A vertical roll coating device for circuit board ink and its roll coating method

Abstract

The present invention relates to a vertical roll coating device for circuit board ink and a roll coating method thereof. The vertical roll coating device for circuit board ink includes a feeding mechanism, a vertical roll coating mechanism, a discharging mechanism, a first vertical weighing mechanism, and a second vertical weighing mechanism. In this application, the vertical roll coating mechanism is adopted to fully utilize the advantages of the vertical roll coating mechanism, with good uniformity of ink coating and not easily damaging the circuit board. In addition, due to the setting of the first vertical weighing mechanism and the second vertical weighing mechanism, which are respectively used to weigh the circuit board before and after coating the ink, the weight of the coated ink can be obtained by subtracting the data of the two weighings. Then, according to the coating area, the average ink thickness can be calculated and compared with the standard data. Within the standard data range, normal continuous production can be carried out. If it exceeds the standard data range, it can be determined that the ink thickness exceeds the standard, and the result is fed back upward to avoid the situation of batch unqualified products and reduce the adverse impact on the yield.

Description

Technical Field

[0001] This application relates to the technical field of circuit board processing, and in particular to a vertical roll coating device for circuit board ink and its roll coating method. Background Art

[0002] In the prior art, screen printing machines are generally used to print inks with various functions on the surface of circuit boards. The printing principle of a screen printing machine is to use a tensioned elastic screen to carry the ink, and then use a squeegee to press down and move left and right to transfer the ink to the surface of the circuit board. This ink coating method is more suitable for relatively hard circuit boards and less suitable for MiniLED circuit boards. Firstly, when screen printing, the squeegee needs to be pressed down forcefully, which is likely to damage the MiniLED circuit board because the MiniLED circuit board is thin and brittle. Secondly, the screen printing process determines that the stability of the ink thickness printed is not good. When encountering products with high requirements for ink thickness, the yield of the products will be reduced. Using a vertical coater can well solve the problem of damaging the MiniLED circuit board. A vertical coater generally uses two horizontally opposed and reversely rotating coating rollers for ink coating and does not use a squeegee, so it is not easy to damage the MiniLED circuit board, and the coated thickness is relatively uniform. For example, a Chinese patent application with the publication number CN201862541U and the name "Vertical PCB Automatic Double-sided Coater" discloses a vertical coater. However, during the continuous coating production process of this vertical coater, when the ink thickness fluctuates greatly and even exceeds the standard requirements, it cannot be timely feedback, which is likely to produce batches of unqualified products, seriously affecting the yield of the products, and there is room for further improvement. Summary of the Invention

[0003] In order to solve the technical problems that in the prior art, when coating ink on a MiniLED circuit board using a screen printing process, it is easily damaged by a squeegee and the stability of the printed ink thickness is poor, the present invention provides a vertical roll coating device for circuit board ink and its roll coating method.

[0004] A vertical roll coating device for circuit board ink provided by this application adopts the following technical solution: A vertical roll coating device for circuit board ink includes a loading mechanism, a vertical roll coating mechanism, an unloading mechanism, a first vertical weighing mechanism, and a second vertical weighing mechanism;

[0005] The loading mechanism is used to vertically feed the circuit board into the vertical roll coating mechanism;

[0006] The vertical roll coating mechanism is used to coat ink on the surface of the circuit board;

[0007] The unloading mechanism is used to receive the circuit board after coating ink;

[0008] The first vertical weighing mechanism is used to weigh the circuit board before coating ink;

[0009] The second vertical weighing mechanism is used to weigh the circuit board after coating with ink.

[0010] By adopting the above technical solution, the present application uses a vertical roll coating mechanism, making full use of the advantages of the vertical roll coating mechanism, such as good uniformity of ink coating and not easily damaging the thin and brittle MiniLED circuit board; in addition, due to the setting of the first vertical weighing mechanism and the second vertical weighing mechanism, which are respectively used to weigh the circuit board before and after coating with ink, the weight of the coated ink can be obtained by subtracting the data of the two weighings. Then, according to the coating area, the average ink thickness can be calculated, and compared with the standard data. Within the standard data range, normal continuous production can be carried out. If it exceeds the standard data range, it can be determined that the ink thickness exceeds the standard, and the result is fed back upward (to the control system), so that the staff can timely obtain the result and make corresponding adjustments, avoiding the situation of batch unqualified products and reducing the adverse impact on the yield.

[0011] Preferably, the vertical ink roll coating equipment for circuit boards further includes a center positioning machine, a temporary storage machine, a cleaning machine, a loading and flipping mechanism, a circuit board conveying mechanism, a baking mechanism, a cooling mechanism, and an unloading and flipping mechanism;

[0012] The center positioning machine is used to horizontally receive and convey the circuit board, center-position the circuit board, and convey the circuit board to the next process;

[0013] The temporary storage machine is used to temporarily store the circuit board conveyed by the center positioning machine and convey the circuit board to the next process;

[0014] The cleaning machine is used to clean the surface of the circuit board conveyed by the temporary storage machine and convey the circuit board to the next process;

[0015] The loading and flipping mechanism is used to flip the circuit board conveyed from the cleaning machine from a horizontal state to a vertical state;

[0016] The loading mechanism is also used to receive the circuit board flipped by the loading and flipping mechanism and vertically feed the circuit board into the vertical roll coating mechanism;

[0017] The circuit board conveying mechanism is used to receive the circuit board conveyed from the unloading mechanism and sequentially feed the circuit board into the baking mechanism and the cooling mechanism;

[0018] The baking mechanism is used to bake the circuit board after coating with ink;

[0019] The cooling mechanism is used to cool the baked circuit board;

[0020] The unloading and flipping mechanism is used to receive the circuit board conveyed by the circuit board conveying mechanism and flip the circuit board to a horizontal state.

[0021] By adopting the above technical solution, the present application can achieve automatic coating of the circuit board ink vertical coating equipment by setting a central positioning machine, a temporary storage machine, a cleaning machine, a loading and flipping mechanism, a circuit board running mechanism, a baking mechanism, a cooling mechanism, and a discharging and flipping mechanism.

[0022] Preferably, the vertical coating mechanism includes a base, a pair of coating rollers, a coating roller rotation drive assembly, a coating roller spacing adjustment assembly, a scraper assembly, a scraper extrusion drive assembly, and an ink tray. The coating rollers, the coating roller rotation drive assembly, the coating roller spacing adjustment assembly, the scraper assembly, the scraper extrusion drive assembly, and the ink tray are all arranged on the base. The coating roller rotation drive assembly is used to drive the two coating rollers to rotate in opposite directions. The coating roller spacing adjustment assembly is used to adjust the spacing between the two coating rollers to adapt to circuit boards of different thicknesses. The coating rollers dip ink from the ink tray. The scraper assembly is used to scrape the ink on the coating rollers. The scraper extrusion drive assembly is used to drive the scraper assembly to move to control the contact degree between the scraper assembly and the coating rollers, thereby controlling the film thickness of the ink on the coating rollers.

