Display substrate, manufacturing method thereof and display device

Abstract

The present disclosure relates to a display substrate, a manufacturing method thereof and a display device, and belongs to the field of display. The display substrate comprises a substrate, at least two annular dams and a filler. The substrate has a display area and a crack isolation area surrounding the display area; the at least two annular dams are spaced apart on a first surface of the substrate and located in the crack isolation area, each of the at least two annular dams surrounds the display area, and there is an annular groove between any two adjacent annular dams among the at least two annular dams; and the filler is filled in the annular groove, and a part of the filler close to the bottom of the annular groove is a metal structure. When the display substrate generates a crack during cutting, transportation or module assembly, the crack will encounter the annular groove during the extension of the crack, the annular groove has the metal structure, the metal material has good anti-fracture performance, and can block the extension of the crack, thereby improving the ability of the display substrate to block the extension of the crack.

Description

Technical Field

[0001] This disclosure relates to the field of displays, and in particular to a display substrate, a method for manufacturing the same, and a display device. Background Technology

[0002] Mobile phones, tablets, and other display devices have become essential electronic components in people's lives, and the display substrate is a crucial part of these devices. The display substrate consists of the display area and the surrounding area. During cutting, transportation, or module assembly, the display substrate is susceptible to external forces, which can cause cracks in the surrounding area. Once cracks form, they can extend into the display area, allowing water and oxygen to enter and corrode the components within, shortening the lifespan of the display substrate. Summary of the Invention

[0003] This disclosure provides a display substrate, a method for manufacturing the same, and a display device, improving the display substrate's ability to resist cracks. The technical solution is as follows:

[0004] On one hand, this disclosure provides a display substrate, the display substrate comprising: a substrate having a display area and a crack isolation area surrounding the display area; at least two annular dams spaced apart on a first surface of the substrate and located within the crack isolation area, the at least two annular dams surrounding the display area, and an annular groove between adjacent annular dams; and a filler filling the annular groove, the portion of the filler near the bottom of the annular groove comprising a metal structure.

[0005] In one implementation of this disclosure, the filler is a metal structure.

[0006] In one implementation of this disclosure, the filler includes a metal structure and an organic structure, with the metal structure located between the substrate and the organic structure.

[0007] In one implementation of this disclosure, the display substrate further includes an electrode layer located on a first surface of the substrate and in the display area; the metal structure is co-layered with the electrode layer.

[0008] In one implementation of this disclosure, the electrode layer is a gate layer or a source / drain layer.

[0009] In one implementation of this disclosure, the material of the metal structure includes one of the following materials: molybdenum, titanium / aluminum / titanium.

[0010] In one implementation of this disclosure, the display substrate further includes a planarization layer located on a first surface of the substrate; the organic structure is co-layered with the planarization layer.

[0011] In one implementation of this disclosure, the material of the organic structure includes one of the following: polyimide and acrylic adhesive.

[0012] In one implementation of this disclosure, the annular groove includes a first groove and a second groove. The bottom width of the first groove is greater than the top width of the first groove, and the bottom width of the second groove is less than the top width of the first groove. The top surface of the first groove and the bottom surface of the second groove are on the same plane, and the metal structure is at least partially located within the first groove.

[0013] In one implementation of this disclosure, the display substrate further includes an active layer, a gate insulating layer, a gate layer, an interlayer dielectric, a source / drain layer, and a planarization layer sequentially stacked on a first surface of the substrate; the active layer, the gate layer, and the source / drain layer are located in the display region; the gate insulating layer, the interlayer dielectric, and the planarization layer are located in the display region and the crack isolation region, and the annular groove penetrates the interlayer dielectric.

[0014] In one implementation of this disclosure, the display substrate further includes a metal layer, a first organic layer, a first waterproof oxygen layer, and a buffer layer sequentially stacked on the first surface of the substrate. The first organic layer is located between the substrate and the first waterproof oxygen layer, and the buffer layer is located between the first waterproof oxygen layer and the active layer.

[0015] In one implementation of this disclosure, the metal layer includes either a molybdenum layer or an aluminum layer.

[0016] In one implementation of this disclosure, the display substrate further includes a screen crack detection terminal located in the crack isolation area; the metal structure in each annular groove includes a first segment and a second segment of insulated trace, the first segment and the second segment of trace being located on opposite sides of their respective annular grooves; the first segment of trace is connected end to end in sequence to form a crack detection line, and the second segment of trace is connected end to end in sequence to form another crack detection line; the two ends of the crack detection line are respectively connected to the screen crack detection terminal and the pixel circuit in the display substrate.

[0017] On the other hand, this disclosure provides a method for manufacturing a display substrate, the method comprising: providing a substrate having a display area and a crack isolation area surrounding the display area; forming at least two annular dams and a filler on a first surface of the substrate, the at least two annular dams being spaced apart on the first surface of the substrate and located within the crack isolation area, the at least two annular dams both surrounding the display area, an annular groove being formed between adjacent annular dams, the filler filling the annular groove, and the portion of the filler near the bottom of the annular groove being a metal structure.

[0018] On the other hand, this disclosure provides a display device, the display device including a power supply component and a display substrate as shown in any of the previous aspects, the power supply component being used to supply power to the display substrate.

