Wireless earphones with pressure sensing module and pressure sensing method

Abstract

This invention discloses a wireless earphone with a pressure-sensitive module and a pressure-sensitive method. The wireless earphone with the pressure-sensitive module includes an earphone back shell, a Bluetooth motherboard, a pressure-sensitive bracket, and a pressure-sensitive device. The earphone back shell includes a cylindrical housing portion, within which a motherboard mounting position is provided. Pressure-sensitive pressing portions are located on the left and / or right sides of the cylindrical housing portion. The Bluetooth motherboard is mounted on the motherboard mounting position. The pressure-sensitive bracket is mounted on the Bluetooth motherboard, and a pressure-sensitive mounting position is provided on its upper side. The pressure-sensitive device is mounted on the pressure-sensitive mounting position, and its upper side is interference-fitted with the upper inner wall of the cylindrical housing portion. A conductive circuit connects the pressure-sensitive device and the Bluetooth motherboard. This invention is easy to assemble, has high sensitivity, and is unlikely to cause mechanical damage to the pressure-sensitive device.

Description

Technical Field

[0001] This invention relates to the field of headphone technology, and in particular to a wireless headphone with a pressure-sensitive module and a pressure-sensitive method. Background Technology

[0002] With the development of wireless headphones and users' diverse demands for interactive functions, the design requirements for buttons that implement headphone interactive functions are becoming increasingly stringent. Existing technologies typically include the following types of buttons: 1. Mechanical contact buttons: These have low sensitivity, complex structures, and require significant force to operate, causing pressure on the user's ears. They also require a large space and offer a poor tactile experience. 2. Buttons based on capacitive touch chips: Because capacitive touch chips use an X and Y axis interactive interface, they are triggered when the user touches the interface, leading to a high probability of accidental touches. 3. Tap-type buttons based on inertial sensors: These buttons use the number of taps on the headphone's sensor surface to control functions such as switching and volume adjustment. However, tapping them while wearing the headphones provides a poor user experience and can cause discomfort to the eardrums and brain.

[0003] With the advancement of technology, wireless headphones with pressure-sensitive modules have gradually emerged.

[0004] See Chinese patent document CN212137906U, which discloses a wireless earphone structure with pressure-sensitive buttons located on the back. The structure includes an ear stem, pressure-sensitive buttons, a Bluetooth antenna, a filler, and a circuit board. The circuit board is located inside the ear stem. When using the wireless earphone, the circuit board has a back side close to the user and a front side away from the user. The Bluetooth antenna and the pressure-sensitive buttons are electrically connected to the circuit board. The Bluetooth antenna is located on the front of the circuit board, and the pressure-sensitive buttons are located on the back of the circuit board. The filler is located between the ear stem and the circuit board. A press button is also provided. When the press button is pressed, the reaction force of the filler transmits the force of pressing the press button to the pressure-sensitive button, thereby realizing the pressing function. However, the technical problems of this patent CN212137906U are: (1) difficult to assemble. The pressure-sensitive button, Bluetooth antenna and circuit board must be installed inside the ear rod. The filler must also be installed on the upper and lower sides of the circuit board. Moreover, the pressure needs to be transmitted through the filler. This makes the installation requirements of the filler very high. If the installation is not good enough, it will affect the ability of the filler to transmit pressure; (2) Installing the filler on the upper and lower sides of the circuit board is not conducive to the heat dissipation of the circuit board; (3) By pressing the press button, the pressure is transmitted to the filler, and then transmitted to the pressure-sensitive button through the filler. This pressure transmission process adds the intermediate link of the filler, which will reduce the sensitivity of the pressure-sensitive button.