[0023] By adopting the above technical solution, the vertical coating mechanism can adjust the spacing between the two coating rollers to adapt to circuit boards of different thicknesses, control the contact degree between the scraper assembly and the coating rollers, thereby controlling the film thickness of the ink on the coating rollers, and can enhance the applicability of the equipment.

[0024] Preferably, the loading mechanism includes a first moving platform, a second moving platform, an upper clamping plate assembly, and a lower clamping plate assembly. The first moving platform is used to drive the upper clamping plate assembly to move up and down and horizontally. The upper clamping plate assembly is used to clamp the flipped circuit board and send it between the two coating rollers for coating. The second moving platform is used to drive the lower clamping plate assembly to move up and down. The lower clamping plate assembly is used to receive the circuit board transmitted by the upper clamping plate assembly and make the circuit board continue to move downward completely through the two coating rollers.

[0025] By adopting the above technical solution, the loading mechanism can achieve the loading function and can ensure that the entire circuit board can be coated.

[0026] Preferably, the first vertical weighing mechanism includes a mounting rod, a first mounting seat, two air grippers, an air gripper fixing seat, a weighing sensor, a sensor support, and a shock pad. The first mounting seat is arranged on the mounting rod. The weighing sensor is arranged on the sensor support. The sensor support is arranged on the first mounting seat. The shock pad is located between the first mounting seat and the sensor support. The air gripper fixing seat is arranged on the mounting rod in a vertically slidable manner and is located above the weighing sensor. The two air grippers are arranged at both ends of the air gripper fixing seat and are used for gripping the circuit board. The second vertical weighing mechanism has the same structure as the first vertical weighing mechanism and is arranged on the blanking mechanism.

[0027] By adopting the above technical solution, the positions of the first vertical weighing mechanism and the second vertical weighing mechanism are reasonably arranged, which will not affect the loading and unloading, and can accurately measure the weight of the circuit board before and after coating.

[0028] Preferably, the loading and flipping mechanism includes a second mounting seat, a fixing frame, a first rotating shaft, a first conveying roller mechanism, a baffle assembly, a flipping motion module, a needle bed, a first lifting module, and a first clamping assembly. The first rotating shaft is rotatably arranged on the second mounting seat. The fixing frame is fixedly arranged on the first rotating shaft. The first conveying roller mechanism, the baffle assembly, the needle bed, the first lifting module, and the first clamping assembly are all arranged on the fixing frame. The first conveying roller mechanism is used for receiving the circuit board conveyed by the cleaning machine. The baffle assembly is used for blocking the circuit board from continuing to move forward. The second lifting module is used for driving the needle bed to lift and lower. The needle bed is used for jacking up the circuit board on the first conveying roller mechanism. The first clamping assembly is used for clamping and fixing the circuit board jacked up by the needle bed. The flipping motion module is used for driving the first rotating shaft to rotate, so that the fixing frame, the first conveying roller mechanism, the baffle assembly, the needle bed, the first lifting module, and the first clamping assembly are rotated from the horizontal state to the vertical state as a whole.

[0029] By adopting the above technical solution, the loading and flipping mechanism can clamp the circuit board and realize the 90° flipping function. The circuit board is aligned by the baffle assembly and will not tilt.

[0030] Preferably, the circuit board running mechanism includes a fourth rotating shaft, a sprocket, a double-row drive chain, a rotation driving mechanism, and a suspended clamping plate assembly. The sprocket is arranged on the fourth rotating shaft. The rotation driving mechanism is used for driving the fourth rotating shaft to rotate. The double-row drive chain is engaged with the sprocket for transmission. The suspended clamping plate assembly is arranged on the double-row drive chain.

[0031] By adopting the above technical solution, due to the adoption of the double-row drive chain to replace the commonly used double-pitch chain in the prior art, the distance between the suspended clamping plate assemblies is smaller. When the baking time is the same, the length of the oven can be reduced.

[0032] Preferably, the blanking and flipping mechanism comprises a mounting plate, a first motor, a third rotating shaft, a rotating arm, a first cylinder, a clamping jaw and a third rotating shaft. The first motor and the third rotating shaft are arranged on the mounting plate. The first motor is used to drive the third rotating shaft to rotate. The rotating arm is arranged on the third rotating shaft and rotates with the third rotating shaft. The clamping jaw is arranged at the outer end of the rotating arm through the third rotating shaft. The piston rod of the first cylinder is connected to one end of the clamping jaw and is used to drive the clamping jaw to rotate so as to clamp the circuit board.

[0033] By adopting the above technical solution, the present application uses a clamping jaw to clamp the upper edge of the circuit board, replacing the suction cup in the prior art, and no suction cup mark will be generated on the surface of the circuit board.

[0034] Another technical solution provided by the present application is: a coating method for the vertical roll coating equipment of the above-mentioned circuit board, comprising the following steps:

[0035] S1: Place the circuit board on the central positioning machine, use the central positioning machine to center the circuit board, and transfer the circuit board to the temporary storage machine;

[0036] S2: Use the temporary storage machine to temporarily store the circuit board transferred by the central positioning machine and transfer the circuit to the cleaning machine;

[0037] S3: Use the cleaning machine to clean the surface of the circuit board and transfer the cleaned circuit board to the blanking and flipping mechanism;

[0038] S4: Use the blanking and flipping mechanism to flip the circuit board from a horizontal state to a vertical state;

[0039] S5: Use the loading mechanism to take out the flipped circuit board, and use the first vertical weighing mechanism to weigh the circuit board without coated ink;

[0040] S6: Use the loading mechanism to transfer the circuit board to the vertical roll coating mechanism to perform coating treatment on the surface of the circuit board;

[0041] S7: Use the unloading mechanism to take away the circuit board coated with ink;

[0042] S8: Use the second vertical weighing mechanism to weigh the circuit board coated with ink. Calculate the weight of the coated ink through the data of the secondary weighing. If it is within the preset weight range, continue to flow downward. If it is not within the preset weight range, stop flowing downward and perform alarm processing;

[0043] S9: Use the unloading mechanism to transfer the circuit board coated with ink to the circuit board running mechanism;

[0044] S10: Use the circuit board transfer mechanism to transfer the circuit board coated with ink to the baking mechanism and the cooling mechanism, use the baking mechanism to bake the circuit board, and use the cooling mechanism to cool the baked circuit board;

[0045] S11: Use the circuit board transfer mechanism to transfer the cooled circuit board to the blanking and flipping mechanism;

[0046] S12: Use the blanking and flipping mechanism to flip the circuit board to a horizontal state.

[0047] By adopting the above technical solution, the coating method of the circuit board ink vertical roll coating equipment in this application is automated coating with a high degree of intelligence. The vertical roll coating mechanism is adopted to make full use of the advantages of the vertical roll coating mechanism. The first vertical weighing mechanism and the second vertical weighing mechanism are set, which can feedback the results upward to avoid the situation of batch unqualified products and reduce the adverse impact on the yield.

[0048] Preferably, the surface of the circuit board is coated for the first time through steps S1 to S10 to make the surface of the circuit board flat, so as to solve the problem of height difference on the surface of the circuit board; the transfer manipulator is used for transfer, and steps S5 to S12 are repeated to coat the surface of the circuit board for the second time to make the ink on the surface of the circuit board reach the designed thickness.

