Molding apparatus and injection molding method thereof

Abstract

The present invention provides a molding apparatus and an injection molding method thereof. The molding apparatus includes a first mold, a second mold, and a sealing ring. The first mold includes a first body and at least one slide. The at least one slide is movably and detachably arranged on the first body and has an undercut. The injection molding method includes the following operations: engaging the first mold and the second mold of the molding apparatus; filling a mold cavity defined by the first mold and the second mold with a gas, wherein the gas is blocked by the sealing ring arranged between the first mold and the second mold; injecting a molding material into the mold cavity; and opening the first mold and the second mold of the molding apparatus.

Description

[0001] Cross-Reference to Related Applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 236,044, filed August 23, 2021; U.S. Patent Application No. 17 / 830,417, filed June 2, 2022, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to a molding device and an injection molding method using the same, and more particularly, to a molding device including a slide having an undercut, and an injection molding method using the same. BACKGROUND

[0004] Foamed polymer materials have many advantages, such as high strength, low weight, impact resistance, thermal insulation, etc. Various objects can be achieved by injection molding. For example, after the polymer material is melted and mixed with a blowing agent to form a mixture, force or pressure is applied to the mixture to inject the mixture into a cavity of a mold, and the mixture is foamed and cooled in the cavity to form the object.

[0005] However, it is necessary to improve the efficiency, quality, and yield of forming the object. Therefore, there is an urgent need in the art to improve the structure of the molding device and the method for using the molding device.

[0006] According to an embodiment of the present disclosure, a molding device is provided. The molding device includes a first mold, a second mold, a mold cavity, and a sealing ring. The first mold includes a first body and at least one slide. The at least one slide is movably and detachably arranged on the first body and has an undercut. The mold cavity is defined by the first mold and the second mold. The sealing ring is arranged between the first mold and the second mold for sealing the mold cavity when the first mold engages the second mold.

[0007] According to an embodiment of the present disclosure, an injection molding method is provided. The injection molding method includes engaging a first mold and a second mold of a molding device, wherein the first mold includes a first body and at least one slide movably and detachably arranged on the first body and having an undercut; filling a mold cavity defined by the first mold and the second mold with a gas, wherein the gas is blocked by a sealing ring arranged between the first mold and the second mold; injecting a molding material into the mold cavity; and opening the first mold and the second mold of the molding device. BRIEF DESCRIPTION OF DRAWINGS

[0008] Aspects of the present application can be better understood from the following embodiments. It should be noted that the various features of the present application are not necessarily drawn to scale. In fact, the dimensions of the various features can be arbitrarily increased or decreased for the sake of providing clarity.

[0009] Figures 1A-1F A schematic cross-sectional view illustrating a molding apparatus according to an embodiment of the present application.

[0010] Figures 2A-2F A schematic cross-sectional view illustrating a molding apparatus according to an embodiment of the present application.

[0011] Figures 3A-3F A schematic cross-sectional view illustrating a molding apparatus according to an embodiment of the present application.

[0012] Figures 4A-4F A schematic cross-sectional view illustrating a molding apparatus according to an embodiment of the present application.

[0013] Figure 5 A flowchart illustrating an injection molding method according to an embodiment of the present application.

[0014] Figure 6 A flowchart illustrating an injection molding method according to an embodiment of the present application.

[0015] Figure 7 A flowchart illustrating an injection molding method according to an embodiment of the present application. DETAILED DESCRIPTION

[0016] The following disclosure provides many different embodiments, or examples, for implementing different characteristics of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present application. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or onto a second feature in the description that follows can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which additional features can be formed between the first and second features, such that the first and second features can not be in direct contact. In addition, the present application can be repeated with reference to a plurality of embodiments of a same feature. Such repetition of the reference is for the purpose of simplicity and clarity and does not constitute multiple describing of a single embodiment unless otherwise specifically indicated.

[0017] Moreover, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein are to be interpreted accordingly.

