Semiconductor diode pin bending and forming apparatus

Abstract

The application relates to a semiconductor diode pin bending forming device, which comprises a conveying mechanism, two resisting plates and two bending mechanisms; the conveying mechanism is used for conveying diodes; the two resisting plates are used for resisting two diode pins one by one; the two bending mechanisms are located on the two sides of the conveying mechanism in a second direction, and the bending mechanisms are located between the conveying mechanism and the resisting plates; the bending mechanism comprises a support, a cutter, a bending plate and a driving part; when the bending mechanism is located at a cutting position, the upper end of the cutter is located above the movable end and below the accommodating groove; the bending plate is rotated to drive the upper end of the cutter to be close to the resisting plate; the cutter and the resisting plate jointly cut the end part of the diode; when the bending mechanism is located at a bending position, the movable end is located above the connecting end and above the accommodating groove; the bending plate is rotated to be close to the accommodating groove, so that the diode pin is bent. The application has the effects of improving the processing efficiency of the diode and shortening the processing time.

Description

Technical Field

[0001] This application relates to the field of diode processing technology, and in particular to a semiconductor diode lead bending and forming apparatus. Background Technology

[0002] A diode is an electronic device made of semiconductor materials. It has unidirectional conductivity, meaning that when a forward voltage is applied to the anode and cathode of the diode, the diode conducts, and when a reverse voltage is applied to the anode and cathode, the diode is cut off. The conduction and cutoff of the diode are equivalent to the on and off of a switch. The diode leads are the two copper leads of the diode. The diode leads need to be bent into right angles to reduce the assembly area of ​​the diode, thereby reducing the size of the product and realizing the miniaturization and portability of the product.

[0003] Existing lead bending devices first transfer the diode to the first station, where a cutting mechanism cuts off both ends of the lead, and then transfer the diode to the second station, where a bending mechanism bends both ends of the lead. This results in low lead bending efficiency and requires a lot of time when bending leads of a large number of diodes. Summary of the Invention

[0004] To improve the efficiency of lead bending and forming and shorten the processing time, this application provides a semiconductor diode lead bending and forming apparatus.

[0005] The semiconductor diode lead bending and forming apparatus provided in this application adopts the following technical solution:

[0006] A semiconductor diode lead bending and forming apparatus, comprising:

[0007] A conveying mechanism having a plurality of limiting members spaced apart in a first direction, the limiting members having receiving grooves for mounting diodes;

[0008] Two baffles are located on either side of the conveying mechanism in a second direction, and are spaced apart from the conveying mechanism. The second direction is perpendicular to the first direction. The baffles have positioning notches at positions opposite the diode pins.

[0009] Two bending mechanisms are located on either side of the conveying mechanism in the second direction, between the conveying mechanism and the stop plate. Each bending mechanism includes a support, a cutter, a bending plate, and a drive unit. The lower end of the cutter is rotatably mounted on the support, and the upper end of the cutter can rotate around its lower end. The bending plate has a connecting end and a movable end. The connecting end is rotatably mounted on the support and located above the lower end of the cutter. The middle portion of the bending plate is slidably connected to the cutter, and the middle portion of the bending plate can slide along the extension direction of the cutter. The drive unit drives the connecting end to rotate, so that the bending mechanism has a cutting position and a bending position.

[0010] When the bending mechanism is in the cutting position, the upper end of the cutter is above the movable end and located on one side of the receiving groove. The bending plate rotates, causing the upper end of the cutter to approach the stop plate. The cutter and the stop plate together cut the diode end. When the bending mechanism is in the bending position, the movable end is above the connecting end and located on one side of the receiving groove. The bending plate rotates and approaches the receiving groove, bending the diode lead.

[0011] By adopting the above technical solution, the diode is located in the receiving groove on the limiting member. The conveying mechanism conveys the diode in the first direction. When the diode is conveyed to the point where the leads at both ends are located in the positioning notches in the stop plate, the conveying mechanism stops conveying. At this time, the upper end of the cutter is located above the movable end and below the receiving groove, which facilitates the diode to pass over the cutter and the bending plate. The driving unit drives the connecting end of the bending plate to rotate, causing the upper end of the cutter to move closer to the stop plate. The cutter and the stop plate together cut the ends of the diode. During the cutting process, there is no gap between the cutter and the stop plate, similar to scissors cutting the diode. The two bending mechanisms on both sides of the conveying mechanism operate simultaneously, which can simultaneously remove the excess leads at both ends of the diode.

