Lead frame and electronic component

Abstract

The lead frame of the present application has: a die pad; a plurality of leads; a frame member; and at least one wire. The frame member includes two first connecting bars and two second connecting bars. The plurality of leads includes a plurality of specific leads. The plurality of specific leads are respectively connected to the first connecting bars. At least one of the plurality of specific leads is connected to the second connecting bars via the at least one wire.

Description

TECHNICAL FIELD

[0001] The present application relates to a lead frame for electronic parts and an electronic part manufactured using the lead frame. BACKGROUND

[0002] As a package for electronic parts such as semiconductor devices suitable for miniaturization, a package such as a DFN (Dual Flatpack No-leaded) package, which is not provided with a lead terminal extending outward from a package main body, is known. In the DFN package, a plurality of terminals are provided on the surface of the package main body. The plurality of terminals are joined with a conductor layer on a substrate, for example, by solder.

[0003] Generally, in the manufacture of the DFN package, a lead frame provided with a die pad on which a chip is mounted and a plurality of leads is used. The plurality of terminals are formed by plating a part of the surface of the plurality of leads. In order to form a good solder leg when the electronic part is mounted on a substrate, it is desirable to plate the entire surface of the lead exposed from the surface of the package main body.

[0004] In the specification of Chinese Patent Application Publication No. 104916606A and Japanese Patent Application Publication No. 2016-167532, a technology of plating the entire surface of the lead exposed from the surface of the package main body is disclosed. In the specification of Chinese Patent Application Publication No. 104916606A, a lead frame in which an inner lead is connected to an outer lead connected to a lead frame is described. The inner lead is connected to the lead frame by an inner hanging lead. The outer lead has a shape longer in one direction. The inner lead and the inner hanging lead extend in a direction orthogonal to the length direction of the outer lead.

[0005] In the specification of Chinese Patent Application Publication No. 104916606A, after the semiconductor chip is sealed with a sealing resin, the outer lead is separated from the lead frame. Even if the outer lead is cut, the lead frame and the outer lead maintain an electrically connected relationship. In the specification of Chinese Patent Application Publication No. 104916606A, by plating in this state, a plating film is formed on the entire surface of the outer lead exposed from the sealing resin.

[0006] The same lead frame as that described in the Chinese Patent Application Publication No. 104916606A is described in Japanese Patent Application Publication No. 2016-167532. The first link bar and the second link bar of Japanese Patent Application Publication No. 2016-167532 correspond to the lead frame frame of the Chinese Patent Application Publication No. 104916606A. In Japanese Patent Application Publication No. 2016-167532, an extension is connected to the lead wire connected to the first link bar. The extension is connected to the second link bar. The lead wire has a shape longer in one direction. The extension extends in a direction orthogonal to the length direction of the lead wire.

[0007] In the lead frame described in the Chinese Patent Application Publication No. 104916606A, Japanese Patent Application Publication No. 2016-167532, a lead wire used as a terminal and a lead wire not used as a terminal are connected. When an electronic component is manufactured using such a lead frame, the lead wire not used as a terminal is also exposed from the package main body. As a result, the number of lead wires exposed from the package main body increases, and the risk of moisture intrusion into the inside of the package main body from the interface between the lead wire and the sealing resin increases. The risk increases as the exposed area of the lead wire not used as a terminal increases. SUMMARY

[0008] An object of the present application is to provide a lead frame capable of reducing the risk of moisture intrusion into the inside of a package main body, and an electronic component using the same.

[0009] The lead frame of the present application is a lead frame for an electronic component. The lead frame includes a die pad, a plurality of lead wires, a frame member surrounding the die pad and the plurality of lead wires, and at least one lead wire. The frame member includes a first link bar extending in a first direction and a second link bar extending in a second direction. The plurality of lead wires includes a plurality of specific lead wires arranged along the first link bar. The plurality of specific lead wires are respectively connected to the first link bar. At least one of the plurality of specific lead wires is connected to the second link bar via the at least one lead wire.

[0010] In the lead frame of the present application, it can also be that a part of the at least one lead wire is arranged in a predetermined region to be removed during the manufacturing process of the electronic component.

[0011] Further, in the lead frame of the present application, it can also be that the at least one lead wire is directly connected to at least one of the plurality of specific lead wires.

