A substrate attaching apparatus and a substrate attaching method

Abstract

The application discloses a substrate adhering device and a substrate adhering method. The substrate adhering device comprises a substrate moving table, a receiver and a transmitter arranged on two sides of the substrate moving table respectively, the receiver and the transmitter both have two degrees of freedom of Y and Z, a Z-direction moving assembly arranged above the substrate moving table and configured to move up and down along the Z-direction, and a reference plate comprising an upper reference plate and a lower reference plate, the upper reference plate and an upper substrate are arranged on a lower surface of the Z-direction moving assembly, and the lower reference plate and a lower substrate are arranged on an upper surface of the substrate moving table. The substrate adhering method uses the above-mentioned substrate adhering device. The substrate adhering device can keep the Z-direction moving assembly and the substrate moving table at an optimal stroke, reduce the load, simplify the structure, improve the alignment accuracy and reduce the adhering deviation. The substrate adhering method improves the substrate alignment accuracy and reduces the substrate adhering deviation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photoetching machine equipment, and particularly relates to a substrate bonding device and a substrate bonding method. BACKGROUND

[0002] In the prior art, a matching device for substrate bonding in a semiconductor process needs to align two substrates before bonding. Substrate alignment is one of the most important technologies in the substrate bonding process.

[0003] The existing substrate alignment method is as follows: first, the surfaces of the two substrates are opposite to each other, and two groups of microscopes are used to detect the positions of the alignment marks on the two substrates, and then the relative position deviation of the alignment marks on the two substrates is compensated by an actuator. However, based on the requirements of the substrate bonding process, a spacer must be placed between the two substrates during the alignment process to ensure that the two substrates do not contact each other before bonding, which results in a large gap between the two substrates, which is usually greater than 0.4 mm. The existence of the gap makes the depth of field of the selected microscope must be greater than the distance between the two substrates, so that the alignment marks on the two substrates can be clearly imaged. However, for microscopes, the depth of field and the resolution are in a contradictory relationship, that is, the larger the depth of field of the microscope, the lower the resolution. Therefore, to further improve the alignment accuracy, the resolution of the microscope should be improved first, which will greatly reduce the depth of field of the microscope and ultimately reduce the alignment accuracy of the substrate.

[0004] In view of the above problems, the prior art provides a detection device which uses two groups of four microscopes to complete the alignment. Since the alignment marks are located on the bonding surface, the lower lens is used to determine the coordinate position of the mark on the upper substrate, and the upper lens is used to determine the coordinate position of the mark on the lower substrate, and then the bonding is completed by the vertical lifting of the motion table. This method effectively solves the problem of insufficient depth of field of the lens, but increases the difficulty of coaxial design of the upper and lower two groups of lenses.

[0005] Subsequently, the prior art provides a solution. A group of lenses moving between two marks are used to detect the deviation of the two materials to be aligned. The feature is that the lens does not need to stop moving, but completes image recognition in motion, and realizes rapid alignment through a predetermined deviation compensation. However, this method does not explain how to avoid the bonding deviation after alignment and how to unify the lens coordinate system and the motion table coordinate system. In addition, the lens will also have Rx and Ry rotation during horizontal movement, which will affect the alignment accuracy.

[0006] In view of the above problems, a solution is provided in the prior art, which realizes alignment detection through a set of relatively placed lenses. Before alignment, coaxial correction of the two lenses is first completed, then the bottom workpiece table is moved to realize the function of observing the lower mark by the upper lens and observing the upper mark by the lower lens. The bottom workpiece table has four degrees of freedom, and the top movement table has one degree of freedom. In addition, a position measuring device is installed to detect the movement position of the movement table. This method solves the problem of lens coaxiality, and reduces the horizontal deviation caused by vertical movement due to the close position of the upper and lower substrates during alignment. However, it has the following disadvantages: the marks on the upper and lower substrates need to be identified respectively, the travel of the workpiece table is large, and the time is long.

[0007] Therefore, it is urgent to provide a substrate bonding device and a substrate bonding method to solve the above technical problems in the prior art. SUMMARY

[0008] The first object of the present application is to provide a substrate bonding device which can keep the movement table at an optimal travel, reduce the load, simplify the structure, improve the alignment accuracy of the substrate, and reduce the substrate bonding deviation.