[0012] The drive unit continues to drive the connecting end of the bending plate to rotate, and the movable end of the bending plate rotates to above the receiving groove, positioning the bending plate in the bending position. The bending plate continues to rotate, and under the limiting effect of the receiving groove, the diode's leads can be bent during the bending plate's rotation. After the bending operation is completed, the bending plate and cutter move to the cutting position. At this time, the conveying mechanism starts conveying the next diode to abut against the stop plate, and the above operation is repeated.

[0013] The drive unit drives the connecting end of the bending plate to rotate one revolution, which can cut and bend the diode. At the same time, the position of the diode remains unchanged during the process, eliminating the need to change the processing position of the diode multiple times, which can improve the processing efficiency and shorten the processing time.

[0014] Optionally, a first rotating shaft is fixed in the middle of the bending plate, a slider is rotatably mounted on the first rotating shaft, and the cutter has a groove that is slidably connected to the slider, the extension direction of the groove being the same as the extension direction of the cutter.

[0015] By adopting the above technical solution, the bending plate can drive the cutter to rotate back and forth once it rotates one revolution. The drive unit drives the bending plate to rotate at a constant speed. When the bending plate and the cutter are in the bending position, the first rotating shaft is located at the upper end of the cutter. The speed at which the cutter moves from the bending position to the cutting position is relatively small, which can slowly bend the diode and avoid damage to the diode pins. When the bending plate and the cutter are in the cutting position, the first rotating shaft is located at the lower end of the cutter, which makes the speed at which the cutter moves from the cutting position to the bending position larger. The cutting speed is larger, which makes the cut surface of the diode pins flatter.

[0016] Optionally, when the bending mechanism is in the bending position, the distance between the bending plate and the limiting member is equal to the diameter of the diode pin.

[0017] By adopting the above technical solution, after the diode pin is bent, the diode pin is located between the receiving groove and the bending plate, so that the bending angle of the diode pin is 90°.

[0018] Optionally, the receiving groove includes a first limiting groove and two second limiting grooves, the two second limiting grooves being located on both sides of the first limiting groove in a second direction, the first limiting groove being adapted to the diode body, and the second limiting grooves being adapted to the diode pins.

[0019] By adopting the above technical solution, the second limiting groove can limit the diode pins. When bending the diode pins, the pins inside the second limiting groove can be avoided from bending, and only the pins located outside the second limiting groove can be bent. This allows control over the bending shape of the diode pins and improves the bending quality of the diode.

[0020] Optionally, the bottom wall of the first limiting groove is a semi-cylindrical shape adapted to the diode body.

[0021] By adopting the above technical solution, the stability of the diode during transmission can be improved, and the probability of damage to the diode body can be reduced.

[0022] Optionally, the two opposite side walls of the first limiting groove are inclined outward in the first direction, so that the opening of the first limiting groove is gradually increased.

[0023] By adopting the above technical solution, it is easy to place the diode body into the first limiting groove, avoiding squeezing the diode body and causing it to be easily damaged.

[0024] Optionally, in the two inner sidewalls opposite each other in the first direction, the inner sidewall located on the front side of the second limiting groove is inclined forward in the advancing direction of the second limiting groove, and the inner sidewall located on the rear side is perpendicular to the plane containing the first direction and the second direction.

[0025] By adopting the above technical solution, it is easy to place the diode lead into the second limiting groove, avoiding compression and damage to the diode lead. When bending the diode lead, the inner sidewall of the second limiting groove located on the rear side can resist the diode lead, reducing the possibility of the diode slipping out of the second limiting groove and helping the diode lead to bend smoothly.

[0026] Optionally, the conveying mechanism includes two sprockets and a chain wound around the sprockets, and the limiting member is fixed to the chain plate of the chain.

