Chip temperature regulation method and system, chip and device

Abstract

The application provides a chip temperature regulation method and system, a chip and a device, and relates to the technical field of chips. The method comprises the following steps: obtaining a first frequency control word; outputting a clock signal according to the first frequency control word; determining a second internal temperature that the chip should reach after a preset time length of action of the clock signal frequency and a first internal temperature of the chip before the action of the clock signal frequency; determining a second frequency control word according to the first frequency control word, the first internal temperature and the second internal temperature; and taking the second frequency control word as a new first frequency control word and returning to the step of outputting the clock signal according to the first frequency control word. In the application, the internal temperature of the chip is related to the clock signal frequency, the clock signal frequency is related to the frequency control word, the change trend of the internal temperature of the chip is predicted, the frequency control word is adjusted, the clock signal frequency is adjusted, the internal temperature of the chip is kept in a suitable range, and the heat dissipation performance of the chip is improved.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and in particular to a chip temperature control method and system, chip, and device. Background Technology

[0002] Today, chip integration is increasing exponentially, with trillions of transistors now integrated into a single chip. In such a high-density integration environment, heat dissipation becomes increasingly critical, limiting chip performance optimization. Summary of the Invention

[0003] This invention provides a chip temperature control method and system, chip and device to solve the heat dissipation problem of existing chips.

[0004] To address the aforementioned problems, this invention discloses a chip temperature control method applied to a chip temperature control system, wherein the chip temperature control system is disposed within a chip, and the method includes:

[0005] Obtain the first frequency control word;

[0006] A clock signal is output according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word.

[0007] Based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied, determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration.

[0008] The second frequency control word is determined based on the first frequency control word, the first internal temperature, and the second internal temperature;

[0009] The second frequency control word is used as the new first frequency control word, and the step of outputting a clock signal according to the first frequency control word is returned, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal.

[0010] Optionally, determining the second internal temperature that the chip should reach after the clock signal has been applied for a preset duration, based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied, includes:

[0011] Based on the frequency of the clock signal, determine the power difference between the heat generation power and the heat dissipation power of the chip;

[0012] Based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied, determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration.

[0013] Optionally, determining the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal includes:

[0014] Based on the frequency of the clock signal, the power difference between the heat generation power and the heat dissipation power of the chip is determined by the following formulas (1) and (2);

[0015] P δ =P g -P d (1)

[0016] P g =ACV 2 f(2)

[0017] Wherein, P δ For the power difference, P g The heat generation power of the chip, P d The heat dissipation power of the chip is given by A, a constant coefficient is given by C, the load capacitance of the chip is given by V, the operating voltage of the chip is given by f, and the frequency of the clock signal is given by f.

[0018] Optionally, determining the second internal temperature that the chip should reach after the clock signal has been applied for a preset duration, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied, includes:

[0019] Based on the power difference and the first internal temperature of the chip before the frequency of the clock signal is applied, the second internal temperature that the chip should reach after the frequency of the clock signal has been applied for a preset duration is determined by the following formula (3).

[0020]

[0021] Wherein, the T end The second internal temperature, T start For the first internal temperature, P δ The power difference is denoted as Δt, the preset duration is denoted as cm, and the energy required for the internal temperature of the chip to increase by 1 degree Celsius is denoted as cm.

[0022] Optionally, determining the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature includes:

[0023] When the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word;

[0024] If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

[0025] Optionally, determining the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature includes:

[0026] The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4);

[0027]

[0028] Wherein, the T end The second internal temperature, T start For the first internal temperature, the F end For the second frequency control word, the F start The first frequency control word is defined as follows: α and β are both preset coefficients, and both α and β are related to the preset temperature.

[0029] Optionally, the frequency of the clock signal is negatively correlated with the first frequency control word.

[0030] To address the aforementioned problems, the present invention also discloses a chip temperature control system, which is disposed within a chip. The chip temperature control system includes a frequency-adjustable clock generator, the output of which is connected to a functional module within the chip. The chip temperature control system further includes a control module and a temperature sensor, the control module being connected to the clock generator and the temperature controller, respectively.

[0031] The clock generator is configured to acquire a first frequency control word; output a clock signal to the functional module according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word;

[0032] The control module is configured to determine, based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied (collected by the temperature sensor), a second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration; and to determine the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature.

[0033] The clock generator is further configured to use the second frequency control word as a new first frequency control word and return to the step of outputting a clock signal to the functional module according to the first frequency control word, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal.