[0012] Further, in the lead frame of the present application, at least one lead wire can also be directly connected to the second tie bar. In this case, the second tie bar can also be plated with Au, Ag, Cu, Ni, or Pd-PPF. Further, PPF is an abbreviation of Pre Plated Lead frame, and Pd-PPF is a multi-layer plating composed of Ni, Pd, and Au.

[0013] Further, the lead frame of the present application can also have at least one connection lead wire connected to the second tie bar. At least one of the plurality of specific lead wires can also be connected to the at least one connection lead wire via the at least one lead wire. The at least one connection lead wire can be plated with Au, Ag, Cu, Ni, or Pd-PPF.

[0014] In the case where the lead frame of the present application has the at least one connection lead wire, the at least one lead wire can include a plurality of lead wires. The at least one connection lead wire can include one connection lead wire. The plurality of specific lead wires can also be connected to the one connection lead wire via the plurality of lead wires. Further, in this case, the at least one connection lead wire can also include a wide portion. The wide portion can also have a first dimension in a first direction and a second dimension in a second direction. The second dimension can also be greater than or equal to the first dimension. The shape of the wide portion, when viewed from a third direction orthogonal to the first direction and the second direction, can be an n-gon with n being 4 or more, a circle, or an ellipse.

[0015] In the case where the at least one connection lead wire includes the wide portion, the at least one connection lead wire can also include a connection portion connecting the wide portion to the second tie bar. Further, the wide portion can be disposed in a predetermined region to be removed during the manufacturing process of the electronic component.

[0016] The electronic component of the present application is an electronic component manufactured using the lead frame of the present application. The electronic component has a chip mounted on a die pad, and a sealing resin sealing the die pad, the plurality of lead wires, and the chip. The plurality of lead wires each have an exposed surface not covered by the sealing resin.

[0017] The electronic component of the present application can also have a plating layer covering the exposed surface.

[0018] In the lead frame and the electronic component of the present application, at least one of the plurality of specific lead wires is connected to the second tie bar via the at least one lead wire. Thus, according to the present application, it is possible to reduce the risk of moisture intrusion into the inside of the package body.

[0019] Other objects, features, and advantages of the present application will become more fully apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1is a perspective view showing an electronic component according to the first embodiment of the present application.

[0021] Figure 2 is a perspective view showing an electronic component according to the first embodiment of the present application.

[0022] Figure 3 is a perspective view showing a part of the electronic component shown in Figure 2

[0023] Figure 4 is a plan view showing a lead frame structure in the first embodiment of the present application.

[0024] Figure 5 is a plan view showing a lead frame according to the first embodiment of the present application.

[0025] Figure 6 is a plan view showing a part of the lead frame shown in Figure 5

[0026] Figure 7 is a plan view showing a lead frame according to the second embodiment of the present application.

[0027] Figure 8 is a plan view showing a part of the lead frame shown in Figure 7

[0028] is a plan view showing a first modification of the lead frame according to the second embodiment of the present application. Figure 9

[0029] is a plan view showing a second modification of the lead frame according to the second embodiment of the present application. Figure 10

[0030] is a plan view showing a third modification of the lead frame according to the second embodiment of the present application. Figure 11

[0031] is a plan view showing a fourth modification of the lead frame according to the second embodiment of the present application. Figure 12 DETAILED DESCRIPTION

[0032] [First Embodiment]

[0033] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. First, with reference to Figures 1 to 3 , an electronic component according to the first embodiment of the present application will be described. Figure 1 and Figure 2 is a perspective view showing an electronic component according to the first embodiment of the present application. Figure 3 is a perspective view showing a part of the electronic component shown in Figure 2 ​​​An enlarged perspective view of a part of the electronic component shown.

[0034] The electronic component 10 according to the present embodiment is an electronic component manufactured using the lead frame according to the present embodiment. The electronic component 10 includes a chip 11, a sealing resin 8, and a plurality of terminals 13. The chip 11 is mounted on the die pad 2 of the lead frame. In addition, the chip 11 has a plurality of electrode pads. The plurality of electrode pads are connected to the plurality of leads 3 of the lead frame by a plurality of bonding wires, not shown. The sealing resin 8 seals the die pad 2, the plurality of leads 3, and the chip 11. The sealing resin 8 constitutes a majority of a package main body (hereinafter referred to as a main body) 12 of the electronic component 10.

