A method of repairing

Abstract

The application discloses a repairing method, which first provides a receiving component and a repair site component; the receiving component comprises a receiving substrate, and a first surface of the receiving substrate is provided with at least one repair site area; the repair site component comprises a repair site substrate and at least one repair site piece arranged on a second surface of the repair site substrate, and at least part of the repair site piece is provided with a repair site chip on a side away from the repair site substrate. Then, the second surface is arranged opposite to the first surface, and the repair site chip is attached to the corresponding repair site area; the attachment force between the repair site chip and the repair site piece is smaller than the attachment force between the repair site chip and the repair site area. Then, the repair site piece is separated from the repair site chip, so that the repair site chip is left in the repair site area, and the repairing is completed. According to the application, the number and position of the repair site chip can be accurately arranged according to the distribution of the repair site area on the receiving substrate, the repairing efficiency is improved, and the attachment of the repair site chip and the repair site area is realized through the repair site piece as an intermediate body, so that the damage to the receiving substrate in the repairing process is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a repair method. Background Technology

[0002] Micro-LED display technology boasts advantages such as high brightness, high response speed, low power consumption, and long lifespan, making it a hot research topic in the pursuit of next-generation display technologies. In a Micro-LED screen, the number of Micro-LED chips can reach hundreds of thousands or even tens of millions. To transfer these massive numbers of LED chips onto the substrate, the required processes include temporary bonding, laser lift-off, transfer, bonding, inspection, and repair. All of these processes affect the yield rate of the transferred screen.

[0003] The inventors of this application have discovered through long-term research on repair processes that existing repair processes easily damage the film layers of the substrate, thereby reducing the yield of the screen after mass transfer. Therefore, developing a repair process that reduces substrate damage has become an urgent problem to be solved. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a repair method that can reduce damage to the substrate during the mass transfer of LED chips.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a repair method, comprising:

[0006] A receiving component and a filling component are provided; wherein, the receiving component includes a receiving substrate, and a first surface of the receiving substrate is provided with at least one filling region; the filling component includes a filling substrate and at least one filling member disposed on a second surface of the filling substrate, and at least a portion of the filling member is provided with a filling chip on the side facing away from the filling substrate.

[0007] The second surface is positioned opposite to the first surface, and the filling chip is attached to the corresponding filling area; wherein the adhesion force between the filling chip and the filling member is less than the adhesion force between the filling chip and the filling area;

[0008] This separates the replacement component from the replacement chip.

[0009] The replacement component is capable of undergoing positive deformation and returning to its original shape, and the positive deformation increases the length of the replacement component in the direction perpendicular to the replacement substrate; the step of setting the second surface opposite to the first surface and attaching the replacement chip to the corresponding replacement area includes:

[0010] The second surface is positioned opposite to the first surface, and the distance between the replacement chip and the replacement area is a preset spacing; wherein, the preset spacing is less than or equal to the maximum deformation of the replacement component in the direction perpendicular to the replacement substrate;

[0011] The filling component undergoes the positive deformation until the filling chip adheres to the filling area;

[0012] The step of separating the filler component from the filler chip includes:

[0013] The replacement component is restored to its original shape to separate it from the replacement chip.

[0014] The material of the replacement component includes a photosensitive deformation material.

[0015] Prior to the step of setting the second surface opposite to the first surface and attaching the filler chip to the corresponding filler region, the method further includes:

[0016] At least one of the replacement elements is disposed on the second surface of the replacement substrate;

[0017] A first adhesive layer is provided on the side of the replacement component that is away from the replacement substrate;

[0018] The filler chip is disposed on at least a portion of the first adhesive layer on the side opposite to the filler member;

[0019] A second adhesive layer is provided on the side of the replacement chip opposite to the first adhesive layer; wherein the adhesiveness of the first adhesive layer is less than that of the second adhesive layer.

[0020] The replacement component is attached to the replacement chip via electrostatic adsorption or vacuum adsorption; the step of setting the second surface opposite to the first surface and attaching the replacement chip to the corresponding replacement area includes:

[0021] The second surface is positioned opposite to the first surface, and the filling chip is made to contact and adhere to the filling area;

[0022] Reduce the electrostatic or vacuum adsorption force between the filler and the filler chip to be less than the adhesion force between the filler chip and the filler area.