[0005] See Chinese patent document CN215121137U, which discloses an earphone structure and earphone that can improve pressure sensitivity, including an ear stem shell, an earphone main board and a pressure sensing module. The inner wall of the ear stem shell is provided with a metal part. The pressure sensing module includes a pressure sensor mounted on the earphone main board and an elastic part disposed on the pressure sensor and elastically abutting against the metal part. However, the technical problems of this patent CN215121137U are: (1) assembly is difficult, as it is necessary to install a metal part on the inner wall of the ear stem shell and to install an elastic part between the metal part and the pressure sensor, which makes assembly difficult; (2) by pressing the ear stem shell, the pressure is transmitted to the metal part by the ear stem shell, then to the elastic part by the metal part, and finally to the pressure sensor by the elastic part. This pressure transmission process adds two intermediate links, the metal part and the elastic part, which will reduce the sensitivity of the pressure-sensitive button.

[0006] Furthermore, in existing technologies, another type of wireless earphone with a pressure-sensitive module directly mounts the pressure sensor on the inner wall of the pressing area of ​​the earphone shell, and the pressure sensor is electrically connected to the driver chip. The problem with this approach is that when a hand presses the pressing area of ​​the shell, the pressure sensor deforms with the touch area and issues a pressure-sensitive command. However, the pressure applied to the pressing area varies. When the pressure is too strong, the pressing area of ​​the earphone shell deforms significantly towards the pressure sensor, applying excessive rigid pressure. This excessive rigid pressure can easily cause mechanical damage to the pressure sensor and reduce its sensitivity. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to address the shortcomings of the prior art by providing a wireless earphone with a pressure-sensitive module that is easy to assemble, has high sensitivity, and is not prone to causing mechanical damage to the pressure-sensitive device. To this end, the present invention also provides a pressure-sensitive method for the wireless earphone with the pressure-sensitive module.

[0008] To solve the aforementioned first technical problem, the technical solution of the present invention is: a wireless earphone with a pressure-sensitive module, comprising:

[0009] The earphone back cover includes a cylindrical housing portion, a motherboard mounting position is provided inside the cylindrical housing portion, and pressure-sensitive pressing portions are provided on the left and / or right sides of the cylindrical housing portion;

[0010] Bluetooth motherboard, wherein the Bluetooth motherboard is mounted on the motherboard mounting position;

[0011] A pressure-sensitive bracket is mounted on the Bluetooth motherboard, and a pressure-sensitive mounting position is provided on the upper side of the pressure-sensitive bracket;

[0012] A pressure-sensitive device is mounted on a pressure-sensitive mounting position. The upper side of the pressure-sensitive device is interference-fitted with the upper inner wall of the cylindrical housing. A conductive line connects the pressure-sensitive device and the Bluetooth motherboard.

[0013] Preferably, the motherboard mounting position includes a left support block and a right support block. The length direction of the upper side of the left support block and the right support block is consistent with the length direction of the cylindrical shell portion. The left support block is integrally formed on the left inner wall of the cylindrical shell portion, and the right support block is integrally formed on the right inner wall of the cylindrical shell portion. The left end of the Bluetooth motherboard is mounted on the upper side of the left support block, and the right end of the Bluetooth motherboard is mounted on the upper side of the right support block.

[0014] Preferably, the Bluetooth motherboard has slots on both the left and right sides, and a socket on the top of the Bluetooth motherboard. The pressure-sensitive bracket has hooks and rods extending downwards. The hooks correspond to and match the slots, and are engaged in the corresponding slots. The rods correspond to and match the sockets, and are engaged in the corresponding sockets.

[0015] Preferably, one end of the pressure-sensitive bracket is provided with a microphone cavity, which covers the Bluetooth motherboard. One end of the Bluetooth motherboard is provided with a noise-canceling microphone, and the microphone cavity and the noise-canceling microphone are vertically aligned. One end of the microphone cavity is provided with a first sound guide hole, and one end of the cylindrical housing is provided with a second sound guide hole that communicates with the first sound guide hole.

[0016] Preferably, a voice microphone and an earphone charging head are provided on the other end of the Bluetooth motherboard, and a tail plug is installed on the other end of the cylindrical housing. The tail plug has a third sound guide hole and a charging hole. The third sound guide hole corresponds to the voice microphone, and the earphone charging head is inserted into the charging hole.

