Manufacturing method of memory chip and memory chip

By using a through-hole process that directly bonds the first wafer to the second wafer, the problems of complex processes and low yield in the fabrication of high-bandwidth memory chips have been solved, achieving higher alignment accuracy and smaller product size.

CN115732398BActive Publication Date: 2026-06-09XI AN UNIIC SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XI AN UNIIC SEMICON CO LTD
Filing Date
2021-08-26
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing high-bandwidth memory (HBM) chips have complex fabrication processes, low yields, and require high alignment precision and have large product sizes.

Method used

By using through-hole technology to directly bond the first wafer and the second wafer to form a memory chip, the cutting of the first wafer is avoided, the number of alignment steps is reduced, and the alignment accuracy is improved.

Benefits of technology

It simplifies the process, improves product yield, reduces product size, and improves alignment accuracy.

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Abstract

The application provides a manufacturing method of a storage chip and the storage chip. The manufacturing method of the storage chip comprises the following steps: providing a first wafer; the first wafer comprises a first substrate, a first metal layer and a first connecting hole connected with the first metal layer, the first connecting hole is arranged on one side of the first substrate or a side away from the first substrate; providing a second wafer; the second wafer comprises a second substrate, a second metal layer and a second connecting hole connected with the second metal layer, the second connecting hole is arranged on one side of the second substrate or a side away from the second substrate; and the first wafer is connected with the second connecting hole of the second wafer through the first connecting hole to form the storage chip. The manufacturing method of the storage chip is relatively simple, and the product yield is relatively high.
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