RF connectors

Abstract

The present invention discloses an RF connector. According to one embodiment of the present invention, an RF connector is provided, comprising: a first printed circuit board (PCB) having a plurality of devices mounted thereon; a first bridge assembly (FB) mounted in an area adjacent to at least one side of the first PCB and comprising a plurality of first signal transmission pins; a second PCB (PCB) disposed spaced apart from the first PCB; a plurality of connection terminals (CTP) disposed in an area adjacent to at least one side of the second PCB to contact at least one side of the plurality of first signal transmission pins; a first push bar (Push Bar) configured to apply a force to at least one side of the plurality of first signal transmission pins to maintain contact between the plurality of first signal transmission pins and the plurality of connection terminals; and a first metal shielding plate (STP) fixed to the first push bar and the second PCB and configured to shield the second PCB and at least a portion of the first push bar.

Description

Technical Field

[0001] The present invention relates to an RF connector, and more particularly to an RF connector that transmits RF signals using a plurality of signal transmission pins. Background Art

[0002] The contents recorded in this section are merely used to provide background information for the present invention and do not constitute prior art.

[0003] RF connectors are commonly used to transmit and receive radio frequency (RF) signals between printed circuit boards (PCBs). RF connectors include single connectors for transmitting single-frequency signals and multi-connectors for transmitting signals of different frequency bands. Multi-connectors have recently become more widely used to handle signals of different frequency bands.

[0004] However, the existing multi-connector is relatively large in size, and due to the structure of the multi-connector, a height difference is generated between the PCBs when the PCBs are connected, thereby causing the overall size of the component to become larger.

[0005] Furthermore, the frequency bands that the multiconnector can handle are limited, and in order to enable the multiconnector to transmit more or wider frequency band signals, the overall cost of the components increases. Summary of the Invention

[0006] (1) Technical issues to be resolved

[0007] Therefore, the present invention has been made to solve the above-mentioned problem, and an object thereof is to provide an RF connector that can reduce the overall size of the component by enabling RF signals to be transmitted on the same plane.

[0008] Another object of the present invention is to provide an RF connector that can handle signals of different frequency bands while reducing the unit price.

[0009] (2) Technical solution

[0010] To achieve the above-mentioned objectives, according to one embodiment of the present invention, an RF connector is provided, comprising: a first printed circuit board (PCB) on which a plurality of devices are mounted; a first bridge assembly (FB) mounted in an area adjacent to at least one side of the first PCB and comprising a plurality of first signal transmission pins; a second PCB (second PCB) arranged apart from the first PCB; a plurality of connection terminals (CTP) arranged in an area adjacent to at least one side of the second PCB to contact at least one side of the plurality of first signal transmission pins; a first push bar (PTP) configured to apply a force to at least one side of the plurality of first signal transmission pins so that the plurality of first signal transmission pins maintain contact with the plurality of connection terminals; and a first metal shielding plate (MTP) fixed to the first push bar and the second PCB and configured to shield at least a portion of the second PCB and the first push bar.

[0011] (3) Beneficial effects

[0012] As described above, according to this embodiment, by utilizing pins for transmitting multiple signals, RF (Radio Frequency) signals of different frequency bands are transmitted on the same plane, thereby reducing the size of the component and having the effect of reducing manufacturing costs compared to existing RF connectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. 1 is a perspective view of a printed circuit substrate combined with a shielding plate according to an embodiment of the present invention.

[0014] Figure 2 FIG. 1 is an exploded perspective view of an RF connector according to an embodiment of the present invention.

[0015] Figure 3 FIG. 4 is an enlarged side view of an RF connector according to an embodiment of the present invention.

[0016] Figure 4 FIG. 1 is an enlarged view of a signal transmission pin of an RF connector according to an embodiment of the present invention.

[0017] Figure 5FIG. 1 is a diagram illustrating isolation when the interval between signal transmission pins for transmitting signals is 6 mm according to an embodiment of the present invention.