[0023] The second surface of the filling substrate is provided with a plurality of filling elements, and the arrangement of the filling chips on the second surface is the same as the arrangement of the filling area on the first surface.

[0024] Wherein, the orthographic projection of the filling member on the filling substrate is less than or equal to the orthographic projection of the filling chip on the filling substrate, and the orthographic projection of the filling chip in the filling region is less than or equal to the filling region.

[0025] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a repair method, including:

[0026] Multiple LED chips are disposed on the first surface of the receiving substrate;

[0027] The multiple LED chips are inspected to determine the location of the abnormal LED chip;

[0028] A transfer substrate is disposed above the first surface, and the transfer head disposed on the transfer substrate corresponds to the position of the abnormal LED chip.

[0029] The transfer head is brought into contact with the abnormal LED chip at the corresponding position, wherein the bonding force between the abnormal LED chip and the transfer head is greater than the bonding force between the abnormal LED chip and the receiving substrate;

[0030] Remove the transfer head to separate the abnormal LED chip from the receiving substrate and form a replacement area on the receiving substrate.

[0031] The transfer head is capable of positive deformation and returning to its original shape, and the positive deformation increases the length of the transfer head in the direction perpendicular to the transfer substrate; the step of attaching the transfer head to the abnormal LED chip at the corresponding position includes:

[0032] The distance between the transfer head and the abnormal LED chip is set to a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the transfer head in the direction perpendicular to the transfer substrate;

[0033] The transfer head undergoes the positive deformation until it adheres to the abnormal LED chip;

[0034] The step of removing the transfer head to separate the abnormal LED chip from the receiving substrate and forming the replacement region on the receiving substrate includes:

[0035] The transfer head is restored to its original shape to separate the abnormal LED chip from the receiving substrate.

[0036] Prior to the step of setting a transfer substrate above the first surface and aligning the transfer head on the transfer substrate with the position of the abnormal LED chip, the method further includes:

[0037] A plurality of the transfer heads are disposed on one side surface of the transfer substrate, wherein the arrangement of the transfer heads on the transfer substrate is the same as the arrangement of the LED chips on the receiving substrate;

[0038] A third adhesive layer is provided on at least a portion of the transfer head on the side opposite to the transfer substrate.

[0039] The beneficial effects of this application are as follows: The repair method provided by this application first provides a receiving component and a replacement component; wherein, the receiving component includes a receiving substrate, and at least one replacement region is provided on the first surface of the receiving substrate; the replacement component includes a replacement substrate and at least one replacement member disposed on the second surface of the replacement substrate, and at least a portion of the replacement member is provided with a replacement chip on the side facing away from the replacement substrate. Then, the second surface is disposed opposite to the first surface, and the replacement chip is attached to the corresponding replacement region; wherein, the adhesion force between the replacement chip and the replacement member is less than the adhesion force between the replacement chip and the replacement region. Then, the replacement member and the replacement chip are separated, and the replacement chip is attached to the replacement region, completing the repair. This application can accurately set the number and position of the replacement chips according to the distribution of the replacement regions on the receiving substrate, improving the repair efficiency, and by using the replacement member as an intermediate to achieve the attachment of the replacement chip and the replacement region, damage to the receiving substrate during the repair process can be reduced. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0041] Figure 1 This is a flowchart illustrating one embodiment of the repair method of this application;

[0042] Figure 2a A schematic diagram of one embodiment of the receiving component;

[0043] Figure 2b This is a schematic diagram of one embodiment of the replacement component;

[0044] Figure 2c for Figure 1 A schematic diagram of the structure of an embodiment of step S12;

[0045] Figure 2d for Figure 1 A schematic diagram of the structure of an embodiment of step S13;

[0046] Figure 3 This is a flowchart illustrating another embodiment of the repair method of this application;

[0047] Figure 4 This is a flowchart illustrating another embodiment of the repair method of this application;

[0048] Figure 5a for Figure 4 A schematic diagram of the structure of an embodiment of step S32;

[0049] Figure 5b for Figure 4 A schematic diagram of the structure of an embodiment of step S34;

[0050] Figure 6 This is a flowchart illustrating another embodiment of the repair method of this application;

[0051] Figure 7a for Figure 6 A schematic diagram of the structure of an embodiment of step S42;

[0052] Figure 7b for Figure 6 A schematic diagram of the structure of an embodiment of step S44;