[0034] Optionally, the control module includes a power calculation submodule and a controller submodule;

[0035] The power calculation submodule is configured to determine the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal.

[0036] The controller submodule is configured to determine, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied (collected by the temperature sensor), the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration.

[0037] Optionally, the power calculation submodule is specifically configured as follows:

[0038] Based on the frequency of the clock signal, the power difference between the heat generation power and the heat dissipation power of the chip is determined by the following formulas (1) and (2);

[0039] P δ =P g -P d (1)

[0040] P g =ACV 2 f(2)

[0041] Wherein, P δ For the power difference, P g The heat generation power of the chip, P d The heat dissipation power of the chip is given by A, a constant coefficient is given by C, the load capacitance of the chip is given by V, the operating voltage of the chip is given by f, and the frequency of the clock signal is given by f.

[0042] Optionally, the controller submodule is specifically configured as follows:

[0043] Based on the power difference and the first internal temperature of the chip before the frequency of the clock signal is applied, the second internal temperature that the chip should reach after the frequency of the clock signal has been applied for a preset duration is determined by the following formula (3).

[0044]

[0045] Wherein, the Tend The second internal temperature, T start For the first internal temperature, P δ The power difference is denoted as Δt, the preset duration is denoted as cm, and the energy required for the internal temperature of the chip to increase by 1 degree Celsius is denoted as cm.

[0046] Optionally, the controller submodule is further configured to:

[0047] When the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word;

[0048] If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

[0049] Optionally, the controller submodule is further configured as follows:

[0050] The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4);

[0051]

[0052] Wherein, the T end The second internal temperature, T start For the first internal temperature, the F end For the second frequency control word, the F start The first frequency control word is defined as follows: α and β are both preset coefficients, and both α and β are related to the preset temperature.

[0053] Optionally, the frequency of the clock signal is negatively correlated with the first frequency control word.

[0054] Optionally, the clock generator is a TAF-DPS clock generator.

[0055] To address the aforementioned problems, the present invention also discloses a chip, including the aforementioned chip temperature control system.

[0056] To address the aforementioned problems, the present invention also discloses an apparatus comprising the aforementioned chip.

[0057] Compared with the prior art, the present invention has the following advantages:

[0058] In this embodiment of the invention, a first frequency control word is first obtained, and a clock signal is output based on the first frequency control word. The frequency of the clock signal is related to the first frequency control word. Then, based on the frequency of the clock signal and the first internal temperature of the chip before the frequency is applied, a second internal temperature that the chip should reach after the frequency is applied for a preset duration is determined. Then, based on the first frequency control word, the first internal temperature, and the second internal temperature, a second frequency control word is determined. Afterward, the second frequency control word can be used as the new first frequency control word, and the process returns to the step of outputting the clock signal based on the first frequency control word. This allows for the regulation of the chip's internal temperature by adjusting the frequency of the clock signal. In this embodiment of the invention, the chip's internal temperature is related to the frequency of the clock signal, and the frequency of the clock signal is related to the frequency control word. By predicting the trend of the chip's internal temperature change and adjusting the frequency control word, the frequency of the clock signal can be adjusted, ensuring that the chip's internal temperature remains within a suitable range and improving the chip's heat dissipation performance. Attached Figure Description

[0059] Figure 1 A flowchart illustrating the steps of a chip temperature control method according to Embodiment 1 of the present invention is shown.

[0060] Figure 2 A schematic diagram of a K-channel pulse signal at a K-channel output terminal is shown in Embodiment 1 of the present invention;

[0061] Figure 3 A schematic diagram of a chip temperature control result according to Embodiment 1 of the present invention is shown;

[0062] Figure 4 A structural block diagram of a chip temperature control system according to Embodiment 2 of the present invention is shown;

[0063] Figure 5 A structural block diagram of another chip temperature control system according to Embodiment 2 of the present invention is shown. Detailed Implementation

[0064] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0065] Example 1

[0066] Figure 1 The diagram illustrates a step flowchart of a chip temperature control method according to Embodiment 1 of the present invention. This chip temperature control method is applied to a chip temperature control system, which can be installed within the chip. The chip temperature control system may include a frequency-adjustable clock generator, the output of which can be connected to a functional module within the chip. (Refer to...) Figure 1 The method includes the following steps:

[0067] Step 101: Obtain the first frequency control word.

