Circuit board

Abstract

A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion provided in the insulating layer, wherein the lead pattern portion includes a first portion provided in the insulating layer, a second portion extending from one end of the first portion, and a third portion connected to the first portion through the second portion and having a via, the first portion is provided to overlap the insulating layer in a vertical direction, the second and third portions are provided at an outside of the insulating layer and do not overlap the insulating layer, and the lead pattern portion has a center line average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.

Description

Technical Field

[0001] The embodiments relate to circuit boards, and more specifically, to circuit boards for image sensors, sensor drivers, and camera modules including the same. Background Technology

[0002] With the widespread use of various portable terminals and the commercialization of wireless internet services, consumer demand related to portable terminals has diversified, and various additional devices have been installed in portable terminals.

[0003] One example is a camera device used to capture subjects in photographs or moving images. Meanwhile, recent camera devices employ camera shake correction to prevent image blurring caused by the photographer's camera movement.

[0004] However, the lens shift in the x-axis / y-axis direction used in traditional camera shake correction modules has limitations in correcting various types of camera shake. Summary of the Invention

[0005] Technical issues

[0006] The embodiments provide a circuit board, an image sensor driver, and a camera module including the circuit board capable of correcting hand shakes for x-axis offset, y-axis offset, and rotation about the z-axis.

[0007] Furthermore, the embodiments provide a circuit board that performs both lens-based and image sensor-based hand shake correction, an image sensor driver, and a camera module including the thereof.

[0008] Furthermore, the embodiments provide a circuit board, an image sensor driver, and a camera module including the spring structure that can simplify the spring structure used to provide autofocus and shake compensation functions.

[0009] Furthermore, the embodiments provide a circuit board, an image sensor driver, and a camera module including the circuit board, which are included in the circuit board and can improve the reliability of the patterned portion having electrical signal transmission function and spring function.

[0010] The technical problems to be solved by the proposed embodiments are not limited to those described above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description of the proposed embodiments.

[0011] Technical solution

[0012] The circuit board according to an embodiment includes an insulating layer; a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is configured to overlap the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0013] In addition, the lead pattern portion has a strength of at least 1000 N / mm. 2 Tensile strength or at least 1000 N / mm 2 0.2% offset yield strength.

[0014] In addition, the lead pattern portion includes: a metal layer; and a first plating layer disposed on the metal layer; wherein the first plating layer has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0015] In addition, the lead pattern portion includes a metal layer, wherein the metal layer has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0016] In addition, the lead pattern portion includes a second plating layer disposed on the metal layer, wherein the second plating layer has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0017] In addition, the metal layer has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0018] Furthermore, the width of the upper surface of each of the first and second parts is within the range of 50% to 100% of the width of the lower surface.

[0019] In addition, the insulating layer has an opening, wherein the lead pattern portion includes: a third portion that is connected to the first portion through the second portion and includes a through hole; and a fourth portion that extends from the other end of the first portion in the interior direction of the insulating layer and is disposed on the opening and does not contact the insulating layer.

[0020] In addition, the second part includes the area that curves between the first part.

[0021] Furthermore, the metal layer is a binary or ternary composite alloy of copper (Cu) containing at least one of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be) and cobalt (Co), and wherein the first plating layer is formed of the same metallic material as the metal layer.

[0022] In addition, the circuit board includes a reinforcing pattern disposed on an insulating layer spaced apart from the lead pattern portion. The reinforcing pattern comprises the same metallic material as the lead pattern portion and has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0023] On the other hand, the sensor driving device according to an embodiment includes a magnet holder; a magnet portion coupled to the magnet holder; a fixed portion disposed on the magnet holder and including a first lead pattern portion; a moving portion spaced apart from the fixed portion at a predetermined interval and including an image sensor; and a plurality of lines disposed between the moving portion and the fixed portion, wherein the moving portion includes a circuit board including an insulating layer and a second lead pattern portion disposed on the insulating layer, wherein one end of the second lead pattern portion is electrically connected to the lines and the other end of the lead pattern portion is electrically connected to the image sensor, wherein at least one surface of the second lead pattern portion includes a metal layer having a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0024] Furthermore, the insulating layer includes an opening in which an image sensor is disposed, wherein the second lead pattern portion includes a first portion disposed on the insulating layer; a second portion extending outward from one end of the first portion; a third portion connected to the first portion through the second portion and including a through-hole through which the wire passes; and a fourth portion extending inward from the other end of the first portion, positioned on the opening, and electrically connected to the image sensor.

[0025] Effects of the present invention

[0026] According to the embodiment, the image sensor moves relative to the lens barrel in the X, Y, and Z axes, instead of moving a conventional lens barrel, to facilitate the OIS and AF functions of the camera module. Therefore, the camera module according to the embodiment can eliminate the complex spring structure used to implement OIS and AF functions, thereby simplifying the structure. Furthermore, compared to the prior art, moving the image sensor according to the embodiment relative to the lens barrel enables the formation of a stable structure.

[0027] Furthermore, the circuit board for the image sensor, electrically connected to the image sensor according to an embodiment, includes a patterned portion having a spring structure and floating in a position where it does not overlap with the insulating layer in the vertical direction. In this case, the patterned portion has a strength and tensile strength above a certain level. That is, the patterned portion of the embodiment should be elastic to realize OIS and AF functions as well as electrical signal transmission functions. Therefore, the patterned portion in the embodiment can be formed from a rolled material to have a strength and tensile strength above a certain level. Accordingly, the patterned portion according to the embodiment can solve reliability problems such as pattern breakage that occurs during OIS or AF functions. In detail, the circuit board for the image sensor according to the embodiment can stably move the image sensor relative to the lens barrel while stably and elastically supporting the image sensor, thereby improving the operational reliability for OIS and AF.

[0028] Furthermore, the metal layer in the embodiment is a rolled material, and therefore has a centerline average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, when the metal layer has a roughness within the above range, the adhesion between the patterned portion and the insulating layer is reduced due to the small surface roughness, and thus the patterned portion detaches from the insulating layer.

[0029] Therefore, the surface of the metal layer in the embodiments is surface-treated to have a specific level or higher surface roughness. The surface of the metal layer can be a lower surface that contacts or faces the insulating layer. In this case, the surface treatment of the lower surface in the embodiments can be performed by forming a plating layer on the lower surface of the metal layer. Furthermore, the surface treatment in another embodiment can be performed by applying at least one of chemical polishing and physical polishing to the lower surface of the metal layer. Additionally, the lower surface of the metal layer can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm and / or a 10-point average roughness in the range of 1.0 μm to 5.0 μm through the surface treatment described above. Therefore, in the embodiments, by surface-treating the lower surface of the metal layer, a specific level or higher surface roughness can be imparted to the lower surface of the metal layer, thereby improving adhesion to the insulating layer. Furthermore, the embodiments can address the reliability problem of the patterned portion detaching from the insulating layer by improving the adhesion between the insulating layer and the patterned portion.

[0030] Furthermore, the upper surface of the metal layer in the embodiments is surface-treated to have a specific level or higher surface roughness. The upper surface of the metal layer may be the surface that comes into contact with the photoresist (PR) during the formation of the patterned portion. In this case, the surface treatment can be performed by forming a plating layer on the upper surface of the metal layer in the same manner as the lower surface. Alternatively, the surface treatment in another embodiment can be performed by performing soft etching or chemical coating on the upper surface of the metal layer. Thus, the upper surface of the metal layer can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm and / or a 10-point average roughness in the range of 1.0 μm to 5.0 μm through the surface treatment described above. Therefore, in the embodiments, by surface-treating the upper surface of the metal layer, a specific level or higher surface roughness can be imparted to the upper surface of the metal layer, and thereby the adhesion to the PR can be improved. In addition, the embodiments can achieve a high etch factor by improving the adhesion between the metal layer and the PR, thereby improving reliability. Specifically, in the embodiments, because a high etch factor can be achieved, the width of the upper surface of the patterned portion can be in the range of 50% to 100% of the width of the lower surface of the patterned portion. Furthermore, according to an embodiment, the noise characteristics of the signal transmitted through the patterned portion can be improved by modifying the dimensional deviation of the width of the upper and lower surfaces of the patterned portion.

[0031] According to the above embodiments, X-axis offset, Y-axis offset, and Z-axis center rotation corresponding to image sensor and camera shake can be performed, and therefore, camera shake correction of the image sensor can be performed together with camera shake correction of the corresponding lens, thereby providing a more improved image stabilization function.

[0032] Furthermore, by utilizing the internal space of the second actuator for moving the image sensor relative to the lens barrel, and by embedding the electronic components required for the camera circuitry, the overall height of the camera device according to the embodiment can be reduced.

[0033] Furthermore, the camera assembly process according to the embodiment can be simplified by integrating and fusing components of the camera circuitry and components of the second actuator. Attached Figure Description

[0034] Figure 1 This is a view of the camera module based on the comparison example.

[0035] Figure 2 This is a perspective view of a camera device according to an embodiment.

[0036] Figure 3 It is along Figure 2 A cross-sectional view taken from line AA.

[0037] Figure 4 This is an exploded perspective view of the camera device according to this embodiment.

[0038] Figure 5 This is an exploded perspective view of the second actuator according to an embodiment.

[0039] Figure 6 It is a schematic diagram. Figure 7 A cross-sectional view showing the connection relationship between the first substrate and the moving part.

[0040] Figure 7 yes Figure 5 An exploded perspective view of the fixed portion.

[0041] Figure 8 yes Figure 5 The bottom view of the fixed part.

[0042] Figure 9 This is a more detailed view illustrating the upper surface of the first substrate.

[0043] Figure 10 This is an exploded perspective view of the movable portion according to an embodiment.

[0044] Figure 11 This is an exploded perspective view of the fourth substrate.

[0045] Figure 12 This is a plan view of the fourth substrate.

[0046] Figure 13 yes Figure 12 A magnified view of a specific area.

[0047] Figure 14 This is a view used to explain the peeling problem of patterned parts based on the comparison example.

[0048] Figure 15 This is a view used to explain the surface roughness of the patterned portion according to the comparative examples and embodiments.

[0049] Figures 16a to 16c This is a view used to explain the surface treatment of the patterned portion according to the embodiment.

[0050] Figure 17 This is a view used to explain the cross-sectional shape of the patterned portion according to the comparative examples and embodiments.

[0051] Figure 18 This is an exploded perspective view of the image sensor module 400 according to an embodiment.

[0052] Figure 19 This is a view illustrating the combination of the third substrate and the image sensor module 400.

[0053] Figure 20 This is a view used to explain the x-axis direction offset driven by some configuration of the camera device according to this embodiment.

[0054] Figure 21 This is a view used to explain the y-axis direction offset driven by some configuration of the camera device according to this embodiment.

[0055] Figure 22 This is a view used to explain the z-axis rotation drive through some configurations of the camera device according to this embodiment.

[0056] Figure 23 (a) is a view illustrating a magnet and a magnet holder arranged on a first substrate along the x-axis and y-axis.

[0057] Figure 23 (b) is a view illustrating the first substrate, magnet holder, magnet, and coil under rotational drive in the z-axis direction.

[0058] Figure 24 This is a view of the magnetic flux and Lorentz force between the magnet and the coil of the camera device according to this embodiment.

[0059] Figure 25 This is a perspective view of the optical device according to this embodiment.

[0060] Figure 26 yes Figure 25 Block diagram of the optical device shown. Detailed Implementation

[0061] In the following description, embodiments of the invention will be illustrated in detail with reference to the accompanying drawings.

[0062] However, the spirit and scope of the invention are not limited to the portion of the described embodiments, and it can be implemented in various other forms. Furthermore, one or more elements in the embodiments can be selectively combined and substituted within the spirit and scope of the invention.

[0063] Furthermore, unless otherwise explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries may be interpreted as having a meaning consistent with their meaning in the context of the relevant art. Moreover, the terminology used in the embodiments of this invention is for describing embodiments and is not intended to limit the invention.