[0017] Preferably, the upper side of the pressure-sensitive bracket is arc-shaped, and its curvature is consistent with the curvature of the upper inner wall of the cylindrical shell. The upper side of the pressure-sensitive bracket is provided with several ribs, and the upper side of the ribs abuts against the upper inner wall of the cylindrical shell.

[0018] Preferably, the pressure-sensitive mounting position includes a rectangular mounting groove, the pressure-sensitive device is attached to the rectangular mounting groove, the middle part of the pressure-sensitive device has an upwardly protruding part, and the upper side of the protruding part is interference-fitted with the upper inner wall of the cylindrical housing part.

[0019] Preferably, the wireless earphone with pressure-sensitive module further includes an earphone front shell, which covers the earphone rear shell. The earphone front shell and the earphone rear shell are provided with a battery, a speaker, a magnet and a mesh fabric inside, and an ear tip is installed at the front end of the earphone front shell.

[0020] To solve the second technical problem mentioned above, the technical solution of the present invention is: the pressure-sensitive method of the wireless earphone with pressure-sensitive module includes the following steps:

[0021] (1) Due to the interference fit between the pressure-sensitive device and the upper inner wall of the cylindrical housing, the cylindrical housing has an initial pressure that presses against the pressure-sensitive device. This initial pressure is the reference pressure.

[0022] (2) Press the pressure-sensitive part from the left and / or right side of the cylindrical shell of the earphone back shell with your hand;

[0023] (3) The cylindrical shell of the earphone back shell deforms when pressed, and the left and right ends of the cylindrical shell move towards the middle, causing the upper and lower ends of the cylindrical shell to open outward, thereby reducing the pressure of the cylindrical shell pressing against the pressure sensing device. The reduced pressure is the low pressure.

[0024] (4) The pressure-sensitive device transmits the low pressure to the Bluetooth motherboard in real time through the conductive line. The Bluetooth motherboard compares the low pressure with the reference pressure and determines the pressing action of the human hand based on the pressure value, duration and frequency of occurrence of the low pressure, and makes instructions to control the working state of the headphones.

[0025] The beneficial effects of this invention are:

[0026] (1) Since the cylindrical shell of the earphone has a motherboard mounting position, the Bluetooth motherboard is mounted on the motherboard mounting position, the pressure-sensitive bracket is mounted on the Bluetooth motherboard, and the pressure-sensitive device is mounted on the pressure-sensitive mounting position. The upper side of the pressure-sensitive device is interference-fitted with the upper inner wall of the cylindrical shell. There is a conductive line connecting the pressure-sensitive device and the Bluetooth motherboard. Therefore, the present invention can support and position the Bluetooth motherboard through the motherboard mounting position of the cylindrical shell, then support and position the pressure-sensitive bracket through the Bluetooth motherboard, and then support and position the pressure-sensitive device through the pressure-sensitive bracket, and make the pressure-sensitive device interference-fitted with the upper inner wall of the cylindrical shell. The various structural components are very securely installed. The assembly process includes four steps: First, the pressure-sensitive device and the Bluetooth motherboard are soldered to the two ends of the conductive circuit to connect the pressure-sensitive device to the Bluetooth motherboard. Second, the pressure-sensitive bracket is installed on the Bluetooth motherboard. Third, the pressure-sensitive device is attached to the pressure-sensitive mounting position on the pressure-sensitive bracket. Fourth, the Bluetooth motherboard, pressure-sensitive bracket, and pressure-sensitive device are inserted as a whole module from the tail of the cylindrical shell of the earphone back shell into the cylindrical shell, thus completing the assembly. As can be seen, the assembly process can achieve modular assembly, which is convenient and highly stable.

[0027] (2) Since the upper side of the pressure-sensitive device is interference-fitted with the upper inner wall of the cylindrical shell, the pressure-sensitive device is in direct contact with the cylindrical shell. Compared with the traditional technology that requires pressure transmission components such as filler, metal sheet, and elastic sheet, the pressure-sensitive device of the present invention can directly sense the pressure change of the cylindrical shell. Therefore, the pressure-sensitive device is very sensitive.