[0068] In a chip, the frequency of the clock signal is controlled by a frequency control word. An adjustable clock generator can output a clock signal of the corresponding frequency to the functional modules within the chip based on this frequency control word. Since the frequency and period of a clock signal are reciprocals, the frequency control word is also called the period control word. In practical applications, the frequency control word is usually input by the user according to the required clock signal frequency.

[0069] In one alternative implementation, the clock generator can be a TAF-DPS (Time-Average-Frequency Direct Period Synthesis) clock generator. A TAF-DPS clock generator can synthesize a target clock period using two or more pulses, thereby enabling the generation of arbitrary frequencies and rapid frequency switching.

[0070] The TAF-DPS clock generator includes a TAF-DPS frequency synthesizer, which can generate a first period and a second period based on a basic time unit Δ and a frequency control word F. The first and second periods are interleaved to synthesize a clock signal of the desired frequency. The TAF-DPS clock generator has one output terminal for outputting the synthesized clock signal.

[0071] The TAF-DPS clock generator includes K output terminals, which can output K pulse signals with uniform phase intervals, where K is a positive integer greater than 1. The phase difference between any two adjacent pulse signals in the K output terminals is the basic time unit Δ. In practical applications, the basic time unit Δ is usually designed according to the requirements of the TAF-DPS circuit.

[0072] The frequency control word F = I + r, where I is the integer part and r is the fractional part, 0 ≤ r < 1. The frequency accuracy of the TAF-DPS clock generator is related to the number of bits allocated to r for storage. In practical applications, the frequency control word F is usually input by the user according to the frequency requirements of the clock signal.

[0073] Based on the basic time unit Δ and the frequency control word F, the TAF-DPS frequency synthesizer can generate two types of periods, the first period T A =I*Δ, second period T B = (I+1)*Δ. The clock signal output by the TAF-DPS frequency synthesizer has a period T. A and T B A clock pulse train synthesized by interleaving, with an average period T of the clock pulse train. TAF= (1-r)*T A +r*T B Among them, T TAF Controlled by the value of r. T TAF The reciprocal of the value is the frequency of the clock signal to be output.

[0074] Furthermore, because individual pulse signals are directly constructed, the frequency of the clock signal output by the TAF-DPS clock generator can be changed instantaneously, giving it the characteristic of rapid frequency switching. The ability to generate arbitrary frequencies and perform rapid frequency switching are the main reasons why the TAF-DPS clock generator is superior to conventional frequency sources.

[0075] Taking the TAF-DPS clock generator as an example, the first frequency control word F can be... start Input the TAF-DPS clock generator to provide an initial frequency control word to the TAF-DPS clock generator.

[0076] Step 102: Output a clock signal according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word.

[0077] In this embodiment of the invention, the frequency-adjustable clock generator can generate a clock signal of a corresponding frequency based on a first frequency control word and output the clock signal to the functional module in the chip.

[0078] Optionally, the frequency of the clock signal is negatively correlated with the first frequency control word. Thus, the frequency of the clock signal can be decreased by increasing the first frequency control word, and increased by decreasing the first frequency control word.

[0079] Continuing with the TAF-DPS clock generator as an example, in the TAF-DPS clock generator, the frequency of the clock signal is negatively correlated with the frequency control word, and satisfies the following relationship:

[0080]

[0081] Where f is the frequency of the clock signal, and K is the number of pulse signals output by the K output terminals. Δ K represents the frequency of each pulse signal output from the K-channel output terminals. In practical applications, once the TAF-DPS clock generator is completed, K and f... Δ Both are constant values, and the frequency f of the clock signal is only related to the frequency control word F.

[0082] In the TAF-DPS clock generator, based on K, f Δ The relationship between Δ and the above formula can also be expressed as:

[0083]

[0084] Step 103: Based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied, determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration.

[0085] In this embodiment of the invention, the chip temperature control system may further include a temperature sensor for real-time acquisition of the chip's internal temperature. The internal temperature of the chip acquired by the temperature sensor just before the current frequency of the clock signal is applied is the first internal temperature. The chip temperature control system can then determine, based on the frequency of the clock signal and the acquired first internal temperature, the second internal temperature that the chip should reach after the current frequency of the clock signal has been applied for a period of time.

[0086] Optionally, this step can be implemented through the following sub-steps (1)-(2):

[0087] Sub-step (1): Determine the power difference between the chip's heat generation power and heat dissipation power based on the frequency of the clock signal.

