A microwave and millimeter-wave connector based on high-frequency technology and its assembly method

Abstract

This invention provides a microwave / millimeter-wave connector based on high-frequency technology, comprising a connecting end, an encapsulation structure, and a tail sleeve. The connecting end and tail sleeve are located at both ends of the encapsulation structure. The connecting end includes a housing, a pin, and a front-end fixing block. The front-end fixing block connects the housing and the encapsulation structure. The pin is located in the middle of the housing and is fitted with an insulating fixing medium. An anti-detachment ring is fitted onto the insulating fixing medium, and both the insulating fixing medium and the anti-detachment ring are in contact with the housing. The encapsulation structure includes an encapsulation shell, within which a fixing plate is provided. A substrate and a shielding protective cover are embedded on the fixing plate. A chip element is mounted on the substrate, and the shielding protective cover covers the chip element. The substrate is connected to the pin. The tail sleeve includes a rear-end fixing block, which connects the tail sleeve and the encapsulation structure. This invention achieves a highly integrated and miniaturized design through the connection of the connecting end and the encapsulation structure, while also improving robustness and facilitating maintenance and replacement.

Description

Technical Field

[0001] This invention relates to the field of microwave and millimeter-wave connector technology, and more specifically to a microwave and millimeter-wave connector based on high-frequency technology and its assembly method. Background Technology

[0002] For microwave and millimeter-wave applications, coaxial connectors are an essential topic. A coaxial connector is a component used to connect the ends of two shafts, ensuring that the centerlines of the two shafts are on the same axis. It is generally used to connect a driving shaft and a driven shaft, transmitting the rotational motion of the driving shaft to the driven shaft.

[0003] Of course, there are many types of coaxial connectors: SMA, SMB, SMC, APC-7, K-connectors, etc. Regardless of the type of connector you use, you need to pay attention to its applicable frequency range before use. The frequency range of a connector is limited by the excitation of the first circular waveguide propagation mode in the coaxial structure. Reducing the outer conductor diameter will increase the highest usable frequency; filling the space with insulators will reduce the highest usable frequency and increase system losses. Furthermore, the performance of all connectors is affected by the quality of the connector interface. If the diameters of the inner and outer conductors deviate from the design requirements, the plating quality is poor, or the gap at the connection is large, the reflection coefficient and resistive loss of the interface will be degraded.

[0004] Patent application CN106207616B discloses a quick-connect millimeter-wave connector for testing. The connector includes a connector body, one end of which is a quick-connect structure. The quick-connect structure includes a first housing, with pins disposed inside and an insulating support medium surrounding the pins. The first housing is press-fitted into a second housing, and a contact head is positioned between the first and second housings. A gap exists between the contact head and the first housing, and the contact head also features a slot. By providing a slot on the contact head, signal leakage is avoided, and the quick-connect structure enables rapid connector insertion, improving connection speed.

[0005] With the continuous development of microwave and millimeter-wave technologies, microwave and millimeter-wave components are gradually moving towards miniaturization, high frequency, and high integration. However, during use, high integration can lead to interference between chips connected by connectors, while miniaturization can affect overall heat dissipation. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art by proposing a microwave millimeter-wave connector based on high-frequency technology and its assembly method.

[0007] This invention provides the following technical solution:

[0008] A microwave millimeter-wave connector based on high-frequency technology includes a connecting end, an encapsulation structure, and a tail sleeve, wherein the connecting end and the tail sleeve are disposed at both ends of the encapsulation structure;

[0009] The connection end is used to connect to the required route and includes a housing, a pin, and a front-end fixing block. The front-end fixing block is used to connect the housing and the encapsulation structure. The pin is located in the middle of the housing. The pin is sleeved with an insulating fixing medium. An anti-detachment ring is sleeved on the insulating fixing medium. Both the insulating fixing medium and the anti-detachment ring are in contact with the housing.

[0010] The packaging structure, used for processing and transmitting signals to reduce losses, includes a packaging shell, a fixing plate inside the packaging shell, a substrate and a shielding cover embedded in the fixing plate, a chip element on the substrate, the shielding cover covering the chip element, and the substrate connected to pins.