[0064] In this specification, unless specifically stated in the phrase, the singular form may also include the plural form, and when described in “at least one (or more) of A, B, and C,” it may include at least one of all combinations that can be combined among A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b)) may be used when describing elements of embodiments of the invention.

[0065] These terms are used only to distinguish an element from other elements, and these terms are not limited to the nature, order, or sequence of elements. Furthermore, when an element is described as “connected,” “coupled,” or “connected” to another element, it may include not only when the element is directly “connected,” “coupled,” or “connected” to other elements, but also when the element is “connected,” “coupled,” or “connected” by another element between the element and other elements.

[0066] Furthermore, when described as being formed or disposed "above" or "below" in each element, "above" or "below" may include not only when the two elements are directly connected to each other, but also when one or more other elements are formed or arranged between the two elements. Additionally, when expressed as "above" or "below," it may include not only the upward direction based on a single element, but also the downward direction.

[0067] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0068] Figure 1 This is a view showing the camera module according to the comparison example.

[0069] Camera modules with optical image stabilization (OIS) and autofocus (AF) require at least two spring plates.

[0070] The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires elastic components, such as at least six springs for the spring plates.

[0071] refer to Figure 1 The camera module according to the comparative example includes an optical system comprising a lens assembly, an infrared cutoff filter, and a sensor unit. Specifically, the camera module according to the comparative example includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a housing 42, an infrared cutoff filter 50, a sensor unit 60, a circuit board 80, and drivers 71, 72, 73, and 74.

[0072] In this configuration, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 via a first elastic member 31. In other words, the lens barrel 10 is connected to the first housing 41 such that it is movable via the first elastic member 31. In this configuration, the first elastic member 31 comprises a plurality of springs (not shown). For example, at multiple points on the lens barrel 10, the first elastic member 31 connects the lens barrel 10 and the first housing 41.

[0073] A second elastic member 32 is connected to a first housing 41 and a second housing 42 that houses the first housing 41. The second elastic member 32 secures the first housing 41 to the second housing 42, making it movable. The second elastic member 32 includes a plurality of springs. Specifically, the second elastic member 32 includes a leaf spring.

[0074] In this configuration, the first elastic member 31 supports the lens barrel 10 while simultaneously allowing the lens barrel 10 to move relative to the sensor unit 60 in the vertical direction (Z-axis direction). For this purpose, the first elastic member 31 comprises at least four springs.

[0075] Furthermore, the second elastic member 32 supports the lens barrel 10 while allowing the lens barrel 10 to move relative to the sensor unit 60 in the horizontal direction (X-axis and Y-axis directions). For this purpose, the second elastic member 32 includes at least two springs.

[0076] As described above, in the camera module according to the comparative example, OIS and AF are performed as the lens barrel 10 moves in the X, Y, and Z axis directions. For this purpose, the camera module according to the comparative example requires at least six elastic members, such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the elastic members as described above. Furthermore, the camera module according to the comparative example requires additional components, such as an elastic line for fixing the lens barrel 10 along the Z axis. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel in the X, Y, and Z axis directions.

[0077] Furthermore, in the camera module according to the comparative example, it is necessary to manually perform the operation of coupling the corresponding elastic member to couple the elastic member to the lens barrel 10. Therefore, the camera module according to the comparative example has a complex manufacturing process and requires a long manufacturing time.

[0078] Furthermore, the camera module according to the comparative example provides a tilt function for the lens barrel 10, but has a structure in which tilt correction of the image is substantially difficult. That is, even if the lens barrel 10 is rotated relative to the sensor unit 60, the image incident on the sensor unit 60 is not changed, and therefore tilt correction of the image is difficult, and furthermore, the tilt function itself is unnecessary.

[0079] In the following, an image sensor substrate, a camera module, and a camera device including the thereof will be described according to embodiments.

[0080] The “optical axis direction” used below is defined as the optical axis direction of the lens and / or the image sensor coupled to the lens drive device.

[0081] The term "vertical direction" as used below can refer to a direction parallel to the optical axis. The vertical direction can correspond to the "z-axis direction." The term "horizontal direction" as used below can refer to a direction perpendicular to the vertical direction. That is, the horizontal direction can be perpendicular to the optical axis. Therefore, the horizontal direction can include both the "x-axis direction" and the "y-axis direction."

[0082] The term "autofocus" as used below is defined as the function of automatically adjusting the focus on the subject by adjusting the distance from the image sensor and moving the lens along the optical axis according to the distance to the subject, so as to obtain a sharp image of the subject on the image sensor. "Autofocus" may also correspond to "AF (Autofocus)".

[0083] The term "camera shake correction function" as used below is defined as the function of moving the lens and / or image sensor to eliminate vibrations (movements) caused by external forces within the image sensor. "Camera shake correction function" can also be interpreted as "optical image stabilization (OIS)".

[0084] Figure 2 This is a perspective view of the camera device according to an embodiment. Figure 3 It is along Figure 2 The cross-sectional view taken by line AA, and Figure 4 This is an exploded perspective view of the camera device according to an embodiment.

[0085] The camera device in the embodiments may include a camera module. The camera device may include a lens driving device. Here, the lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens drive motor. The lens driving device may be a lens drive actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0086] <Camera Device>

[0087] The camera device may include a lens module 100.

[0088] Lens module 100 may include lenses and lens barrels. Lens module 100 may include one or more lenses and a lens barrel capable of housing one or more lenses. However, one configuration of lens module 100 is not limited to a lens barrel, and any retainer structure capable of supporting one or more lenses is possible. Lens module 100 is coupled to a first actuator 200 for movement. As an example, lens module 100 may be coupled to the interior of the first actuator 200. Therefore, lens module 100 can move within the first actuator 200 in response to movement of the first actuator 200. Lens module 100 may be threadedly coupled to the first actuator 200. As an example, lens module 100 may be coupled to the first actuator 200 by an adhesive (not shown). Meanwhile, light passing through lens module 100 can be irradiated onto an image sensor. Lens module 100 may include, for example, five lenses. Lens module 100 may include liquid lenses and solid lenses. Liquid lenses contain conductive and non-conductive liquids, and the interface formed between the conductive and non-conductive liquids can be controlled electrically. A liquid lens is a lens whose focal length can be adjusted by adjusting the interface.

[0089] The camera device may include an actuator.

[0090] In detail, the camera device may include a first actuator 200 for shifting the lens module 100. The first actuator 200 may be an AF module. The first actuator 200 can move the lens module 100 in the vertical direction (obviously, the optical axis direction). That is, the first actuator 200 can perform an autofocus function by moving the lens module 100 in the optical axis direction.

[0091] The second actuator 600 can drive the image sensor 430. The second actuator 600 can tilt or rotate the image sensor 430. The second actuator 600 can move the image sensor 430. The second actuator 600 can move the image sensor 430 in a first direction perpendicular to the optical axis, move the image sensor 430 in a second direction perpendicular to both the optical axis and the first direction, and rotate the image sensor 430 based on the optical axis. In this case, the first direction can be the x-axis direction, the second direction can be the y-axis direction, and the optical axis can be the z-axis direction.

[0092] Simultaneously, the first actuator 200 and the second actuator 600 may include drivers for moving the lens module 100 and the image sensor 430, respectively. That is, the first actuator 200 may include a first driver (described later). Furthermore, the second actuator 600 may include a second driver (described later). Each of the first and second drivers may include a coil and a magnet. Additionally, the coil and magnet may generate an electromagnetic force between them to drive the lens module 100 and the image sensor 430, respectively.

[0093] The camera device may include a housing. The housing may include a first housing 300 covering the upper region of the camera device. Furthermore, the housing may include a second housing 500 covering the lower region of the first housing 300.

[0094] The image sensor module 400 can be coupled to the second actuator 600. Preferably, the second actuator 600 can consist of a fixed portion (described later) and a movable portion (described later). Furthermore, the movable portion of the second actuator 600 can be connected to the fixed portion via a wire (described later). The movable portion of the second actuator 600 can move relative to the fixed portion by the electromagnetic force of the second drive portion. Here, the movement of the fixed portion can include movement in a first direction, movement in a second direction, and movement in the optical axis direction.

[0095] Furthermore, the image sensor module 400 can be coupled to the moving portion of the second actuator 600. The image sensor module 400 may include an image sensor 440. The image sensor 440 may be any one of a charge-coupled device (CCD), a metal-oxide-semiconductor (MOS), a CPD, and a CID.

[0096] In this embodiment, the image sensor 440 can rotate about the x-axis, y-axis, and z-axis. The image sensor 440 can move about the x-axis, y-axis, and z-axis. The image sensor 440 can tilt about the x-axis, y-axis, and z-axis.

[0097] In other words, the image sensor module 400 is coupled to the moving part of the second actuator 600, and when the moving part of the second actuator 600 moves relative to the fixed part of the second actuator 600, it can move together with the moving part of the second actuator 600 relative to the fixed part of the second actuator 600. As a result, camera shake correction function can be performed.

[0098] As described above, in this embodiment, the AF function can be performed by the first actuator 200 or the liquid lens of the lens module, and the camera shake correction function can be performed by the second actuator 600. Alternatively, the second actuator 600 can perform both the AF function and the camera shake correction function.

[0099] According to this embodiment, the camera device moves the image sensor module 400 relative to the lens module 100 to perform camera shake correction and / or autofocus functions.

[0100] In other words, recently, with the development of camera technology, image resolution has increased, thereby increasing the size of the image sensor 440. At the same time, with the increase in the size of the image sensor 440, the size of the lens module 100 and the components of the actuators used to shift the lens module 100 also increase. Therefore, with the increased weight of the other actuator components used to shift the lens module 100 and the lens module 100 itself, it is difficult to stably shift the lens module 100 using conventional VCM technology, and many reliability issues arise.

[0101] Therefore, in this embodiment, AF is performed using a first actuator 200 that implements the lens shifting method, and OIS is performed using a second actuator 600 that implements the image sensor shifting method, thereby improving the reliability of the camera device.

[0102] Furthermore, camera shake in camera devices can include 5-axis camera shake. For example, in 5-axis camera shake, there are two camera shakes caused by angular shaking, two camera shakes caused by displacement, and one camera shake caused by rotation. In this case, 4-axis camera shake correction is possible using the lens shifting method, but it is not possible to correct camera shake caused by rotation. This is because camera shake caused by rotation should be corrected by the rotation of the optical module, and even if the lens module 100 is rotated, the incident light path remains unchanged. Therefore, 5-axis camera correction is impossible using the lens shifting method. Therefore, in this embodiment, the reliability problem of the lens shifting method can be solved according to the development of camera technology as described above, while the sensor shifting method enables 5-axis camera shake correction.

[0103] In the following text, each configuration of the camera device according to the embodiments will be described in more detail. Specifically, the configuration of the second actuator in the configuration of the camera device according to the embodiments will be described in detail below.

[0104] <Second Actuator>

[0105] The second actuator 600 will be described below.

[0106] The second actuator 600 can be positioned below the first actuator 200 and operate separately from the first actuator 200 to shift the image sensor module 400.

[0107] Therefore, the second actuator 600 may include a fixed portion 700 whose position is fixed, and a moving portion 800 whose position is moved by the electromagnetic force of the actuator when the second actuator 600 is coupled to the fixed portion.

[0108] Figure 5 This is an exploded perspective view of the second actuator according to an embodiment. Figure 6 It is a schematic diagram. Figure 5 A cross-sectional view showing the connection relationship between the first substrate and the moving part. Figure 7 yes Figure 5 Exploded perspective view of the fixed part Figure 8 yes Figure 5 Bottom view of the fixed part, Figure 9 This is a more detailed view illustrating the upper surface of the first substrate. Figure 10 This is an exploded perspective view of the movable portion according to an embodiment. Figure 11 This is an exploded perspective view of the fourth substrate. Figure 12 This is a plan view of the fourth substrate. Figure 13 yes Figure 12 A magnified view of a specific area. Figure 14 This is a view used to explain the peeling problem of the patterned portion based on the comparison example. Figure 15 This is a view used to explain the surface roughness of the patterned portion according to the comparative examples and embodiments. Figures 16a to 16c This is a view used to explain the surface treatment of the patterned portion according to the embodiment, and Figure 17 This is a view used to explain the cross-sectional shape of the patterned portion according to the comparative examples and embodiments.