[0027] By adopting the above technical solution, after the diode is cut and bent, when the conveying mechanism conveys the diode to the end, the diode can fall directly from the conveying mechanism into the collection device, which can eliminate the operation of removing the diode from the conveying mechanism and improve the diode collection efficiency.

[0028] Optionally, it also includes a base, on which the conveying mechanism, the baffle plate, and the bracket are all mounted.

[0029] By adopting the above technical solutions, the integration level of the entire device can be improved.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. The drive unit drives the connecting end of the bending plate to rotate one revolution, which can realize the cutting and bending of the diode. At the same time, the position of the diode remains unchanged during this process, eliminating the need to change the processing position of the diode multiple times, which can improve the processing efficiency and shorten the processing time.

[0032] 2. The bending plate rotates once, which drives the cutter to rotate back and forth. The drive unit drives the bending plate to rotate at a constant speed. When the bending plate and the cutter are in the bending position, the first rotating shaft is located at the upper end of the cutter. The speed at which the cutter moves from the bending position to the cutting position is relatively small, which can slowly bend the diode and avoid damage to the diode pins. When the bending plate and the cutter are in the cutting position, the first rotating shaft is located at the lower end of the cutter, which makes the speed at which the cutter moves from the cutting position to the bending position larger. The cutting speed is larger, which makes the cut surface of the diode pins flatter. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the semiconductor diode pin bending and forming device in Embodiment 1 of this application;

[0034] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0035] Figure 3 yes Figure 1 Schematic diagram of the semiconductor diode pin bending and forming device (without the baffle plate);

[0036] Figure 4 yes Figure 3 Enlarged view of point B in the middle;

[0037] Figure 5 yes Figure 1 A partial structural diagram of a semiconductor diode pin bending and forming device (the bending mechanism is located at the cutting position);

[0038] Figure 6 yes Figure 1 A partial structural diagram of a semiconductor diode lead bending and forming device (the position after the bending mechanism cuts the diode leads);

[0039] Figure 7 yes Figure 3 A partial structural diagram of a semiconductor diode pin bending and forming device (the bending mechanism is located at the bending position);

[0040] Figure 8 This is a cross-sectional view of the limiting member and diode perpendicular to the second direction in Embodiment 2 of this application.

[0041] Explanation of reference numerals in the attached drawings: 1. Conveying mechanism; 11. Sprocket; 12. Chain; 2. Baffle plate; 2a. Positioning notch; 3. Bending mechanism; 31. Bracket; 32. Cutter; 32a. Slide groove; 33. Bending plate; 33a. Connecting end; 33b. Movable end; 34. Second rotating shaft; 35. Slider; 4. Base; 5. Limiting element; 51. First limiting groove; 52. Second limiting groove; 100. Diode; 101. Diode body; 102. Diode pin. Detailed Implementation

[0042] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0043] This application discloses a semiconductor diode pin bending and forming apparatus.

[0044] Reference Figure 1 The semiconductor diode pin bending and forming device includes a conveying mechanism 1, two baffles 2, two bending mechanisms 3, and a base 4.

[0045] The conveying mechanism 1, the baffle plate 2, and the bending mechanism 3 are all mounted on the base 4. The conveying mechanism 1 is provided with multiple limiting members 5 spaced apart in a first direction, which is consistent with the conveying direction of the conveying mechanism 1. The conveying mechanism 1 can be a chain conveyor or a belt conveyor. In this embodiment, the conveying mechanism 1 includes two sprockets 11 and a chain 12 wound around the sprockets 11. The limiting members 5 are fixed to the chain plates of the chain 12.

[0046] Reference Figure 2 The limiting member 5 has a receiving groove for mounting the diode 100, the diode 100 is placed in the receiving groove, the diode 100 extends along the second direction and is perpendicular to the first direction.

[0047] Since the lead diameter of diode 100 is relatively small, in order to limit the position of diode 100, the receiving groove includes a first limiting groove 51 and two second limiting grooves 52. The two second limiting grooves 52 are located on both sides of the first limiting groove 51 in the second direction. In an optional embodiment, the first limiting groove 51 can be a square groove. The first limiting groove 51 is adapted to the diode body 101, and the second limiting grooves 52 are adapted to the diode lead 102. The sidewall of the first limiting groove 51 opposite to the lead is provided with a clearance notch for the diode lead 102 to pass through.

