this figure, it can be seen that the metal wire grid 12 is seriously collapsed and missing. Filling the transparent resin layer 17 will not affect the transmittance of light, and provide a better substrate for nano-imprinting to avoid the subsequent collapse and missing of the metal wire grid 12. Figure 8 and Fig. 9 The schematic diagram of the microstructure of the metal wire grid formed after the transparent resin layer is shown. From this figure, it can be seen that the metal wire grid 12 is neither collapsed nor missing.

[0088] A hard mask is deposited on the metal layer 16 and the transparent resin layer 17. The hard mask is an inorganic thin film material generated by CVD (Chemical Vapor Deposition). Its main components are usually TiN, SiN, SiO2, etc. A layer of imprint glue is imprinted on the hard mask, and the imprint glue is imprinted and cured using a soft template to form a plurality of parallel strip grooves on the imprint glue; the hard mask not covered by the imprint glue is dry-etched to remove the hard mask layer not covered by the imprint glue to form a hard mask mask; the metal layer 16 and the transparent resin layer 17 not covered by the hard mask mask are etched to form a plurality of metal wire grids 12 on the metal layer 16 and a transparent wire grid 13 on the transparent resin layer 17.

[0089] The metal wire grid 12 can also be formed by the following method.

[0090] A metal layer 16 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set by deposition, sputtering or evaporation. The metal layer 16 is an aluminum layer, and the thickness of the metal layer 16 is about 200 nm.

[0091] A protective layer is formed on the side of the metal layer 16 facing away from the base substrate 11, and the thickness of the protective layer is about 100 nm. The protective layer may be a silicon oxide layer, a silicon nitride layer, or the like.

[0092] The metal layer 16 and the protective layer are photolithographically removed to remove part of the metal layer 16 and part of the protective layer, so that the orthographic projections of the remaining metal layer 16 and the remaining protective layer on the base substrate 11 do not overlap with the fixed area 14 and the binding alignment area 15. This avoids the metal wire grid 12 from blocking the light in the subsequent binding process, so that the alignment process can proceed smoothly and the accuracy of the binding can be achieved.

[0093] Of course, in other exemplary embodiments of the present invention, a metal layer 16 may be formed on the side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, a protective layer may be formed on the side of the metal layer 16 facing away from the base substrate 11, and the metal layer 16 and the protective layer may be photolithographically removed to remove part of the metal layer 16 and part of the protective layer, so that the orthographic projections of the remaining metal layer 16 and the remaining protective layer on the base substrate 11 do not overlap with the binding area 14 and the binding alignment area 15. This avoids the shielding of light by the metal wire grid 12 in the subsequent binding process, allows the alignment process to proceed smoothly, and achieves binding accuracy.

[0094] After removing part of the metal layer, a transparent resin layer 17 is formed on the side of the base substrate 11 where the metal layer is formed, and the transparent resin layer 17 is only filled in the via hole formed after removing part of the metal layer 16 and part of the protective layer. The thickness of the transparent resin layer 17 is the same as the sum of the thickness of the metal layer 16 and the thickness of the protective layer, which is about 300nm. The transparent resin layer 17 has a certain rigidity and can withstand the subsequent temperature of about 150°C.

[0095] After the metal layer 16 and the protective layer are removed, there will also be a step difference between the protective layer on the substrate and the substrate. Since the process conditions of nanoimprinting itself are relatively delicate, a slight step difference can cause a large area of ​​the surrounding edge to produce poor lines, and ultimately lead to the collapse and loss of the metal wire grid 12. After filling the transparent resin layer 17, a relatively flat base can be provided for the nanoimprinting process, so that the subsequently formed metal wire grid 12 can avoid collapse and loss.

[0096] After the transparent resin layer 17 is formed, a layer of embossed glue is embossed on the protective layer and the transparent resin layer 17, and the embossed glue is embossed and cured using a soft template to form a plurality of parallel strip grooves on the embossed glue; the protective layer not covered by the embossed glue is dry-etched to remove the protective layer not covered by the embossed glue to form a protective layer mask; the metal layer 16 and the transparent resin layer 17 not covered by the protective layer mask are etched to form a plurality of metal wire grids 12 in the metal layer 16 and a transparent wire grid 13 in the transparent resin layer 17.