[0018] Notwithstanding that the numerical ranges and parameters setting forth the broadest scope of the disclosed subject matter are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in the respective testing measurements. Moreover, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the field to which the disclosed subject matter pertains. Other than in the operating / working examples, or unless otherwise expressly specified, all of the numerical ranges, amounts, values and percentages such as amounts of materials, durations, temperatures, work conditions, ratios, and the like set forth in the preceding description, specification and claims are to be interpreted as approximations and are understood to allow for a degree of variability in matters of or measurements of a given value and / or range. Accordingly, unless indicated to the contrary within the specification, the numerical parameters set forth in the specification and claims are approximations. At the very least, each numerical parameter should be construed in light of the number of significant digits and by applying ordinary rounding techniques. Each range can be broken down into a smaller range "nesting" of smaller ranges, and each smaller range can be treated as a separate embodiment. All such ranges are intended to be included within this application. Also, as used in the specification and claims, the singular form "a", "an" and "the" include plural references unless the context clearly dictates otherwise.

[0019] Figure 1A A schematic cross-sectional view of a molding apparatus 1 is shown. In some embodiments, the molding apparatus 1 includes a first mold 11, a second mold 13, and a sealing ring 15. The first mold 11 includes a first body 111 and at least one slide 113. The at least one slide 113 is movably and detachably disposed on the first body 111 and has an undercut 110 (i.e., the undercut 110 is formed on the at least one slide 113). The sealing ring 15 is disposed between the first mold 11 and the second mold 13. The sealing ring 15 is disposed around the molding apparatus 1 to block leakage of gas from the interior of the molding apparatus 1.

[0020] Figure 1BFIG. 6 is another schematic cross-sectional view of the molding apparatus 1. In some embodiments, after the first mold 11 and the second mold 13 are joined, the gas 91 is filled into the mold cavity 10 from at least one conduit (not shown) disposed on the first mold 11, the second mold 13, or both the first mold 11 and the second mold 13. The sealing ring 15 disposed between the first mold 11 and the second mold 13 is configured to block the leakage of the gas.

[0021] Figure 1C FIG. 7 is another schematic cross-sectional view of the molding apparatus 1. In some embodiments, after the first mold 11 and the second mold 13 are joined, the gas 91 is filled into the mold cavity 10 from at least one conduit (not shown) disposed on the first mold 11, the second mold 13, or both the first mold 11 and the second mold 13. The sealing ring 15 disposed between the first mold 11 and the second mold 13 is configured to block the leakage of the gas.

[0022] In some embodiments, when the first mold 11 and the second mold 13 are joined, the sealing ring 15 can block the gas 91 with a predetermined gas pressure inside the mold cavity 10. The predetermined gas pressure can be greater than 1 atmosphere.

[0023] Figure 1D and Figure 1E FIG. 8 is a schematic cross-sectional view of the molding apparatus 1. In some embodiments, after the gas 91 is filled into the mold cavity 10, the molding material 93 is injected into the mold cavity 10 from at least one inlet (not shown) disposed on the first mold 11, the second mold 13, or both the first mold 11 and the second mold 13. In some embodiments, the molding material 93 includes a mixture formed from a molten polymer material mixed with a blowing agent.

[0024] Figure 1F FIG. 9 is another schematic cross-sectional view of the molding apparatus 1. In some embodiments, after the injected molding material 93 is cooled, the first mold 11 and the second mold 13 are opened. At least one slide 113 is disassembled to release the article 95 from the molding apparatus 1. More specifically, before the article 95 is released from the molding apparatus 1, the article 95 is held or fixed by the undercut 110 of at least one slide 113. Thus, unless at least one slide 113 is moved laterally, the article 95 cannot be easily picked up. In other words, after the movement of at least one slide 113, the article 95 can then be easily picked up.

[0025] Figure 2AA schematic cross-sectional view of the molding apparatus 2 is shown. In some embodiments, the molding apparatus 2 includes a first mold 21, a second mold 23, a seal ring 25, and a pressure sensor 27. The first mold 21 includes a first body 211 and two slides 213A, 213B. The slides 213A, 213B are movably and detachably disposed on the first body 211. The slide 213A has an undercut 210A, and the slide 213B has an undercut 210B (i.e., the undercuts 210A, 210B are formed on the slides 213A, 213B, respectively).