[0109] refer to Figures 5 to 17 The second actuator 600 may include a fixed substrate portion 700, a movable substrate portion 900, a connecting line 800, and a substrate housing 1000.

[0110] The fixed substrate portion 700 and the movable substrate portion 900 are electrically connected to each other via a connecting line 800. Here, the length of the connecting line 800 is greater than the sum of the thicknesses of both the fixed substrate portion 700 and the movable substrate portion 700. Accordingly, the movable substrate portion 900, positioned below the fixed substrate portion 700, can be separated from the fixed substrate portion 700 by a predetermined distance. That is, via the connecting line 800, in a suspended state (airborne state), the movable substrate portion 900 can move relative to the fixed substrate portion 700 to the lower part of the fixed substrate portion 700 by the electromagnetic force generated by the magnet portion and the coil portion, described later.

[0111] The connecting line 800 can connect the fixed substrate portion 700 and the movable substrate portion 900. The connecting line 800 can be elastic. The connecting line 800 can be an elastic member. The connecting line 800 can be a wire spring. When the fixed substrate portion 700 and the movable substrate portion 900 are spaced apart at a predetermined interval, the connecting line 800 can connect between the circuit pattern portion of the fixed substrate portion 700 and the circuit pattern portion of the movable substrate portion 900. The connecting line 800 can be formed of metal. The connecting line 800 can elastically support the movement of the movable substrate portion 900.

[0112] The connecting line 800 may include multiple lines. These multiple lines may correspond to the number of channels of signals exchanged between the movable substrate portion 900 and the fixed substrate portion 700. The connecting line 800 may include a total of thirty-six lines, nine at each location on the side surface between adjacent corners of the four corners of the fixed substrate portion 700 and the movable substrate portion 900.

[0113] For example, the connecting line 800 may include nine first lines 810 disposed on each of the first side surfaces of the fixed substrate portion 700 and the movable substrate portion 900, nine second lines 820 disposed on the second side surface, nine third lines 830 disposed on the third side surface, and nine fourth lines 840 disposed on the fourth side surface.

[0114] As described above, the connecting lines 800 can be evenly distributed on the four side surfaces. That is, the connecting lines 800 can be formed and arranged on the four side surfaces with the side surfaces facing each other. In this case, the connecting lines 800 should elastically support the movable substrate portion 900 relative to the fixed substrate portion 700 while transmitting signals. In this case, when the connecting lines 800 are asymmetrically arranged, problems may occur in the reliability of the displacement operation of the movable substrate portion 900. For example, when the connecting lines 800 are asymmetrically arranged, the amount of movement between the portion in which a large number of connecting lines are arranged and the portion in which a small number of connecting lines are arranged may differ, thus causing problems with operational reliability. Therefore, in this embodiment, the connecting lines 800 are evenly distributed on each of the four side surfaces to improve the reliability of the image sensor displacement operation.

[0115] The substrate housing 1000 is disposed below the fixed substrate portion 700 to accommodate the movable substrate portion 900 therein.

[0116] The second actuator 600 configured as described above will be specifically described below.

[0117] The fixed substrate portion 700 may include a first substrate 710, a magnet holder 720, and a magnet portion 730.

[0118] The first substrate 710 may include: a first substrate region 711, wherein a first opening 712 is formed at its center; and a second substrate region 716, wherein a connector is provided extending from the first substrate region 711 and connected to an external device.

[0119] The first substrate 710 may include a first lead pattern portion 713 disposed in a first substrate region 711. The first lead pattern portion 713 of the first substrate 710 may be coupled to a connecting line 800. That is, one end of the connecting line 800 may be electrically coupled to the first lead pattern portion 713 of the first substrate 710. The first lead pattern portion 713 and the connecting line 800 may be coupled by soldering, but are not limited thereto. In this case, the solder resist may be opened in the region on the first substrate 710 where the first lead pattern portion 713 is disposed for electrical connection with the connecting line 800.

[0120] In detail, the first lead pattern portion 713 includes a first hole 713-2 and a lead pattern 713-1 disposed around the first hole 713-2. That is, the first lead pattern portion 713 can be a pad including the first hole 713-2 through which the connecting wire 800 passes. Therefore, in the state where the connecting wire 800 passes through the first hole 713-2 to be electrically connected to the lead pattern 713-1 disposed around the first hole 713-2, the connecting wire 800 can be soldered.

[0121] The first lead pattern portion 713 is configured to have multiple first lead patterns. That is, the first lead pattern portion 713 includes multiple first lead patterns. Furthermore, the multiple first lead patterns are connected to the connecting lines 800. In this case, the number of first lead patterns can be equal to or less than the number of connecting lines 800. When the number of first lead patterns is the same as the number of connecting lines 800, all the first lead patterns can be coupled to the connecting lines. Furthermore, when the number of first lead patterns is less than the number of connecting lines 800, at least one of the first lead patterns may not be coupled to the connecting lines.

[0122] A connector may be disposed in a second substrate region 716 connected to the first substrate region 711. The connector may be a port for electrical connection to an external device.

[0123] In this configuration, the first substrate region 711 can be disposed in the camera device, and the second substrate region 716 can extend from the first substrate region 711 to be exposed to the outside of the camera device.

[0124] That is, the first substrate region 711 can be disposed inside the first housing 300, and the second substrate region 716 can be disposed outside the first housing 300 to include a connector for connecting to an external device.

[0125] The first substrate 710 can transmit signals to the movable substrate portion 900, or can receive signals transmitted from the movable substrate portion 900. That is, the first substrate 710 is electrically connected to the movable substrate portion 900 via a connection line 800, and therefore, power signals or communication signals (e.g., sensing signals or operation control signals) can be transmitted to the movable substrate portion 900 via the connection line 800, and signals including image signals obtained through the movable substrate portion 900 can be received.

[0126] The first pad portion 714 may be disposed in the edge region of the first substrate region 711 of the first substrate 710. The first pad portion 714 may be electrically connected to the flexible circuit board 260 included in the first actuator 200.

[0127] At least one first coupling hole 715 is formed in the corner region of the first substrate region 711 of the first substrate 710. The first coupling hole 715 may be formed to fix the first substrate 710 to the magnet holder 720.

[0128] The first substrate 710 can be fixedly positioned within the first housing 300 of the camera device. That is, the first substrate 710 can be fixedly positioned without moving.

[0129] A magnet holder 720 is disposed below the first substrate 710. The magnet holder 720 may be provided with a substrate mounting portion 721 on which the first substrate 710 is mounted. Furthermore, a first coupling protrusion 722 coupled to a first coupling hole 715 formed in the first substrate 710 may be formed in the substrate mounting portion 721.

[0130] With the first coupling hole 715 inserted into the first coupling protrusion 722, the first substrate 710 can be placed on the substrate placement portion 721.

[0131] In this configuration, the magnet holder 720 may include an opening region that overlaps with the first opening 712 of the first substrate 710 in the optical axis direction. Furthermore, an opening may be made at a location that overlaps with the first lead pattern portion 713 of the magnet holder 720 in the optical axis direction.

[0132] The gyroscope sensor 717 can be disposed on the lower surface of the first substrate 710. That is, according to this embodiment, the gyroscope sensor 717 can be disposed on the lower surface of the first substrate 710 and housed in the first housing 300 of the camera device.

[0133] That is, in this embodiment, the gyroscope sensor 717 for implementing the image stabilization function can be built-in in a state of being mounted on the lower surface of the first substrate 710, so that the angular velocity / linear velocity sensing information caused by camera shake can be fed back to the moving substrate portion 900. Therefore, in this embodiment, the gyroscope sensor 717 is disposed in the space between the first substrate 710 and the moving substrate portion 900, and thus there is no need to provide additional space for placing the gyroscope sensor 717.

[0134] A magnet mounting groove (not shown) in which the magnet portion 730 is disposed can be formed on the lower surface of the magnet holder 720. The magnet portion 730 can be disposed in the magnet mounting groove of the magnet holder 720. In this case, the magnet portion 730 can be configured to face the coil portion 916 disposed on the movable substrate portion 900. In this case, when current is applied to the coil portion 916, an electric field can be formed around the coil portion 916. When current is applied to the coil portion 916, the coil portion 916 can move relative to the magnet portion 730 via the electromagnetic interaction between the coil portion 916 and the magnet portion 730.

[0135] At the same time, such as Figure 8 As shown, one end of the connecting line 800 can be coupled to the first lead pattern portion 713 of the first substrate 710, and passes through the first hole 713-2 that forms the first lead pattern portion 713 to extend to the lower part of the first substrate 710.

[0136] As described above, based on the magnet holder 720, the fixed substrate portion 700 can be configured such that the first substrate 710 is disposed on the upper surface of the magnet holder 720, and the magnet portion 730 is disposed on its lower surface. Furthermore, a gyroscope sensor can be disposed on the lower surface of the first substrate 710. This gyroscope sensor obtains sensing information necessary for performing camera shake correction, and the signal obtained via the gyroscope sensor can be transmitted to the movable substrate portion 900 via the connecting line 800.

[0137] A substrate housing 1000 may be disposed below the fixed substrate portion 700. The substrate housing 1000 is coupled below the fixed substrate portion 700. Preferably, the substrate housing 1000 may provide a mounting portion (not shown) on which the magnet holder 720 constituting the fixed substrate portion 700 is mounted, and thus, the mounting portion (not shown) may be coupled to the magnet holder 720. Furthermore, a movable substrate portion 900 is disposed within the substrate housing 1000 coupled to the magnet holder 720.

[0138] The movable substrate portion 900 can be electrically connected to the fixed substrate portion 700 via the connecting line 800, and can move relative to the fixed substrate portion 700 through the interaction between the magnet portion 730 and the coil portion 916.

[0139] Therefore, the movable substrate portion 900 may include a second substrate 910, a substrate holder 920, a third substrate 930, and a fourth substrate 940. Specifically, the second substrate 910, the third substrate 930, and the fourth substrate 940 may be the second substrate portion constituting the movable substrate 900. Additionally, the first substrate 710 may be the first substrate portion constituting the fixed substrate portion 700.

[0140] The second substrate 910 can be a main substrate. The second substrate 910 can also be a drive substrate for driving the second actuator.

[0141] The second substrate 910 may include a second opening 911. In this case, the second opening 911 may overlap with the first opening 712 formed in the first substrate 710 in the optical axis direction. The second substrate 910 may include coil portions 916, which are disposed at each corner of the second substrate 910 and correspond to the coil portions 916. In addition, a second hole 912 may be formed in the edge region of the second substrate 910. In this case, the second hole 912 may be aligned with the first hole 713-2 formed in the first substrate 710 in the optical axis direction. The second hole 912 may be a through-hole through which a connecting line 800 coupled to the first substrate 710 passes.

[0142] A third hole 922 can be formed at the edge region of the substrate holder 920. In this case, the third hole 922 can be aligned in the optical axis direction with the second hole 912 formed in the second substrate 910 and the first hole 713-2 formed in the first substrate 710. The third hole 922 can be a through-hole through which the connecting line 800 coupled to the first substrate 710 passes. At the same time, an opening can be provided at the center of the substrate holder 920.

[0143] The third substrate 930 can be disposed in the opening of the substrate holder 920.

[0144] The third substrate 930 can relay the connection between the image sensor module 400, the second substrate 910 and the fourth substrate 940.

[0145] -Circuit board for image sensor-

[0146] The fourth substrate 940 also enables signal transmission and, simultaneously, enables the displacement of the image sensor module 400. The fourth substrate 940 may be a circuit board on which the image sensor module 400 is mounted. The fourth substrate 940 may be a key component in the configuration of the camera module in the embodiment. The fourth substrate 940 may be elastically and electrically coupled to the connection line 800. Here, elastic coupling may mean applying a spring force that allows the image sensor module 400 to move relative to the fixed substrate portion 700 by electromagnetic force. Furthermore, electrical coupling may mean being electrically connected to other components to transmit signals to or receive signals transmitted from the fixed substrate portion 700. Therefore, the patterned portion 942 included in the fourth substrate 940 should perform an electrical wiring function for transmitting electrical signals and a spring function for applying a spring force. This will be described in detail.