[0097] The metal wire grid 12 may also be formed by the following method.

[0098] A metal layer 16 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set by deposition, sputtering or evaporation processes. The metal layer 16 is an aluminum layer, and the thickness of the metal layer 16 is about 200nm. A SiO2 layer is made on the metal layer 16; the thickness of the SiO2 layer is about 100nm. A layer of embossing glue is formed on the SiO2 layer; the embossing glue is embossed and cured using a soft template to form a plurality of parallel strip grooves on the embossing glue; the SiO2 layer not covered by the embossing glue is dry-etched to remove the SiO2 layer not covered by the embossing glue to form a SiO2 mask; the metal layer 16 not covered by the SiO2 mask is etched to form a plurality of metal wire grids 12, and then the SiO2 mask can be removed.

[0099] The plurality of metal wire grids 12 are patterned to remove partial segments of the metal wire grids 12, so that the orthographic projection of the remaining metal wire grids 12 on the substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. The patterning process may be dry etching or photolithography, etc., so as to avoid the metal wire grids 12 blocking the light in the subsequent binding process, so that the alignment process can proceed smoothly and the binding accuracy can be achieved.

[0100] Of course, in other exemplary embodiments of the present invention, a metal wire grid 12 may be formed on one side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, and then the metal wire grid 12 is photolithographically removed to remove a portion of the metal wire grid 12, so that the orthographic projection of the remaining metal wire grid 12 on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. This avoids the metal wire grid 12 from blocking light during the subsequent binding process, allowing the alignment process to proceed smoothly and achieving binding accuracy.

[0101] In the present exemplary embodiment, light is arranged to be incident from the opposite side of the base substrate 11 where the binding region 14 and the binding alignment region 15 are arranged.

[0102] In addition, after the metal wire grid 12 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, the preparation method of the above-mentioned metal wire grid polarizer can also include forming a shielding material layer on the side of the base substrate away from the metal wire grid 12, and then patterning the shielding material layer to form a first shielding portion 18 and a second shielding portion 19. The first shielding portion 18 and the second shielding portion 19 are both set in a ring shape. The first shielding portion 18 and the second shielding portion 19 are both located on the light-emitting side of the metal wire grid 12. The light enters the metal wire grid 12, and after being polarized by the metal wire grid 12, it is emitted to the base substrate 11, and is emitted to the first shielding portion 18 and the second shielding portion 19 through the base substrate 11.

[0103] The edge of the binding area 14 is located within the orthographic projection of the first shielding portion 18 on the substrate 11, and the edge of the binding alignment area 15 is located within the orthographic projection of the second shielding portion 19 on the substrate 11, and the edge of the binding area 14 can be located in the middle position of the width direction of the orthographic projection of the first shielding portion 18 on the substrate 11, and the edge of the binding alignment area 15 can be located in the middle position of the width direction of the orthographic projection of the second shielding portion 19 on the substrate 11. The width of the first shielding portion 18 and the second shielding portion 19 is about 5 microns. The first shielding portion 18 and the second shielding portion 19 are used to remove the abnormal shielding caused by the edge metal wire grid of the binding area 14 and the binding alignment area 15, respectively, to avoid uneven light caused by abnormal metal wire grids. In addition, in the above structure, the first shielding portion 18 and the second shielding portion 19 are arranged on opposite sides of the substrate 11 with the metal wire grid 12, so the first shielding portion 18 and the second shielding portion 19 can be formed first and then the metal wire grid 12 can be formed.

[0104] It should be noted that when the metal wire grid 12 is formed on one side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, the first shielding portion 18 and the second shielding portion 19 can be formed on the side of the metal wire grid 12 away from the base substrate 11. In this case, the metal wire grid 12 needs to be formed first and then the first shielding portion 18 and the second shielding portion 19 are formed. When the metal wire grid 12 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are set, the first shielding portion 18 and the second shielding portion 19 can be formed between the metal wire grid 12 and the base substrate 11. In this case, the first shielding portion 18 and the second shielding portion 19 need to be formed first and then the metal wire grid 12 is formed. In this way, it can be ensured that the first shielding portion 18 and the second shielding portion 19 are located on the light-emitting side of the metal wire grid 12.

