Depth control plug device and depth control plug method

Abstract

This invention relates to the field of circuit board manufacturing technology, disclosing a depth-controlled via-plugging device and method. The depth-controlled via-plugging device includes: a via-plugging cylinder containing a via-plugging medium; a clamping mechanism for clamping the PCB and moving it within the via-plugging cylinder; and a via-plugging mechanism including a lifting drive and a via-plugging rod. The lifting drive can move the via-plugging rod up and down to extend and retract along the vias of the PCB, and the diameter of the via-plugging rod is equal to the inner diameter of the via. The depth-controlled via-plugging device provided by this invention directly immerses the PCB in the via-plugging medium within the via-plugging cylinder and controls the depth of the via-plugging medium in the vias using the via-plugging mechanism. After the via-plugging medium solidifies, vias with a specific depth can be obtained, eliminating the need for back-drilling, saving production time, improving production efficiency, and reducing production costs.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and more particularly to a depth-controlled via plugging device and a depth-controlled via plugging method. Background Technology

[0002] As the demand for signal transmission rate continues to increase, it is necessary to increase the wiring density of PCB. The plugged via structure is beneficial to increase the wiring density of PCB. That is, one side of the hole is crimped, and the other side is plugged to prevent solder paste from flowing into the hole, causing cold solder joints or forming pads for soldering.

[0003] In existing technologies, PCB via plugging processes utilize resin plugging and solder mask plugging. Currently, PCB via plugging processes involve extruding ink or resin into the holes from above using a stencil or aluminum plate. Due to the amount of ink injected and gravity, the plugging process generally fills the entire hole, making it impossible to precisely control the plugging depth.

[0004] Therefore, there is an urgent need for depth-controlled plugging devices and methods to solve the aforementioned technical problems. Summary of the Invention

[0005] Based on the above, the purpose of this invention is to provide a depth-controlled via-plugging device and a depth-controlled via-plugging method. By directly immersing the PCB into the via-plugging medium in the via-plugging cylinder and controlling the depth of the via-plugging medium in the via with the via-plugging mechanism, vias with a specific depth can be obtained after the via-plugging medium has solidified. This eliminates the need for back drilling, saves production time, improves production efficiency, and reduces production costs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Provide a depth-controlled plugging device, including:

[0008] A plugging cylinder body, wherein a plugging medium is contained in the plugging cylinder body;

[0009] A clamping mechanism is used to clamp the PCB and move the PCB within the plug cylinder.

[0010] The via plugging mechanism includes a lifting drive and a via plugging rod. The lifting drive can drive the via plugging rod to move up and down so that the via plugging rod extends and retracts along the through hole of the PCB. The diameter of the via plugging rod is equal to the inner diameter of the through hole.

[0011] As an optional technical solution for the depth-controlled plugging device, the depth-controlled plugging device further includes:

[0012] The limiting mechanism includes multiple spaced grid columns that can press against the PCB from above to limit the PCB from arching upwards.

[0013] As an optional technical solution for the depth-controlled plugging device, the depth-controlled plugging device further includes:

[0014] A curing mechanism is used to cure the plugging medium in the through hole.

[0015] As an optional technical solution for the depth-controlled plugging device, the curing mechanism includes:

[0016] The photocuring mechanism includes a light source output component capable of irradiating the plugging medium in the through-hole; and / or

[0017] The thermosetting mechanism is equipped with a heat source output component, which is capable of heating the plugging medium in the through hole.

[0018] As an optional technical solution for the depth-controlled plugging device, the plugging rod is made of thermally conductive or light-guiding material.

[0019] Secondly, a depth-controlled orifice plugging method is provided, implemented using the depth-controlled orifice plugging device described above, the depth-controlled orifice plugging method comprising the following steps:

[0020] The PCB with the aforementioned through holes is formed through processing.

[0021] Insert the plug rod into the through hole from above, and make the bottom end of the plug rod flush with or protrude from the bottom end of the through hole;

[0022] The clamping mechanism clamps the PCB and drives the PCB to be immersed in the plugging medium in the plugging cylinder, so that the upper surface of the PCB is not lower than the liquid level of the plugging medium.

[0023] The lifting drive unit drives the plug rod to move upward, so that the bottom end of the plug rod is between the upper and lower surfaces of the PCB.

[0024] The curing mechanism cures the plugging medium that has entered the through hole, forming a plug.

[0025] As an optional technical solution for the depth-controlled plugging method, before the lifting drive moves the plugging rod upward, the following steps are also included:

[0026] The limiting mechanism presses against the upper surface of the PCB from above through multiple grid columns.

