Lift-up type double-cavity wafer single wafer etching machine

Abstract

The application provides a lifting type double-cavity wafer single-piece etching machine, which comprises an etching tank, double-cavity structures are designed in parallel left and right in the etching tank, an outer shell capable of sliding left and right is wrapped outside the etching tank, a closing plate covering the upper surface of the etching tank is designed in the middle of the outer shell, the closing plate slides on the upper part of the etching tank along with the outer shell, a placing platform is respectively assembled on the left and right sides of the outer shell, wafers to be etched are placed on the upper part of the placing platform through etching frames, and a roll material module is respectively fixed at the top of the outer shell near the left and right positions. The device can etch the wafers in two etching frames at the same time, and the efficiency is higher. A gas isolation area is further formed outside the etching tank and the closing plate, so that the gas is further prevented from escaping to the outside, and the safety of workshop workers is further ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer etching equipment, in particular to a lifting type double-cavity wafer single-piece etching machine. BACKGROUND

[0002] Wafer etching processing is to first deposit metal on the wafer, and then use the chemical reaction between the etching solution and the deposited metal on the wafer to dissolve the metal layer, so as to achieve the purpose of etching patterns on the wafer. The traditional wafer etching processing equipment usually uses a separate etching tank, places etching solution in it, places the wafer in the etching container, then places the etching container used to place the wafer into the etching tank, and waits for the etching solution to complete the etching process. However, the etching tank of the wafer etching processing equipment uses a single-cavity structure, the number of wafers placed is small, the production efficiency is low, and when the etching container together with the wafer is placed into the liquid in the etching tank, the etching container needs to be lifted and placed into the etching tank through a lifting structure, such as the general structure used in the wafer etching tool disclosed in patent 202021100534.9, so the etching equipment usually needs to be specially equipped with a lifting device in the workshop, and the operation of the placement process is also relatively inconvenient. In addition, since the solution used in wafer etching processing contains heavy metal solutions such as chromium acid, it is easy to produce smoke and has great pollution, and the etching tank needs to be sealed, but when the etching tank is opened each time, the contaminated gas will still escape to the processing workshop, causing harm to workers. SUMMARY

[0003] In view of the above problems, the present application provides a lifting type double-cavity wafer single-piece etching machine which has a lifting structure itself, has a double-cavity in the etching tank, and has better sealing performance and lower pollution.

[0004] The technical scheme adopted by the present application to solve its technical problems is: the lifting type double-cavity wafer single wafer etching machine comprises an etching tank, and the etching tank is internally fitted with etching liquid for etching processing wafers; a double-cavity structure in parallel left and right is designed in the etching tank, and an outer shell capable of sliding left and right is wrapped outside the etching tank; tracks in the left and right directions are fitted in front and back of the etching tank, and the outer shell is fitted by sliding left and right through the front and back tracks; a closing plate covering the upper surface of the etching tank is designed in the middle of the outer shell, and the closing plate slides on the upper part of the etching tank along with the outer shell; a placing platform is respectively fitted on the left and right sides of the outer shell, and the wafers to be etched are placed on the upper part of the placing platform through an etching frame; the etching frame adopts a hollow structure; a roll material module is fixed on the left and right positions of the top of the outer shell; a hanging bracket is respectively fixed on the left and right sides of the outer shell and protrudes left and right; a steering wheel is fitted at the end of the hanging bracket; the roll rope on the roll material module is vertically placed on the etching frame on the placing platform through the steering wheel; a hook adapted to the hanging structure is fitted on the lower end of the roll rope; a negative pressure module is fitted in the middle of the upper part of the outer shell, and the bottom air inlet of the negative pressure module is communicated with the inside of the outer shell.

[0005] As a preferred, a cable module fixed on the ground is respectively fitted on the left and right outer sides of the placing platform, and the pull ropes of the left and right cable modules are respectively connected with the left and right sides of the rear part of the outer shell.

[0006] As a preferred, the etching tank and the placing platform are rectangular, and the width of the etching tank and the placing platform is the same.

[0007] As a preferred, the upper plane of the etching tank is higher than the upper plane of the placing platform, and a roller shutter door is respectively fitted on the left and right sides of the outer shell, and door holes for the placing platform to pass through are designed on the lower left and right sides of the roller shutter door.