[0053] Figure 8 This is a flowchart illustrating another embodiment of the repair method of this application;

[0054] Figure 9a for Figure 8 A schematic diagram of the structure of an embodiment of step S51;

[0055] Figure 9b for Figure 8 A schematic diagram of the structure of an embodiment of step S53;

[0056] Figure 9c for Figure 8 A schematic diagram of the structure of an embodiment of step S54;

[0057] Figure 9d for Figure 8 A schematic diagram of the structure of an embodiment of step S55;

[0058] Figure 10 for Figure 8 A flowchart illustrating an implementation method for step S54. Detailed Implementation

[0059] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0060] Please see Figure 1 , Figure 1 This is a flowchart illustrating one embodiment of the repair method of this application, which includes the following steps.

[0061] Step S11, providing a receiving component and a filling component; wherein, the receiving component includes a receiving substrate, and a first surface of the receiving substrate is provided with at least one filling region; the filling component includes a filling substrate and at least one filling member disposed on a second surface of the filling substrate, and at least a portion of the filling member is provided with a filling chip on the side facing away from the filling substrate.

[0062] Please see Figure 2a and Figure 2b , Figure 2a This is a schematic diagram of one embodiment of the receiving component. Figure 2b This is a schematic diagram of one embodiment of the replacement component. The receiving component 10 includes a receiving substrate 11, and at least one replacement region 110 is provided on the first surface of the receiving substrate 11. The receiving component 10 also includes a plurality of normal LED chips 12 arranged in an array on the first surface. The replacement region 110 is distributed among the normal LED chips 12 and is formed after removing any abnormal LED chips that were originally distributed among the normal LED chips 12. The normal LED chips 12 can be disposed on the first surface of the receiving substrate 11 through an adhesive layer.

[0063] The patching component 20 includes a patching substrate 21 and at least one patching element 22 disposed on the second surface of the patching substrate 21, and at least a portion of the patching element 22 has a patching chip 30 disposed on the side facing away from the patching substrate 21. In some applications, only one patching element 22 and one patching chip 30 can be used. If there are multiple patching areas 110, they can be repaired individually and repeatedly. In other applications, multiple patching elements 22 can be used, and patching chips 30 can be disposed according to the number and position of the patching areas 110, so as to repair all patching areas 110 at once. Figure 2a In the case where multiple filler regions 110 are drawn, Figure 2b The image shows a case where multiple filler elements 22 and multiple filler chips 30 are drawn, and the filler elements 22 below the filler chips 30 are not visible because they are covered.

[0064] Step S12: The second surface is positioned opposite to the first surface, and the replacement chip is attached to the corresponding replacement area; wherein the adhesion force between the replacement chip and the replacement component is less than the adhesion force between the replacement chip and the replacement area.

[0065] Please combine Figure 2a and Figure 2b See Figure 2c , Figure 2c for Figure 1A schematic diagram of the structure of an embodiment of step S12, wherein the receiving component 10 is used Figure 2a The cross-sectional view in the AA direction shows that the replacement component 20 is used. Figure 2b The cross-sectional view along the BB direction is shown. The second surface of the replacement substrate 21 is positioned opposite to the first surface of the receiving substrate 11, and the replacement chip 30 is bonded to the corresponding replacement region 110. The bonding force between the replacement chip 30 and the replacement member 22 is less than the bonding force between the replacement chip 30 and the replacement region 110. The specific method for bonding the replacement chip 30 to the corresponding replacement region 110 will be described below.

[0066] Step S13 separates the replacement component from the replacement chip.

[0067] Please combine Figure 2c See Figure 2d , Figure 2d for Figure 1 In step S13, a schematic diagram of an embodiment shows that after the replacement chip 30 is attached to the corresponding replacement area 110, since the bonding force between the replacement chip 30 and the replacement component 22 is less than the bonding force between the replacement chip 30 and the replacement area 110, it is only necessary to remove the replacement substrate 21, which can simultaneously remove the replacement component 22, while leaving the replacement chip 30 in the replacement area 110, thus completing the repair. Figure 2d The middle section shows the case where the supplementary substrate 21 is far away from the receiving substrate 11.

