A porous metal atomizing core and its preparation method

Abstract

This invention discloses a porous metal atomizing core and its preparation method, relating to the field of metal atomizing core production technology. A porous metal atomizing core includes a porous metal plate, a dielectric layer, and a heating layer. The dielectric layer is located between the porous metal plate and the heating layer, and has a thickness of 10-35 μm. The heating layer is sintered onto the surface of the dielectric layer. The dielectric layer is obtained by drying and sintering a dielectric slurry. The dielectric slurry, by weight fraction, consists of the following components: 1-13% alumina, 2-12% silicon dioxide, 0-3% copper oxide, 0-5% molybdenum oxide, 0.5-5% zinc oxide, 15-45% glass powder, 0.5-5.5% sodium silicate, 0-4.5% titanium dioxide, 0.5-8% polyvinyl alcohol, 0.5-5% dispersant, and the balance being pure water. The porous metal atomizing core of the present invention improves the adhesion and insulation between the porous metal plate and the medium layer by optimizing the composition ratio and thickness selection of the medium layer; at the same time, it has the advantages of high strength and toughness, impact resistance, no powder shedding, long service life and reliability.

Description

Technical Field

[0001] This invention relates to the field of metal atomizer core manufacturing technology, and in particular to a porous metal atomizer core and its preparation method. Background Technology

[0002] Existing atomizing coils are generally divided into two main categories: cotton coils and ceramic coils. Ceramic atomizing coils typically consist of a ceramic substrate and a heating circuit. The heating circuit currently includes various forms such as resistance wires, etched meshes, and thick-film printed circuits. These heating circuits are all solid heating elements. During atomization, the heating circuit generates heat, which is transferred to the ceramic substrate. A thermal gradient then forms around the solid heating element, heating the ceramic substrate to vaporize the atomizing liquid, thus forming an atomized aerosol.

[0003] Existing porous ceramic atomizing cores have the atomization interface on the ceramic surrounding the heating coil. The heating circuit generates heat, which is transferred to the surrounding ceramic, which then heats the atomized liquid. This double heat transfer results in significant wasted energy and power loss, leading to low atomization efficiency, weak atomization power, and a poor user experience. Furthermore, due to the inherent structural limitations of ceramic materials, the e-liquid's fidelity is low. Porous ceramics also have low strength, are prone to breakage, and easily shed powder. Additionally, due to the characteristics of ceramic manufacturing processes, blind pores exist within the ceramic. At high temperatures, the atomized liquid in these blind pores cannot vaporize, leading to overheating, cracking, polymerization, and carbonization of the atomized liquid, altering the flavor.

[0004] Therefore, optimizing existing atomizer cores by replacing ceramic atomizer cores with porous metal atomizer cores can overcome the limitations of the ceramic material structure itself, improve the toughness and impact resistance of the atomizer core, prevent powder shedding, and extend the reliability and service life of the atomizer core.

[0005] However, there is limited research on porous metal atomizing cores. Specifically, the research focuses on how to achieve barrier conduction between the heating layer and the porous metal atomizing core, as well as improving the adhesion and insulation of the barrier conduction layer. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a porous metal atomizing core that uses a porous metal plate instead of porous ceramic as the substrate. Simultaneously, it optimizes the composition ratio and thickness selection of the dielectric layer to improve adhesion and insulation with the porous metal plate, ensuring the insulating and conductive effect between the porous metal plate and the heating layer. This also prevents the dielectric layer from blocking the pores of the porous metal plate, thus guaranteeing atomization performance. The porous metal atomizing core of this invention possesses advantages such as high strength and toughness, impact resistance, no powder shedding, long service life, and reliability.

[0007] Meanwhile, the method for preparing the porous metal atomizing core of the present invention involves coating or coating both the dielectric layer and the heating layer before sintering, which makes the connection between the layers tighter and the operation simple and convenient, suitable for large-scale production.

[0008] Specifically, the present invention provides a porous metal atomizing core, comprising a porous metal plate, a dielectric layer, and a heating layer, wherein the dielectric layer is located between the porous metal plate and the heating layer and has a thickness of 10-35 μm; the heating layer is sintered on the surface of the dielectric layer.