[0018] Figure 6 FIG. 1 is a diagram illustrating isolation when the interval between signal transmission pins for transmitting signals is 8 mm according to an embodiment of the present invention.

[0019] Figure 7 3 is a diagram illustrating the isolation when a shielding wall is arranged between each signal transmission pin for transmitting a signal and the interval between each signal transmission pin is 6 mm according to an embodiment of the present invention.

[0020] Figure 8 FIG. 1 is a top view of a printed circuit substrate combined with a shielding plate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] Below, some embodiments of the present invention are described in detail using the accompanying drawings. When annotating the figures, even if the same components appear in different figures, the same reference numerals are used whenever possible. Throughout this specification, if a detailed description of a known component or function is deemed to obscure the subject matter of the present invention, such detailed description will be omitted.

[0022] In describing the components according to the embodiments of the present invention, symbols such as "first," "second," "i," "ii," "a," and "b" may be used. Such symbols are used only to distinguish a component from other components and are not intended to define the nature, order, or sequence of the corresponding component based on the symbols. In the specification, if a component "includes" or "has" another component, unless otherwise expressly stated, it is understood that the component also includes the other component, rather than excluding the other component.

[0023] Figure 1 FIG. 1 is a perspective view of a printed circuit substrate combined with a shielding plate according to an embodiment of the present invention.

[0024] Figure 2 FIG. 1 is an exploded perspective view of an RF connector according to an embodiment of the present invention.

[0025] Figure 3 FIG. 4 is an enlarged side view of an RF connector according to an embodiment of the present invention.

[0026] Figure 4 FIG. 1 is an enlarged view of a signal transmission pin of an RF connector according to an embodiment of the present invention.

[0027] Figure 5FIG. 1 is a diagram illustrating isolation when the interval between signal transmission pins for transmitting signals is 6 mm according to an embodiment of the present invention.

[0028] Figure 6 FIG. 1 is a diagram illustrating isolation when the interval between signal transmission pins for transmitting signals is 8 mm according to an embodiment of the present invention.

[0029] Figure 7 3 is a diagram illustrating the isolation when a shielding wall is arranged between each signal transmission pin for transmitting a signal and the interval between each signal transmission pin is 6 mm according to an embodiment of the present invention. Figure 7 (a) shows the situation where the shield wall length is reduced due to manufacturing tolerances. Figure 7 Figure (b) shows the case where the shielding wall is reasonably manufactured.

[0030] Reference Figures 1 to 7 According to an embodiment of the present invention, an RF connector may include a first printed circuit board 10, a second printed circuit board 20, a first bridge assembly 200, a plurality of first signal transmission pins 220, a plurality of connection terminals 260, a first push bar 240, a first metal shielding plate 100, and all or part of a plurality of shielding walls 500.

[0031] A plurality of devices may be mounted on the first printed circuit substrate 10. In the RF connector according to an embodiment of the present invention, the first printed circuit substrate 10 may be an amplifier (Amp) board, but is not limited thereto.

[0032] The second printed circuit substrate 20 may be spaced apart from the first printed circuit substrate 10 and may be mounted with a plurality of components. In the RF connector according to an embodiment of the present invention, the second printed circuit substrate 20 may be a digital board, but is not limited thereto.

[0033] The first bridge assembly 200 includes a plurality of first signal transmission pins 220 and is mounted in an area adjacent to at least one side of the first printed circuit substrate 10. Specifically, the first bridge assembly 200 is configured to assemble the plurality of first signal transmission pins 220 and to secure one end of the plurality of first signal transmission pins 220.

[0034] The plurality of first signal transmission pins 220 serve as a medium for transmitting and receiving signals and are connected to the first printed circuit board 10 and the second printed circuit board 20. The plurality of first signal transmission pins 220 can transmit not only RF signals but also power and digital signals.

[0035] The plurality of first signal transmission pins 220 may be assembled at equal intervals on the first bridge component 200. However, the plurality of first signal transmission pins 220 do not necessarily need to be assembled at equal intervals, and the intervals between the first signal transmission pins may be adjusted according to the functions of the respective signal transmission pins.