[0035] In the present embodiment, in particular, the main body 12 has a substantially rectangular parallelepiped shape. The main body 12 has a bottom surface 12A constituting an outer peripheral portion of the main body 12, an upper surface 12B, and four side surfaces 12C to 12F. The bottom surface 12A and the upper surface 12B face each other in opposite directions, the side surfaces 12C and 12D also face each other in opposite directions, and the side surfaces 12E and 12F also face each other in opposite directions. The side surfaces 12C to 12F are perpendicular to the bottom surface 12A and the upper surface 12B. Figure 1 An electronic component 10 viewed from the upper surface 12B side is shown. Figure 2 An electronic component 10 viewed from the bottom surface 12A side is shown.

[0036] Here, as shown in Figures 1 to 3 , an X direction, a Y direction, and a Z direction are defined. The X direction, the Y direction, and the Z direction are orthogonal to each other. In the present embodiment, a direction perpendicular to the bottom surface 12A, that is, a direction from the bottom surface 12A toward the upper surface 12B is set as the Z direction. In addition, a direction opposite to the X direction is set as the -X direction, a direction opposite to the Y direction is set as the -Y direction, and a direction opposite to the Z direction is set as the -Z direction.

[0037] In the present embodiment, the Y direction corresponds to the "first direction" in the present application. The X direction corresponds to the "second direction" in the present application. The Z direction corresponds to the "third direction" in the present application. The first direction, the second direction, and the third direction can also be orthogonal to each other.

[0038] As shown in Figure 1 and Figure 2 , the bottom surface 12A is located at an end portion of the main body 12 in the -Z direction. The upper surface 12B is located at an end portion of the main body 12 in the Z direction. The side surface 12C is located at an end portion of the main body 12 in the -X direction. The side surface 12D is located at an end portion of the main body 12 in the X direction. The side surface 12E is located at an end portion of the main body 12 in the -Y direction. The side surface 12F is located at an end portion of the main body 12 in the Y direction.

[0039] Several of the plurality of terminals 13 are arranged in an edge line between the bottom surface 12A and the side surface 12C and in the vicinity thereof. In addition, several of the plurality of terminals 13 are arranged in an edge line between the side surface 12C and the side surface 12D and in the vicinity thereof. In addition, several of the plurality of terminals 13 are arranged in an edge line between the side surface 12D and the side surface 12E and in the vicinity thereof. In addition, several of the plurality of terminals 13 are arranged in an edge line between the side surface 12E and the side surface 12F and in the vicinity thereof. In addition, several of the plurality of terminals 13 are arranged in an edge line between the side surface 12F and the upper surface 12B and in the vicinity thereof.Figure 1 and Figure 2 In the example shown in FIG. 10, four terminals 13 arranged in the Y direction are disposed at and near the edge between the bottom surface 12A and the side surface 12C. Similarly, other terminals 13 are disposed at and near the edge between the bottom surface 12A and the side surface 12D. Figure 1 and Figure 2 In the example shown in FIG. 10, four terminals 13 arranged in the Y direction are disposed at and near the edge between the bottom surface 12A and the side surface 12C. Similarly, other terminals 13 are disposed at and near the edge between the bottom surface 12A and the side surface 12D.

[0040] As shown in FIG. 11, the plurality of lead wires 3 each have an exposed surface that is not covered by the sealing resin 8. The electronic component 10 further has a plurality of plating layers 30 that cover the exposed surfaces of the plurality of lead wires 3, respectively. The plurality of terminals 13 are each composed of a lead wire 3 and a plating layer 30. Figure 3

[0041] The exposed surface of the die pad 2 is not covered by the sealing resin 8. Most of the exposed surface of the die pad 2 is disposed at the bottom surface 12A. The electronic component 10 further has a plating layer, not shown, that covers the portion of the exposed surface of the die pad 2 that is disposed at the bottom surface 12A.

[0042] The portion of the exposed surface of the die pad 2 other than the portion disposed at the bottom surface 12A is disposed at the side surface 12E and the side surface 12F. The portion of the exposed surface of the die pad 2 disposed at the side surfaces 12E, 12F can also not be covered by the plating layer.

[0043] The electronic component 10 is mounted on a mounting substrate in a posture in which the bottom surface 12A of the main body 12 faces the mounting substrate. Figures 1 to 3 The electronic component 10 shown in FIG. 1 is a DFN (Dual Flatpack No-leaded) package that does not have lead terminals extending outward from the main body 12.