[0011] The tail sleeve, used to wrap and protect the connecting wire, includes a rear fixing block for connecting the tail sleeve and the encapsulation structure. The tail sleeve wraps the connecting wire, and the connecting wire is connected to the substrate.

[0012] Preferably, the front end of the outer shell is provided with an internal thread section, and the inner surface of the outer shell is provided with a limiting platform protruding ring block. The inner ring of the outer shell is provided with anti-detachment grooves that match the anti-detachment rings. The number of anti-detachment grooves matches the number of anti-detachment rings, and there is at least one anti-detachment ring.

[0013] Preferably, the limiting platform protrusion block has two sections. The inner ring of the front section of the limiting platform protrusion block is a cylindrical through hole, and the rear section of the limiting platform protrusion block has at least one section of frustum-shaped inclined surface. The minimum cross-sectional diameter of the frustum-shaped inclined surface near the packaging structure is greater than the maximum cross-sectional diameter of the front section of the frustum-shaped inclined surface.

[0014] Preferably, the pin is also sleeved with a limiting insulating medium, which is located at the front end of the insulating fixing medium and connected to the limiting platform protruding ring block. The surface of the limiting insulating medium that contacts the frustum-shaped inclined surface is provided with a rubber pad.

[0015] Preferably, the front end of the limiting insulating medium is provided with a circular annular post, and the outer ring of the circular annular post is provided with threads.

[0016] Preferably, the outer rings of the front fixing block and the rear fixing block are both provided with annular grooves, and the front and rear ends of the encapsulation shell are provided with fixing grooves. The tail end of the front fixing block and the front end of the rear fixing block are respectively embedded in the fixing groove at the front end of the encapsulation shell and the fixing groove at the rear end of the encapsulation shell.

[0017] Preferably, the rear end of the outer shell is provided with an internal thread section, and the front end fixing block is provided with two sections. The front section of the front end fixing block is a circular ring cylinder, and the outer ring of the circular ring cylinder is threaded and matches the internal thread section of the rear end of the outer shell.

[0018] Preferably, a circuit network is provided between the fixing plate and the substrate, and an adapter plate is provided on the fixing plate, which is connected to the rear end of the pin.

[0019] Preferably, the encapsulation shell is provided with a sealing partition, the sealing partition is provided with a heat dissipation block and the heat dissipation block is connected to the substrate, the heat dissipation block is provided with a protrusion and the protrusion passes through the sealing partition, and the sealing shell is provided with a heat dissipation vent hole at the position corresponding to the protrusion.

[0020] A preferred assembly method for a microwave / millimeter-wave connector based on high-frequency technology, characterized by the following specific assembly steps:

[0021] S1. The limiting insulating medium and the insulating fixing medium are sequentially sleeved onto the pin, and an anti-detachment ring is sleeved over the fixing insulating medium.

[0022] S2. Insert the pin into the housing and use the assembly tool to press against the insulating fixing medium and push it inward until the anti-disengagement ring is embedded in the anti-disengagement groove in the housing, while the limiting insulating medium presses against the limiting platform protrusion block.

[0023] S3. Insert the annular column of the front fixing block into the rear end of the outer shell, and rotate the front fixing block to connect the front fixing block and the outer shell through the internal thread section of the outer shell and the thread of the annular column.

[0024] S4. The front fixing block is embedded in the fixing groove, and the rear end of the pin is located in the package shell and above the adapter board. The pin and the adapter board are connected by welding. The connecting wire with the tail pressure sleeve is welded to the circuit network, and the front end of the tail pressure sleeve is embedded in the fixing groove.

[0025] S5. Close the sealing shell and secure it with bolts.

[0026] The beneficial effects of this invention are:

[0027] By directly connecting the packaging structure and the connection terminal, the overall structure is miniaturized. Then, the pins are soldered and fixed to the adapter board, avoiding situations where poor contact of the soldering wires or weak soldering would render the device unusable. The shielding cover on the substrate can also protect the chip components when soldering the pins and the adapter board.