[0036] If the intervals between the signal transmission pins including the plurality of first signal transmission pins 220 are very narrow, there is a possibility that interference will occur between the signals. Therefore, it is necessary to appropriately set the distances between the signal transmission pins as needed. Figure 5 As shown in FIG, when the distance between each signal transmission pin for transmitting a signal is 6 mm, the isolation value is approximately 48 dB in the 3.5 GHz band. Figure 6 As shown in FIG. 1 , when the distance between each signal transmission pin for transmitting signals is 8 mm, the isolation value is approximately 55 dB in the 3.5 GHz band. Therefore, in order to maintain the isolation value above 55 dB, the spacing between each signal transmission pin for transmitting signals is preferably at least 8 mm.

[0037] For example, the plurality of first signal transmission pins 220 may consist of over 80 pins, each of which may be spaced apart. The number of pins may vary depending on the intended use. The plurality of first signal transmission pins 220 are assembled with the first bridge assembly 200 pre-mounted on a printed circuit board, simplifying manufacturing. Consequently, the use of multiple first signal transmission pins 220 can reduce unit costs compared to achieving the same performance using an RF multi-connector.

[0038] A protruding unit 400 may be formed on one surface of the plurality of first signal transmitting pins 220. The protruding unit 400 is formed to allow the plurality of first signal transmitting pins 220 to contact the plurality of connection terminals 260.

[0039] The plurality of connection terminals 260 are configured to contact at least one side of the plurality of first signal transmission pins 220 and are arranged in an area near at least one side of the second printed circuit substrate 20. In other words, they may be arranged in areas near both sides of the second printed circuit substrate 20. In the RF connector according to one embodiment of the present invention, the plurality of connection terminals 260 may be formed as pads, but this is not necessarily limited to this and may also be formed as insertions.

[0040] The plurality of first signal transmission pins 220 may correspond to the plurality of connection terminals 260, respectively. For example, one signal transmission pin may correspond to one connection terminal, but this is not necessarily limited to this. A portion of the plurality of first signal transmission pins 220 may also contact a ground terminal. Furthermore, the plurality of first signal transmission pins 220 may each contact one side of the plurality of connection terminals 260 in an overlapping manner.

[0041] The first push rod 240 is configured to apply a force to at least one side of the plurality of first signal transmission pins 220, thereby maintaining contact between the plurality of first signal transmission pins 220 and the plurality of connection terminals 260. For example, the first push rod 240 may be disposed on the side opposite the protrusion 400 of the plurality of first signal transmission pins 220, i.e., the other side. Because the first push rod 240 applies a force to the other side of the plurality of first signal transmission pins 220, the protrusion 400 is in contact with the plurality of connection terminals 260 without any gap, thereby ensuring stable signal transmission between the plurality of first signal transmission pins 220.

[0042] The first push rod 240 can be made of an insulating material, such as a plastic material, but is not necessarily limited thereto.

[0043] The first push rod 240 may be, for example, wedge-shaped, with its apex located between the first printed circuit substrate 10 and the second printed circuit substrate 20. However, the wedge shape is not required and may be any other shape that allows the protrusions 400 of the plurality of first signal transmission pins 220 to securely contact the plurality of connection terminals 260.

[0044] The first push rod 240 is formed in a wedge shape. When the apex of the wedge applies a force to the other side of the plurality of first signal transmission pins 220, the plurality of first signal transmission pins 220 form a bending portion 280 between the first printed circuit board 10 and the second printed circuit board 20. As described above, the formation of the bending portion 280 allows the protrusions 400 of the plurality of first signal transmission pins 220 to firmly contact the plurality of connection terminals 260 through the principle of leverage.