[0019] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0020] In this embodiment, the display area in the display substrate is used to display an image, and the crack isolation area is arranged around the display area to prevent cracks from extending into the display area. When cracks are generated in the display substrate during cutting, transportation, or module assembly, the cracks may extend from the crack isolation area into the display area. During the extension of the crack, it will encounter an annular groove with a metal structure. The fracture resistance of the metal material is better than that of organic materials, which can block the extension of the crack, thereby improving the display substrate's ability to prevent crack extension. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a top view of a display substrate provided in an embodiment of this disclosure;

[0023] Figure 2 yes Figure 1 Cross-sectional view of surface AA;

[0024] Figure 3 yes Figure 1 Cross-sectional view of the BB surface;

[0025] Figure 4 yes Figure 1 Cross-sectional view of the C-plane;

[0026] Figure 5 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure;

[0027] Figure 6 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure;

[0028] Figure 7 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure;

[0029] Figure 8 This is a peeling force trend diagram provided in an embodiment of the present disclosure;

[0030] Figure 9 This is a structural diagram of a crack detection line provided in an embodiment of this disclosure;

[0031] Figure 10 yes Figure 9 Cross-sectional view of the DD plane;

[0032] Figure 11 This is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of this disclosure;

[0033] Figure 12 This is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of this disclosure;

[0034] Figure 13 This is a process diagram illustrating the fabrication of a display substrate according to an embodiment of this disclosure;

[0035] Figure 14 This is a process diagram illustrating the fabrication of a display substrate according to an embodiment of this disclosure;

[0036] Figure 15 This is a process diagram illustrating the fabrication of a display substrate according to an embodiment of this disclosure;

[0037] Figure 16 This is a process diagram illustrating the fabrication of a display substrate according to an embodiment of this disclosure;

[0038] Figure 17 This is a process diagram illustrating the fabrication of a display substrate according to an embodiment of this disclosure;

[0039] Figure 18 This is a process diagram of the manufacturing process of a display substrate provided in an embodiment of this disclosure.

[0040] Figure label:

[0041] 10. Substrate; 20. Annular dam; 101. Display area; 102. Crack isolation area; 103. First surface; 30. Annular groove; 40. Filler; 401. Metal structure; 402. Organic structure; 50. Electrode layer; 60. Gate layer; 70. Source / drain layer; 80. Planarization layer; 90. Active layer; 100. Gate insulating layer; 110. Interlayer dielectric; 1101. First sub-layer interlayer dielectric; 1102. Second sub-layer interlayer dielectric; 130. First organic layer; 140. First waterproof oxygen layer; 150. Buffer layer; 180. Second waterproof oxygen layer; 1501. First sub-buffer layer; 1502. 190. Buffer layer; 120. Adhesion layer; 601. Metal layer; 602. First gate layer; 603. Second gate layer; 604. First electrode plate; 605. Second electrode plate; 1001. First gate insulating layer; 1002. Second gate insulating layer; 301. First groove; 302. Second groove; 160. Screen crack detection terminal; 170. Crack detection switch terminal; 210. Switching thin film transistor; 220. Crack detection data terminal; 200. Cover plate; 230. Functional layer; 300. Crack detection line; 310. First segment trace; 320. Second segment trace; 350. First segment; 360. Second segment; 370. Via. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0043] In related technologies, to prevent crack formation, multiple grooves are created in the outer area of ​​the display substrate, and these grooves are filled with organic material. When a crack extends to the groove, it encounters the organic material, which is less prone to cracking, thus preventing the crack from continuing to extend into the display area.

[0044] However, this method is not ideal in preventing cracks, and the cracks will still extend into the display area of ​​the display substrate, shortening the lifespan of the display substrate.

[0045] Figure 1 This is a top view of a display substrate provided in an embodiment of this disclosure. See also... Figure 1 The display substrate includes a substrate 10 and at least two annular dams 20. The substrate 10 has a display area 101 and a crack isolation area 102 surrounding the display area 101. The at least two annular dams 20 are spaced apart on a first surface 103 of the substrate 10 and are located within the crack isolation area 102. Both annular dams 20 surround the display area 101, and an annular groove 30 is formed between adjacent annular dams 20.

[0046] The first surface 103 of the substrate 10 is the surface of the substrate 10 that is close to the light-emitting surface.

[0047] Figure 2 yes Figure 1 Cross-sectional view of plane AA. See also Figure 2 The display substrate also includes a filler 40, which fills the annular groove 30. At least the portion of the filler 40 located at the bottom of the annular groove 30 is a metal structure 401.

[0048] In this embodiment, the display area 101 in the display substrate is used to display an image, and the crack isolation area 102 is arranged around the display area 101 to prevent cracks from extending into the display area 101. When cracks are generated in the display substrate during cutting, transportation, or module assembly, the cracks may extend from the crack isolation area 102 into the display area 101. During the extension of the crack, the crack will encounter the annular groove 30, which has a metal structure. The fracture resistance of the metal material is better than that of the organic material, which can block the extension of the crack, thereby improving the ability of the display substrate to prevent crack extension.

[0049] In one implementation of this embodiment, the filler 40 is a metal structure 401. That is, not only the bottom of the annular groove 30 is a metal structure 401, but the entire annular groove 30 is a metal structure 401, which can improve the ability of the display substrate to prevent crack propagation.

[0050] In another implementation of this embodiment, the filler 40 includes a metal structure 401 and an organic structure 402, with the metal structure 401 located between the substrate 10 and the organic structure 402. That is, the bottom of the annular groove 30 is the metal structure 401, and the top of the annular groove 30 is the organic structure 402. This improves the display substrate's ability to prevent crack propagation and, moreover, the organic structure 402's good flexibility enhances the flexibility of the display substrate.

