Tray lifting device of a test handler and test handler

Abstract

Embodiments of the present invention provide a pallet lifting device for a test sorting machine and the test sorting machine itself. The pallet lifting device prevents wear and damage to bushing components in test sorting machines that perform inspections of semiconductor packages under high and low temperature environments. In the test sorting machine according to the present invention, the pallet lifting device includes: a pallet mounting member for holding a test pallet; a shaft member providing a path for lifting the pallet mounting member; a guide sleeve member configured to be inserted into a through hole in the pallet mounting member and move along the shaft member; and a ring member inserted into a groove formed on the outer surface of the guide sleeve member.

Description

Technical Field

[0001] This invention relates to a pallet lifting device in a test sorting machine, and more specifically to a pallet lifting device for conveying pallets containing semiconductor packages in a test sorting machine that performs inspections on semiconductor packages under high or low temperature conditions. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. Semiconductor devices formed in this way can be manufactured into semiconductor packages through slicing, bonding, and packaging processes.

[0003] The manufactured semiconductor packages can be determined as good or bad through electrical characteristic testing. The testing process can be performed using a test sorter that sorts semiconductor packages and a tester that provides inspection signals to check the semiconductor packages.

[0004] After a semiconductor package is housed in an insertion assembly mounted in a test tray, and the external universal terminals of the semiconductor package housed in the insertion assembly are electrically connected to the tester, a test process can be performed. An interface board for connecting the semiconductor package and the tester can be installed on the side wall of the test chamber used for performing the test process. A socket board for connecting to the semiconductor package can be configured on the interface board. Simultaneously, the interface board can be connected to a tester for providing test signals to the semiconductor package.

[0005] During this testing process, trays containing semiconductor packages are vertically aligned with the interface board, requiring them to be raised and lowered to a suitable height. Typically, the tray mounting components are connected to a vertical axis via bushing components for height adjustment. However, when testing is performed in high or low temperature environments, the axis and tray mounting components deform due to low-temperature contraction or high-temperature expansion. This deformation can lead to wear and breakage of the bushing components, resulting in twisting of the tray mounting components. Summary of the Invention

[0006] Therefore, embodiments of the present invention provide a pallet lifting device in a test sorting machine that performs inspection of semiconductor packages in high and low temperature environments, which can prevent wear and damage to bushing components.

[0007] In addition, embodiments of the present invention provide a pallet lifting device in a test sorting machine that performs inspection of semiconductor packages under high and low temperature environments, which can prevent the pallet mounting components from getting stuck and twisted.

[0008] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

[0009] The pallet lifting device of the test sorting machine according to the present invention includes: a pallet mounting component on which a test pallet is placed; a shaft component providing a path for lifting the pallet mounting component; a guide sleeve component configured to be inserted into a through hole in the pallet mounting component and move along the shaft component; and a ring component inserted into a groove formed on the outer surface of the guide sleeve component.

[0010] According to an embodiment of the present invention, the diameter of the guide sleeve component may be set to be a certain value smaller than the diameter of the through hole.

[0011] According to an embodiment of the present invention, the ring component may be configured to protrude beyond the outer surface of the guide sleeve component.

[0012] According to an embodiment of the present invention, the ring component may be configured to contact the inner surface of the through hole.

[0013] According to an embodiment of the present invention, a plurality of grooves may be formed on the outer surface of the guide sleeve component, and the ring component may include a plurality of O-rings respectively inserted into the plurality of grooves.

[0014] According to an embodiment of the present invention, the pallet lifting device may further include: an inner bushing component configured to be inserted into the inner side of the guide sleeve component and in contact with the shaft component.

[0015] According to an embodiment of the present invention, the inner bushing component may be made of a polymer material with a lower coefficient of friction than the guide bushing component.

[0016] According to an embodiment of the present invention, the inner bushing component may have a partially open cylindrical shape.

[0017] According to an embodiment of the present invention, the guide sleeve component and the inner bushing component may have a partially open "C" shape.

[0018] According to another aspect of the present invention, a pallet lifting device for a test sorting machine includes: a pallet mounting component on which a test pallet is placed; a belt drive component providing power for lifting the pallet mounting component; a fixing fastener mounted in the pallet mounting component as a protrusion; a straightening fastener mounted on the belt drive component and rotatably engaged with the fixing fastener to transmit power for lifting the pallet mounting component; a shaft component providing a path for lifting the pallet mounting component; a guide sleeve component configured to be inserted into a through hole in the pallet mounting component and move along the shaft component; and a ring component inserted into a groove formed on the outer surface of the guide sleeve component.

[0019] According to an embodiment of the present invention, the correction fastening member may be configured to rotate about the fixing fastening member, such that the direction of the force applied to the pallet mounting member by the movement of the strap drive member is consistent with the direction of movement of the strap drive member.

