Non-invasive laser package and method of use

Abstract

The application relates to a non-damage laser package device and a use method, and belongs to the technical field of semiconductor laser package. The device comprises a suction nozzle module, a clamping module, a moving module and a fixing frame. A ball screw A is horizontally arranged at the top end of the fixing frame, the ball screw A is connected with a screw motor A, the ball screw A is connected with a ball screw B through a screw nut A, the ball screw B is connected with a screw motor B, the ball screw B is vertically arranged, the ball screw B is connected with the moving module through a screw nut B, and the moving module is respectively provided with the suction nozzle module and the clamping module. The laser chip is clamped through the suction nozzle module and the clamping module, damage to the surface of the laser chip or film pollution is avoided, the laser chip is stably moved during the clamping process, position deviation does not occur, the die bonding precision and quality are improved, and the package quality of the semiconductor laser is improved.

Description

Technical Field

[0001] This invention relates to a non-destructive laser packaging device and its usage method, belonging to the field of semiconductor laser packaging technology. Background Technology

[0002] Currently, in semiconductor laser packaging, the laser chip mounting method involves a pin lifting the laser chip from a thin film, followed by a metal suction nozzle picking up the chip from above, and finally die bonding to mount the laser chip onto a heat sink, completing the semiconductor laser packaging. This method carries the following risks: First, damage risk: because the pin lifts the chip from the thin film, there is a risk of damaging the laser chip surface, affecting subsequent performance. Second, contamination risk: the pin may damage the thin film, leaving film residue on the laser chip, causing contamination. Third, die bonding accuracy error risk: the laser chip may slightly shift during pin lifting, causing deviations in its mounting position on the heat sink, resulting in die bonding accuracy errors. Fourth, die bonding void risk: due to damage and film contamination, there is a risk of voids forming at the damaged and contaminated sites during die bonding, thus impairing laser performance and lifespan.

[0003] Chinese patent document CN110890295A discloses a fixture for mounting multiple laser chips, including a substrate and a spring block. The substrate surface has a through hole. An optical positioning point a is located on the upper right side of the top surface of the substrate, and an optical positioning point b is located on the lower right side of the top surface of the substrate. Both optical positioning points a and b are "L"-shaped. A limiting block a is located on the upper left side of the through hole. The bottom of the limiting block a has a rubber layer made of anti-static rubber. The right side of the rubber layer has a chamfer to prevent wear on the chip surface during chip mounting. A limiting block b is located on the right side of the limiting block a. A spring block is located in the middle of the bottom of the through hole. The limiting blocks a, b, and spring block are all fixed to the back of the substrate. A protrusion is located inside the spring block, allowing it to move up and down within the spring block. A spring is located at the bottom of the protrusion. This fixture can clamp multiple laser chips at once. However, since the laser chips are clamped using springs, the clamping force is difficult to adjust, and the elasticity of the springs changes after prolonged use, affecting the clamping effect. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a non-destructive laser packaging device that avoids damage or thin-film contamination to the surface of the laser chip, improves die bonding accuracy and quality, and thus improves the packaging quality of semiconductor lasers.

[0005] The present invention also provides a method for using the above-mentioned non-destructive laser packaging device.

[0006] The technical solution of the present invention is as follows:

[0007] A non-destructive laser packaging device includes a nozzle module, a gripping module, a moving module, and a fixing frame. A ball screw A is horizontally mounted on the top of the fixing frame, connected to a screw motor A. Ball screw A is connected to ball screw B via a screw nut A, and ball screw B is connected to a screw motor B. Ball screw B is vertically mounted and connected to the moving module via a screw nut B. The moving module has both the nozzle module and the gripping module mounted on it. The horizontal movement of the moving module is achieved via ball screw A, and the vertical movement is achieved via ball screw B, ensuring precise gripping of the laser chip.

[0008] Preferably, the moving module is a hollow cuboid, with a suction nozzle module located at the bottom center of the moving module, and a gripping module located inside the moving module.

[0009] Preferably, the suction nozzle module includes a suction nozzle, the upper end of which is a hollow cylinder and the lower end is a hollow cone. An opening is provided at the apex of the cone. The suction nozzle is connected to a vacuum pump via a solenoid valve. Suction is provided by the vacuum pump.

[0010] Further preferred, the upper part of the nozzle is made of metal, and the lower part is made of high-temperature resistant resin.