[0051] In this embodiment, the number of annular grooves 30 is between 3 and 8, thereby ensuring the display substrate's ability to prevent cracks. In other embodiments, the number of annular grooves 30 may be more or less. For example, the number of annular grooves 30 may be 6.

[0052] Figure 3 yes Figure 1 Cross-sectional view of the BB plane. See also Figure 3 The display substrate also includes an electrode layer 50, which is located on the first surface 103 of the substrate 10 and in the display area 101.

[0053] For example, electrode layer 50 may include gate layer 60 and source drain (SD) layer 70.

[0054] In one possible implementation provided in this disclosure, the metal structure 401 is on the same layer as the electrode layer 50. In the display panel, the electrode layer 50 is made of metal, and the metal structure 401 is on the same layer as the electrode layer 50. In this way, when manufacturing the display substrate, the metal structure 401 and the electrode layer 50 can be manufactured simultaneously in one patterning process, without adding a step to manufacture the metal structure 401, thus simplifying the manufacturing method.

[0055] In embodiments of this disclosure, the term "same layer" refers to the relationship between layers formed simultaneously in the same step. When the metal structure 401 and the electrode layer 50 are formed by performing one or more steps of the same patterning process in the same layer material, they are in the same layer. In another example, the metal structure 401 and the electrode layer 50 can be formed in the same layer by simultaneously performing the steps of forming the metal structure 401 and forming the electrode layer 50. The term "same layer" does not always mean that the thickness of the layer or the layers in a cross-sectional view are the same.

[0056] Figure 4 yes Figure 1 Cross-sectional view of the C-plane. See also Figure 3 and Figure 4 The display substrate further includes an active layer 90, a gate insulation (GI) layer 100, a gate layer 60, an interlayer dielectric (ILD) 110, a source-drain layer 70, and a planarization layer (PLN) 80, which are sequentially stacked on the first surface 103 of the substrate 10. The active layer 90, the gate layer 60, and the source-drain layer 70 are located in the display region 101, while the gate insulation layer 100, the interlayer dielectric 110, and the planarization layer 80 are located in the display region 101 and the crack isolation region 102. An annular groove 30 penetrates the interlayer dielectric 110. All display substrates have a gate layer.

[0057] The active layer 90 can be a polycrystalline silicon material layer, or simply a poly layer. The gate insulating layer 100 separates the active layer 90 from the gate layer 60, preventing interference with the electrical signal transmission of the gate layer 60. The interlayer dielectric 110 separates the gate layer 60 from the source-drain layer 70, preventing interference between the gate layer 60 and the source-drain layer 70, thus affecting the electrical signal transmission. The planarization layer 80 makes the surface of the display substrate with the source-drain layer 70 flatter, facilitating the fabrication of subsequent film layers.

[0058] In this embodiment, the substrate 10 can be a glass substrate or a polyimide (PI) substrate.

[0059] In this embodiment, the gate insulating layer 100 may be a silicon oxide (SiOx) layer, a silicon nitride (SiNx) layer, or a stack of silicon oxide and silicon nitride layers.

[0060] See you again Figure 3 and Figure 4 The interlayer dielectric 110 includes a first sub-interlayer dielectric 1101 and a second sub-interlayer dielectric 1102 stacked together to ensure the insulating effect of the interlayer dielectric 110. The first sub-interlayer dielectric 1101 is located between the second sub-interlayer dielectric 1102 and the gate layer 60.

[0061] For example, the first interlayer dielectric 1101 is one of a silicon oxide layer and a silicon nitride layer, and the second interlayer dielectric 1102 is the other of a silicon oxide layer and a silicon nitride layer. For instance, the first interlayer dielectric 1101 is a silicon oxide layer, and the second interlayer dielectric 1102 is a silicon nitride layer.

[0062] See Figure 4 The metal structure 401 is on the same layer as the gate layer 60. For a display substrate with a bottom gate structure, the distance between the gate layer 60 and the substrate 10 is closer than the distance between the source / drain layer 70 and the substrate 10. This allows the annular groove 30 to be deeper and the filler 40 in the annular groove 30 to be taller. The filler 40 can block more cracks, thereby improving the display substrate's ability to block cracks.

[0063] For example, the gate layer 60 is a molybdenum (Mo) gate layer. When the metal structure 401 is on the same layer as the gate layer 60, the metal structure 401 is metallic molybdenum.

[0064] In another implementation of this disclosure, the metal structure 401 is on the same layer as the source / drain layer 70. When the source / drain layer 70 is a titanium / aluminum / titanium (Ti / Al / Ti) stack, the metal structure 401 is a titanium / aluminum / titanium metal structure.

[0065] See you again Figure 3 and Figure 4 The organic structure 402 is on the same layer as the planarization layer 80. The planarization layer 80 is made of organic material, so the organic structure 402 can be made at the same time as the planarization layer 80, without adding any steps to the process of making the organic structure 402, making the manufacturing method simple.

[0066] In one implementation of this disclosure, the organic structure 402 is polyimide or acrylic adhesive. Polyimide and acrylic adhesive have good flexibility, which can ensure the flexibility of the organic structure 402, thereby ensuring the flexibility of the display substrate.

[0067] In this embodiment of the disclosure, the filler 40 may be referred to as a crack dam.

