IC chip burning detection device and detection method

Abstract

The present application discloses an IC chip burning detection device and detection method, including a mounting assembly, a track assembly, a detection assembly and a transfer assembly, the track assembly includes a transition channel, a discharge channel and a braided transmission channel, and a 3D detection area and an IC transfer area are arranged between the transition channel and the discharge channel; the detection assembly includes a 3D detection mechanism; the transfer assembly is arranged between the transition channel and the braided transmission channel, including a support vertical plate fixedly arranged on the mounting substrate and a material taking mechanism movably arranged on the support vertical plate, and the material taking mechanism is used to transfer the IC chip in the IC transfer area to the braided transmission channel. During the process of IC chip moving and discharging, the IC chip can be 3D detected. For qualified IC chips, the transfer assembly can be used to transfer the IC chip to the braided transmission channel, and for unqualified IC chips, the material can be directly discharged. The device can realize multiple processing methods of IC chips, which greatly improves the detection efficiency of IC chips.

Description

Technical Field

[0001] The present application relates to the technical field of burning equipment, and in particular to an IC chip burning detection device and a detection method. Background Art

[0002] The English name of programmer is PROGRAMMER, and some people call it WRITER. This machine is used to program a type of IC called programmable IC. It can program the CELL data inside these ICs to make the programmable IC have different functions. Most of the previous ICs were fixed-function ICs, so if a designer designs a circuit board, he must use a variety of different fixed-function ICs. Mass producers need to prepare many types of ICs. Since the emergence of programmable ICs, designers only need to prepare one IC and burn it into ICs with different functions. Material preparers only need to purchase one IC, which is convenient for material preparation, but they must prepare a programmer to burn it.

[0003] After the IC chip is successfully burned, it needs to be tested. After the test, the IC chip can be directly taped. IC chips in the same batch may fail to burn. For IC chips that fail to burn, they need to be collected and burned again, and finally the IC chips that cannot be burned are screened out.

[0004] Most of the burning equipment in the related technology can only classify and collect the burned IC chips and the unburned IC chips. The burned IC chips need to be transferred to the testing equipment and the taping equipment by IC tubes for final testing and taping operations, which not only reduces the work efficiency but also increases the risk of damage to the IC chips. Summary of the invention

[0005] In order to improve the efficiency of IC chip burning detection and material collection, reduce or even avoid the risk of IC chip damage during transfer, the present application provides an IC chip burning detection device and detection method.

[0006] In the first aspect, the present application provides an IC chip burning detection device, which adopts the following technical solution:

[0007] An IC chip burning detection device includes a mounting assembly, including a mounting substrate for mounting on a burning device and a connecting plate arranged on the mounting substrate;

[0008] A track assembly is arranged on the mounting assembly, and includes a transition channel, a discharge channel, and a tape transmission channel. The transition channel is used to connect with the track in the burning device for IC chip transmission. A 3D detection area and an IC transfer area are arranged between the transition channel and the discharge channel.

[0009] A detection component, comprising a 3D detection mechanism, wherein a detection end of the 3D detection mechanism is directly opposite to the 3D detection area and is used to detect the IC chip located in the 3D detection area;

[0010] The transfer component is arranged between the transition channel and the braid transmission channel, and includes a support vertical plate fixedly arranged on the mounting base plate and a material picking mechanism movably arranged on the support vertical plate. A limiting arc groove is arranged on the support vertical plate. The material picking mechanism cooperates with the limiting arc groove. The limiting arc groove is used to limit the movable stroke of the material picking mechanism, so that the material picking mechanism transfers the IC chip in the IC transfer area to the braid transmission channel.

[0011] Preferably, the material taking mechanism comprises a material taking head and a suction nozzle fixedly connected to the material taking head, the suction nozzle is used to suck the IC chip, and a limiting axis is arranged on the material taking head;

[0012] The transfer assembly also includes a main drive mechanism and a slave drive mechanism;

[0013] The main driving mechanism comprises a rotating shaft rotatably connected to the supporting vertical plate and an eccentric swing plate fixedly connected to the rotating shaft, wherein the eccentric swing plate is arranged on the outer circumference of the rotating shaft, a limit slot is provided on the eccentric swing plate, and the limit shaft passes through the limit slot and is slidably engaged with the limit arc slot;

[0014] The slave driving mechanism comprises a rotating seat rotatably arranged on the supporting vertical plate, a slide rail fixedly connected to the rotating seat, and a slide bar slidably connected to the slide rail, and the slide bar is fixedly connected to the material taking head.

[0015] Preferably, a bearing is provided on the limiting shaft, and the bearing cooperates with the limiting groove and / or the limiting arc groove.