[0011] Preferably, the gripping module includes a stepper motor, gears, a vertical slider, a vertical slide rail, a horizontal slider, a horizontal slide rail, a first gripping arm, and a second gripping arm. A vertical slide rail is located in the middle of the moving module, and a vertical slider is mounted on the vertical slide rail. A gear groove is provided on the vertical slider. A stepper motor is located at the top of the moving module, and the stepper motor is connected to the vertical slider via gears. The forward and reverse rotation of the stepper motor drives the vertical slider to move up and down. Horizontal slide rails are arranged side-by-side on both sides of the vertical slider, and horizontal sliders are mounted on the horizontal slide rails. A first gripping arm and a second gripping arm are vertically mounted on the horizontal sliders on both sides. The first and second gripping arms are connected to the vertical slider via connecting rods. When the vertical slider moves down, the connecting rods move the first and second gripping arms closer together, clamping the laser chip. When the vertical slider moves up, the connecting rods move the first and second gripping arms away from each other, releasing the laser chip.

[0012] In a further preferred embodiment, the lower end of the first gripping arm is inclined, and a gripping block is provided at the bottom end of the first gripping arm. The first gripping arm and the second gripping arm have the same structure. When the first gripping arm and the second gripping arm are close to each other, the laser chip is clamped by the gripping block.

[0013] Preferably, the first and second gripping arms are made of high-temperature resistant resin material.

[0014] Preferably, a camera is provided at the top of the ball screw B, and the camera and the suction nozzle are located on the same center line. When in use, the camera is aligned with the laser chip to observe the position of the laser chip.

[0015] Preferably, the lead screw motor A, lead screw motor B, stepper motor and camera are all connected to a computer control system.

[0016] The operating steps for using the above-mentioned non-destructive laser packaging device are as follows:

[0017] (1) Expand and fix the thin film with the laser chip;

[0018] (2) Take the laser chip. Ball screw A drives the moving module to move horizontally, and ball screw B drives the moving module to move vertically. The movement of the moving module drives the suction nozzle to move, so that the suction nozzle contacts the laser chip. The vacuum pump starts and clamps the laser chip. Then the stepper motor starts and drives the vertical slider to move down. Through the connecting rod, the first clamping arm and the second clamping arm move closer and clamp the side of the laser chip. Then the moving module rises. Under the simultaneous action of vacuum suction and clamping force, the laser chip is removed from the film. There is no position or angle movement during the laser chip peeling process.

[0019] (3) Die bonding: Adjust the position of the moving module and move the laser chip to the heat sink to be bonded. Solder is placed on the heat sink. When the laser chip descends to 20-50um above the solder, reduce the descent speed. When the laser chip contacts the solder, the vacuum pump stops running, the suction force of the nozzle disappears, and the vertical slider moves up. The first and second clamping arms are moved away from each other by the connecting rod. The clamping force of the laser chip disappears, and the laser chip is freely wetted by the solder.

[0020] (4) After the laser chip and solder are freely immersed, the die-bonded product is removed and transferred to the next process.

[0021] The beneficial effects of this invention are as follows:

[0022] 1. This invention uses a suction module and a clamping module to clamp the laser chip, avoiding damage or film contamination to the surface of the laser chip. At the same time, it ensures that the laser chip moves smoothly during the clamping process without positional displacement, thereby improving the die bonding accuracy and quality, and thus improving the packaging quality of semiconductor lasers.

[0023] 2. This invention uses both a suction nozzle module and a gripping module, which solves the problem that the laser chip cannot be picked up due to insufficient suction force when using the suction nozzle alone.

[0024] 3. The laser chip is gripped without damage by the present invention, reducing the risk of die bonding voids. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the mobile module structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of the mobile module of the present invention;

[0028] Figure 4 This is a schematic diagram of the laser chip clamping process of the present invention;

[0029] The components are as follows: 1. Suction nozzle module; 2. Gripping module; 3. Moving module; 4. Fixing frame; 5. Lead screw A; 6. Lead screw motor A; 7. Lead screw B; 8. Lead screw motor B; 9. Suction nozzle; 10. Stepper motor; 11. Gear; 12. Vertical slider; 13. Vertical slide rail; 14. Horizontal slider; 15. Horizontal slide rail; 16. First gripping arm; 17. Second gripping arm; 18. Connecting rod; 19. Gripping block; 20. Camera; 21. Laser chip; 22. Thin film. Detailed Implementation

[0030] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0031] Example 1:

[0032] like Figure 1-4 As shown, this embodiment provides a non-destructive laser packaging device, including a suction module 1, a clamping module 2, a moving module 3, and a fixing frame 4. A ball screw A5 is horizontally mounted at the top of the fixing frame 4, connected to a screw motor A6. The ball screw A5 is connected to a ball screw B7 via a screw nut A, and the ball screw B7 is connected to a screw motor B8. The ball screw B7 is vertically mounted and connected to the moving module 3 via a screw nut B. The moving module 3 has both the suction module 1 and the clamping module 2 mounted on it. The ball screw A enables horizontal movement of the moving module, and the ball screw B enables vertical movement, ensuring precise clamping of the laser chip.