[0048] The second limiting groove 52 can limit the diode pin 102. When bending the diode pin 102, the pin inside the second limiting groove 52 can be avoided from bending. Only the pin outside the second limiting groove 52 is bent, thereby controlling the bending shape of the diode pin 102 and improving the bending quality of the diode 100.

[0049] The two side walls of the second limiting groove 52 can be perpendicular to the plane containing the first and second directions. In an optional embodiment, among the two inner side walls of the second limiting groove 52 opposite each other in the first direction, the inner side wall located on the front side is inclined forward in the forward direction of the second limiting groove 52, and the inner side wall located on the rear side is perpendicular to the plane containing the first and second directions. This makes the opening of the second limiting groove 52 gradually increase, which facilitates the insertion of the diode lead 102 into the second limiting groove 52 and avoids squeezing the diode lead 102, which could easily cause damage. When bending the diode lead 102, the inner side wall of the second limiting groove 52 located on the rear side can resist the diode lead 102, reducing the possibility of the diode 102 sliding out of the second limiting groove 52 and helping the diode lead 102 to bend smoothly.

[0050] After the diode 100 is cut and bent, when the conveying mechanism 1 conveys the diode 100 to the end, the diode 100 can fall directly from the conveying mechanism 1 into the collection device, which eliminates the need to remove the diode 100 from the conveying mechanism 1 and improves the collection efficiency of the diode 100.

[0051] Two baffles 2 are located on both sides of the conveying mechanism 1 in the second direction and are spaced apart from the conveying mechanism 1. Two bending mechanisms 3 are located on both sides of the conveying mechanism 1 in the second direction and are located between the conveying mechanism 1 and the baffles 2. The baffles 2 are provided with positioning notches 2a at the position opposite to the diode pin 102.

[0052] Specifically, refer to Figure 3 and Figure 4 The bending mechanism 3 includes a bracket 31, a cutter 32, a bending plate 33, and a drive unit. The bracket 31 can be independently installed; in this embodiment, the bracket 31 is fixed to the base 4. The lower end of the cutter 32 is rotatably mounted on the bracket 31, and the upper end of the cutter 32 can rotate around its lower end. The bending plate 33 has a connecting end 33a and a movable end 33b. The connecting end 33a is rotatably mounted on the bracket 31 and located above the lower end of the cutter 32. The middle part of the bending plate 33 is slidably connected to the cutter 32, and the middle part of the bending plate 33 can slide along the extension direction of the cutter 32. The movable end 33b of the bending plate 33 rotates circumferentially around the connecting end 33a, which can drive the upper end of the cutter 32 to reciprocate around its lower end.

[0053] In one optional embodiment, a first rotating shaft is fixed to the middle of the bending plate 33, and a slider 35 is rotatably mounted on the first rotating shaft. The cutter 32 has a groove 32a that is slidably connected to the slider 35, and the extension direction of the groove 32a is the same as the extension direction of the cutter 32. In other embodiments, a slide rail may be provided on the side of the cutter 32 facing the bending plate 33, and the slider 35 slides on the slide rail.

[0054] It should be noted that the size of the groove 32a on the cutter 32 can be set according to the actual situation, but it should not affect the strength of the cutter 32. The size of the groove 32a should not be limited to that shown in the attached drawings. In order to ensure the strength of the cutter 32, it is preferable to arrange a slide rail on the cutter 32 that is slidably connected to the slider 35.

[0055] The drive unit drives the connecting end 33a to rotate, so that the bending mechanism 3 has a cutting position and a bending position. The connecting end 33a and the bracket 31 can be connected through the second rotating shaft 34. The drive unit can be a rotary motor, and the rotating shaft of the rotary motor and the second rotating shaft 34 can be connected by a transmission belt or gear transmission.