[0009] To achieve the above object, the present application adopts the following technical solutions:

[0010] A substrate bonding device comprises:

[0011] a substrate movement table;

[0012] a receiver and a transmitter arranged on the two sides of the substrate movement table respectively, the receiver and the transmitter each having two degrees of freedom of Y and Z;

[0013] a Z-direction movement assembly located above the substrate movement table and configured to move up and down along the Z-direction;

[0014] a reference plate comprising an upper reference plate and a lower reference plate, the upper reference plate and the upper substrate being arranged on the lower surface of the Z-direction movement assembly, and the lower reference plate and the lower substrate being arranged on the upper surface of the substrate movement table.

[0015] As a preferred technical solution of the above substrate bonding device, the upper reference plate is located on the side of the upper substrate close to the transmitter, and the lower reference plate is located on the side of the lower substrate close to the receiver; or, the upper reference plate and the lower reference plate are located on the same side.

[0016] As a preferred technical solution of the above substrate bonding device, the Z-direction movement assembly comprises:

[0017] a support;

[0018] A Z-direction moving table is connected to the support, and the upper reference plate and the upper substrate are both connected to the Z-direction moving table, which is configured to move up and down along the Z-direction.

[0019] As a preferred technical scheme of the substrate bonding device, the Z-direction moving assembly further comprises:

[0020] A substrate chuck is connected to the Z-direction moving table, and the upper reference plate is fixedly connected to the lower surface of the substrate chuck, which is used for adsorbing the upper substrate.

[0021] As a preferred technical scheme of the substrate bonding device, the Z-direction moving assembly further comprises: a chuck fixing support, one end of which is connected to the Z-direction moving table, and the other end of which is connected to the substrate chuck.

[0022] As a preferred technical scheme of the substrate bonding device, further comprising: a transmission assembly located below the substrate chuck, which is used for transmitting the upper substrate.

[0023] As a preferred technical scheme of the substrate bonding device, further comprising: a moving table base, on which the substrate moving table is arranged.

[0024] As a preferred technical scheme of the substrate bonding device, further comprising: a positioning clamp arranged on the substrate moving table, which is used for positioning the lower substrate.

[0025] As a preferred technical scheme of the substrate bonding device, further comprising: a control unit, which forms a closed-loop control with the receiver and the transmitter respectively, so as to control the receiver and the transmitter to move individually.

[0026] The second object of the present application is to provide a substrate bonding method, which has high alignment accuracy of upper and lower substrates and high bonding accuracy.

[0027] To achieve the above object, the present application adopts the following technical scheme:

[0028] A substrate bonding method using the substrate bonding device according to any one of the above technical schemes, the substrate bonding method comprising the following steps:

[0029] S1, the receiver and the transmitter detect the positions of the upper reference plate and the lower reference plate through the marks on the reference plate;

[0030] S2, the position of the substrate moving table is aligned with that of the Z-direction moving table;

[0031] S3, the receiver and the transmitter detect the positions of the substrate marks on the upper substrate and the lower substrate;

[0032] S4, the substrate motion table motion realizes the position alignment of the upper substrate and the lower substrate;

[0033] S5, the Z-direction motion assembly moves along the Z-direction to realize the lamination of the upper substrate and the lower substrate.

[0034] As a preferred technical scheme of the above-mentioned substrate lamination method, the step S2 comprises:

[0035] As a preferred technical scheme of the above-mentioned substrate lamination method, the step S3 comprises:

[0036] S31, the receiver and the transmitter detect the left side mark of the upper substrate and the right side mark of the lower substrate at the first position;

[0037] S32, the receiver and the transmitter detect the left side mark of the lower substrate and the right side mark of the upper substrate at the second position.

[0038] As a preferred technical scheme of the above-mentioned substrate lamination method, when the receiver and the transmitter move along the Z-direction, the X-direction scanning of the upper substrate and the lower substrate is realized, and the image of the substrate mark distributed in the X-direction is obtained.

[0039] As a preferred technical scheme of the above-mentioned substrate lamination method, when the receiver and the transmitter move along the Y-direction, the Y-direction scanning of the upper substrate and the lower substrate is realized, and the image of the substrate mark distributed in the Y-direction is obtained.