[0026] The second mold 23 includes a second body 231 and a pressure cover 233. The pressure cover 233 is disposed with the second body 231. A pressure buffer space 230 is defined by the second body 231 and the pressure cover 233. The seal ring 25 is disposed between the first body 211 of the first mold 21 and the pressure cover 233 of the second mold 23. The seal ring 25 is disposed around the molding apparatus 2 to block the leakage of the gas from the interior of the molding apparatus 2. In some embodiments, the seal ring 25 includes a flexible material for enhancing the function of blocking the leakage of the gas from the interior of the molding apparatus 2.

[0027] Figure 2B A schematic cross-sectional view of the molding apparatus 2 is shown. In some embodiments, when the first mold 21 and the second mold 23 are engaged, the mold cavity 20 is defined by the slides 213A, 231B of the first mold 21 and the second body 231 of the second mold 23, and the seal ring 25 is clamped by the first body 211 of the first mold 21 and the pressure cover 233 of the second mold 23. The pressure sensor 27 is disposed on the second mold 23 for sensing the pressure of the gas inside the mold cavity 20. In some embodiments, the pressure sensor 27 can be disposed on the first mold 21 or the second mold 23.

[0028] Figure 2C A schematic cross-sectional view of the molding apparatus 2 is shown. In some embodiments, after the first mold 21 and the second mold 23 are engaged, the gas 81 is filled into the mold cavity 20 from at least one conduit (not shown) disposed on the first mold 21, the second mold 23, or both the first mold 21 and the second mold 23. During the process of filling the gas 81 into the mold cavity 20, the pressure of the gas inside the mold cavity 20 is continuously sensed by the pressure sensor 27. The gas 81 is filled into the mold cavity 20 until the pressure sensor 27 senses a predetermined pressure of the gas inside the mold cavity 20.

[0029] In some embodiments, the predetermined gas pressure is greater than a gas pressure outside of the molding device 2. The assembly of the first body 211 of the first mold 21 and the pressure cover 233 of the second mold 23 maintains the predetermined gas pressure inside of the mold cavity 20. The pressure buffer space 230 buffers changes in the predetermined gas pressure inside of the mold cavity 20. The sealing ring 25 disposed between the first body 211 of the first mold 21 and the pressure cover 233 of the second mold 23 is configured to block leakage of the gas 81.

[0030] Figure 2D and Figure 2E FIG. 1 is a schematic cross-sectional view of a molding device 2. In some embodiments, after the gas 81 is filled into the mold cavity 20, a molding material 83 is injected into the mold cavity 20 from at least one inlet (not shown) disposed on the first mold 21, the second mold 23, or both the first mold 21 and the second mold 23. In some embodiments, the molding material 83 includes a mixture formed from a molten polymer material mixed with a blowing agent. In some embodiments, the blowing agent includes a supercritical fluid (SCF).

[0031] In some embodiments, when the molding material 83 is injected into the mold cavity 20 having the predetermined gas pressure, the molding material 83 is in contact with the gas 81, and the predetermined gas pressure is applied to the molding material 83. During the process of injecting the molding material 83 into the mold cavity 20, the gas pressure inside of the mold cavity 20 rises from the predetermined gas pressure to another gas pressure.

[0032] In some embodiments, as the molding material 83 expands in the mold cavity 20, the gas 81 is expelled from the mold cavity 20 through the at least one conduit. The density of the molding material 83 expanded in the mold cavity 20 depends on the rate at which the gas 81 is expelled. The higher the rate at which the gas 81 is expelled, the lower the density of the molding material 83 expanded in the mold cavity 20, such that the density of the article formed from the molding material 83 is lower.

[0033] In some embodiments, the injection of the molding material 83 and the expulsion of the gas 81 are completed in less than 1 second. In some embodiments, due to (1) the mold cavity 20 having the predetermined gas pressure before the molding material 83 is injected, and (2) the predetermined gas pressure being greater than the gas pressure outside of the molding device 2, the injection of the molding material 83 and the expulsion of the gas 81 are completed in less than 0.5 second.