[0105] Furthermore, the present invention also provides a display device, referring to Fig.10 The structural schematic diagram of an example embodiment of the display device of the present invention is shown, and the display device may include a display panel 2 and a light control panel 3, and the display panel 2 is located on the light emitting side of the light control panel 3. Specifically, the display panel 2 is located on the side of the second liquid crystal layer 32 that is away from the second array substrate 31, and the first liquid crystal layer 22 of the display panel 2 is farther away from the light control panel 3 than the first array substrate 21.

[0106] The display panel 2 includes the above-mentioned metal wire grid polarizer 1. The structure of the metal wire grid polarizer 1 has been described in detail above, so it will not be repeated here.

[0107] In this example embodiment, the display panel 2 may further include a first array substrate 21, a first liquid crystal layer 22 and a color film substrate 23; the first array substrate 21 may be arranged on a side of the base substrate 11 that is away from the metal wire grid 12, that is, the first array substrate 21 and the metal wire grid 12 are arranged on opposite sides of the base substrate 11; the first liquid crystal layer 22 is arranged on a side of the first array substrate 21 that is away from the base substrate 11; and the color film substrate 23 is arranged on a side of the first liquid crystal layer 22 that is away from the array substrate.

[0108] Of course, in other exemplary embodiments of the present invention, the first array substrate 21 may be disposed on a side of the metal wire grid 12 that is away from the base substrate 11, that is, the metal wire grid 12 is disposed between the base substrate 11 and the first array substrate 21. An insulating layer may also be disposed between the metal wire grid 12 and the first array substrate 21.

[0109] The light control panel 3 includes the above-mentioned metal wire grid polarizer 1. The structure of the metal wire grid polarizer 1 has been described in detail above, so it will not be repeated here.

[0110] In this example embodiment, the light control panel 3 may also include a second array substrate 31 and a second liquid crystal layer 32; the second array substrate 31 may be arranged on the side of the base substrate 11 away from the metal wire grid 12, that is, the second array substrate 31 and the metal wire grid 12 are arranged on opposite sides of the base substrate 11; the second liquid crystal layer 32 is arranged on the side of the second array substrate 31 away from the base substrate 11.

[0111] Of course, in other exemplary embodiments of the present invention, the second array substrate 31 may be disposed on the side of the metal wire grid 12 that is away from the base substrate 11, that is, the metal wire grid 12 is disposed between the base substrate 11 and the second array substrate 31. An insulating layer may also be disposed between the metal wire grid 12 and the second array substrate 31.

[0112] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing what is disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and embodiments are to be considered merely as exemplary, and the true scope and spirit of the present disclosure are indicated by the claims.

Claims

1. A metal wire grid polarizer, wherein: include: A substrate base having a plurality of binding regions and a plurality of binding alignment regions; A plurality of metal wire grids are disposed on the base substrate, the plurality of metal wire grids are arranged parallel to each other, and the orthographic projections of the plurality of metal wire grids on the base substrate do not overlap with the plurality of binding areas and the plurality of binding alignment areas; The metal wire grid whose orthographic projection extends to the binding area and the binding alignment area includes at least two sub-metal wire grids arranged at intervals, and the metal wire grid polarizer further includes: A plurality of transparent wire grids are arranged on the same surface of the base substrate as the plurality of metal wire grids, and the plurality of transparent wire grids are arranged in parallel with the metal wire grids, and two ends of at least one of the plurality of transparent wire grids are respectively connected to two sub-metal wire grids located on the same straight line.

2. The metal wire grid polarizer according to claim 1, wherein: The metal wire grid polarizer further comprises: A plurality of first shielding portions, located at the light-emitting side of the metal wire grid, and the edge of the binding area is located within the orthographic projection of the first shielding portion on the base substrate; A plurality of second shielding portions are located at the light-emitting side of the metal wire grid, and the edge of the binding alignment area is located within the orthographic projection of the second shielding portion on the base substrate.

3. The metal wire grid polarizer according to claim 1, wherein: The metal wire grid is an aluminum wire grid, and the transparent wire grid is a transparent resin wire grid.