[0044] Next, the lead frame involved in the present embodiment will be described with reference to Figures 4 to 6 Figure 4 is a plan view showing the structure of the lead frame in the present embodiment. Figure 5 is a plan view showing the lead frame involved in the present embodiment. Figure 6 is a plan view showing a portion of the lead frame shown in FIG. 9 in an enlarged manner. Also, in Figure 5 , the X direction, the Y direction, and the Z direction are shown in the same manner as in Figures 4 to 6 . In Figures 1 to 3 , the X direction, the Y direction, and the Z direction are defined in the same manner as in Figures 4 to 6 with respect to the posture of the die pad 2. Figures 1 to 3

[0045] Figure 4 ​​​The lead frame structure 100 shown has a plurality of lead frames 1 for electronic components 10. In Figure 4 In the example shown, the plurality of lead frames 1 are arranged in a manner that a plurality of lead frames 1 are arranged in each of the X direction and the Y direction. The lead frame structure 100 is manufactured, for example, by processing a metal plate composed of an alloy containing Cu or Fe.

[0046] Hereinafter, the structure of the lead frame 1 will be described with focus on one lead frame 1. The lead frame 1 has a die pad 2, a plurality of leads 3, and a frame member 6 that surrounds the die pad 2 and the plurality of leads 3.

[0047] The frame member 6 includes two first link bars 61A and 61B that extend in the Y direction, respectively, and two second link bars 62A and 62B that extend in the X direction, respectively. One end portion of the first link bar 61A is connected to one end portion of the second link bar 62A. The other end portion of the second link bar 62A is connected to one end portion of the first link bar 61B. The other end portion of the first link bar 61B is connected to one end portion of the second link bar 62B. The other end portion of the second link bar 62B is connected to the other end portion of the first link bar 61A.

[0048] One end portion of the die pad 2 is connected to the second link bar 62A. The other end portion of the die pad 2 is connected to the second link bar 62B. In Figure 5 In the example shown, the boundary between the die pad 2 and the second link bar 62A and the boundary between the die pad 2 and the second link bar 62B are indicated by broken lines, respectively.

[0049] The lead frame 1 has eight leads 3 as the plurality of leads 3. The eight leads 3 extend in the X direction, respectively. Four leads 3 are disposed between the die pad 2 and the first link bar 61A and are arranged in a manner that they are arranged along the first link bar 61A. The four leads 3 are connected to the first link bar 61A, respectively. In Figure 5 In the example shown, the boundary between the four leads 3 and the first link bar 61A is indicated by a broken line.

[0050] The other four leads 3 are disposed between the die pad 2 and the first link bar 61B and are arranged in a manner that they are arranged along the first link bar 61B. The other four leads 3 are connected to the first link bar 61B, respectively. In Figure 5 In the example shown, the boundary between the other four leads 3 and the first link bar 61B is indicated by a broken line.

[0051] The lead frame 1 also has at least one wire 4. In the present embodiment, in particular, the lead frame 1 has eight wires 4 as the at least one wire 4.

[0052] Here, the lead 3 at the end portion in the -Y direction among the four leads 3 disposed along the first link bar 61A and the lead 3 adjacent to the lead are referred to as a specific lead. In Figure 6Two specific leads 3 are shown in the diagram.

[0053] At least one of the two specific leads 3 is connected to the second connecting strip 62A via at least one wire 4. In this embodiment, the two specific leads 3 are respectively connected to the second connecting strip 62A via two wires 4.

[0054] In this embodiment, the wire 4 is directly connected to the specific lead 3 and also directly connected to the second connecting strip 62A. The second connecting strip 62A can also be plated with Au, Ag, Cu, Ni, or Pd-PPF. Furthermore, PPF is short for Pre Plated Leadframe, and Pd-PPF is a multilayer plating composed of Ni, Pd, and Au.

[0055] The above description regarding the two specific leads 3 also applies to the lead 3 at the Y-direction end and the lead 3 adjacent to it among the four leads 3 arranged along the first connecting strip 61A, provided that the second connecting strip 62A is replaced with the second connecting strip 62B. Similarly, the above description regarding the four leads 3 arranged along the first connecting strip 61A also applies to the four leads 3 arranged along the first connecting strip 61B, provided that the first connecting strip 61A is replaced with the first connecting strip 61B.