[0020] According to an embodiment of the present invention, a mounting groove for mounting the inner bushing component may be formed at the inner center of the guide sleeve component, the inner bushing component comprising a pair of polymer bushings, each comprising a flange portion formed to be insertable into the mounting groove.

[0021] The test sorting machine according to the present invention includes: a loading section for loading or unloading semiconductor packages; a temperature-controlled chamber for preheating or precooling semiconductor packages placed in a test tray; a test chamber for pressurizing the semiconductor packages transferred from the temperature-controlled chamber to a test interface unit to perform a test; a heat-removing chamber for unloading the semiconductor packages after the test to the loading section; and a tray lifting unit for lifting the test tray in the temperature-controlled chamber or the heat-removing chamber. The tray lifting unit includes: a tray mounting member for holding the test tray; a shaft member for providing a path for lifting the tray mounting member; a guide sleeve member configured to be inserted into a through hole in the tray mounting member and move along the shaft member; and a ring member inserted into a groove formed on the outer surface of the guide sleeve member and contacting the inner wall of the through hole in the tray mounting member, thereby maintaining a certain distance between the inner wall of the through hole and the outer surface of the guide sleeve member.

[0022] According to the present invention, a ring component is joined on the outer side of the guide sleeve component, thereby forming a gap between the inner wall of the through hole of the guide sleeve component and the guide sleeve component, so that jamming and twisting of the tray mounting component can be prevented even with thermal deformation.

[0023] Furthermore, according to the present invention, an inner guide sleeve component with a relatively low coefficient of friction is combined with the inner side of the guide sleeve component, thereby preventing wear and damage to the guide sleeve component caused by friction with the shaft component.

[0024] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. Attached Figure Description

[0025] Figure 1 A schematic structure of a test sorting machine to which the present invention can be applied is shown.

[0026] Figure 2 The schematic structure of the constant temperature chamber in the test sorting machine according to the present invention is shown.

[0027] Figure 3The schematic structure of the test chamber in the test sorting machine according to the present invention is shown.

[0028] Figure 4 The schematic structure of the heat removal chamber in the test sorting machine according to the present invention is shown.

[0029] Figure 5 A pallet lifting device according to the present invention is shown.

[0030] Figure 6 This is a cross-sectional view of the guide sleeve component and shaft integrated into the pallet lifting device according to the present invention.

[0031] Figure 7a as well as Figure 7b An example of a guide sleeve component with an O-ring attached to its outer side is shown.

[0032] Figure 8 This is a diagram illustrating the floating bushing component for the through hole in a pallet lifting device.

[0033] Figure 9a as well as Figure 9b This shows another example of a partially open guide sleeve component.

[0034] Figure 10a as well as Figure 10b An example of a guide sleeve component with an O-ring attached to its inner side is shown.

[0035] Figure 11a as well as Figure 11b An example of a guide bushing component of the ball bearing type is shown.

[0036] Figure 12a as well as Figure 12b An example of a guide bushing assembly with a partially open inner bushing component is shown.

[0037] Figure 13a as well as Figure 13b An example is shown where the inner bushing component is joined to the end guide bushing component.

[0038] Figure 14 This is a flowchart of the tray transfer method according to the present invention.

[0039] Figure 15 The tray transfer process according to the present invention is shown.

[0040] Figure 16 A schematic structure of a pallet horizontal conveying device to which embodiments of the present invention can be applied is shown.

[0041] (Explanation of reference numerals in the attached diagram)

[0042] 10: Semiconductor package

[0043] 100: Test Sorting Machine

[0044] 110: Loading Unit

[0045] 120: Unloading Unit

[0046] 350: Test Interface

[0047] 20: Test tray

[0048] 200: Constant Temperature Chamber

[0049] 300: Test Chamber

[0050] 400: Heat removal chamber

[0051] 500: Pallet Lifting Device

[0052] 510, 550: Pallet mounting components

[0053] 511, 551: Guide sleeve components

[0054] 512: Ring component

[0055] 513: Inner bushing component

[0056] 514: Ball bearing components

[0057] 591, 595: Shaft components Detailed Implementation

[0058] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0059] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0060] Furthermore, in multiple embodiments, the same reference numerals are used to describe only representative embodiments of the constituent elements having the same structure, while in other embodiments only structures different from the representative embodiments are described.

[0061] In the specification as a whole, when a part is described as being "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also includes cases where other components are placed in between for "indirect connection (or combination)". Furthermore, when a part is described as "including" a constituent element, unless otherwise stated otherwise, it means that other constituent elements may be included, rather than excluding them.

[0062] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless explicitly defined in this application.