[0028] (3) Since the upper side of the pressure-sensitive device is interference-fitted with the upper inner wall of the cylindrical housing, and the pressure-sensitive pressing part is located on the left and / or right side of the cylindrical housing, the position of the pressure-sensitive device and the position of the pressure-sensitive pressing part are different. Therefore, when a person presses the pressure-sensitive pressing part, the left and right ends of the cylindrical housing will move towards the middle, causing the upper and lower ends of the cylindrical housing to open outward, thus reducing the pressure of the cylindrical housing against the pressure-sensitive device. It can be seen that no matter how much force a person applies to the pressure-sensitive pressing part of the cylindrical housing, the pressure applied to the pressure-sensitive device by the upper inner wall of the cylindrical housing can only be less than the initial pressure, and will not be greater than the initial pressure. Therefore, when a person presses the pressure-sensitive pressing part of the cylindrical housing, it will not cause mechanical damage to the pressure-sensitive device. Attached Figure Description

[0029] Figure 1 This is a structural diagram of a wireless headset.

[0030] Figure 2 This is one of the distributed structure diagrams for wireless headphones.

[0031] Figure 3 This is the second diagram showing the distributed structure of a wireless earphone.

[0032] Figure 4 This is the third diagram showing the distributed structure of a wireless earphone.

[0033] Figure 5 This is a longitudinal sectional view of the earphone back shell, Bluetooth motherboard, pressure-sensitive bracket, pressure-sensitive device, and tail plug.

[0034] Figure 6 This is a cross-sectional view of the earphone's back shell, Bluetooth motherboard, pressure-sensitive bracket, pressure-sensitive device, and tail plug.

[0035] Figure 7 This is a schematic diagram illustrating the assembly process of wireless headphones. Detailed Implementation

[0036] The structural and working principles of the present invention will be further described in detail below with reference to the accompanying drawings.

[0037] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, see [link to drawings]. Figure 6The directional coordinates in the text are for the purpose of facilitating the description of the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the invention.