[0147] The fourth substrate 940 may include an insulating layer 941 and a patterned portion 942 disposed on the insulating layer 941.

[0148] The insulating layer 941 may include an opening 941-2. The opening 941-2 may be aligned in the optical axis direction with the openings of the first substrate 710, the second substrate 910, the third substrate 910, and the substrate holder 920.

[0149] The patterned portion 942 is disposed on the insulating layer 941. At this time, although not shown in the figure, an additional adhesive layer (not shown) for improving adhesion can be disposed between the insulating layer 941 and the patterned portion 942.

[0150] In this configuration, the pattern portion 942 includes a second lead pattern portion 942-1, which has one end connected to the third substrate 930 and the other end connected to the connecting line 800. Furthermore, the pattern portion 942 includes a reinforcing pattern 942-2, which is disposed on the corner region of the insulating layer 941.

[0151] The second lead pattern portion 942-1 is a circuit pattern for electrically connecting to the third substrate 930 and the connecting line 800 and for correspondingly transmitting and receiving signals.

[0152] Furthermore, the reinforcing pattern 942-2 can be disposed on the corner region of the insulating layer 941. The reinforcing pattern 942-2 can be electrically isolated from the second lead pattern portion 942-1. For example, the reinforcing pattern 942-2 can be configured to be spaced apart from the second lead pattern portion 942-1 by a predetermined interval. The reinforcing pattern 942-2 can impart rigidity to the fourth substrate 940. Therefore, the reinforcing pattern 942-2 may not be electrically connected to other components, and the reinforcing pattern 942-2 is only disposed in the corner region of the upper surface of the insulating layer 941 where the second lead pattern portion 942-1 is not disposed, to improve the rigidity of the fourth substrate 940. In this case, the reinforcing pattern 942-2 can be formed by etching the same metal layer as the second lead pattern portion 942-1. Furthermore, when the second lead pattern portion 942-1 is formed, the reinforcing pattern 942-2 can be formed together with the second lead pattern portion 942-1. Therefore, an advantage of this embodiment is that it is not necessary to provide additional components for improving the rigidity of the fourth substrate 940. In detail, in an embodiment, the reinforcing pattern 942-2 can be formed together with the second lead pattern portion 942-1 by using a portion of the metal layer used to form the second lead pattern portion 942-1. Therefore, additional metal layers or additional processes for forming the reinforcing pattern 942-2 are unnecessary.

[0153] Multiple second lead pattern portions 942-1 can be formed. The fourth substrate 940 may include, for example, 36 terminal portions (specifically, 36 second lead pattern portions serving as terminals), the same number as the number of connecting lines 800.

[0154] In this configuration, the second lead pattern portion 942-1 may include a second-first lead pattern portion 942-1a disposed in the first region of the insulating layer 941. Furthermore, the second lead pattern portion 942-1 may include a second-second lead pattern portion 942-1b disposed in the second region of the insulating layer 941 adjacent to the second-first lead pattern portion 942-1a. Additionally, the second lead pattern portion 942-1 may include a second-third lead pattern portion 942-1c disposed in a third region facing the first region of the insulating layer 941 and adjacent to the second region. Furthermore, the second lead pattern portion 942-1 may include a second-fourth lead pattern portion 942-1d disposed in a fourth region between the first and third regions, simultaneously facing the second region of the insulating layer 941. In other words, the second lead pattern portion 942-1 may include multiple lead patterns disposed in different regions of the insulating layer 941. Specifically, the second-first lead pattern portion 942-1a may include nine second-first lead patterns. Furthermore, the second-second lead pattern section 942-1b may include nine second-second lead patterns. Furthermore, the second-third lead pattern section 942-1c may include nine second-third lead patterns. Furthermore, the second-fourth lead pattern section 942-1d may include nine second-fourth lead patterns.

[0155] In this case, the number of second lead patterns can be equal to or less than the number of connecting lines. When the number of second lead patterns is the same as the number of connecting lines, all second lead patterns can be coupled to the connecting lines. Furthermore, when the number of second lead patterns is less than the number of connecting lines, at least one of the second lead patterns may not be coupled to a connecting line.

[0156] Furthermore, the reinforcing pattern 942-2 may include a first reinforcing pattern 942-2a disposed in a first corner region between a first region and a second region of the insulating layer 941, a second reinforcing pattern 942-2b disposed in a second corner region between a second region and a third region of the insulating layer 941, a third reinforcing pattern 942-2c disposed in a third corner region between a third region and a fourth region of the insulating layer 941, and a fourth reinforcing pattern 942-2d disposed in a fourth corner region between a first region and a fourth region of the insulating layer 941.

[0157] In this configuration, the insulating layer 941 has an opening 942-2 at its center. Furthermore, the insulating layer 941 includes a first insulating region 941-1 that contacts the second lead pattern portion 942-1 and the reinforcing pattern 942-2. Additionally, the insulating layer 941 includes a second insulating region 941-3 that protrudes outward from the outer surface of the first insulating region 941-1.

[0158] The second insulating region 941-3 supports the reinforcing pattern 942-2, and thus the contact area between the insulating layer 941 and the reinforcing pattern 942-2 can be increased to further improve the rigidity of the fourth substrate 940.

[0159] Meanwhile, the reinforcing pattern 942-2 may further include a coupling hole 943-3 into which a coupling protrusion (not shown) disposed on the lower surface of the substrate holder 920 is inserted.

[0160] Simultaneously, each lead pattern constituting the second lead pattern portion 942-1 includes a first portion 942-11 disposed on the insulating layer 941. Furthermore, each lead pattern constituting the second lead pattern portion 942-1 includes a second portion 942-12 extending from the first portion 942-11 toward the outside of the insulating layer 941. The second portion 942-12 may not overlap with the insulating layer 941 in the vertical direction or optical axis direction. That is, the second portion 942-12 may not contact the insulating layer 941. Additionally, each lead pattern constituting the second lead pattern portion 942-1 includes a third portion 942-13 extending outward from the second portion 942-12. The third portion 942-13 may be electrically connected to or coupled to the connecting line 800. The second portion 942-12 may be connected between the first portion 942-11 and the third portion 942-13. Each lead pattern comprising the second lead pattern portion 942-1 may include a fourth portion 942-14 extending from the first portion 942-11 in the inward direction of the insulating layer 941. The fourth portion 942-14 may be electrically connected to the third substrate 930.

[0161] Here, the first part 942-11 can be referred to as the "body part" of the second lead pattern part 942-1. That is, the first part 942-11 is disposed on the insulating layer 941, and therefore, it can be the body part supporting the second part 942-12, the third part 942-13, and the fourth part 942-14.

[0162] Furthermore, the third part 942-13 can be referred to as a "coupling portion" coupled to the connection line 800. Furthermore, the second part 942-12 can be referred to as a "connection portion" connecting the first part 942-11 and the third part 942-13. Furthermore, the fourth part 942-14 can be referred to as a "coupling portion" coupled to the third substrate 930, and can also be referred to as a "pad portion".

[0163] Additionally, the hole through which the connecting wire 800 passes can be formed in the third portion 942-13. The third portion 942-13 can be coupled to the connecting wire 800 by soldering. The second portion 942-12 may include a bent portion. The second portion 942-12 can be bent multiple times in one direction. The second portion 942-12 can be flexible. Therefore, the second lead pattern portion 942-1 can be flexible.

[0164] In this case, when the second portion 942-12 does not include the curved portion, the connecting wire 800 may be bent in the direction of movement as the image sensor module 400 moves, and may break depending on the degree and amount of warping. Alternatively, the second portion 942-12 in the embodiment includes a curved portion, and this curved portion can act as a suspender when the image sensor module 400 moves. Therefore, the curved portion of the second portion 942-12 of the second lead pattern portion 942-1 in the embodiment can impart elasticity to the connecting wire 800, and thus increase the rigidity of the connecting wire 800.

[0165] Part 4, 942-14, can be electrically connected to the third substrate 930.

[0166] On the other hand, only the first portion 942-11 of the second lead pattern portion 942-1 in the embodiment is disposed on the insulating layer 941, and the other portions are not disposed on the insulating layer 941. That is, only the lower surface of the first portion 942-11 of the second lead pattern portion 942-1 in the embodiment can contact the upper surface of the insulating layer 941. In addition, the second portion 942-12, the third portion 942-13, and the fourth portion 942-14 of the second lead pattern portion 942-1 in the embodiment may not contact the insulating layer 941. At this time, when an adhesive layer (not shown) is additionally disposed on the insulating layer 941 and the pattern portion 942 as described above, the first portion 942-11 can contact the adhesive layer other than the insulating layer 941.

[0167] Meanwhile, the third portion 942-13 can be a bonding pad electrically connected to the connection line 800. That is, the third portion 942-13 can be a solder pad soldered together with the connection line 800. For this purpose, the third portion 942-13 can include a through-hole through which the connection line 800 passes. Furthermore, the through-hole can be aligned in the optical axis direction with the third hole 922 of the substrate holder 920, the second hole 912 of the second substrate 910, and the first hole 713-2 of the first substrate 710.

[0168] Additionally, as described above, the second portion 942-12 can be connected between the first portion 942-11 and the third portion 942-13. For this purpose, the second portion 942-12 can include multiple bent portions. In this case, the second portion of each of the second lead pattern portions 942-1a, 942-1b, 942-1c, and 942-1d can be bent in the same direction. For example, the second portion 942-12 of each of the second lead pattern portions 942-1a, 942-1b, 942-1c, and 942-1d can include a clockwise rotating bent portion. That is, the second portion 942-12 can be bent in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Therefore, when rotating in the z-axis direction, the second portion 942-12 can minimize damage to the second lead pattern portion 942-1. In addition, it can prevent cracks from forming in the second lead pattern portion 942-1 or the second lead pattern portion 942-1 from detaching from the insulating layer 941.

[0169] Meanwhile, the adhesive layer disposed between the insulating layer 941 and the patterned portion 942 can be a cured adhesive, but is not limited thereto. Furthermore, the adhesive layer can be electroplated to increase adhesion or the adhesion between the insulating layer 941 and the second lead patterned portion 942-1, and thus can impart roughness to the surface. The adhesive layer may include at least one metallic material selected from Ni, Cr, Pd, Au, and Ag.

[0170] Meanwhile, the second lead pattern portion 942-1 is a line for transmitting electrical signals and can be formed of a highly conductive metallic material. Therefore, the second lead pattern portion 942-1 can be formed of at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Furthermore, the circuit pattern 112 can be formed of a paste or solder paste comprising at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), exhibiting excellent bonding strength.

[0171] Preferably, the second lead pattern portion 942-1 can be used as wiring for transmitting electrical signals, and can be formed of a metallic material having elastic force that allows the image sensor module 400 to move in the X, Y, and Z axis directions.

[0172] Therefore, the second lead pattern portion 942-1 can be made of a wire with a strength of 1000MPa (1000N / mm²). 2It is formed of a metallic material with tensile strength of 1000 or greater. For example, the second lead pattern portion 942-1 may be a binary alloy or a ternary alloy including copper. In detail, the second lead pattern portion 942-1 may be a binary alloy or a ternary alloy containing copper (Cu) as the main component and at least one of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be) and cobalt (Co).

[0173] For example, the second lead pattern portion 942-1 can be a binary alloy of copper (Cu) and nickel (Ni). For example, the second lead pattern portion 942-1 can be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn).

[0174] Meanwhile, the second lead pattern portion 942-1 can be formed using general processes for manufacturing printed circuit boards, such as additive process, subtractive process, modified semi-additive process (MSAP), and semi-additive process (SAP).