[0027] As an optional technical solution for the depth-controlled hole plugging method, the hole plugging mechanism includes multiple sets of lifting drive components and hole plugging rods arranged in a one-to-one correspondence. Each lifting drive component can independently drive the corresponding hole plugging rod to rise and fall. In the step where the lifting drive component drives the hole plugging rod to move upward by a preset distance, the distance that each hole plugging rod rises is not the same.

[0028] As an optional technical solution for the controlled-depth plugging method, the curing time of the plugging medium entering the through hole by the curing mechanism is equal to the curing time required for the longest plugging hole.

[0029] As an optional technical solution for the depth-controlled via plugging method, before immersing the PCB into the via plugging medium in the via plugging cylinder, the following steps are also included:

[0030] An insulating material for isolating the via-filling medium is coated on the lower surface and sidewalls of the PCB.

[0031] The beneficial effects of this invention are as follows:

[0032] The depth-controlled via-plugging device provided by this invention uses a clamping mechanism to hold a PCB, then a lifting drive unit drives a via-plugging rod to insert into the PCB's through-hole. The clamping mechanism then moves the PCB into a via-plugging cylinder, immersing it in a via-plugging medium. Subsequently, based on the desired via-plugging depth, the lifting drive unit drives the via-plugging rod to rise a corresponding height relative to the through-hole, creating a space between the bottom end of the via-plugging rod and the bottom end of the through-hole to accommodate the via-plugging medium. Once the via-plugging medium enters and solidifies in this space, a via with a preset depth is formed. This depth-controlled via-plugging device effectively solves the problem of inaccurate via-plugging depth control in traditional via-plugging processes, while eliminating the back-drilling step, simplifying the production process, improving production efficiency, and reducing production costs.

[0033] The depth-controlled via-plugging method provided by this invention first involves inserting a via-plugging rod into a via on a PCB. Then, the PCB is placed in a via-plugging cylinder containing a via-plugging medium, immersing the PCB in the medium. Subsequently, according to the desired via-plugging depth, a lifting drive unit drives the via-plugging rod to rise a corresponding height relative to the via, creating a space between the bottom end of the via-plugging rod and the bottom end of the via to accommodate the via-plugging medium. After the via-plugging medium enters and solidifies in this space, a via with a preset depth is formed. This depth-controlled via-plugging method effectively solves the problem of traditional via-plugging processes failing to precisely control the via-plugging depth. It also eliminates the back-drilling process, saving production time, improving production efficiency, and reducing production costs. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0035] Figure 1 This is a front view of the depth-controlled hole-plugging device provided by the present invention applied to a PCB;

[0036] Figure 2 This is a top view of the depth-controlled plugging device provided by the present invention applied to a PCB;

[0037] Figure 3 This is a schematic diagram showing the state of the plug rod extending into the through hole provided by the present invention;

[0038] Figure 4 This is a flowchart of the steps of the depth-controlled plugging method provided by the present invention;

[0039] Figure 5 This is a flowchart of the steps after removing the PCB from the plug cylinder provided by the present invention;

[0040] Figure 6 This is a flowchart of the steps involved in forming a PCB with vias provided by the present invention.

[0041] In the picture:

[0042] 10. PCB; 11. Through hole; 1. Plug cylinder; 2. Clamping mechanism; 3. Plug mechanism; 31. Lifting drive; 32. Plug rod; 4. Grille column; 5. Device body; 6. Plug medium. Detailed Implementation

[0043] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] This embodiment provides a depth-controlled via-forming device for forming vias of a specific depth on PCB10. For example... Figures 1-3As shown, the depth-controlled via plugging device includes a plugging cylinder 1, a clamping mechanism 2, and a plugging mechanism 3. The plugging cylinder 1 contains a plugging medium 6. The clamping mechanism 2 is used to clamp the PCB 10 and drive the PCB 10 to move within the plugging cylinder 1. The plugging mechanism 3 includes a lifting drive 31 and a plugging rod 32. The lifting drive 31 can drive the plugging rod 32 to rise and fall so that the plugging rod 32 extends and retracts along the through hole 11 of the PCB 10. The diameter of the plugging rod 32 is equal to the inner diameter of the through hole 11.