[0049] By adopting the above technical solution, in this application, through two coatings, the ink thickness of each coating is correspondingly reduced, and the sum of the two ink thicknesses is equal to the designed thickness. Since the coating roller is a soft rubber roller, different deformation amounts are caused by different pressures. The higher positions on the surface of the circuit board are under greater pressure, and the ink coating thickness is thinner. The lower positions are under less pressure, and the ink coating thickness is thicker. After the first coating, the surface of the circuit board will be flatter than before, that is, the overall height difference will become smaller. After the second coating, the surface of the circuit board will be even flatter, and the appearance of the circuit board will also be more beautiful.

[0050] In summary, this application includes at least one of the following beneficial technical effects:

[0051] 1. The vertical roll coating mechanism is adopted to make full use of the advantages of the vertical roll coating mechanism, with good ink coating uniformity and not easy to damage the thin and brittle MiniLED circuit board;

[0052] 2. The first vertical weighing mechanism and the second vertical weighing mechanism are set, which can timely feedback the results upward to avoid the situation of batch unqualified products and reduce the adverse impact on the yield;

[0053] 3. Through two coatings, the surface of the circuit board will be even flatter, and the appearance of the circuit board will also be more beautiful. Description of the Drawings

[0054] Figure 1Shows the overall structure diagram of the vertical roll coating equipment for the circuit board ink in the first embodiment of the present application;

[0055] Figure 2 Shows the layout diagram of the center positioning machine, the temporary storage machine and the cleaning machine in the first embodiment of the present application;

[0056] Figure 3 Shows the structural schematic diagram of the center positioning machine in the first embodiment of the present application;

[0057] Figure 4 Shows the structural schematic diagram of the temporary storage machine in the first embodiment of the present application;

[0058] Figure 5 Shows the structural schematic diagram of the temporary storage machine from another angle in the first embodiment of the present application;

[0059] Figure 6 Shows the operation principle diagram of the cleaning machine in the first embodiment of the present application;

[0060] Figure 7 Shows the overall structural schematic diagram of the loading and flipping mechanism in the first embodiment of the present application;

[0061] Figure 8 Shows the structural schematic diagram of the first conveying roller mechanism, the baffle assembly and the needle bed in the first embodiment of the present application;

[0062] Figure 9 Shows the exploded structural schematic diagram of the first conveying roller mechanism, the baffle assembly, the needle bed and the second centering positioning plate mechanism in the first embodiment of the present application;

[0063] Figure 10 Shows the structural schematic diagram of the baffle assembly in the first embodiment of the present application;

[0064] Figure 11 Shows the structural schematic diagram of the flipping motion module in the first embodiment of the present application;

[0065] Figure 12 Shows the structural schematic diagram of the upper clamping plate assembly in the first embodiment of the present application;

[0066] Figure 13 Shows the structural schematic diagram of the vertical roll coating mechanism in the first embodiment of the present application;

[0067] Figure 14 Shows the structural schematic diagram of the vertical roll coating mechanism from another angle in the first embodiment of the present application;

[0068] Figure 15 Shows the structural schematic diagram of the first vertical weighing mechanism in the first embodiment of the present application;

[0069] Figure 16Shows the structural schematic diagram of the lower clamping plate assembly and the second moving platform in the first embodiment of the present application;

[0070] Figure 17 Shows the structural schematic diagram of the lower clamping plate assembly and the second moving platform from another angle in the first embodiment of the present application;

[0071] Figure 18 Shows the structural schematic diagram of the circuit board operation mechanism in the first embodiment of the present application;

[0072] Figure 19 Shows the structural schematic diagram of the circuit board operation mechanism from another angle in the first embodiment of the present application;

[0073] Figure 20 Shows the structural schematic diagram of the hanging clamping plate assembly in the first embodiment of the present application;

[0074] Figure 21 Shows the structural schematic diagram of the baking mechanism in the first embodiment of the present application;

[0075] Figure 22 Shows the structural schematic diagram of the cooling mechanism in the first embodiment of the present application;

[0076] Figure 23 Shows the structural schematic diagram of the blanking turnover mechanism in the first embodiment of the present application (vertical state);

[0077] Figure 24 Shows Figure 23 The enlarged view at A in

[0078] Figure 25 Shows the structural schematic diagram of the blanking turnover mechanism in the first embodiment of the present application (horizontal state);

[0079] Figure 26 Shows Figure 25 The enlarged view at B in

[0080] Figure 27 Shows the structural schematic diagram of the blanking roller conveying mechanism in the first embodiment of the present application;

[0081] Figure 28 Shows the structural schematic diagram of the blanking roller conveying mechanism in the first embodiment of the present application (with the cover removed);

[0082] Figure 29 Shows the layout diagram of the main components of the circuit board ink vertical rolling coating equipment in the first embodiment of the present application;

[0083] Figure 30 Shows the overall structure of the circuit board ink vertical rolling coating equipment in the second embodiment of the present application.

[0084] Description of reference numerals in the drawings: 1. Loading mechanism; 11. First moving platform; 12. Second moving platform; 13. Upper clamping plate assembly; 131. Fourth mounting seat; 132. Pneumatic slide; 133. First air gripper; 134. Second air gripper; 135. Crossed roller guide; 14. Lower clamping plate assembly; 141. Third air gripper; 142. Air gripper driving mechanism; 1421. Fifth motor; 1422. Second coupling; 1423. Lead screw slider assembly; 2. Vertical roller coating mechanism; 21. Base; 211. Bottom plate; 212. Fixed mounting seat; 213. Movable mounting seat; 22. Coating roller; 23. Coating roller rotation driving assembly; 231. Third motor; 232. First coupling; 233. Second lead screw; 234. Bevel gear set; 235. Spur gear set; 236. Transmission rod; 24. Coating roller spacing adjustment assembly; 241. Fourth motor; 242. Second lead screw transmission assembly; 25. Blade assembly; 26. Blade extrusion driving assembly; 27. Ink tray; 3. Unloading mechanism; 4. First vertical weighing mechanism; 41. Mounting rod; 42. First mounting seat; 43. Fourth air gripper; 44. Air gripper fixing seat; 45. Weighing sensor; 46. Sensor support; 47. Shock pad; 5. Second vertical weighing mechanism; 6. Center positioning machine; 61. Roller conveyor mechanism; 62. First centering positioning plate mechanism; 7. Temporary storage machine; 71. Second conveying roller mechanism; 72. Temporary storage rack; 721. Support rod; 73. Temporary storage rack lifting mechanism; 8. Cleaning machine; 81. Dust sticking wheel; 82. Intermediate adsorption roller; 83. Third conveying roller mechanism; 9. Loading turnover mechanism; 91. Second mounting seat; 92. Fixed frame; 93. First rotating shaft; 94. First conveying roller mechanism; 95. Baffle assembly; 96. Turning motion module; 961. Third mounting seat; 962. Slide rail slider assembly; 963. Second motor; 964. First lead screw transmission assembly; 965. Link assembly; 97. Pin bed; 98. First lifting module; 99. First clamping assembly; 991. Second centering positioning plate mechanism; 10. Circuit board running mechanism; 101. Fourth rotating shaft; 102. Sprocket; 103. Double-row transmission chain; 104. Rotation driving mechanism; 105. Suspended clamping plate assembly; 201. Baking mechanism; 202. Cooling mechanism; 203. Unloading turnover mechanism; 2031. Mounting plate; 2032. First motor; 2033. Second rotating shaft; 2034. Rotating arm; 2035. First cylinder; 2036. Claw; 2037. Third rotating shaft; 204. Unloading roller conveying mechanism; 2041. Cover plate; 205. Transfer manipulator. Detailed implementation manners

[0085] The following further elaborates on this application in conjunction with the attached Figures 1 - 30 drawings.