[0175] Meanwhile, the second lead pattern portion 942-1 can have different linewidths for each portion. The first portion 942-11 can have a wider width than other portions to increase the contact area with the insulating layer 941. Furthermore, the second portion 942-12 can have a narrower linewidth than the first portion 942-11 to provide elasticity. For example, the second portion 942-12 can have a linewidth of 20 μm to 1000 μm. For example, the second portion 942-12 can have a linewidth of 30 μm to 800 μm. For example, the second portion 942-12 can have a linewidth of 50 μm to 500 μm. When the linewidth of the second portion 942-12 is less than 20 μm, the overall rigidity of the second lead pattern portion 942-1 may be reduced, thereby reducing the reliability of the second lead pattern portion 942-1. Additionally, when the linewidth of the second part 942-12 is greater than 1000μm, the elasticity of the second lead pattern part 942-1 may decrease, which may cause the image sensor module 400 to shift.

[0176] Simultaneously, the second portion 942-12 may include a buffer pattern portion for buffering in region A connected to the first portion 942-11. The buffer pattern portion may have a shape in which the width gradually decreases in the direction from the first portion 942-11 to the second portion 942-12. In this case, the width reduction is not linear but has a non-linear characteristic, and therefore, the outer surface of the buffer pattern portion may have a circular or curved shape.

[0177] The buffer pattern section can solve problems such as pattern breakage caused by the pattern width difference between the first part 942-11 and the second part 942-12, and stably connects the first part 942-11 and the third part 942-13.

[0178] Furthermore, the buffer pattern portion may not overlap with the insulating layer in the vertical direction. Therefore, when the substrate moves not only in the X, Y, and Z axes but also tilts, the point where the connecting portion and the pattern portion are connected does not exist on the insulating layer but is formed outside the insulating layer, and thus pattern breakage caused by the difference in width between the connecting portion and the pattern portion can be effectively reduced.

[0179] Furthermore, the line width of the fourth part 942-14 may also be smaller than the line width of the first part 942-11, and therefore, a buffer pattern portion with a circular or curved outer surface may be provided in region B between the fourth part 942-14 and the first part 942-11.

[0180] Meanwhile, the second portion 942-12 can be bent at least once as described above. Therefore, the second portion 942-12 includes a second-first portion 942-12a extending in one direction and a second-second portion 942-12b bent in a direction different from the second-first portion 942-12a.

[0181] In this case, the side surface of the second portion 942-12b can have a circular or curved shape instead of a straight line. That is, when the side surface of the second portion 942-12b has a straight shape, stress may concentrate on that portion, and therefore, breakage of the second lead pattern portion 942-1 may occur. Therefore, the side surface of the second portion 942-12b has a circular or curved shape to prevent stress concentration in the second portion 942-12b. The curvature R value of the side surface of the second portion 942-12b can have a value between 30 and 100. For example, the curvature R value of the side surface of the second portion 942-12b can have a value between 40 and 90. For example, the curvature R value of the side surface of the second portion 942-12b can have a value between 50 and 80.

[0182] When the curvature-R value of the side surface is less than 30, the stress concentration prevention effect is insufficient, and when it is greater than 100, the elasticity of the second lead pattern portion 942-1 may decrease. In this case, the second portion 942-12b may include an inner surface and an outer surface along the bending direction. Furthermore, the curvature-R value of the inner surface of the second portion 942-12b may differ from that of the outer surface of the second portion 942-12b to maximize the stress relaxation effect.

[0183] Furthermore, the linewidth of the second-second portion 942-12b may differ from that of the second-first portion 942-12a. For example, the second-second portion 942-12b may have a larger linewidth than the second-first portion 942-12a. That is, stress may be concentrated in the second-second portion 942-12b, and therefore, the second-second portion 942-12b may be formed to have a larger linewidth than the second-first portion 942-12a.

[0184] Meanwhile, the third substrate 930 can be positioned on the fourth portion 942-14. In addition, the fourth portion 942-14 and the third substrate 930 can be coupled to each other by soldering.

[0185] Meanwhile, in the above description, the second portion 942-12 of the second lead pattern portion 942-1 has a rectangular shape with rounded corners, but is not limited thereto. For example, the second portion 942-12 of the second lead pattern portion 942-1 can be circular or polygonal and can be bent.

[0186] Meanwhile, in the embodiment, the second-first lead pattern portion 942-1a and the second-third lead pattern portion 942-1c of the second lead pattern portion 942-1 can be spaced apart from each other on the insulating layer 941 in the longitudinal direction. Furthermore, the second-second lead pattern portion 942-1b and the second-fourth lead pattern portion 942-1d of the second lead pattern portion 942-1 can be disposed within the width of the insulating layer 941.

[0187] At this time, each lead pattern of the second-first lead pattern section 942-1a and each lead pattern of the second-third lead pattern section 942-1c can be set to be spaced apart by a distance P1 in the longitudinal direction. For example, each lead pattern of the second-first lead pattern section 942-1a and each lead pattern of the second-third lead pattern section 942-1c can be spaced apart by a distance of 0.1 mm to 7 mm in the longitudinal direction. For example, each lead pattern of the second-first lead pattern section 942-1a and each lead pattern of the second-third lead pattern section 942-1c can be spaced apart by a distance of 0.5 mm to 5 mm in the longitudinal direction. For example, each lead pattern of the second-first lead pattern section 942-1a and each lead pattern of the second-third lead pattern section 942-1c can be spaced apart by a distance of 0.6 mm to 3 mm in the longitudinal direction. For example, each lead pattern of the second-first lead pattern section 942-1a and each lead pattern of the second-third lead pattern section 942-1c can be spaced apart in the longitudinal direction at intervals of 0.7 mm to 2 mm.

[0188] In this case, the first interval P1 can refer to the distance between the holes in the third portion 942-3 included in the adjacent lead patterns. In this case, when the first interval P1 is less than 0.1 mm, a short circuit problem may occur when the image sensor module 400 is displaced as the adjacent lead patterns come into contact with each other. Furthermore, when the first interval P1 is greater than 7 mm, the size of the fourth substrate 940 will increase.

[0189] At this time, each lead pattern of the second-second lead pattern section 942-1b and each lead pattern of the second-fourth lead pattern section 942-1d can be configured to be spaced apart by a second interval P2 in the width direction. For example, each lead pattern of the second-second lead pattern section 942-1b and each lead pattern of the second-fourth lead pattern section 942-1d can be spaced apart by an interval of 0.1 mm to 7 mm in the width direction. For example, each lead pattern of the second-second lead pattern section 942-1b and each lead pattern of the second-fourth lead pattern section 942-1d can be spaced apart by an interval of 0.5 mm to 5 mm in the width direction. For example, each lead pattern of the second-second lead pattern section 942-1b and each lead pattern of the second-fourth lead pattern section 942-1d can be spaced apart by an interval of 0.6 mm to 3 mm in the width direction. For example, each lead pattern of the second-second lead pattern portion 942-1b and each lead pattern of the second-fourth lead pattern portion 942-1d can be spaced apart in the width direction at intervals of 0.7 mm to 2 mm. In this case, the second interval P2 can refer to the distance between the holes of the third portion 942-3 included in adjacent lead patterns.

[0190] The metal layer of the patterned portion 942 according to an embodiment will be described below.

[0191] The pattern portion 942, including the second lead pattern portion 942-1 and the reinforcing pattern 942-2, can be formed by etching the same metal layer.

[0192] In this case, the reinforcing pattern 942-2 is used only for the mechanical function of ensuring rigidity, and therefore there are no significant restrictions on the materials used to form the reinforcing pattern 942-2.

[0193] However, the second lead pattern portion 942-1 should serve as wiring for transmitting electrical signals and as a spring for imparting elasticity.

[0194] Therefore, the patterned portion 942 in the embodiment can be formed of a metal layer with a specific level or higher of hardness and tensile strength in order to perform both wiring and spring functions.

[0195] In this case, patterns with only general wiring functions can be formed from a metal layer of electrolytic material. However, although the metal layer of electrolytic material described above can perform wiring functions, it cannot perform spring functions due to its low tensile strength and hardness.

[0196] Therefore, the patterned portion 942 in the embodiment can be formed using a metal layer of rolled material. Specifically, the patterned portion 942 can be formed from a binary or ternary composite alloy containing copper as the main component and at least one of Ni, Co, Mn, and Al.

[0197] The metal layer can have a predetermined level or higher of tensile strength and 0.2% offset yield strength (0.2% offset yield strength).

[0198] For example, the metal layer can have 500 N / mm 2 Or even greater tensile strength. The metal layer can have 800 N / mm². 2 Or even greater tensile strength. For example, the metal layer can have 1000 N / mm². 2 Or even greater tensile strength. For example, the metal layer can have 1400 N / mm². 2 Or even greater tensile strength. For example, the metal layer can have 500 N / mm². 2 Or a greater 0.2% offset yield strength. For example, the metal layer could have 800 N / mm². 2 Or a greater 0.2% offset yield strength. Furthermore, for example, the metal layer can have a yield strength of 1000 N / mm². 2 Or a greater 0.2% offset yield strength. For example, the metal layer can have 1400 N / mm². 2 Or 0.2% greater offset yield strength.

[0199] In this case, the tensile strength of the metal layer of a typical electrolytic material can reach 100 N / mm². 2 Up to 400 N / mm 2 Within this range, the metal layer of the electrolytic material cannot meet the characteristics required for the second lead pattern section 942-1. Specifically, the metal layer of the electrolytic material can meet the characteristics required for wiring functions, but may not meet the characteristics required for spring functions.

[0200] Here, the metal layer of the generally rolled material has a centerline average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, when the metal layer has a roughness in the above range, the adhesion between the patterned portion 942 and the insulating layer 941 is reduced due to the low surface roughness, and therefore, there is a problem of the patterned portion separating from the insulating layer.

[0201] refer to Figure 14 When the metal layer of the second lead pattern portion 942-1 has a centerline average roughness Ra in the range of 0.025μm to 0.035μm and / or a 10-point average roughness in the range of 0.3μm to 0.5μm, the second lead pattern portion 942-1 in region C may separate from the insulating layer 941.

[0202] Therefore, the embodiment improves the adhesion between the patterned portion 942 and the insulating layer 941 by performing a surface treatment on the surface of the metal layer that makes up the patterned portion 942.

[0203] That is, the surface treatment in the embodiment is performed on the surface of the metal layer, so that the surface of the metal layer has a certain level or higher surface roughness.

[0204] In this configuration, the surface of the metal layer may include a lower surface in contact with the insulating layer 941 and an upper surface opposite to the lower surface. Here, the surface treatment in this embodiment may involve performing the same surface treatment on both the upper and lower surfaces of the metal layer, or it may involve performing different surface treatments on both surfaces. Therefore, when the same surface treatment is performed on both the upper and lower surfaces of the metal layer, the upper and lower surfaces of the metal layer may have corresponding surface roughnesses. Furthermore, when different surface treatments are performed on the upper and lower surfaces of the metal layer, the upper and lower surfaces of the metal layer may have different surface roughnesses.

[0205] Here, the surface roughness of the lower surface of the metal layer affects the adhesion of the insulating layer 941. Furthermore, the surface roughness of the upper surface of the metal layer may affect the adhesion of the photoresist (PR) formed on the upper surface of the metal layer during the process of forming the patterned portion 942 using the metal layer. Additionally, the surface roughness of the upper surface of the metal layer may affect the etch factor in the etching process for forming the patterned portion 942. That is, the etch factor may increase with increasing adhesion between the metal layer and the photoresist. Furthermore, the numerical deviation between the width of the upper surface and the width of the lower surface of the patterned portion 942 may decrease with increasing etch factor.

[0206] Therefore, the surface treatment in the embodiment is performed on the upper and lower surfaces of the metal layer to increase the adhesion between the patterned portion 942 and the insulating layer 941, and in addition, a high etching factor is achieved by increasing the adhesion to the photoresist during the etching process.

[0207] In this case, the surface treatment in the embodiment can be performed by plating the surface of the metal layer with a separate metal material to form a coating.

[0208] Alternatively, the surface treatment described in the embodiments can be formed by performing chemical polishing, physical polishing, soft etching, or chemical coating on the surface of the metal layer.