[0056] exist Figure 5 In the figure, the area enclosed by the rectangle marked with double-dotted lines (reference numeral 8) represents the area sealed by the sealing resin 8 in the electronic component 10 manufactured using the lead frame 1. Furthermore, the area outside the rectangle marked with double-dotted lines (reference numeral 8) is a predetermined area that is removed during the manufacturing process of the electronic component 10. The first connecting strips 61A, 61B and the second connecting strips 62A, 62B are positioned in the predetermined areas that are removed during the manufacturing process of the electronic component 10. During the manufacturing process of the electronic component 10, portions of the leads 3 near the boundaries of the first connecting strips 61A or 61B are also removed.

[0057] Furthermore, during the manufacturing process of electronic component 10, portions of the bare die pad 2 near the boundary of the second connecting strip 62A and near the boundary of the second connecting strip 62B are also removed. As a result, as... Figure 1 and Figure 2 As shown, the end faces of the bare die pads 2 are exposed on the sides 12E and 12F of the main body 12 of the electronic component 10.

[0058] Furthermore, a portion of each of the eight wires 4 is also positioned in a predetermined area that is removed during the manufacturing process of the electronic component 10. During the manufacturing process of the electronic component 10, the wires 4 are cut when the second connecting strips 62A and 62B are removed. As a result, as... Figure 1 andFigure 2 As shown, cut surfaces of the lead wires 4 are exposed on the side surfaces 12E, 12F of the main body 12 of the electronic component 10, respectively.

[0059] Thus far, the lead frame 1 has been described. As described above, a plurality of lead frames 1 are provided in the lead frame structure 100 of the present embodiment. Further, in the lead frame structure 100, a plurality of first connecting bars 61A, a plurality of first connecting bars 61B, a plurality of second connecting bars 62A, and a plurality of second connecting bars 62B are also provided, respectively.

[0060] The plurality of first connecting bars 61A and the plurality of first connecting bars 61B are arranged in the X direction in a manner that the first connecting bars 61A and the first connecting bars 61B are alternately arranged. The first connecting bars 61A, 61B each have a size corresponding to the plurality of lead frames 1 arranged in the Y direction in a direction parallel to the Y direction.

[0061] Further, the plurality of second connecting bars 62A and the plurality of second connecting bars 62B are arranged in the Y direction in a manner that the second connecting bars 62A and the second connecting bars 62B are alternately arranged and cross the plurality of first connecting bars 61A, 61B. The second connecting bars 62A, 62B each have a size corresponding to the plurality of lead frames 1 arranged in the X direction in a direction parallel to the X direction.

[0062] The lead frame structure 100 has a third connecting bar 101 at an end portion in the -Y direction of the lead frame structure 100, a fourth connecting bar not shown at an end portion in the Y direction of the lead frame structure 100, a fifth connecting bar 102 at an end portion in the -X direction of the lead frame structure 100, and a sixth connecting bar not shown at an end portion in the X direction of the lead frame structure 100. The plurality of first connecting bars 61A and the plurality of first connecting bars 61B are connected to the third connecting bar 101 and the fourth connecting bar, respectively. The plurality of second connecting bars 62A and the plurality of second connecting bars 62B are connected to the fifth connecting bar 102 and the sixth connecting bar, respectively.

[0063] Next, the manufacturing method of the electronic component 10 will be described with reference to FIG. 8. Figures 4 to 6 The manufacturing method of the electronic component 10 will be described. In the manufacturing method of the electronic component 10, first, the chip 11 is mounted on the die pad 2 of the lead frame 1. Next, the plurality of electrode pads of the chip 11 are connected to the plurality of lead wires 3 of the lead frame 1 by wire bonding. Next, a sealing process of sealing the die pad 2, the plurality of lead wires 3, and the chip 11 with the sealing resin 8 is performed. In the sealing process, the first connecting bars 61A, 61B and the second connecting bars 62A, 62B of the frame member 6 of the lead frame 1 are also sealed. Hereinafter, a structure including the lead frame 1 and the sealing resin 8 made by the sealing process will be referred to as a base structure.