[0034] Figure 2FTo illustrate another schematic cross-sectional view of the molding device 2. In some embodiments, the first mold 21 and the second mold 23 are opened after the injected molding material 83 is cooled. The slides 213A, 213B are detached to demold the article 85 from the molding device 2. More specifically, the article 85 is held or fixed by the undercut 210A of the slide 213A and the undercut 210B of the slide 213B before the article 85 is demolded from the molding device 2. Thus, the article 85 cannot be easily picked up unless the slides 213A and 213B are moved laterally. In other words, the article 85 can be easily picked up after the movement of the slides 213A and 213B.

[0035] Figure 3A To illustrate a schematic cross-sectional view of the molding device 3. In some embodiments, the molding device 3 comprises a first mold 31, a second mold 33, a sealing ring 35, and a pressure sensor 37. The first mold 31 comprises a first body 311 and two slides 313A, 313B. The slides 313A, 313B are movable and detachably disposed on the first body 311. The slide 313A has an undercut 310A, and the slide 313B has an undercut 310B (i.e., the undercuts 310A, 310B are formed on the slides 313A, 313B, respectively).

[0036] The second mold 33 comprises a second body 331, a pressure cover 333, and a core 335. The pressure cover 333 is coupled to the second body 331. A pressure buffer space 330 is defined by the second body 331 and the pressure cover 333. The core 335 is disposed on the second body 331 and opposite to the first mold 31. The sealing ring 35 is disposed between the first body 311 of the first mold 31 and the pressure cover 333 of the second mold 33. The sealing ring 35 is disposed around the molding device 3 to block the leakage of gas from the interior of the molding device 3. In some embodiments, the sealing ring 35 comprises a flexible material for enhancing the function of blocking the leakage of gas from the interior of the molding device 3.

[0037] Figure 3B To illustrate another schematic cross-sectional view of the molding device 3. In some embodiments, when the first mold 31 and the second mold 33 are engaged, the mold cavity 30 is defined by the slides 313A, 313B of the first mold 31 and the core 335 of the second mold 33, and the sealing ring 35 is clamped by the first body 311 of the first mold 31 and the pressure cover 333 of the second mold 33. The pressure sensor 37 is disposed on the second mold 33 for sensing the pressure of the gas inside the mold cavity 30. In some embodiments, the pressure sensor 37 can be disposed on the first mold 31 or the second mold 33.

[0038] Figure 3C FIG. 4 is a schematic cross-sectional view of the molding apparatus 3. In some embodiments, after the first mold 31 and the second mold 33 are engaged, the gas 71 is filled into the mold cavity 30 from at least one conduit (not shown) disposed on the first mold 31, the second mold 33, or both the first mold 31 and the second mold 33. During the process of filling the gas 71 into the mold cavity 30, the gas pressure inside the mold cavity 30 is continuously sensed by the pressure sensor 37. The gas 71 is filled into the mold cavity 30 until the pressure sensor 37 senses a predetermined gas pressure inside the mold cavity 30.

[0039] In some embodiments, the predetermined gas pressure is greater than the gas pressure outside the molding apparatus 3. The assembly of the first body 311 of the first mold 31 and the pressure jacket 333 of the second mold 33 maintains the predetermined gas pressure inside the mold cavity 30 and the pressure buffer space 330. The pressure buffer space 330 buffers the change of the predetermined gas pressure inside the mold cavity 30. The sealing ring 35 disposed between the first body 311 of the first mold 31 and the pressure jacket 333 of the second mold 33 is configured to block the leakage of the gas 71.

[0040] Figure 3D and Figure 3E FIG. 5 is a schematic cross-sectional view of the molding apparatus 3. In some embodiments, after the gas 71 is filled into the mold cavity 30, the molding material 73 is injected into the mold cavity 30 from at least one feed port (not shown) disposed on the first mold 31, the second mold 33, or both the first mold 31 and the second mold 33. In some embodiments, the molding material 73 includes a mixture formed by a molten polymer material mixed with a blowing agent. In some embodiments, the blowing agent includes a SCF.