[0016] Preferably, a sensing sheet is fixedly provided on the material taking head, and a travel sensor is provided on the supporting vertical plate, and the travel sensor is used to sense the position of the sensing sheet to accurately locate the moving position of the material taking head;

[0017] Or / and, the limiting arc slot includes a material taking end and a material discharging end, and the stroke sensor is arranged on a side close to the material taking end.

[0018] Preferably, the IC transfer zone is arranged near the feed end of the discharge channel, and a second blocking mechanism is arranged at the feed end of the discharge channel. The second blocking mechanism includes a plug slidably arranged in the discharge channel, and the plug is used to block the channel for the movement of the IC chip, so that the IC chip stays in the IC transfer zone.

[0019] Preferably, an opening and closing discharge mechanism is provided at the position of the IC transfer area, and the opening and closing discharge mechanism includes a limit card plate movably connected to the connecting plate, and the limit card plate is provided with two symmetrical limit cards about the central axis of the discharge channel, and the connecting plate is provided with an avoidance groove for the two limit card plates to move toward or away from each other;

[0020] A card slot for limiting the position of the IC chip is arranged on one side of the two limit card plates facing each other, and a material collection slot is opened on one side of the two limit card plates facing each other. When the two limit card plates abut against each other, the two material collection slots are connected to form a material collection space for the suction nozzle to suck the IC chip.

[0021] Preferably, the 3D detection mechanism includes a second mounting seat arranged on the mounting substrate, a first camera fixedly connected to the second mounting seat, and a first lens barrel, the shooting side of the first camera faces the 3D detection area, and the first lens barrel is arranged between the first camera and the 3D detection area for magnifying the structure of the IC chip.

[0022] Preferably, a detection window is provided at the position of the 3D detection area, a window pressing frame is fixedly connected to the detection window, a shooting window for the first camera to view is provided on the window pressing frame, a support bridge and a detection prism are also provided in the detection window, the width of the support part in the support bridge corresponds to the width of the main part of the IC chip, so that the pins of the IC chip extend to the outside of the support part in the support bridge, two detection prisms are provided symmetrically about the support bridge, the two detection prisms are arranged on both sides of the support bridge in a one-to-one correspondence, and the detection prisms are arranged obliquely to reflect the pin structure of the IC chip;

[0023] Or / and, the shooting windows are provided with two mutually symmetrical ones, and a strip-shaped limiting portion for limiting the IC chip is formed between the two shooting windows;

[0024] Or / and, a avoidance groove is provided in the middle position of the strip-shaped limiting portion to expose the middle part of the IC chip body.

[0025] Preferably, a first material blocking mechanism is also provided at the position of the 3D detection area, and the first material blocking mechanism includes a sliding plate slidably connected to the connecting plate in a direction perpendicular to the support bridge and a material blocking plate fixedly connected to the sliding plate, one end of the material blocking plate extends into the avoidance groove, and the material blocking end of the material blocking plate can be abutted against the surface of the support bridge, so as to play a limiting blocking role for the IC chip.

[0026] In a second aspect, the present application provides an IC chip burning detection method, which adopts the following technical solution:

[0027] A method for detecting burning of an IC chip comprises the following steps:

[0028] Allowing the programmed IC chip to enter the transition channel;

[0029] Detecting the overall appearance of the IC chip;

[0030] If the test is qualified, the IC chip is transferred to the braiding transmission channel by using the material taking structure;

[0031] If the test fails, the IC chip will be directly sent to the discharge channel.

[0032] In summary, this application includes the following beneficial technical effects:

[0033] After the IC chip is burned, the IC chip that meets the quality requirements slides down from the transition channel. When the IC chip enters the 3D inspection area, it is subjected to 3D inspection. If the IC chip after 3D inspection needs to be taped out, it is transferred to the taping transmission channel in the IC transfer area. If it is directly discharged or does not meet the quality requirements, it enters the discharge channel for discharge.

[0034] During the transfer process, the IC chip is transferred using the transfer component. When the IC chip is transferred to the tape transmission channel, the surface of the IC chip is immediately inspected. This can improve the efficiency of IC chip inspection and material collection after burning, reduce or even avoid the risk of damage to the IC chip during the transfer process, and also improve the accuracy of inspection.