[0045] Specifically, the depth-controlled hole-filling device provided in this embodiment uses a clamping mechanism 2 to clamp the PCB 10, and then a lifting drive 31 drives a hole-filling rod 32 to insert into the through hole 11 of the PCB 10. The clamping mechanism 2 then moves the PCB 10 into the hole-filling cylinder 1, immersing the PCB 10 in the hole-filling medium 6. Subsequently, according to the required hole-filling depth, the lifting drive 31 drives the hole-filling rod 32 to rise relative to the through hole 11 by a corresponding height, creating a space between the bottom end of the hole-filling rod 32 and the lower end of the through hole 11 to accommodate the hole-filling medium 6. After the hole-filling medium 6 enters and solidifies in the aforementioned space, a hole with a preset depth is formed. The depth-controlled hole-filling device provided in this embodiment effectively solves the problem of traditional hole-filling processes failing to accurately control the hole-filling depth, while eliminating the back-drilling process, saving production time, improving production efficiency, and reducing production costs.

[0046] Optionally, the depth-controlled plugging device also includes a limiting mechanism, which includes multiple spaced grid columns 4. The grid columns 4 can press against the PCB10 from above to limit the PCB10 from arching upwards, so as to prevent the control accuracy of the plugging depth from being affected when the lifting drive 31 pulls the plugging rod 32 upwards due to the PCB10 arching upwards.

[0047] Optionally, the plugging mechanism 3 includes multiple sets of corresponding lifting drive components 31 and plugging rods 32, such as... Figure 3 As shown, each lifting drive unit 31 can independently drive the corresponding hole-plugging rod 32 to rise and fall. The operator can set the driving rise distance of each lifting drive unit 31, so that the rise distance of the hole-plugging rod 32 is not the same, and the space between the bottom end of the hole-plugging rod 32 and the bottom end of the through hole 11 can accommodate different hole-plugging media 6, so as to form hole-plugging holes of different depths on the PCB10, thereby improving flexibility and versatility.

[0048] Furthermore, before the lifting drive 31 starts driving the plugging rod 32 to rise after it extends into the initial position of the through hole 11, the bottom end of the plugging rod 32 is flush with or protrudes from the bottom end of the through hole 11, to accommodate cases where some through holes 11 do not need to be plugged. In this embodiment, before the lifting drive 31 starts driving the plugging rod 32 to rise, the bottom ends of all plugging rods 32 are flush with the lower surface of the PCB 10.

[0049] Preferably, the bottom end of the plug rod 32 is flush with the bottom end of the guide hole 11. It should be noted that when the bottom end of the plug rod 32 protrudes from the bottom end of the guide hole 11, the plug rod 32 should avoid interfering with the bottom of the plug cylinder 1. At the same time, it should be ensured that when the lifting drive 31 drives the plug rod 32 to rise to the upper limit position, the height of the bottom end of the plug rod 32 is higher than the height of the bottom end of the guide hole 11, that is, the length of the plug rod 32 should not be too long.

[0050] Optionally, the depth-controlled plugging device also includes a curing mechanism (not shown in the figure) for curing the plugging medium 6 in the through hole 11 to form a plug.

[0051] Preferably, the via-filling medium 6 is made of photosensitive and / or thermosetting inks, resins, conductive adhesives, or similar materials. Correspondingly, the curing mechanism includes a photocuring mechanism and / or a thermosetting mechanism. The photocuring mechanism is equipped with a light source output component that can irradiate the via-filling medium 6 in the through-hole 11 to cure the photosensitive via-filling medium 6. The thermosetting mechanism is equipped with a heat source output component that can heat the via-filling medium 6 in the through-hole 11 to cure the thermosetting via-filling medium 6. The curing mechanism should include at least one of the photocuring mechanism and the thermosetting mechanism; more preferably, the curing mechanism includes both photocuring and thermosetting mechanisms, which can be flexibly selected according to the actual via-filling medium 6.

[0052] Furthermore, the curing mechanism acts on the via-hole medium 6 within the via 11 via the via-hole rod 32. The via-hole rod 32 is made of a thermally conductive or light-guiding material. Specifically, when the via-hole medium 6 is made of a photosensitive material, the via-hole rod 32 is made of a transparent or semi-transparent material with light-guiding properties, such as optical fiber; when the via-hole medium 6 is made of a thermosetting material, the via-hole rod 32 is made of a good thermal conductor, such as steel, and is required to have poor expansion and contraction properties and be not easily deformed, so that gaps appear between the via-hole rod 32 and the inner wall of the via 11, or the via-hole rod 32 cracks the PCB10.

[0053] Preferably, the clamping mechanism 2 includes a telescopic arm and multiple grippers acting on the periphery of the PCB10. The grippers are mounted on the output end of the telescopic arm, and the multiple grippers clamp the PCB10 from the periphery to keep the PCB10 in a horizontal position. The telescopic arm can use linear drive components such as linear cylinders or electric actuators to drive the grippers to extend and retract vertically, and the grippers can be pneumatically or electrically controlled.