[0045] The first metal shielding plate 100 is secured to the first push rod 240 and the second printed circuit substrate 20 and is configured to shield at least a portion of the second printed circuit substrate 20 and the first push rod 240. When the first metal shielding plate 100 is coupled to the first push rod 240, the first push rod 240 preferably applies a force to one side of the plurality of first signal transmission pins 220. The first metal shielding plate 100 can have varying thicknesses depending on the noise environment surrounding the printed circuit substrate, and can also be secured to different locations on the second printed circuit substrate 20.

[0046] Multiple shielding walls 500 are arranged between two adjacent first signal transmission pins and contact the ground terminals of the first and second printed circuit boards 10 and 20. These shielding walls 500 prevent signal interference between the signal transmission pins. Specifically, the use of multiple shielding walls 500 ensures isolation between the signal transmission pins. The shielding walls 500 can be made of metal.

[0047] According to one embodiment of the present invention, when the RF connector includes multiple shielding walls 500, the first push rod 240 may be composed of multiple unit push rods (not shown). For example, the multiple unit push rods may be arranged at positions corresponding to one side of the multiple first signal transmission pins 220, and the multiple shielding walls 500 may be arranged between the signal transmission pins. However, this configuration is not necessarily limited to the above.

[0048] like Figure 7 As shown in FIG. 1 , when a shielding wall is formed between each signal transmission pin for transmitting signals and the distance between each signal transmission pin is 6 mm, the isolation value is approximately 69 dB in the 3.5 GHz band. Even if the length of the shielding wall is reduced due to manufacturing tolerances, the isolation value is approximately 65 dB in the 3.5 GHz band. Therefore, in order to increase the isolation value, it is preferable to form a shielding wall as described above between each signal transmission pin for transmitting signals.

[0049] With the structure described above, signal transmission between printed circuit boards can be achieved on the same plane, thereby having the effect of reducing the size of components.

[0050] Figure 8 FIG. 1 is a top view of a printed circuit substrate combined with a shielding plate according to an embodiment of the present invention.

[0051] Reference Figure 3 、 Figure 4 and Figure 8According to an embodiment of the present invention, the RF connector may further include a third printed circuit board 30, a second bridge assembly 300, a plurality of second signal transmission pins 320, a second pushbar 340, and all or part of a second metal shielding plate 120.

[0052] The third printed circuit substrate 30 is arranged on the opposite side of the first printed circuit substrate 10, spaced apart from the second printed circuit substrate 20, and may be mounted with multiple components. In the RF connector according to one embodiment of the present invention, the third printed circuit substrate 30 may be an amplifier (Amp) board, but is not limited thereto.

[0053] The second bridge assembly 300 includes a plurality of second signal transmission pins 320 and is mounted in an area adjacent to at least one side of the third printed circuit substrate 30. Specifically, the second bridge assembly 300 is configured to assemble the plurality of second signal transmission pins 320 and to secure one end of the plurality of second signal transmission pins 320.

[0054] The plurality of second signal transmission pins 320, serving as a medium for transmitting and receiving signals, are connected to the second printed circuit substrate 20 and the third printed circuit substrate 30. The plurality of second signal transmission pins 320 can transmit not only RF signals but also power and digital signals. Depending on the characteristics of the first printed circuit substrate 10, the second printed circuit substrate 20, and the third printed circuit substrate 30, the plurality of second signal transmission pins 320 can also transmit signals with characteristics different from those of the plurality of first signal transmission pins 220.

[0055] The plurality of second signal transmission pins 320 can be assembled on the second bridge assembly 300 at equal intervals. However, this arrangement is not mandatory; the spacing between the second signal transmission pins 320 can be adjusted based on their respective functions. The spacing between the plurality of second signal transmission pins 320 can be described with reference to the description of the plurality of first signal transmission pins 220 described above.

[0056] For example, the plurality of second signal transmission pins 320 may be composed of more than 80 pins, and the 80 pins may be arranged with a certain interval between them. Like the plurality of first signal transmission pins 220, the plurality of second signal transmission pins 320 may have different numbers of pins depending on different uses. One side of the plurality of second signal transmission pins 320 may be formed with a protrusion 400.