[0035] When performing surface inspection on the IC chip, the surface inspection mechanism is adjacent to the discharge position of the IC chip, and the IC chip can be inspected just when the IC chip is placed in the tape transmission channel, thereby ensuring the accuracy of the inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The overall structure diagram of an IC chip burning detection device according to an embodiment of the present application is depicted;

[0037] Figure 2 Draws Figure 1 Schematic diagram of some structures in ;

[0038] Figure 3 A detailed structural diagram of a track assembly in an IC chip burning detection device according to an embodiment of the present application is depicted;

[0039] Figure 4 Draws Figure 3 A schematic diagram of the structure of part A in the middle;

[0040] Figure 5A detailed structural diagram of the positions of the 3D detection area and the IC transfer area in an IC chip burning detection device according to an embodiment of the present application is depicted;

[0041] Figure 6 A schematic diagram of the back structure of a 3D detection area and an IC transfer area in an IC chip burning detection device according to an embodiment of the present application is depicted;

[0042] Figure 7 A schematic diagram of a cross-sectional three-dimensional structure of an IC transfer area in an IC chip burning detection device according to an embodiment of the present application is depicted from one viewing angle;

[0043] Figure 8 A schematic diagram of a cross-sectional three-dimensional structure of an IC transfer area in an IC chip burning detection device according to an embodiment of the present application is depicted from another perspective;

[0044] Fig. 9 A schematic diagram of the position structure of a transfer component in an IC chip burning detection device according to an embodiment of the present application is depicted, which is used to reflect the state of the transfer component when discharging materials;

[0045] Fig.10 A detailed structural diagram of a transfer component in an IC chip burning detection device according to an embodiment of the present application is depicted;

[0046] Fig.11 A schematic diagram of the exploded structure of a transfer component in an IC chip burning detection device according to an embodiment of the present application is depicted;

[0047] Fig.12 A schematic diagram of the structure of another state of a transfer component in an IC chip burning detection device according to an embodiment of the present application is depicted, which is used to reflect the state of the transfer component when taking material;

[0048] Fig.13 A schematic structural explosion diagram of a surface detection mechanism and a tape transmission channel in an IC chip burning detection device according to an embodiment of the present application is depicted.

[0049] Description of reference numerals:

[0050] 10. Installation assembly; 11. Installation base plate; 111. Limiting slide groove; 12. Connecting plate; 121. Installation slot; 122. Avoidance slot;

[0051] 20. Track assembly; 21. Transition channel; 22. Discharging channel; 23. Tape transmission channel; 231. Detection viewport; 24. 3D detection area; 241. Detection window; 242. Window pressing frame; 243. Detection prism; 244. Support bridge; 246. Shooting window; 247. Strip limiter; 248. Avoidance groove; 25. IC transfer area; 251. Material receiving seat; 252. Induction cover plate;

[0052] 30. Detection assembly; 31. 3D detection mechanism; 311. Second mounting seat; 312. First camera; 313. First lens barrel; 321. Third mounting seat; 322. Second lens barrel; 323. Second camera;

[0053] 40. Transfer assembly; 41. Supporting plate; 411. Limiting arc groove; 412. Travel sensor; 42. Main driving mechanism; 421. Driving motor; 422. Rotating shaft; 423. Eccentric swing plate; 424. Limiting slot; 43. Slave driving mechanism; 431. Rotating seat; 432. Slide rail; 433. Slide bar; 44. Retrieving mechanism; 441. Retrieving head; 442. Suction nozzle; 443. Limiting shaft; 444. Bearing; 445. Induction sheet; 45. First protective cover; 46. Second protective cover;

[0054] 51. First material blocking mechanism; 511. First mounting seat; 512. First cylinder; 513. Sliding plate; 514. Material blocking plate; 515. Guide rail; 516. Sliding block;

[0055] 61. Opening and closing material discharging mechanism; 611. Bidirectional driving cylinder; 612. Moving arm; 613. Limiting card plate; 614. Material taking trough;

[0056] 71. Second material blocking mechanism; 711. Second air cylinder; 712. Extension plate; 713. Plug. DETAILED DESCRIPTION

[0057] The following is combined with Figure 1-13 This application is described in further detail.

[0058] The present application embodiment discloses an IC chip burning detection device. Figure 1 The IC chip burning detection device includes a mounting assembly 10, a track assembly 20, a detection assembly 30 and a transfer assembly 40. The mounting assembly 10 includes a mounting substrate 11 and a connecting plate 12 fixedly connected to the mounting substrate 11. The track assembly 20, the detection assembly 30 and the transfer assembly 40 are all mounted on the mounting substrate 11, and the mounting substrate 11 provides support for other components. The mounting substrate 11 can be fixedly connected to the rack of the burning device. The mounting substrate 11 is tilted. The tilt angle is to facilitate the chip to slide down under the action of gravity, and the burning process and the material collection process are more convenient.

[0059] Reference Figure 1The track assembly 20 includes a transition channel 21 and a discharge channel 22 fixedly connected to the connecting plate 12. The transition channel 21 is used to correspond to the chip burning channel, and the chip after burning enters the transition channel 21. The transition channel 21 and the channel axis for the IC chip to move in the discharge channel 22 are colinear, and the IC chip can be transferred from the transition channel 21 to the discharge channel 22.