[0209] refer to Figure 15 As can be seen, the surface of a typical rolled material has a relatively low surface roughness, as in (a). Alternatively, the surface treatment described in the embodiments can be performed on the metal layer of the rolled material. Furthermore, as shown in (b), the surface of the metal layer that has undergone the surface treatment as described in the embodiments can have a surface roughness that is clearly distinguishable from that of the rolled material in (a).

[0210] For example, the upper and lower surfaces of the metal layer in the embodiments may have the same surface roughness or different surface roughness. For example, the upper and lower surfaces of the metal layer in the embodiments may both have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm. For example, the upper and lower surfaces of the metal layer in the embodiments may both have a centerline average roughness (Ra) in the range of 0.05 μm to 0.2 μm. For example, the upper and lower surfaces of the metal layer in the embodiments may both have a centerline average roughness (Ra) in the range of 0.08 μm to 0.15 μm. For example, the upper and lower surfaces of the metal layer in the embodiments may both have a 10-point average roughness (Rz) in the range of 0.6 μm to 5 μm. For example, the upper and lower surfaces of the metal layer in the embodiments may both have a 10-point average roughness (Rz) in the range of 0.7 μm to 3.0 μm. For example, the upper and lower surfaces of the metal layer in the embodiments may have a 10-point average roughness (Rz) in the range of 1.0 μm to 2.5 μm.

[0211] That is, compared with the metal layer before surface treatment, the surface-treated metal layer in the embodiments can have a surface roughness that is 10 times or greater. For example, compared with the metal layer before surface treatment, the surface-treated metal layer in the embodiments can have a surface roughness that is 20 times or greater.

[0212] The surface-treated metal layer according to the embodiments will be described in detail below.

[0213] like Figure 16a As shown, the surface treatment of the metal layer in the first embodiment can be performed by depositing a coating on the surface.

[0214] Therefore, the metal layer of the patterned portion 942 in the embodiment includes a metal layer 942a of rolled material, a first plating layer 942b formed on the lower surface of the metal layer 942a, and a second plating layer 942c formed on the upper surface of the metal layer 942a.

[0215] The first plating layer 942b and the second plating layer 942c can be formed by plating the upper and lower surfaces of the rolled metal layer 942a, which is the raw material, with metal materials respectively. In this case, the first plating layer 942b and the second plating layer 942c can be formed from the same metal material as the metal material constituting the metal layer 942a.

[0216] For example, each of the first coating 942b and the second coating 942c can be formed from a binary or ternary composite alloy containing copper as a main component and at least one of Ni, Co, Mn and Al.

[0217] In this case, a first plating layer 942b can be formed on the lower surface of the metal layer 942a to have a first thickness T1. For example, the first thickness T1 can be in the range of 0.1 μm to 10 μm. For example, the first thickness T1 can be in the range of 0.2 μm to 8 μm. For example, the first thickness T1 can be in the range of 0.3 μm to 5 μm. When the first thickness T1 is less than 0.1 μm, a surface shape with a specific level or higher surface roughness can be achieved on the lower surface of the metal layer 942a. That is, when the first thickness T1 is less than 0.1 μm, the surface roughness required in the embodiment may not be met. Furthermore, when the first thickness T1 is greater than 10 μm, the overall volume of the patterned portion 942 may increase due to the increase in thickness. Furthermore, when the first thickness T1 is greater than 10 μm, the plating cost for forming the first plating layer 942b may increase, and therefore the product cost may increase.

[0218] In this case, a second plating layer 942c can be formed on the upper surface of the metal layer 942a to have a second thickness T2. The second thickness T2 can range from 0.1 μm to 10 μm. Alternatively, it can range from 0.2 μm to 8 μm. Or, it can range from 0.3 μm to 5 μm. When the second thickness T2 is less than 0.1 μm, a surface shape with a predetermined level or higher surface roughness can be achieved on the upper surface of the metal layer 942a. That is, when the second thickness T2 is less than 0.1 μm, the surface roughness required by the embodiment may not be met. Furthermore, when the second thickness T2 is greater than 10 μm, the overall volume of the patterned portion 942 may increase due to the increased thickness. Additionally, when the second thickness T2 is greater than 10 μm, the plating cost for forming the second plating layer 942c may increase, and therefore the product cost may increase.

[0219] Meanwhile, in the first embodiment described above, a specific level or higher surface roughness is imparted to the surface of the metal layer 942a by means of plating. Therefore, the surface roughness of the metal layer 942a in the first embodiment may substantially refer to the surface roughness of the lower surface of the first plating layer 942b and the surface roughness of the upper surface of the second plating layer 942c.

[0220] In this case, when surface roughness is imparted by plating, manufacturing costs may increase as the plating process progresses. Therefore, in the second embodiment, plating may be performed only on one of the upper and lower surfaces of the metal layer 942a, and the other surface may undergo surface treatment by polishing or etching.

[0221] like Figure 16b As shown, a first plating layer 942b can be formed on the lower surface of the metal layer 942a. Since the first plating layer 942b has already been described above, its detailed description will be omitted.

[0222] Simultaneously, the upper surface 942T1 of the metal layer 942a can be surface-treated by polishing or etching. Specifically, chemical polishing or physical polishing is performed on the upper surface 942T1 of the metal layer 942a to impart a specific level or higher surface roughness. In this case, when performing surface treatment by chemical polishing, acidic chemicals capable of corroding raw materials such as ferric chloride or sulfuric acid can be used. Furthermore, when performing surface treatment by physical polishing, brushes, sandpaper, grinding stones, etc., can be used to impart surface roughness to the upper surface 942T1 of the metal layer 942a.

[0223] In this case, a polishing process can be performed on the upper surface of the metal layer 942a at a second depth T2. The second depth T2 can have a value that substantially corresponds to the second thickness. That is, the second depth T2 can have a range of 0.1 μm to 10 μm.

[0224] Furthermore, although it has been described above that the first plating layer 942b is formed on the lower surface of the metal layer 942a and polishing is performed on the upper surface of the metal layer 942a, the embodiments are not limited thereto. For example, surface treatment can be performed by forming a second plating layer 942c on the upper surface of the metal layer 942a and polishing the lower surface of the metal layer 942a.

[0225] Meanwhile, the upper and lower surfaces of the metal layer 942a in the third embodiment can be polished to provide a specific level or higher surface roughness.

[0226] refer to Figure 16cThe upper surface 942T1 of the metal layer 942a can undergo a surface treatment using polishing as described in the second exemplary embodiment to provide at least a certain level of surface roughness. Alternatively, a certain level or higher surface roughness can be imparted to the lower surface 942B1 of the metal layer 942a by performing a surface treatment using polishing, instead of forming a plating layer. (As already referenced...) Figure 16b The polishing method has been described, so its detailed description will be omitted.

[0227] On the other hand, the surface roughness of the lower surface of the metal layer 942a is more important than the surface roughness of the upper surface of the metal layer 942a. That is, the lower surface of the metal layer 942a is the surface in contact with the insulating layer 941, and therefore the surface roughness greatly affects the operational reliability of the camera module.

[0228] Therefore, by forming the first plating layer 942b, the lower surface of the metal layer 942a in the embodiment is provided with a specific level or higher surface roughness, and by using polishing, the upper surface 942T1 of the metal layer 942a can be provided with surface roughness.

[0229] In summary, the surface treatment of the lower surface of the metal layer 942a in the embodiments can be performed by forming a first plating layer 942b on the lower surface of the metal layer 942a. Furthermore, the surface treatment of the lower surface in another embodiment can be performed by applying at least one of chemical polishing and physical polishing to the lower surface of the metal layer 942a.

[0230] Therefore, through the surface treatment described above, the lower surface of metal layer 942a (and, during plating, the lower surface of first plating layer 942b) can have a centerline average roughness Ra in the range of 0.05 μm to 0.5 μm. For example, the lower surface of metal layer 942a can have a centerline average roughness Ra in the range of 0.05 μm to 0.2 μm. For example, the lower surface of metal layer 942a can have a centerline average roughness Ra in the range of 0.08 μm to 0.15 μm. For example, the lower surface of metal layer 942a can have a 10-point average roughness Rz in the range of 0.6 μm to 5 μm. For example, the lower surface of metal layer 942a can have a 10-point average roughness Rz in the range of 0.7 μm to 3.0 μm. For example, the lower surface of metal layer 942a can have a 10-point average roughness Rz in the range of 1.0 μm to 2.5 μm. Therefore, the lower surface of the metal layer 942a in the embodiment can be provided with a specific level or higher surface roughness by surface treatment of the lower surface of the metal layer 942a, and thus, the adhesion to the insulating layer 941 can be improved. Furthermore, the reliability problem of the patterned portion 942 peeling off from the insulating layer 941 can be solved by improving the adhesion between the insulating layer 941 and the patterned portion 942.

[0231] Furthermore, in this embodiment, the upper surface of the metal layer 942a is surface-treated to have a specific level or higher surface roughness. The upper surface of the metal layer 942a may be the surface that comes into contact with the photoresist (PR) during the formation of the patterned portion 942. In this case, the surface treatment can be performed by forming a second plating layer 942c on the surface of the metal layer 942a in the same manner as the lower surface. Alternatively, the surface treatment of the upper surface in another embodiment can be performed by soft etching or chemical coating of the surface of the metal layer 942a. Therefore, through the surface treatment described above, the upper surface of the metal layer 942a (the upper surface of the second plating layer 942c when plating is performed) can have a centerline average roughness Ra in the range of 0.05 μm to 0.5 μm. For example, the upper surface of the metal layer 942a can have a centerline average roughness Ra in the range of 0.05 μm to 0.2 μm. For example, the upper surface of the metal layer 942a can have a centerline average roughness Ra in the range of 0.08 μm to 0.15 μm. For example, the upper surface of metal layer 942a can have a 10-point average roughness Rz ranging from 0.6 μm to 5 μm. Alternatively, the upper surface of metal layer 942a can have a 10-point average roughness Rz ranging from 0.7 μm to 3.0 μm. Or, the upper surface of metal layer 942a can have a 10-point average roughness Rz ranging from 1.0 μm to 2.5 μm. Therefore, by performing surface treatment on the upper surface of metal layer 942a, the upper surface of metal layer 942a in this embodiment can have a specific level or higher surface roughness, and thus, adhesion to PR can be improved. Furthermore, a high etch factor can be achieved, and therefore reliability can be improved by improving the adhesion between metal layer 942a and PR.

[0232] That is, reference Figure 17 (a) When photoresist is formed on a metal layer of untreated rolled material as in the embodiment and etching is performed using the formed photoresist, the high etch factor of this embodiment cannot be achieved. This means that the untreated metal layer has a lower surface roughness compared to this embodiment, and this is because the adhesion to the photoresist is reduced. Therefore, when no surface treatment is performed, the difference between the width T1 of the upper surface of the patterned portion and the width B1 of the lower surface of the patterned portion is twice or more. For example, if no surface treatment is performed, the width (T1) of the patterned portion is approximately 24.41 μm, and the width (B1) of the lower surface is approximately 56.30 μm.

[0233] Alternative locations, for reference Figure 17(b) When the surface treatment is performed as in the embodiment, the adhesion between the metal layer 942a and the photoresist can be improved, and thus the high etch factor can be improved. Compared with the comparative example, the patterned portion 942 in the embodiment can reduce the width deviation between the upper and lower surfaces. Preferably, the width T2 of the upper surface of the patterned portion 942 in the embodiment can be in the range of 50% to 100% of the width B2 of the lower surface. Preferably, the width T2 of the upper surface of the patterned portion 942 in the embodiment can be in the range of 80% to 100% of the width B2 of the lower surface. Preferably, the width T2 of the upper surface of the patterned portion 942 in the embodiment can be in the range of 90% to 99% of the width B2 of the lower surface.