[0054] Optionally, the depth-controlled plugging device also includes a device body 5. The lifting drive 31 of the plugging mechanism 3 and the telescopic arm of the clamping mechanism 2 are both connected to the device body 5. The grid column 4 can be connected to the device body 5 through the telescopic drive, or it can be directly connected and fixed to the clamping mechanism 2.

[0055] Optionally, the lifting drive component 31 can be a linear drive component such as a linear cylinder or an electric actuator.

[0056] like Figure 4 As shown, this embodiment also provides a depth-controlled orifice plugging method, implemented using the aforementioned depth-controlled orifice plugging device, specifically including the following steps:

[0057] A PCB10 with via holes 11 is formed by processing;

[0058] The lower surface and sidewalls of PCB10 are coated with isolation materials such as isolation film / release film for isolating via plugging medium 6, so as to prevent via plugging medium 6 from adhering to the board surface of PCB10.

[0059] Insert the plug rod 32 into the through hole 11 from above, and make the bottom end of the plug rod 32 flush with or protrude from the bottom end of the through hole 11.

[0060] The limiting mechanism presses against the upper surface of PCB10 from above through multiple grid pillars 4;

[0061] The clamping mechanism 2 clamps the PCB10 and drives the PCB10 to be immersed in the plugging medium 6 in the plugging cylinder 1, so that the upper surface of the PCB10 is not lower than the liquid level of the plugging medium 6.

[0062] The lifting drive 31 drives the plug rod 32 to move upward, so that the bottom end of the plug rod 32 is between the upper and lower surfaces of the PCB10.

[0063] The curing mechanism cures the plugging medium 6 that enters the through hole 11, forming a plug hole;

[0064] Remove PCB10 from cylinder block 1;

[0065] The surface of PCB10 is cleaned to remove residual via-plugging medium 6 and isolation material.

[0066] Specifically, the depth-controlled hole-plugging method provided in this embodiment first inserts the plugging rod 32 into the through hole 11 of the PCB 10. Then, the PCB 10 is placed in the plugging cylinder 1 containing the plugging medium 6 and immersed in the plugging medium 6. Subsequently, according to the required hole-plugging depth, the lifting drive 31 drives the plugging rod 32 to rise relative to the through hole 11 by a corresponding height, so that a space is formed between the bottom end of the plugging rod 32 and the lower end of the through hole 11 to accommodate the plugging medium 6. After the plugging medium 6 enters the aforementioned space and solidifies, a hole with a preset depth is formed. Multiple grid columns 4 press against the upper surface of the PCB 10 from above to prevent the PCB 10 from arching upwards when the lifting drive 31 pulls the plugging rod 32 upwards, thus affecting the hole-plugging depth and ensuring the control accuracy of the hole-plugging depth.

[0067] Furthermore, since the upper surface of PCB10 is not lower than the liquid level of the plugging medium 6 when PCB10 is immersed in the plugging medium 6, there is a pressure difference between the upper and lower surfaces of PCB10, as well as the vacuum pressure generated when the plugging rod 32 is moved upward, the plugging medium 6 can fill the hole well and there will be no air bubbles or other issues that cause poor plugging.

[0068] Preferably, in the step of coating the PCB10 with insulating material, insulating material is also applied to the plugging rod 32 to prevent it from sticking to and pulling the plugging medium 6 when it exits the through hole 11 after the plugging medium 6 has cured, thus ensuring that the quality of the plugging is not affected. In embodiments where the bottom end of the plugging rod 32 is flush with the bottom end of the through hole 11, insulating material must be applied to at least the bottom area of ​​the plugging rod 32; while in embodiments where the bottom end of the plugging rod 32 protrudes from the bottom end of the through hole 11, insulating material must be applied to at least the protruding portion of the plugging rod 32.

[0069] Preferably, the upper surface of PCB10 is flush with the liquid surface of the plugging medium 6.

[0070] Optionally, in the step of the lifting drive 31 driving the plug rod 32 to move upward a preset distance, the operator can set the driving distance of each lifting drive 31 separately, so that the distance the plug rod 32 rises is not the same, so as to form plug holes of different depths.

[0071] Furthermore, in the step of curing the plugging medium 6 that enters the through hole 11 in the curing mechanism, the curing time is equal to the curing time required for the longest plugging hole, so as to ensure that the plugging medium 6 in all through holes 11 is fully cured.