[0060] Reference Figure 1 The track assembly 20 further includes a braid transmission channel 23 fixedly disposed on the mounting substrate 11. The braid transmission channel 23 is disposed on one side of the transition channel 21 and is disposed horizontally. An IC chip braid material strip is passed through the braid transmission channel 23, and the braid material strip moves in the braid transmission channel 23. The IC chip is placed in a material box in the braid material strip, and the IC chip is driven to move during the movement of the braid material strip, and finally the braid is wound up to complete the braiding.

[0061] Reference Figure 1 and Figure 2 The detection assembly 30 includes a 3D detection mechanism 31 and a surface detection mechanism. The 3D detection mechanism 31 is mounted on the mounting substrate 11 and is disposed at the discharge end of the transition channel 21. The 3D detection mechanism 31 is used to perform 3D detection on the discharged IC chip. The surface detection mechanism is also mounted on the mounting substrate 11 and is disposed on one side of the braiding transmission channel 23, and can detect the outer surface of the chip processed by the braiding.

[0062] Reference Figure 1 and Figure 2 The transfer component 40 is arranged between the transition channel 21 and the braiding transmission channel 23. The transfer component 40 can transfer the IC chip in the transition channel 21 to the braiding transmission channel 23, and place the IC chip that meets the quality requirements and needs to be braided into the braiding material tape for braiding.

[0063] The structure of each part is described in detail below.

[0064] Reference Figure 1 and Figure 2 A material trough for IC chips to move is arranged in the transition channel 21 and the discharge channel 22. Cover plates are fixedly connected to the outside of the transition channel 21 and the discharge channel 22. The cover plates protect the chips in the transition channel 21 and the discharge channel 22.

[0065] Reference Figure 2After burning, the IC chip enters the material trough of the transition channel 21. A 3D detection area 24 and an IC transfer area 25 are set between the transition channel 21 and the discharge channel 22. If the IC chip after 3D detection needs to be taped for discharge, it is transferred to the taping transmission channel 23 in the IC transfer area 25. If it needs to be discharged directly, it enters the discharge channel 22 for discharge.

[0066] Reference Figure 3 and Figure 4 A detection window 241 fixedly connected to the connecting plate 12, a window pressure frame 242 fixedly connected to the detection window 241, and a detection prism 243 fixedly arranged in the detection window 241 are provided at the position of the 3D detection area 24. Two window pressure frames 242 and two detection prisms 243 are axially symmetrically arranged, and the symmetry axes of the two window pressure frames 242 and the detection prisms 243 are the axes of the transition channel 21.

[0067] Reference Figure 4 and Figure 5 A support bridge 244 is fixedly connected to the detection window 241. The central axis of the support bridge 244 is colinear with the axis of the transition channel 21. The support bridge 244 includes connecting parts and a support part at both ends. The support part is arranged corresponding to the material groove in the transition channel 21, so that the IC chip can slide smoothly onto the support bridge 244. The width of the support part is roughly the same as the width of the main part of the IC chip. When the IC chip enters the support part, the support part mainly supports the main part of the IC chip, and the pins on both sides of the IC chip extend to the outside of the support part respectively. An inclined chamfer is arranged at one end of the support part close to the transition channel 21. The inclined chamfer is lower than the support plane of the support part, so that the IC chip can slide more smoothly onto the support bridge 244.

[0068] Reference Figure 4 and Figure 5 Each window pressing frame 242 is provided with a shooting window 246, and two detection prisms 243 correspond to the two shooting windows 246 one by one. A narrow strip-shaped limiting portion 247 is left on the side of the shooting window 246 close to the support portion, and a slideway for the IC chip to pass through is left between the strip-shaped limiting portion 247 and the support portion. The strip-shaped limiting portion 247 is configured to have a width that just limits the main position of the IC chip, and the strip-shaped limiting portion 247 will not block the pins on both sides of the IC chip. The detection prism 243 is arranged in an inclined shape, so that from the direction facing the shooting window 246, the pins on both sides of the IC chip can be observed from the two detection prisms 243, respectively, and it can be detected whether the pins of each IC chip meet the quality requirements.

[0069] Reference Figure 4 and Figure 5At the center of the entire 3D detection area 24, an avoidance groove 248 is opened on the side where the two window pressure frames 242 are close to each other, so that the strip-shaped limiting portion 247 located at the position of the avoidance groove 248 is narrower. The strip-shaped limiting portion 247 only limits and blocks the IC chip body and the connection position of the pins. The main part of the IC chip can be photographed and detected through the avoidance groove 248.

