Control Method for Laser Cutting and Related Equipment

Abstract

The embodiment of the present application belongs to the field of laser cutting technology, and relates to a control method for laser cutting, including obtaining the contour to be cut of a laser-cut plate; obtaining first process layer information corresponding to the contour to be cut; determining the cutting process of the contour to be cut according to the first process layer information; and controlling the laser to cut the plate according to the cutting process. The present application also provides a control device, computer equipment, and storage medium for laser cutting. In the embodiment of the present application, during the laser cutting process, the cutting process can be determined according to the specific conditions of the plate. Specifically, during the cutting process, the cutting process can be determined for each contour to be cut, and the local spray film processing of the plate can be automatically realized, while improving the efficiency of laser cutting.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a control method and related equipment for laser cutting. Background Art

[0002] With the widespread application of laser cutting technology, the types of plates that can be cut by laser are becoming more and more diverse, such as plates with surface corrosion, rust, or corrosion that requires spray coating treatment first.

[0003] For sheet metal in this application, film spraying is a very effective method. Film spraying involves irradiating the metal's surface with a high-energy laser beam, converting the heat into rapid vaporization, thereby exposing the metal's underlying layers. This method effectively performs two processing steps on the sheet metal: first, film spraying the entire sheet, and then laser cutting.

[0004] In actual situations, most plates only have a thick metal corrosion layer in local areas or at the edges of the plates. In this case, spraying the entire plate is redundant and greatly reduces processing efficiency. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a laser cutting control method and related equipment to improve the efficiency of laser cutting of plates.

[0006] In order to solve the above technical problems, an embodiment of the present application provides a control method for laser cutting, comprising:

[0007] Obtain the contour of the laser cutting plate to be cut;

[0008] Acquire first process layer information corresponding to the contour to be cut;

[0009] Determining a cutting process for the contour to be cut according to the first process layer information;

[0010] The laser is controlled to cut the plate according to the cutting process.

[0011] In one embodiment, determining the cutting process of the to-be-cut contour according to the first process layer information includes:

[0012] Obtaining a cutting request, wherein the cutting request includes whether to perform intelligent cutting;

[0013] In a case where the cutting request is to perform intelligent cutting, the cutting process of the to-be-cut contour is determined according to the first process layer information.

[0014] In one embodiment, determining the cutting process of the to-be-cut contour according to the first process layer information includes:

[0015] Obtaining global second process layer information of the plate;

[0016] Determining, based on the second process layer information, whether a process for cutting the plate is spraying film first and then cutting, conventional cutting, or intelligent cutting;

[0017] When it is determined that the process for cutting the plate is intelligent cutting, the cutting process for the contour to be cut is determined according to the first process layer information.

[0018] In one embodiment, the second process layer information includes a proportion of contours that require spraying before cutting; and determining, based on the second process layer information, whether the process for cutting the plate is spraying before cutting, conventional cutting, or intelligent cutting includes:

[0019] Comparing the contour ratio with a first preset threshold and a second preset threshold;

[0020] When the contour ratio is greater than or equal to a first preset threshold, determining that the process for cutting the plate is to spray film first and then cut;

[0021] When the contour ratio is less than a first preset threshold and greater than a second preset threshold, determining that the process of cutting the plate is intelligent cutting;

[0022] When the contour ratio is less than or equal to a second preset threshold, it is determined that the process of cutting the plate is conventional cutting.

[0023] In one embodiment, determining the cutting process of the to-be-cut contour according to the first process layer information includes:

[0024] The first process layer information includes whether the contour to be cut needs spraying;

[0025] In the case that the contour to be cut requires spraying, the cutting process of the contour to be cut is determined to be spraying first and then cutting.

[0026] In one embodiment, controlling the laser to cut the plate according to the cutting process includes:

[0027] In the case where the cutting of the plate is interrupted, obtaining the cutting state before the interruption occurs; the cutting state includes spraying or cutting;

[0028] According to the cutting state, the cutting process after restarting the cutting is determined; wherein,

[0029] In the case where the cutting state is film spraying, after it is determined to restart cutting, film spraying is completed from the breakpoint before cutting.

[0030] In order to solve the above technical problems, the embodiment of the present application further provides a laser cutting control device for controlling laser cutting of a plate, comprising:

[0031] A contour acquisition module is used to obtain the contour of the laser-cut plate to be cut;

[0032] A first process layer information acquisition module, configured to acquire first process layer information corresponding to the contour to be cut;

[0033] a process determination module, configured to determine a cutting process for the contour to be cut according to the first process layer information;

[0034] The laser cutting module is used to control the laser to cut the plate according to the cutting process.