[0040] Compared with the prior art, the advantages and beneficial effects of the present application are that:

[0041] The substrate lamination device provided by the present application obtains the relative position and attitude of the motion table where the reference plate is located through the upper reference plate and the lower reference plate based on the triangulation technology, measures the coordinate position of the upper substrate and the lower substrate by using the transmitter and the receiver on both sides of the substrate motion table, thereby measuring the relative position of the substrate and the reference plate, determining the relative position and attitude of the substrate, realizing the position alignment of the upper substrate and the lower substrate, and then completing the lamination of the upper substrate and the lower substrate through the vertical lifting of the Z-direction motion assembly; the substrate lamination device can keep the Z-direction motion assembly and the substrate motion table at the optimal stroke, reduce the load, simplify the structure, improve the alignment accuracy, and reduce the lamination deviation.

[0042] The substrate lamination method provided by the present application applies the above-mentioned substrate lamination device, and compared with the prior art, the substrate alignment accuracy of the substrate lamination method is improved, and the substrate lamination deviation is reduced.

[0043] Additional aspects and advantages of the present application will be given in part in the following description, part will become apparent from the following description, or will be understood by those skilled in the art through the practice of the present application. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the substrate bonding device provided in a specific embodiment of the present invention;

[0045] Figure 2 This is a schematic diagram of the reference plate structure and the distribution of marks on the reference plate provided in a specific embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram of the substrate structure and substrate marking distribution provided in a specific embodiment of the present invention;

[0047] Figure 4 This is a schematic diagram of the optical triangulation measurement principle of a specific embodiment of the present invention;

[0048] Figure 5 This is a schematic diagram showing the positional relationship between the projection slit and the alignment mark in a specific embodiment of the present invention;

[0049] Figure 6 This is a schematic diagram of the structure of the z-axis motion stage assembly provided in a specific embodiment of the present invention;

[0050] Figure 7 This is a top view schematic diagram of the POS.A measurement optical path of the substrate bonding device provided in a specific embodiment of the present invention;

[0051] Figure 8 This is a top view schematic diagram of the POS.B measurement optical path of the substrate bonding device provided in a specific embodiment of the present invention;

[0052] Figure 9 This is a front view schematic diagram of the branch measurement optical path of the substrate bonding device provided in a specific embodiment of the present invention;

[0053] Figure 10 This is a schematic diagram of the optical path from the upper substrate at different Z-positions to the receiver in different X-directions, provided by a specific embodiment of the present invention.

[0054] Figure 11 This is a flowchart of the substrate bonding method provided in a specific embodiment of the present invention.

[0055] The markings in the image are as follows:

[0056] 1. Substrate motion stage; 2. Receiver; 3. Transmitter;

[0057] 4. Z-axis motion assembly; 41. Support frame; 42. Z-axis motion stage; 43. Substrate suction cup; 44. Suction cup fixing bracket;

[0058] 51. Upper reference version; 52. Lower reference version;

[0059] 61, upper substrate; 62, lower substrate; 63, substrate mark;

[0060] 7, transmission assembly; 8, motion stage base; 9, control unit;

[0061] 101, light source; 102, illumination assembly; 103, projection slit; 104, projection assembly; 105, substrate; 106, detection assembly; 107, detection slit; 108, relay assembly; 109, detector. DETAILED DESCRIPTION

[0062] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0063] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative work fall within the scope of protection of the present application.

[0064] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0065] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0066] In the description of the present application, it is also necessary to explain that, unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0067] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "above" and "on" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The "under", "below" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0068] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0069] In view of the problems of low alignment accuracy, great design difficulty, and large movement table stroke of the substrate bonding device in the prior art, the present application proposes a substrate bonding device based on triangulation technology, which can effectively solve the above problems.

[0070] The optical triangulation reflection measurement principle is based on simple geometric relationships. The light beam emitted by the light-emitting diode is irradiated to the surface of the measured object, and the reflected light is projected onto the photosensitive element matrix through a set of lenses, and the photosensitive element can be a CCD / CMOS or a PSD element. The intensity of the reflected light depends on the surface characteristics of the measured object. For this purpose, the sensitivity of the analog element PSD needs to be adjusted. For digital element CCD sensor, using real-time surface compensation technology (RTSC, Real Time Surface Compensation) provided by Germany MIYAR can change the received light intensity instantaneously.