[0072] Preferably, the plugging medium 6 is composed of a two-component medium, comprising a photosensitive ink and a thermosetting ink, or comprising a photosensitive resin and a thermosetting resin. The curing mechanism includes both a photocuring mechanism and a thermosetting mechanism. The plugging rod 32 is made of a material with light-guiding properties. The plugging medium 6, which enters the through-hole 11, is cured in the curing mechanism described above. The light source in the photocuring mechanism passes through the plugging rod 32 to irradiate the plugging medium 6 in the through-hole 11, thereby achieving preliminary curing. Figure 5 As shown, after removing PCB10 from the plug cylinder 1, the following steps are also included:

[0073] By developing and cleaning the via 11, the uncured via medium 6 on PCB10 is removed.

[0074] The plugging medium 6 in the through hole 11 is heated by a thermosetting mechanism to further solidify the plugging medium 6 in the through hole 11, ensuring complete solidification of the plugging medium 6 and guaranteeing the reliability of the plugging.

[0075] Preferred, such as Figure 6 As shown, the PCB10 with via 11 is fabricated by the following steps:

[0076] At least two substrates are stacked and laminated to form a PCB10 with a multilayer board structure;

[0077] Drill a via 11 on PCB10;

[0078] A metallic conductive layer is formed on the via 11 by electroplating.

[0079] Preferably, when the PCB10 is placed inside the plugging cylinder 1, the distance between the edge of the PCB10 and the peripheral wall of the plugging cylinder 1 is 1cm to 2cm.

[0080] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A depth control plug device, characterized by, include: A plugging cylinder (1) is filled with a plugging medium (6). Clamping mechanism (2) is used to clamp PCB (10) and drive PCB (10) to move in the plug cylinder (1); The plugging mechanism (3) includes a lifting drive (31) and a plugging rod (32). The lifting drive (31) can drive the plugging rod (32) to move up and down so that the plugging rod (32) extends and retracts along the through hole (11) of the PCB (10). The diameter of the plugging rod (32) is equal to the inner diameter of the through hole (11). The depth-controlled plugging device further includes: The limiting mechanism includes multiple spaced grid columns (4) that can press against the PCB (10) from above to limit the PCB (10) from arching upwards.

2. The depth control plug device of claim 1, wherein, The depth-controlled plugging device further includes: A curing mechanism for curing the plugging medium (6) in the through hole (11).

3. The depth-controlled plugging device according to claim 2, characterized in that, The curing mechanism includes: The photocuring mechanism is equipped with a light source output component, which is capable of irradiating the plugging medium (6) in the through hole (11); and / or The thermosetting mechanism is equipped with a heat source output component, which is capable of heating the plug medium (6) in the through hole (11).

4. The depth-controlled plugging device according to claim 1, characterized in that, The plug rod (32) is made of thermally conductive or light-conductive material.

5. A method for controlling the depth of a hole, characterized in that, The method is implemented using the depth-controlled plugging apparatus as described in any one of claims 1-4, and the depth-controlled plugging method includes the following steps: The PCB (10) is formed by processing and having the via (11). Insert the plug rod (32) into the through hole (11) from above, and make the bottom end of the plug rod (32) flush with or protrude from the bottom end of the through hole (11). The clamping mechanism (2) clamps the PCB (10) and drives the PCB (10) to be immersed in the plugging medium (6) in the plugging cylinder (1), so that the upper surface of the PCB (10) is not lower than the liquid level of the plugging medium (6); The lifting drive (31) drives the plug rod (32) to move upward, so that the bottom end of the plug rod (32) is between the upper and lower surfaces of the PCB (10); The curing mechanism cures the plugging medium (6) that enters the through hole (11) to form a plug.

6. The method for controlling the depth of a hole according to claim 5, characterized in that, Before the lifting drive (31) moves the plug rod (32) upward, the following steps are also included: The limiting mechanism presses against the upper surface of the PCB (10) from above through multiple grid columns (4).

7. The method for controlling the depth of a hole according to claim 5, characterized in that, The plugging mechanism (3) includes multiple sets of lifting drive members (31) and plugging rods (32) arranged one-to-one. Each lifting drive member (31) can independently drive the corresponding plugging rod (32) to rise and fall. In the step of the lifting drive member (31) driving the plugging rod (32) to move upward by a preset distance, the distance that each plugging rod (32) rises is not the same.

8. The method for controlling the depth of a hole according to claim 7, characterized in that, The curing time of the curing mechanism for the plugging medium (6) that enters the through hole (11) is equal to the curing time required for the longest plugging hole.

9. The method for controlling the depth of a hole according to claim 5, characterized in that, Before immersing the PCB (10) into the plugging medium (6) within the plugging cylinder (1), the following steps are also included: An insulating material for isolating the via medium (6) is coated on the lower surface and sidewalls of the PCB (10).

Images