A miniature integrated refrigeration and disinfection unit, structure, device and usage method

Abstract

The present invention discloses a micro-integrated refrigeration and disinfection unit, structure and device and use method, the micro-integrated refrigeration and disinfection unit comprises an ion wind generator, the ion wind generator comprises a disinfection cover with openings at both ends, the upper port of the disinfection cover is equipped with a conductive bracket, the lower port of the disinfection cover is equipped with a receiving electrode sheet, the lower part of the side wall of the disinfection cover is provided with air holes, the inner side of the conductive bracket is equipped with a transmitting electrode needle, the bottom end of the receiving electrode sheet is attached to the electrical isolation layer, and the bottom of the isolation layer is attached to the hot end of the semiconductor refrigerator. The beneficial effects of the present invention are: using corona discharge to efficiently sterilize bacteria, microorganisms, etc., the high temperature generated by the hot end of the semiconductor refrigerator is transmitted to the receiving electrode sheet through the isolation layer, and the bacteria and microorganisms on the surface of the receiving electrode sheet can be thermally inactivated, and the hot air is radiated upwards, and finally the environmental temperature around the cold end is reduced through the cold end of the semiconductor refrigerator, so as to realize the integration and miniaturization of the refrigeration and disinfection device.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration and disinfection, and particularly to a micro integrated refrigeration and disinfection unit, structure, device and usage method. Background Art

[0002] For the cooling and disinfection of medical surgical instruments, the fresh-keeping and disinfection of food processing, storage and transportation, the storage of chemical drugs, the heat dissipation of precision instruments, etc., a low-temperature and sterile environment is required. Viruses and bacteria are difficult to be completely killed and their growth inhibited through the natural environment in daily life. Therefore, external measures must be taken for sterilization and disinfection and to inhibit their growth. The Chinese patent document with the publication number CN113368292A discloses a high-pressure disinfection unit, structure, device and usage method, which uses a high-energy particle beam to bombard a disinfection cylinder to achieve the effect of sterilization and disinfection. However, since the above device lacks a refrigeration unit, if it is to be applied to a low-temperature and sterile scenario, an additional independent refrigeration unit needs to be added. Therefore, the above device is not suitable for places with a small space. Summary of the Invention

[0003] In view of the above problems, the present invention proposes a micro integrated refrigeration and disinfection unit, structure, device and usage method, mainly solving the problem that the existing disinfection unit and refrigeration unit are designed separately, resulting in an overly large overall volume of the device.

[0004] To solve the above technical problems, in a first aspect of the present invention, a micro integrated refrigeration and disinfection unit is proposed, which includes an ion wind generator. The ion wind generator includes a disinfection cover with openings at both ends. A conductive support is installed at the upper port of the disinfection cover, a receiving electrode sheet is installed at the lower port of the disinfection cover, air holes are provided at the lower part of the side wall of the disinfection cover, emission electrode needles are installed inside the conductive support, the bottom end of the receiving electrode sheet is attached to an electrical isolation layer, and the bottom of the isolation layer is attached to the hot end of a semiconductor refrigerator.

[0005] In some embodiments, the electrical isolation layer is a sheet made of BaTiO 3

[0006] In some embodiments, the conductive support is in a grid shape.

[0007] In some embodiments, the surface of the emission electrode needle is coated with a graphene coating.

[0008] In some embodiments, the semiconductor refrigerator includes a first connection piece attached to the isolation layer, and a p-type semiconductor and an n-type semiconductor provided at both ends of the first connection piece. The bottom ends of the p-type semiconductor and the n-type semiconductor are respectively fixed to a second connection piece and a third connection piece. The third connection piece is used to connect to the positive pole of the power supply, and the second connection piece is used to connect to the negative pole of the power supply.​

[0009] In a second aspect of the present invention, a micro integrated refrigeration and disinfection structure is proposed, which includes the above-mentioned micro integrated refrigeration and disinfection unit. The micro integrated refrigeration and disinfection units are arranged in an array on the upper end surface of the cold conduction plate, and the cold end of the thermoelectric cooler of each micro integrated refrigeration and disinfection unit is attached to the cold conduction plate. The top end of the conductive support of each micro integrated refrigeration and disinfection unit is fixedly connected to the conductive channel frame, and all the receiving electrode plates are grounded.