[0041] In some embodiments, when the molding material 73 is injected into the mold cavity 30 having the predetermined gas pressure, the molding material 73 is in contact with the gas 71, and the predetermined gas pressure is applied to the molding material 73. During the process of injecting the molding material 73 into the mold cavity 30, the gas pressure inside the mold cavity 30 rises from the predetermined gas pressure to another gas pressure.

[0042] In some embodiments, as the molding material 73 expands in the mold cavity 30, the gas 71 is expelled from the mold cavity 30 and the pressure buffer space 330 through the at least one conduit. The density of the molding material 73 expanded in the mold cavity 30 depends on the rate of expelling the gas 71. The higher the rate of expelling the gas 71, the lower the density of the molding material 73 expanded in the mold cavity 30, such that the density of the article formed by the molding material 73 is lower.

[0043] In some embodiments, the injection of the molding material 73 and the evacuation of the gas 71 are completed in less than 1 second. In some embodiments, the injection of the molding material 73 and the evacuation of the gas 71 are completed in less than 0.5 second because: (1) the mold cavity 30 has the predetermined gas pressure before the molding material 73 is injected; and (2) the predetermined gas pressure is greater than the gas pressure outside the molding device 3.

[0044] Figure 3F FIG. 6 is a schematic cross-sectional view illustrating another embodiment of the molding device 3. In some embodiments, after the injected molding material 73 is cooled, the first mold 31 and the second mold 33 are opened. The slides 313A, 313B are detached to release the article 75 from the molding device 3. More specifically, before the article 75 is released from the molding device 3, the article 75 is held or fixed by the undercut 310A of the slide 313A and the undercut 310B of the slide 313B. Therefore, the article 75 cannot be easily picked up unless the slides 313A, 313B are moved laterally. In other words, after the slides 313A, 313B are moved, the article 75 can then be easily picked up.

[0045] Figure 4A FIG. 7 is a schematic cross-sectional view illustrating an embodiment of the molding device 4. In some embodiments, the molding device 4 includes a first mold 41, a second mold 43, a seal ring 45, and a sensor 47. The first mold 41 includes a first body 411, two slides 413A, 413B, and a first core 415. The slides 413A, 413B are movable and detachably disposed on the first body 411. The first core 415 is disposed on the first body 411 and opposite to the second mold 43. The slide 413A has an undercut 410A, and the slide 413B has an undercut 410B (i.e., the undercuts 410A, 410B are formed on the slides 413A, 413B, respectively).

[0046] The second mold 43 includes a second body 431, a pressure cover 433, and a second core 435. The pressure cover 433 is coupled to the second body 431 and includes a protrusion 433P. A pressure buffer space 430 is defined by the second body 431 and the pressure cover 433. The second core 435 is disposed on the second body 431 and opposite to the first core 415. The seal ring 45 is disposed between the first body 411 of the first mold 41 and the pressure cover 433 of the second mold 43. The seal ring 45 is disposed around the molding device 4 to block the leakage of the gas from the interior of the molding device 4. In some embodiments, the seal ring 45 includes a flexible material to enhance the function of blocking the leakage of the gas from the interior of the molding device 4.

[0047] Figure 4B FIG. 6 is another schematic cross-sectional view of the molding apparatus 4. In some embodiments, when the first mold 41 and the second mold 43 are engaged, the mold cavity 40 is defined by the slides 413A, 413B, the first core 415, and the second core 435 of the second mold 43, and the seal ring 45 is clamped by the first body 411 of the first mold 41 and the pressure jacket 433 of the second mold 43. The protrusions 433P fit the shapes of the slides 413A, 413B. The pressure sensor 47 is disposed on the second mold 43 for sensing the gas pressure inside the mold cavity 40. In some embodiments, the pressure sensor 47 can be disposed on the first mold 41 or the second mold 43.

[0048] Figure 4C FIG. 7 is another schematic cross-sectional view of the molding apparatus 4. In some embodiments, after the first mold 41 and the second mold 43 are engaged, the gas 61 is filled into the mold cavity 40 from at least one conduit (not shown) disposed on the first mold 41, the second mold 43, or both the first mold 41 and the second mold 43. During the process of filling the gas 61 into the mold cavity 40, the gas pressure inside the mold cavity 40 is continuously sensed by the pressure sensor 47. The gas 61 is filled into the mold cavity 40 until the pressure sensor 47 senses a predetermined gas pressure inside the mold cavity 40.