[0028] The anti-detachment ring of the connecting end, which is connected by an insulating fixing medium, works in conjunction with the anti-detachment groove of the outer shell to improve the firmness of the pin. At the same time, the circular column of the front fixing block abuts against the insulating fixing medium to reinforce the pin, which greatly improves the stability of the connecting end.

[0029] The limiting platform protruding ring block provided at the connecting end is used to restrict the migration of the insert pin, reducing the situation where the insert pin is pushed forward during the assembly process and improving the assembly qualification rate. Attached Figure Description

[0030] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0031] Figure 1 This is a schematic diagram of the structure of the present invention;

[0032] Figure 2 This is a top view of the structure of the present invention;

[0033] Figure 3 This is an enlarged schematic diagram of the connection end of the present invention;

[0034] The markings in the diagram are as follows: 1-Connecting end, 2-Encapsulation shell, 3-Tail pressure sleeve, 4-Fixing plate, 5-Mounting substrate, 6-Chip component, 7-Circuit network, 8-Shielding cover, 9-Connecting wire, 10-Fixing groove, 11-Front end fixing block, 12-Rear end fixing block, 13-Shell, 14-Pin, 15-Heat sink, 16-Sealing partition, 17-Heat dissipation vent, 18-Insulating fixing medium, 19-Anti-detachment ring, 20-Anti-detachment groove, 21-Limiting platform protruding ring block, 22-Limiting insulating medium, 23-Fixing connecting block, 24-Internal thread section, 25-Adapter plate. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0036] Example 1:

[0037] like Figures 1-3 As shown, a microwave millimeter-wave connector based on high-frequency technology includes a connection end 1, an encapsulation structure, and a tail sleeve 3, with the connection end 1 and the tail sleeve 3 located at both ends of the encapsulation structure.

[0038] The connecting end 1, used for connection to the required route, includes a housing 13, a pin 14, and a front fixing block 11. The front fixing block 11 connects the housing 13 and the encapsulation structure. The pin 14 is located in the middle of the housing 13 and is fitted with an insulating fixing medium 18. An anti-detachment ring 19 is fitted onto the insulating fixing medium 18. Both the insulating fixing medium 18 and the anti-detachment ring 19 are in contact with the housing 13. The front end of the housing 13 has an internal thread section 24, and the housing 13 has a limiting platform protrusion ring block 21 inside. The inner ring of the housing 13 has an anti-detachment groove 20 matching the anti-detachment ring 19. The number of anti-detachment grooves 20 matches the number of anti-detachment rings 19, and there is at least one anti-detachment ring 19. The limiting platform protrusion ring block 21 has two sections. The inner ring of the front limiting platform protrusion ring block 21 is a cylindrical through hole, and the rear limiting platform protrusion ring block 21 has at least one section of a frustum-shaped inclined surface. The minimum cross-sectional diameter of the frustum-shaped inclined surface near the encapsulation structure is greater than the maximum cross-sectional diameter of the front frustum-shaped inclined surface. The pin 14 is also sleeved with a limiting insulating medium 22, which is located at the front end of the insulating fixing medium 18 and connected to the limiting platform protruding ring block 21. The surface of the limiting insulating medium 22 that contacts the frustum-shaped inclined surface is provided with a rubber pad. The front end of the limiting insulating medium 22 is provided with a circular post, and the outer ring of the circular post is provided with threads.

[0039] The encapsulation structure is used to process and transmit signals in order to reduce losses. It includes an encapsulation shell 2, a fixing plate 4 is provided inside the encapsulation shell 2, a substrate and a shielding cover 8 are embedded on the fixing plate 4, a chip element 6 is provided on the substrate, the shielding cover 8 covers the chip element 6, and the substrate is connected to the pin 14.

[0040] The tail sleeve 3 is used to wrap and protect the connecting line 9. It includes a rear fixing block 12. The rear fixing block 12 is used to connect the tail sleeve 3 and the packaging structure. The tail sleeve 3 wraps the connecting line 9, and the connecting line 9 is connected to the substrate.