[0068] This embodiment can use only one replacement chip to perform a single, repeated repair of the replacement area. Alternatively, the number and position of the replacement chips can be precisely set according to the distribution of the replacement area on the receiving substrate, completing the repair in one go and improving repair efficiency. Moreover, this embodiment uses the replacement component as an intermediate to achieve the bonding between the replacement chip and the replacement area, which can reduce damage to the receiving substrate during the repair process.

[0069] In one implementation, please refer to Figure 3 , Figure 3 This is a flowchart illustrating another embodiment of the repair method of this application. In addition to steps S11-S13 described in the above embodiment, this embodiment also includes the following steps before step S12.

[0070] Step S21: At least one replacement element is provided on the second surface of the replacement substrate.

[0071] Please continue reading. Figure 2b First, at least one replacement element 22 is provided on the second surface of the replacement substrate 21 to obtain... Figure 2bThe structure includes a replacement substrate 21 and a replacement element 22. Specifically, a whole-layer structure can be first formed on the surface of the replacement substrate 21, and the material of this whole-layer structure is the same as the material of the replacement element 22. Then, photoresist and etching processes are used to form the replacement element 22. Figure 2b The multiple replacement parts 22 shown.

[0072] Step S22: A first adhesive layer is provided on the side of the replacement component away from the replacement substrate.

[0073] Please refer to the following: Figure 2b and Figure 2c After forming the replacement component 22, a first adhesive layer 23 is provided on the side of the replacement component 22 facing away from the replacement substrate 21, resulting in... Figure 2c The assembly 20 includes a replacement substrate 21, a replacement member 22, and a first adhesive layer 23. Specifically, a full layer of the first adhesive layer material can be formed on the surface of the replacement member 22 firstly, and then formed using photoresist and etching processes. Figure 2c The first adhesive layer 23 is shown on one side of the filler 22.

[0074] Step S23: A replacement chip is disposed on at least a portion of the first adhesive layer on the side opposite to the replacement component.

[0075] Please continue reading. Figure 2c After forming the first adhesive layer 23, a replacement chip 30 is disposed on at least a portion of the first adhesive layer 23 on the side opposite to the replacement member 22, resulting in... Figure 2c The structure includes a replacement substrate 21, a replacement member 22, a first adhesive layer 23, and a replacement chip 30. Specifically, some replacement members 22 can be selected according to the number and position of the replacement areas 110, and then replacement chips 30 are disposed on one side of these replacement members 22. Due to the presence of the first adhesive layer 23, the replacement chip 30 can be bonded to the replacement member 22.

[0076] Step S24: A second adhesive layer is disposed on the side of the replacement chip away from the first adhesive layer; wherein the adhesiveness of the first adhesive layer is less than that of the second adhesive layer.

[0077] Please continue reading. Figure 2c After the replacement chip 30 is installed, a second adhesive layer 31 is installed on the side facing away from the first adhesive layer 23. The adhesiveness of the first adhesive layer 23 is less than that of the second adhesive layer 31. This ensures that after the replacement chip 30 is subsequently attached to the replacement area 110, the adhesion force between the replacement chip 30 and the replacement component 22 is less than the adhesion force between the replacement chip 30 and the replacement area 110, facilitating the removal of the replacement component 20 and completing the repair. In other embodiments, the second adhesive layer 31 may also be installed in the replacement area 110.

[0078] This embodiment, by setting adhesive layers on both sides of the replacement chip 30, can transfer the replacement chip 30 to the replacement area 110 using the intermediate carrier replacement component 22 without damaging the replacement area 110, thereby improving the overall yield of the device after repair.

[0079] In one implementation, please refer to Figure 4 , Figure 4 This is a flowchart illustrating another embodiment of the repair method of this application. This embodiment includes the following steps.

[0080] Step S31: Provide a receiving component and a padding component.

[0081] Step S31 is the same as step S11 above. In this step, a plurality of replacement members 22 are provided on the second surface of the replacement substrate 21, and the arrangement of the replacement chips 30 on the second surface of the replacement substrate 21 is the same as the arrangement of the replacement region 110 on the first surface of the receiving substrate 11. That is, the number and position of the replacement chips 30 are set according to the arrangement of the replacement region 110.