[0035] In order to solve the above technical problems, an embodiment of the present application also provides a laser cutting machine, including a laser cutting control device of any implementation of the above embodiments, and the laser cutting control device adopts the laser cutting control method of any implementation of the above embodiments.

[0036] In order to solve the above technical problems, an embodiment of the present application also provides a computer device, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the steps of the laser cutting control method of any implementation method of the above embodiment are implemented.

[0037] In order to solve the above technical problems, an embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the laser cutting control method of any implementation method of the above embodiments are implemented.

[0038] Compared with the prior art, the embodiments of the present application have at least the following beneficial effects:

[0039] In the embodiment of the present application, during the laser cutting process, the cutting process can be determined according to the specific conditions of the plate. Specifically, during the cutting process, the cutting process can be determined for each contour to be cut, and the local spraying process of the plate can be automatically realized, while improving the efficiency of laser cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the solutions in this application, a brief introduction will be given below to the drawings required for use in the description of the embodiments of this application. Obviously, the drawings described below are some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1A flow chart of an embodiment of a method for controlling laser cutting according to the present application;

[0042] Figure 2 is a schematic structural diagram of an embodiment of a control device for laser cutting according to the present application;

[0043] Figure 3 It is a structural diagram of an embodiment of a computer device according to the present application. DETAILED DESCRIPTION

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0045] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0046] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0047] Figure 1 A flow chart of a laser cutting control method according to an embodiment of the present application is shown.

[0048] like Figure 1 As shown, a laser cutting control method according to an embodiment of the present application includes:

[0049] S210: Obtaining the contour of the plate to be cut by laser cutting.

[0050] Among them, obtaining the contour of the sheet to be cut by laser cutting can be a method commonly used by those skilled in the art for obtaining the contour of the sheet to be cut by a laser cutting machine. For example, the contour to be cut for each cut can be determined by reading graphic information uploaded by the user to the laser cutting machine. Specifically, for example, if the graphic information to be cut includes multiple letters, each letter can be distinguished as a cutting contour, and the contour to be cut can be determined according to the order of the letters. For example, if the letters to be cut are "ABCDE", when "A" is cut or after "A" is cut, the contour to be cut is "B". Alternatively, the contour to be cut can be determined by reading code information uploaded by the user to the laser cutting machine.

[0051] In the embodiments of the present application, the contour to be cut by the laser can be a complete contour to be cut, or it can be one of the contours to be cut after a complete cutting contour is divided into multiple contours according to a preset rule. The complete cutting contour can be divided into multiple contours according to a preset rule, which can be divided according to a preset contour size or divided into equal areas according to a preset number of divisions.

[0052] In one example, a complete cutting contour of a cutting task is divided into multiple contours according to preset rules. When obtaining the contour to be cut by the laser, the first cutting contour can be obtained as the contour to be cut. Before the first cutting contour is cut, the second cutting contour can be obtained as the contour to be cut.

[0053] In one example, after obtaining the first cutting contour as the cutting contour to be cut, the second cutting contour, the third cutting contour, and finally the last cutting contour can be obtained at any time. In a specific practical application, the time nodes for obtaining subsequent cutting contours can be set according to the logical requirements of the time length.

[0054] S220: Acquire first process layer information corresponding to the contour to be cut.

[0055] In the embodiment of the present application, the process layer may refer to the upper surface and / or side surface of the plate; based on the conditions of the upper surface and / or side surface of the plate, it is determined whether it is necessary to spray the film first and then cut when cutting the corresponding position of the plate.

[0056] In the embodiment of the present application, when the laser cuts according to the contour to be cut, the starting point of the cutting is first located; the laser cutting control device stores the contour position of the starting point in the cache. Corresponding to the starting point, the process layer of the contour to be cut can be obtained.

[0057] In an embodiment of the present application, the first process layer information corresponding to the contour to be cut can be obtained by image acquisition; various technical solutions that are known to ordinary technicians in this field now and in the future for obtaining the first process layer information corresponding to the contour to be cut can also be adopted, and the embodiment of the present application is not limited to this.

[0058] S230: Determine a cutting process for the contour to be cut according to the first process layer information.

[0059] For example, when the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is rusty or corroded and needs to be sprayed first, it is determined that spraying is required before cutting when cutting the contour to be cut.