[0086] Embodiment 1:

[0087] Reference Figure 1 and Figure 29 Figure 29 , an embodiment of the present application discloses a vertical rolling coating device for circuit board ink, including a central positioning machine 6, a temporary storage machine 7, a cleaning machine 8, a loading turnover mechanism 9, a loading mechanism 1, a vertical rolling coating mechanism 2, a discharging mechanism 3, a first vertical weighing mechanism 4, a second vertical weighing mechanism 5, a circuit board running mechanism 10, a baking mechanism 201, a cooling mechanism 202, and a discharging turnover mechanism 203.

[0088] The central positioning machine 6 is used to horizontally receive and transfer the circuit board, center-position the circuit board, and transfer the circuit board to the next process; the temporary storage machine 7 is used to temporarily store the circuit board transferred by the central positioning machine 6 and transfer the circuit board to the next process; the cleaning machine 8 is used to clean the surface of the circuit board transferred by the temporary storage machine 7 and transfer the circuit board to the next process; the loading turnover mechanism 9 is used to turn the circuit board transferred from the cleaning machine 8 from a horizontal state to a vertical state; the loading mechanism 1 is used to receive the turned-over circuit board and vertically feed the circuit board into the vertical rolling coating mechanism 2; the vertical rolling coating mechanism 2 is used to coat the surface of the circuit board with ink; the discharging mechanism 3 is used to receive the circuit board coated with ink; the first vertical weighing mechanism 4 is used to weigh the circuit board without ink coating; the second vertical weighing mechanism 5 is used to weigh the circuit board coated with ink; the circuit board running mechanism 10 is used to receive the circuit board transferred from the discharging mechanism 3 and sequentially feed the circuit board into the baking mechanism 201 and the cooling mechanism 202; the baking mechanism 201 is used to bake the circuit board coated with ink; the cooling mechanism 202 is used to cool the baked circuit board; the discharging turnover mechanism 203 is used to receive the circuit board transferred by the circuit board running mechanism 10 and turn the circuit board to a horizontal state.

[0089] The rolling coating method of the above-mentioned vertical rolling coating device for circuit board ink includes the following steps:

[0090] S1: Place the circuit board on the central positioning machine 6, use the central positioning machine 6 to center-position the circuit board, and transfer the circuit board to the temporary storage machine 7;

[0091] S2: Use the temporary storage machine 7 to temporarily store the circuit board transferred by the central positioning machine 6 and transfer the circuit to the cleaning machine 8;

[0092] S3: Use the cleaning machine 8 to clean the surface of the circuit board and transfer the cleaned circuit board to the loading turnover mechanism 9;

[0093] S4: Use the loading turnover mechanism 9 to turn the circuit board from a horizontal state to a vertical state;

[0094] S5: Use the loading mechanism 1 to take out the circuit board from the loading and flipping mechanism 9, and use the first vertical weighing mechanism 4 to weigh the uncoated circuit board.

[0095] S6: Use the loading mechanism 1 to transfer the circuit board to the vertical roll coating mechanism 2 for coating the surface of the circuit board.

[0096] S7: Use the unloading mechanism 3 to take away the circuit board after coating with ink.

[0097] S8: Use the second vertical weighing mechanism 5 to weigh the circuit board after coating with ink. Calculate the weight of the coated ink through the data of the two weighings. If it is within the preset weight range, continue to flow downward; if it is not within the preset weight range, stop flowing downward and perform alarm processing.

[0098] S9: Use the unloading mechanism 3 to transfer the circuit board after coating with ink to the circuit board transfer mechanism 10.

[0099] S10: Use the circuit board transfer mechanism 10 to transfer the circuit board after coating with ink to the baking mechanism 201 and the cooling mechanism 202. Use the baking mechanism 201 to bake the circuit board, and use the cooling mechanism 202 to cool the baked circuit board.

[0100] S11: Use the circuit board transfer mechanism 10 to transfer the cooled circuit board to the unloading and flipping mechanism 203.

[0101] S12: Use the unloading and flipping mechanism 203 to flip the circuit board to a horizontal state.

[0102] This application adopts the vertical roll coating mechanism 2, making full use of the advantages of the vertical roll coating mechanism 2, such as good uniformity of ink coating and not easily damaging the thin and brittle MiniLED circuit board. In addition, due to the setting of the first vertical weighing mechanism 4 and the second vertical weighing mechanism 5, which are respectively used to weigh the circuit board before and after coating with ink, the weight of the coated ink can be obtained by subtracting the data of the two weighings. Then, according to the coating area, the average ink thickness can be calculated and compared with the standard data. If it is within the standard data range, normal continuous production can be carried out; if it exceeds the standard data range, it can be determined that the ink thickness exceeds the standard, and the result is fed back upward (to the control system), so that the staff can timely obtain the result and make corresponding adjustments, avoiding the situation of batch unqualified products and reducing the adverse impact on the yield.

[0103] Refer to Figure 2 and Figure 3, the center positioning machine 6 includes a roller conveying mechanism 61 and a first centering and positioning clamping mechanism 62. The roller conveying mechanism 61 is used to convey the circuit board. The first centering and positioning clamping mechanism 62 is arranged on both sides in the circuit board conveying direction. Through the clamping action, the circuit board can be centered and aligned, which can solve the technical problems of insufficient feeding accuracy during feeding, resulting in left and right offset and tilt of the circuit board, and at the same time can reduce the requirement for feeding accuracy.

[0104] Referring to Figure 2 , Figure 4 and Figure 5 , the buffer machine 7 includes a second conveying roller mechanism 71, a buffer rack 72 and a buffer rack lifting mechanism 73. The buffer rack 72 can collect the circuit boards that are not processed in time at the back end layer by layer, and then convey the circuit boards to the next process in time according to the requirements of the back end. Specifically, the buffer rack 72 includes multiple layers of support rods 721, and each layer of support rods 721 can support a circuit board. The buffer rack lifting mechanism 73 drives the buffer rack 72 to lift one grid each time. When lifting upward, the circuit boards on the second conveying roller mechanism 71 can be buffered. When lowering, the buffered circuit boards can be placed back on the second conveying roller mechanism 71, and the second conveying roller mechanism 71 then conveys the circuit boards to the next process in time.