[0009] The dielectric layer is obtained by sintering a dielectric slurry after drying. The dielectric slurry, by weight fraction, consists of the following components: 1-13% alumina, 2-12% silicon dioxide, 0-3% copper oxide, 0-5% molybdenum oxide, 0.5-5.0% zinc oxide, 15-45% glass powder, 0.5-5.5% sodium silicate, 0-4.5% titanium dioxide, 0.5-8.0% polyvinyl alcohol, 0.5-5.0% dispersant, and water as the balance. The solid content of the dielectric slurry is 25-65%.

[0010] Preferably, the weight ratio of sodium silicate to glass powder is 1:8-39;

[0011] Preferably, the weight ratio of polyvinyl alcohol to sodium silicate is 1-5:1.

[0012] Preferably, the porous metal plate has a porosity of 55-85% and a pore size of 35-100 μm.

[0013] Preferably, the porous metal plate is made of at least one of iron-based materials, nickel-based materials, and stainless steel.

[0014] Preferably, the material of the heating layer is at least one of gold, silver-palladium, platinum, and nickel-based alloys.

[0015] The present invention also provides a method for preparing the above-mentioned porous metal atomizing core, comprising the following steps:

[0016] S1 pretreatment involves cleaning and drying the porous metal plate.

[0017] S2 coating medium slurry: Immerse the pretreated porous metal plate in the medium slurry, remove and dry it, repeat the above operation until the thickness of the medium slurry coating on the surface of the porous metal plate reaches 10-35μm; or, spray the medium slurry evenly on the surface of the porous metal plate until the thickness of the medium slurry on the surface of the porous metal plate reaches 10-35μm.

[0018] S3 prepares the dielectric layer by drying and pre-sintering the porous metal plate coated with dielectric slurry;

[0019] The heating layer is prepared by S4, and the heating layer is printed on the surface of the dielectric layer. After sintering, a porous metal atomizing core is obtained.

[0020] Preferably, in step S1, the drying conditions are: drying temperature 60-120℃, drying time 3-12h.

[0021] Preferably, in step S3, the pre-sintering time is 30-80 min.

[0022] Preferably, in step S4, sintering is performed in a vacuum, air, or protective gas atmosphere, and the sintering time is 30-100 min.

[0023] Beneficial effects:

[0024] (1) The porous metal atomizing core of the present invention uses a porous metal plate as a substrate, and a medium layer and a heating layer are coated on it; wherein, the porous metal plate replaces the porous ceramic, which can avoid the limitations of the ceramic material itself, and the porous metal plate has higher strength, better toughness, and stronger impact resistance, which can improve the reliability of the atomizing core and extend the service life of the atomizing core; the medium layer is located between the porous metal plate and the heating layer, which plays the role of blocking the conduction between the heating layer and the porous metal plate, while the medium layer does not block the pores of the porous metal plate, and the porous metal plate can conduct heat with the heating layer through the pores, thereby improving the atomization efficiency.

[0025] (2) The porous metal atomizing core of the present invention, by limiting the porous metal plate material, specifically limiting it to have a suitable porosity and pore size, facilitates heat conduction, improves atomization efficiency, and controls atomization rate; by optimizing the composition and thickness of the medium slurry of the medium layer, the adhesion and insulation of the medium layer are improved, which can better block the current conduction between the porous metal plate and the heating layer and extend the service life of the atomizing core; and the heating layer material is selected as a metal material with low resistivity and good conductivity, which is more conducive to conductive heating.

[0026] (3) The method for preparing the porous metal atomizing core of the present invention involves coating or coating both the dielectric layer and the heating layer before sintering, which makes the connection between the layers tighter and the operation simple and convenient, and is suitable for large-scale production. Attached Figure Description

[0027] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the porous metal atomizing core of the present invention;

[0029] Figure 2 This is a top view of one embodiment of the porous metal atomizing core of the present invention;

[0030] Figure 3 This is a top view of one embodiment of the porous metal atomizing core of the present invention;

[0031] Figure 4 Microscopic image of the porous metal matrix prepared in Example 1 of this application;

[0032] Figure 5 Microscopic image of the porous metal matrix prepared in Comparative Example 5.