[0008] As a preferred, the upper plane of the etching tank is flush with the upper plane of the placing platform.

[0009] As a preferred, the etching frame is square, the hanging structure comprises hard rods hinged on the upper four corners of the etching frame, the upper parts of the four hard rods are connected at one point, and a structure facilitating the hanging and taking of the hook is designed on the upper part of the connection position of the hard rods.

[0010] As a preferred, an observation window made of transparent material is fitted on the front of the outer shell, and the closing plate is made of transparent material.

[0011] As a preferred, the tracks fitted on the front and back of the outer shell are triangular in cross section, two or more than two rollers are respectively fitted on the bottom of the front and back of the outer shell, and the outer shell is placed on the front and back tracks through the rollers.

[0012] As preferred, the left and right sides of the shell are respectively designed with hinged hooks, and one side of the corrosion frame is equipped with anti-shaking connecting blocks, when the corrosion frame is lifted upward, the hooks are hooked on the anti-shaking connecting blocks.

[0013] The beneficial effects of the present application are that: when the lifting type double-cavity wafer single-piece etching machine works, the wafer to be etched is placed on the placing platform through the corrosion frame, then the movement of the coiled material module is controlled to make the hook at the end of the coiled rope hook the corrosion frame, and the corrosion frame is lifted away from the surface of the placing platform, then the shell moves as a whole along the front and rear tracks, driving the corrosion frame and the wafer inside to the upper part of the cavity on one side of the etching tank, at this time, the closure plate inside the shell slides synchronously to make the upper part of the cavity on one side of the etching tank open, and the corrosion frame and the wafer inside are placed into the etching liquid in the etching tank through the coiled material module. Then the hook is detached, and the shell moves back to the original position.

[0014] In the etching machine, two parallel cavities are designed in the etching tank, so that the etching tank can etch two wafers in the corrosion frames at the same time, the efficiency is higher, and when the shell moves to one side to open one etching cavity, the closure plate in the shell is still closed above the other cavity of the etching tank, so that the opening area of the etching tank is smaller. The design of the shell not only plays the role of sliding carrier, but also the coiled material module and the hanger installed therein can conveniently lift the corrosion frame on the placing platform, and through the overall movement of the shell, the corrosion frame and the wafer are moved to the open cavity of the etching tank, the movement of the shell and the opening of the closure plate to one cavity are completed at the same time, and the overall structure design is simpler. In addition, when the shell moves as a whole to the outside of the etching tank, the shell inside and the side of the placing platform form a cavity wrapping the etching tank, and through the negative pressure module, the gas in the cavity can be extracted, so that the toxic gas in the cavity is extracted out, thereby forming a gas isolation area outside the etching tank and the closure plate, further preventing the gas from escaping to the outside; and the shell can keep the state of extracting gas during the movement process to timely extract a small amount of toxic gas in the etching tank, reducing the toxic gas above when the wafer is placed into the etching tank, and further ensuring the safety of the workshop staff. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is the forward structure schematic diagram of the lifting type double-cavity wafer single-piece etching machine in example 1 when taking materials on the placing platform.

[0016] Figure 2 is the forward structure schematic diagram of the lifting type double-cavity wafer single-piece etching machine in example 1 when placing the corrosion frame into the etching tank.

[0017] Figure 3 is Figure 1 the left view structure schematic diagram of the lifting type double-cavity wafer single-piece etching machine in example 1.

[0018] Figure 4 is a schematic diagram of the positive structure of the lifting type double-cavity wafer single wafer etching machine in Example 2 when taking materials on the placement platform. DETAILED DESCRIPTION

[0019] The application will be further described below in conjunction with examples:

[0020] In this patent, the directional words used have the following relationship: Figure 1 and Figure 4 The orientation or positional relationship of the figures is only for the purpose of simplifying the description of the application and does not indicate that the device or element must have a specific orientation, so it cannot be understood as a limitation on the application.