[0088] Optionally, sub-step (1) may specifically include: determining the power difference between the heat generation power and the heat dissipation power of the chip according to the frequency of the clock signal using the following formulas (1) and (2);

[0089] P δ =P g -P d (1)

[0090]

[0091] Among them, P δ P is the power difference. g P represents the heat generation power of the chip. d Where A is the heat dissipation power of the chip, C is the load capacitance of the chip, V is the operating voltage of the chip, and f is the frequency of the clock signal.

[0092] In practical applications, A can optionally be 1 / 2, and correspondingly, the above formula (2) can be expressed as:

[0093]

[0094] Once the chip is manufactured and its area, volume, shape, and appearance are determined, the heat dissipation power P is... d It is generally a constant value. Heat generation power P gThe value of is related to the chip's load (i.e., the capacitance or current of the functional module), operating voltage V, and operating frequency (i.e., the frequency f of the clock signal). After the chip is manufactured, the chip load and operating voltage V are usually fixed; therefore, the heat generation power can be adjusted by changing the frequency f of the clock signal.

[0095] The power difference P between heat generation power and heat dissipation power δ The P δ A positive value indicates that the chip's internal heat is not dissipated in time, which will cause the chip's internal temperature to rise. δ When the value is negative, it indicates that the chip dissipates heat in a timely manner and the internal temperature of the chip is decreasing.

[0096] Sub-step (2): Based on the power difference and the first internal temperature of the chip before the frequency of the collected clock signal is applied, determine the second internal temperature that the chip should reach after the preset duration of the frequency of the clock signal is applied.

[0097] Optionally, sub-step (2) may specifically include: determining the second internal temperature that the chip should reach after the clock signal has been applied for a preset duration, based on the power difference and the first internal temperature of the chip before the frequency of the collected clock signal is applied, using the following formula (3);

[0098]

[0099] Among them, T end The second internal temperature, T start P is the first internal temperature. δ Δt is the power difference, Δt is the preset duration, and cm is the energy required for the chip's internal temperature to rise by 1 degree Celsius.

[0100] In this embodiment of the invention, the internal temperature of the chip before the current frequency of the clock signal is applied can be predicted using the above formula (3) after a period of time. If the predicted internal temperature of the chip after a period of time is high, it indicates that the current frequency of the clock signal will cause the chip to have insufficient heat dissipation, thereby increasing the chip's power consumption. If the predicted internal temperature of the chip after a period of time is low, it indicates that the current frequency of the clock signal can ensure timely heat dissipation inside the chip, thereby reducing the chip's power consumption.

[0101] Step 104: Determine the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature.

[0102] In this embodiment of the invention, the chip temperature control system can determine a second frequency control word based on the current first frequency control word, the current first internal temperature of the chip, and the predicted second internal temperature after the current frequency clock signal has been applied to the chip for a period of time. This allows the system to adjust the frequency of the clock signal using the second frequency control word. Based on the above formula (2), it is known that the heat generation power is related to the frequency of the clock signal. Therefore, by adjusting the frequency of the clock signal, the internal temperature of the chip can be controlled.

[0103] Optionally, this step may specifically include:

[0104] If the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word;

[0105] If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

[0106] Because the frequency of the clock signal is negatively correlated with the first frequency control word, when a higher internal chip temperature is predicted after a certain period, the clock signal frequency can be reduced by increasing the first frequency control word, thereby reducing the chip's heat generation power and lowering the internal chip temperature. Conversely, when a lower internal chip temperature is predicted after a certain period, the clock signal frequency can be increased by decreasing the first frequency control word, thereby increasing the chip's heat generation power and raising the internal chip temperature. In this way, the internal chip temperature can always be maintained within a relatively suitable temperature range, around the preset temperature.

[0107] Optionally, embodiments of the present invention may determine the second frequency control word through the following steps:

[0108] The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4);

[0109]

[0110] Among them, T end The second internal temperature, T start The first internal temperature, F end For the second frequency control word, F start This is the first frequency control word, where α and β are both preset coefficients, and both α and β are related to the preset temperature.

[0111] In the above formula (4), α and β are both coefficients related to the preset temperature. In practical applications, they can be formulated according to the specific temperature control strategy. The principle for formulating α and β is: when the second internal temperature exceeds the preset temperature, the second frequency control word can be made greater than the first frequency control word, that is, the frequency control word is increased; when the second internal temperature does not exceed the preset temperature, the second frequency control word can be made less than the first frequency control word, that is, the frequency control word is decreased.

