A soldering apparatus for semiconductor packaging

Abstract

This utility model discloses a semiconductor packaging welding device, including a base plate, a horizontal plate fixedly connected to the upper surface of the base plate, support frames I fixedly connected to both ends of the horizontal plate, one end of the support frame I fixedly connected to the upper surface of the base plate, vertical plates symmetrically fixedly connected to the upper surface of the horizontal plate, semiconductors disposed on the inner side of the vertical plates, a strip-shaped through hole opened inside the horizontal plate, a pushing mechanism slidably connected inside the strip-shaped through hole, a welding plate disposed on one side of the horizontal plate, a driving mechanism disposed on the lower surface of the welding plate, a welding assembly disposed above the welding plate, and sliding grooves II symmetrically opened on the upper surface of the base plate, a sliding frame slidably connected inside the sliding grooves II. This device solves the problem of traditional semiconductor welding devices requiring manual operation for loading and unloading semiconductors, avoiding wasted power and manpower, and enabling automatic loading and unloading of semiconductors, while improving the efficiency of semiconductor packaging welding and the automation level of the welding device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a welding device for semiconductor packaging. Background Technology

[0002] With the continuous development of modern electronic and information technologies, intelligent electronic devices are increasingly appearing in people's lives. Semiconductor chips are being used more and more frequently, and their importance in electronic devices is growing daily, with broad application prospects. A semiconductor chip is a semiconductor device that performs a certain function by etching and wiring on a semiconductor wafer. Common semiconductor materials, besides silicon chips, include gallium arsenide and germanium. In the semiconductor chip manufacturing process, installing and fixing the leads on the chip's edge is a crucial step.

[0003] Currently, welding is the most common method. During welding, the operator typically places the semiconductor chip under the welding head, then activates the drive assembly to bring the welding head into contact with the chip for welding. After welding, the semiconductor chip is usually replaced manually before the next round of welding. This method not only wastes the power of the drive assembly, failing to utilize the downward displacement of the drive assembly to automatically move the semiconductor chip for welding and unloading, but also consumes a lot of manpower. The process of unloading after installation is extremely inconvenient, making it difficult to meet the needs of high-efficiency production and reducing the efficiency of semiconductor packaging welding and the automation level of the welding equipment. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this utility model provides a semiconductor packaging welding device that solves the problem of requiring manual operation for loading and unloading semiconductors in traditional semiconductor welding devices. This avoids wasting power and manpower on the welding device and enables automatic loading and unloading of semiconductors, thereby improving the efficiency of semiconductor packaging welding and the degree of automation of the welding device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging welding device includes a base plate, a horizontal plate fixedly connected to the upper surface of the base plate, and support frames I fixedly connected to both ends of the horizontal plate. One end of the support frame I is fixedly connected to the upper surface of the base plate. Vertical plates are symmetrically fixedly connected to the upper surface of the horizontal plate, and semiconductors are disposed on the inner side of the vertical plates. A strip-shaped through hole is opened inside the horizontal plate, and a pushing mechanism is slidably connected inside the strip-shaped through hole. A welding plate is disposed on one side of the horizontal plate, and a driving mechanism is disposed on the lower surface of the welding plate. A welding assembly is disposed above the welding plate. The upper surface of the plate is symmetrically provided with sliding grooves II, and a sliding frame is slidably connected inside the sliding grooves II. A pushing mechanism is symmetrically fixedly connected to one end of the sliding frame. A support plate is fixedly installed on one side of the horizontal plate, and a motor I is fixedly connected to one side surface of the support plate. A turntable is fixedly connected to one end of the motor I, and a push plate I and a push plate II are rotatably connected to one side surface of the turntable. One end of the push plate I and the push plate II are located at the same point, and one end of the push plate I is rotatably connected to the pushing mechanism inside the strip-shaped through hole through a crossbar I. One end of the push plate II is rotatably connected to the pushing mechanism on the upper surface of one end of the sliding frame through a crossbar II.

[0006] Preferably, the pushing mechanism includes a base, and a push plate is rotatably connected inside the base. A roller is fixedly installed on the upper end of the push plate, and torsion springs are symmetrically installed on both sides of the lower end of the push plate.

[0007] Preferably, the upper surface of the base plate is provided with a sliding groove I, and the sliding groove I is aligned with the strip-shaped through hole. A slider is slidably connected inside the sliding groove I, and the upper end of the slider is fixedly connected to the bottom of the pushing mechanism inside the strip-shaped through hole.

