A C-SIC welding target ultrasonic testing method

Abstract

The invention relates to the technical field of sputtering target preparation, and discloses a C-SIC welding target ultrasonic detection method, comprising: preparing a standard C-SIC welding target, placing the C-SIC welding target in water and extending a probe into the water after the standard C-SIC welding target is detected to be qualified, using water as a medium to perform ultrasonic detection of different reflected waves on the waterway position and the plane position of a standard copper back plate of the C-SIC welding target, wherein the detection waveform for the waterway position is the second reflected wave, and the detection waveform for the plane position is the fourth reflected wave; the invention can achieve good detection effect in the case of large-area welding and large defect size through the above technical scheme, can use the probe to directly judge the quality from the height of the reflected wave, can also detect very small defects, and can perform qualitative and quantitative evaluation on welding quality.

Description

Technical Field

[0001] The invention relates to the technical field of sputtering target material preparation, in particular to an ultrasonic detection method for a C-SIC welding target. Background Art

[0002] The existing target material welding technology includes SB welding technology. SB welding technology is a welding method in which a brazing material with a lower melting point than the weld metal is filled between two pieces of metal. After proper heating, the brazing material melts and bonds the solid welds together. The characteristics are: the alloy welding material has the characteristics of "heat shrinkage and cold expansion", but the hardness is relatively low.

[0003] After obtaining SB welded products through SB welding technology, the welding status of SB welded products needs to be detected. The existing technologies for detecting welding status include C-SCAN detection. C-SCAN detection is ultrasonic non-destructive testing. The characteristics of ultrasonic signals can be used to know the internal welding status of SB welded products, including whether there are defects and the location, range, size, and shape of the defects. This allows the welding status of the product to be detected without destroying the product, and the results can be seen intuitively. The system can calculate the defect rate of the product through detection and distinguish whether the welded product is qualified.

[0004] However, CSCAN detection cannot detect the strength of welding. The detection method for welding strength in the prior art includes tensile test, which is a detection method to infer whether the product welding is good by the tensile strength of the sample. However, the tensile test can only detect the tensile strength of the test part, which cannot well reflect the welding condition of the entire target material. Summary of the invention

[0005] The purpose of the present invention is to overcome the limitation problem of the existing detection technology and provide a C-SIC welding target ultrasonic detection method.

[0006] In order to achieve the above object, the present invention provides a C-SIC welding target ultrasonic detection method, comprising the following steps:

[0007] Making a standard C-SIC welding target, wherein the standard C-SIC welding target is formed by welding a standard C-SIC target material and a standard copper backing plate, and the standard copper backing plate includes a raised waterway position and a recessed plane position;

[0008] After the standard sample C-SIC welding target is tested to be qualified, a C-SIC welding target is provided, wherein the C-SIC welding target is formed by welding a C-SIC target material and a copper backing plate, and the copper backing plate has the same thickness and structure as the standard sample copper backing plate;

[0009] The C-SIC welding target is placed in water and the probe is inserted into the water. The welding state of the C-SIC welding target is ultrasonically detected using water as a medium and a copper back plate as a detection surface, wherein the detection waveform of the ultrasonic detection of the water channel position of the copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the copper back plate is the fourth reflected wave.

[0010] As an implementable embodiment, the probe is located above the C-SIC welding target, and the distance from the probe to the upper surface of the C-SIC welding target is 50 to 65 mm.

[0011] As an implementable embodiment, the probe is a 15MHZ probe.

[0012] As an implementable embodiment, the probe is connected to an ultrasonic flaw detector, and a gain parameter of the ultrasonic flaw detector is 45-60dB.

[0013] As an implementable method, the steps after the standard sample C-SIC welding target is tested to be qualified specifically include: placing the standard sample C-SIC welding target in water and extending the probe into the water, using water as a medium and the standard sample copper back plate as a detection surface to perform ultrasonic detection on the welding state of the standard sample WTI welding target, wherein the detection waveform of the ultrasonic detection of the water channel position of the standard sample copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the standard sample copper back plate is the fourth reflected wave;

[0014] The ultrasonic flaw detector obtains the test result and analyzes it to obtain the defect rate of the standard C-SIC welding target. When the defect rate of the standard C-SIC welding target is within the preset qualified defect range, it is considered that the test of the standard C-SIC welding target is qualified. Otherwise, the parameters of the ultrasonic flaw detector are adjusted so that the defect rate of the standard C-SIC welding target is within the preset qualified defect range.

[0015] As an implementable embodiment, the probe is located above the standard C-SIC welding target, the distance from the probe to the upper surface of the standard C-SIC welding target is 50-65 mm, and the filter of the ultrasonic flaw detector is a 15 MHz filter.

[0016] As an implementable embodiment, the preset qualified defect range is 15.43-18.86%.

[0017] As an implementable embodiment, the probe is fixed by a probe holder.