[0063] Figure 1 The outline structure of the test sorting machine 100 to which the present invention can be applied is shown. Figure 1 This is a schematic structural diagram of the test sorting machine 100 as viewed from the ceiling side. In this specification, the test sorting machine 100 refers to a device that electrically connects the semiconductor package 10 to a test interface for inspecting the function and / or performance of a semiconductor package 10 that has undergone semiconductor processing and packaging. Furthermore, for inspecting the semiconductor package 10, the test sorting machine 100 can convey the transferred semiconductor package 10 to a tray, create an environment (e.g., temperature) for inspection, classify the inspected semiconductor packages 10 according to their grade, and remove the semiconductor packages 10. This specification describes the case where the test sorting machine 100 is connected to a test apparatus via a test interface; however, the embodiments described herein are not limited to this, and the test sorting machine 100 and the test apparatus can be integrated. That is, the test sorting machine 100 can also be referred to as a test apparatus.

[0064] Reference Figure 1 The test sorting machine 100 may include a loading unit 110, a soak chamber 200, a test chamber 300, a de-soak chamber 400, and an unloading unit 120. First, a universal tray (or C-Tray) 30 containing the semiconductor package 10 to be inspected is placed into the test sorting machine 100. The loading unit 110 loads the semiconductor package 10 stored in the universal tray 30 onto the test tray (or T-Tray) 20. Here, the test tray 20 and the universal tray 30 may differ in size, the number of slots capable of accommodating the semiconductor package 10, and the distance between the slots. Although not shown, the loading unit 110 may include a pick-up device for suction of the semiconductor package 10, a drive unit for moving the pick-up device, and a moving track. The test tray 20 containing the semiconductor package 10 can be conveyed to the soak chamber 200 via a conveying device (not shown). The loading unit 110 and the unloading unit 120 may be collectively referred to as the loading unit.

[0065] The temperature-controlled chamber 200, serving as a space for storing the test tray 20, can be maintained at a temperature environment (first temperature) suitable for testing. That is, the temperature-controlled chamber 200 can store the test tray 20 transferred from the loading unit 110 at the first temperature. The first temperature is a temperature preset as a test temperature for testing the semiconductor package 10 in the test chamber 300. In other words, the first temperature can be the same as or similar to the test temperature. The test tray 20 stored in the temperature-controlled chamber 200 can be transferred to the test chamber 300 via a transfer device (not shown).

[0066] The test chamber 300 serves as a space for inspecting the semiconductor package 10 in conjunction with the test interface 350, providing an environment for testing the semiconductor package 10. The test interface 350 can contact the semiconductor package 10 to apply an electrical signal and output the signal through the semiconductor package 10 to a test apparatus (not shown). The test chamber 300 may include a semiconductor element pressurization device for pressurizing the semiconductor package 10 to bring it into contact with the test interface 350. The semiconductor package 10, after inspection in the test chamber 300, can be transferred to the heat removal chamber 400.

[0067] The heat removal chamber 400, serving as a space for storing test trays 20 containing semiconductor packages 10 that have undergone inspection, can be maintained at room temperature (second temperature). That is, the heat removal chamber 400 can store test trays 20 transferred from the test chamber 300 at this second temperature. The test trays 20 stored in the heat removal chamber 400 can be transferred to the unloading unit 120 via a transfer device. The unloading unit 120 can unload the semiconductor packages 10 from the test trays 20 transferred from the heat removal chamber 400 according to their grade.

[0068] Figure 2 The schematic structure of the constant temperature chamber 200 in the test sorting machine 100 according to the present invention is shown. Figure 2 Equivalent to Figure 1 An example of a constant temperature chamber 200 is shown.

[0069] The temperature-controlled chamber 200 provides a temperature-regulating space for adjusting the temperature of the semiconductor package 10. In the temperature-controlled chamber 200, a loading port for the test tray 20 is provided near the loading unit 110, and the test tray 20 is loaded into the temperature-controlled chamber 200 in a vertical (-Z direction) upright position. Although not shown, a rotation mechanism for rotating the test tray 20 from the horizontal (Y direction) to the vertical (Z direction) direction can be configured at the upper end of the loading port of the temperature-controlled chamber 200. A first lifting device 202 for conveying the test tray 20 into the temperature-controlled chamber 200 is configured around the loading port. The first lifting device 202 includes a first tray mounting member 204 on which the test tray 20 is placed. The test tray 20, placed in the first tray mounting member 204, is lowered by the first lifting device 202 and positioned in the tray storage member 230.

[0070] The temperature set for testing is maintained inside the thermostatic chamber 200, so that the semiconductor package 10 mounted in the test tray 20 is preheated or precooled to the test temperature while the test tray 20 is in the tray storage component 230.