[0033] Explanation of reference numerals in the attached diagram: 1-Porous metal plate; 2-Dielectric layer; 3-Heating layer. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0035] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0036] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0037] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0038] It should also be further understood that the term "concentration" as used in this specification and the appended claims refers to mass concentration, and "%" refers to mass percentage content, unless otherwise explained.

[0039] A porous metal atomizing core,

[0040] like Figure 1It includes a porous metal plate 1, a dielectric layer 2 and a heating layer 3; the dielectric layer 2 is located between the porous metal plate 1 and the heating layer 3, and the dielectric layer 2 covers the porous metal plate 1 without affecting the permeability of the pores of the porous metal plate 1, that is, the dielectric layer 2 does not block the pores of the porous metal plate 1.

[0041] The porous metal plate 1 has a porosity of 55-85% and a pore size of 35-100 μm. The material of the porous metal plate 1 is preferably at least one of iron-based materials, nickel-based materials, and stainless steel. Specifically, the porous metal plate 1 serves as the atomizing core substrate, possessing advantages such as high strength, good toughness, strong impact resistance, and no powder shedding problem. The material of the porous metal plate can be prepared using methods such as melt foaming, infiltration casting, gas blowing, solid-gas eutectic reaction, investment casting, powder sintering, or slurry foaming to ensure that the prepared material meets the requirements of a porosity of 55-85% and a pore size of 35-100 μm.

[0042] The dielectric layer 2 is obtained by sintering after drying the dielectric slurry, and has a thickness of 10-35 μm. The dielectric slurry, by weight fraction, consists of the following components: 1-13% alumina, 2-12% silica, 0-3% copper oxide, 0-5% molybdenum oxide, 0.5-5.0% zinc oxide, 15-45% glass powder, 0.5-5.5% sodium silicate, 0-4.5% titanium dioxide, 0.5-8.0% polyvinyl alcohol, 0.5-5.0% dispersant, and water as the balance; the solid content of the dielectric slurry is preferably 25-65%. The weight ratio of sodium silicate to glass powder is preferably 1:8-39; the weight ratio of polyvinyl alcohol to sodium silicate is preferably 1-5:1; the dispersant can be at least one selected from stearic acid, PVP (polyvinylpyrrolidone), and polyacrylic acid; and the water is preferably pure water.

[0043] The medium slurry is prepared by ball milling and can be uniformly coated on the surface skeleton of the porous metal plate 1 by methods such as impregnation, coating, spraying or printing, with a thickness of 10-35 μm. After drying, it is sintered and cured at high temperature in a vacuum, air or protective atmosphere. The protective gas is preferably a clean gas such as nitrogen, hydrogen or argon.

[0044] The function of the dielectric layer 2 is to block the current conduction between the heating layer 3 and the porous metal plate 1.

[0045] The heating layer 3 is disposed on the dielectric layer 2, and is preferably at least one of the following materials: gold, silver, palladium, platinum, nickel-based alloy, etc. It is disposed on the dielectric layer 2 by printing or spraying, and its specific shape is not limited; it can be a regular shape, such as a square, rectangle, or circle, or an irregular shape. Specifically, in some embodiments, the shape of the heating layer 3 is as follows: Figure 2 As shown, in other embodiments, the pattern of the heating layer 3 is as follows: Figure 3As shown. The heating layer 3 can be manufactured by high-temperature sintering in a vacuum, air, or protective gas atmosphere. The protective gas is preferably a clean gas such as nitrogen, hydrogen, or argon.

[0046] A porous metal atomizing core atomization process, specifically, the heating layer 3 heats up after being energized, and then conducts heat to the interior of the porous metal plate 1 through the pores of the dielectric layer 2 and the porous metal plate 1, so that the atomizing material covered or placed inside the porous metal plate 1 is atomized.

[0047] A method for preparing a porous metal atomizing core,

[0048] Includes the following steps:

[0049] S1 pretreatment involves cleaning and drying the porous metal plate.

[0050] S2 coating medium slurry: Immerse the pretreated porous metal plate in the medium slurry, remove and dry it, repeat the above operation until the thickness of the medium slurry coating on the surface of the porous metal plate reaches 10-35μm; or, spray the medium slurry evenly on the surface of the porous metal plate until the thickness of the medium slurry on the surface of the porous metal plate reaches 10-35μm.