[0018] Beneficial effects of the present invention: The present invention places a C-SIC welding target in water and extends a probe into the water, and uses water as a medium to perform ultrasonic detection of different reflected waves on the waterway position and the plane position of a standard copper back plate of the C-SIC welding target, wherein the detection waveform for the waterway position is the second reflected wave, and the detection waveform for the plane position is the fourth reflected wave, so that a good detection effect can be achieved in the case of large-area welding and large-size defects, the probe can be used to directly judge the quality from the height of the reflected wave, very small defects can also be detected, and the welding quality can be qualitatively and quantitatively evaluated. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the steps of the ultrasonic detection method for C-SIC welding target according to an embodiment of the present invention.

[0020] Figure 2 It is a schematic diagram of the structure of an ultrasonic detection device of a C-SIC welding target ultrasonic detection method according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the copper back plate surface structure of a C-SIC welding target in an ultrasonic detection method for a C-SIC welding target according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of the effect obtained by using the second detection wave to detect the surface of the standard copper back plate of the C-SIC welding target in the C-SIC welding target ultrasonic detection method according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the effect obtained by using the fourth detection wave to detect the surface of the standard copper back plate of the C-SIC welding target in the C-SIC welding target ultrasonic detection method according to an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the effect obtained by using the second detection wave to detect the water channel position on the surface of the standard copper back plate of the C-SIC welding target ultrasonic detection method of an embodiment of the present invention, and using the fourth detection wave to detect the plane position on the surface of the standard copper back plate. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1, this embodiment provides a technical solution: a C-SIC welding target ultrasonic detection method, comprising the following steps:

[0027] Step S100: manufacturing a standard C-SIC welding target, wherein the standard C-SIC welding target is formed by welding a standard C-SIC target material and a standard copper backing plate, and the standard copper backing plate includes a raised waterway position and a recessed plane position;

[0028] Step S200: after the standard C-SIC welding target is tested to be qualified, a C-SIC welding target is provided, wherein the C-SIC welding target is formed by welding a C-SIC target material and a copper backing plate, and the copper backing plate has the same thickness and structure as the standard copper backing plate;

[0029] Step S300: placing the C-SIC welding target in water and extending the probe into the water, using water as a medium and the copper back plate as a detection surface to perform ultrasonic detection on the welding state of the C-SIC welding target, wherein the detection waveform of the ultrasonic detection of the water channel position of the copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the copper back plate is the fourth reflected wave.

[0030] In this embodiment, the probe is located above the C-SIC welding target, and the distance from the probe to the upper surface of the C-SIC welding target is 50-65 mm.

[0031] In this embodiment, the probe is a 15 MHz probe, the probe is connected to an ultrasonic flaw detector, and the filter of the ultrasonic flaw detector is a 15 MHz filter.

[0032] The steps after the standard sample C-SIC welding target is qualified include: placing the standard sample C-SIC welding target in water and extending the probe into the water, using water as a medium and the standard sample copper back plate as a detection surface to perform ultrasonic detection on the welding state of the standard sample WTI welding target, wherein the detection waveform of the ultrasonic detection of the waterway position of the standard sample copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the standard sample copper back plate is the fourth reflected wave;

[0033] The ultrasonic flaw detector obtains the test result and analyzes it to obtain the defect rate of the standard C-SIC welding target. When the defect rate of the standard C-SIC welding target is within the preset qualified defect range, it is considered that the test of the standard C-SIC welding target is qualified. Otherwise, the parameters of the ultrasonic flaw detector are adjusted so that the defect rate of the standard C-SIC welding target is within the preset qualified defect range.

[0034] It should be noted that, since ultrasonic waves cannot propagate in C-SIC materials, one side of the C-SIC target cannot be used as the detection surface, and the copper backing plate needs to be used as the detection surface. The copper backing plate of the C-SIC welding target includes a raised water channel position and a recessed plane position. In actual tests, it is found that the use of the common first detection wave cannot achieve the detection of the C-SIC welding target. Instead, the second reflected wave is used for the water channel position of the copper backing plate, and the fourth reflected wave is used for the plane position of the copper backing plate to achieve the detection purpose, such as Figure 3 As shown in FIG. 1 , it is a schematic diagram of the surface structure of the standard copper back plate, wherein the standard copper back plate includes a raised waterway position 2, a recessed plane position 3 and a defective portion 1, as shown in FIG. Figure 4 The figure is a schematic diagram of the effect of using the second detection wave to detect the surface of the copper back plate of the standard sample in the ultrasonic detection method of the C-SIC welding target of the embodiment of the present invention; Figure 5 The figure is a schematic diagram of the effect of using the fourth detection wave to detect the surface of the copper back plate of the standard sample in the ultrasonic detection method of the C-SIC welding target of the embodiment of the present invention; Figure 6 The figure shows a C-SIC welding target ultrasonic detection method according to an embodiment of the present invention, in which the C-SIC welding target uses the second detection wave to detect the water channel position on the surface of the standard copper back plate, and uses the fourth detection wave to detect the plane position on the surface of the standard copper back plate.

[0035] In this embodiment, the probe is located above the standard C-SIC welding target, the distance between the probe and the upper surface of the standard C-SIC welding target is 50-65 mm, the filter of the ultrasonic flaw detector is a 15 MHz filter; the probe is fixed by a probe holder, such as Figure 2 It is shown that the probe 20 irradiates the surface of the standard WTI welding target 10. In addition, the step length of the probe can be adjusted according to the size of the target material, so as to be suitable for WTI targets used in different sputtering machines.