[0234] In other words, the ratio of the width T2 of the upper surface to the width B2 of the lower surface of the pattern portion 942 in the embodiment can be in the range of 1:2 to 1:1. Therefore, the embodiment can improve the dimensional deviation of the widths of the upper and lower surfaces of the pattern portion, and thus improve the noise characteristics of the signal transmitted through the pattern portion.

[0235] <Image Sensor Module>

[0236] Figure 18 This is an exploded perspective view of the image sensor module 400 according to an embodiment, and Figure 19 This is a view illustrating the combination of the third substrate and the image sensor module 400.

[0237] refer to Figure 18 and Figure 19 The image sensor module 400 may include a sensor holder 460, a filter 450, an adhesive member 440, a sensor base 410, an image sensor 430, and an image sensor substrate 420.

[0238] Such an image sensor module 400 can be coupled to the second substrate 910 and the substrate holder 920 via a sensor holder 460. For example, the image sensor module 400 can be fixed to the substrate holder 920 via the sensor holder 460. The image sensor module 400 may include a sensor holder 460, a filter 450, an adhesive member 440, a sensor base 410, an image sensor 430, and an image sensor substrate 420, but at least one of these components may be omitted.

[0239] The image sensor module 400 may include a sensor holder 460. The sensor holder 460 allows the image sensor module 400 to be stably fixed to the substrate holder 920. In this case, the sensor holder 460 may include an opening 461, and the opening 461 may be aligned with the filter 450 and the image sensor 430 in the optical axis direction.

[0240] The image sensor module 400 includes a sensor base 410.

[0241] The sensor base 410 may include an opening 411 and may provide a stepped protrusion to allow the filter 450 to be positioned adjacent to the opening 411. Furthermore, an adhesive member 440 may be disposed on the stepped protrusion, and the filter 450 may be fixedly disposed on the adhesive member 440. Such a filter 450 can be used to block light of a specific frequency band passing through the lens module 100 from incident onto the image sensor 430. The filter 450 may be configured parallel to the xy plane. The filter 450 may be disposed between the lens module 100 and the image sensor 430. The filter 450 may include an infrared filter. The infrared filter may absorb or reflect infrared light incident on it.

[0242] Image sensor substrate 420 can be a package substrate. That is, image sensor 430 can be mounted on image sensor substrate 420 in a package form. Image sensor substrate 420 can include a printed circuit board (PCB). Image sensor substrate 420 can include a circuit board. Image sensor 430 can be disposed on image sensor substrate 420. Image sensor substrate 420 can be coupled to third substrate 930. For this purpose, a sixth pad portion 421 electrically connected to the fifth pad portion 935 of third substrate 930 can be provided on the lower surface of image sensor substrate 420. In this case, as described above, the sixth pad portion 421 is also disposed at the opposite edge regions on the lower surface of image sensor substrate 420, and therefore, the position of the pad to which the image signal is sent can be separated from the other pads. At the same time, image sensor substrate 420 can be positioned in an opening of third substrate 930, and the sixth pad portion 421 in the opening of third substrate 930 can be aligned horizontally with the fifth pad portion 935 of third substrate 930. The fifth pad portion 935 and the sixth pad portion 421 can be coupled to each other via soldering or the like.

[0243] Image sensor 430 may be configured such that light passing through lens module 100 and filter 450 is incident to form an image. Image sensor 430 may be mounted on image sensor substrate 420. Image sensor 430 may be electrically connected to image sensor substrate 420. For example, image sensor 430 may be coupled to image sensor substrate 420 via surface mount technology (SMT). As another example, image sensor 430 may be coupled to image sensor substrate 420 via flip chip technology. Image sensor 430 may be configured to coincide with lens module 100 in the optical axis. That is, the optical axis of image sensor 430 and the optical axis of lens module 100 may be aligned. Image sensor 430 may convert light incident on the effective image area of ​​image sensor 430 into an electrical signal. Alternatively, the converted electrical signal may be an image signal. Image sensor 430 may be any of charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0244] <Image Sensor Module Shift Drive Operation>

[0245] The shifting operation of the image sensor module 400 will be described below.

[0246] Figure 20 This is a view used to explain the x-axis direction shift drive through some configurations of the camera device according to this embodiment. Figure 21 This is a view used to explain the y-axis direction shift drive through some configurations of the camera device according to this embodiment. Figure 22 This is a view used to explain the z-axis rotation drive through some configurations of the camera device according to this embodiment. Figure 23 (a) is a view illustrating a magnet and a magnet holder disposed on a first substrate along the x-axis and y-axis. Figure 23 (b) is a view illustrating the first substrate, magnet holder, magnet, and coil under rotational drive conditions in the z-axis direction, and Figure 24 This is a view of the magnetic flux and Lorentz force between the magnet and the coil of the camera device according to this embodiment.

[0247] like Figure 20As shown, when currents in the same direction are applied to the first coil 916-1 and the third coil 916-3 in this embodiment, the image sensor 430 of the image sensor module 400 can be moved (displaced) in the x-axis direction through the electromagnetic interaction between the first magnet 731 and the third magnet 733, respectively. That is, the first coil 916-1, the first magnet 731, and the third coil 916-3 and the third magnet 733 can be used for x-axis displacement driving of the image sensor 430. In this case, the first coil 916-1 and the first magnet 731 can be the first x-axis displacement driver X1, and the third coil 916-3 and the third magnet 733 can be the second x-axis displacement driver X2.

[0248] like Figure 21 As shown, when current in the same direction is applied to the second coil 916-2 and the fourth coil 916-4 in this embodiment, they can be moved (displaced) in the y-axis and coupled to the image sensor 430 of the image sensor module 400 through the electromagnetic interaction between the second magnet 732 and the fourth magnet 734, respectively. That is, the second coil 916-2, the second magnet 732, the fourth coil 916-4, and the fourth magnet 734 can be used for y-axis displacement driving of the image sensor 430. In this case, the second coil 916-2 and the second magnet 732 can be the first y-axis displacement driver Y1, and the fourth coil 916-4 and the fourth magnet 734 can be the second y-axis displacement driver Y2.

[0249] like Figure 22 As shown, in this embodiment, currents in opposite directions are applied to the first coil 916-1 and the third coil 916-3, and currents in opposite directions are applied to the second coil 916-2 and the fourth coil 916-4. At this time, when the coil portion 916 rotates in the same direction by the currents applied to the first coil 916-1 and the second coil 916-2, the image sensor 430 coupled to the image sensor module 400 can rotate (roll) around the z-axis. Figure 22 The embodiment shown illustrates a configuration where coil portion 916 is controlled by four channels. When coil portion 916 is controlled by three channels, the image sensor 430 can be rotated by either the first coil 916-1 and the third coil 916-3, or the second coil 916-2 and the fourth coil 916-4. This is because when there are coils bundled together in one channel among the first coil 916-1 and the third coil 916-3, and the second coil 916-2 and the fourth coil 916-4, current cannot be applied in opposite directions.

[0250] like Figure 23As shown in (b), in this embodiment, a positive current is applied to the first coil 916-1, thereby pushing the first coil 916-1 relative to the first magnet 731 in a first direction (see [link]). Figure 23 (a) A positive current is applied to the second coil 916-2, thereby pushing the second coil 916-2 relative to the second magnet 732 in the second direction (see [a]). Figure 23 (b) A reverse current is applied to the third coil 916-3, thereby pushing the third coil 916-3 relative to the third magnet 733 in a third direction (see [link]). Figure 23 (c)) and a reverse current is applied to the fourth coil 916-4, thereby pushing the fourth coil 916-4 relative to the fourth magnet 734 in the fourth direction (see Figure 23 (d) allows the image sensor 430, coupled to the image sensor module 400, to be rotated about the z-axis (see [reference]). Figure 23 (e)). In this case, the first to fourth directions may correspond to a clockwise direction around the center of the substrate holder 410.

[0251] In this embodiment, the magnetic flux of the magnet portion 730 is... Figure 24 It is shown in the image. (Reference) Figure 24 It can be confirmed that there are magnetic lines of force perpendicular to the coil portion 916, and when a current is applied to the coil portion 916 in this state, the coil portion 916 can move relative to the magnet portion 730 by the Lorentz force.

[0252] <Optical Devices>

[0253] Figure 25 This is a perspective view of the optical device according to this embodiment, and Figure 26 yes Figure 25 Block diagram of the optical device shown.

[0254] The optical device can be any of the following: mobile phone and portable phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, personal digital assistant (PDA), portable multimedia player (PMP), and navigation device. However, the type of optical device is not limited to these, and any device used to capture images or pictures can be included in the optical device.

[0255] The optical device may include a body 1250. The body 1250 may be in the form of a strip. Alternatively, the body 1250 may have various structures, such as sliding, folding, swinging, rotating, etc., wherein two or more sub-bodies are coupled to be relatively movable. The body 1250 may include a housing (sleeve, shell, and cover) forming the appearance. For example, the body 1250 may include a front housing 1251 and a rear housing 1252. Various electronic components of the optical device may be housed in the space formed between the front housing 1251 and the rear housing 1252. A display 2151 may be disposed on one surface of the body 1250. A camera 1121 may be disposed on any one or more surfaces of one surface of the body 1250, and another surface may be disposed on an opposite side of one surface.

[0256] The optical device may include a wireless communication unit 1110. The wireless communication unit 1110 may include one or more modules that enable wireless communication between the optical device and a wireless communication system or between the optical device and a network in which the optical device is located. For example, the wireless communication unit 1110 may include any one or more of a broadcast receiving module 1111, a mobile communication module 1112, a wireless internet module 1113, a short-range communication module 1114, and a location information module 1115.

[0257] The optical device may include an A / V input unit 1120. The A / V input unit 1120 is used to input audio signals or video signals and may include any one or more of a camera 1121 and a microphone 1122. In this case, the camera 1121 may include a camera device according to the first embodiment described above.

[0258] The optical device may include a sensing unit 1140. The sensing unit 1140 can sense the current state of the optical device, such as its on / off state, position, presence of user contact, orientation, acceleration / deceleration, etc., to generate sensing signals for controlling the operation of the optical device. For example, when the optical device is a slider phone, it can sense whether the slider is on or off. Furthermore, it can be responsible for sensing functions related to whether the power supply unit 1190 is supplying power or whether the interface unit 1170 is coupled to an external device.

[0259] The optical device may include an input / output unit 1150. The input / output unit 1150 may be configured to generate inputs or outputs related to vision, hearing, or touch. The input / output unit 1150 may generate input data for controlling the operation of the optical device and may output information processed by the optical device.

[0260] The input / output unit 1150 may include at least one of a keyboard unit 1130, a display 1151, a sound output module 1152, and a touch screen panel 1153. The keyboard unit 1130 can generate input data using keyboard input. The display 1151 can output images captured by the camera 1121. The display 1151 may include multiple pixels whose colors change according to electrical signals. For example, the display 1151 may include at least one of a liquid crystal display (LCD), a thin-film transistor liquid crystal display (TFT LCD), an organic light-emitting diode (OLED), a flexible display, and a three-dimensional (3D) display. The sound output module 1152 can output audio data received from the wireless communication unit 1110 in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or output audio data stored in the memory unit 1160. The touch screen panel 1153 can convert capacitance changes caused by a user's touch on a specific area of ​​the touch screen into electrical input signals.

[0261] The optical device may include a storage unit 1160. Storage unit 1160 may store programs for processing and controlling controller 1180. Furthermore, storage unit 1160 may store input / output data, such as any one or more of phone books, messages, audio, still images, photographs, and videos. Storage unit 1160 may store images captured by camera 1121, such as pictures or videos.

[0262] The optical device may include an interface unit 1170. The interface unit 1170 serves as a path for connecting to external devices connected to the optical device. The interface unit 1170 can receive data from external devices, receive power to transmit to various components within the optical device, or transmit data from within the optical device to external devices. The interface unit 1170 may include any one or more of the following: a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, and a headphone port.

[0263] The optical device may include a controller 1180. The controller 1180 can control the overall operation of the optical device. The controller 1180 can perform related control and processing for voice calls, data communications, video calls, etc. The controller 1180 may include a multimedia module 1181 for playing multimedia. The multimedia module 1181 may be provided in the controller 1180 or may be provided separately from the controller 1180. The controller 1180 can perform pattern recognition processing to recognize handwritten or drawing input performed on the touchscreen as text and images, respectively.