[0051] S3 prepares the dielectric layer by drying and pre-sintering the porous metal plate coated with dielectric slurry;

[0052] The heating layer is prepared by S4, and the heating layer is printed on the surface of the dielectric layer. After sintering, a porous metal atomizing core is obtained.

[0053] Specifically,

[0054] (1) The porous metal plate is subjected to low-concentration acid washing and alkali washing, ultrasonic cleaning with clean water, and drying at 60-120℃ for 3-12 hours. Specifically, acid washing can be performed using low-concentration acids such as dilute hydrochloric acid, dilute sulfuric acid, and dilute nitric acid, and alkali washing can be performed using sodium carbonate, potassium carbonate, low-concentration sodium hydroxide, and low-concentration potassium hydroxide.

[0055] (2) Immerse one side of the porous metal plate obtained in (1) in the medium slurry for 3-15s, take it out and air dry or bake it, repeat the above operation 1-5 times, so that the outer surface of the skeleton of the porous metal plate is covered with the medium slurry with a thickness of 10-35um; or spray the medium slurry evenly on the surface of the porous metal plate with a thickness of 10-35um.

[0056] (3) Place the porous metal plate obtained in (2) into a drying oven and dry for 30-60 minutes;

[0057] (4) The porous metal plate obtained in (3) is pre-sintered for 30-80 min;

[0058] (5) The porous metal plate obtained in (4) is printed with a heating layer on the surface of the dielectric layer by printing method;

[0059] (6) The porous metal plate obtained in (5) is sintered in a vacuum, air or protective atmosphere for 30-100 min to obtain a porous metal atomizing core.

[0060] Example 1

[0061] A porous metal plate with an open hole is used as the atomizing core substrate. The porous metal plate has a porosity of 70-75% and a pore size of 85-95 μm. The material used is stainless steel.

[0062] A dielectric layer on the surface of a porous metal plate was prepared by an impregnation method. The composition and weight percentage of the dielectric slurry were as follows: alumina 5.5%, silica 6%, copper oxide 0.6%, zinc oxide 2.5%, glass powder 19.4%, sodium silicate 0.5%, titanium dioxide 3.5%, PVA (polyvinyl alcohol) 2.5%, dispersant 0.8%, and the balance being pure water. Stearic acid was selected as the dispersant.

[0063] The media slurry has a solid content of approximately 38%. It is ball-milled for 24-48 hours to prepare a uniformly dispersed slurry with a fineness of less than 5 μm. A 20-30 μm thick layer of the media slurry adheres to the metal skeleton on the surface of the porous metal plate. After drying, it is sintered at 1000-1200℃ for 30 minutes, pre-sintering and solidifying the media slurry onto the surface of the porous metal plate while retaining open pores.

[0064] Then, nickel-based resistive paste is printed on the surface of the dielectric layer of the pre-sintered dielectric layer of the porous metal plate by screen printing to form the heating circuit. After drying, it is sintered at high temperature of 950-1100℃ in vacuum or protective atmosphere for 30-60 minutes to sinter the heating layer circuit and make it tightly adhere to the surface of the dielectric layer, thus completing the preparation of the porous metal atomizing core.

[0065] Example 2

[0066] A porous metal plate with an open hole is used as the atomizing core substrate. The porous metal plate has a porosity of 60-65% and a pore size of 55-65 μm. The material used is nickel-based.

[0067] A dielectric layer on the surface of a porous metal plate was prepared by spraying. The composition and weight percentage of the dielectric slurry were as follows: 1.2% alumina, 2.6% silica, 2.2% copper oxide, 2.5% molybdenum oxide, 0.5% zinc oxide, 35% glass powder, 1% sodium silicate, 4.5% PVA, 1.2% dispersant, and the balance being pure water. The dispersant was selected as PVP (polyvinylpyrrolidone).

[0068] The media slurry has a solid content of approximately 45%. It is ball-milled for 24-48 hours to prepare a uniformly dispersed media slurry with a fineness of less than 3 μm. A 12-18 μm thick media slurry is sprayed onto the surface of a porous metal plate to form a metal skeleton. After drying, it is sintered at 800-1000℃ for 30 minutes, pre-sintering and solidifying the media slurry onto the porous metal plate surface while retaining open pores.