[0033] The moving module 3 is a hollow cuboid. A suction nozzle module is located at the bottom center of the moving module, and a gripping module is located inside the moving module.

[0034] The suction module includes a suction nozzle 9, which has a hollow cylindrical upper end and a hollow conical lower end. An opening is provided at the apex of the cone. The suction nozzle is connected to a vacuum pump via a solenoid valve. The vacuum pump provides suction.

[0035] The gripping module 2 includes a stepper motor 10, a gear 11, a vertical slider 12, a vertical slide rail 13, a horizontal slider 14, a horizontal slide rail 15, a first gripping arm 16, and a second gripping arm 17. A vertical slide rail 13 is located in the middle of the moving module 3, and a vertical slider 12 is mounted on the vertical slide rail 13. The vertical slider 12 has a gear groove. A stepper motor 10 is located at the top of the moving module 3. The stepper motor 10 is connected to the vertical slider 12 via the gear 11. The forward and reverse rotation of the stepper motor 10 drives the vertical slider 12 to move up and down. A horizontal slide rail 15 is arranged side by side on both sides of the vertical slider 12. A horizontal slider 14 is arranged on the horizontal slide rail 15. A first gripping arm 16 and a second gripping arm 17 are arranged vertically on the horizontal slider 14 on both sides. The first gripping arm 16 and the second gripping arm 17 are connected to the vertical slider 12 through a connecting rod 18. When the vertical slider 12 moves down, the first gripping arm and the second gripping arm move closer together through the connecting rod 18 to clamp the laser chip. When the vertical slider moves up, the first gripping arm and the second gripping arm move away from each other through the connecting rod to put the laser chip down.

[0036] The lower end of the first gripping arm 16 is inclined, and a gripping block 19 is provided at the bottom end of the first gripping arm. The first gripping arm and the second gripping arm have the same structure and are installed opposite each other to ensure that the lower ends of the first gripping arm and the second gripping arm can fit together when they are close to each other. When the first gripping arm and the second gripping arm are close to each other, the laser chip is clamped by the gripping block.

[0037] A camera 20 is installed at the top of the ball screw B7. The camera 20 and the suction nozzle 9 are located on the same center line. When in use, the camera corresponds to the laser chip to observe the position of the laser chip.

[0038] Lead screw motor A, lead screw motor B, stepper motor and camera are all connected to a computer control system.

[0039] The operating steps for using the above-mentioned non-destructive laser packaging device are as follows:

[0040] (1) Expand and fix the thin film 22 with the laser chip;

[0041] (2) Take laser chip 21. Ball screw A drives the moving module to move horizontally, and ball screw B drives the moving module to move vertically. The movement of the moving module drives the suction nozzle to move, so that the suction nozzle contacts the laser chip. The vacuum pump starts and clamps the laser chip. Then the stepper motor starts and drives the vertical slider to move down. Through the connecting rod, the first clamping arm and the second clamping arm move closer and clamp the side of the laser chip. Then the moving module rises. Under the simultaneous action of vacuum suction and clamping force, the laser chip is removed from the film. There is no position or angle movement during the laser chip peeling process.

[0042] (3) Die bonding: Adjust the position of the moving module and move the laser chip to the heat sink to be bonded. Solder is placed on the heat sink. When the laser chip descends to 20-50um above the solder, reduce the descent speed. When the laser chip contacts the solder, the vacuum pump stops running, the suction force of the nozzle disappears, and the vertical slider moves up. The first and second clamping arms are moved away from each other by the connecting rod. The clamping force of the laser chip disappears, and the laser chip is freely wetted by the solder.

[0043] (4) After the laser chip and solder are freely immersed, the die-bonded product is removed and transferred to the next process.

[0044] Example 2:

[0045] A non-destructive laser packaging device is disclosed, with the structure described in Example 1, except that the upper end of the suction nozzle is made of metal, while the lower end is made of high-temperature resistant resin. The first and second gripping arms are also made of high-temperature resistant resin.