[0112] If the second frequency control word is greater than the original first frequency control word, the frequency of the clock signal decreases, and correspondingly, the heat generation power of the chip decreases, thereby lowering the internal temperature of the chip. If the second frequency control word is less than the original first frequency control word, the frequency of the clock signal increases, and correspondingly, the heat generation power of the chip increases, thereby raising the internal temperature of the chip.

[0113] Step 105: Use the second frequency control word as the new first frequency control word, and return to the step of outputting a clock signal according to the first frequency control word, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal.

[0114] In this step, the second frequency control word can be used as the new first frequency control word input to the clock generator. The clock generator can then change the frequency of the clock signal according to the new first frequency control word, and output a clock signal of the new frequency to the functional module. Subsequently, the frequency control word can be adjusted based on the temperature change trend inside the chip caused by the new frequency clock signal, thereby achieving dynamic control of the chip's internal temperature. In other words, in this step, the second frequency control word can be used as the new first frequency control word, and steps 102-104 can be executed cyclically to achieve dynamic control of the chip's internal temperature.

[0115] In this embodiment of the invention, by predicting the internal temperature of the chip after the current frequency of the clock signal has been applied for a period of time, and then adjusting the frequency control word according to the prediction result, the frequency of the clock signal can be reduced before the internal temperature of the chip reaches a high temperature, thus slowing down the rising trend of the internal temperature of the chip and keeping the internal temperature of the chip within a relatively suitable temperature range. This keeps the chip power consumption within a stable range and improves the working efficiency of the chip.

[0116] Furthermore, the chip temperature control method provided in this embodiment of the invention can be integrated into various chips as a program, thus possessing the characteristics of simplicity, high efficiency, low cost, rapid development, and portability. It can achieve dynamic control of the internal temperature of the chip and improve the chip's working efficiency.

[0117] In one specific embodiment, the chip's initial internal temperature is 25°C, the maximum temperature limit is 80°C, the default operating voltage is 1V, the default load capacitance is 1nF, the initial clock signal frequency is 80MHz, and cm is 0.01. The chip temperature control method can employ the following strategy: when the predicted internal chip temperature after a certain period does not exceed 40°C, the clock signal frequency is slowly increased (e.g., the frequency control word F is decremented by 1 with each operation); when the predicted internal chip temperature after a certain period exceeds 40°C, the clock signal frequency is slowly decreased (e.g., the frequency control word F is incremented by 1 with each operation). The chip temperature control result is as follows: Figure 3 As shown. From Figure 3 As can be seen, by dynamically adjusting the clock signal frequency, the internal temperature of the chip can be controlled at around 40℃, thereby keeping the chip power consumption within a stable range and improving the chip's working efficiency.

[0118] In this embodiment of the invention, a first frequency control word is first obtained, and a clock signal is output based on the first frequency control word. The frequency of the clock signal is related to the first frequency control word. Then, based on the frequency of the clock signal and the first internal temperature of the chip before the frequency is applied, a second internal temperature that the chip should reach after the frequency is applied for a preset duration is determined. Then, based on the first frequency control word, the first internal temperature, and the second internal temperature, a second frequency control word is determined. Afterward, the second frequency control word can be used as the new first frequency control word, and the process returns to the step of outputting the clock signal based on the first frequency control word. This allows for the regulation of the chip's internal temperature by adjusting the frequency of the clock signal. In this embodiment of the invention, the chip's internal temperature is related to the frequency of the clock signal, and the frequency of the clock signal is related to the frequency control word. By predicting the trend of the chip's internal temperature change and adjusting the frequency control word, the frequency of the clock signal can be adjusted, ensuring that the chip's internal temperature remains within a suitable range and improving the chip's heat dissipation performance.

[0119] Example 2

[0120] Reference Figure 4 The diagram shows a structural block diagram of a chip temperature control system according to a second embodiment of the present invention. The chip temperature control system 200 is disposed in the chip 1000. The chip temperature control system 200 includes a frequency-adjustable clock generator 210, and the output terminal Out of the clock generator 210 is connected to the functional module 400 in the chip 1000. The chip temperature control system 200 also includes a control module 220 and a temperature sensor 230. The control module 220 is connected to the clock generator 210 and the temperature controller 230, respectively.

[0121] Clock generator 210 is configured to acquire a first frequency control word; and output a clock signal to functional module 400 according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word.