[0056] Reference Figure 5When the bending mechanism 3 is in the cutting position, the upper end of the cutter 32 is above the movable end 33b and located on one side of the receiving groove. The rotation of the bending plate 33 drives the upper end of the cutter 32 to approach the stop plate 2. At this time, the blade of the cutter 32 faces the stop plate 2. In the second direction, there is no gap between the cutter 32 and the stop plate 2. During the process of the upper end of the cutter 32 approaching the stop plate 2, the upper end of the cutter 32 and the stop plate 2 are similar to scissors, jointly cutting the end of the diode 100. After the bending mechanism 3 has finished cutting the diode lead 102, the positions of the cutter 32 and the bending plate 33 are as follows: Figure 6 As shown.

[0057] Reference Figure 7 When the bending mechanism 3 is in the bending position, the movable end 33b is located above the connecting end 33a and on one side of the receiving groove. In the second direction, the distance between the bending plate 33 and the limiting member 5 is greater than or equal to the pin diameter. The bending plate 33 rotates closer to the receiving groove, thereby bending the diode pin 102. In an optional embodiment, when the bending mechanism 3 is in the bending position, the distance between the bending plate 33 and the limiting member 5 is equal to the diameter of the diode pin 102. After the diode pin 102 is bent, it is positioned between the receiving groove and the bending plate 33, allowing the diode pin 102 to bend at a 90° angle.

[0058] The implementation principle of the semiconductor diode lead bending and forming apparatus in this application is as follows:

[0059] The diode 100 is placed in the receiving groove of the limiting member 5. The conveying mechanism 1 conveys the diode 100 in the first direction. The diode 100 is conveyed until the leads at both ends are located in the positioning notches 2a in the abutment plate 2. The conveying mechanism 1 stops conveying. At this time, the upper end of the cutter 32 is above the movable end 33b and below the receiving groove, so that the diode 100 can pass over the cutter 32 and the bending plate 33. The driving unit drives the connecting end 33a of the bending plate 33 to rotate, causing the upper end of the cutter 32 to move closer to the abutment plate 2. The cutter 32 and the abutment plate 2 together cut the ends of the diode 100. The two bending mechanisms 3 on both sides of the conveying mechanism 1 operate simultaneously, which can simultaneously remove the excess leads at both ends of the diode 100.

[0060] The drive unit continues to drive the connecting end 33a of the bending plate 33 to rotate, and the movable end 33b of the bending plate 33 rotates to above the receiving groove, so that the bending plate 33 is in the bending position. The bending plate 33 continues to rotate, and under the limiting action of the receiving groove, the diode 100 can be bent during the rotation of the bending plate 33. After the bending operation is completed, the bending plate 33 and the cutter 32 move to the cutting position. At this time, the conveying mechanism 1 starts to convey the next diode 100 to abut against the stop plate 2, and the above operation is repeated.

[0061] The drive unit drives the connecting end 33a of the bending plate 33 to rotate one revolution, which can realize the cutting and bending of the diode 100. At the same time, the position of the diode 100 remains unchanged during this process, eliminating the need to change the processing position of the diode 100 multiple times, which can improve the processing efficiency of the diode 100 and shorten the processing time.

[0062] A single rotation of the bending plate 33 causes the cutter 32 to rotate back and forth. The drive unit drives the bending plate 33 to rotate at a constant speed. When the bending plate 33 and the cutter 32 are in the bending position, the first rotating shaft is located at the upper end of the cutter 32. The speed at which the cutter 32 moves from the bending position to the cutting position is relatively small, allowing for slow bending of the diode 100 and avoiding damage to the diode pins 102. When the bending plate 33 and the cutter 32 are in the cutting position, the first rotating shaft is located at the lower end of the cutter 32, allowing the cutter 32 to move from the cutting position to the bending position at a greater speed. This results in a higher cutting speed and a smoother cut surface for the diode pins 102.

[0063] Example 2

[0064] Reference Figure 8 The difference between Embodiment 2 and Embodiment 1 is that the bottom wall of the first limiting groove 51 is a semi-cylindrical shape adapted to the diode body 101, which can improve the stability of the diode 100 during transmission and reduce the probability of damage to the diode body 101. The two opposite side walls of the first limiting groove 51 are inclined outward in the first direction, so that the opening of the first limiting groove 51 is gradually enlarged, which makes it easier to put the diode body 101 into the first limiting groove 51 and avoids squeezing the diode body 101 and easily damaging it.