[0070] Reference Figure 5 In order to achieve the shooting of each IC chip more smoothly, a first material blocking mechanism 51 is arranged on the connecting plate 12, and the first material blocking mechanism 51 includes a first mounting seat 511 fixedly connected to the mounting substrate 11, a first cylinder 512 fixedly connected to the first mounting seat 511, a sliding plate 513 fixedly connected to the piston rod of the first cylinder 512, and a material blocking plate 514 fixedly connected to the sliding plate 513. One blocking end of the material blocking plate 514 extends to the slideway between the strip-shaped limiting portion 247 and the supporting portion through the avoidance groove 248. The first cylinder 512 drives the material blocking plate 514 to slide toward the supporting portion, so that the material blocking plate 514 is against the supporting surface of the supporting portion, so as to limit the IC chip.

[0071] Reference Figure 5 A guide rail 515 is fixedly connected to the first mounting seat 511 , and a slider 516 is fixedly connected to the sliding plate 513 . The slider 516 is slidably engaged with the guide rail 515 , so that the sliding plate 513 moves more smoothly under the driving action of the first cylinder 512 .

[0072] Reference Figure 2 The 3D detection mechanism 31 includes a second mounting base 311 fixedly connected to the mounting substrate 11, a first camera 312 fixedly connected to the second mounting base 311, and a first lens barrel 313. The first lens barrel 313 and the first camera 312 have the same inclination angle, and the viewfinder of the first camera 312 is located within the coverage of the first lens barrel 313. The first lens barrel 313 is a magnifying glass. The first camera 312 is arranged directly opposite to the shooting window 246. The first camera 312 shoots the specific conditions of the main body and the pin part of the IC chip through the first lens barrel 313, and can also shoot the pin conditions reflected in the detection prism 243, so as to comprehensively detect the appearance quality of the IC chip.

[0073] If the IC chip is qualified after the first shooting, the first cylinder 512 will drive the baffle plate 514 to separate from the support portion, and the IC chip continues to slide down. The IC transfer area 25 is provided with a receiving seat 251 fixedly connected to the mounting substrate 11 and a sensing cover plate 252 fixedly connected to the receiving seat 251. A slideway for the IC chip to move is reserved between the receiving seat 251 and the sensing cover plate 252. A sensor is fixedly connected to the sensing cover plate 252. The sensing end of the sensor faces the slideway between the receiving seat 251 and the sensing cover plate 252, so as to sense the falling IC chip.

[0074] Reference Figure 5 and Figure 6 An opening and closing discharge mechanism 61 is also provided at the position of the IC transfer area 25, and a second blocking mechanism 71 is provided at the feeding end of the discharge channel 22. The second blocking mechanism 71 limits and blocks the IC chip. The IC chip is transferred by using the transfer component 40, so that the opening and closing discharge mechanism 61 is opened during the transfer process of the IC chip, and the IC chip can be transferred smoothly. The second blocking mechanism 71 cooperates with the opening and closing discharge mechanism 61 to achieve the limiting and transfer of qualified IC chips.

[0075] Reference Figure 6 and Figure 8 The connecting plate 12 is provided with a mounting slot 121, and the discharging channel 22 is provided with a limiting slide slot 111 connected to the mounting slot 121. The second material blocking mechanism 71 includes a second cylinder 711 fixed to the connecting plate 12, an extension plate 712 fixed to the piston rod of the second cylinder 711, and a plug 713 fixed to the extension plate 712. The extension plate 712 and the plug 713 are both slidably arranged in the mounting slot 121, and the plug 713 extends into the limiting slide slot 111. When the second cylinder 711 drives the extension plate 712 and the plug 713 to move, the plug 713 can be used to block the slide slot in the discharging channel 22, so that the IC chip is limited at the position of the opening and closing discharge mechanism 61.

[0076] The opening and closing discharge mechanism 61 is in a normally closed state. When the transfer assembly 40 needs to transfer an IC chip, the opening and closing discharge mechanism 61 will be opened to allow the IC chip to be transferred out smoothly.

[0077] Reference Figure 6 and Figure 7An avoidance groove 122 is provided on the connecting plate 12, and the opening and closing discharge mechanism 61 includes a two-way driving cylinder 611 fixedly connected to the connecting plate 12, a movable arm 612 linked to the two-way driving cylinder 611, and a limiting clamping plate 613 fixedly connected to the movable arm 612. Two groups of movable arms 612 and limiting clamping plates 613 are provided. The two groups of movable arms 612 and limiting clamping plates 613 are connected to the piston rod of the two-way driving cylinder 611 in a one-to-one manner. The movable arm 612 is slidably arranged in the avoidance groove 122, and the limiting clamping plate 613 extends to one side of the material receiving seat 251.

[0078] Reference Figure 6 and Figure 7 The side of the limit card plate 613 facing the support surface is provided with a card slot, which can limit the width direction of the IC chip to prevent the IC chip from being separated from the receiving seat 251. The side of the limit card plate 613 facing the support surface is provided with a material taking groove 614, which is arranged in the middle position in the width direction of the limit card plate 613, so that the transfer component 40 can cooperate with the middle position of the IC chip and transfer the IC chip more stably.