[0105] Referring to Figure 2 and Figure 6 , the cleaning machine 8 includes a dust sticking wheel 81, an intermediate adsorption roller 82 and a third conveying roller mechanism 83. The dust sticking wheel 81 is provided with dust sticking paper. The third conveying roller mechanism 83 is used to convey the circuit board forward. The intermediate adsorption roller 82 is in direct contact with the surface of the circuit board and can stick the dust on the surface of the circuit board. The dust sticking paper on the dust sticking wheel 81 has stronger adhesiveness and can adsorb the dust on the intermediate adsorption roller 82. When the dust sticking paper gets dirty to a certain extent, it can be replaced in time. Generally, a set of dust sticking wheel 81 and intermediate adsorption roller 82 are provided on both the upper and lower surfaces of the circuit board to clean the upper and lower surfaces of the circuit board at the same time. The dust sticking wheel 81 is generally arranged in the drawer of the cleaning machine 8. A linear slide rail can be arranged in the drawer, and the dust sticking wheel 81 is slidably arranged in the drawer through the linear slide rail and can be detachably placed for easy extraction and replacement of the dust sticking paper.

[0106] Referring to Figures 7 to 11, the loading and flipping mechanism 9 includes a second mounting base 91, a fixing frame 92, a first rotating shaft 93, a first conveying roller mechanism 94, a baffle assembly 95, a flipping motion module 96, a needle bed 97, a first lifting module 98 and a first clamping assembly 99. The first rotating shaft 93 is rotatably arranged on the second mounting base 91, the fixing frame 92 is fixedly arranged on the first rotating shaft 93, and the first conveying roller mechanism 94, the baffle assembly 95, the needle bed 97, the first lifting module 98 and the first clamping assembly 99 are all arranged on the fixing frame 92. The first conveying roller mechanism 94 is used to receive the circuit board conveyed by the cleaning machine 8, and the baffle assembly 95 is used to block the continuous advancement of the circuit board. The second lifting module is used to drive the needle bed 97 to lift and lower, the needle bed 97 is used to lift up the circuit board on the first conveying roller mechanism 94, and the first clamping assembly 99 is used to clamp and fix the circuit board lifted by the needle bed 97. The flipping motion module 96 is used to drive the first rotating shaft 93 to rotate, so that the fixing frame 92, the first conveying roller mechanism 94, the baffle assembly 95, the needle bed 97, the first lifting module 98 and the first clamping assembly 99 are rotated from the horizontal state to the vertical state as a whole.

[0107] The needle bed 97 is covered with ejector pins. The ejector pins can pass through the first conveying roller mechanism 94 to lift up the circuit board. Due to the large number and dense layout of the ejector pins, it is not easy to deform the circuit board when lifting. The first conveying roller mechanism 94 can adopt a magnetic wheel group drive to replace the belt transmission in the prior art, which can greatly reduce the generation of dust, approach dust-free transmission, and keep the surface of the circuit board clean.

[0108] Refer to Figure 11 , the flipping motion module 96 includes a third mounting base 961, a slide rail and slider assembly 962, a second motor 963, a first lead screw drive assembly 964 and a connecting rod assembly 965. The slide rail and slider assembly 962, the second motor 963 and the first lead screw drive assembly 964 are all arranged on the third mounting base 961. The second motor 963 drives the slider to lift and lower through the first lead screw drive assembly 964. One end of the connecting rod assembly 965 is hinged to the slider, and the other end is hinged to the fixing frame 92. The second motor 963 rotates to drive the first lead screw drive assembly 964 to work. The first lead screw drive assembly 964 then drives the slider to lift and lower. The lifting and lowering of the slider drives the fixing frame 92 to rotate through the connecting rod assembly 965. The fixing frame 92 rotates 90° around the first rotating shaft 93 from the horizontal state to the vertical state. The flipping motion module 96 has sufficient power, a stable thrust direction, and smooth movement. By controlling the upper and lower extreme positions of the slider, the flipping angle of the circuit board can be well controlled.

[0109] Refer to Figure 9The loading and turning mechanism 9 also includes a second centering positioning clapper mechanism 991. Before being clamped by the first clamping assembly 99, the second centering positioning clapper mechanism 991 is used to push the circuit board to the center and forward direction, thereby improving the positioning accuracy of the circuit board when it is transmitted in a vertical state.

[0110] Reference Figure 14 and Figure 15 The vertical rolling mechanism 2 includes a base 21, a pair of coating rollers 22, a coating roller rotation drive assembly 23, a coating roller spacing adjustment assembly 24, a scraper assembly 25, a scraper extrusion drive assembly 26 and an ink tray 27. The coating roller 22, the coating roller rotation drive assembly 23, the coating roller spacing adjustment assembly 24, the scraper assembly 25, the scraper extrusion drive assembly 26 and the ink tray 27 are all arranged on the base 21. The coating roller rotation drive assembly 23 is used to drive the two coating rollers 22 to rotate in opposite directions. The coating roller spacing adjustment assembly 24 is used to adjust the spacing between the two coating rollers 22 to adapt to circuit boards of different thicknesses. The coating roller 22 dips ink from the ink tray 27. The scraper assembly 25 is used to scrape the ink on the coating roller 22. The scraper extrusion drive assembly 26 is used to drive the scraper assembly 25 to move to control the abutment between the scraper assembly 25 and the coating roller 22, thereby controlling the film thickness of the ink on the coating roller 22.

[0111] Reference Figure 14 The coating roller rotation drive assembly 23 includes a third motor 231, a first coupling 232, a second screw rod 233, two sets of bevel gear sets 234, two sets of spur gear sets 235 and two transmission rods 236. The third motor 231 is connected to the second screw rod 233 through the first coupling 232, and the second screw rod 233 is connected to the two transmission rods 236 through the two sets of bevel gear sets 234. The two sets of bevel gear sets 234 are arranged in opposite directions to reverse the rotation direction of the second screw rod 233. The two transmission rods 236 are connected to the two coating rollers 22 through the two sets of spur gear sets 235. The third motor 231 drives the second screw rod 233 to rotate, and the second screw rod 233 drives the two sets of bevel gears to rotate. Since the two sets of bevel gear sets 234 are arranged in reverse, the two transmission rods 236 rotate in opposite directions. The two transmission rods 236 then drive the two coating rollers 22 to rotate in reverse through the two sets of spur gear sets 235 to achieve the coating function.

[0112] Reference Figure 14 The base 21 includes a bottom plate 211, a fixed mounting seat 212 and a movable mounting seat 213. The fixed mounting seat 212 is fixedly arranged on the bottom plate 211, and the movable mounting seat 213 is slidably arranged on the bottom plate 211 through a guide rail. The movable mounting seat 213 can approach and move away from the fixed mounting seat 212. The two coating rollers 22 are respectively arranged on the fixed mounting seat 212 and the movable mounting seat 213. Figure 15, the coating roller spacing adjustment assembly 24 includes a fourth motor 241 and a second lead screw drive assembly 242. The fourth motor 241 drives the movable mounting seat 213 to move through the second lead screw drive assembly 242. One of the coating rollers 22 follows the movement of the movable mounting seat 213, approaching or moving away from the other coating roller 22, thereby realizing the adjustment of the coating spacing to adapt to the coating operation of circuit boards with different thicknesses.