[0010] In some embodiments, there is at least one contact point between the conductive support and the conductive channel frame.

[0011] In a third aspect of the present invention, a micro integrated refrigeration and disinfection device is proposed, which includes the above-mentioned micro integrated refrigeration and disinfection structure. The micro integrated refrigeration and disinfection structure is placed inside the housing. A plurality of channel holes corresponding to the positions of the micro integrated refrigeration and disinfection units are provided at the top of the housing, and a plurality of exhaust holes are provided on the side surface of the housing.

[0012] In a fourth aspect of the present invention, a usage method for the above-mentioned micro integrated refrigeration and disinfection device is proposed, including the following steps:

[0013] Input high-voltage electricity to the conductive channel frame;

[0014] Input the working voltage to the positive and negative electrodes of the thermoelectric cooler, and ensure that under the working voltage, the hot end of the thermoelectric cooler is attached to the bottom of the isolation layer.

[0015] The beneficial effects of the present invention are as follows: An isolation layer and a thermoelectric cooler are sequentially arranged at the bottom of the ion wind generator, and the hot end of the thermoelectric cooler is attached to the isolation layer, realizing the integration and miniaturization of the refrigeration and disinfection device. When air enters the disinfection cover, corona discharge is generated by using the potential difference between the emission electrode needle and the receiving electrode plate. The negatively charged particles generated by the corona discharge are fully mixed with bacteria, microorganisms, etc. in the air, effectively killing bacteria, microorganisms, etc. At the same time, the negatively charged ion wind can deflect bacteria, microorganisms, etc. under the action of the electric field and fall onto the receiving electrode plate. Since the high temperature generated at the hot end of the thermoelectric cooler is transmitted to the receiving electrode plate through the isolation layer, it can inactivate the bacteria and microorganisms on the surface of the receiving electrode plate by heat. The ion wind drives some of the sterilized air to be discharged from the air holes, making the air contact the cold end of the thermoelectric cooler, and finally reducing the ambient temperature around the cold end through the cold end of the thermoelectric cooler. The low-temperature air sinks downward, so it can be applied to low-temperature sterile scenarios. Description of the Drawings

[0016] Figure 1 It is a three-dimensional view of the micro integrated refrigeration and disinfection unit disclosed in Embodiment 1 of the present invention;

[0017] Figure 2 Explosion diagram of the micro integrated refrigeration and disinfection unit disclosed in the first embodiment of the present invention;

[0018] Figure 3 Stereogram of the micro integrated refrigeration and disinfection structure disclosed in the second embodiment of the present invention;

[0019] Figure 4 Stereogram of the micro integrated refrigeration and disinfection device disclosed in the third embodiment of the present invention. Detailed implementation manners

[0020] The present invention will be further described below in conjunction with the detailed implementation manners. Among them, the drawings are only for illustrative purposes, showing only schematic diagrams, not physical diagrams, and should not be construed as a limitation of this patent; in order to better illustrate the embodiments of the present invention, some components in the drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0021] In the drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and should not be construed as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0022] Embodiment 1

[0023] This embodiment provides a micro integrated refrigeration and disinfection unit 100, as Figure 1 , 2 shown, which includes an ion wind generator. The ion wind generator includes a disinfection cover 1 with openings at both ends. A conductive bracket 2 is installed at the upper port of the disinfection cover 1, a receiving electrode sheet 3 is installed at the lower port of the disinfection cover 1, air holes 16 are provided at the lower part of the side wall of the disinfection cover 1, an emission electrode needle 4 is installed inside the conductive bracket 2, the bottom end of the receiving electrode sheet 3 is attached to an electrical isolation layer 5, and the bottom of the isolation layer 5 is attached to the hot end of a semiconductor refrigerator.