[0122] The control module 220 is configured to determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration, based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied, collected by the temperature sensor 230; and to determine the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature.

[0123] The clock generator 210 is also configured to use the second frequency control word as the new first frequency control word and return to the step of outputting a clock signal to the functional module 400 according to the first frequency control word, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal.

[0124] Optionally, refer to Figure 5 The control module 220 includes a power calculation submodule 2201 and a controller submodule 2202;

[0125] The power calculation submodule 2201 is configured to determine the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal.

[0126] The controller submodule 2202 is configured to determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied by the temperature sensor 230.

[0127] Optionally, the power calculation submodule 2201 is specifically configured as follows:

[0128] Based on the frequency of the clock signal, the power difference between the heat generation power and the heat dissipation power of the chip is determined by the following formulas (1) and (2);

[0129] P δ =P g -P d (1)

[0130] P g =ACV 2 f(2)

[0131] Among them, P δ P is the power difference. g P represents the heat generation power of the chip. d Where A is the heat dissipation power of the chip, C is the load capacitance of the chip, V is the operating voltage of the chip, and f is the frequency of the clock signal.

[0132] Optionally, the controller submodule 2202 is specifically configured as follows:

[0133] Based on the power difference and the first internal temperature of the chip before the frequency of the collected clock signal is applied, the second internal temperature that the chip should reach after the preset duration of the clock signal is applied is determined by the following formula (3).

[0134]

[0135] Among them, T end The second internal temperature, T start P is the first internal temperature. δ Δt is the power difference, Δt is the preset duration, and cm is the energy required for the chip's internal temperature to rise by 1 degree Celsius.

[0136] Optionally, the controller submodule 2202 is also configured as follows:

[0137] If the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word;

[0138] If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

[0139] Optionally, the controller submodule 2202 is further configured as follows:

[0140] The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4);

[0141]

[0142] Among them, T end The second internal temperature, T start The first internal temperature, F end For the second frequency control word, F start This is the first frequency control word, where α and β are both preset coefficients, and both α and β are related to the preset temperature.

[0143] Optionally, the frequency of the clock signal is negatively correlated with the first frequency control word.

[0144] Optionally, refer to Figure 5 Clock generator 210 is a TAF-DPS clock generator.

[0145] In this embodiment of the invention, the clock generator 210 can output a clock signal to the functional module 400 through the output terminal Out, and transmit the first frequency control word to the power calculation submodule 2201 in the control module 220, so as to calculate the power difference between the heat generation power and the heat dissipation power of the chip through the power calculation submodule 2201.

[0146] In one specific implementation, the power calculation submodule 2201 can first determine the frequency of the current clock signal based on the first frequency control word, and then determine the power difference between the chip's heat generation power and heat dissipation power based on the current clock signal frequency. Specifically, a line can be added to the clock generator 210 to send the first frequency control word to the power calculation submodule 2201 in the control module 220 after obtaining it. Then, the power calculation submodule 2201 can determine the power difference between the chip's heat generation power and heat dissipation power based on the first frequency control word and preset values ​​K and f. Δ The clock signal frequency is determined by the value or Δ value, and then the power difference between the chip's heat generation power and heat dissipation power is determined based on the current clock signal frequency.

[0147] Subsequently, the power calculation submodule 2201 can transmit the calculated power difference to the controller submodule 2202 in the control module 220. The controller submodule 2202 can then determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied by the temperature sensor 230. In this embodiment of the invention, the controller submodule 2202 can acquire the chip internal temperature collected by the temperature sensor 230 in real time and extract the required temperature value for calculation.

[0148] After determining the second internal temperature, the controller submodule 2202 can determine the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature, and feed the second frequency control word back to the clock generator 210 so that the clock generator 210 can adjust the frequency of the clock signal according to the new frequency control word to achieve the regulation of the chip's internal temperature.

[0149] In this embodiment of the invention, the power calculation submodule 2201 and the controller submodule 2202 may be configured in the same physical module in the chip, or they may be configured in different physical modules in the chip. This embodiment of the invention does not make any specific limitation on this.

[0150] It should be noted that this embodiment focuses on the hardware, circuit connection relationship and data transmission process related to the chip temperature control system. For the specific data processing part, please refer to the relevant content in the method embodiment. This embodiment will not repeat it here.