[0113] Refer to Figure 14 , the squeegee extrusion drive assembly 26 is a cylinder group, connected to the squeegee assembly 25, and is used to drive the squeegee assembly 25 to approach or move away from the coating roller 22. There are two sets of squeegee assemblies 25 and squeegee extrusion drive assemblies 26, which are respectively installed on the fixed mounting seat 212 and the movable mounting seat 213. The ink tray 27 is arranged between the fixed mounting seat 212 and the bottom plate 211, below the coating roller 22. One side of the ink tray 27 is bent to prevent ink leakage. When the coating roller 22 rotates, it can dip the ink. The squeegee assembly 25 evenly distributes the ink on the surface of the coating roller 22, and the coating roller 22 rotates and squeezes to transfer the ink to the circuit board.

[0114] Refer to Figure 29 , the feeding mechanism 1 includes a first moving platform 11, a second moving platform 12, an upper clamping plate assembly 13, and a lower clamping plate assembly 14. The first moving platform 11 is used to drive the upper clamping plate assembly 13 to move up and down and horizontally. The upper clamping plate assembly 13 is used to clamp the flipped circuit board and send it between the two coating rollers 22 for coating. The second moving platform 12 is used to drive the lower clamping plate assembly 14 to move up and down. The lower clamping plate assembly 14 is used to pick up the circuit board transmitted by the upper clamping plate assembly 13 and make the circuit board continue to move downward completely through the two coating rollers 22.

[0115] Refer to Figure 12 , the upper clamping plate assembly 13 includes a fourth mounting seat 131, a pneumatic slide table 132, a first air chuck 133, a second air chuck 134, and a crossed roller guide 135. The first air chuck 133 and the second air chuck 134 are used to clamp the circuit board. The first air chuck 133 and the second air chuck 134 both include a moving air chuck and a clamping block. The moving air chuck uses the crossed roller guide 135 for movement guidance, occupying less space. The first air chuck 133 is fixedly arranged on the fourth mounting seat 131. The pneumatic slide table 132 is arranged on the fourth mounting seat 131. The second air chuck 134 is arranged on the pneumatic slide table 132. The pneumatic slide table 132 is used to drive the second air chuck 134 to move to tension the circuit board.

[0116] The upper clamping plate assembly 13 feeds the circuit board between the two coating rollers 22. Due to travel problems, the circuit board cannot be fed to the transverse position of the two coating rollers 22. To ensure that the circuit board is completely coated, the uppermost edge of the circuit board must be located at the transverse position of the two coating rollers 22 so that it can be clamped by the two coating rollers 22 and complete the coating operation. Therefore, a lower clamping plate mechanism (also called a lower connecting plate assembly) needs to be provided under the coating rollers 22. The functions of the lower clamping plate mechanism are, first, to receive the circuit board fed from above, and second, to adjust the uppermost edge of the circuit board to the center of the transverse line of the two coating rollers 22.

[0117] Reference Figure 16 and Figure 17 The lower clamping plate assembly 14 includes two groups of third air grippers 141 and two groups of air gripper driving mechanisms 142. The air gripper driving mechanisms 142 drive the two groups of third air grippers 141 to move closer or further away. First, the gripping plate position of the third air grippers 141 is adjusted to adapt to circuit boards of different widths. Second, after gripping the circuit board, the air gripper can be moved away appropriately to slightly tighten the circuit board to prevent the circuit board from bending. The air gripper driving mechanism 142 includes a fifth motor 1421, a second coupling 1422, and a screw slider assembly 1423. The fifth motor 1421 is connected to the screw slider assembly 1423 through the second coupling 1422. The third air gripper 141 is arranged on a slider in the screw slider assembly 1423. The fifth motor 1421 drives the slider in the screw slider assembly 1423 to move, and the third air gripper 141 on the slider moves accordingly, thereby realizing the two groups of third air grippers 141 moving closer or further away. The third air gripper 141 uses a 180° opening and closing air gripper, which has a large opening and closing range and is convenient for clamping the circuit board.

[0118] Reference Figure 13 The first vertical weighing mechanism 4 includes a mounting rod 41, a first mounting seat 42, two fourth air grippers 43, an air gripper fixing seat 44, a weighing sensor 45, a sensor support 46 and a shock-absorbing pad 47. The first mounting seat 42 is arranged on the mounting rod 41, the weighing sensor 45 is arranged on the sensor support 46, the sensor support 46 is arranged on the first mounting seat 42, the shock-absorbing pad 47 is located between the first mounting seat 42 and the sensor support 46, the air gripper fixing seat 44 is slidably arranged on the mounting rod 41 up and down, and is located above the weighing sensor 45, the two air grippers are arranged at both ends of the air gripper fixing seat 44, and are used to clamp the circuit board; the second vertical weighing mechanism 5 has the same structure as the first vertical weighing mechanism 4, and the second vertical weighing mechanism 5 is arranged on the unloading mechanism 3.

[0119] The width of the first vertical weighing mechanism 4 is less than the distance between the first air gripper 133 and the second air gripper 134, so that the first vertical weighing mechanism 4 can be arranged on the loading mechanism 1 without affecting the upper clamping plate assembly 13 to clamp the circuit board. After the upper clamping plate assembly 13 clamps the circuit board, the first vertical weighing mechanism 4 also clamps the circuit board. At this time, the upper clamping plate assembly 13 releases the circuit board, and the first vertical weighing mechanism 4 completely bears the weight of the circuit board, thereby measuring the weight of the circuit board and uploading the weight data to the control system; after the weighing is completed, the upper clamping plate assembly 13 clamps the circuit board again, the first vertical weighing mechanism 4 releases the circuit board, and then the loading device can move the circuit board to the vertical roller coating mechanism 2 for coating.

[0120] Referring to Figure 1 , the coated circuit board needs to be baked. The baking is generally divided into preheating, first-stage heating, and second-stage heating, and the temperature of each stage can be controlled separately, and then it enters the cooling zone. This process requires the circuit board running mechanism 10 to send the circuit board into the heating zone and the cooling zone in sequence. Referring to Figure 18 、 Figure 19 and Figure 20 , the circuit board running mechanism 10 includes a fourth rotating shaft 101, a sprocket 102, a double-row drive chain 103, a rotation drive mechanism 104 and a suspension clamping plate assembly 105. The sprocket 102 is arranged on the fourth rotating shaft 101, the rotation drive mechanism 104 is used to drive the fourth rotating shaft 101 to rotate, the double-row drive chain 103 meshes with the sprocket 102 for transmission, and the suspension clamping plate assembly 105 is arranged on the double-row drive chain 103. Due to the adoption of the double-row drive chain 103 to replace the commonly used double-pitch chain in the prior art, the distance between the suspension clamping plate assemblies 105 is smaller, and when the baking time is the same, the length of the oven can be reduced.