[0082] In this embodiment, the replacement member 22 is capable of undergoing positive deformation and returning to its original shape. Positive deformation increases the length of the replacement member 22 in the direction perpendicular to the replacement substrate 21, while the process of returning to its original shape decreases its length in the same direction. The replacement member 22 is made of a photosensitive deformation material, such as azobenzene, which can deform under irradiation with a specific wavelength of light. Furthermore, this embodiment allows the replacement substrate 21 to transmit the specific wavelength of light, thus satisfying the conditions for the replacement member 22 to undergo positive deformation or return to its original shape.

[0083] The orthographic projection of the 22 replacement component on the 21 replacement substrate is less than or equal to the orthographic projection of the 30 replacement chip on the 21 replacement substrate, and the orthographic projection of the 30 replacement chip on the 110 replacement region is less than or equal to the 110 replacement region, so that the 30 replacement chip can be successfully attached to the 110 replacement region.

[0084] Step S32: The second surface is positioned opposite to the first surface, and the distance between the replacement chip and the replacement area is a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the replacement component in the direction perpendicular to the replacement substrate.

[0085] Please see Figure 5a , Figure 5a for Figure 4In step S32, a schematic diagram of an embodiment is shown. The second surface of the replacement substrate 21 is arranged opposite to the first surface of the receiving substrate 11, and the distance between the replacement chip 30 and the replacement area 110 is a preset distance d. The preset distance d is less than or equal to the maximum deformation of the replacement member 22 in the direction perpendicular to the replacement substrate 21, so that after the replacement member 22 undergoes positive deformation, the replacement chip 30 can contact and adhere to the replacement area 110.

[0086] Step S33: The replacement component undergoes positive deformation until the replacement chip adheres to the replacement area.

[0087] Please combine Figure 5a See Figure 2c After setting the preset spacing d, the aforementioned specific wavelength beam is used to irradiate part of the filling component 22 through the filling substrate 21. The irradiated filling component 22 is the filling component 22 with the filling chip 30 on one side. After being irradiated, the filling component 22 undergoes positive deformation, and its length in the direction perpendicular to the filling substrate 21 increases, causing the filling chip 30 to move closer to the filling area 110 until it contacts and adheres to it, thereby obtaining the desired result. Figure 2c The structure shown.

[0088] Step S34: Restore the replacement component to its original shape so that the replacement component is separated from the replacement chip.

[0089] Please combine Figure 5a and Figure 2c See Figure 5b , Figure 5b for Figure 4 A schematic diagram of the structure of one embodiment of step S34 shows that after confirming that the replacement chip 30 is bonded to the replacement region 110, the replacement component 22, which has undergone positive deformation, is irradiated again through the replacement substrate 21 using the aforementioned specific wavelength light beam, causing it to return to its original shape. Its length in the direction perpendicular to the replacement substrate 21 decreases. Simultaneously, because the bonding force between the replacement chip 30 and the replacement component 22 is less than the bonding force between the replacement chip 30 and the replacement region 110, it separates from the replacement chip 30, leaving the replacement chip 30 on the replacement region 110, thus completing the repair. Figure 5a , Figure 2c and Figure 5b In this process, the distance between the receiving substrate 11 and the supplementary substrate 21 remains unchanged.

[0090] This embodiment utilizes a deformable material to prepare the replacement component 22. The process of positive deformation and restoration of its original shape is used to achieve the bonding of the replacement chip 30 to the replacement region 110 and the separation of the replacement chip 30 from the replacement component 22, thereby reducing damage to the replacement region 110. Furthermore, by setting the replacement chip 30 according to different receiving components 10, the replacement component can be reused, improving repair efficiency and reducing repair costs.

[0091] In one implementation, please refer to Figure 6 , Figure 6 This is a flowchart illustrating another embodiment of the repair method of this application. This embodiment includes the following steps.

[0092] Step S41: Provide the receiving component and the padding component.

[0093] Step S41 is the same as step S11 above; the structure of the receiving component can be further referred to. Figure 2a The structure of the filler component can be found in [link to relevant documentation]. Figure 2b The replacement component 22 is attached to the replacement chip 30 by electrostatic adsorption or vacuum adsorption. Specifically, the replacement component 22 can be made of conductive material to achieve electrostatic adsorption with the replacement chip 30, or an airflow channel can be provided in the replacement component 22 to achieve electrostatic adsorption with the replacement chip 30. These are all mature technologies in the prior art and will not be described in detail here.

[0094] Among them, the replacement chip 30 has a second adhesive layer 31 on the side opposite to the replacement component 22. Figure 2b Not shown in the image, see [link / reference]. Figure 7a ).