[0151] In this embodiment of the invention, the chip temperature control system first obtains a first frequency control word through a frequency-adjustable clock generator, and outputs a clock signal to the functional modules in the chip according to the first frequency control word. The frequency of the clock signal is related to the first frequency control word. Then, the control module determines the second internal temperature the chip should reach after a preset duration of the clock signal's application, based on the clock signal's frequency and the chip's first internal temperature before the frequency is applied. Furthermore, based on the first frequency control word, the first internal temperature, and the second internal temperature, a second frequency control word is determined. This second frequency control word can then be used as the new first frequency control word, and the frequency of the clock signal is adjusted by the frequency-adjustable clock generator to control the chip's internal temperature. In this embodiment, the chip's internal temperature is related to the frequency of the clock signal, and the clock signal's frequency is related to the frequency control word. By predicting the chip's internal temperature change trend and adjusting the frequency control word, the frequency of the clock signal can be adjusted, allowing the chip's internal temperature to be maintained within a suitable range, thus improving the chip's heat dissipation performance.

[0152] Example 3

[0153] This invention also discloses a chip, including the chip temperature control system described above.

[0154] Optionally, the chip may be a display chip.

[0155] In this embodiment of the invention, the chip temperature control system first obtains a first frequency control word through a frequency-adjustable clock generator, and outputs a clock signal to the functional modules in the chip according to the first frequency control word. The frequency of the clock signal is related to the first frequency control word. Then, the control module determines the second internal temperature the chip should reach after a preset duration of the clock signal's application, based on the clock signal's frequency and the chip's first internal temperature before the frequency is applied. Furthermore, based on the first frequency control word, the first internal temperature, and the second internal temperature, a second frequency control word is determined. This second frequency control word can then be used as the new first frequency control word, and the frequency of the clock signal is adjusted by the frequency-adjustable clock generator to control the chip's internal temperature. In this embodiment, the chip's internal temperature is related to the frequency of the clock signal, and the clock signal's frequency is related to the frequency control word. By predicting the chip's internal temperature change trend and adjusting the frequency control word, the frequency of the clock signal can be adjusted, allowing the chip's internal temperature to be maintained within a suitable range, thus improving the chip's heat dissipation performance.

[0156] Example 4

[0157] This invention also discloses an apparatus comprising the aforementioned chip.

[0158] Optionally, the device may be a display device.

[0159] In this embodiment of the invention, the chip temperature control system first obtains a first frequency control word through a frequency-adjustable clock generator, and outputs a clock signal to the functional modules in the chip according to the first frequency control word. The frequency of the clock signal is related to the first frequency control word. Then, the control module determines the second internal temperature the chip should reach after a preset duration of the clock signal's application, based on the clock signal's frequency and the chip's first internal temperature before the frequency is applied. Furthermore, based on the first frequency control word, the first internal temperature, and the second internal temperature, a second frequency control word is determined. This second frequency control word can then be used as the new first frequency control word, and the frequency of the clock signal is adjusted by the frequency-adjustable clock generator to control the chip's internal temperature. In this embodiment, the chip's internal temperature is related to the frequency of the clock signal, and the clock signal's frequency is related to the frequency control word. By predicting the chip's internal temperature change trend and adjusting the frequency control word, the frequency of the clock signal can be adjusted, allowing the chip's internal temperature to be maintained within a suitable range, thus improving the chip's heat dissipation performance.

[0160] For the foregoing method embodiments, in order to simplify the description, they are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, because according to the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0161] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0162] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0163] The present invention has provided a detailed description of a chip temperature control method, system, chip, and device. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A chip temperature control method, characterized in that, The method, applied to a chip temperature control system, wherein the chip temperature control system is disposed in a chip, includes: Obtain the first frequency control word; A clock signal is output according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word. Based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied, determine the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration, including: determining the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal; and determining the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied. The second frequency control word is determined based on the first frequency control word, the first internal temperature, and the second internal temperature; The second frequency control word is used as the new first frequency control word, and the step of outputting a clock signal according to the first frequency control word is returned, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal.

2. The method according to claim 1, characterized in that, Determining the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal includes: Based on the frequency of the clock signal, the power difference between the heat generation power and the heat dissipation power of the chip is determined by the following formulas (1) and (2); （1） f（2） Among them, the For the power difference, P g The heat generation power of the chip, P d The heat dissipation power of the chip is given by A, a constant coefficient is given by C, the load capacitance of the chip is given by V, the operating voltage of the chip is given by f, and the frequency of the clock signal is given by f.