[0038] like Figures 1-6 As shown, the present invention is a wireless earphone with a pressure-sensitive module, including an earphone back shell 1, a Bluetooth motherboard 2, a pressure-sensitive bracket 3, and a pressure-sensitive device 4; the earphone back shell 1 includes a cylindrical shell portion 11, a motherboard mounting position 111 is provided inside the cylindrical shell portion 11, and a pressure-sensitive pressing portion 112 is provided on the left and / or right side of the cylindrical shell portion 11; the Bluetooth motherboard 2 is mounted on the motherboard mounting position 111; the pressure-sensitive bracket 3 is mounted on the Bluetooth motherboard 2, and a pressure-sensitive mounting position 31 is provided on the upper side of the pressure-sensitive bracket 3; the pressure-sensitive device 4 is mounted on the pressure-sensitive mounting position 31, and the upper side of the pressure-sensitive device 4 is interference-fitted with the upper inner wall of the cylindrical shell portion 11; a conductive line 42 is connected between the pressure-sensitive device 4 and the Bluetooth motherboard 2, and the conductive line 42 is preferably an FPC flexible circuit board. This invention enables the Bluetooth motherboard 2 to be supported and positioned via the motherboard mounting position 111 of the cylindrical housing 11, which in turn supports and positions the pressure-sensitive bracket 3, which in turn supports and positions the pressure-sensitive device 4. The pressure-sensitive device 4 is also press-fitted into the upper inner wall of the cylindrical housing 111, resulting in a very stable installation of all components. Figure 7 As shown, the assembly process of this invention includes four steps: First, the pressure-sensitive device 4 and the Bluetooth motherboard 2 are soldered to the two ends of the conductive line 42 respectively, so that the pressure-sensitive device 4 and the Bluetooth motherboard 2 are connected; Second, the pressure-sensitive bracket 3 is installed on the Bluetooth motherboard 2; Third, the pressure-sensitive device 4 is attached to the pressure-sensitive mounting position 31 of the pressure-sensitive bracket 3; Fourth, the Bluetooth motherboard 2, the pressure-sensitive bracket 3, and the pressure-sensitive device 4 are inserted into the cylindrical housing portion 111 of the earphone back shell 1 as a whole module, thus completing the assembly; It can be seen that the assembly process can realize modular assembly, which is convenient to assemble and has high stability. Because the upper side of the pressure-sensitive device 4 is interference-fitted with the upper inner wall of the cylindrical housing portion 11, the pressure-sensitive device 4 is in direct contact with the cylindrical housing portion 11. Compared with the traditional technology that requires pressure transmission components such as fillers, metal sheets, and elastic sheets, the pressure-sensitive device 4 of the present invention can directly sense the pressure change of the cylindrical housing portion 11. Therefore, the pressure-sensitive device is very sensitive. Because the upper side of the pressure-sensitive device 4 is interference-fitted with the upper inner wall of the cylindrical housing portion 11, and the pressure-sensitive pressing portion 112 is located on the left and / or right side of the cylindrical housing portion 11, that is, the position of the pressure-sensitive device 4 and the position of the pressure-sensitive pressing portion 112 are not the same, therefore, as Figure 6As shown, when a person presses the pressure-sensitive pressing part 112 with a hand, the pressing direction is F1. The left and right ends of the cylindrical shell part 11 will move towards the center, causing the upper and lower ends of the cylindrical shell part 11 to open outward in the direction of F2. This reduces the pressure of the cylindrical shell part 11 pressing against the pressure-sensitive device 4. Therefore, no matter how much force a person applies to pressing the pressure-sensitive pressing part 112 of the cylindrical shell part 11, the pressure applied to the pressure-sensitive device 4 by the upper inner wall of the cylindrical shell part 11 can only be less than the initial pressure, and will not be greater than the initial pressure. Therefore, pressing the pressure-sensitive pressing part 112 of the cylindrical shell part 11 will not cause mechanical damage to the pressure-sensitive device 4.

[0039] like Figures 2-6 As shown, the motherboard mounting position 111 includes a left support block 113 and a right support block 114. The length direction of the upper side surfaces of the left support block 113 and the right support block 114 is consistent with the length direction of the cylindrical housing portion 11. The left support block 113 is integrally formed on the left inner wall of the cylindrical housing portion 11, and the right support block 114 is integrally formed on the right inner wall of the cylindrical housing portion 11. The left end of the Bluetooth motherboard 2 is mounted on the upper side surface of the left support block 113, and the right end of the Bluetooth motherboard 2 is mounted on the upper side surface of the right support block 114. During the process of inserting the Bluetooth motherboard 2, the pressure-sensitive bracket 3, and the pressure-sensitive device 4 as a whole module from the tail of the cylindrical housing portion 111 of the earphone back shell 1 into the cylindrical housing portion 111, the left and right ends of the Bluetooth motherboard 2 can be slidably inserted into the upper side surfaces of the left support block 113 and the right support block 114, making installation more convenient.

[0040] like Figures 2-6 As shown, the Bluetooth motherboard 2 has slots 21 on both its left and right sides, and a socket 22 on its top. The pressure-sensitive bracket 3 has downward-extending hooks 32 and rods 33. The hooks 32 correspond to and match the slots 21, engaging with the corresponding slots 21; the rods 33 correspond to and match the sockets 22, inserting into the corresponding sockets 22. This makes installation between the Bluetooth motherboard 2 and the pressure-sensitive bracket 3 convenient, requiring no screws for fastening.