[0079] When the IC chip needs to be transferred, the plug 713 is first extended to the limiting slide groove 111 to block the IC chip and make it stay in the material receiving seat 251. At this time, the two limiting clamps 613 are close to each other to limit the IC chip. When the transfer component 40 cooperates with the IC chip, the bidirectional driving cylinder 611 is driven to make the bidirectional driving cylinder 611 drive the moving arm 612 and the limiting clamp 613 to move, and the limiting clamp 613 opens to both sides. Therefore, the transfer component 40 can make the IC chip disengage from the slide between the material receiving seat 251 and the sensing cover plate 252, and can smoothly drive the IC chip to be transferred.

[0080] Reference Fig. 9 The transfer assembly 40 includes a support plate 41, a main drive mechanism 42 and a slave drive mechanism 43 mounted on the support plate 41, and a material taking mechanism 44. The main drive mechanism 42 and the slave drive mechanism 43 cooperate with each other to drive the material taking mechanism 44 to move and take materials. The transfer assembly 40 can be assembled on the mounting substrate 11 or on one side of the braid transmission channel 23.

[0081] Reference Fig.10 and Fig.11The main driving mechanism 42 includes a driving motor 421 fixedly connected to the supporting vertical plate 41, a rotating shaft 422 fixedly connected to the output shaft of the driving motor 421, and an eccentric swing plate 423 rotatably connected to the rotating shaft 422. The eccentric swing plate 423 is arranged on one side of the rotating shaft 422, and the eccentric swing plate 423 is offset from the axis position of the rotating shaft 422. When the rotating shaft 422 rotates, the eccentric swing plate 423 rotates around the outer circumference of the rotating shaft 422. A limiting slot 424 is provided on the eccentric swing plate 423, and the eccentric swing plate 423 cooperates with the slave driving mechanism 43 by using the limiting slot 424 to realize the movement of the material taking mechanism 44.

[0082] Reference Fig.10 and Fig.11 The slave driving mechanism 43 includes a rotating seat 431 rotatably connected to the supporting vertical plate 41, a slide rail 432 fixedly connected to the rotating seat 431, and a slide bar 433 slidably arranged in the slide rail 432. The material picking mechanism 44 includes a material picking head 441 fixed to the slide bar 433 and a suction nozzle 442 fixedly connected to the material picking head 441. The axis of the rotating seat 431 and the axis of the rotating shaft 422 are not in the same vertical plane.

[0083] Reference Fig.10 and Fig.11 The support vertical plate 41 is provided with a limit arc groove 411, and the limit arc groove 411 is set as a U-shaped arc groove. The material taking head 441 is fixedly connected with a limit shaft 443, and the limit shaft 443 passes through the limit clamping groove 424 and extends into the limit arc groove 411. The limit guiding function of the limit arc groove 411 can make the movement of the material taking head 441 more stable. Two bearings 444 are arranged on the outer side of the limit shaft 443, one of which is in contact with the inner wall of the limit clamping groove 424, and the other bearing 444 is in contact with the inner wall of the limit arc groove 411.

[0084] Reference Fig.10 and Fig.11 The rotation axis of the rotating shaft 422 is arranged on the inner side of the arc of the limiting arc groove 411, and the rotation axis of the rotating seat 431 is arranged on the outer side of the arc of the limiting arc groove 411, that is, the limiting arc groove 411 is arranged between the rotating shaft 422 and the rotating seat 431. By utilizing the limiting effect of the limiting arc groove 411, under the main driving action of the rotating shaft 422, the material removal head 441 is deflected during the movement of the material removal head under the limiting effect of the rotating seat 431 and the slide bar 433, so that the deflection and material removal can be performed more accurately.

[0085] Reference Fig.11 and Fig.12The limiting arc groove 411 includes a feeding end and a discharging end according to the position of the feeding head 441. In order to make the moving stroke of the feeding head 441 more accurate, a sensing sheet 445 is arranged on the feeding head 441, and a stroke sensor 412 is arranged on the supporting vertical plate 41. The stroke sensor 412 is arranged at a position close to the feeding end in the limiting arc groove 411. When the feeding head 441 moves to the feeding end of the limiting arc groove 411, the sensing sheet 445 passes through the sensing side of the stroke sensor 412. The stroke sensor 412 can be electrically connected to the driving motor 421 by means of the controller. When the stroke sensor 412 senses the sensing sheet 445, the stroke sensor 412 sends a signal to the controller, and the controller then sends an instruction to control the driving motor 421 to stop the control motor from running, thereby ensuring accurate feeding.