[0024] In an embodiment, an isolation layer 5 and a thermoelectric cooler are sequentially arranged at the bottom of the ionic wind generator, and the hot end of the thermoelectric cooler is attached to the isolation layer 5, realizing the integration and miniaturization of the refrigeration and disinfection device. When air enters the disinfection cover 1, a corona discharge is generated by the potential difference between the emission electrode needle 4 and the receiving electrode plate 3. The negatively charged particles generated by the corona discharge are fully mixed with bacteria, microorganisms, etc. in the air, highly disinfecting the bacteria, microorganisms, etc. At the same time, the negatively charged ionic wind can deflect bacteria, microorganisms, etc. under the action of the electric field and fall onto the receiving electrode plate 3. Since the high temperature generated at the hot end of the thermoelectric cooler is transmitted to the receiving electrode plate 3 through the isolation layer 5, the bacteria and microorganisms on the surface of the receiving electrode plate 3 can be thermally inactivated. The ionic wind drives some of the sterilized air to discharge from the air holes 16, making the air contact the cold end of the thermoelectric cooler, and finally reducing the ambient temperature around the cold end through the cold end of the thermoelectric cooler. The low-temperature air sinks downward, so it can be applied to low-temperature sterile scenarios.

[0025] The above-mentioned electrical isolation layer 5 can be any material with a high dielectric strength. In one example, the electrical isolation layer 5 can be made of a sheet formed by BaTiO 3 It is a strong dielectric compound material with a high dielectric constant and low dielectric loss. Its purpose is to isolate the ionic wind generator and the thermoelectric cooler, ensuring that the high voltage generated by the emission electrode needle 4 will not break down the thermoelectric cooler through the receiving electrode plate 3, resulting in the failure of the thermoelectric cooler.

[0026] The surface of the above-mentioned conductive support 2 has a plurality of pores, which can allow air to freely pass through the conductive support 2 and reach the disinfection cover 1. In one example, the conductive support 2 is in a grid shape. The above-mentioned emission electrode needle 4 is preferably installed at the inner center of the grid. The length of the emission electrode needle 4 is 1 - 10 mm, the vertical distance between the emission electrode needle 4 and the receiving electrode plate 3 is 1 - 10 mm, the height of the disinfection cover 1 is 2 - 25 mm, the length is 2 - 25 mm, and the width is 2 - 25 mm. In some embodiments, a plurality of the above-mentioned air holes 16 can be provided, which are evenly arranged at the lower part of the side wall of the disinfection cover 1, and the position is as close as possible to the receiving electrode plate 3.

[0027] Optionally, the surface of the emission electrode needle 4 is coated with a graphene coating to prevent ozone generation during the high-voltage discharge process between the emission electrode needle 4 and the receiving electrode plate 3.

[0028] The above-mentioned thermoelectric cooler refers to a semiconductor device that applies the Peltier effect. Optionally, the thermoelectric cooler includes a first connection piece 6 attached to the isolation layer, and a p-type semiconductor 7 and an n-type semiconductor 8 provided at both ends of the first connection piece 6. The bottom ends of the p-type semiconductor 7 and the n-type semiconductor 8 are respectively fixed to a second connection piece 9 and a third connection piece 10. The third connection piece 10 is used to connect to the positive pole of the power supply, and the second connection piece 9 is used to connect to the negative pole of the power supply.

[0029] In use, the third connecting piece 10 is connected to the positive electrode of the power supply, and the second connecting piece 9 is connected to the negative electrode of the power supply. The p-type semiconductor 7 and the n-type semiconductor 8 are reversely cut off. Heat release and heat absorption will occur simultaneously at the upper and lower ends of the thermoelectric cooler. That is, the first connecting piece 6 releases heat, and the third connecting piece 10 and the second connecting piece 9 absorb heat. The heat released by the first connecting piece 6 is used to heat the receiving electrode plate 3, and the third connecting piece 10 and the second connecting piece 9 absorb the heat of the air near them, thereby achieving the refrigeration effect. In this embodiment, by combining the ionic wind corona discharge device with the thermoelectric refrigeration unit, the functions of equipment refrigeration and disinfection can be achieved simultaneously, and the integrated refrigeration and disinfection unit structure can miniaturize the equipment. Therefore, it can be used in various air disinfection devices, air-conditioning equipment, etc.