[0069] Then, silver-palladium resistive paste is printed on the surface of the dielectric layer of the pre-sintered dielectric layer of the porous metal plate by screen printing to form the heating circuit. After drying, it is sintered at 700-900℃ for 30-60 minutes to sinter the heating layer circuit and make it tightly adhere to the surface of the dielectric layer, thus completing the preparation of the porous metal atomizing core.

[0070] Example 3

[0071] A porous metal plate with an open hole is used as the atomizing core substrate. The porous metal plate has a porosity of 55-65% and a pore size of 85-100 μm. The material used is iron-based.

[0072] A dielectric layer on the surface of a porous metal plate was prepared by spraying. The dielectric slurry consisted of the following components by weight percentage: 13.0% alumina, 2.0% silica, 3.0% copper oxide, 5.0% molybdenum oxide, 5.0% zinc oxide, 15% glass powder, 5.5% sodium silicate, 1% titanium dioxide, 0.5% PVA, 0.5% dispersant, and the balance being pure water. The dispersant was polyacrylic acid.

[0073] The media slurry has a solid content of approximately 49.5%. It is ball-milled for 24-48 hours to prepare a uniformly dispersed media slurry with a fineness of less than 3 μm. A 12-18 μm thick media slurry is sprayed onto the surface of a porous metal plate to form a metal skeleton. After drying, it is sintered at 900-1200℃ for 30 minutes, pre-sintering and solidifying the media slurry onto the porous metal plate surface while retaining open pores.

[0074] Platinum resistance paste is then printed onto the surface of the dielectric layer of the pre-sintered dielectric layer porous metal plate by screen printing to form the heating circuit. After drying, the heating layer circuit is sintered at 800-1000℃ for 30-60 minutes to sinter the heating layer circuit and adhere it tightly to the surface of the dielectric layer, thus completing the preparation of the porous metal atomizing core.

[0075] Example 4

[0076] A porous metal plate with an open hole is used as the atomizing core substrate. The porous metal plate has a porosity of 75-85% and a pore size of 35-45 μm. The material used is stainless steel.

[0077] A dielectric layer on the surface of a porous metal plate was prepared by spraying. The composition and weight percentage of the dielectric slurry were as follows: 1.0% alumina, 12.0% silica, 0.5% molybdenum oxide, 0.5% zinc oxide, 35% glass powder, 1.5% sodium silicate, 4.5% titanium dioxide, 8% PVA, and 5% dispersant, with the balance being pure water. The dispersant was a mixture of stearic acid (0.2% by weight) and polyacrylic acid (0.3% by weight).

[0078] The media slurry has a solid content of approximately 55%. It is ball-milled for 24-48 hours to prepare a uniformly dispersed media slurry with a fineness of less than 3 μm. A 12-18 μm thick media slurry is sprayed onto the surface of a porous metal plate to form a metal skeleton. After drying, it is sintered at 800-1000℃ for 30 minutes, pre-sintering and solidifying the media slurry onto the porous metal plate surface while retaining open pores.

[0079] Then, gold resistive paste is printed on the surface of the dielectric layer of the pre-sintered dielectric layer porous metal plate by screen printing to form the heating circuit. After drying, it is sintered at 700-900℃ for 30-60 minutes to sinter the heating layer circuit and make it tightly adhere to the surface of the dielectric layer, thus completing the preparation of the porous metal atomizing core.

[0080] Meanwhile, a comparative example was set up based on Example 1. The differences between the comparative example and Example 1 are shown in Table 1.

[0081] Table 1 shows the differences between the comparative example and Example 1.

[0082]

[0083] The ceramic matrices obtained in Examples 1-4 and Comparative Examples 1-8 were tested, and the results are shown in Table 2 below.

[0084] Dielectric layer adhesion: The adhesion of the dielectric layer is judged by scratching with a hard object and observing the adhesion through a CCD magnifying glass (grades are: excellent, good, relatively good, poor, and very poor).