[0008] Preferably, the driving mechanism includes a half gear, and the half gear is fixedly connected to the lower surface of the welding plate through a rotating shaft. The lower end of the rotating shaft is rotatably connected to the upper surface of the base plate. A gear is meshed with the side surface of the half gear, and a motor II is fixedly connected to the lower surface of the gear through a driving shaft. The motor II is fixedly connected to the lower surface of the base plate.

[0009] Preferably, the welding mechanism includes a support frame II, and both ends of the support frame II are fixedly connected to the upper surface of the base plate. A welding head is fixedly installed inside the support frame II, and the lower end of the welding head is aligned with the welding plate.

[0010] Preferably, the two sides of the horizontal plate are symmetrically fixedly connected to supporting side plates, and the inside of the supporting side plates are symmetrically slidably connected to sliding rods. One end of the sliding rod is fixedly connected to a spring, and the other end of the spring is fixedly connected to the outer surface of the supporting side plate. The other end of the sliding rod is fixedly connected to a clamping frame, and multiple sets of guide wheels are installed inside the clamping frame.

[0011] This invention provides a welding apparatus for semiconductor packaging. Compared with the prior art, it has the following advantages:

[0012] 1. The feeding mechanism inside the strip-shaped through hole and the feeding mechanism symmetrically arranged on the upper surface of one end of the sliding frame, together with the motor I, turntable and push plate I and push plate II rotatably connected to one side surface of the turntable mounted on the upper end of the support plate, as well as the cross bar I and cross bar II at one end of push plate I and push plate II, cooperate with each other to solve the problem of manual operation of feeding and unloading semiconductors in traditional semiconductor welding equipment. This avoids the waste of power and manpower in the welding equipment, and enables automatic feeding and unloading of semiconductors, thereby improving the efficiency of semiconductor packaging welding and the degree of automation of the welding equipment.

[0013] 2. Secondly, the support side plates symmetrically connected to the two sides of the horizontal plate and the clamping frame at one end of the sliding rod inside the support side plates cooperate with the guide wheel installed inside the clamping frame to limit the semiconductor inside the vertical plate, preventing the semiconductor from shifting during the pushing process, which would reduce the precision of semiconductor welding and improve the welding quality of the semiconductor. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This utility model Figure 1 A schematic diagram of the side view structure;

[0016] Figure 3 This utility model Figure 1 A three-dimensional structural diagram of the middle horizontal plate;

[0017] Figure 4 This utility model Figure 1 Schematic diagram of the connection structure between the pusher mechanism and the turntable;

[0018] Figure 5 This utility model Figure 4 Enlarged structural diagram of the central base.

[0019] In the diagram: 1. Base plate; 101. Slide groove I; 102. Slide groove II; 2. Support plate; 201. Motor I; 202. Turntable; 203. Push plate I; 204. Crossbar I; 205. Push plate II; 206. Crossbar II; 3. Horizontal plate; 301. Vertical plate; 302. Support frame I; 303. Strip through hole; 304. Guide wheel; 305. Support side plate; 306. Slide bar; 307. Spring; 308. Clamping frame; 4. Semiconductor; 5. Support frame II; 501. Welding head; 6. Welding plate; 7. Motor II; 701. Half gear; 702. Gear; 8. Sliding frame; 9. Base; 901. Push plate; 902. Torsion spring; 903. Roller. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-5 This utility model provides a technical solution: a semiconductor packaging welding device, including a base plate 1, a horizontal plate 3 fixedly connected to the upper surface of the base plate 1, support frames I 302 fixedly connected to both ends of the horizontal plate 3, one end of the support frame I 302 fixedly connected to the upper surface of the base plate 1, vertical plates 301 symmetrically fixedly connected to the upper surface of the horizontal plate 3, semiconductors 4 disposed on the inner side of the vertical plates 301, a strip-shaped through hole 303 opened inside the horizontal plate 3, a pushing mechanism slidably connected inside the strip-shaped through hole 303, a welding plate 6 disposed on one side of the horizontal plate 3, a driving mechanism disposed on the lower surface of the welding plate 6, a welding assembly disposed above the welding plate 6, and symmetrically opened sliding grooves II 102 on the upper surface of the base plate 1. The sliding frame 8 is slidably connected inside the slide chute II 102. A pushing mechanism is symmetrically fixedly connected to one end of the sliding frame 8. A support plate 2 is fixedly installed on one side of the horizontal plate 3. A motor I 201 is fixedly connected to one side surface of the support plate 2. A turntable 202 is fixedly connected to one end of the motor I 201. A push plate I 203 and a push plate II 205 are rotatably connected to one side surface of the turntable 202. One end of the push plate I 203 and the push plate II 205 are located at the same point. One end of the push plate I 203 is rotatably connected to the pushing mechanism inside the strip-shaped through hole 303 through the cross bar I 204. One end of the push plate II 205 is rotatably connected to the pushing mechanism on the upper surface of one end of the sliding frame 8 through the cross bar II 206.