[0021] Example 1

[0022] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , the lifting type double-cavity wafer single wafer etching machine comprises an etching tank 1 in which an etching liquid for etching a wafer is assembled; the etching tank 1 can adopt the structure of a conventional wafer etching device, which will not be described in detail here. The etching tank 1 is designed with a double-cavity structure in parallel on the left and right, and the double-cavity bodies in the etching tank 1 can be connected to each other or independent. The etching tank 1 is wrapped with an outer shell 2 that can slide left and right, and the etching tank 1 is assembled with rails 21 in the left and right directions in front and back, and the outer shell 2 is assembled by sliding left and right through the rails 21 in front and back, and the front and back of the outer shell 2 are respectively assembled with the rails 21 corresponding to the sliding assembly. The middle of the outer shell 2 is designed with a closure plate 22 covering the upper surface of the etching tank 1, and the upper surface of the etching tank 1 and the lower surface of the closure plate 22 are designed to be smooth, and the closure plate 22 slides on the upper surface of the etching tank 1 with the outer shell 2, and when the outer shell 2 covers the outside of the etching tank 1, the closure plate 22 just seals and covers the etching tank 1. The left and right sides of the outer shell 2 are respectively assembled with a placement platform 3, and the wafer to be etched is placed on the upper part of the placement platform 3 through an etching frame 4, and the etching frame 4 adopts a hollow structure, and the top of the outer shell 2 is fixed with a winding module 5 at positions near the left and right sides, and the winding module 5 adopts a winding rope machine structure. The outer shell 2 is fixed with a hanging bracket 51 extending left and right on both sides, and the end of the hanging bracket 51 is assembled with a steering wheel, and the winding rope on the winding module 5 is placed vertically on the etching frame 4 on the placement platform 3 through the steering wheel, and the upper part of the etching frame 4 is designed with a hanging structure, and the downward end of the winding rope is assembled with a hook 52 adapted to the hanging structure. The middle of the upper part of the outer shell 2 is assembled with a negative pressure module 23, and the bottom air inlet of the negative pressure module 23 is connected to the inside of the outer shell 2.

[0023] The present lifting type double-cavity wafer single wafer etching machine is mainly used for etching processing wafer, and can also be used for processing other workpieces which need to be soaked in volatile solution and toxic solution. When the machine works, the wafer to be etched is placed on the placing platform 3 through the etching frame 4, then the hook 52 at the end of the winding rope is hung on the etching frame 4 by controlling the movement of the winding module 5, and the etching frame 4 is lifted away from the upper surface of the placing platform 3, as shown in Figure 1 . Then the shell 2 moves left as a whole along the front and rear tracks, driving the etching frame 4 and the wafer in it to reach the upper part of the cavity on one side of the etching tank 1, as shown in Figure 2 . At this time, the closing plate 22 in the shell 2 slides synchronously to open the upper part of the cavity on one side of the etching tank 1, and the etching frame 4 and the wafer in it are put into the etching liquid in the etching tank 1 through the winding module 5. Then the hook 52 is detached, and the shell 2 moves right to the original position. When it is needed to place the etching frame 4 into the cavity on the left side of the etching tank 1, the shell 2 can move left along the reverse movement process.

[0024] In the etching machine, two parallel cavities are designed in the etching tank 1, and the etching tank 1 can put the etching frame 4 and the wafer in it into the two cavities in the etching frame 4 respectively by moving the shell 2 left and right respectively, and etch the wafers in the two etching frames 4 at the same time, which is more efficient. Moreover, when the shell 2 moves to one side to open one etching cavity, the closing plate 22 in the shell 2 is still closed above the other cavity of the etching tank 1, so that the opening area of the etching tank 1 is small. The design of the shell 2 not only plays the role of sliding carrier, but also the winding module 5 and the hanger 51 installed in the shell 2 can conveniently lift the etching frame 4 on the placing platform. By moving the shell 2 as a whole, the etching frame 4 and the wafer are moved to the open cavity of the etching tank 1, and the movement of the shell 2 and the opening of the cavity by the closing plate 22 are completed at the same time, so that the overall structure design is simpler. In addition, when the shell 2 moves to the outside of the etching tank 1 as a whole, the shell 1 and the side of the placing platform 2 form a cavity which wraps the etching tank 1, as shown in Figure 1 . At this time, the gas in the cavity can be extracted by the negative pressure module 23, so that the toxic gas in the cavity is extracted out, thereby forming a gas isolation area outside the etching tank 1 and the closing plate 22, further preventing the gas from escaping to the outside; and the shell 2 can keep the state of extracting gas during the movement process to timely extract a small amount of toxic gas in the etching tank 1, reducing the toxic gas when the wafer is placed in the etching tank 1, and further ensuring the safety of the workshop staff.