[0041] like Figures 2-5 As shown, one end of the pressure-sensitive bracket 3 is provided with a microphone cavity 34, which covers the Bluetooth motherboard 2. One end of the Bluetooth motherboard 2 is provided with a noise-canceling microphone 23, and the microphone cavity 34 and the noise-canceling microphone 23 are vertically aligned. One end of the microphone cavity 34 is provided with a first sound guide hole 341, and one end of the cylindrical housing 11 is provided with a second sound guide hole 115 that communicates with the first sound guide hole 341. Preferably, the noise-canceling microphone 23 is soldered to the lower side of the Bluetooth motherboard 2. The Bluetooth motherboard 2 is provided with a fourth sound guide hole 231, the lower end of which connects to the noise-canceling microphone 23, and the upper end of which connects to the microphone cavity 34.

[0042] like Figure 1-Figure 5 As shown, a voice microphone 24 and an earphone charging head 25 are provided on the other end of the Bluetooth motherboard 2. A tail plug 5 is installed on the other end of the cylindrical housing 11. The tail plug 5 has a third sound guide hole 51 and a charging hole 52. The third sound guide hole 51 corresponds to the voice microphone 24, and the earphone charging head 25 is inserted into the charging hole 52. Preferably, the voice microphone 24 is soldered to the lower side of the Bluetooth motherboard 2. The Bluetooth motherboard 2 has a fifth sound guide hole 241. The lower end of the fifth sound guide hole 241 is connected to the voice microphone 24, and the upper end of the fifth sound guide hole 241 is connected to the third sound guide hole 51.

[0043] like Figures 2-6 As shown, the upper side of the pressure-sensitive bracket 3 is arc-shaped, and its curvature matches the curvature of the upper inner wall of the cylindrical housing 11. The upper side of the pressure-sensitive bracket 3 is provided with several ribs 35, the upper sides of which abut against the upper inner wall of the cylindrical housing 11. This makes the installation of the pressure-sensitive bracket 3 and the cylindrical housing 11 more stable, and gives the end of the pressure-sensitive bracket 3 with the pressure-sensitive mounting position 31 a certain degree of elasticity, preventing the pressure-sensitive device 4 from rigidly contacting the upper inner wall of the cylindrical housing 11.

[0044] like Figures 2-6 As shown, the pressure-sensitive mounting position 31 includes a rectangular mounting groove, and the pressure-sensitive device 4 is attached to the rectangular mounting groove. The middle part of the pressure-sensitive device 4 has an upwardly protruding part 41, and the upper side of the protruding part 41 is interference-fitted with the upper inner wall of the cylindrical housing part 11.

[0045] like Figures 1-4 As shown, the wireless earphone with pressure-sensitive module also includes an earphone front shell 6, which covers the earphone rear shell 1. The earphone front shell 6 and the earphone rear shell 1 are provided with a battery 7, a speaker 8, a magnet 9 and a mesh fabric 10. An ear cover 61 is installed at the front end of the earphone front shell 6.

[0046] The pressure-sensitive method for wireless earphones with a pressure-sensitive module according to the present invention includes the following steps:

[0047] (1) Due to the interference fit between the pressure-sensitive device 4 and the upper inner wall of the cylindrical housing 11, the cylindrical housing 11 has an initial pressure pressing against the pressure-sensitive device 4, which is the reference pressure.

[0048] (2) A person presses the pressure-sensitive pressing part 112 from the left and / or right side of the cylindrical housing part 11 of the earphone back shell 1; see also Figure 6 Press the left and right sides of the cylindrical shell part 11 with your hand in the F1 direction, or press only the left or right side;

[0049] (3) The cylindrical shell portion 11 of the earphone back shell 1 deforms when pressed, see [reference] Figure 6 The left and right ends of the cylindrical housing 11 move closer to the middle, causing the upper and lower ends of the cylindrical housing 11 to open outward, that is, open in the F2 direction, so that the pressure of the cylindrical housing 11 pressing against the pressure sensing device 4 is reduced, and the reduced pressure is the low pressure.