[0068] Figure 5 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure. Figure 5 The display substrate shown is located in the crack isolation region 102. See also... Figure 5 The display substrate also includes a first organic layer 130, a first waterproof oxygen (Barrier) layer 140 and a buffer layer 150 sequentially stacked on the first surface 103 of the substrate 10. The first organic layer 130 is located between the substrate 10 and the first waterproof oxygen (Barrier) layer 140, and the buffer layer 150 is located between the first waterproof oxygen (Barrier) layer 140 and the active layer 90.

[0069] The first organic layer 130 is used to improve the support performance of the substrate 10. The first waterproof oxygen layer 140 is used to block water and oxygen in a direction perpendicular to the surface of the display substrate, preventing water and oxygen from entering the interior of the display substrate and corroding the display devices inside. The buffer layer 150 is used to reduce the impact on the substrate 10 and the first waterproof oxygen layer 140 when etching the active layer 90.

[0070] Figure 6 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure. Figure 6 The display substrate shown is located in display area 101. See also... Figure 5 and Figure 6 The display substrate also includes a second waterproof oxygen layer 180, which is located between the substrate 10 and the first organic layer 130. The second waterproof oxygen layer 180 can further block water and oxygen in a direction perpendicular to the surface of the display substrate, preventing water and oxygen from entering the interior of the display substrate and causing corrosion to the display devices inside the display substrate, thereby further improving the waterproof oxygen performance of the display substrate.

[0071] For example, the first organic layer 130 may be a polyimide layer. Polyimide has good flexibility, ensuring the flexibility of the display substrate.

[0072] For example, both the first waterproof oxygen layer 140 and the second waterproof oxygen layer 180 are silicon nitride layers. Silicon nitride has a better waterproof oxygen effect, thereby ensuring the waterproof oxygen performance of the display substrate.

[0073] See you again Figure 5 and Figure 6The buffer layer 150 includes a first sub-buffer layer 1501 and a second sub-buffer layer 1502 stacked together. The buffering effect is ensured by setting two sub-buffer layers. The first sub-buffer layer 1501 is located between the first waterproof oxygen layer 140 and the second sub-buffer layer 1502.

[0074] For example, in the display area 101, the second sub-buffer layer 1502 is located between the first sub-buffer layer 1501 and the active layer 90; while there is no active layer 90 in the crack isolation area 102, so in the crack isolation area 102, the second sub-buffer layer 1502 is located between the first sub-buffer layer 1501 and the gate insulating layer 100.

[0075] For example, the first sub-buffer layer 1501 is one of a silicon oxide layer and a silicon nitride layer, and the second sub-buffer layer 1502 is the other of a silicon oxide layer and a silicon nitride layer. For instance, the first sub-buffer layer 1501 is a silicon nitride layer, and the second sub-buffer layer 1502 is a silicon oxide layer.

[0076] See you again Figure 5 and Figure 6 The display panel also includes an adhesive layer 190, which is located between the second waterproof oxygen layer 180 and the first organic layer 130. The adhesive layer 190 has adhesive properties and can increase the adhesion between the second waterproof oxygen layer 180 and the first organic layer 130, thereby preventing the second waterproof oxygen layer 180 and the first organic layer 130 from detaching from each other.

[0077] For example, the adhesive layer 190 is an amorphous silicon layer, which has good adhesion, thus ensuring the adhesion of the adhesive layer 190.

[0078] Figure 7 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this disclosure. Figure 7 The diagram shows the structure of the display substrate at the boundary between the display area 101 and the crack isolation area 102. See also... Figure 6 and Figure 7 The display substrate includes a substrate 10 and, sequentially located on the first surface 103 of the substrate 10, a second waterproof oxygen layer 180, an adhesion layer 190, a metal layer 120, a first organic layer 130, a first waterproof oxygen layer 140, a first sub-buffer layer 1501, a second sub-buffer layer 1502, an active layer 90, a first gate insulating layer 1001, a first gate layer 601, a second gate insulating layer 1002, a second gate layer 602, a first sub-layer inter-dielectric layer 1101, a second sub-layer inter-dielectric layer 1102, a source / drain layer 70, a planarization layer 80, a functional layer 230, and an overcoat (OC) 200. Figure 6 and Figure 7 The display substrate shown includes two gate layers and two gate insulating layers, while Figure 3 and Figure 4 The display substrate shown includes only one gate layer and one gate insulating layer. The layer relationship of the display substrate shown in the embodiments of this disclosure is only one example, and other layer relationships are also possible, which are not limited by this disclosure.

[0079] In this embodiment of the disclosure, the functional layer 230 may include an anode layer, a pixel defining layer, a light-emitting layer, a cathode layer, and an encapsulation layer of the display panel, so as to realize the light-emitting display function of the display panel.

[0080] In this embodiment of the disclosure, the cover plate 200 can be a glass cover plate. For example, the cover plate 200 is a glass with touch function. In this case, the functional layer 230 can include a touch layer, and the cover plate 200 can be called a Touch Over Coat (TOC).

[0081] exist Figure 6 and Figure 7 In this embodiment, the metal structure 401 is on the same layer as the first gate layer 601. In other implementations, the metal structure 401 can be on the same layer as the second gate layer 602.

[0082] exist Figure 6 and Figure 7 In the first gate layer 601, there is a first electrode 603 with a capacitor, and in the second gate layer 602, there is a second electrode 604 with a capacitor. The second electrode 604 is spaced apart from and opposite to the first electrode 603.

[0083] In this embodiment of the disclosure, the first gate insulating layer 1001 is one of a silicon oxide layer and a silicon nitride layer, and the second gate insulating layer 1002 is the other of a silicon oxide layer and a silicon nitride layer. For example, the first gate insulating layer 1001 can be a silicon oxide layer, and the second gate insulating layer 1002 can be a silicon nitride layer.