[0041] The limiting insulating medium 22 and the insulating fixing medium 18 are sequentially sleeved onto the pin 14, and the anti-detachment ring 19 is sleeved onto the insulating fixing medium 18. The pin 14 is embedded in the housing 13, and the insulating fixing medium 18 is pressed inward by the assembly tool until the anti-detachment ring 19 is embedded in the corresponding anti-detachment groove 20.

[0042] Example 2:

[0043] The difference from Embodiment 1 is that the outer ring of the front fixing block 11 and the outer ring of the rear fixing block 12 are both provided with annular grooves, and the front and rear ends of the encapsulation shell 2 are provided with fixing grooves 10. The tail end of the front fixing block 11 and the front end of the rear fixing block 12 are respectively embedded in the fixing groove 10 at the front end of the encapsulation shell 2 and the fixing groove 10 at the rear end of the encapsulation shell 2.

[0044] Open the encapsulation shell 2 of the encapsulation structure, insert the rear end of the front fixing block 11 into the fixing groove 10 at the front end of the sealing shell 2, and at the same time, insert the front end of the rear fixing block 12 into the fixing groove 10 at the rear end of the sealing shell 2. Tighten the encapsulation shell 2 to achieve the effect of fixing the front fixing block 11 and the rear fixing block 12.

[0045] Example 3:

[0046] The difference from Embodiment 2 is that the rear end of the outer shell 13 has an internally threaded section 24, and the front fixing block 11 has two sections. The front section of the front fixing block 11 is a cylindrical ring, and the outer ring of the cylindrical ring is threaded and matches the internally threaded section 24 at the rear end of the outer shell 13. A circuit network 7 is provided between the fixing plate 4 and the substrate. An adapter plate 25 is provided on the fixing plate 4, and the adapter plate 25 is connected to the rear end of the pin 14. A sealing partition 16 is provided inside the encapsulation shell 2. The sealing partition 16 has a heat sink 15 and the heat sink 15 is connected to the substrate. The heat sink 15 has a protrusion that passes through the sealing partition 16. The sealing shell has a heat dissipation vent 17 at the position corresponding to the protrusion.

[0047] The annular post of the front fixing block 11 is embedded in the rear end of the outer shell 13, and the front fixing block 11 is rotated to connect the front fixing block 11 and the outer shell 13 through the internal thread section of the outer shell 13 and the thread of the annular post.

[0048] Simultaneously, the tail end of pin 14 is soldered to adapter board 25, and the connecting wire is soldered to circuit network 7 to achieve connection with circuit network 7 and chip component 6.

[0049] This invention provides an assembly method, the specific assembly steps of which are as follows:

[0050] S1. The limiting insulating medium and the insulating fixing medium are sequentially sleeved onto the pin, and an anti-detachment ring is sleeved over the fixing insulating medium.

[0051] S2. Insert the pin into the housing and use the assembly tool to press against the insulating fixing medium and push it inward until the anti-disengagement ring is embedded in the anti-disengagement groove in the housing, while the limiting insulating medium presses against the limiting platform protrusion block.

[0052] S3. Insert the annular column of the front fixing block into the rear end of the outer shell, and rotate the front fixing block to connect the front fixing block and the outer shell through the internal thread section of the outer shell and the thread of the annular column.

[0053] S4. The front fixing block is embedded in the fixing groove, and the rear end of the pin is located in the package shell and above the adapter board. The pin and the adapter board are connected by welding. The connecting wire with the tail pressure sleeve is welded to the circuit network, and the front end of the tail pressure sleeve is embedded in the fixing groove.