[0095] Step S42: Set the second surface opposite to the first surface, and make the replacement chip contact and adhere to the replacement area.

[0096] Please combine Figure 2a and Figure 2b See Figure 7a , Figure 7a for Figure 6 A schematic diagram of the structure of an embodiment of step S42, wherein the receiving component 10 is used Figure 2a The cross-sectional view in the AA direction shows that the replacement component 20 is used. Figure 2b The cross-sectional view is shown in the BB direction. The second surface of the replacement substrate 21 is positioned opposite to the first surface of the receiving substrate 11, and the replacement chip 30 is brought into contact with and bonded to the replacement region 110. The second adhesive layer 31 allows the replacement chip 30 to bond after contacting the replacement region 110. Other replacement members 22 without replacement chips 30, although in contact with the normal chip 12 on the receiving substrate 11, do not bond.

[0097] Step S43: Reduce the electrostatic adsorption force or vacuum adsorption force between the replacement component and the replacement chip to less than the adhesion force between the replacement chip and the replacement area.

[0098] Please continue reading. Figure 7aAfter the replacement chip 30 is attached to the replacement area 110, the electrostatic adsorption force or vacuum adsorption force between the replacement component 22 and the replacement chip 30 is reduced to be less than the adhesion force between the replacement chip 30 and the replacement area 110. For example, the conditions for the formation of electrostatic adsorption force or vacuum adsorption force are disrupted, causing it to be reduced directly to zero. In this case, the replacement component 22 and the replacement chip 30 are in contact but not attached.

[0099] Step S44 separates the replacement component from the replacement chip.

[0100] Step S44 is the same as step S13 above. Please refer to the above steps. Figure 7a See Figure 7b , Figure 7b for Figure 6 The schematic diagram of one embodiment of step S44 shows that after step S43, the replacement component 20 can be directly removed to separate the replacement component 22 from the replacement chip 30, leaving the replacement chip 30 in the replacement area 110, thus completing the repair. Figure 7b The middle section shows the case where the supplementary substrate 21 is far away from the receiving substrate 11.

[0101] This embodiment achieves the bonding and separation of the replacement component 22 and the replacement chip 30 through electrostatic adsorption or vacuum adsorption, thereby bonding the replacement chip 30 to the replacement area and reducing damage to the replacement area 110. Furthermore, by setting the replacement chip 30 according to different receiving components 10, the replacement component can be reused, improving repair efficiency and reducing repair costs.

[0102] In one implementation, please refer to Figure 8 , Figure 8 This is a flowchart illustrating another embodiment of the repair method of this application, which includes the following steps.

[0103] Step S51: Place multiple LED chips on the first surface of the receiving substrate.

[0104] Please see Figure 9a , Figure 9a for Figure 8 The schematic diagram of one embodiment of step S51 shows that multiple LED chips 13 are disposed on the first surface of the receiving substrate 11. The LED chips 13 can be Micro-LED chips, which are massively arranged on the driving backplane to realize Micro-LED display. Figure 9a Only a few LED chips 13 are schematically shown, among which there are usually defective LED chips 130, i.e., dead pixels. The receiving substrate 11 can be a driving backplate or a temporary substrate during the transfer process. Specifically, an adhesive layer 14 (see...) can be used. Figure 9b LED chip 13 is placed on the first surface.

[0105] Step S52: Detect multiple LED chips to determine the location of abnormal LED chips.

[0106] Please continue reading. Figure 9a After a large number of LED chips 13 are arranged, defect detection is performed on them to pinpoint the location of any abnormal LED chips 130. The specific detection method is a mature technology in the existing field and will not be described in detail here.

[0107] Step S53: A transfer substrate is disposed above the first surface, and the transfer head disposed on the transfer substrate is aligned with the position of the abnormal LED chip.

[0108] Please combine Figure 9a See Figure 9b , Figure 9b for Figure 8 A schematic diagram of the structure of an embodiment of step S53, based on Figure 9a The cross-sectional view in the CC direction is further explained. After setting up multiple LED chips 13 and detecting the position of abnormal LED chip 130, a transfer substrate 41 is set above the first surface of the receiving substrate 11, and the transfer head 42 set on the transfer substrate 41 is aligned with the position of the abnormal LED chip 130.