[0049] In some embodiments, the predetermined gas pressure is greater than the gas pressure outside the molding apparatus 4. The assembly of the first body 411 of the first mold 41 and the pressure jacket 433 of the second mold 43 maintains the predetermined gas pressure inside the mold cavity 40 and the pressure buffer space 430. The pressure buffer space 430 buffers the change of the predetermined gas pressure inside the mold cavity 40. The seal ring 45 disposed between the first body 411 of the first mold 41 and the pressure jacket 433 of the second mold 43 is configured to block the leakage of the gas 61.

[0050] Figure 4D and Figure 4E FIG. 8 is a schematic cross-sectional view of the molding apparatus 4. In some embodiments, after the gas 61 is filled into the mold cavity 40, the molding material 63 is injected into the mold cavity 40 from at least one inlet (not shown) disposed on the first mold 41, the second mold 43, or both the first mold 41 and the second mold 43. In some embodiments, the molding material 63 includes a mixture formed by a molten polymer material mixed with a blowing agent. In some embodiments, the blowing agent includes a SCF.

[0051] In some embodiments, when the molding material 63 is injected into the mold cavity 40 having the predetermined gas pressure, the molding material 63 is in contact with the gas 61, and the predetermined gas pressure is applied to the molding material 63. During the process of injecting the molding material 63 into the mold cavity 40, the gas pressure inside the mold cavity 40 rises from the predetermined gas pressure to another gas pressure.

[0052] In some embodiments, when the molding material 63 expands in the mold cavity 40, the gas 61 is expelled from the mold cavity 40 and the pressure buffer space 430 through the at least one conduit. The density of the molding material 63 expanded in the mold cavity 40 depends on the rate of expelling the gas 61. The higher the rate of expelling the gas 61, the lower the density of the molding material 63 expanded in the mold cavity 40, so that the density of the object formed by the molding material 63 is lower.

[0053] In some embodiments, the injection of the molding material 63 and the expulsion of the gas 61 are completed in less than 1 second. In some embodiments, the injection of the molding material 63 and the expulsion of the gas 61 are completed in less than 0.5 second, due to: (1) the mold cavity 40 has the predetermined gas pressure before the molding material 63 is injected; and (2) the predetermined gas pressure is greater than the gas pressure outside the molding device 4.

[0054] Figure 4F Another schematic cross-sectional view of the molding device 4 is shown. In some embodiments, after the injected molding material 63 is cooled, the first mold 41 and the second mold 43 are opened. The slides 413A, 413B are detached to demold the object 65 from the molding device 4. More specifically, before the object 65 is demolded from the molding device 4, the object 65 is held or fixed by the undercut 410A of the slide 413A and the undercut 410B of the slide 413B. Therefore, the object 65 cannot be easily picked up unless the slides 413A and 413B are moved laterally. After the movement of the slides 413A and 413B, the object 65 is supported by the first core 415, and then the object 65 can be easily picked up from the first core 415.

[0055] Figure 5 A flowchart of an injection molding method according to some embodiments of the present application is shown. The injection molding method is performed by a molding device. The molding device includes a first mold, a second mold, and a sealing ring. The first mold includes a first body; and at least one slide movably and detachably arranged on the first body. The at least one slide has an undercut (i.e., the undercut is formed on the at least one slide).

[0056] The injection molding method includes several steps: step S501, joining the first mold and the second mold of the molding apparatus; step S502, filling a gas into a mold cavity defined by the first mold and the second mold, wherein the gas is blocked by the sealing ring disposed between the first mold and the second mold; step S503, injecting a molding material into the mold cavity; and step S504, opening the first mold and the second mold of the molding apparatus.

[0057] In some embodiments, the injection molding method is performed by the molding apparatuses 1-4 as shown in Figures 1A-4F In some embodiments, the injection molding method is performed by the molding apparatuses 1-4 as shown in Figures 1A-4F are schematic cross-sectional views of various stages of the injection molding method.