[0071] According to the triangulation method, the laser emitter 3 shoots visible laser to the surface of the measured object through the lens, and the reflected light spot is received by the internal CCD linear camera through the lens of the receiver 2. According to different distances, the CCD linear camera can "see" these light points at different angles. According to this angle and the known distance between the light source 101 and the camera, the digital signal processor can calculate the distance between the sensor and the measured object. The triangulation method calculates the height of the mark by measuring the height difference between the substrate surface and the bottom reflection of the mark, and realizes the substrate alignment by densely sampling and splicing the graphic information of the substrate mark 63. According to different designs, the maximum allowed measurement distance of the optical measurement principle can reach 1m. The imaging spot of the oblique laser triangulation is larger, the light intensity is not concentrated, there is difference with the change of the incident angle, the volume is larger than that of the direct type, the measurement range is small, but the resolution of the oblique type is higher than that of the direct type.

[0072] The embodiment discloses a substrate bonding device, realizes accurate measurement and alignment of the substrate position, ensures the optimal stroke and load of the motion table, and reduces bonding deviation. Figure 1 As shown in the figure, the substrate bonding device comprises a substrate motion table 1, a receiver 2, an emitter 3, a Z-direction motion assembly 4 and a reference plate. The substrate motion table 1 has three degrees of freedom of X, Y and Rz. The receiver 2 and the emitter 3 are arranged on the two sides of the substrate motion table 1 respectively, and both the receiver 2 and the emitter 3 have two degrees of freedom of Y and Z. The Z-direction motion assembly 4 is located above the substrate motion table 1 and is configured to move up and down along the Z direction. The reference plate comprises an upper reference plate 51 and a lower reference plate 52, and a plurality of marks are arranged on the upper reference plate 51 and the lower reference plate 52. The substrate comprises an upper substrate 61 and a lower substrate 62, and a plurality of substrate marks 63 are arranged on the upper substrate 61 and the lower substrate 62. The upper reference plate 51 and the upper substrate 61 are arranged on the lower surface of the Z-direction motion assembly 4, and the lower reference plate 52 and the lower substrate 62 are arranged on the upper surface of the substrate motion table 1.

[0073] The substrate bonding device of the embodiment is based on the triangulation technology. When aligning, the coordinates of the marks on the upper and lower reference plates and the substrate marks 63 are measured by using the emitters 3 and receivers 2 distributed on the left and right sides of the substrate motion table 1 and the Z-direction motion assembly 4. The emitters 3 and receivers 2 have two degrees of freedom of Y and Z, and can realize the measurement of the coordinates of all the marks on the reference plates and the substrate marks 63. Then, the bonding is completed by the vertical lifting of the Z-direction motion assembly 4.

[0074] In the embodiment, the upper reference plate 51 is located on the side of the upper substrate 61 close to the emitter 3, and the lower reference plate 52 is located on the side of the lower substrate 62 close to the receiver 2. In another feasible embodiment, the upper reference plate 51 and the lower reference plate 52 are located on the same side. The specific positions of the upper reference plate 51 and the lower reference plate 52 are not the focus of the protection of the present application, and can be set according to the actual situation.

[0075] As Figure 2 shown, it is a reference version structure and a reference version mark distribution diagram in the embodiment, and the above reference version 51 is taken as an example for description, and the multiple marks on the upper reference version 51 are respectively marked as 51a, 51b, 51c, 51d, 51e, 51f, 51g and 51h, and the structure of the lower reference version 52 is the same as that of the upper reference version 51. It should be noted that the reference version is used as a reference part, and the specific distribution of the marks thereon is not limited to this, and can be adjusted according to actual requirements, and the number of the marks on the reference version can also be adjusted according to actual requirements, and the embodiment will not be enumerated one by one. The relative position and attitude of the motion platform where the reference version is located can be calculated through the mark distribution on the reference version. Alternatively, the marks on the reference version are in the form of a cross-shaped slit. Preferably, the upper reference version 51 and the lower reference version 52 are in the form of a rectangle, and a corner is provided with a chamfer, which plays a foolproof role.