[0022] As a technical optimization of this utility model, the feeding mechanism includes a base 9, a push plate 901 is rotatably connected inside the base 9, a roller 903 is fixedly installed on the upper end of the push plate 901, and torsion springs 902 are symmetrically installed on both sides of the lower end of the push plate 901. By connecting the push plate 901 inside the base 9 in the feeding mechanism with one side surface of the turntable 202, push plate I 203 and push plate II 205 are obtained to cooperate with each other, so that semiconductors can be fed and unloaded at the same time, thus avoiding manual operation and improving the semiconductor welding efficiency.

[0023] As a technical optimization of this utility model, a sliding groove I101 is provided on the upper surface of the base plate 1. The sliding groove I101 is aligned with the strip-shaped through hole 303. A slider is slidably connected inside the sliding groove I101. The upper end of the slider is fixedly connected to the bottom of the pushing mechanism inside the strip-shaped through hole 303. The sliding groove I101 and the slider can limit the pushing mechanism inside the strip-shaped through hole 303, thereby improving the motion stability of the pushing mechanism inside the strip-shaped through hole 303.

[0024] As a technical optimization of this utility model, the driving mechanism includes a half gear 701. The half gear 701 is fixedly connected to the lower surface of the welding plate 6 through a rotating shaft. The lower end of the rotating shaft is rotatably connected to the upper surface of the base plate 1. A gear 702 is meshed with the side surface of the half gear 701. A motor II 7 is fixedly connected to the lower surface of the gear 702 through a driving shaft. The motor II 7 is fixedly connected to the lower surface of the base plate 1. The driving mechanism can drive the welding plate 6 to rotate, thereby facilitating welding at different positions on the semiconductor 4.

[0025] As a technical optimization of this utility model, the welding mechanism includes a support frame II5. The two ends of the support frame II5 are fixedly connected to the upper surface of the base plate 1. A welding head 501 is fixedly installed inside the support frame II5. The lower end of the welding head 501 is aligned with the welding plate 6. The semiconductor 4 can be welded through the welding head 501.

[0026] As a technical optimization of this utility model, support side plates 305 are symmetrically fixedly connected to both sides of the horizontal plate 3. Slide rods 306 are symmetrically slidably connected inside the support side plates 305. A spring 307 is fixedly connected to one end of the slide rod 306, and the other end of the spring 307 is fixedly connected to the outer surface of the support side plate 305. A clamping frame 308 is fixedly connected to the other end of the slide rod 306. Multiple sets of guide wheels 304 are installed inside the clamping frame 308. The guide wheels 304 and the springs 307 on the side surface of the slide rod 306 can position semiconductors 4 of different sizes, improve the stability of semiconductor 4 during transmission, and avoid movement errors after semiconductor 4 moves to the upper surface of the welding plate 6, which would lead to a reduction in welding accuracy.

[0027] In use, the semiconductor 4 is first placed inside the upright plate 301. The semiconductor 4 will then fall inside the guide wheel 304 and be clamped and positioned by it. The operator then starts the motor I 201 on the upper end of the support plate 2. The motor I 201 then drives the pusher plate I 203 and pusher plate II 205 to rotate via the turntable 202. During the rotation of the pusher plate I 203, the pusher mechanism inside the strip-shaped through-hole 303 is pulled along the strip-shaped through-hole 303 by the crossbar I 204. At this time, the pusher plate 901 and roller 903 in the pusher mechanism will push the semiconductor 4 to move. When the pusher mechanism inside the strip-shaped through-hole 303 moves to one end of the horizontal plate 3, it will push the semiconductor 4 above the welding plate 6. Simultaneously, the sliding frame 8 will move along the slide groove II 102 to one end of the bottom plate 1. Then, the operator starts the welding mechanism, which uses the welding head 501 to cut the semiconductor 4 in half. Conductor 4 is welded. During the welding process, the operator can start motor II 7 in the drive mechanism. At this time, motor II 7 drives the welding plate 6 and semiconductor 4 to rotate through half gear 701 and gear 702. Therefore, welding can be performed on different positions of semiconductor 4. When the welding contacts, the operator starts motor I 201 again. At this time, motor I 201 will drive the pusher mechanism and sliding frame 8 back to their original positions. When the pusher plate 901 in the pusher mechanism touches semiconductor 4 during the return to its original position, it will rotate and be compressed on the lower surface of semiconductor 4. When it passes semiconductor 4, it will stand up again due to the elastic force of torsion spring 902. When the semiconductor 4 inside the upright plate 301 is pushed again, the pusher mechanism symmetrically set at the other end of the sliding frame 8 will push away the semiconductor 4 welded on the upper surface of the welding plate 6 for unloading. At the same time, the semiconductor 4 on the upper surface of the horizontal plate 3 is pushed back to the upper surface of the welding plate 6 for welding.