[0109] Prior to step S53, the following steps are also included:

[0110] Step 1: Place multiple transfer heads on one side surface of the transfer substrate, wherein the arrangement of the transfer heads on the transfer substrate is the same as the arrangement of the LED chips on the receiving substrate.

[0111] Please continue reading. Figure 9b First, multiple transfer heads 42 are disposed on one side surface of the transfer substrate 41, wherein the arrangement of the transfer heads 42 on the transfer substrate 41 is the same as the arrangement of the LED chips 13 on the receiving substrate 11. Then, when the transfer substrate 41 and the receiving substrate 11 are subsequently arranged opposite each other, it is only necessary to correspond the transfer heads 42 one-to-one with the LED chips 13, and the abnormal LED chips 130 will naturally correspond one-to-one with the transfer heads 42, regardless of how the abnormal LED chips 130 are distributed.

[0112] Step 2: A third adhesive layer is formed on at least a portion of the transfer head on the side opposite to the transfer substrate.

[0113] Please continue reading. Figure 9b After setting multiple transfer heads 42, a third adhesive layer 43 is provided on at least some of the transfer heads 42 on the side facing away from the transfer substrate 41. The third adhesive layer 43 can be provided on one side of some transfer heads 42 according to the distribution of abnormal LED chips 130, or the third adhesive layer 43 can be provided on one side of all transfer heads 42. Figure 9bDraw the case where a third adhesive layer 43 is provided on one side of all transfer heads 42.

[0114] Step S54: The transfer head is made to bond with the abnormal LED chip at the corresponding position, wherein the bonding force between the abnormal LED chip and the transfer head is greater than the bonding force between the abnormal LED chip and the receiving substrate.

[0115] Please combine Figure 9b See Figure 9c , Figure 9c for Figure 8 A schematic diagram of an embodiment of step S54 shows that the transfer head 42 is bonded to the abnormal LED chip 130 at the corresponding position, wherein the bonding force between the abnormal LED chip 130 and the transfer head 42 is greater than the bonding force between the abnormal LED chip 130 and the receiving substrate 11. The third adhesive layer 43 enables the transfer head 42 and the abnormal LED chip 130 to be bonded together.

[0116] The third adhesive layer 43 is applied to one side of some transfer heads 42 based on the distribution of the abnormal LED chips 130. This is suitable for both cases where the transfer heads 42 deform during the bonding process and cases where they do not deform. However, the process complexity of applying the third adhesive layer 43 is relatively high. Applying the third adhesive layer 43 to one side of all transfer heads 42 is only suitable for cases where the transfer heads 42 deform during the bonding process. However, the process complexity of applying the third adhesive layer 43 is relatively low.

[0117] Step S55: Remove the transfer head to separate the abnormal LED chip from the receiving substrate and form a replacement area on the receiving substrate.

[0118] Please combine Figure 9c See Figure 9d , Figure 9d for Figure 8 In step S55, a schematic diagram of one embodiment shows that after the transfer head 42 adheres to the abnormal LED chip 130, the transfer head 42 is removed. For example, the transfer substrate 41 is moved away from the receiving substrate 11. Since the adhesion force between the abnormal LED chip 130 and the transfer head 42 is greater than the adhesion force between the abnormal LED chip 130 and the receiving substrate 11, the abnormal LED chip 130 will separate from the receiving substrate 11 and be carried away by the transfer head 42 when the transfer head 42 moves, leaving a replacement area 110 on the receiving substrate 11. The distribution of the replacement area 110 is the same as the distribution of the abnormal LED chip 130. The adhesive layer 14 between the abnormal LED chip 130 and the receiving substrate 11 may follow the abnormal LED chip 130 away from the receiving substrate 11, or it may remain in the replacement area 110.

[0119] This embodiment uses the transfer head 42 as an intermediate carrier to remove bad spots by bonding it with the abnormal LED chip 130. This can reduce damage to the receiving substrate 11 and can set the bonding between the transfer head 42 and the abnormal chip 130 according to the distribution of bad spots, so as to remove all bad spots at once and improve the removal efficiency.

[0120] The above bonding process is explained below with the example of the transfer head 42 being deformable.