[0058] Figure 6 is a flowchart showing an injection molding method according to some embodiments of the present application. The injection molding method is performed by a molding apparatus. The molding apparatus includes a first mold, a second mold, and a sealing ring. The first mold includes a first body and at least one slide movably and detachably disposed on the first body. The at least one slide has an undercut (i.e., the undercut is formed on the at least one slide). The second mold includes a second body and a pressure cover coupled to the second body.

[0059] The injection molding method includes several steps: step S601, moving the second body and the pressure cover toward the first body and the at least one slide; step S602, filling a gas into a mold cavity defined by the first mold and the second mold, wherein the gas is blocked by the sealing ring disposed between the first mold and the pressure cover; step S603, injecting a molding material into the mold cavity; step S604, discharging the gas from the mold cavity; and step S605, opening the first mold and the second mold of the molding apparatus.

[0060] In some embodiments, the mold cavity has a predetermined gas pressure after the gas is filled. The predetermined gas pressure is greater than a gas pressure outside the molding apparatus. In some embodiments, the injection molding method is performed by the molding apparatuses 1-4 as shown in Figures 1A-4F In some embodiments, the injection molding method is performed by the molding apparatuses 1-4 as shown in Figures 1A-4F are schematic cross-sectional views of various stages of the injection molding method.

[0061] Figure 7A flowchart of an injection molding method according to some embodiments of the present application is shown. The injection molding method is performed by a molding apparatus. The molding apparatus includes a first mold, a second mold, and a sealing ring. The first mold includes a first body and at least one slide movably and detachably arranged on the first body. The at least one slide has an undercut (i.e., the undercut is formed on the at least one slide). The second mold includes a second body and a pressure cover coupled to the second body.

[0062] The injection molding method includes several steps: step S701, moving the second body and the pressure cover toward the first body and the at least one slide; step S702, filling a gas into a mold cavity defined by the first mold and the second mold and into a pressure buffer space defined by the second body and the pressure cover, wherein the gas is blocked by the sealing ring arranged between the first mold and the pressure cover; step S703, injecting a molding material into the mold cavity; step S704, discharging the gas from the mold cavity and the pressure buffer space; step S705, opening the first mold and the second mold of the molding apparatus; and step S706, moving the at least one slide relative to the first body to demold the molding material. In some embodiments, the molding material can be secured by the undercut before the step S706, and the molding material can be detached from the molding apparatus after the step S706.

[0063] In some embodiments, the mold cavity has a predetermined gas pressure after the gas is filled. The predetermined gas pressure is greater than a gas pressure outside the molding apparatus. In some embodiments, the injection molding method is performed by the molding apparatuses 1-4 as shown in Figures 1A-4F and Figures 1A-4F Schematic cross-sectional views of various stages of the injection molding method are shown.

[0064] The foregoing summary, as well as particular embodiments of the application, will be described with reference to the drawings. Those skilled in the art will appreciate that the conception, upon which, the disclosure is based, can readily be utilized as a basis for the designing of other structures, methods, and / or systems for carrying out the several purposes of the present application. It will also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the present application, and that they can make modifications, substitutions, and changes in the present disclosure, in its procedures and / or compositions, without departing from the spirit and scope of the present application. This section summarizes features of several embodiments to provide a better understanding of aspects of the present application to those skilled in the art. Those skilled in the art will appreciate that they can readily use the disclosure disclosed herein as a basis for designing or modifying other programs and structures for performing the same purposes and / or achieving the same advantages of the embodiments cited herein without departing from the spirit and scope of the present application. Those skilled in the art will also realize that such equivalent constructions do not depart from the spirit and scope of the present application, and that they can make various changes, substitutions, and alterations in the present disclosure, in its procedures and / or compositions, without departing from the spirit and scope of the present application.

[0065] However, the scope of the application should not be limited to such specific embodiments of processes, machines, manufactures, compositions of matter, means, methods, and steps inherent in the disclosu re, as such processes, machines, manufactures, compositions of matter, means, methods, and steps become or are in possession of present or later-developed, equivalents. Therefore, claims that follow are intended to cover any processes, machines, manufactures, compositions of matter, means, methods, and steps inherent in the disclosu re, and their equivalents.