[0030] Embodiment 2

[0031] This embodiment proposes a micro integrated refrigeration and disinfection structure 200, as Figure 3 shown, including the micro integrated refrigeration and disinfection unit 100 described in Embodiment 1. The micro integrated refrigeration and disinfection units 100 are arranged in an array on the upper end surface of the cold conduction plate 11, and the cold ends of the thermoelectric coolers of each micro integrated refrigeration and disinfection unit 100 are attached to the cold conduction plate 11. The top ends of the conductive brackets 2 of each micro integrated refrigeration and disinfection unit 100 are fixedly connected to the conductive channel frame 12, and all the receiving electrode plates 3 are grounded.

[0032] In this embodiment, a high voltage is provided to multiple parallel conductive brackets 2 through the conductive channel frame 12. Therefore, there is at least one contact point between the conductive bracket 2 and the conductive channel frame 12. The cold ends of the thermoelectric cooler (i.e., the third connecting piece 10 and the second connecting piece 9) absorb the heat of the cold conduction plate 11, thereby reducing the temperature of the cold conduction plate 11. More preferably, fixing members (not shown in the figure) are provided at both ends of the cold conduction plate 11. Through these fixing members, the cold conduction plate 11 is suspended in the housing 13, doubling the contact area between the cold conduction plate 11 and the air.

[0033] Embodiment 3

[0034] This embodiment proposes a micro integrated refrigeration and disinfection device 300, as Figure 4 shown, including the micro integrated refrigeration and disinfection structure 200 described in Embodiment 2. The micro integrated refrigeration and disinfection structure 200 is placed inside the housing 13. A number of channel holes 14 corresponding to the positions of the micro integrated refrigeration and disinfection units 100 are provided at the top of the housing 13, and a number of exhaust holes 15 are provided on the side of the housing 13.

[0035] In this embodiment, the channel hole 14 provided at the top of the outer shell 13 corresponds to the upper port of the disinfection cover 1. Therefore, the path for air to enter the disinfection cover 1 is unique. It must go through the sterilization process of the disinfection cover 1 before entering the interior of the outer shell 13 from the air hole 16 and finally exchange heat with the cold guide plate 11. At the same time, the outer shell 13 spatially isolates the disinfection cover 1 and the cold guide plate 11 relatively. The temperature of the air in the disinfection cover 1 rises after ionization disinfection and high-temperature disinfection. The heat is dissipated from the upper port of the disinfection cover 1 and the channel hole 14 to the outside of the outer shell 13 in sequence. Part of the air can enter the interior of the outer shell 13 from the air hole 16 under the drive of the ionic wind after ionization disinfection and high-temperature disinfection, and is cooled by the cold guide plate 11. The cold air near the cold guide plate 11 is discharged from the exhaust hole 15 of the outer shell 13, avoiding direct heat exchange between the air near the disinfection cover 1 and the cold guide plate 11. Finally, hot air is discharged from the channel hole 14 and cold air is discharged from the exhaust hole 15.

[0036] In summary, the miniaturized integrated refrigeration and disinfection device 300 proposed in this embodiment can be used for a variety of existing disinfection and low-temperature products, such as a disinfection and cooling box for medical surgical instruments. Since the cold air discharged from the exhaust hole 15 of this device has been disinfected, there is no need to place the entire miniaturized integrated refrigeration and disinfection device 300 in the disinfection cavity of the disinfection and low-temperature product. Therefore, it is only necessary to connect the exhaust hole 15 of the miniaturized integrated refrigeration and disinfection device 300 to the disinfection cavity of the disinfection and low-temperature product, which can effectively reduce the influence of the hot air discharged from the channel hole 14.