[0076] As Figure 3 shown, it is a substrate mark 63 distribution diagram in the embodiment, and the relative position of the substrate mark 63 and the mark on the reference version is used to determine the relative position and attitude of the substrate. Alternatively, the multiple substrate marks 63 in the embodiment are respectively marked as 63a, 63b, 63c and 63d, and the distribution positions are as shown in Figure 2 It should be noted that the specific distribution of the substrate mark 63 is not limited to this, and can be adjusted according to actual requirements, and the number of the substrate mark 63 can also be adjusted according to actual requirements, and the embodiment will not be enumerated one by one. Preferably, the upper substrate 61 and the lower substrate 62 are both provided with a notch, and this structure is prior art, which will not be described here.

[0077] As Figure 4 shown, it is an optical triangular reflection measurement principle diagram of the embodiment, in which: a light source 101, an illumination assembly 102, a projection slit 103, a projection assembly 104, a substrate 105, a detection assembly 106, a detection slit 107, a relay assembly 108 and a detector 109. The light emitted by the light source 101 passes through the illumination assembly 102 to form parallel light, passes through the projection slit 103 and the projection assembly 104, forms a projection spot on the substrate 105, and at the same time, the substrate 105 reflects the light and images the pattern of the substrate mark 63 on the detection slit 107 through the detection assembly 106. The light passing through the detection slit 107 is processed by the relay assembly 108 and is received by the detector 109. The detector 109 collects the corresponding voltage value according to the received light intensity. In the embodiment, the transmitter 3 is the light source 101, the receiver 2 is the detector 109, and the mark on the reference version is the projection slit 103 and the detection slit 107.

[0078] According to the triangulation method, the laser emitter 3 shoots visible laser to the surface of the measured object through the lens, and the reflected light spot is received by the internal CCD linear camera through the lens of the receiver 2. According to different distances, the CCD linear camera can“see” the light points at different angles. According to the angle and the known distance between the light source 101 and the camera, the digital signal processor can calculate the distance between the sensor and the measured object. According to the triangulation method, the height of the substrate mark 63 is calculated by measuring the height difference between the surface of the substrate 105 and the reflection of the mark bottom, and the graphic information of the substrate mark 63 is spliced by 3D dense sampling to realize the alignment of the substrate 105.

[0079] As shown in Figure 5 The schematic diagram of the positional relationship between the projection slit 103 and the alignment mark of the embodiment, the projection formed by the projection light spot on the projection slit 103 is reflected by the substrate 105, and then the pattern of the substrate mark 63 is projected on the detector 109 through the detection slit 107. Based on the size and angle of the projection slit 103, the detection slit 107 and the substrate mark 63, the accurate pose of the substrate mark 63 can be calculated and measured.

[0080] In the embodiment, as shown in Figure 6 The Z-direction motion assembly 4 mainly includes a support 41 and a Z-direction motion table 42. The support 41 is used as a support structure to realize the mounting and fixation of all parts thereon. The Z-direction motion table 42 is connected to the support 41. The upper reference plate 51 and the upper substrate 61 are both connected to the Z-direction motion table 42. The Z-direction motion table 42 is configured to move up and down along the Z-direction to drive the Z-direction motion of all parts thereon.

[0081] Further, the Z-direction motion assembly 4 further includes a substrate suction disc 43. The substrate suction disc 43 is connected to the Z-direction motion table 42. The upper reference plate 51 is fixedly connected to the lower surface of the substrate suction disc 43. The substrate suction disc 43 is used to adsorb the upper substrate 61 to realize the adsorption positioning of the upper substrate 61. Optionally, the substrate suction disc 43 is a vacuum suction disc. Preferably, a plurality of substrate suction discs 43 are arranged in a rectangular array or a circular array to improve the adsorption stability. The number of substrate suction discs 43 is not specifically limited in the embodiment and can be selected according to actual conditions.

[0082] Further, the Z-direction motion assembly 4 further includes a suction disc fixing support 44. One end of the suction disc fixing support 44 is connected to the Z-direction motion table 42, and the other end is connected to the substrate suction disc 43.

[0083] The substrate bonding device further includes a transmission assembly 7. The transmission assembly 7 is located below the substrate suction disc 43. The transmission assembly 7 is used to transmit the upper substrate 61. Optionally, the transmission assembly 7 moves along the X-direction or the Y-direction in the horizontal plane perpendicular to the Z-direction to realize the transmission of the upper substrate 61.