[0054] S5. Close the sealing shell and secure it with bolts.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A microwave millimeter-wave connector based on high-frequency technology, characterized in that, It includes a connecting end, an encapsulation structure, and a tail sleeve, wherein the connecting end and the tail sleeve are located at both ends of the encapsulation structure; The connection end is used to connect to the required route and includes a housing, a pin, and a front-end fixing block. The front-end fixing block is used to connect the housing and the encapsulation structure. The pin is located in the middle of the housing. The pin is sleeved with an insulating fixing medium. An anti-detachment ring is sleeved on the insulating fixing medium. Both the insulating fixing medium and the anti-detachment ring are in contact with the housing. The encapsulation structure, used for processing and transmitting signals to reduce losses, includes an encapsulation shell, a fixing plate inside the encapsulation shell, a substrate and a shielding cover embedded in the fixing plate, a chip element on the substrate, and the shielding cover covering the chip element; a circuit network is provided between the fixing plate and the substrate, an adapter plate is provided on the fixing plate, and the substrate is soldered to the rear end of the pin through the adapter plate; a sealing partition is provided inside the encapsulation shell, the sealing partition has a heat sink connected to the substrate, the heat sink has a protrusion that passes through the sealing partition, and the encapsulation shell has heat dissipation vents at positions corresponding to the protrusions; The tail sleeve, used to wrap and protect the connecting wire, includes a rear fixing block for connecting the tail sleeve and the encapsulation structure. The tail sleeve wraps the connecting wire, and the connecting wire is connected to the substrate.

2. The microwave millimeter-wave connector based on high-frequency technology according to claim 1, characterized in that, The front end of the outer shell is provided with an internal thread section, and the inner shell is provided with a limiting platform protruding ring block. The inner ring of the outer shell is provided with anti-detachment grooves that match the anti-detachment rings. The number of anti-detachment grooves matches the number of anti-detachment rings, and there is at least one anti-detachment ring.

3. A microwave millimeter-wave connector based on high-frequency technology according to claim 2, characterized in that, The limiting platform protrusion block has two sections. The inner ring of the front section of the limiting platform protrusion block is a cylindrical through hole, and the rear section of the limiting platform protrusion block has at least one section of frustum-shaped inclined surface. The minimum cross-sectional diameter of the frustum-shaped inclined surface near the packaging structure is greater than the maximum cross-sectional diameter of the front section of the frustum-shaped inclined surface.

4. A microwave millimeter-wave connector based on high-frequency technology according to claim 3, characterized in that, The pin is also fitted with a limiting insulating medium, which is located at the front end of the insulating fixing medium and connected to the limiting platform protruding ring block. The surface of the limiting insulating medium that contacts the frustum-shaped inclined surface is provided with a rubber pad.

5. A microwave millimeter-wave connector based on high-frequency technology according to claim 4, characterized in that, The front end of the limiting insulating medium is provided with a circular annular post, and the outer ring of the circular annular post is provided with threads.

6. A microwave millimeter-wave connector based on high-frequency technology according to claim 1, characterized in that, The outer rings of the front fixing block and the rear fixing block are both provided with annular grooves. The front and rear ends of the encapsulation shell are provided with fixing grooves. The tail end of the front fixing block and the front end of the rear fixing block are respectively embedded in the fixing groove at the front end of the encapsulation shell and the fixing groove at the rear end of the encapsulation shell.

7. A microwave millimeter-wave connector based on high-frequency technology according to claim 1, characterized in that, The rear end of the outer shell is provided with an internal thread section, and the front end fixing block is provided with two sections. The front section of the front end fixing block is a circular annular column, and the outer ring of the circular annular column is threaded and matches the internal thread section at the rear end of the outer shell.

8. An assembly method for a microwave millimeter-wave connector based on high-frequency technology as described in claim 1, characterized in that, The specific assembly steps are as follows: S1. The limiting insulating medium and the insulating fixing medium are sequentially sleeved onto the pin, and an anti-detachment ring is sleeved over the fixing insulating medium. S2. Insert the pin into the housing and use the assembly tool to press against the insulating fixing medium and push it inward until the anti-disengagement ring is embedded in the anti-disengagement groove in the housing, while the limiting insulating medium presses against the limiting platform protrusion block. S3. Insert the annular column of the front fixing block into the rear end of the outer shell, and rotate the front fixing block to connect the front fixing block and the outer shell through the internal thread section of the outer shell and the thread of the annular column. S4. The front fixing block is embedded in the fixing groove, and the rear end of the pin is located in the package shell and above the adapter board. The pin and the adapter board are connected by welding. The connecting wire with the tail pressure sleeve is welded to the circuit network, and the front end of the tail pressure sleeve is embedded in the fixing groove. S5. Close the sealing shell and secure it with bolts.

Images