[0071] The tray holding component 230 is located at the lower end of the constant temperature chamber 200, and the test tray 20 is held upright in the vertical direction (Z direction) by the tray holding component 230. The tray holding component 230 may be composed of multiple slits into which the test tray 20 can be inserted. Horizontal conveying units (not shown) can be provided at the upper and lower ends of the tray holding component 230 to collect and sequentially transfer the test trays 20. The horizontal conveying unit can hold the test trays 20 placed in the tray holding component 230 at once, move them a distance equivalent to one slot, and then release the hold. Thus, the test trays 20, which are placed first and located in the forward direction (-Y direction), are sequentially transferred to the second lifting device 220 and then moved to the test chamber 300.

[0072] After receiving the test tray 20, the second lifting device 220 raises it a predetermined distance in the vertical direction (Z direction) and then moves the test tray 20 to the test chamber 300. The second lifting device 220 includes a vertical drive shaft, i.e., a shaft component 224, and a second tray mounting component 222 configured to move vertically along the shaft component 224. On the other hand, as... Figure 2As shown, the test tray 20 can be transported to the test chamber 300 in a stacked state in the vertical direction (Z direction). That is, in one go, the test tray 20 rises to the upper position in the upper second tray mounting member 222, and then rises to a relatively low position in the lower second tray mounting member 222. The test tray 20 placed in the upper second tray mounting member 222 becomes the upper test tray 22, and the test tray 20 placed in the lower second tray mounting member 222 becomes the lower test tray 24. The upper test tray 22 and the lower test tray 24 are moved along the horizontal direction (X direction) and conveyed to the test chamber 300.

[0073] Figure 3 The schematic structure of the test chamber 300 in the test sorting machine 100 according to the present invention is shown.

[0074] Test chamber 300 can provide a test space for electrical testing of semiconductor package 10. As an example, such as... Figure 3 As shown, two test trays 22 and 24 can be supplied to the test chamber 300 in a stacked state. A test interface 350 for providing test signals for electrical testing of the semiconductor package 10 can be connected to the outside of the side wall 302 of the test chamber 300. A device under test (DUT) board 310 can be installed on the side wall 302 of the test chamber 300. The DUT board 310 has an upper opening 312 for connecting the semiconductor package 10 housed in the test tray 22 to the test interface 350 and a lower opening 314 for connecting the semiconductor package 10 housed in the lower test tray 24 to the test interface 350.

[0075] An interface board 352 for electrically connecting the semiconductor package 10 and the test interface 350 can be respectively configured in the upper opening 312 and the lower opening 314. A socket board 354 for connecting to the semiconductor package 10 can be installed on the interface board 352.

[0076] The test chamber 300 may include a pressing unit 320 for pressing the semiconductor package 10 against the socket plate 354. The pressing unit 320 may include a middle plate 324 on which a push rod 322 for pressing the semiconductor package 10 against the socket plate 354 is mounted, a drive unit 326 for applying force to the middle plate 324, and a pressure plate 328 for transmitting the applied force to the middle plate 324. Simultaneously, a conduit 330 may be connected behind the pressure plate 328 for supplying a temperature-regulating gas, such as heated air or cooling gas, to regulate the temperature of the push rod 322.

[0077] Although not shown, it may include a second tray transfer unit (not shown) for transferring the upper test tray 22 and the lower test tray 24 from the temperature-controlled chamber 200 to the interior of the test chamber 300. A guide rail 340 for guiding the upper test tray 22 and the lower test tray 24 may be installed on the inner side of the device under test board 310, and the tray transfer unit may move the upper test tray 22 and the lower test tray 24 from the second lifting device 220 to the interior of the test chamber 300 along the guide rail 340.

[0078] Figure 4 The schematic structure of the heat removal chamber 400 in the test sorter 100 according to the present invention is shown.

[0079] The heat removal chamber 400 provides a space for restoring the temperature of the semiconductor package 10 to room temperature. A third lifting device 402 may be configured on one side of the interior of the heat removal chamber 400, and a fourth lifting device 420 may be configured on the other side. Additionally, although not shown, a tray transfer unit may be included for moving the upper test tray 22 and the lower test tray 24 from the test chamber 300 into the heat removal chamber 400. The heat removal chamber 400 may also include a horizontal transfer unit (not shown) for moving the upper test tray 22 and the lower test tray 24 from the third lifting device 402 to the tray storage component 430.

[0080] Figure 5 A pallet lifting device 500 according to the present invention is shown. Figure 5 The pallet lifting device 500 is in Figure 2 An example of the second lifting device 220 described herein.