[0086] Furthermore, the driving motor 421 often has inertial force during the driving process, so the position of the stroke sensor 412 can be offset from the position of the material picking end, so that when the driving motor 421 stops running, the material picking head 441 just drives the suction nozzle 442 to move to the position of the IC chip to perform the material picking operation.

[0087] Further, refer to Fig. 9 In order to protect the material picking mechanism 44, a first protective cover 45 and a second protective cover 46 are provided on the support plate 41. The first protective cover 45 is fixedly connected to the horizontal side of the support plate 41, and is mainly used to protect the drive motor 421. The second protective cover 46 is fixedly connected to the upper part of the support plate 41, and is mainly used to protect the slave drive mechanism 43. A displacement space is reserved in the second protective cover 46 for the movement of the slide bar 433.

[0088] Reference Fig.13 The surface detection mechanism includes a third mounting seat 321 fixedly connected to the mounting substrate 11, a second lens barrel 322 fixedly connected to the third mounting seat 321, and a second camera 323. A detection viewfinder 231 is provided on the tape transmission channel 23. The second camera 323 is arranged directly above the detection viewfinder 231. The second lens barrel 322 is arranged on the viewfinder side of the second camera 323 to magnify the detailed features of the IC chip. The detection viewfinder 231 is adjacent to the IC chip discharge position. The IC chip can be detected when it is just placed in the tape transmission channel 23 to ensure the accuracy of the detection.

[0089] The implementation principle of an IC chip burning detection device in an embodiment of the present application is as follows: after the burning of the IC chip is completed, the IC chip that meets the quality requirements slides down from the transition channel 21, and when the IC chip enters the 3D detection area 24, the IC chip is subjected to 3D detection. If the IC chip after the 3D detection needs to be taped and discharged, it is transferred to the taping transmission channel 23 in the IC transfer area 25. If it is discharged directly or does not meet the quality requirements, it enters the discharge channel 22 for discharge.

[0090] During the transfer process, the IC chip is transferred by the transfer assembly 40, and the surface of the IC chip is immediately inspected after the IC chip is transferred to the tape transmission channel 23. This can improve the efficiency of IC chip inspection and material collection after burning, reduce or even avoid the risk of damage to the IC chip during the transfer process, and also improve the accuracy of inspection.

[0091] The present application also discloses an IC chip burning detection method. The IC chip burning detection method comprises the following steps:

[0092] The IC chip after burning enters the transition channel 21;

[0093] Detect the overall appearance of the IC chip;

[0094] If the test is qualified, the IC chip is transferred to the tape transmission channel 23 by using the material taking structure, and the material taking structure is the transfer component 40 mentioned above;

[0095] If the detection fails, the IC chip is directly sent into the discharge channel 22 .

[0096] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An IC chip burning detection device, characterized in that: include: A mounting assembly (10) comprises a mounting substrate (11) for mounting on a burning device and a connecting plate (12) arranged on the mounting substrate (11); A track component (20) is arranged on the mounting component (10), comprising a transition channel (21), a discharge channel (22) and a braided tape transmission channel (23), wherein the transition channel (21) is used to connect with a track in a burning device for IC chip transmission, and a 3D detection area (24) and an IC transfer area (25) are arranged between the transition channel (21) and the discharge channel (22); A detection component (30) comprises a 3D detection mechanism (31), wherein a detection end of the 3D detection mechanism (31) is facing the 3D detection area (24) and is used to detect an IC chip located in the 3D detection area (24); A transfer assembly (40) is arranged between the transition channel (21) and the braid transmission channel (23), comprising a support vertical plate (41) fixedly arranged on the mounting substrate (11) and a material picking mechanism (44) movably arranged on the support vertical plate (41), wherein a limit arc groove (411) is arranged on the support vertical plate (41), and the material picking mechanism (44) cooperates with the limit arc groove (411), and the limit arc groove (411) is used to limit the movable stroke of the material picking mechanism (44), so that the material picking mechanism (44) transfers the IC chip in the IC transfer area (25) to the braid transmission channel (23); The material taking mechanism (44) comprises a material taking head (441) and a suction nozzle (442) fixedly connected to the material taking head (441), wherein the suction nozzle (442) is used to suck the IC chip, and a limiting axis (443) is provided on the material taking head (441); The transfer assembly (40) further comprises a main drive mechanism (42) and a slave drive mechanism (43); The main driving mechanism (42) comprises a rotating shaft (422) rotatably connected to the supporting vertical plate (41) and an eccentric swing plate (423) fixedly connected to the rotating shaft (422); the eccentric swing plate (423) is arranged on the outer circumference of the rotating shaft (422); a limit slot (424) is provided on the eccentric swing plate (423); the limit shaft (443) passes through the limit slot (424) and is slidably engaged with the limit arc slot (411); The slave drive mechanism (43) comprises a rotating seat (431) rotatably arranged on the supporting vertical plate (41), a slide rail (432) fixedly connected to the rotating seat (431), and a slide bar (433) slidably connected to the slide rail (432), and the slide bar (433) is fixedly connected to the material taking head (441).