[0060] S240, controlling the laser to cut the plate according to the cutting process.

[0061] In the embodiment of the present application, when the cutting process requires spraying before cutting, specifically, the spraying process parameters are first called, and the laser is controlled to spray according to the spraying process parameters. After the spraying is completed, the laser cutting process parameters are called, and the laser is controlled to cut according to the cutting process parameters.

[0062] The spraying process parameters can be fixed preset parameters or fine-tuned based on the first process layer information. For example, if the first process layer information indicates that the surface of the sheet corresponding to the contour to be cut is severely rusted, the spraying process parameters can be adjusted.

[0063] In one example, the first process layer information may also include the thickness of the sheet corresponding to the contour to be cut, and whether spraying is required before cutting is determined based on the sheet thickness. For example, if the sheet thickness corresponding to the contour to be cut exceeds a preset threshold, the laser may be controlled to spray the sheet before cutting, thereby ensuring that the sheet thickness after laser cutting meets the requirements.

[0064] In the embodiment of the present application, during the laser cutting process, the cutting process can be determined according to the specific conditions of the plate. Specifically, during the cutting process, the cutting process can be determined for each contour to be cut, and the local spraying process of the plate can be automatically realized, while improving the efficiency of laser cutting.

[0065] In one embodiment, step S230 includes:

[0066] A cutting request is obtained, where the cutting request includes whether to perform smart cutting.

[0067] When a user needs to use a laser cutting machine to cut a plate, he or she sends a cutting request to request the laser cutting machine to cut the plate.

[0068] In an exemplary application scenario, the user can determine based on subjective experience whether the plate to be cut requires local film spraying. If local film spraying is required, the user can determine to use the intelligent cutting method to cut the plate when a cutting request occurs.

[0069] In a case where the cutting request is to perform intelligent cutting, the cutting process of the contour to be cut is determined according to the first process layer information.

[0070] If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is rusted or corroded and requires prior film spraying, it is determined that the contour to be cut needs to be sprayed before cutting. If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is not rusted or has minimal rust, it is determined that the contour to be cut does not require film spraying and the plate is directly cut according to the contour to be cut.

[0071] In a case where the cutting request is not to perform intelligent cutting, it is determined that the cutting process of the contour to be cut is a conventional cutting process.

[0072] The conventional cutting process may refer to controlling the laser to cut the plate according to the contour to be cut without performing the film spraying operation. It may also refer to first spraying the entire plate and then cutting the entire plate according to the contour to be cut.

[0073] In an exemplary application scenario, the user can determine based on subjective experience whether the plate to be cut requires global or local film spraying. If neither global or local film spraying is required, the user can determine that intelligent cutting is not required when a cutting request is made.

[0074] In this embodiment of the present application, the user can select whether to perform intelligent cutting based on their actual needs. If the user determines that spray coating is not necessary based on the surface condition of the plate or the processing requirements, a direct cutting process can be selected. Determining whether intelligent cutting is required based on the user's cutting request can reduce the data processing process of the laser cutting machine and further improve the efficiency of laser cutting.

[0075] In one embodiment, step S230 includes:

[0076] Obtain global second process layer information of the plate.

[0077] In the embodiments of the present application, the global second process layer information of the plate refers to the process layer information of the entire plate. This second process layer information allows for a comprehensive assessment of the plate's condition. This allows for situations where the entire surface of the plate is rusty or corroded and requires spraying, allowing the entire plate to be sprayed first and then cut according to the desired contour. This reduces the data processing required by the laser cutting machine and improves laser cutting efficiency.

[0078] According to the second process layer information, it is determined that the process for cutting the plate is spraying first and then cutting, conventional cutting, or intelligent cutting.

[0079] In one example, if the entire surface of a plate is rusted or corroded and requires spraying, the entire plate is sprayed first, and then the entire plate is cut according to the desired contour. If only a portion of the plate is rusted, smart cutting is performed. If the entire surface of the plate is relatively rust-free, cutting is performed directly according to the desired contour.

[0080] When it is determined that the process for cutting the plate is intelligent cutting, the cutting process for the contour to be cut is determined according to the first process layer information.

[0081] If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is rusted or corroded and requires prior film spraying, it is determined that the contour to be cut needs to be sprayed before cutting. If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is not rusted or has minimal rust, it is determined that the contour to be cut does not require film spraying and the plate is directly cut according to the contour to be cut.