[0081] The pallet lifting device 500 according to the present invention includes pallet mounting components 510 and 550 on which a test pallet 20 is placed, shaft components 591 and 595 providing a path for lifting the pallet mounting components 510 and 550, guide sleeve components 511 and 551 configured to be inserted into through holes in the pallet mounting components 510 and 550 and move along the shaft components 591 and 595, and an annular component 512 inserted into a groove formed on the outer surface of the guide sleeve components 511 and 551. The pallet mounting components 510 and 550 include an upper pallet mounting component 510 located above and a lower pallet mounting component 550 located below. The shaft components 591 and 595 include a first shaft component 591 and a second shaft component 595 located on both sides. The guide sleeve components 511 and 551 include an upper guide sleeve component 511 inserted into a through hole in the upper pallet mounting component 510 and a lower guide sleeve component 551 inserted into a through hole in the lower pallet mounting component 550.

[0082] Additionally, the pallet lifting device 500 includes belt drive components 530 and 570 that provide power for moving pallet mounting components 510 and 550 in the vertical direction (Z direction), and alignment fastening components 540 and 580 and fixing fastening components 520 and 560 for engaging the belt drive components 530 and 570 and the pallet mounting components 510 and 550 together. The belt drive components 530 and 570 include chain components 531 and 571 whose ends are connected to each other and can rotate infinitely, and circular pulleys 535 and 575 with serrations that engage with the inner sides of the chain components 531 and 571. Alternatively, a lifting drive unit (not shown) may rotate the pulleys 535 and 575, causing the chain components 531 and 571 to rotate. Alternatively, the chain components 531 and 571 may be implemented using a belt instead of a chain.

[0083] Alternatively, the fixing fasteners 520 and 560 can be mounted as protrusions in the pallet mounting components 510 and 550, and the alignment fasteners 540 and 580 can be mounted in the belt drive components 530 and 570, with the fixing fasteners 520 and 560 connected to the alignment fasteners 540 and 580. Thus, by rotating the chain components 531 and 571, the pallet mounting components 510 and 550 can rise or fall. Here, the alignment fasteners 540 and 580 can be configured to rotate around the fixing fasteners 520 and 560, such that the direction of the force applied to the pallet mounting components 510 and 550 by the movement of the belt drive components 530 and 570 is consistent with the direction of movement of the belt drive components 530 and 570.

[0084] On the other hand, the interior of the temperature-controlled chamber 200 is maintained at a high or low temperature for the inspection of the semiconductor package 10. Recently, as the temperature range required for the semiconductor package 10 has widened, the range of temperature environments used for testing has also widened. The internal temperature of the temperature-controlled chamber 200 can be set to approximately -60°C for low-temperature testing and approximately +160°C for high-temperature testing.

[0085] In such low or high temperature environments, the components of the pallet lifting device 500 may undergo thermal deformation, such as low-temperature contraction or high-temperature expansion. For example, when the shaft components 591 and 595 are directly inserted into the through holes of the pallet mounting components 510 and 550, if the shaft components 591 and 595 expand due to high temperature, they may become stuck in the pallet mounting components 510 and 550. If the device is forcibly lifted while stuck, the components will be damaged. Conversely, if the shaft components 591 and 595 contract due to low temperature, the gap between them and the pallet mounting components 510 and 550 will increase. In this case, the pallet mounting components 510 and 550 may tilt in one direction.

[0086] The present invention provides a pallet lifting device that, while preventing damage to fittings and tilting of pallet mounting components 510, 550 due to such thermal deformation, also provides a way to prevent the pallet mounting components 510, 550 from twisting while creating a certain gap between the pallet mounting components 510, 550 and the shaft components 591, 595.

[0087] For ease of explanation, this document focuses on the case where the pallet lifting device 500 is located inside the constant temperature chamber 200. However, the pallet lifting device 500 can be located not only inside the constant temperature chamber 200 but also inside the deheating chamber 400. The pallet lifting device 500 can be implemented as a pallet lifting unit for lifting the test pallet 20 in either the constant temperature chamber 200 or the deheating chamber 400.

[0088] According to the present invention, cylindrical guide sleeve components 511 and 551 are inserted with a certain gap between them and the inner walls of the through holes of the tray mounting components 510 and 550. A ring component 512 is inserted into a groove formed on the outer wall of the guide sleeve components 511 and 551 to maintain the gap between the guide sleeve components 511 and 551 and the inner walls of the through holes of the tray mounting components 510 and 550. Therefore, even when thermal deformation occurs, the gap between the guide sleeve components 511 and 551 and the inner walls of the through holes of the tray mounting components 510 and 550 is maintained, thus preventing the tray mounting components 510 and 550 from tilting.

[0089] In addition, an inner bushing component 513 with a lower coefficient of friction than the guide sleeve components 511 and 551 is inserted into the inner wall of the guide sleeve components 511 and 551. Thus, when the shaft components 591 and 595 expand at high temperature, the inner bushing component 513 acts as a buffer, thereby preventing damage to the components.