[0036] In this embodiment, the preset qualified defect range is 15.43-18.86%, and the gain parameter Gain of the ultrasonic flaw detector is 45-60dB. Specifically, before the C-SIC welding target is inspected, it must be calibrated with a standard sample, that is, first, a standard C-SIC welding target with the same structure as the C-SIC welding target to be inspected must be prepared. Specifically, the copper back plate of the C-SIC welding target to be inspected and the standard copper back plate of the standard C-SIC welding target must be the same in thickness and structure, wherein the same structure includes the same water channel position and plane position; after the production is completed, a defect is set on the standard C-SIC welding target. At this time, the defect of the standard C-SIC welding target is As known, the standard C-SIC welding target is detected by the probe. When the defect rate obtained by the probe on the standard C-SIC welding target meets the manually set defect rate, there is no need to adjust the parameters of the ultrasonic flaw detector. However, if the defect rate obtained by the probe on the standard C-SIC welding target is not within the manually preset defect rate range, that is, the qualified defect range, it is necessary to adjust the parameters of the ultrasonic flaw detector so that the parameters of the ultrasonic flaw detector are correct and the C-SIC welding target can be ultrasonically detected in a stable state. In addition, the Gain parameter used in this embodiment is 45-60dB. If it exceeds this range, no defects will be detected.

[0037] This embodiment is based on the principle of ultrasonic flaw detection for detection, that is, the detection is performed using the principle that when ultrasonic waves encounter a heterogeneous interface during propagation, part of the sound waves will be reflected and received by the probe. This method has a good detection effect when large-area SB welding and the defect size is large. Conventional probes can be used to directly judge the interface quality from the height of the reflected wave. Very small defects can also be detected, and the quality of welding can be qualitatively and quantitatively evaluated. At the same time, this embodiment starts from the state of the C-SIC welding target after use, selects the copper back plate surface for detection, and adopts the second reflected wave for the waterway position of the copper back plate according to the structure of the copper back plate itself, and adopts the fourth reflected wave for the plane position of the copper back plate, thereby achieving the detection purpose and better detection effect.

[0038] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A C-SIC welding target ultrasonic detection method, characterized in that: The following steps are involved: Making a standard C-SIC welding target, wherein the standard C-SIC welding target is formed by welding a standard C-SIC target material and a standard copper backing plate, and the standard copper backing plate includes a raised waterway position and a recessed plane position; After the standard sample C-SIC welding target is tested to be qualified, a C-SIC welding target is provided, wherein the C-SIC welding target is formed by welding a C-SIC target material and a copper backing plate, and the copper backing plate has the same thickness and structure as the standard sample copper backing plate; The C-SIC welding target is placed in water and the probe is inserted into the water. The welding state of the C-SIC welding target is ultrasonically detected using water as a medium and a copper back plate as a detection surface, wherein the detection waveform of the ultrasonic detection of the water channel position of the copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the copper back plate is the fourth reflected wave.

2. The C-SIC welding target ultrasonic detection method according to claim 1, characterized in that: The probe is located above the C-SIC welding target, and the distance from the probe to the upper surface of the C-SIC welding target is 50-65 mm.

3. The C-SIC welding target ultrasonic detection method according to claim 1, characterized in that: The probe is a 15MHZ probe.

4. The C-SIC welding target ultrasonic detection method according to claim 1, characterized in that: The probe is connected to an ultrasonic flaw detector, and a gain parameter of the ultrasonic flaw detector is 45-60dB.

5. The C-SIC welding target ultrasonic detection method according to claim 4, characterized in that: The steps after the standard C-SIC welding target is tested to be qualified specifically include: The standard C-SIC welding target is placed in water and the probe is inserted into the water, and the welding state of the standard WTI welding target is ultrasonically detected using water as a medium and the standard copper back plate as a detection surface, wherein the detection waveform of the ultrasonic detection of the waterway position of the standard copper back plate is the second reflected wave, and the detection waveform of the ultrasonic detection of the plane position of the standard copper back plate is the fourth reflected wave; The ultrasonic flaw detector obtains the test result and analyzes it to obtain the defect rate of the standard C-SIC welding target. When the defect rate of the standard C-SIC welding target is within the preset qualified defect range, it is considered that the test of the standard C-SIC welding target is qualified. Otherwise, the parameters of the ultrasonic flaw detector are adjusted so that the defect rate of the standard C-SIC welding target is within the preset qualified defect range.

6. The C-SIC welding target ultrasonic detection method according to claim 5, characterized in that: The probe is located above the standard C-SIC welding target, the distance from the probe to the upper surface of the standard C-SIC welding target is 50-65 mm, and the filter of the ultrasonic flaw detector is a 15 MHz filter.

7. The C-SIC welding target ultrasonic detection method according to claim 5, characterized in that: The preset qualified defect range is 15.43-18.86%.

8. The C-SIC welding target ultrasonic detection method according to claim 1, characterized in that: The probe is fixed by a probe frame.

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