[0037] Embodiment Four

[0038] This embodiment proposes a usage method for the miniaturized integrated refrigeration and disinfection device 300 described in Embodiment Three, including the following steps:

[0039] Input high-voltage electricity to the conductive channel frame 12, and air enters the entire miniaturized integrated refrigeration and disinfection device 300 from multiple channel holes 14. When the conductive channel frame 12 installed is connected to a high-voltage power supply, negatively charged particles will be generated at the tip of the emission electrode needle 4 in the disinfection cover 1, and the negatively charged particles will adhere to the disinfection cover 1;

[0040] Input the working voltage to the positive and negative poles of the semiconductor refrigerator, and ensure that under the working voltage, the hot end of the semiconductor refrigerator is attached to the bottom of the isolation layer 5 (that is, the third connecting piece 10 is connected to the positive pole of the power supply, and the second connecting piece 9 is connected to the negative pole of the power supply), so as to eliminate all bacteria and other substances entering the miniaturized integrated refrigeration and disinfection device 300 and achieve the refrigeration effect on the air. Finally, the air is sent out from the exhaust hole 15 of the miniaturized integrated refrigeration and disinfection device 300 to complete the entire refrigeration and disinfection process.

[0041] The above steps should be carried out simultaneously.

[0042] The above has made a detailed introduction to a micro integrated refrigeration and disinfection unit, structure, device and usage method provided by the present invention. Specific examples are applied in the present invention to elaborate on the principle and implementation manner of the present invention. For those of ordinary skill in the art, other different forms of changes or alterations can be made based on the above description. It is also unnecessary and impossible to enumerate all implementation manners here. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the scope protected by the claims of the present invention.

Claims

1. A micro integrated refrigeration and disinfection unit, comprising an ion wind generator, Characterized in that, The ion wind generator includes a disinfection cover with openings at both ends. A conductive bracket is installed at the upper port of the disinfection cover, a receiving electrode plate is installed at the lower port of the disinfection cover, air holes are provided at the lower part of the side wall of the disinfection cover, emission electrode needles are installed inside the conductive bracket, the bottom end of the receiving electrode plate is attached to an electrical isolation layer, and the bottom of the electrical isolation layer is attached to the hot end of a semiconductor refrigerator; The electrical isolation layer is a sheet made of BaTiO 3 ; The conductive bracket is in a grid shape; The semiconductor refrigerator includes a first connection piece attached to the electrical isolation layer, and a p-type semiconductor and an n-type semiconductor provided at both ends of the first connection piece. The bottom ends of the p-type semiconductor and the n-type semiconductor are respectively fixed to a second connection piece and a third connection piece. The third connection piece is used to connect to the positive pole of the power supply, and the second connection piece is used to connect to the negative pole of the power supply.

2. The micro integrated refrigeration and disinfection unit according to claim 1, Characterized in that, The surface of the emission electrode needle is coated with a graphene coating.

3. A micro integrated refrigeration and disinfection structure, comprising a plurality of the micro integrated refrigeration and disinfection units according to claim 1 or 2, Characterized in that, The micro integrated refrigeration and disinfection units are arranged in an array on the upper end surface of a cold conduction plate, and the cold end of the semiconductor refrigerator of each micro integrated refrigeration and disinfection unit is attached to the cold conduction plate. The top ends of the conductive brackets of each micro integrated refrigeration and disinfection unit are fixedly connected to a conductive channel frame, and all the receiving electrode plates are grounded.

4. The micro integrated refrigeration and disinfection structure according to claim 3, Characterized in that, There is at least one contact point between the conductive bracket and the conductive channel frame.

5. A micro integrated refrigeration and disinfection device, comprising a plurality of the micro integrated refrigeration and disinfection structures according to claim 4, Characterized in that, The micro integrated refrigeration and disinfection structure is placed inside a housing. A plurality of channel holes corresponding to the positions of the micro integrated refrigeration and disinfection units are provided at the top of the housing, and a plurality of exhaust holes are provided on the side of the housing.

6. A method for using the micro integrated refrigeration and disinfection device according to claim 5, Characterized in that, Comprises the following steps: Input high voltage electricity to the conductive channel frame; Input operating voltage to the positive and negative poles of the semiconductor refrigerator, and ensure that under the operating voltage, the hot end of the semiconductor refrigerator is attached to the bottom of the electrical isolation layer.

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