[0090] Figure 6 This is a cross-sectional view of the guide sleeve component 511 and the shaft component 591 integrated into the pallet lifting device 500 according to the present invention. (Refer to...) Figure 6 A guide sleeve component 511 is inserted into the inner side of the pallet mounting component 510, and a ring component 512 is inserted into a groove formed in the outer side wall of the guide sleeve component 511. Additionally, an inner bushing component 513 is inserted into the inner side wall of the guide sleeve component 511. The ring component 512 may include an upper O-ring 512A located above and a lower O-ring 512B located below. By providing the upper O-ring 512A and the lower O-ring 512B respectively and enabling them to act as a buffer, it is possible to prevent the pallet mounting component 510 from wobbling around the vertical direction (Z direction).

[0091] Figure 7a as well as Figure 7b An example of a guide sleeve component 511 with a ring component 512 attached to the outside is shown. Figure 7a This is a cross-sectional view of guide sleeve component 511. Figure 7b The guide sleeve component 511 is shown as viewed from above. (Refer to...) Figure 7a as well as Figure 7b A ring member 512 is inserted into a groove formed on the outer side wall of the guide sleeve member 511. Additionally, an inner bushing member 513 is inserted into the inner side wall of the guide sleeve member 511.

[0092] like Figure 7a As shown, a mounting groove for mounting an inner bushing component 513 is formed at the center of the inner side of the guide sleeve component 511. The inner bushing component 513 includes a pair of polymer inner bushing components 513A and 513B, each including a flange portion formed to be inserted into the mounting groove. The configuration of inserting the pair of inner bushing components 513A and 513B into one guide sleeve component 511 is for ease of assembly. Simple assembly can be achieved by inserting the flange portion of one inner bushing component 513A into the inner mounting groove of the guide sleeve component 511 and then inserting the flange portion of the other inner bushing component 513B into the inner mounting groove of the guide sleeve component 511.

[0093] Reference Figure 8 The diameter (d1) of the guide sleeve component 511 is set to be smaller than the diameter (d2) of the through hole of the tray mounting component 510. That is, there is a certain gap between the outer wall of the guide sleeve component 511 and the inner wall 510A of the through hole of the tray mounting component. The ring component 512 is configured to protrude from the outer surface of the guide sleeve component 511 and contact the inner wall 510A of the through hole. Therefore, even when thermal deformation occurs, the gap between the guide sleeve component 511 and the inner wall 510A of the through hole of the tray mounting component 510 can be maintained, and the tray mounting components 510 and 550 can be prevented from tilting.

[0094] According to the present invention, a plurality of grooves are formed on the outer surface of the guide sleeve component 511, and the ring component 512 includes a plurality of O-rings 512A and 512B respectively inserted into the plurality of grooves. Since the upper O-ring 512A and the lower O-ring 512B are respectively provided, the tray mounting component 510 can be prevented from shaking about the vertical direction (Z direction) as the center.

[0095] According to the present invention, an inner bushing member 513 is provided, configured to attach to the inside of the guide sleeve member 511 and contact the shaft member 591. The inner bushing member 513 may be made of a polymer material with a lower coefficient of friction than the guide sleeve member 511. Thus, when the shaft member 591 expands at high temperature, the inner bushing member 513 acts as a buffer, thereby preventing damage to the components. On the other hand, for ease of assembly, the inner bushing member 513 may be composed of an upper inner bushing member 513A and a lower inner bushing member 513B.

[0096] In addition, such as Figure 7bAs shown, the inner bushing component 513 can have a partially open cylindrical shape. For example... Figure 7b In this way, by configuring the inner bushing member 513 to be open by about 5° in a local area, the inner bushing member 513 can make uniform contact with the shaft member 591 and the guide bushing member 511 even when the guide bushing member 511 shrinks at low temperature.

[0097] Figure 9a as well as Figure 9b The guide sleeve component 511 is shown in a partially open form. (See reference...) Figure 9a as well as Figure 9b The guide sleeve component 511 and the inner bushing component 513 have a "C" shape with a partial opening of 90°. Then, a ring component 512 is inserted into a groove formed on the outer surface of the guide sleeve component 511, which can also have a "C" shape with a partial opening of 90°. This is achieved through... Figure 9a as well as Figure 9b The guide sleeve component 511 is configured in such a way that even if thermal deformation occurs, the inner bushing component 513 can uniformly contact the shaft component 591 and the ring component 512 can uniformly contact the inner wall of the through hole of the tray mounting component 510.

[0098] On the other hand, not only the ring member 512 is inserted into the groove on the outer surface of the guide sleeve member 511 as described above, but guide sleeve members 511 with various structures can also be used.