[0065] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor diode lead bending and forming apparatus characterized by comprising: include: The conveying mechanism (1) is provided with a plurality of limiting members (5) spaced apart in a first direction, and the limiting members (5) have receiving grooves for mounting diodes (100). Two baffles (2) are located on both sides of the conveying mechanism (1) in the second direction and are spaced apart from the conveying mechanism (1). The second direction is perpendicular to the first direction. The baffles (2) are provided with positioning notches (2a) at positions opposite to the diode pins (102); and, Two bending mechanisms (3) are located on both sides of the conveying mechanism (1) in the second direction. The bending mechanism (3) is located between the conveying mechanism (1) and the baffle plate (2). The bending mechanism (3) includes a bracket (31), a cutter (32), a bending plate (33), and a driving unit. The lower end of the cutter (32) is rotatably mounted on the bracket (31), and the upper end of the cutter (32) can rotate around the lower end of the cutter (32). The bending plate (33) has a connecting end (33a) and a movable end (33b). The connecting end (33a) is rotatably mounted on the bracket (31) and is located above the lower end of the cutter (32). The middle part of the bending plate (33) is slidably connected to the cutter (32), and the middle part of the bending plate (33) can slide along the extension direction of the cutter (32). The driving unit drives the connecting end (33a) to rotate so that the bending mechanism (3) has a cutting position and a bending position. When the bending mechanism (3) is in the cutting position, the upper end of the cutter (32) is above the movable end (33b) and on one side of the receiving groove. The bending plate (33) rotates and drives the upper end of the cutter (32) to approach the baffle plate (2). The cutter (32) and the baffle plate (2) together cut the end of the diode (100). When the bending mechanism (3) is in the bending position, the movable end (33b) is above the connecting end (33a) and on one side of the receiving groove. The bending plate (33) rotates and approaches the receiving groove, so that the diode pin (102) is bent.

2. The semiconductor diode lead bend forming apparatus of claim 1, wherein The bending plate (33) has a first rotating shaft fixed in the middle, and a slider (35) is rotatably mounted on the first rotating shaft. The cutter (32) has a groove (32a) that is slidably connected to the slider (35). The extension direction of the groove (32a) is the same as the extension direction of the cutter (32).

3. The semiconductor diode lead bending and forming apparatus according to claim 1, characterized in that, When the bending mechanism (3) is in the bending position, the distance between the bending plate (33) and the limiting member (5) is equal to the diameter of the diode pin (102).

4. The semiconductor diode lead bend forming apparatus of claim 1, wherein The receiving groove includes a first limiting groove (51) and two second limiting grooves (52). The two second limiting grooves (52) are located on both sides of the first limiting groove (51) in the second direction. The first limiting groove (51) is adapted to the diode body (101), and the second limiting grooves (52) are adapted to the diode pins (102).

5. The semiconductor diode lead bend forming apparatus of claim 4, wherein The bottom wall of the first limiting groove (51) is a semi-cylindrical shape adapted to the diode body (101).

6. The semiconductor diode lead bending and forming apparatus according to claim 4, characterized in that, The first limiting groove (51) has two opposite side walls that are inclined outward in the first direction, so that the opening of the first limiting groove (51) is gradually increased.

7. The semiconductor diode lead bending and forming apparatus according to claim 4, characterized in that, In the first direction, the inner wall of the second limiting groove (52) is opposite to the other two inner walls. In the forward direction of the second limiting groove (52), the inner wall located on the front side is inclined forward, and the inner wall located on the rear side is perpendicular to the plane containing the first direction and the second direction.

8. The semiconductor diode lead bending and forming apparatus according to claim 1, characterized in that, The transmission mechanism (1) includes two sprockets (11) and a chain (12) wound on the sprockets (11), and the limiting member (5) is fixed to the chain plate of the chain (12).

9. The semiconductor diode lead bending and forming apparatus according to claim 1, characterized in that, It also includes a base (4), on which the conveying mechanism (1), the baffle plate (2) and the bracket (31) are all mounted.

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