[0082] In this embodiment of the present application, the second process layer information can be used to determine whether to perform intelligent cutting. If the second process layer information determines that film spraying is not required, a direct cutting process can be selected. By determining whether to perform intelligent cutting based on the second process layer information, user information input can be reduced, and the cutting process of the entire plate can be intelligently determined, making the laser cutting machine more intelligent and improving the user experience of the laser cutting machine.

[0083] In one embodiment, the second process layer information includes a proportion of contours that require spraying before cutting;

[0084] The determining, based on the second process layer information, whether the process for cutting the plate is spraying before cutting, conventional cutting, or intelligent cutting includes:

[0085] Comparing the contour ratio with a first preset threshold and a second preset threshold;

[0086] When the contour ratio is greater than or equal to a first preset threshold, determining that the process for cutting the plate is to spray film first and then cut;

[0087] When the contour ratio is less than a first preset threshold and greater than a second preset threshold, determining that the process of cutting the plate is intelligent cutting;

[0088] When the contour ratio is less than or equal to the second preset threshold, it is determined that the process of cutting the plate is conventional cutting.

[0089] This embodiment of the present application uses a preset threshold to determine whether the cutting process for the plate is spray-coating first, then cutting, conventional cutting, or intelligent cutting. For example, if the first preset threshold is 75% and the second process layer information shows that the proportion of contours requiring spray-coating first, then cutting exceeds 75% of the total plate contour, the plate cutting process is determined to be spray-coating the entire plate first, then cutting the entire plate according to the contour to be cut.

[0090] For another example, the first preset threshold is 75%; the second preset threshold is 7%; in the second process layer information, the proportion of contours that need to be sprayed before cutting accounts for 20% of the entire plate contour, then the cutting process of the plate is judged to be intelligent cutting. By obtaining the first process layer information of the contour to be cut during the cutting process, the cutting process of the contour to be cut is judged respectively, and each contour to be cut is cut one by one according to the cutting process of each contour to be cut.

[0091] For another example, the first preset threshold is 75%; the second preset threshold is 7%; in the second process layer information, the proportion of contours that need to be sprayed before cutting accounts for 4% of the entire plate contour, then the cutting process of the plate is judged to be conventional cutting, that is, the plate does not need to be sprayed, and can be cut directly according to the cutting contour.

[0092] In the embodiment of the present application, by comparing the contour ratio parameter with the first preset threshold and the second preset threshold, the cutting process of the plate can be intelligently determined, thereby improving the intelligence level of the laser cutting machine.

[0093] In one embodiment, step S230 includes:

[0094] The first process layer information includes whether the contour to be cut requires spraying.

[0095] In the case that the contour to be cut requires spraying, the cutting process of the contour to be cut is determined to be spraying first and then cutting.

[0096] The first process layer information can be obtained by acquiring a surface image of the contour to be cut through image acquisition, and then obtaining information about the process layer corresponding to the contour to be cut through image processing methods. If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut has rust or corrosion, and if the rust or corrosion requires prior film spraying, it is determined that the contour to be cut requires prior film spraying.

[0097] In one embodiment, step S240 includes:

[0098] In the case where the cutting of the plate is interrupted, obtaining the cutting state before the interruption occurs; the cutting state includes spraying or cutting;

[0099] According to the cutting state, the cutting process after restarting the cutting is determined; wherein,

[0100] In the case where the cutting state is film spraying, after it is determined to restart cutting, film spraying is completed from the breakpoint before cutting.

[0101] The embodiment of the present application obtains the cutting state before the interruption, and can continue the cutting state before the interruption from the breakpoint after restarting the cutting, thereby realizing breakpoint recovery, avoiding repeated film spraying or repeated cutting, and further improving the efficiency of laser cutting.

[0102] In one example, when the cutting state before the interruption is cutting, after it is determined to restart the cutting, the cutting is continued from the breakpoint to avoid repeated film spraying.

[0103] In one example, it is possible to set the moment when an unexpected alarm or an unexpected interruption occurs, and store the current working status of the laser cutting machine in a cache so that the data before the interruption can be obtained after the laser cutting machine is restarted.

[0104] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When executed, the program can include the processes in the above-described method embodiments. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0105] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0106] Further references Figure 2 , as a response to the above Figure 1 In order to realize the method shown in the figure, the present application provides an embodiment of a control device for laser cutting. Figure 1 Corresponding to the method embodiment shown, the device can be specifically applied to various electronic devices.

[0107] like Figure 2 As shown, the laser cutting control device 200 described in this embodiment includes: a contour acquisition module 201, a process determination module 202 and a laser cutting module 203.