[0099] Reference Figure 10a as well as Figure 10b Alternatively, multiple grooves can be formed on the inner wall of the guide sleeve component 511, and a ring component 512 can be inserted into each groove. The ring component 512 may include an upper O-ring 512A inserted into the upper groove and a lower O-ring 512B inserted into the lower groove. After the ring component 512 is inserted into the groove on the inner wall of the guide sleeve component 511, the inner bushing component 513 is inserted into the interior of the guide sleeve component 511. For ease of assembly, the inner bushing component 513 may be configured as an upper inner bushing component 513A and a lower inner bushing component 513B.

[0100] like Figure 11a as well as Figure 11b In that case, a ball bearing type guide sleeve component 511 can be used. (See reference...) Figure 11a as well as Figure 11b The guide sleeve component 511 may include a ball bearing component 514 configured to rotate with its inner surface in contact with the shaft component 591 and the inner wall of the through hole of the tray mounting component 510.

[0101] Can be used as Figure 12a as well as Figure 12b The guide sleeve component 511 is combined with an inner bushing component 513 that is partially open at approximately 90 degrees. It can be used as follows: Figure 13a as well as Figure 13b Thus, the guide sleeve component 511 is respectively coupled with the inner bushing component 513 at the end.

[0102] Figure 14 This is a flowchart of a tray transfer method according to the present invention. The tray transfer method according to the present invention includes the steps of placing a test tray 20 into a constant temperature chamber 200 (S1410), adjusting the temperature of the semiconductor package 10 mounted in the test tray 20 to a set test temperature (S1420), positioning the test tray 20 in tray mounting members 510, 550 (S1430), raising the tray mounting members 510, 550 along shaft members 591, 595 (S1440), and transferring the test tray 20 to the test chamber 300 (S1450). Here, guide sleeve members 511, 551 are provided, configured to be inserted into through holes in the tray mounting members 510, 550 and move along shaft members 591, 595, and ring members 512 are inserted into grooves formed on the outer surfaces of the guide sleeve members 511, 551.

[0103] Reference Figure 15 To illustrate, the test tray 20 is conveyed vertically into the temperature-controlled chamber 200 (A). While the test tray 20 is held in the tray holding member 230, the temperature of the semiconductor package 10 is preheated or precooled to the test temperature (B). If the test tray 20 is conveyed to the tray mounting members 510 or 550, the tray mounting members 510 or 550 rise and the test tray 20 is positioned at the upper or lower end (C). Afterward, the test tray 20 moves horizontally and is conveyed into the test chamber 300 (D) for testing.

[0104] Figure 16 A schematic structure of a pallet horizontal conveying device to which embodiments of the present invention can be applied is shown. Figure 16 It is shown in Figure 2 The bushing device according to an embodiment of the present invention is applied to the apparatus for horizontally conveying the tray 20 described herein. Specifically, Figure 16 This is a diagram illustrating a horizontal conveying device for moving the pallet 20 slot by slot in a pallet holding component 230 that holds the pallet 20 vertically. Figure 16 The guide sleeve component 511, in which the ring component 512 of the present invention is installed in the outline, can also be used in such a horizontal conveying device.

[0105] Reference Figure 16The pallet holding component 230 is configured to move vertically, and the horizontal conveying device is configured to move horizontally. When a pallet 20 is to be moved one slot, the clamps 232, coupled to the horizontal drive shaft 234, grip each pallet 20 at its lower end, the pallet holding component 230 descends, and the pallet 20 is gripped by the clamps 232. Then, the clamps 232 move horizontally along the horizontal drive shaft 234 via the horizontal drive unit 236, and the pallet 20 also moves horizontally via the clamps 232. Once the pallet has moved one slot distance, the pallet holding component 230 rises to support each pallet 20 below, the clamps 232 release their grip, and the pallet 20 is supported by the pallet holding component 230. The uppermost pallet 20 is then conveyed to… Figure 2 The second lifting device 220.

[0106] On the other hand, the horizontal drive shaft 234 moves horizontally by contacting a bushing installed in a hole formed in the wall of the chamber. Similarly, the interior of the thermostatic chamber 200 is conditioned from a low temperature to a high temperature environment, so in the case of a normal bushing, the horizontal drive shaft 234 may twist or rub and be damaged due to thermal deformation.

[0107] Therefore, according to an embodiment of the present invention, the guide sleeve member 511 may be disposed inside the chamber wall, and the ring member 512 may be inserted into a groove formed on the outer peripheral surface of the guide sleeve member 511. In addition, the inner bushing member 513 of polymer material for preventing friction and damage to the horizontal drive shaft 234 may be configured to be inserted into the inner side of the guide sleeve member 511 and contact the horizontal drive shaft 234.