[0064] In the base structure, a portion of each of the plurality of leads 3, i.e., a portion in the vicinity of the first connecting bars 61A or 61B, can also be exposed from a predetermined portion of the bottom surface 12A of the main body 12 in the sealing resin 8. Further, in the base structure, a portion of the die pad 2 can also be exposed from a predetermined portion of the bottom surface 12A of the main body 12 in the sealing resin 8. The lead frame 1 can also have a configuration in which a portion of each of the plurality of leads 3 and a portion of the die pad 2 are exposed as described above. Alternatively, the lead frame 1 can be processed in a manner in which a portion of each of the plurality of leads 3 and a portion of the die pad 2 are exposed as described above before the sealing process.

[0065] In the manufacturing method of the electronic component 10, next, the base structure is fixed to a dicing tape (not shown). Next, a dicing process of cutting the base structure with a dicing saw in a manner in which the first connecting bars 61A, 61B are removed is performed. By this dicing process, cut surfaces of the plurality of leads 3 are exposed from the sealing resin 8. Further, in the dicing process, the base structure can also be cut in a manner in which the base structure is not divided, i.e., the third connecting bar 101 and the fourth connecting bar are not completely cut. The plurality of leads 3 are connected to the second connecting bars 62A, 62B via the plurality of wires 4, respectively. The second connecting bars 62A, 62B are connected to the fifth connecting bar 102 and the sixth connecting bar.

[0066] In the manufacturing method of the electronic component 10, next, a plating layer 30 is formed on the surfaces of the plurality of leads 3 exposed from the sealing resin 8, and a plating layer is formed on the surfaces of the die pad 2 exposed from the sealing resin 8, for example, by an electroplating method. In the case of using the electroplating method, the electroplated layer can be formed by connecting an electrode of an electroplating device to at least one of the third connecting bar 101, the fourth connecting bar (not shown), the fifth connecting bar 102, and the sixth connecting bar (not shown).

[0067] In the manufacturing method of the electronic component 10, next, the base structure is cut in a manner in which the second connecting bars 62A, 62B are removed, thereby separating the plurality of electronic components 10 from each other. Thus, the electronic component 10 is completed.

[0068] Next, the effects and advantages of the lead frame 1 and the electronic component 10 according to the present embodiment will be described. The plurality of leads 3 are connected to the first connecting bars 61A or 61B, respectively. Here, a comparative example of a lead frame in which the plurality of leads 3 are connected to the second connecting bars 62A or 62B by connecting leads having a certain width instead of the wires 4 will be considered. In the case of manufacturing the electronic component 10 using the lead frame of the comparative example, cut surfaces of the connecting leads are exposed on the side surfaces 12E, 12F of the main body 12 of the electronic component 10, respectively.

[0069] In the electronic component 10 manufactured using the lead frame of the comparative example, the number of the lead lines exposed from the main body 12 increases the number of the connecting lead lines. As a result, in the electronic component 10 manufactured using the lead frame of the comparative example, the risk of the moisture intrusion from the interface of the lead lines and the sealing resin 8 into the inside of the main body 12 becomes high. The risk becomes high as the area of the cut surface of the connecting lead line becomes large.

[0070] On the contrary, in the present embodiment, the plurality of lead lines 3 are connected with the second link bars 62A or 62B via the lead wires 4, respectively. As described above, the cut surfaces of the lead wires 4 are exposed on the side surfaces 12E, 12F of the main body 12 of the electronic component 10, respectively. The cut surfaces of the lead wires 4 are smaller than the cut surfaces of the connecting lead lines. Therefore, in the present embodiment, the risk of the moisture intrusion into the inside of the main body 12 becomes low as compared with the case of using the connecting lead lines. In this way, according to the present embodiment, by using the lead wires 4, it is possible to reduce the risk of the moisture intrusion into the inside of the main body 12.

[0071] Further, since the cut surfaces of the lead wires 4 are smaller than the cut surfaces of the connecting lead lines, according to the present embodiment, it is possible to suppress the abrasion of the cutting saw.

[0072] [Second Embodiment]

[0073] Next, with reference to Figure 7 and Figure 8 , a second embodiment of the present application will be described. Figure 7 is a plan view showing a lead frame to which the present embodiment is applied. Figure 8 is a plan view showing a part of the lead frame shown in Figure 7 .

[0074] The lead frame 1 to which the present embodiment is applied has at least one connecting lead line. At least one of the plurality of lead lines 3 is connected with the at least one connecting lead line via at least one lead wire 4. In the present embodiment, in particular, the lead frame 1 has four connecting lead lines 5 as the at least one connecting lead line. The four connecting lead lines 5 can be plated with Au, Ag, Cu, Ni, or Pd-PPF, respectively.