[0121] Referring to Figures 23 to 26, the blanking and flipping mechanism 203 includes a mounting plate 2031, a first motor 2032, a second rotating shaft 2033, a rotating arm 2034, a first cylinder 2035, a clamping jaw 2036 and a third rotating shaft 2037. The first motor 2032 and the second rotating shaft 2033 are arranged on the mounting plate 2031. The first motor 2032 is used to drive the second rotating shaft 2033 to rotate. The rotating arm 2034 is arranged on the second rotating shaft 2033 and rotates with the second rotating shaft 2033. The clamping jaw 2036 is arranged at the outer end of the rotating arm 2034 through the third rotating shaft 2037. The piston rod of the first cylinder 2035 is connected to one end of the clamping jaw 2036 and is used to drive the clamping jaw 2036 to rotate so as to clamp the circuit board. When blanking is required, the first motor 2032 works, drives the rotating arm 2034 to rotate to the vertical state through the second rotating shaft 2033, then the first cylinder 2035 works, pushes the clamping jaw 2036 to rotate, thereby clamping the upper edge of the circuit board, and then the first motor 2032 works in the reverse direction, drives the rotating arm 2034 to rotate to the horizontal state through the second rotating shaft 2033, and completes the blanking and flipping action. In this application, the clamping jaw 2036 is used to clamp the upper edge of the circuit board, replacing the suction cup in the prior art, and no suction cup mark will be generated on the surface of the circuit board.

[0122] After the blanking and flipping mechanism 203 flips the circuit board to the horizontal state, the circuit board can be taken away by a manipulator, or the blanking roller conveying mechanism 204 can be used to convey the circuit board to the next process. Refer to Figure 27 and Figure 28 , the blanking roller conveying mechanism 204 described in this application includes a cover plate 2041, a sixth motor, a synchronous pulley and synchronous belt assembly, a transmission shaft, a magnetic wheel group and a conveying roller assembly. The sixth motor drives the transmission shaft to rotate through the synchronous pulley and synchronous belt assembly, and the transmission shaft drives the conveying roller assembly to work through the magnetic wheel group to realize the function of conveying the circuit board. A plurality of through holes are provided on the cover plate 2041 to expose a small part of the conveying roller, which can not only play a conveying role, but also avoid the situation that the corners of the circuit board catch the conveying roller and cause no board jamming. The magnetic wheel group drive is adopted to replace the belt transmission in the prior art, which can greatly reduce the generation of dust, approach dust-free transmission and keep the surface of the circuit board clean.

[0123] Embodiment 2:

[0124] Refer to Figure 30, on the basis of the first embodiment, the vertical rolling coating equipment for circuit board ink is provided with a transfer manipulator 205, as well as a second set of vertical rolling coating mechanism 2, blanking mechanism 3, first vertical weighing mechanism 4, second vertical weighing mechanism 5, circuit board transfer mechanism 10, baking mechanism 201 and cooling mechanism 202. The transfer manipulator 205 transfers the circuit board after the first coating to the second set of vertical rolling coating mechanism 2 for the second coating, then undergoes the second baking and cooling, and is finally blanked.

[0125] The rolling coating method of the vertical rolling coating equipment for circuit board ink performs the first coating on the surface of the circuit board through steps S1 to S10 to make the surface of the circuit board flat, so as to solve the problem of height difference on the surface of the circuit board; and then repeats steps S4 to S12 again to perform the second coating on the surface of the circuit board to make the ink on the surface of the circuit board reach the designed thickness.

[0126] Due to the reason of the self-structure design of the circuit board, it is very difficult to make the surface completely flat. By adopting the one-time coating scheme in the first embodiment, although the uniformity of the ink thickness is relatively good and the stability of the thickness is also good, the surface flatness still needs to be improved. In this embodiment, through two coatings, the ink thickness of each coating is correspondingly reduced, and the sum of the two ink thicknesses is equal to the designed thickness. Since the coating roller 22 is a soft rubber roller, different deformation amounts will occur under different pressures. The higher position on the surface of the circuit board receives a greater pressure, and the thickness of the ink coating is thinner; the lower position receives a smaller pressure, and the thickness of the ink coating is thicker. After the first coating, the surface of the circuit board will be flatter than before, that is, the overall height difference will become smaller. After the second coating, the surface of the circuit board will be even flatter, and the appearance of the circuit board will be more beautiful.

[0127] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A vertical roll coating device for circuit board ink, characterized in that, It includes a loading mechanism (1), a vertical coating mechanism (2), an unloading mechanism (3), a first vertical weighing mechanism (4) and a second vertical weighing mechanism (5); The loading mechanism (1) is used to vertically feed the circuit board into the vertical coating mechanism (2); The vertical coating mechanism (2) is used to coat the surface of the circuit board with ink; The unloading mechanism (3) is used to receive the circuit board after coating with ink; The first vertical weighing mechanism (4) is used to weigh the circuit board without coating with ink; The second vertical weighing mechanism (5) is used to weigh the circuit board after coating with ink; The vertical coating mechanism (2) includes a base (21), a pair of coating rollers (22), a coating roller rotation driving assembly (23), a coating roller spacing adjustment assembly (24), a scraper assembly (25), a scraper extrusion driving assembly (26) and an ink tray (27). The coating rollers (22), the coating roller rotation driving assembly (23), the coating roller spacing adjustment assembly (24), the scraper assembly (25), the scraper extrusion driving assembly (26) and the ink tray (27) are all arranged on the base (21). The coating roller rotation driving assembly (23) is used to drive the two coating rollers (22) to rotate in opposite directions. The coating roller spacing adjustment assembly (24) is used to adjust the spacing between the two coating rollers (22) to adapt to circuit boards of different thicknesses. The coating rollers (22) dip ink from the ink tray (27). The scraper assembly (25) is used to scrape the ink on the coating rollers (22). The scraper extrusion driving assembly (26) is used to drive the scraper assembly (25) to move to control the contact degree between the scraper assembly (25) and the coating rollers (22), and further control the film thickness of the ink on the coating rollers (22); The first vertical weighing mechanism (4) includes a mounting rod (41), a first mounting seat (42), two air grippers, an air gripper fixing seat (44), a weighing sensor (45), a sensor support (46) and a shock pad (47). The first mounting seat (42) is arranged on the mounting rod (41). The weighing sensor (45) is arranged on the sensor support (46). The sensor support (46) is arranged on the first mounting seat (42). The shock pad (47) is located between the first mounting seat (42) and the sensor support (46). The air gripper fixing seat (44) is slidably arranged up and down on the mounting rod (41) and is located above the weighing sensor (45). The two air grippers are arranged at both ends of the air gripper fixing seat (44) and are used to grip the circuit board. The second vertical weighing mechanism (5) has the same structure as the first vertical weighing mechanism (4), and the second vertical weighing mechanism (5) is arranged on the unloading mechanism (3).