[0084] In this embodiment of the disclosure, both the first gate layer 601 and the second gate layer 602 are molybdenum metal layers.

[0085] See you again Figure 7 The annular groove 30 includes a first groove 301 and a second groove 302. The bottom width of the first groove 301 is greater than the top width of the first groove 301, and the bottom width of the second groove 302 is less than the top width of the first groove 301. The top surface of the first groove 301 and the bottom surface of the second groove 302 are in the same plane. The metal structure 401 is located in the first groove 301, and the organic structure 402 is located in the second groove 302. Since the metal structure 401 and the organic structure 402 are fabricated through different steps—first the metal structure 401, then the organic structure 402—this will result in the following structure: Figure 7 The shape of the annular groove 30 shown.

[0086] In this embodiment of the disclosure, an adhesive layer 190 and a metal layer 120 are provided between the second waterproof oxygen layer 180 and the first organic layer 130. The adhesive layer 190 and the metal layer 120 can improve the adhesion between the first organic layer 130 and the first waterproof oxygen layer 140, making it more difficult to peel the first organic layer 130 and the first waterproof oxygen layer 140, thereby preventing the film layers of the display substrate from peeling off.

[0087] For example, the metal layer 120 can be a molybdenum layer or an aluminum layer.

[0088] This disclosure embodiment experimentally verifies that molybdenum and aluminum can improve the adhesion between the first organic layer 130 and the first waterproof oxygen layer 140. For example, different metal layers are arranged between the second waterproof oxygen layer 180 and the first organic layer 130, and a comparative example is provided in which no metal layer is arranged between the second waterproof oxygen layer 180 and the first organic layer 130. Then, the peel force when peeling the first organic layer 130 and the first waterproof oxygen layer 140 is measured respectively. Table 1 is a data table of experimental peel force provided by this disclosure embodiment.

[0089] Table 1

[0090]

[0091] In the experiments, the film structure in Experiments 1, 2, and 3 was: PI1-Barrier2-Metal Layer-PI2-Barrier1. The materials of the metal layers in Experiments 1, 2, and 3 were all different, and the specific materials of the metal layers are given in Table 1. The structures of the other film layers were the same. The film structure of the comparative example was: PI1-Barrier2-PI2-Barrier1, and there was no metal layer in the comparative example. Furthermore, the peeling surface in both the experimental examples and the comparative example was Barrier1. The peeling force refers to the force required to separate Barrier1 from PI2.

[0092] In this embodiment of the disclosure, the substrate material is also PI, so PI1 represents substrate 10, Barrier2 represents second waterproof oxygen layer 180, PI2 represents first organic layer 130, and Barrier1 represents first waterproof oxygen layer 140.

[0093] Figure 8 This is a peel force trend diagram provided in an embodiment of this disclosure. (Referring to Table 1 and...) Figure 8It can be seen that when the metal layer between the first organic layer 130 and the first waterproof oxygen layer 140 is a molybdenum layer or an aluminum layer, the peel force is relatively large, greater than that of the comparative example. The peel force is greatest when the metal layer is molybdenum, indicating that the adhesion between the first organic layer 130 and the first waterproof oxygen layer 140 is strongest, and the film is least likely to peel off. This is because the crystal structure of molybdenum is columnar, with many grooves between the columns, resulting in a relatively large surface roughness. This increases the adhesion between the metal layer 120 and the first organic layer 130, as well as the adhesion between the metal layer 120 and the first waterproof oxygen layer 140, making the first waterproof oxygen layer 140 difficult to peel off. Therefore, the film is less likely to peel off.

[0094] In this embodiment of the disclosure, the maximum radius of the columnar structure is 18.4 nanometers, and the average radius of the columnar structure is 14.1 nanometers.

[0095] In this embodiment, the metal structure 401 can be reused as a crack detection line to detect cracks in the display substrate. The crack detection line is located in the crack isolation area 102. Compared with related technologies, where the crack detection line is located in the display area 101 and on the outside, when a crack occurs in the display substrate, the crack can encounter the crack detection line earlier, thus allowing for earlier detection and repair of the display substrate.

[0096] Figure 9 This is a structural diagram of a crack detection line provided in an embodiment of this disclosure. See also... Figure 9 The display substrate also includes a screen crack detection (PCD) terminal 160, located in the crack isolation region 102. A metal structure 401 in an annular groove 30 includes a first trace 310 and a second trace 320 that are insulated from each other. The first trace 310 and the second trace 320 are located on opposite sides of their respective annular grooves 30. The first trace 310 is connected end-to-end to form a crack detection line 300, and the second trace 320 is connected end-to-end to form another crack detection line 300. The two ends of the crack detection line 300 are connected to the screen crack detection terminal 160 and the pixel circuit 330 in the display substrate, respectively. Figure 9 As shown, the first segment 310 and the second segment 320 are two L-shaped segments, one in front and one behind. The shorter side of the first segment 310 and the shorter side of the second segment 320 are on the same straight line, and the longer side of the first segment 310 and the longer side of the second segment 320 are parallel to each other.