[0075] The four connecting lead lines 5 each include a wide portion 51 and a connecting portion 52. The lead wire 4 connects the lead line 3 with the wide portion 51. The connecting portion 52 connects the wide portion 51 with the second link bar 62A or 62B. In Figure 7 and Figure 8 , the boundaries of the wide portion 51 and the connecting portion 52, the boundaries of the connecting portion 52 and the second link bar 62A or 62B are shown by broken lines, respectively.

[0076] Figure 8Two specific lead wires 3 explained in the first embodiment are shown. The two specific lead wires 3 are connected to a wide portion 51. The above explanation regarding the two specific lead wires 3 is also applicable to the lead wire 3 at the Y direction end of the four lead wires 3 arranged along the first connecting strip 61 A and the lead wire 3 adjacent to the lead wire 3, provided that the second connecting strip 62A is replaced by the second connecting strip 62B. Likewise, the above explanation regarding the four lead wires 3 arranged along the first connecting strip 61 A is also applicable to the four lead wires 3 arranged along the first connecting strip 61 B, provided that the first connecting strip 61 A is replaced by the first connecting strip 61 B.

[0077] In Figure 7 , the area enclosed by the rectangle of double-dot chain line with reference numeral 8 represents the area sealed by the sealing resin 8 in the electronic component 10 manufactured using the lead frame 1 related to the present embodiment. Further, the area outside the rectangle of double-dot chain line with reference numeral 8 is a predetermined area to be removed in the manufacturing process of the electronic component 10. The first connecting strips 61 A, 61 B, the second connecting strips 62A, 62B, and the connecting lead 5 (the wide portion 51 and the connecting portion 52) are arranged in the predetermined area to be removed in the manufacturing process of the electronic component 10.

[0078] Next, with reference to Figure 8 , the shape (planar shape) of the wide portion 51 as viewed from the Z direction will be explained. In the present embodiment, the planar shape of the wide portion 51 is a quadrangle. Two sides of the quadrangle are parallel to the X direction, and the other two sides of the quadrangle are parallel to the Y direction.

[0079] The wide portion 51 has a first dimension in the Y direction and a second dimension in the X direction. The second dimension can also be equal to or greater than the first dimension. In the case where the second dimension is equal to the first dimension, the planar shape of the wide portion 51 becomes a square. In the case where the second dimension is greater than the first dimension, the planar shape of the wide portion 51 becomes a rectangle.

[0080] Next, the manufacturing method of the electronic component 10 related to the present embodiment will be explained. The manufacturing method of the electronic component 10 related to the present embodiment is the same as the first embodiment until the step of forming the plating layer 30 on the surface of the plurality of lead wires 3 exposed from the sealing resin 8 and the step of forming the plating layer on the surface of the die pad 2 exposed from the sealing resin 8. In the present embodiment, next, the base structure is cut in a manner to remove the second connecting strips 62A, 62B and the connecting lead 5, thereby separating the plurality of electronic components 10 from each other. Thus, the electronic component 10 is completed.

[0081] [Modified Examples]

[0082] Next, the first to fourth modified examples of the lead frame 1 related to the present embodiment will be explained. First, with reference toFigure 9 A first modification of the lead frame 1 will be described. In the first modification, the four connection leads 5 each include a wide portion 53 instead of the wide portion 51 shown in Figure 7 and Figure 8 In Figure 9 , the boundary between the wide portion 53 and the connection portion 52 is indicated by a broken line. The planar shape of the wide portion 53 is polygonal. In the example shown in Figure 9 , in particular, the planar shape of the wide portion 53 is hexagonal. Further, in the case where the planar shape of the wide portion is polygonal, it is not limited to a quadrangle or a hexagon, but can be an n-gon where n is 4 or more.

[0083] Next, a second modification of the lead frame 1 will be described with reference to Figure 10 . In the second modification, the four connection leads 5 each include a wide portion 54 instead of the wide portion 51 shown in Figure 7 and Figure 8 In Figure 10 , the boundary between the wide portion 54 and the connection portion 52 is indicated by a broken line. The planar shape of the wide portion 54 is circular.

[0084] Next, a third modification of the lead frame 1 will be described with reference to Figure 11 . In the third modification, the four connection leads 5 each include a wide portion 55 instead of the wide portion 51 shown in Figure 7 and Figure 8 In Figure 11 , the boundary between the wide portion 55 and the connection portion 52 is indicated by a broken line. The planar shape of the wide portion 55 is elliptical.