[0084] In this embodiment, as Figure 1 As shown, receiver 2 and transmitter 3 are respectively positioned on both sides of substrate motion stage 1 and Z-axis motion component 4 along the X-axis, while transmission component 7 moves horizontally along the Y-axis; alternatively, receiver 2 and transmitter 3 are respectively positioned on both sides of substrate motion stage 1 and Z-axis motion component 4 along the Y-axis, while transmission component 7 moves horizontally along the X-axis. Both arrangements avoid structural interference and make full use of space.

[0085] The substrate bonding equipment in this embodiment also includes a motion stage base 8, which is placed on a workbench or the ground and serves as the supporting component for the entire substrate bonding equipment. The substrate motion stage 1, receiver 2, and transmitter 3 are all mounted on the motion stage base 8. Triangulation technology is employed, placing the alignment measurement transmitter 3 and receiver 2 outside the motion stage, and directly mounting them on the motion stage base 8 without a cantilever structure. This results in high structural stability and facilitates higher measurement accuracy. Simultaneously, it ensures optimal stroke for the Z-axis motion component 4 and the substrate motion stage 1 below, reducing load and simplifying the structure.

[0086] Furthermore, the substrate bonding equipment also includes a positioning fixture, which is mounted on the substrate motion stage 1 and is used to position the lower substrate 62. The positioning fixture adopts a substrate positioning structure commonly used in the prior art, which will not be described in detail here.

[0087] Optionally, the substrate bonding equipment also includes a control unit 9, which is connected to the substrate motion stage 1 to control the three-degree-of-freedom motion of the substrate motion stage 1. The control unit 9 is also connected to the Z-axis motion component 4 to control the Z-axis motion of the Z-axis motion component 4. The control unit 9 forms a closed-loop control with the receiver 2 and the transmitter 3 respectively to control the individual movement of the receiver 2 and the transmitter 3. In this embodiment, the control unit 9 can be a centralized or distributed controller. For example, the control unit 9 can be a single microcontroller or a combination of multiple distributed microcontrollers. The microcontroller can run a control program to control the substrate motion stage 1, receiver 2, transmitter 3, display device 5, and Z-axis motion component 4 to achieve their respective functions.

[0088] The substrate bonding device provided by this invention is based on triangulation technology. By measuring the distribution of marks on the upper reference plate 51 and the lower reference plate 52, the relative position and orientation of the motion stage on which the reference plate is located can be obtained. The transmitters 3 and receivers 2 on both sides of the substrate motion stage 1 are used to measure the coordinate positions of the substrate marks 63 on the upper substrate 61 and the lower substrate 62, thereby measuring the relative position of the substrate and the reference plate, determining the relative position and orientation of the substrate, and thus achieving the alignment of the upper substrate 61 and the lower substrate 62. Then, the bonding of the upper substrate 61 and the lower substrate 62 is completed by the vertical lifting of the Z-axis motion component 4. This substrate bonding device can maintain the optimal stroke of the Z-axis motion component 4 and the substrate motion stage 1, reduce the load, simplify the structure, improve the alignment accuracy, and reduce the bonding deviation.

[0089] The following is in conjunction with the appendix Figure 7 - Appendix Figure 9 The measurement principle of the above-mentioned substrate bonding equipment will be explained in detail.

[0090] like Figure 7 This is a top view schematic diagram of the measurement optical path of the substrate bonding apparatus in the first position (POS.A) of this embodiment. When the alignment lens of the receiver 2 and the light source of the transmitter 3 are at POS.A, they are used to measure the left side mark 63b of the upper substrate and the right side mark 63c of the lower substrate. Due to structural limitations, optical paths 3a and 3c are intersected. Optical path 3a forms a field of view 3b with the upper substrate 61 to measure the left side mark 63b of the upper substrate, and optical path 3c forms a field of view 3d with the lower substrate 62 to measure the right side mark 63c of the lower substrate.