[0085] Dielectric layer insulation: The sheet resistance of the dielectric layer is tested using a sheet resistance meter—the four-point probe method—to determine the insulation. If the sheet resistance is less than 1MΩ, it is considered to have poor insulation and conduction; if the sheet resistance is greater than 1MΩ or ∞, it is considered to have good insulation and non-conductivity. Atomizer core lifespan: Tested using a smoking machine with the same cartridge structure, the test conditions are 3 seconds of inhalation and 8 seconds of rest, with each puff being 45ml or 55ml, until failure, and the number of test cycles is compared.

[0086] Atomization efficiency: Characterized by the amount of mist produced per puff during the test.

[0087] Table 2 Performance results of Examples 1-4 and Comparative Examples 1-8

[0088]

[0089] As shown in Table 3, the atomizer cores prepared in Examples 1-4 have a service life of more than 750 puffs and a vapor production of more than 6.59 mg. However, the dielectric layer of Comparative Examples 1, 3, 5, and 6 has poor adhesion and insufficient insulation, failing to meet the requirements for atomizer core preparation. The atomizer cores of Comparative Examples 2, 4, 7, and 8 have significantly shorter service lives or lower vapor production, failing to meet the requirements for atomizer core use.

[0090] Among them, the microstructure of the porous metal matrix prepared in Example 1 of this application is shown in the figure below. Figure 4 Microscopic images of the porous metal matrix prepared in Comparative Example 5, as shown below. Figure 5 . Figure 4 and Figure 5 The structure at point A corresponds to the structure at point B; therefore, according to Figure 4-5 A comparison of the structures at points A and B shows that the porous metal matrix prepared in Comparative Example 5 has low porosity and poor adhesion.

[0091] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0092] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A porous metal atomizing core, characterized in that, It includes a porous metal plate, a dielectric layer, and a heating layer. The dielectric layer is located between the porous metal plate and the heating layer and has a thickness of 10-35 μm. The heating layer is sintered on the surface of the dielectric layer. The dielectric layer is obtained by sintering a dielectric slurry after drying. The dielectric slurry, by weight fraction, consists of the following components: 1-13% alumina, 2-12% silicon dioxide, 0-3% copper oxide, 0-5% molybdenum oxide, 0.5-5.0% zinc oxide, 15-45% glass powder, 0.5-5.5% sodium silicate, 0-4.5% titanium dioxide, 0.5-8.0% polyvinyl alcohol, 0.5-5.0% dispersant, and water as the balance; the solid content of the dielectric slurry is 25-65%. The weight ratio of sodium silicate to glass powder is 1:8-39; The weight ratio of polyvinyl alcohol to sodium silicate is 1-4:

1.

2. The porous metal atomizing core as described in claim 1, characterized in that, The porous metal plate has a porosity of 55-85% and a pore size of 35-100 μm.

3. The porous metal atomizing core as described in claim 1, characterized in that, The porous metal plate is made of at least one of iron-based materials, nickel-based materials, and stainless steel.

4. The porous metal atomizing core as described in claim 1, characterized in that, The material of the heating layer is at least one of gold, silver, palladium, platinum, and nickel-based alloys.

5. The method for preparing a porous metal atomizing core according to any one of claims 1-4, characterized in that, Includes the following steps: S1 pretreatment involves cleaning and drying the porous metal plate. S2 coating medium slurry: Immerse the pretreated porous metal plate in the medium slurry, remove and dry it, repeat the above operation until the thickness of the medium slurry coating on the surface of the porous metal plate reaches 10-35μm; or, spray the medium slurry evenly on the surface of the porous metal plate until the thickness of the medium slurry on the surface of the porous metal plate reaches 10-35μm. S3 prepares the dielectric layer by drying and pre-sintering the porous metal plate coated with dielectric slurry; The heating layer is prepared by S4, and the heating layer is printed on the surface of the dielectric layer. After sintering, a porous metal atomizing core is obtained.

6. The method for preparing the porous metal atomizing core as described in claim 5, characterized in that, In step S1, the drying conditions are: drying temperature 60-120℃, drying time 3-12h.

7. The method for preparing the porous metal atomizing core as described in claim 5, characterized in that, In step S3, the pre-sintering time is 30-80 minutes.

8. The method for preparing the porous metal atomizing core as described in claim 5, characterized in that, In step S4, sintering is performed in a vacuum, air, or protective gas atmosphere, and the sintering time is 30-100 min.

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