[0108] The contour acquisition module 201 is used to obtain the contour of the plate to be cut by laser cutting;

[0109] A first process layer information acquisition module 202 is used to acquire first process layer information corresponding to the contour to be cut;

[0110] A process determination module 203 is configured to determine a cutting process for the contour to be cut according to the first process layer information;

[0111] The laser cutting module 204 is used to control the laser to cut the plate according to the cutting process.

[0112] In one embodiment, the process determination module 203 includes:

[0113] A cutting request acquisition submodule is used to acquire a cutting request, wherein the cutting request includes whether to perform intelligent cutting;

[0114] The first cutting process determination submodule is configured to determine the cutting process of the to-be-cut contour according to the first process layer information when the cutting request is to perform intelligent cutting.

[0115] In one embodiment, the process determination module 203 includes:

[0116] A second process layer information acquisition submodule, used to acquire the global second process layer information of the plate;

[0117] a plate cutting process determination submodule, configured to determine, based on the second process layer information, whether the process for cutting the plate is spraying film first and then cutting or intelligent cutting;

[0118] The second cutting process determination submodule determines the cutting process of the contour to be cut according to the first process layer information when it is determined that the process for cutting the plate is intelligent cutting.

[0119] In one embodiment, the second process layer information includes the proportion of contours that require spraying before cutting; the plate cutting process determination submodule is used to:

[0120] Comparing the contour ratio with a first preset threshold and a second preset threshold;

[0121] When the contour ratio is greater than or equal to a first preset threshold, determining that the process for cutting the plate is to spray film first and then cut;

[0122] When the contour ratio is less than a first preset threshold and greater than a second preset threshold, determining that the process of cutting the plate is intelligent cutting;

[0123] When the contour ratio is less than or equal to a second preset threshold, it is determined that the process of cutting the plate is conventional cutting.

[0124] In one embodiment, the first process layer information includes whether the contour to be cut requires film spraying; the process determination module 202 is used to determine that the cutting process of the contour to be cut is first film spraying and then cutting if the contour to be cut requires film spraying.

[0125] In one embodiment, the laser cutting module 203 includes:

[0126] A cutting status acquisition submodule is used to acquire the cutting status before the interruption occurs when the cutting of the plate is interrupted; the cutting status includes film spraying or cutting;

[0127] The post-restart cutting process determination submodule is used to determine the cutting process after restarting the cutting according to the cutting state; wherein,

[0128] In the case where the cutting state is film spraying, after it is determined to restart cutting, film spraying is completed from the breakpoint before cutting.

[0129] In order to solve the above technical problems, an embodiment of the present application also provides a laser cutting machine, including a laser cutting control device of any implementation of the above embodiments, and the laser cutting control device adopts the laser cutting control method of any implementation of the above embodiments.

[0130] To solve the above technical problems, the present application also provides a computer device. Figure 3 , Figure 3 This is a basic structural block diagram of the computer device in this embodiment.

[0131] The computer device 3 includes a memory 31, a processor 32, and a network interface 33 that are interconnected through a system bus. It should be noted that the figure only shows a computer device 3 with components 31-33, but it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented instead. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0132] The computer device may be a desktop computer, notebook computer, PDA, cloud server, etc. The computer device may interact with the user via a keyboard, mouse, remote control, touchpad, or voice control device.

[0133] The memory 31 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, magnetic disk, optical disk, etc. In some embodiments, the memory 31 can be an internal storage unit of the computer device 3, such as the hard disk or memory of the computer device 3. In other embodiments, the memory 31 can also be an external storage device of the computer device 3, such as a plug-in hard disk equipped on the computer device 3, a smart memory card (SMC), a secure digital (SD) card, a flash memory card, etc. Of course, the memory 31 can also include both the internal storage unit of the computer device 3 and its external storage device. In this embodiment, the memory 31 is generally used to store the operating system and various application software installed on the computer device 3, such as the program code of the laser cutting control method. In addition, the memory 31 can also be used to temporarily store various types of data that have been output or are to be output.

[0134] In some embodiments, the processor 32 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip. The processor 32 is generally used to control the overall operation of the computer device 3. In this embodiment, the processor 32 is used to execute program code stored in the memory 31 or process data, such as executing the program code of the laser cutting control method.

[0135] The network interface 33 may include a wireless network interface or a wired network interface. The network interface 33 is generally used to establish a communication connection between the computer device 3 and other electronic devices.