[0091] like Figure 8 This is a top view schematic diagram of the measurement optical path of the substrate bonding apparatus in the second position (POS.B) of this embodiment. When the alignment lens of the receiver 2 and the light source of the transmitter 3 are at POS.B, they are used to measure the left side mark 63a of the lower substrate and the right side mark 63d of the upper substrate. Due to structural limitations, optical paths 3a and 3c are intersected. Optical path 3a forms a field of view 3b with the lower substrate 62 to measure the left side mark 63a of the lower substrate, and optical path 3c forms a field of view 3d with the upper substrate 61 to measure the right side mark 63d of the upper substrate.

[0092] like Figure 9 This is a front view schematic diagram of the branch measurement optical path of the substrate bonding device in this embodiment. When the receiver 2 and transmitter 3 move along the Z-axis, the substrate can be scanned in the X-axis to obtain an image of the distribution of substrate markings 63 in the X-axis. Specifically, as shown... Figure 10As shown, when the upper substrate 61 is at the Z1 position, the image of the substrate mark 63c or 63d is projected to the receiver 2; when the upper substrate 61 is at the Z2 position, the image of the substrate mark 63a or 63b is projected to the receiver 2; the Z-direction position of the receiver 2 is synchronously moved. When the receiver 2 and the transmitter 3 are moved along the Y-direction, Y-direction scanning of the substrate can be realized, and the image of the Y-direction distribution of the substrate mark 63 is obtained, so that the measurement of the substrate mark 63 distributed at any position on the whole surface of the substrate can be realized. When the position of the substrate mark 63 of the substrate is determined, the Z-direction position of the receiver 2 and the transmitter 3 is determined, and the relative position of the upper substrate 61 and the lower substrate 62 can be aligned by moving along the Y-direction between POS.A and POS.B; and the position alignment of the upper substrate 61 and the lower substrate 62 can be realized by the three degrees of freedom of the X, Y and Rz of the substrate motion stage 1.

[0093] The embodiment also provides a substrate bonding method using the substrate bonding device of any of the above technical solutions. Figure 11 As shown, the substrate bonding method comprises the following steps:

[0094] S1, the receiver 2 and the transmitter 3 detect the positions of the upper reference plate 51 and the lower reference plate 52 through the marks on the reference plate;

[0095] S2, the position of the substrate motion stage 1 is aligned with the Z-direction motion stage 42;

[0096] S3, the receiver 2 and the transmitter 3 detect the positions of the substrate mark 63 on the upper substrate 61 and the lower substrate 62;

[0097] S4, the substrate motion stage 1 is moved to realize the position alignment of the upper substrate 61 and the lower substrate 62;

[0098] S5, the Z-direction motion assembly 4 is moved along the Z-direction to realize the bonding of the upper substrate 61 and the lower substrate 62.

[0099] Further, the step S2 of aligning the position of the substrate motion stage 1 with the Z-direction motion stage 42 comprises: the three degrees of freedom of the substrate motion stage 1 are moved to realize the position alignment with the Z-direction motion stage 42.

[0100] Further, the step S3 of detecting the positions of the substrate mark 63 on the upper substrate 61 and the lower substrate 62 by the receiver 2 and the transmitter 3 comprises:

[0101] S31, the receiver 2 and the transmitter 3 detect the left side mark of the upper substrate 61 and the right side mark of the lower substrate 62 at the first position;

[0102] S32, the receiver 2 and the transmitter 3 detect the left side mark of the lower substrate 62 and the right side mark of the upper substrate 61 at the second position.

[0103] Compared with the prior art, the substrate alignment accuracy is improved and the substrate fitting deviation is reduced.

[0104] Obviously, the above-mentioned embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. Based on the above-mentioned description, other different forms of changes or variations can be made by those skilled in the art. Here, all the implementation modes are not required or can not be exhausted. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A substrate bonding device, characterized in that, include: A substrate motion stage (1); a receiver (2) and a transmitter (3) are respectively disposed on both sides of the substrate motion stage (1), and the receiver (2) and the transmitter (3) each have two degrees of freedom, Y and Z; a Z-axis motion component (4) is located above the substrate motion stage (1) and is configured to move up and down along the Z direction; a reference plate, including an upper reference plate (51) and a lower reference plate (52), the upper reference plate (51) and the upper substrate (61) are both disposed on the lower surface of the Z-axis motion component (4), and the lower reference plate (52) and the lower substrate (62) are both disposed on the upper surface of the substrate motion stage (1); The substrate bonding device is configured to: when the receiver (2) and the transmitter (3) move along the Z direction, perform X-axis scanning on the upper substrate (61) and the lower substrate (62) to obtain an image of the substrate markings (63) on the upper substrate (61) and the lower substrate (62) distributed in the X direction; when the receiver (2) and the transmitter (3) move along the Y direction, perform Y-axis scanning on the upper substrate (61) and the lower substrate (62) to obtain an image of the substrate markings (63) distributed in the Y direction.