[0057] The plurality of second signal transmission pins 320 respectively correspond to the plurality of connection terminals 260. For example, one signal transmission pin may correspond to one connection terminal, but the present invention is not necessarily limited thereto. Some of the plurality of second signal transmission pins 320 may also contact the ground terminal.

[0058] The plurality of connection terminals 260 that contact the plurality of second signal transmission pins are located on the second printed circuit substrate 20, preferably in a region opposite to the side where the plurality of first signal transmission pins 220 are located. The plurality of second signal transmission pins 320 respectively contact one side of the plurality of connection terminals 260 in an overlapping manner.

[0059] The second push rod 340 is configured to apply a force to at least one side of the plurality of second signal transmission pins 320 to maintain contact between the plurality of second signal transmission pins 320 and the plurality of connection terminals 260. Like the first push rod 240, the second push rod 340 can be disposed on the opposite side of the plurality of second signal transmission pins 320 where the protrusions 400 are located, i.e., the other side.

[0060] The second push rod 340 may be, for example, wedge-shaped, with the apex of the wedge located between the second printed circuit substrate 20 and the third printed circuit substrate 30. However, the wedge shape is not required and may be any other shape that allows the protrusions 400 of the plurality of second signal transmission pins 320 to securely contact the plurality of connection terminals 260.

[0061] The second push rod 340 is formed in a wedge shape. When the apex of the wedge applies a force to the other side of the plurality of second signal transmission pins 320, the plurality of second signal transmission pins 320 form a bent portion 280 between the second printed circuit substrate 20 and the third printed circuit substrate 30. As described above, the formation of the bent portion 280 allows the protrusions 400 of the plurality of second signal transmission pins 320 to securely contact the plurality of connection terminals 260 through the principle of leverage.

[0062] The second push rod 340 can be made of an insulating material, such as a plastic material, but is not necessarily limited thereto.

[0063] The second metal shielding plate 120 is secured to the second push rod 340 and the second printed circuit substrate 20 and is configured to shield at least a portion of the second printed circuit substrate 20 and the second push rod 340. When the second metal shielding plate 120 is coupled to the second push rod 340, the second push rod 340 preferably applies a force to one side of the plurality of second signal transmission pins 320. The second metal shielding plate 120 can have varying thicknesses depending on the noise environment surrounding the printed circuit substrate, and can also be secured to different locations on the second printed circuit substrate 20.

[0064] In addition to the first metal shielding plate 100 and the second metal shielding plate 120, another metal shielding plate may be combined to cover the first printed circuit substrate 10 and the third printed circuit substrate 30. Therefore, it is possible to prevent noise from interfering with the path for transmitting wireless signals.

[0065] In addition, a plurality of shielding walls 500 may be included, which are arranged between two adjacent second signal transmission pins and contact the ground terminals of the second printed circuit substrate 20 and the third printed circuit substrate 30. The plurality of shielding walls 500 are described above.

[0066] According to an embodiment of the present invention, the RF connector's bridge assembly, signal transmission pins, push rod, and shielding wall can be disposed between each printed circuit board. For example, two of these components can be used. However, this is not a requirement; one, three, or more components can be used depending on the intended application.

[0067] As described above, the RF connector according to one embodiment of the present invention can minimize the size of the component by utilizing multiple signal transmission pins to transmit signals on the same plane. Furthermore, compared to the case of using a multi-connector, it is easier to manufacture and has the effect of reducing the unit price of the component.

[0068] The above description is only used to illustrate the technical concept of this embodiment. For those skilled in the art with ordinary knowledge in the technical field to which this embodiment belongs, various modifications and variations can be made without exceeding the essential features of this embodiment. Therefore, this embodiment is not used to limit the technical concept of this embodiment but is used for illustration. The scope of the technical concept of this embodiment is not limited by the embodiment. The scope of protection of this embodiment should be interpreted based on the following claims, and all technical concepts within the scope equivalent to them should be interpreted as belonging to the scope of rights of this embodiment.