2. The IC chip burning detection device according to claim 1, characterized in that: A bearing (444) is provided on the limiting shaft (443), and the bearing (444) matches the limiting slot (424) and / or the limiting arc slot (411).

3. The IC chip burning detection device according to claim 1, characterized in that: The material taking head (441) is fixedly provided with a sensing sheet (445), and the supporting vertical plate (41) is provided with a travel sensor (412), and the travel sensor (412) is used to sense the position of the sensing sheet (445) so as to accurately locate the moving position of the material taking head (441); Or / and, the limiting arc groove (411) includes a material taking end and a material discharging end, and the travel sensor (412) is arranged on a side close to the material taking end.

4. The IC chip burning detection device according to claim 1, characterized in that: The IC transfer area (25) is arranged at a feeding end close to the discharge channel (22), and a second blocking mechanism (71) is arranged at the feeding end of the discharge channel (22). The second blocking mechanism (71) includes a plug (713) slidably arranged in the discharge channel (22), and the plug (713) is used to block the channel for the IC chip to move, so that the IC chip stays in the IC transfer area (25).

5. The IC chip burning detection device according to claim 4, characterized in that: An opening and closing discharge mechanism (61) is provided at the position of the IC transfer area (25), and the opening and closing discharge mechanism (61) comprises a limit clamping plate (613) movably connected to the connecting plate (12), and two limit clamping plates (613) are provided symmetrically about the central axis of the discharge channel (22), and an avoidance groove (122) is provided on the connecting plate (12) for the two limit clamping plates (613) to move toward or away from each other; A card slot for limiting the position of the IC chip is provided on one side of the two limit card plates (613) facing each other, and a material taking groove (614) is provided on one side of the two limit card plates (613) facing each other. When the two limit card plates (613) abut against each other, the two material taking grooves (614) are connected to form a material taking space for the suction nozzle (442) to suck the IC chip.

6. The IC chip burning detection device according to claim 1, characterized in that: The 3D detection mechanism (31) comprises a second mounting seat (311) arranged on the mounting substrate (11), a first camera (312) fixedly connected to the second mounting seat (311), and a first lens barrel (313), wherein a shooting side of the first camera (312) faces the 3D detection area (24), and the first lens barrel (313) is arranged between the first camera (312) and the 3D detection area (24) and is used to magnify the structure of the IC chip.

7. The IC chip burning detection device according to claim 6, characterized in that: A detection window (241) is arranged at the position of the 3D detection area (24), a window pressing frame (242) is fixedly connected to the detection window (241), a shooting window (246) for the first camera (312) to take a picture is opened on the window pressing frame (242), a support bridge (244) and a detection prism (243) are also arranged in the detection window (241), the width of the support part in the support bridge (244) corresponds to the width of the main part of the IC chip, so that the pins of the IC chip extend to the outside of the support part in the support bridge (244), two detection prisms (243) are arranged symmetrically with respect to the support bridge (244), the two detection prisms (243) are arranged on both sides of the support bridge (244) in a one-to-one correspondence, and the detection prism (243) is arranged at an angle to reflect the pin structure of the IC chip; Or / and, the shooting windows (246) are provided with two mutually symmetrical ones, and a strip-shaped limiting portion (247) for limiting the IC chip is formed between the two shooting windows (246); Alternatively or alternatively, a relief groove (248) is provided in the middle of the strip-shaped limiting portion (247) for exposing the middle portion of the IC chip body.

8. The IC chip burning detection device according to claim 7, characterized in that: A first material blocking mechanism (51) is also provided at the position of the 3D detection area (24), and the first material blocking mechanism (51) comprises a sliding plate (513) slidably connected to the connecting plate (12) in a direction perpendicular to the supporting bridge (244), and a material blocking plate (514) fixedly connected to the sliding plate (513), one end of the material blocking plate (514) extends into the avoidance groove (248), and the material blocking end of the material blocking plate (514) can be abutted against the surface of the supporting bridge (244), so as to play a limiting blocking role for the IC chip.

9. An IC chip burning detection method, characterized in that: The IC chip burning detection device according to any one of claims 1 to 8 comprises the following steps: Allowing the programmed IC chip to enter the transition channel (21); Detecting the overall appearance of the IC chip; If the test is qualified, the IC chip is transferred to the braiding transmission channel (23) by using the material taking structure; If the detection fails, the IC chip is directly sent into the discharge channel (22).

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