2. The substrate bonding equipment according to claim 1, characterized in that, Also includes: The upper reference plate (51) is located on the side of the upper substrate (61) closer to the transmitter (3), and the lower reference plate (52) is located on the side of the lower substrate (62) closer to the receiver (2); or, the upper reference plate (51) and the lower reference plate (52) are located on the same side.

3. The substrate bonding equipment according to claim 1, characterized in that, The Z-axis motion assembly (4) includes: a support (41); a Z-axis motion stage (42) connected to the support (41), the upper reference plate (51) and the upper substrate (61) both connected to the Z-axis motion stage (42), and the Z-axis motion stage (42) is configured to move up and down along the Z-axis.

4. The substrate bonding equipment according to claim 3, characterized in that, The Z-axis motion assembly (4) further includes: a substrate suction cup (43) connected to the Z-axis motion stage (42), the upper reference plate (51) being fixed to the lower surface of the substrate suction cup (43), and the substrate suction cup (43) being used to adsorb the upper substrate (61).

5. The substrate bonding equipment according to claim 4, characterized in that, The Z-axis motion component (4) further includes a suction cup fixing bracket (44), one end of which is connected to the Z-axis motion stage (42), and the other end of which is connected to the substrate suction cup (43).

6. The substrate bonding equipment according to claim 4, characterized in that, Also includes: A transmission component (7) is located below the substrate chuck (43) and is used to transmit the upper substrate (61).

7. The substrate bonding equipment according to claim 6, characterized in that, Also includes: The motion stage base (8) is provided on the motion stage base, and the substrate motion stage (1), the receiver (2) and the transmitter (3) are all disposed on the motion stage base.

8. The substrate bonding equipment according to claim 7, characterized in that, Also includes: A positioning fixture is provided on the substrate motion stage (1), and the positioning fixture is used to position the lower substrate (62).

9. The substrate bonding equipment according to claim 1, characterized in that, Also includes: Control unit (9) forms a closed-loop control with the receiver (2) and the transmitter (3) respectively, so as to control the receiver (2) and the transmitter (3) to move independently respectively.

10. A substrate bonding method using the substrate bonding apparatus according to any one of claims 1-9, characterized in that, Includes the following steps: S1. The receiver (2) and transmitter (3) detect the positions of the upper reference plate (51) and the lower reference plate (52) through the marks on the reference plate; S2. Align the positions of the substrate motion stage (1) and the Z-axis motion stage (42); S3. The receiver (2) and the transmitter (3) detect the positions of the substrate marks (63) on the upper substrate (61) and the lower substrate (62); S4. The substrate motion stage (1) moves to achieve the alignment of the upper substrate (61) and the lower substrate (62); S5. The Z-axis motion component (4) moves along the Z-axis to achieve the bonding of the upper substrate (61) and the lower substrate (62); When the receiver (2) and the transmitter (3) move along the Z direction, the upper substrate (61) and the lower substrate (62) are scanned in the X direction to obtain an image of the substrate mark (63) distributed in the X direction; when the receiver (2) and the transmitter (3) move along the Y direction, the upper substrate (61) and the lower substrate (62) are scanned in the Y direction to obtain an image of the substrate mark (63) distributed in the Y direction.

11. The substrate bonding method according to claim 10, characterized in that, Step S2 includes: the three-degree-of-freedom motion of the substrate motion stage (1) and the position alignment of the Z-axis motion stage (42).

12. The substrate bonding method according to claim 10, characterized in that, Step S3 includes: S31, the receiver (2) and the transmitter (3) detect the left mark on the upper substrate (61) and the right mark on the lower substrate (62) at a first position; S32, the receiver (2) and the transmitter (3) detect the left mark on the lower substrate (62) and the right mark on the upper substrate (61) at a second position.

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