[0066] SYMBOL DESCRIPTION

[0067] 1, 2, 3, 4: molding device

[0068] 10, 20, 30, 40: mold cavity

[0069] 11, 21, 31, 41: first mold

[0070] 13, 23, 33, 43: second mold

[0071] 15, 25, 35, 45: seal ring

[0072] 27, 37, 47: pressure sensor

[0073] 61, 71, 81, 91: gas

[0074] 63, 73, 83, 93: molding material

[0075] 65, 75, 85, 95: object

[0076] 110, 210A, 210B, 310A, 310B, 410A, 410B: undercut

[0077] 111, 211, 311, 411: first body

[0078] 113, 213A, 213B, 313A, 313B, 413A, 413B: slider

[0079] 230, 330, 430: pressure buffer space

[0080] 231, 331, 431: second body

[0081] 233, 333, 433: pressure cover

[0082] 335: core

[0083] 415: first core

[0084] 433P: protrusion

[0085] 435: second core

[0086] S501-S504: steps

[0087] S601-S605: steps

[0088] S701-S706: steps

Claims

1. A molding device comprising: A first casting mold comprising: a first entity; and at least one sliding member, movably and detachably disposed on the first body and having an undercut portion; a second casting mold; a mold cavity defined by the first mold and the second mold; a pressure buffer space defined by the slide and the second mold; as well as a sealing ring disposed between the first casting mold and the second casting mold, for sealing the casting mold cavity when the first casting mold engages the second casting mold, When the first casting mold engages the second casting mold, the slide is immovable and surrounded by the second casting mold.

2. The molding device according to claim 1, wherein the second mold comprises: a second body; and A pressure cover is coupled to the second body and has at least one protrusion.

3. The molding device according to claim 2, wherein the sealing ring is disposed between the first body of the first casting mold and the pressure cover of the second casting mold. 4 . The molding device according to claim 1 , wherein the second mold comprises a core disposed relative to the first mold, and the mold cavity is defined by the core and the at least one slide.

5. The molding device as described in claim 1, wherein the first mold includes a first core, the second mold includes a second core, and is configured relative to the first core, and the mold cavity is defined by the first core, the second core, and the at least one slide.

6. An injection molding method comprising: Joining a first mold and a second mold of a molding device, wherein the first mold includes a first body and at least one slide, the at least one slide being movably and detachably disposed on the first body and having an undercut portion; Filling a mold cavity defined by the first mold and the second mold with a gas, wherein the gas is blocked by a sealing ring disposed between the first mold and the second mold; filling a pressure buffer space defined by the slider and the second mold with the gas; injecting a molding material into the mold cavity; and opening the first casting mold and the second casting mold of the molding device, After the first casting mold and the second casting mold of the molding device are engaged, the slide cannot be moved.

7. The injection molding method as described in claim 6 further includes moving the at least one slide relative to the first body to demold the molding material, wherein the molding material is fixed by the undercut portion before the step of moving the at least one slide, and the molding material can be removed from the molding device after the step of moving the at least one slide.

8. The injection molding method of claim 6 , wherein the mold cavity has a predetermined gas pressure after the step of filling the mold cavity with the gas, the predetermined gas pressure being greater than the atmospheric pressure outside the molding apparatus, and the injection molding method further comprising: The gas is exhausted from the mold cavity.

9. The injection molding method of claim 6 , wherein the second mold comprises a second body and a pressure shield, the pressure shield is coupled to the second body, and the step of coupling the first mold and the second mold of the molding device further comprises: moving the second body and the pressure shield toward the first body and the at least one slide, The mold cavity and the pressure buffer space have a predetermined gas pressure after the step of filling the mold cavity and the pressure buffer space with the gas.

10. The injection molding method according to claim 9, further comprising: The gas is exhausted from the mold cavity and the pressure buffer space, wherein the predetermined gas pressure is greater than the atmospheric pressure outside the molding device.

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