[0097] In this embodiment, the display substrate further includes a crack test switch (CTSW) terminal 170 and a crack test data (CTD) terminal 220. The crack test switch terminal 170 is connected to the gates of a plurality of switching thin-film transistors 210, each of which is connected to a plurality of pixel circuits in the same column. Figure 9 The 330) electrical connection, crack detection data terminal 220 and other column pixel circuits ( Figure 9 The 340) is electrically connected, while the pixel circuits in the other columns are pixel circuits not connected to the switching thin-film transistor 210. The screen crack detection terminal 160, crack detection switch terminal 170, and crack detection data terminal 220 are all used to provide voltage.

[0098] Taking a P-type switching thin-film transistor 210 as an example, the crack detection process is described. During crack detection, a first voltage is input to the crack detection data terminal 220, causing the pixel circuits connected to the crack detection data terminal 220 to turn off. Then, a second voltage is input to the gates of multiple switching thin-film transistors 210 through the crack detection switch terminal 170, turning on the switching thin-film transistors 210, where the first voltage is greater than the second voltage. The first voltage is input to the screen crack detection terminal 160, and the current flows through the crack detection line 300 to the pixel circuits electrically connected to the switching thin-film transistors 210, causing all pixel circuits on the display substrate to turn off and not display an image. When a crack appears on the display substrate, the crack blocks the current transmission in the crack detection line 300, causing the voltage received by the pixel circuits electrically connected to the switching thin-film transistors 210 to become the second voltage. Therefore, the pixel circuits electrically connected to the switching thin-film transistors 210 turn on and emit light, thus indicating that a crack has appeared on the display substrate.

[0099] like Figure 9 As shown, screen crack detection terminals 160, crack detection switch terminals 170, and crack detection data terminals 220 are arranged on both the left and right sides of the display substrate, allowing crack detection on both sides. During detection, when the left side of the display substrate emits light, it indicates a crack has appeared on the left side; when the right side emits light, it indicates a crack has appeared on the right side. If both sides of the display substrate emit light, it indicates cracks have appeared on both sides; if neither side emits light, it indicates no cracks have appeared on either side.

[0100] like Figure 9As shown, the crack detection lines 300 on both the left and right sides of the display substrate have multiple turns. If the crack does not affect the outermost crack detection line 300, the crack will continue to extend and will encounter the inner crack detection line 300. The crack will affect the inner crack detection line 300, thereby ensuring that cracks in the display substrate can be detected.

[0101] like Figure 9 As shown, both the first trace 310 and the second trace 320 include the first trace 350 and the second trace 360. Figure 10 yes Figure 9 Cross-sectional view of the DD plane. See also Figure 10 The first section, 350, refers to the metal structure 401. Figure 10 (Not shown), that is, the first segment 350 is located in the first gate layer 601, and the second segment 360 is located in the source-drain layer 70. The first segment 350 and the second segment 360 are connected by a via 370 that penetrates the first sub-layer dielectric 1101 and the second sub-layer dielectric 1102. The first segment 310 and the second segment 320 are relatively long, which can lead to static electricity accumulation. By arranging the second segment 360 in the source-drain layer 70, the first segment 310 and the second segment 320 are treated as jumpers, which can release static electricity and avoid affecting crack detection.

[0102] In this embodiment of the disclosure, the display substrate may include a back plate.

[0103] In this embodiment of the disclosure, the display substrate may be an organic light-emitting diode (OLED) display substrate or a quantum dot light-emitting diode (QLED) display substrate.

[0104] Figure 11 This is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of this disclosure. See also... Figure 11 The method includes:

[0105] In step S11, a substrate is provided. The substrate has a display area and a crack isolation area surrounding the display area.

[0106] For example, the substrate may be a polyimide substrate.

[0107] In step S12, at least two annular dams and a filler are formed on the first surface of the substrate.

[0108] For example, at least two annular dams are spaced apart on the first surface of the substrate and located within the crack isolation region. Both annular dams surround the display area. An annular groove is formed between two adjacent annular dams. A filler is located within the annular groove, and at least the portion of the filler located at the bottom of the groove is a metal structure.

[0109] Figure 12 This is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of this disclosure. See also... Figure 12 The method includes:

[0110] The embodiments disclosed herein are based on Figure 7 The following explanation uses the display substrate shown as an example. Figures 13 to 18 This is a schematic diagram of the structure of the display substrate provided in the embodiments of this disclosure during the manufacturing process. The following is in conjunction with... Figures 13 to 18 The manufacturing method of display substrates is introduced.

[0111] In step S21, a substrate is provided.

[0112] See Figure 13 A substrate 10 is provided. The substrate 10 has a display area and a crack isolation area surrounding the display area.

[0113] In step S22, a second waterproof oxygen layer, an adhesion layer, a molybdenum metal layer, a first organic layer, a first waterproof oxygen layer, a first sub-buffer layer, and a second sub-buffer layer are sequentially formed on the first surface of the substrate.

[0114] See Figure 14 A second waterproof oxygen layer 180, an adhesion layer 190, a metal layer 120, a first organic layer 130, a first waterproof oxygen layer 140, a first sub-buffer layer 1501, and a second sub-buffer layer 1502 are sequentially formed on the first surface 103 of the substrate 10.

[0115] For example, the second waterproof oxide layer 180 is a silicon nitride layer, which can be formed on the first surface 103 of the substrate 10 by deposition.

[0116] For example, the adhesion layer 190 is an amorphous silicon layer, which can be formed by deposition on the side of the second waterproof oxygen layer 180 away from the substrate 10.

[0117] For example, a metal layer 120 can be formed on the side of the adhesion layer 190 away from the substrate 10 by sputtering.

[0118] For example, the first organic layer 130 is a polyimide layer, which can be formed by deposition on the side of the adhesion layer 190 away from the substrate 10.