[0025] As shown in Figure 1 and Figure 2As shown, the left and right outer sides of the placement platforms 3 are respectively equipped with cable modules 6 fixed to the ground, and the pull ropes of the left and right cable modules 6 are connected to the left and right sides of the rear of the outer shell 2, respectively. Thus, the outer shell 2 can be pulled left and right using the cable modules 6, a simple structure that is easy to implement. The corrosion tank 1 and the placement platform 3 are rectangular in shape, and their widths are the same. The opening widths on the left and right sides of the outer shell 2 are slightly larger than the widths of the corrosion tank 1 and the placement platform 3, facilitating the passage of the placement platform 3 through the interior of the outer shell 2 when it moves left and right.

[0026] Other examples Figure 1 and picture Figure 2 As shown, the upper plane of the etching tank 1 is higher than the upper plane of the placement platform, and roller shutters 7 are respectively installed on the left and right sides of the outer shell 2. The lower left and right sides of the roller shutters 7 are designed with door openings to facilitate the passage of the placement platform 3. When the wafer is placed in the etching tank 1 through the etching frame 4 for etching processing, the roller shutters 7 close the left and right door openings of the outer shell 2. When etching is completed and material needs to be removed, the roller shutters open, and the outer shell 2 is moved by the pull cable module 6, so that the upper sealing plate 22 of the etching tank 1 opens synchronously.

[0027] In its specific design, the corrosion frame 4 is square in shape. The hanging structure includes rigid rods hinged at the four corners of the upper part of the corrosion frame 4. The upper parts of the four rigid rods are connected at a single point. The upper part of each rigid rod is also designed with a hook structure for easy hooking by the hook 52. Using rigid rods ensures that the hanging structure remains fixed upwards when the corrosion frame 4 is placed inside the corrosion tank 1. Figure 1 and Figure 2 As shown, the hook on the rigid rod remains above the liquid surface, facilitating retrieval after processing. Furthermore, the hanging structure formed by the rigid rod and the etching frame 4 can be designed as a detachable structure, which facilitates the placement and retrieval of the wafer within the etching frame 4.

[0028] In the specific design, the front of the outer casing 2 is fitted with an observation window made of transparent material, and the sealing plate 22 is also made of transparent material. This facilitates observation of the etching process of the wafer in the etching tank 1 at any time. Figure 1 and Figure 3 As shown, the tracks 21 mounted on the front and rear sides of the outer casing 2 have a triangular cross-section. Three rollers 20 are mounted on the bottom of the front and rear sides of the outer casing 2, respectively. The outer casing 2 is placed on the front and rear tracks 21 via the rollers 20. The assembly structure between the triangular cross-section tracks and the rollers 20 is simple and easy to implement. The triangular cross-section of the tracks makes them more robust and ensures accurate positioning. Using three rollers 20 on the bottom of the front and rear sides of the outer casing 2 effectively reduces the weight borne by each roller 20.

[0029] Example 2

[0030] In this embodiment, as Figure 4 As shown, the upper plane of the corrosion tank 1 is flush with the upper plane of the placement platform 3. The corrosion tank 1 and the placement platform 3 have the same width. The outer casing 2 also has a doorway, but instead of a roller shutter structure, the doorway of the outer casing 2 is slightly larger than the cross-sectional dimensions of the corrosion tank 1 and the placement platform 3, creating a small gap between the left and right sides of the outer casing 2 and the adjacent surface of the placement platform 3. This ensures that there is no friction between the outer casing 2 and the front and back of the placement platform 3 when the outer casing 2 slides left and right, and also ensures that the negative pressure module 23 can smoothly extract gas, keeping the cavity between the corrosion tank 1 and the outer casing 2 clean. This eliminates the need for a roller shutter structure, thus eliminating the need to control the up and down movement of the roller shutter, further simplifying the structure and control process of the equipment.