2. The vertical roll coating device for circuit board ink according to claim 1, wherein It also includes a center positioning machine (6), a temporary storage machine (7), a cleaning machine (8), a loading turning mechanism (9), a circuit board conveying mechanism (10), a baking mechanism (201), a cooling mechanism (202) and an unloading turning mechanism (203); The center positioning machine (6) is used to horizontally receive and convey the circuit board, center-position the circuit board, and convey the circuit board to the next process; The temporary storage machine (7) is used to temporarily store the circuit boards conveyed by the center positioning machine (6) and convey the circuit boards to the next process; The cleaning machine (8) is used to clean the surfaces of the circuit boards conveyed by the temporary storage machine (7) and convey the circuit boards to the next process; The loading turnover mechanism (9) is used to turn over the circuit boards conveyed by the cleaning machine (8) from a horizontal state to a vertical state; The loading mechanism (1) is further used to receive the circuit boards turned over by the loading turnover mechanism (9) and vertically feed the circuit boards into the vertical coating mechanism (2); The circuit board running mechanism (10) is used to receive the circuit boards conveyed by the unloading mechanism (3) and sequentially feed the circuit boards into the baking mechanism (201) and the cooling mechanism (202); The baking mechanism (201) is used to bake the circuit boards after coating with ink; The cooling mechanism (202) is used to cool the baked circuit boards; The unloading turnover mechanism (203) is used to receive the circuit boards conveyed by the circuit board running mechanism (10) and turn over the circuit boards to a horizontal state.

3. The vertical roll coating device for circuit board ink according to claim 2, wherein, The loading mechanism (1) includes a first moving platform (11), a second moving platform (12), an upper clamping plate assembly (13) and a lower clamping plate assembly (14). The first moving platform (11) is used to drive the upper clamping plate assembly (13) to move up and down and horizontally. The upper clamping plate assembly (13) is used to clamp the turned-over circuit boards and feed them between two coating rollers (22) for coating. The second moving platform (12) is used to drive the lower clamping plate assembly (14) to move up and down. The lower clamping plate assembly (14) is used to pick up the circuit boards conveyed by the upper clamping plate assembly (13) and make the circuit boards continue to move downward completely through the two coating rollers (22).

4. The vertical roll coating device for circuit board ink according to claim 2, characterized in that, The feeding and flipping mechanism (9) includes a second mounting seat (91), a fixing frame (92), a first rotating shaft (93), a first conveying roller mechanism (94), a baffle assembly (95), a flipping motion module (96), a needle bed (97), a first lifting module (98), and a first clamping assembly (99). The first rotating shaft (93) is rotatably arranged on the second mounting seat (91), the fixing frame (92) is fixedly arranged on the first rotating shaft (93), and the first conveying roller mechanism (94), the baffle assembly (95), the needle bed (97), the first lifting module (98), and the first clamping assembly (99) are all arranged on the fixing frame (92). The first conveying roller mechanism (94) is used to receive the circuit board conveyed by the cleaning machine (8), and the baffle assembly (95) is used to block the continuous advancement of the circuit board. The first lifting module (98) is used to drive the needle bed (97) to lift, the needle bed (97) is used to lift the circuit board on the first conveying roller mechanism (94), and the first clamping assembly (99) is used to clamp and fix the circuit board lifted by the needle bed (97). The flipping motion module (96) is used to drive the first rotating shaft (93) to rotate, so that the fixing frame (92), the first conveying roller mechanism (94), the baffle assembly (95), the needle bed (97), the first lifting module (98), and the first clamping assembly (99) are rotated from the horizontal state to the vertical state as a whole.

5. The vertical roll coating device for circuit board ink according to claim 2, wherein The circuit board operating mechanism (10) includes a fourth rotating shaft (101), a sprocket (102), a double-row drive chain (103), a rotation driving mechanism (104), and a hanging splint assembly (105). The sprocket (102) is arranged on the fourth rotating shaft (101), the rotation driving mechanism (104) is used to drive the fourth rotating shaft (101) to rotate, the double-row drive chain (103) is meshed with the sprocket (102) for transmission, and the hanging splint assembly (105) is arranged on the double-row drive chain (103).

6. The vertical roll coating device for circuit board ink according to claim 2, wherein The discharging and flipping mechanism (203) includes a mounting plate (2031), a first motor (2032), a third rotating shaft (2037), a rotating arm (2034), a first cylinder (2035), a clamping jaw (2036), and a third rotating shaft (2037). The first motor (2032) and the third rotating shaft (2037) are arranged on the mounting plate (2031), the first motor (2032) is used to drive the third rotating shaft (2037) to rotate, the rotating arm (2034) is arranged on the third rotating shaft (2037) and rotates with the third rotating shaft (2037), the clamping jaw (2036) is arranged at the outer end of the rotating arm (2034) through the third rotating shaft (2037), and the piston rod of the first cylinder (2035) is connected to one end of the clamping jaw (2036) to drive the clamping jaw (2036) to rotate so as to clamp the circuit board.

7. A coating method for the vertical roll coating equipment of the circuit board ink described in claim 2, characterized in that, It includes the following steps: S1: Place the circuit board on the center positioning machine (6), use the center positioning machine (6) to center the circuit board, and transfer the circuit board to the buffer machine (7); S2: Use the buffer machine (7) to temporarily store the circuit board transferred by the center positioning machine (6), and transfer the circuit board to the cleaning machine (8); S3: Use the cleaning machine (8) to clean the surface of the circuit board, and transfer the cleaned circuit board to the loading and flipping mechanism (9); S4: Use the loading and flipping mechanism (9) to flip the circuit board from the horizontal state to the vertical state; S5: Use the loading mechanism (1) to take out the flipped circuit board, and use the first vertical weighing mechanism (4) to weigh the circuit board without coated ink; S6: Use the loading mechanism (1) to transfer the circuit board to the vertical roller coating mechanism (2) to perform coating treatment on the surface of the circuit board; S7: Use the unloading mechanism (3) to take away the circuit board coated with ink; S8: Use the second vertical weighing mechanism (5) to weigh the circuit board coated with ink, calculate the weight of the coated ink through the data of the second weighing. If it is within the preset weight range, continue to flow downward. If it is not within the preset weight range, stop flowing downward and perform alarm processing; S9: Use the unloading mechanism (3) to transfer the circuit board coated with ink to the circuit board transfer mechanism (10); S10: Use the circuit board transfer mechanism (10) to transfer the circuit board coated with ink to the baking mechanism (201) and the cooling mechanism (202). Use the baking mechanism (201) to bake the circuit board, and use the cooling mechanism (202) to cool the baked circuit board; S11: Use the circuit board transfer mechanism (10) to transfer the cooled circuit board to the unloading and flipping mechanism (203); S12: Use the unloading and flipping mechanism (203) to flip the circuit board to the horizontal state.

8. The coating method of the vertical roll coating equipment for circuit board ink according to claim 7, characterized in that Perform the first coating on the surface of the circuit board through steps S1 to S10 to make the surface of the circuit board flat, so as to solve the problem of height difference on the surface of the circuit board; use the transfer manipulator (205) for transfer, and repeat steps S5 to S12 to perform the second coating on the surface of the circuit board to make the ink on the surface of the circuit board reach the designed thickness.

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