3. The method according to claim 1, characterized in that, The step of determining the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied, includes: Based on the power difference and the first internal temperature of the chip before the frequency of the clock signal is applied, the second internal temperature that the chip should reach after the frequency of the clock signal has been applied for a preset duration is determined by the following formula (3). （3） Wherein, the T end The second internal temperature, T start The first internal temperature, the The power difference, the The preset duration is denoted by cm, where cm represents the energy required to raise the internal temperature of the chip by 1 degree Celsius.

4. The method according to claim 1, characterized in that, Determining the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature includes: When the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word; If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

5. The method according to claim 4, characterized in that, Determining the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature includes: The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4); （4） Wherein, the T end The second internal temperature, T start For the first internal temperature, the F end For the second frequency control word, the F start For the first frequency control word, the and stated All are preset coefficients, the and stated All of these are related to the preset temperature.

6. The method according to claim 1, characterized in that, The frequency of the clock signal is negatively correlated with the first frequency control word.

7. A chip temperature control system, characterized in that, The chip temperature control system, located within the chip, includes a frequency-adjustable clock generator, the output of which is connected to a functional module within the chip. The chip temperature control system also includes a control module and a temperature sensor, with the control module connected to both the clock generator and the temperature sensor. The clock generator is configured to acquire a first frequency control word; output a clock signal to the functional module according to the first frequency control word; the frequency of the clock signal is related to the first frequency control word; The control module is configured to determine, based on the frequency of the clock signal and the first internal temperature of the chip before the clock signal frequency is applied (collected by the temperature sensor), a second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration; and to determine the second frequency control word based on the first frequency control word, the first internal temperature, and the second internal temperature. The clock generator is further configured to use the second frequency control word as a new first frequency control word and return to the step of outputting a clock signal to the functional module according to the first frequency control word, so as to regulate the internal temperature of the chip by adjusting the frequency of the clock signal; The control module includes a power calculation submodule and a controller submodule; The power calculation submodule is configured to determine the power difference between the heat generation power and the heat dissipation power of the chip based on the frequency of the clock signal. The controller submodule is configured to determine, based on the power difference and the first internal temperature of the chip before the clock signal frequency is applied (collected by the temperature sensor), the second internal temperature that the chip should reach after the clock signal frequency has been applied for a preset duration.

8. The system according to claim 7, characterized in that, The power calculation submodule is specifically configured as follows: Based on the frequency of the clock signal, the power difference between the heat generation power and the heat dissipation power of the chip is determined by the following formulas (1) and (2); （1） f（2） Among them, the For the power difference, P g The heat generation power of the chip, P d The heat dissipation power of the chip is given by A, a constant coefficient is given by C, the load capacitance of the chip is given by V, the operating voltage of the chip is given by f, and the frequency of the clock signal is given by f.

9. The system according to claim 7, characterized in that, The controller submodule is specifically configured as follows: Based on the power difference and the first internal temperature of the chip before the frequency of the clock signal is applied, the second internal temperature that the chip should reach after the frequency of the clock signal has been applied for a preset duration is determined by the following formula (3). （3） Wherein, the T end The second internal temperature, T start The first internal temperature, the The power difference, the The preset duration is denoted by cm, where cm represents the energy required to raise the internal temperature of the chip by 1 degree Celsius.

10. The system according to claim 7, characterized in that, The controller submodule is also configured to: When the second internal temperature exceeds the preset temperature, the first frequency control word is increased according to the first frequency control word, the first internal temperature and the second internal temperature to obtain the second frequency control word; If the second internal temperature does not exceed the preset temperature, the first frequency control word is reduced according to the first frequency control word, the first internal temperature, and the second internal temperature to obtain the second frequency control word.

11. The system according to claim 10, characterized in that, The controller submodule is further configured as follows: The second frequency control word is determined according to the first frequency control word, the first internal temperature and the second internal temperature by the following formula (4); （4） Wherein, the T end The second internal temperature, T start For the first internal temperature, the F end For the second frequency control word, the F start For the first frequency control word, the and stated All are preset coefficients, the and stated All of these are related to the preset temperature.

12. The system according to claim 7, characterized in that, The frequency of the clock signal is negatively correlated with the first frequency control word.

13. The system according to claim 7, characterized in that, The clock generator is a TAF-DPS clock generator.

14. A chip, characterized in that, Includes the chip temperature control system according to any one of claims 7-13.

15. An apparatus, characterized in that, Includes the chip described in claim 14.

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