[0108] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0109] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. A pallet lifting device, which is a pallet lifting device for a test sorting machine, wherein, The pallet lifting device includes: The tray mounting component is used to place the test tray. A shaft component provides a path for lifting and lowering the pallet mounting component; The guide sleeve component is configured to be inserted into the through hole of the tray mounting component and move along the shaft component; A ring component, inserted into a groove formed on the outer surface of the guide sleeve component; and The inner bushing component is configured to be inserted inside the guide bushing component and contact the shaft component. The inner bushing component has a cylindrical shape with a partially open cross-section when viewed from the vertical direction of the test tray as it is being lifted and lowered.

2. The pallet lifting device according to claim 1, wherein, The diameter of the guide sleeve component is set to be a certain value smaller than the diameter of the through hole.

3. The pallet lifting device according to claim 2, wherein, The ring component is configured to protrude beyond the outer surface of the guide sleeve component.

4. The pallet lifting device according to claim 3, wherein, The ring component is configured to contact the inner surface of the through hole.

5. The pallet lifting device according to claim 1, wherein, Multiple grooves are formed on the outer surface of the guide sleeve component. The ring component includes a plurality of O-rings that are respectively inserted into the plurality of slots.

6. The pallet lifting device according to claim 1, wherein, The inner bushing component is made of a polymer material with a lower coefficient of friction than the guide bushing component.

7. The pallet lifting device according to claim 1, wherein, The guide sleeve component and the inner bushing component have a partially open "C" shape.

8. A pallet lifting device, which is a pallet lifting device for a test sorting machine, wherein, The pallet lifting device includes: The tray mounting component is used to place the test tray. A belt drive component provides power for lifting and lowering the pallet mounting component; The fastening component is mounted in a protruding manner within the tray mounting component; The fastening component is mounted on the belt drive component and is rotatably engaged with the fixing fastening component to transmit power for lifting and lowering the pallet mounting component; A shaft component provides a path for lifting and lowering the pallet mounting component; The guide sleeve component is configured to be inserted into the through hole of the tray mounting component and move along the shaft component; A ring component, inserted into a groove formed on the outer surface of the guide sleeve component; and The inner bushing component is configured to be inserted inside the guide bushing component and contact the shaft component. The inner bushing component has a cylindrical shape with a partially open cross-section when viewed from the vertical direction of the test tray as it is being lifted and lowered.

9. The pallet lifting device according to claim 8, wherein, The correction fastening member is configured to rotate about the fixing fastening member, such that the direction of the force applied to the tray mounting member by the movement of the belt drive member is consistent with the direction of movement of the belt drive member.

10. The pallet lifting device according to claim 8, wherein, The diameter of the guide sleeve component is set to be a certain value smaller than the diameter of the through hole.

11. The pallet lifting device according to claim 9, wherein, The ring component is configured to protrude beyond the outer surface of the guide sleeve component and contact the inner surface of the through hole.

12. The pallet lifting device according to claim 8, wherein, Multiple grooves are formed on the outer surface of the guide sleeve component. The ring component includes a plurality of O-rings that are respectively inserted into the plurality of slots.

13. The pallet lifting device according to claim 8, wherein, The inner bushing component is made of a polymer material with a lower coefficient of friction than the guide bushing component.

14. The pallet lifting device according to claim 13, wherein, A mounting groove for mounting the inner bushing component is formed at the center of the inner side of the guide sleeve component. The inner bushing component includes a pair of polymer bushings, each comprising a flange portion formed to be inserted into the mounting groove.

15. The pallet lifting device according to claim 13, wherein, The guide sleeve component and the inner bushing component have a partially open "C" shape.

16. A testing and sorting machine, comprising: Loading section, used for loading or unloading semiconductor packages; A temperature-controlled chamber for preheating or precooling semiconductor packages placed in a test tray; The test chamber pressurizes the semiconductor package transferred from the temperature-controlled chamber to the test interface unit to perform the test; After removing the thermal chamber, the semiconductor package that has completed the test is moved to the loading section; as well as The tray lifting unit raises and lowers the test tray within the constant temperature chamber or the deheating chamber. The pallet lifting unit includes: The tray mounting component is used to place the test tray. A shaft component provides a path for lifting and lowering the pallet mounting component; The guide sleeve component is configured to be inserted into the through hole of the tray mounting component and move along the shaft component; A ring component is inserted into a groove formed on the outer surface of the guide sleeve component and contacts the inner wall of the through hole of the tray mounting component, thereby maintaining a certain distance between the inner wall of the through hole and the outer surface of the guide sleeve component; and The inner bushing component is configured to be inserted inside the guide bushing component and contact the shaft component. The inner bushing component has a cylindrical shape with a partially open cross-section when viewed from the vertical direction of the test tray as it is being lifted and lowered.

17. The test sorting machine according to claim 16, wherein, The inner bushing component is made of a polymer material with a lower coefficient of friction than the guide bushing component.

Images