[0264] The optical device may include a power supply unit 1190. The power supply unit 1190 may receive external or internal power supply under the control of the controller 1180 to supply the power necessary to operate each component.

[0265] According to the embodiment, the image sensor moves relative to the lens barrel in the X, Y, and Z axes, instead of moving a conventional lens barrel, to facilitate the OIS and AF functions of the camera module. Therefore, the camera module according to the embodiment can eliminate the complex spring structure used to implement OIS and AF functions, thereby simplifying the structure. Furthermore, compared to the prior art, by moving the image sensor relative to the lens barrel according to the embodiment, a stable structure can be formed.

[0266] Furthermore, the circuit board for the image sensor, electrically connected to the image sensor according to an embodiment, includes a patterned portion having a spring structure and floating in a position that does not overlap with the insulating layer in the vertical direction. In this case, the patterned portion has a strength and tensile strength above a certain level. That is, the patterned portion of the embodiment should be elastic to realize OIS and AF functions as well as electrical signal transmission functions. Therefore, the patterned portion in the embodiment can be formed from a rolled material to have a strength and tensile strength above a certain level. Accordingly, the patterned portion according to the embodiment can solve reliability problems such as pattern breakage that occurs during OIS or AF functions. In detail, the circuit board for the image sensor according to the embodiment can stably move the image sensor relative to the lens barrel while stably and elastically supporting the image sensor, thereby improving the operational reliability for OIS and AF.

[0267] Furthermore, the metal layer in the embodiment is a rolled material and therefore has a centerline average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a 10-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, when the metal layer has a roughness within the aforementioned range, the adhesion between the patterned portion and the insulating layer is reduced due to the small surface roughness, and thus the patterned portion detaches from the insulating layer.

[0268] Therefore, the surface of the metal layer in the embodiments is surface-treated to have a specific level or higher surface roughness. The surface of the metal layer can be the lower surface that contacts or faces the insulating layer. In this case, the surface treatment of the lower surface in the embodiments can be performed by forming a plating layer on the lower surface of the metal layer. Furthermore, the surface treatment in another embodiment can be performed by applying at least one of chemical polishing and physical polishing to the lower surface of the metal layer. Additionally, the lower surface of the metal layer can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm and / or a 10-point average roughness in the range of 1.0 μm to 5.0 μm through the surface treatment described above. Therefore, in the embodiments, by surface-treating the lower surface of the metal layer, a specific level or higher surface roughness can be imparted to the lower surface of the metal layer, thereby improving adhesion to the insulating layer. Furthermore, the embodiments can solve the reliability problem of the patterned portion detaching from the insulating layer by improving the adhesion between the insulating layer and the patterned portion.

[0269] Furthermore, the upper surface of the metal layer in the embodiments is surface-treated to have a specific level or higher surface roughness. The upper surface of the metal layer may be the surface that comes into contact with the photoresist (PR) during the formation of the patterned portion. In this case, the surface treatment can be performed by forming a plating layer on the upper surface of the metal layer in the same manner as the lower surface. Alternatively, the surface treatment in another embodiment can be performed by performing soft etching or chemical coating on the upper surface of the metal layer. Thus, the upper surface of the metal layer can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm and / or a 10-point average roughness in the range of 1.0 μm to 5.0 μm through the surface treatment described above. Therefore, in the embodiments, by surface-treating the upper surface of the metal layer, a specific level or higher surface roughness can be imparted to the upper surface of the metal layer, and thereby the adhesion to the PR can be improved. In addition, the embodiments can achieve a high etch factor by improving the adhesion between the metal layer and the PR, thereby improving reliability. Specifically, in the embodiments, because a high etch factor can be achieved, the width of the upper surface of the patterned portion can be in the range of 50% to 100% of the width of the lower surface of the patterned portion. Furthermore, according to an embodiment, the noise characteristics of the signal transmitted through the patterned portion can be improved by modifying the dimensional deviation of the width of the upper and lower surfaces of the patterned portion.

[0270] According to the above embodiments, X-axis offset, Y-axis offset, and Z-axis-centered rotation corresponding to image sensor and camera shake can be performed, and therefore, camera shake correction of the image sensor can be performed together with camera shake correction for the corresponding lens, thereby providing a more improved image stabilization function.

[0271] Furthermore, by utilizing the internal space of the second actuator for moving the image sensor relative to the lens barrel, and by embedding the electronic components required for the camera circuitry, the overall height of the camera device according to the embodiment can be reduced.

[0272] Furthermore, the camera assembly process according to the embodiment can be simplified by integrating and fusing components of the camera circuitry and components of the second actuator.

[0273] Although embodiments of the invention have been described with reference to the accompanying drawings, those skilled in the art to which this invention pertains will understand that the invention can be practiced in other specific forms without modifying the technical spirit and essential features of the invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A circuit board, comprising: Insulating layer; as well as The lead pattern portion is disposed on the insulating layer and has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm. The lead wire pattern portion includes: The first part is disposed on the insulating layer; The second portion extends from one end of the first portion in the external direction of the insulating layer; and The third part, which is connected to the first part via the second part, includes a through-hole. Wherein, the first portion is configured to overlap the insulating layer in the vertical direction, and The second portion is disposed in the outer region of the insulating layer and does not overlap the insulating layer in the vertical direction. Wherein, the third portion of the lead pattern extends in the outer direction of the insulating layer and does not overlap the insulating layer in the vertical direction, and The second portion of the lead pattern portion is provided between the first and third portions of the lead pattern portion and includes multiple curved regions that bend in different directions.

2. The circuit board according to claim 1, wherein, The lead pattern portion has a strength of at least 1000 N / mm. 2 Tensile strength or at least 1000 N / mm 2 0.2% offset yield strength.

3. The circuit board according to claim 1, wherein, The lead pattern portion includes a lower surface in contact with the insulating layer and an upper surface opposite to the lower surface, and Wherein, the average roughness of the centerline or the average roughness of the 10 points is the surface roughness of the upper or lower surface of the lead pattern portion.

4. The circuit board according to claim 1, wherein, The lower surface of the lead pattern portion has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm, and The upper surface of the lead pattern portion has a centerline average roughness in the range of 0.05μm to 0.5μm or a 10-point average roughness in the range of 1.0μm to 5.0μm.

5. The circuit board according to claim 4, wherein, The lead pattern portion includes a metal layer, which is disposed on the insulating layer; Wherein, the upper surface of the lead pattern portion is the upper surface of the metal layer, and The lower surface of the lead pattern portion is the lower surface of the metal layer.

6. The circuit board according to claim 4, wherein, The lead wire pattern includes: A first plating layer, wherein the first plating layer is disposed on the insulating layer; and A metal layer, wherein the metal layer is disposed on the first plating layer; Wherein, the upper surface of the lead pattern portion is the upper surface of the metal layer, and The lower surface of the lead wire pattern portion is the lower surface of the first plating layer.

7. The circuit board according to claim 4, wherein, The lead wire pattern includes: A first coating is disposed on the insulating layer; A metal layer, wherein the metal layer is disposed on the first plating layer; and A second coating is disposed on the metal layer; Wherein, the upper surface of the lead pattern portion is the upper surface of the second plating layer, and The lower surface of the lead wire pattern portion is the lower surface of the first plating layer.

8. The circuit board according to claim 4, wherein, Each of the upper and lower surfaces of the lead pattern portion has a centerline average roughness in the range of 0.08 μm to 0.15 μm or a 10-point average roughness in the range of 1.0 to 2.5 μm.

9. The circuit board according to claim 1, wherein, Each of the first and second portions of the lead pattern portion has a width of the upper surface ranging from 50% to 100% of the width of the lower surface.

10. The circuit board according to claim 1, wherein, The insulating layer includes an opening that penetrates both the upper and lower surfaces of the insulating layer. The lead pattern portion further includes a fourth portion, which extends from the other end of the first portion of the lead pattern portion in the interior direction of the insulating layer and overlaps the opening of the insulating layer in the vertical direction.

11. The circuit board according to claim 1, wherein, The lead pattern portion includes a binary or ternary composite alloy in which the copper (Cu) comprises at least one of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be) and cobalt (Co).

12. The circuit board according to claim 1, further comprising: A reinforcing pattern is disposed on the insulating layer and spaced apart from the lead pattern portion. The reinforcing pattern portion includes the same metal material as the lead pattern portion.

13. The circuit board according to claim 12, wherein, The reinforced pattern portion has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

14. A sensor driving device, comprising: The fixing part includes a magnet holder, a magnet portion coupled to the magnet holder, and a first lead pattern portion disposed on the magnet holder; The moving part is spaced apart from the fixed unit at predetermined intervals and includes an image sensor; as well as Multiple lines are disposed between the moving part and the fixed part. The movable part includes a circuit board, which includes an insulating layer and a second lead pattern portion disposed on the insulating layer. Wherein, one end of the second lead pattern portion is electrically connected to the wire, and the other end of the lead pattern portion is electrically connected to the image sensor, and Wherein, at least one surface of the second lead pattern portion has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm. The second lead pattern portion includes: The first part is disposed on the insulating layer; The second portion extends from one end of the first portion in the external direction of the insulating layer; and The third part, which is connected to the first part via the second part, includes a through-hole through which the wire passes. Wherein, the first portion is configured to overlap the insulating layer in the vertical direction, and The second portion is disposed in the outer region of the insulating layer and does not overlap the insulating layer in the vertical direction. Wherein, the third portion of the second lead pattern extends in the outer direction of the insulating layer and does not overlap the insulating layer in the vertical direction, and The second portion of the second lead pattern portion is provided between the first and third portions of the second lead pattern portion and includes multiple curved regions that bend in different directions.

15. The sensor driving device according to claim 14, wherein, The insulating layer includes an opening, in which the image sensor is disposed. The second lead pattern portion further includes: The fourth part extends inward from the other end of the first part, is positioned on the opening, and is electrically connected to the image sensor.

16. The sensor driving device according to claim 14, wherein, The second lead pattern portion includes a binary or ternary composite alloy in which the copper (Cu) comprises at least one of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be) and cobalt (Co).

17. A camera module, comprising: A first camera actuator is used to drive a lens module; as well as A second camera actuator is used to drive an image sensor; Wherein, the first camera actuator moves the lens module to perform autofocus or zoom operations, and The second camera actuator moves the image sensor to perform OIS (Optical Image Stabilizer) operation. The second camera actuator includes: The fixing part includes a magnet holder, a magnet portion coupled to the magnet holder, and a first lead pattern portion disposed on the magnet holder; A movable portion, spaced apart from the fixed unit at predetermined intervals and including an image sensor; and Multiple lines are disposed between the moving part and the fixed part. The movable part includes a circuit board, which includes an insulating layer and a second lead pattern portion disposed on the insulating layer. Wherein, one end of the second lead pattern portion is electrically connected to the wire, and the other end of the lead pattern portion is electrically connected to the image sensor. Wherein, at least one surface of the second lead pattern portion has a centerline average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm. The second lead pattern portion includes: The first part is disposed on the insulating layer; The second portion extends from one end of the first portion in the external direction of the insulating layer; and The third part, which is connected to the first part via the second part, includes a through-hole through which the wire passes. Wherein, the first portion is configured to overlap the insulating layer in the vertical direction, and The second portion is disposed in the outer region of the insulating layer and does not overlap the insulating layer in the vertical direction. Wherein, the third portion of the second lead pattern extends in the outer direction of the insulating layer and does not overlap the insulating layer in the vertical direction, and The second portion of the second lead pattern portion is provided between the first and third portions of the second lead pattern portion and includes multiple curved regions that bend in different directions.

18. The camera module according to claim 17, wherein, The insulating layer includes an opening, in which the image sensor is disposed. The second lead pattern portion further includes: The fourth part extends inward from the other end of the first part, is positioned on the opening, and is electrically connected to the image sensor.

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