[0085] Next, a fourth modification of the lead frame 1 will be described with reference to Figure 12 . In the fourth modification, the lead frame 1 has four connection leads 56 instead of the four connection leads 5. The planar shape of each of the four connection leads 56 is rectangular. The four connection leads 56 can each be plated with Au, Ag, Cu, Ni, or Pd-PPF.

[0086] The wire 4 connects the lead 3 and the connection lead 56. The connection lead 56 is directly connected to the second link bar 62A or 62B. In Figure 12 , the boundary between the connection lead 56 and the second link bar 62A or 62B is indicated by a broken line.

[0087] The other structures, effects, and advantages in the present embodiment are the same as those in the first embodiment.

[0088] Further, the present application is not limited to the above-described embodiments, and various changes can be made. For example, the shapes, numbers, and arrangements of the lead wires and the connection lead wires are not limited to the examples shown in the embodiments, and are arbitrary, as long as the requirements of the claims are satisfied. The planar shape of the connection lead wire or the wide portion can also be another shape, such as a circular-angled polygon, a portion of a circle or an ellipse, or the like.

[0089] Further, some of the plurality of lead wires 3 can also be connected to the second link 62A or 62B through a connection lead wire instead of the wire 4.

[0090] As described above, various modes and modifications of the present application can be implemented. Therefore, the present application can be implemented in modes other than the above-described preferred modes, within the scope equivalent to the claims.

Claims

1. A lead frame, characterized in that, A lead frame for electronic components has the following features: bare die pads; Multiple leads; The frame members surrounding the bare die pads and the plurality of leads; and At least one wire, The frame member includes: a first connecting strip extending along a first direction, and a second connecting strip extending along a second direction. The plurality of leads comprises a plurality of specific leads arranged along the first connecting strip. The multiple specific leads are respectively connected to the first connecting strip. At least one of the plurality of specific leads is connected to the second connecting strip via the at least one conductor. The wire is cut when the second connecting strip is removed, exposing the cut surface of the wire on the side of the main body of the electronic component.

2. The lead frame according to claim 1, characterized in that, A portion of the at least one wire is disposed in a predetermined area that is removed during the manufacturing process of the electronic component.

3. The lead frame according to claim 1, characterized in that, The at least one wire is directly connected to at least one of the plurality of specific leads.

4. The lead frame according to claim 1, characterized in that, The at least one wire is directly connected to the second connecting strip.

5. The lead frame according to claim 4, characterized in that, The second connecting strip is plated with Au, Ag, Cu, Ni or Pd-PPF.

6. The lead frame according to claim 1, characterized in that, It also includes: at least one connecting lead that is connected to the second connecting strip. At least one of the plurality of specific leads is connected to the at least one connecting lead via the at least one conductor.

7. The lead frame according to claim 6, characterized in that, The at least one connecting lead is plated with Au, Ag, Cu, Ni or Pd-PPF.

8. The lead frame according to claim 6, characterized in that, The at least one wire comprises multiple wires. The at least one connecting lead includes a single connecting lead. The plurality of specific leads are connected to the single connecting lead via the plurality of conductors.

9. The lead frame according to claim 8, characterized in that, The at least one connecting lead includes a wide portion. The wide portion has a first dimension in the first direction and a second dimension in the second direction. The second dimension is greater than or equal to the first dimension.

10. The lead frame according to claim 8, characterized in that, The at least one connecting lead includes a wide portion. When viewed from a third direction orthogonal to the first and second directions, the shape of the width portion is an n-sided polygon, a circle, or an ellipse with n=4 or more.

11. The lead frame according to claim 9, characterized in that, The at least one connecting lead also includes a connecting portion that connects the wide portion and the second connecting strip.

12. The lead frame according to claim 9, characterized in that, The wide portion is disposed in a predetermined area that is removed during the manufacturing process of the electronic component.

13. An electronic component, characterized in that, An electronic component manufactured using the lead frame as described in claim 1 comprises: The chip, which is mounted on the bare die pad; and A sealing resin is used to seal the bare die pads and the chip. Each of the multiple leads has an exposed surface that is not covered by the sealing resin.

14. The electronic component according to claim 13, characterized in that, It also has: a coating covering the exposed surface.

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