[0069] [Explanation of Reference Signs]

[0070] 10: First printed circuit board 20: Second printed circuit board

[0071] 30: Third printed circuit board 100: First metal shielding plate

[0072] 120: Second metal shielding plate 200: First bridge component

[0073] 220: First signal transmission pin 240: First push rod

[0074] 260: Connecting terminal 280: Bend portion

[0075] 300: second bridge component 320: second signal transmission pin

[0076] 340: Second push rod 400: Protrusion

[0077] 500: Shielding wall

[0078] [CROSS-REFERENCE TO RELATED APPLICATIONS]

[0079] This application is based on and claims the benefit of priority from Korean patent application No. 10-2020-0063073, filed on May 26, 2020, the entire contents of which are incorporated herein by reference.

Claims

1. RF connector, characterized in that, include: a first printed circuit substrate having a plurality of components mounted thereon; a first bridge assembly mounted in an area adjacent to at least one side of the first printed circuit substrate and comprising a plurality of first signal transmission pins; a second printed circuit substrate, arranged spaced apart from the first printed circuit substrate; a plurality of connection terminals arranged in an area close to at least one side of the second printed circuit substrate so as to contact at least one side of the plurality of first signal transmission pins; a first push rod configured to apply a force to at least one side of the plurality of first signal transmission pins so as to keep the plurality of first signal transmission pins in contact with the plurality of connection terminals; as well as The first metal shielding plate is fixed on the first push rod and the second printed circuit substrate and is configured to shield at least a portion of the second printed circuit substrate and the first push rod.

2. The RF connector according to claim 1, wherein: The system includes a plurality of shielding walls disposed between two adjacent first signal transmission pins, wherein the plurality of shielding walls are in contact with the ground ends of the first printed circuit substrate and the second printed circuit substrate.

3. The RF connector according to claim 1, wherein: The plurality of first signal transmission pins are assembled on the first bridge component at equal intervals.

4. The RF connector according to claim 1, wherein: The plurality of first signal transmission pins respectively correspond to the plurality of connection terminals, and the plurality of first signal transmission pins overlap and contact one side of the plurality of connection terminals.

5. The RF connector according to claim 1, wherein: A protrusion for contacting the plurality of connection terminals is formed on one side of the plurality of first signal transmission pins.

6. The RF connector according to claim 5, wherein: The first push rod is configured to apply a force to the other side of the plurality of first signal transmission pins.

7. The RF connector according to claim 6, wherein: The first push rod is wedge-shaped, and the vertex of the wedge is located between the first printed circuit substrate and the second printed circuit substrate.

8. The RF connector according to claim 7, wherein: The plurality of first signal transmission pins form a bent portion between the first printed circuit substrate and the second printed circuit substrate.

9. The RF connector according to claim 1, wherein: The plurality of first signal transmission pins are used to transmit RF signals, power and digital signals.

10. The RF connector according to claim 1, wherein: The plurality of connection terminals are formed in a pad type.

11. The RF connector according to claim 1, wherein: The first push rod is made of plastic material.

12. The RF connector according to claim 1, wherein: The first printed circuit substrate is an amplifier board, and the second printed circuit substrate is a digital board.

13. The RF connector according to claim 1, wherein: Further including: a third printed circuit substrate, which is arranged on the opposite side of the first printed circuit substrate with respect to the second printed circuit substrate and is installed with a plurality of components; a second bridge component mounted in an area adjacent to at least one side of the third printed circuit substrate and comprising a plurality of second signal transmission pins; a second push rod configured to apply a force to at least one side of the plurality of second signal transmission pins so as to keep the plurality of second signal transmission pins in contact with the plurality of connection terminals; as well as The second metal shielding plate is fixed on the second push rod and the second printed circuit substrate and is configured to shield at least a portion of the second printed circuit substrate and the second push rod.

14. The RF connector according to claim 13, wherein: The third printed circuit substrate is an amplifier board.

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