[0046] Comparative example:

[0047] A laser packaging method employs a bottom ejector pin lifting and top suction nozzle picking scheme during laser chip pickup. Since the ejector pin lifting height and the suction nozzle lowering height are fixed values, when the thickness of laser chips of the same type varies, the pressure exerted on the laser chip by the ejector pin and nozzle increases. This causes the ejector pin to puncture the thin film, leaving obvious puncture marks on the lower electrode of 10% of the laser chips, damaging the active area of ​​the laser and causing damage such as laser leakage. Furthermore, the chip is prone to warping after ejection, and thin film residue often remains at the lower electrode, resulting in warping of 5% of laser chips during die bonding, or insufficient contact with the heat sink solder, leading to voids. Table 1 shows a parameter comparison between the comparative example and Example 1. As can be seen from Table 1, the laser chip damage rate, laser chip warping or void rate of Example 1 are all lower than those of the comparative example, and the laser yield is significantly improved.

[0048] Table 1: Parameter Comparison between Comparative Example and Example 1

[0049] Laser chip damage rate Laser chip warping or void ratio Laser yield Example 1 0％ 2％ 98％ Comparative Example 5％ 5％ 90％

Claims

1. A non-destructive laser packaging device, characterized in that, It includes a suction module, a gripping module, a moving module, and a fixed frame. The fixed frame has a ball screw A horizontally mounted on its top, which is connected to a screw motor A. The ball screw A is connected to a ball screw B via a screw nut A, which is connected to a screw motor B. The ball screw B is vertically mounted and is connected to a moving module via a screw nut B. The moving module has a suction module and a gripping module mounted on it. The moving module is a hollow cuboid. A suction nozzle module is set at the middle of the bottom of the moving module. A clamping module is set inside the moving module. The suction nozzle module includes a suction nozzle. The upper end of the suction nozzle is a hollow cylinder and the lower end is a hollow cone. An opening is set at the apex of the cone. The suction nozzle is connected to a vacuum pump through a solenoid valve. The gripping module includes a stepper motor, gears, a vertical slider, a vertical slide rail, a horizontal slider, a horizontal slide rail, a first gripping arm, and a second gripping arm. A vertical slide rail is located in the middle of the moving module, and a vertical slider is mounted on the vertical slide rail. A gear groove is provided on the vertical slider. A stepper motor is located at the top of the moving module and is connected to the vertical slider via gears. Horizontal slide rails are arranged side by side on both sides of the vertical slider, and horizontal sliders are mounted on the horizontal slide rails. A first gripping arm and a second gripping arm are vertically mounted on the horizontal sliders on both sides, and the first gripping arm and the second gripping arm are connected to the vertical slider via connecting rods.

2. The non-destructive laser packaging device as described in claim 1, characterized in that, The upper part of the nozzle is made of metal, and the lower part is made of high-temperature resistant resin.

3. The non-destructive laser packaging device as described in claim 2, characterized in that, The lower end of the first gripping arm is inclined, and a gripping block is provided at the bottom end of the first gripping arm. The first gripping arm and the second gripping arm have the same structure.

4. The non-destructive laser packaging device as described in claim 1, characterized in that, The first and second gripping arms are made of high-temperature resistant resin material.

5. The non-destructive laser packaging device as described in claim 1, characterized in that, A camera is installed at the top of ball screw B, and the camera and the suction nozzle are located on the same center line.

6. The non-destructive laser packaging device as described in claim 5, characterized in that, Lead screw motor A, lead screw motor B, stepper motor and camera are all connected to a computer control system.

7. A method of using the non-destructive laser packaging device as described in claim 6, characterized in that, The operation steps are as follows: (1) Expand and fix the thin film with the laser chip; (2) Take the laser chip. Ball screw A drives the moving module to move horizontally, and ball screw B drives the moving module to move vertically. The movement of the moving module drives the suction nozzle to move, so that the suction nozzle contacts the laser chip. The vacuum pump starts and clamps the laser chip. Then the stepper motor starts and drives the vertical slider to move down. Through the connecting rod, the first clamping arm and the second clamping arm move closer and clamp the side of the laser chip. Then the moving module rises. Under the simultaneous action of vacuum suction and clamping force, the laser chip is removed from the film. There is no position or angle movement during the laser chip peeling process. (3) Die bonding: Adjust the position of the moving module and move the laser chip to the heat sink to be bonded. Solder is placed on the heat sink to be bonded. When the laser chip comes into contact with the solder, the vacuum pump stops running, the suction force of the nozzle disappears, and the vertical slider moves up. The first and second clamping arms are moved away from each other by the connecting rod. The clamping force of the laser chip disappears, and the laser chip is freely wetted by the solder. (4) After the laser chip and solder are freely wetted, the die-bonded product is taken out and transferred to the next process.

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