[0136] The present application also provides another embodiment, namely, providing a computer-readable storage medium, which stores a control program for laser cutting, and the control program for laser cutting can be executed by at least one processor so that the at least one processor performs the steps of the laser cutting control method as described above.

[0137] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0138] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A laser cutting control method for controlling laser cutting of a plate, characterized in that: include: Obtain the contour of the laser cutting plate to be cut; Obtaining first process layer information corresponding to the contour to be cut, wherein the process layer refers to the upper surface and / or side surface of the laser-cut plate, and the first process layer information is used to indicate the rust or corrosion condition of the surface of the laser-cut plate corresponding to the contour to be cut; If the first process layer information indicates that the surface of the plate corresponding to the contour to be cut is rusty or corroded and needs to be treated by spraying, it is determined that the contour to be cut needs to be sprayed before cutting; if the first process layer information also indicates that the surface of the plate corresponding to the contour to be cut is not rusty or has little rust, it is determined that the contour to be cut does not need to be sprayed, and the plate is directly cut according to the contour to be cut. Determining a cutting process for the contour to be cut according to the first process layer information; Controlling the laser to cut the plate according to the cutting process; Determining the cutting process of the to-be-cut contour according to the first process layer information includes: Obtaining global second process layer information of the plate, wherein the second process layer information refers to information of the process layer of the entire plate. If the entire global surface of the plate is rusted or corroded and requires spraying treatment first, it is determined that the entire plate is sprayed first and then the entire plate is cut according to the contour to be cut. If only a part of the surface of the plate is rusted, it is determined that intelligent cutting is performed. If the entire global surface of the plate is less rusted, it is determined that the plate is cut directly according to the contour to be cut. Determining, based on the second process layer information, whether a process for cutting the plate is spraying film first and then cutting, conventional cutting, or intelligent cutting; When it is determined that the process for cutting the plate is intelligent cutting, the cutting process for the contour to be cut is determined according to the first process layer information.

2. The method according to claim 1, characterized in that Determining the cutting process of the to-be-cut contour according to the first process layer information includes: Obtaining a cutting request, wherein the cutting request includes whether to perform intelligent cutting; In a case where the cutting request is to perform intelligent cutting, the cutting process of the to-be-cut contour is determined according to the first process layer information.

3. The method according to claim 2, characterized in that The second process layer information includes a proportion of contours that require spraying before cutting. Determining, based on the second process layer information, whether the process for cutting the plate is spraying before cutting, conventional cutting, or intelligent cutting includes: Comparing the contour ratio with a first preset threshold and a second preset threshold; When the contour ratio is greater than or equal to a first preset threshold, determining that the process for cutting the plate is to spray film first and then cut; When the contour ratio is less than a first preset threshold and greater than a second preset threshold, determining that the process of cutting the plate is intelligent cutting; When the contour ratio is less than or equal to a second preset threshold, it is determined that the process of cutting the plate is conventional cutting.

4. The method according to any one of claims 1 to 3, characterized in that Determining the cutting process of the to-be-cut contour according to the first process layer information includes: The first process layer information includes whether the contour to be cut needs spraying; In the case that the contour to be cut requires spraying, the cutting process of the contour to be cut is determined to be spraying first and then cutting.

5. The method according to any one of claims 1 to 3, characterized in that Controlling the laser to cut the plate according to the cutting process includes: In the case where the cutting of the plate is interrupted, obtaining the cutting state before the interruption occurs; the cutting state includes spraying or cutting; According to the cutting state, the cutting process after restarting the cutting is determined; wherein, In the case where the cutting state is film spraying, after it is determined to restart cutting, film spraying is continued from the breakpoint before cutting.

6. A laser cutting control device for controlling laser cutting of plates, characterized in that: The laser cutting control device implements the steps of the laser cutting control method according to any one of claims 1 to 5, wherein the laser cutting comprises: A contour acquisition module is used to obtain the contour of the laser-cut plate to be cut; A first process layer information acquisition module, configured to acquire first process layer information corresponding to the contour to be cut; a process determination module, configured to determine a cutting process for the contour to be cut according to the first process layer information; The laser cutting module is used to control the laser to cut the plate according to the cutting process.

7. A laser cutting machine, characterized in that: The laser cutting control device and the laser according to claim 6 are included, wherein the laser cutting control device controls the laser cutting of the plate.

8. A computer device, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the steps of the laser cutting control method according to any one of claims 1 to 5 are implemented.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the laser cutting control method according to any one of claims 1 to 5.

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