[0028] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A soldering apparatus for semiconductor packaging comprising a base plate (1), characterized in that: A horizontal plate (3) is fixedly connected to the upper surface of the base plate (1), and a support frame I (302) is fixedly connected to both ends of the horizontal plate (3). One end of the support frame I (302) is fixedly connected to the upper surface of the base plate (1). A vertical plate (301) is symmetrically fixedly connected to the upper surface of the horizontal plate (3), and a semiconductor (4) is provided on the inner side of the vertical plate (301). A strip-shaped through hole (303) is opened inside the horizontal plate (3), and a pushing mechanism is slidably connected inside the strip-shaped through hole (303). A welding plate (6) is provided on one side of the horizontal plate (3), and a driving mechanism is provided on the lower surface of the welding plate (6). A welding assembly is provided above the welding plate (6). A sliding groove II (102) is symmetrically opened on the upper surface of the base plate (1), and the sliding groove II (102) is slidably connected inside. There is a sliding frame (8), and a pushing mechanism is symmetrically fixedly connected to one end of the sliding frame (8). A support plate (2) is fixedly installed on one side of the horizontal plate (3), and a motor I (201) is fixedly connected to one side surface of the support plate (2). A turntable (202) is fixedly connected to one end of the motor I (201), and a push plate I (203) and a push plate II (205) are rotatably connected to one side surface of the turntable (202). One end of the push plate I (203) and the push plate II (205) are located at the same point. One end of the push plate I (203) is rotatably connected to the pushing mechanism inside the strip through hole (303) through the cross bar I (204), and one end of the push plate II (205) is rotatably connected to the pushing mechanism on the upper surface of one end of the sliding frame (8) through the cross bar II (206).

2. The soldering apparatus for semiconductor packaging according to claim 1, wherein: The pushing mechanism includes a base (9), and a push plate (901) is rotatably connected inside the base (9). A roller (903) is fixedly installed on the upper end of the push plate (901), and torsion springs (902) are symmetrically installed on both sides of the lower end of the push plate (901).

3. The soldering apparatus for semiconductor packaging according to claim 1, wherein: The upper surface of the base plate (1) is provided with a sliding groove I (101), and the sliding groove I (101) is aligned with the strip-shaped through hole (303). A slider is slidably connected inside the sliding groove I (101), and the upper end of the slider is fixedly connected to the bottom of the pushing mechanism inside the strip-shaped through hole (303).

4. The soldering apparatus for semiconductor packaging according to claim 1, wherein: The drive mechanism includes a half gear (701), and the half gear (701) is fixedly connected to the lower surface of the welding plate (6) through a rotating shaft. The lower end of the rotating shaft is rotatably connected to the upper surface of the base plate (1). The side surface of the half gear (701) is meshed with a gear (702), and the lower surface of the gear (702) is fixedly connected to a motor II (7) through a drive shaft. The motor II (7) is fixedly connected to the lower surface of the base plate (1).

5. The soldering apparatus for semiconductor packaging according to claim 1, wherein: It also includes a welding mechanism, which includes a support frame II (5), and both ends of the support frame II (5) are fixedly connected to the upper surface of the base plate (1). A welding head (501) is fixedly installed inside the support frame II (5), and the lower end of the welding head (501) is aligned with the welding plate (6).

6. The semiconductor packaging welding apparatus according to claim 1, characterized in that: The two sides of the horizontal plate (3) are symmetrically fixedly connected to support side plates (305), and the inside of the support side plates (305) is symmetrically slidably connected to slide rods (306). One end of the slide rod (306) is fixedly connected to a spring (307), and the other end of the spring (307) is fixedly connected to the outer surface of the support side plate (305). The other end of the slide rod (306) is fixedly connected to a clamping frame (308), and multiple sets of guide wheels (304) are installed inside the clamping frame (308).

Images