[0050] (4) The pressure-sensitive device 4 transmits the low pressure to the Bluetooth motherboard 2 in real time through the conductive line 42. The Bluetooth motherboard 2 compares the low pressure with the reference pressure and determines the pressing action of the human hand based on the pressure value, duration and frequency of occurrence of the low pressure, and makes a command to control the working state of the headphones.

[0051] The above description is merely a preferred embodiment of the present invention. Any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical solution of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A wireless earphone with a pressure-sensitive module, characterized in that, include: The earphone back cover includes a cylindrical housing portion, a motherboard mounting position is provided inside the cylindrical housing portion, and pressure-sensitive pressing portions are provided on the left and / or right sides of the cylindrical housing portion; Bluetooth motherboard, wherein the Bluetooth motherboard is mounted on the motherboard mounting position; A pressure-sensitive bracket is mounted on the Bluetooth motherboard, and a pressure-sensitive mounting position is provided on the upper side of the pressure-sensitive bracket; A pressure-sensitive device is mounted on a pressure-sensitive mounting position. The upper side of the pressure-sensitive device is interference-fitted with the upper inner wall of the cylindrical housing. A conductive line connects the pressure-sensitive device and the Bluetooth motherboard. The motherboard mounting position includes a left support block and a right support block. The length direction of the upper side of the left and right support blocks is consistent with the length direction of the cylindrical shell. The left support block is integrally formed on the left inner wall of the cylindrical shell, and the right support block is integrally formed on the right inner wall of the cylindrical shell. The left end of the Bluetooth motherboard is mounted on the upper side of the left support block, and the right end of the Bluetooth motherboard is mounted on the upper side of the right support block. The left and right sides of the Bluetooth motherboard are respectively provided with slots, and the Bluetooth motherboard is provided with a socket. The pressure-sensitive bracket is provided with downwardly extending hooks and rods. The hooks correspond to and match the slots, and the hooks are engaged in the corresponding slots. The rods correspond to and match the sockets, and the rods are inserted into the corresponding sockets. The upper side of the pressure-sensitive bracket is arc-shaped, and its curvature is consistent with the curvature of the upper inner wall of the cylindrical shell. The upper side of the pressure-sensitive bracket is provided with several ribs, and the upper side of the ribs abuts against the upper inner wall of the cylindrical shell. The end of the pressure-sensitive bracket with the pressure-sensitive mounting position is elastic.

2. The wireless earphone with pressure-sensitive module according to claim 1, characterized in that: One end of the pressure-sensitive bracket is provided with a microphone cavity, which covers the Bluetooth motherboard. One end of the Bluetooth motherboard is provided with a noise-canceling microphone, and the microphone cavity and the noise-canceling microphone are positioned vertically corresponding. One end of the microphone cavity is provided with a first sound guide hole, and one end of the cylindrical shell is provided with a second sound guide hole that communicates with the first sound guide hole.

3. The wireless earphone with pressure-sensitive module according to claim 2, characterized in that: A voice microphone and an earphone charging head are provided on the other end of the Bluetooth motherboard. A tail plug is installed on the other end of the cylindrical housing. The tail plug has a third sound guide hole and a charging hole. The third sound guide hole corresponds to the voice microphone, and the earphone charging head is inserted into the charging hole.

4. The wireless earphone with pressure-sensitive module according to claim 1, characterized in that: The pressure-sensitive mounting position includes a rectangular mounting groove, and the pressure-sensitive device is attached to the rectangular mounting groove. The middle part of the pressure-sensitive device has an upwardly protruding part, and the upper side of the protruding part is interference-fitted with the upper inner wall of the cylindrical housing part.

5. The wireless earphone with pressure-sensitive module according to claim 1, characterized in that: The conductive circuit is an FPC flexible circuit board.

6. The wireless earphone with pressure-sensitive module according to claim 1, characterized in that: It also includes a front shell for the earphone, which covers the rear shell of the earphone. The front shell and the rear shell of the earphone contain a battery, a speaker, a magnet, and a mesh fabric. An ear tip is installed at the front end of the front shell of the earphone.

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