4. A method for preparing a metal wire grid polarizer, wherein: include: Providing a substrate substrate, the substrate substrate having a plurality of binding areas and a plurality of binding alignment areas; Forming a plurality of metal wire grids on the base substrate, the plurality of metal wire grids are arranged in parallel with each other, and the orthographic projections of the plurality of metal wire grids on the base substrate do not overlap with the plurality of binding areas and the plurality of binding alignment areas; A plurality of metal wire grids are formed on the substrate, comprising: forming a metal layer on the base substrate; Performing patterning on the metal layer to remove a portion of the metal layer so that an orthographic projection of the remaining metal layer on the substrate does not overlap with the binding area and the binding alignment area; performing patterning on the metal layer again to form a plurality of metal wire grids; After removing part of the metal layer, the preparation method further comprises: forming a transparent resin layer in the via hole formed by removing the metal layer from the base substrate, wherein the thickness of the transparent resin layer is the same as the thickness of the metal layer; While patterning the metal layer again to form a plurality of metal wire grids, patterning the transparent resin layer to form a plurality of transparent wire grids; The metal wire grid whose orthographic projection extends to the binding area and the binding alignment area includes at least two sub-metal wire grids arranged at intervals, and two ends of at least one of the plurality of transparent wire grids are respectively connected to two of the sub-metal wire grids located on the same straight line.

5. The method for preparing a metal wire grid polarizer according to claim 4, wherein: A plurality of metal wire grids are formed on the substrate, comprising: forming a metal layer on the base substrate; forming a protective layer on a side of the metal layer facing away from the base substrate; Performing patterning on the metal layer and the protective layer to remove part of the metal layer and part of the protective layer, so that the orthographic projections of the remaining metal layer and the remaining protective layer on the substrate do not overlap with the binding area and the binding alignment area; The metal layer and the protection layer are patterned again to form a plurality of metal wire grids.

6. The method for preparing a metal wire grid polarizer according to claim 5, wherein: After removing part of the metal layer and part of the protective layer, the preparation method further comprises: forming a transparent resin layer in the via hole formed by removing the metal layer and the protective layer of the base substrate, wherein the thickness of the transparent resin layer is the same as the sum of the thickness of the metal layer and the thickness of the protective layer; While the metal layer and the protective layer are patterned again to form a plurality of metal wire grids, the transparent resin layer is patterned to form a plurality of transparent wire grids.

7. The method for preparing a metal wire grid polarizer according to claim 4, wherein: A plurality of metal wire grids are formed on the substrate, comprising: forming a metal layer on the base substrate; performing patterning on the metal layer to form a plurality of metal wire grids; The plurality of metal wire grids are patterned to remove partial segments of some of the metal wire grids, so that the orthographic projections of the remaining metal wire grids on the substrate do not overlap with the binding area and the binding alignment area.

8. The method for preparing a metal wire grid polarizer according to any one of claims 4 to 7, wherein: The preparation method further comprises: A first shielding portion and a second shielding portion are formed on the light-emitting side of the metal wire grid, the edge of the binding area is located within the orthographic projection of the first shielding portion on the base substrate, and the edge of the binding alignment area is located within the orthographic projection of the second shielding portion on the base substrate.

9. A display device, wherein: include: A display panel comprising the metal wire grid polarizer according to any one of claims 1 to 3; A light control panel comprising the metal wire grid polarizer according to any one of claims 1 to 3; The display panel is located on the light emitting side of the light control panel.

10. The display device according to claim 9, wherein: The display panel further includes: A first array substrate, provided on a side of the base substrate away from the metal wire grid or a side of the metal wire grid away from the base substrate; A first liquid crystal layer is provided on a side of the first array substrate away from the base substrate; The color filter substrate is arranged on a side of the first liquid crystal layer away from the array substrate.

11. The display device according to claim 9, wherein: The light control panel further includes: A second array substrate is provided on a side of the base substrate away from the metal wire grid or a side of the metal wire grid away from the base substrate; The second liquid crystal layer is arranged on a side of the second array substrate away from the base substrate.

12. The display device according to claim 9, wherein: The multiple binding areas and the multiple binding alignment areas of the display panel and the multiple binding areas and the multiple binding alignment areas of the light control panel are located at two opposite sides of the display device.

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