[0031] In this embodiment, such as Figure 4 As shown, hinged hooks 24 are designed on the left and right sides of the outer shell 2, and an anti-sway connecting block 41 is fitted on one side of the corrosion frame 4. The anti-sway connecting block 41 is fixed to one side of the corrosion frame 4 and has a hole structure corresponding to the size of the hook 24, so that the hook 24 can be inserted into it. When the equipment needs to feed material into the corrosion tank 1, the coil module 5 lifts the corrosion frame 4, and the hook 24 hooks into the hole of the anti-sway connecting block 41. This limits the left and right movement of the outer shell 2 and the corrosion frame 4, so that when the outer shell 2 moves left and right, the corrosion frame 4 will not move left and right. The connection design of the hook 24 and the anti-sway connecting block 41 makes the corrosion frame 4 more stable when it moves.

[0032] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A lifting-type dual-cavity wafer etching machine, comprising an etching tank (1), wherein the etching tank (1) is filled with an etching liquid for etching wafers; the etching tank (1) is designed with a dual-cavity structure arranged side by side, characterized in that: The etching tank (1) is encased in a sliding outer shell (2). The etching tank (1) is fitted with left-right directional tracks (21) at its front and rear. The outer shell (2) slides left and right along the tracks (21). A closed plate (22) covering the upper surface of the etching tank (1) is designed in the middle of the outer shell (2). The closed plate (22) slides along the outer shell (2) on the upper surface of the etching tank (1). Placement platforms (3) are mounted on the left and right sides of the outer shell (2). The wafer to be etched is placed on the upper part of the placement platform (3) via an etching frame (4). The etching frame (4) uses… The shell (2) has a hollow structure. On the top of the shell (2), there are two fixed winding modules (5) on the left and right sides respectively. On the two sides of the shell (2), there are two hanging brackets (51) extending to the left and right respectively. The end of the hanging bracket (51) is equipped with a steering wheel. The winding rope on the winding module (5) passes through the steering wheel and is placed vertically on the corrosion frame (4) on the platform (3). The upper part of the corrosion frame (4) is designed with a hook structure. The hanging end of the winding rope is equipped with a hook (52) that is compatible with the hook structure. The middle of the upper part of the shell (2) is equipped with a negative pressure module (23). The bottom air inlet of the negative pressure module (23) is connected to the inside of the shell (2).

2. The lifting dual-cavity wafer etching machine according to claim 1, characterized in that: The left and right sides of the placement platform (3) are respectively equipped with cable modules (6) fixed to the ground, and the cable ropes of the left and right cable modules (6) are respectively connected to the left and right sides of the rear of the outer shell (2).

3. The lifting dual-cavity wafer etching machine according to claim 1, characterized in that: The corrosion tank (1) and the placement platform (3) are rectangular in shape, and the corrosion tank (1) and the placement platform (3) have the same width.

4. The lifting dual-cavity wafer etching machine according to any one of claims 1-3, characterized in that: The upper plane of the corrosion tank (1) is higher than the upper plane of the placement platform. Roller shutters (7) are respectively installed on the left and right sides of the outer shell (2). The lower left and right sides of the roller shutters (7) are designed with door openings to facilitate the passage of the placement platform (3).

5. The lifting dual-cavity wafer etching machine according to claim 3, characterized in that: The upper plane of the corrosion tank (1) is flush with the upper plane of the placement platform (3).

6. The lifting dual-cavity wafer etching machine according to any one of claims 1-3, characterized in that: The corrosion frame (4) is square in shape. The hanging structure includes rigid rods hinged at the four corners of the upper part of the corrosion frame (4). The upper parts of the four rigid rods are connected at one point. The upper part of the connection position of the rigid rods is designed with a structure that facilitates the hanging of hooks (52).

7. The lifting dual-cavity wafer etching machine according to any one of claims 1-3, characterized in that: The outer shell (2) is fitted with an observation window made of transparent material in front, and the sealing plate (22) is made of transparent material.

8. The lifting dual-cavity wafer etching machine according to any one of claims 1-3, characterized in that: The track (21) mounted on the front and rear sides of the outer shell (2) has a triangular cross section. Two or more rollers (20) are mounted on the bottom of the front and rear sides of the outer shell (2). The outer shell (2) is placed on the front and rear tracks (21) by means of the rollers (20).

9. The lifting dual-cavity wafer etching machine according to claim 5, characterized in that: The outer shell (2) is designed with hinged hooks (24) on the left and right sides respectively. The corrosion frame (4) is equipped with an anti-sway connecting block (41) on one side. When the corrosion frame (4) is lifted upward, the hooks (24) are hooked onto the anti-sway connecting block (41).

Images