[0119] For example, the first waterproof oxide layer 140 is a silicon nitride layer, which can be formed by deposition on the side of the first organic layer 130 away from the substrate 10.

[0120] For example, the first sub-buffer layer 1501 is a silicon nitride layer, which can be formed by deposition on the side of the first waterproof oxygen layer 140 away from the substrate 10.

[0121] For example, the second sub-buffer layer 1502 is a silicon oxide layer, and the second sub-buffer layer 1502 can be formed by deposition on the side of the first sub-buffer layer 1501 away from the substrate 10.

[0122] In step S23, an active layer and a gate insulating layer are sequentially formed on the side of the second sub-buffer layer away from the substrate.

[0123] In step S24, a gate layer is formed on the side of the gate insulating layer away from the substrate.

[0124] The display substrate includes two gate layers and two gate insulating layers. Steps S23 and S24 will be explained together here.

[0125] See Figure 15 An active layer 90 is located on the side of the second sub-buffer layer 1502 away from the substrate 10. The active layer 90 is located in the display area 101.

[0126] For example, the active layer 90 is a polysilicon layer. A polysilicon thin film can be formed on the side of the second sub-buffer layer 1502 away from the substrate 10 by deposition, and then the polysilicon thin film is patterned by a patterning process to obtain the active layer 90.

[0127] See Figure 15 A first gate insulating layer 1001 is formed on the side of the active layer 90 away from the substrate 10. The first gate insulating layer 1001 covers the active layer 90 and is located in the display area 101 and the crack isolation area 102.

[0128] For example, the first gate insulating layer 1001 is a silicon oxide layer, which can be formed by deposition on the side of the active layer 90 away from the substrate 10.

[0129] See Figure 15A first gate layer 601 and a metal structure 401 are formed on the side of the first gate insulating layer 1001 away from the substrate 10. The first gate layer 601 is located in the display area 101 and includes a first electrode 603 of a capacitor. The metal structure 401 is located in the crack isolation area 102.

[0130] For example, both the first gate layer 601 and the metal structure 401 are made of molybdenum. A thin film of molybdenum can be formed on the side of the first gate insulating layer 1001 away from the substrate 10 by sputtering, and then the first gate layer 601 and the metal structure 401 can be formed by a patterning process.

[0131] See Figure 16 A second gate insulating layer 1002 is formed on the side of the first gate layer 601 away from the substrate 10. The second gate insulating layer 1002 covers the first gate layer 601 and the metal structure 401, and at the same time, the second gate insulating layer 1002 separates the first gate layer 601 and the metal structure 401.

[0132] For example, the second gate insulating layer 1002 is a silicon nitride layer, which can be formed by deposition on the side of the first gate layer 601 away from the substrate 10.

[0133] See Figure 16 A second gate layer 602 is formed on the side of the second gate insulating layer 1002 away from the substrate 10. The second gate layer 602 is located in the display area 101 and includes a second electrode 604 of a capacitor.

[0134] For example, the second gate layer 602 is a molybdenum layer. A thin molybdenum film can be formed on the side of the second gate insulating layer 1002 away from the substrate 10 by sputtering, and then the second gate layer 602 can be formed by a patterning process.

[0135] In step S25, an interlayer dielectric and a source / drain layer are sequentially formed on the side of the gate layer away from the substrate.

[0136] For example, the interlayer dielectric includes a first sub-interlayer dielectric and a second sub-interlayer dielectric.

[0137] See Figure 16 A first sub-layer dielectric 1101 is formed on the side of the second gate layer 602 away from the substrate 10. The first sub-layer dielectric 1101 covers the second gate layer 602. The first sub-layer dielectric 1101 is located in the display region 101 and the crack isolation region 102.

[0138] For example, the first sub-layer dielectric 1101 is a silicon nitride layer, which can be formed by deposition on the side of the second gate layer 602 away from the substrate 10.

[0139] See Figure 16 A second sub-layer dielectric 1102 is formed on the side of the first sub-layer dielectric 1101 away from the substrate 10. The second sub-layer dielectric 1102 is located in the display region 101 and the crack isolation region 102.

[0140] For example, the second sub-layer dielectric 1102 is a silicon oxide layer, which can be formed by deposition on the side of the first sub-layer dielectric 1101 away from the substrate 10.

[0141] See Figure 16 A source / drain layer 70 is formed on the side of the second sublayer dielectric 1102 away from the substrate 10. The source / drain layer 70 is located in the display region 101.

[0142] For example, the source / drain layer 70 is a titanium / aluminum / titanium stack. A titanium / aluminum / titanium stack film can be formed on the side of the second sublayer dielectric 1102 away from the substrate 10 by sputtering, and then the source / drain layer 70 is formed by a patterning process.

[0143] In step S26, a groove is formed at the position of the interlayer dielectric corresponding to the metal structure.

[0144] See Figure 17 A second groove 302 is formed in the second sub-layer interlayer dielectric 1102, the first sub-layer interlayer dielectric 1101, and the second gate insulating layer 1002 at a position corresponding to the metal structure 401, so that the metal structure 401 is exposed from the second groove 302. The second groove 302 is located in the crack isolation region 102 and surrounds the display region 101.

[0145] For example, after the source-drain layer 70 is fabricated, a groove is made on the display substrate at the position corresponding to the pad bending. The second groove 302 is made at the same time as the pad bending groove, without adding any fabrication steps.

[0146] For example, the second groove 302 and the pad bending groove can be formed by etching.

[0147] In this embodiment, when the second groove 302 is created, it penetrates both the first sublayer dielectric 1101 and the second sublayer dielectric 1102. The first sublayer dielectric 1101 and the second sublayer dielectric 1102 can be referred to as a double buffer layer. Therefore, the process for fabricating the second groove 302 can be called the EBB process, where E stands for Etch and BB stands for double buffer layer. The buffer here is not the same as the buffer layer 150.

[0148] In step S27, a planarization layer is formed on the side of the interlayer dielectric away from the substrate.

[0149] See Figure 18 A planarization layer 80 is formed on the side of the second sublayer dielectric 1102 away from the substrate 10. The planarization layer 80 includes an organic structure 402 located within the second groove 302.

[0150] For example, the planarization layer 80 is a polyimide layer, which can be formed by deposition on the side of the second sublayer dielectric 1102 away from the substrate 10.

[0151] Finally, a functional layer 230 is formed on the planarization layer 80, and a cover plate 200 is placed on the functional layer 230 to form a structure as shown in the figure. Figure 7 The display substrate shown.

[0152] This disclosure also provides a display device, which includes a power supply component and a display substrate as described above. The power supply component is used to supply power to the display substrate.

[0153] In specific implementation, the display device provided in the embodiments of this disclosure can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0154] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display substrate, characterized in that, The display substrate includes: A substrate having a display area and a crack isolation area surrounding the display area; An active layer, a gate insulating layer, a gate layer, an interlayer dielectric, a source drain layer, and a planarization layer are sequentially stacked on the first surface of the substrate. The active layer, the gate layer, and the source drain layer are located in the display area, and the gate insulating layer, the interlayer dielectric, and the planarization layer are located in the display area and the crack isolation area. At least two annular dams are spaced apart on the first surface of the substrate and located within the crack isolation area. Both annular dams surround the display area. An annular groove is formed between two adjacent annular dams. The annular groove includes a first groove and a second groove. The bottom width of the first groove is greater than the top width of the first groove, and the bottom width of the second groove is less than the top width of the first groove. The top surface of the first groove and the bottom surface of the second groove are on the same plane. The filler includes a metal structure and an organic structure, wherein the metal structure is located in the first groove and the organic structure is located in the second groove; The top and bottom surfaces of the first groove are located on the gate insulating layer, and the top surface of the second groove is located on the interlayer dielectric; the organic structure and the planarization layer are an integral structure.

2. The display substrate according to claim 1, characterized in that, The filler is a metal structure.

3. The display substrate according to claim 1 or 2, characterized in that, The display substrate further includes an electrode layer, which is located on a first surface of the substrate and in the display area. The metal structure is in the same layer as the electrode layer.

4. The display substrate according to claim 3, characterized in that, The electrode layer is either a gate layer or a source / drain layer.

5. The display substrate according to claim 4, characterized in that, The material of the metal structure includes one of the following materials: Molybdenum, titanium / aluminum / titanium.

6. The display substrate according to claim 1 or 2, characterized in that, The organic structure is made of one of the following materials: Polyimide and acrylic adhesive.

7. The display substrate according to claim 1 or 2, characterized in that, The display substrate further includes a metal layer, a first organic layer, a first waterproof oxygen layer, and a buffer layer sequentially stacked on the first surface of the substrate. The first organic layer is located between the substrate and the first waterproof oxygen layer, and the buffer layer is located between the first waterproof oxygen layer and the active layer.

8. The display substrate according to claim 7, characterized in that, The metal layer includes either a molybdenum layer or an aluminum layer.

9. The display substrate according to claim 1 or 2, characterized in that, The display substrate also includes a screen crack detection terminal, which is located in the crack isolation area; Each of the annular grooves contains a metal structure comprising a first segment of trace and a second segment of trace that are insulated from each other. The first segment of trace and the second segment of trace are located on opposite sides of the annular groove. The first segment of trace is connected end to end to form a crack detection line, and the second segment of trace is connected end to end to form another crack detection line. The two ends of the crack detection line are connected to the screen crack detection end and the pixel circuit in the display substrate, respectively.

10. A method for manufacturing a display substrate, characterized in that, The method includes: A substrate is provided, the substrate having a display area and a crack isolation area surrounding the display area; An active layer, a gate insulating layer, a gate layer, an interlayer dielectric, a source drain layer, and a planarization layer are sequentially stacked on the first surface of the substrate. The active layer, the gate layer, and the source drain layer are located in the display area, and the gate insulating layer, the interlayer dielectric, and the planarization layer are located in the display area and the crack isolation area. At least two annular dams and a filler are formed on the first surface of the substrate. The at least two annular dams are spaced apart on the first surface of the substrate and located within the crack isolation region. Both annular dams surround the display area. An annular groove is formed between adjacent annular dams. The annular groove includes a first groove and a second groove. The bottom width of the first groove is greater than the top width of the first groove, and the bottom width of the second groove is less than the top width of the first groove. The top surface of the first groove and the bottom surface of the second groove are on the same plane. The filler includes a metal structure and an organic structure. The metal structure is located in the first groove, and the organic structure is located in the second groove. The top and bottom surfaces of the first groove are located on the gate insulating layer, and the top surface of the second groove is located on the interlayer dielectric. The organic structure is integral with the planarization layer.

11. A display device, characterized in that, The display device includes a power supply component and a display substrate as described in any one of claims 1 to 9, wherein the power supply component is used to supply power to the display substrate.

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