[0121] In one embodiment, the transfer head 42 is capable of positive deformation and returning to its original shape. Positive deformation increases the length of the transfer head 42 in the direction perpendicular to the transfer substrate 41, while returning to its original shape decreases its length in the same direction. The transfer head 42 is made of a photosensitive deformable material, such as azobenzene, which can deform under irradiation with a specific wavelength of light. Furthermore, in this embodiment, the transfer substrate 41 is configured to allow the transmission of this specific wavelength of light, thus satisfying the conditions for the transfer head 42 to undergo positive deformation or return to its original shape. Please refer to [link to previous embodiment]. Figure 10 , Figure 10 for Figure 8 The flowchart of step S54 of the embodiment shows that the transfer head can be attached to the abnormal LED chip at the corresponding position through the following steps.

[0122] Step S61: Set the distance between the transfer head and the abnormal LED chip to a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the transfer head in the direction perpendicular to the transfer substrate.

[0123] Please continue reading. Figure 9b Based on the above step S53, the distance between the transfer head 42 and the abnormal LED chip 130 is set to a preset spacing; wherein, the preset spacing is less than or equal to the maximum deformation of the transfer head 42 in the direction perpendicular to the transfer substrate 41, so that the transfer head 42 can contact and adhere to the abnormal LED chip 130 after undergoing positive deformation.

[0124] Step S62, cause the transfer head to deform in the forward direction until the transfer head adheres to the abnormal LED chip.

[0125] Please continue reading. Figure 9b and Figure 9c After setting the aforementioned preset spacing, a specific wavelength beam is used to irradiate a portion of the transfer head 42 through the transfer substrate 41. The irradiated transfer head 42 is the one corresponding to the abnormal LED chip 130. After being irradiated, the transfer head 42 undergoes positive deformation, its length in the direction perpendicular to the transfer substrate 41 increases, and it moves closer to the abnormal LED chip 130 until it contacts and adheres to it, thereby obtaining the desired result. Figure 9c The structure shown.

[0126] Furthermore, in the case where the transfer head 42 is deformable, after deforming the transfer head 42 in the positive direction to adhere it to the abnormal LED chip 130, the aforementioned specific wavelength beam can be used again to irradiate the positively deformed transfer head 42 through the transfer substrate 41, causing it to return to its original shape. Its length in the direction perpendicular to the transfer substrate 41 decreases, thus separating the abnormal LED chip 130 from the receiving substrate 11 and following the transfer head 42 away from the receiving substrate 11, resulting in... Figure 9d The structure shown completes the removal of bad pixels.

[0127] This embodiment utilizes a deformable material to prepare the transfer head 42. By using the process of positive deformation and restoration of the original shape, the abnormal LED chip 130 is bonded to the transfer head 42 and the abnormal LED chip 130 is separated from the receiving substrate 11, which can reduce damage to the receiving substrate 11.

[0128] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A repair method, characterized in that, include: A receiving component and a filling component are provided; wherein, the receiving component includes a receiving substrate, and a first surface of the receiving substrate is provided with at least one filling region; the filling component includes a filling substrate and at least one filling member disposed on a second surface of the filling substrate, and at least a portion of the filling member is provided with a filling chip on the side facing away from the filling substrate; the filling member is capable of undergoing positive deformation and returning to its original shape, and the positive deformation increases the length of the filling member in the direction perpendicular to the filling substrate; The second surface is positioned opposite to the first surface, and the replacement chip is attached to the corresponding replacement area, comprising: positioning the second surface opposite to the first surface, and setting the distance between the replacement chip and the replacement area to a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the replacement component in the direction perpendicular to the replacement substrate; causing the replacement component to undergo the positive deformation until the replacement chip is attached to the replacement area; wherein the adhesion force between the replacement chip and the replacement component is less than the adhesion force between the replacement chip and the replacement area; Separating the filler from the filler chip includes: restoring the filler to its original shape to separate the filler from the filler chip.

2. The repair method according to claim 1, characterized in that, The replacement component is made of photosensitive deformation material.

3. The repair method according to claim 1, characterized in that, Before the step of setting the second surface opposite to the first surface and attaching the filler chip to the corresponding filler region, the method further includes: At least one of the replacement elements is disposed on the second surface of the replacement substrate; A first adhesive layer is provided on the side of the replacement component that is away from the replacement substrate; The filler chip is disposed on at least a portion of the first adhesive layer on the side opposite to the filler member; A second adhesive layer is provided on the side of the replacement chip opposite to the first adhesive layer; wherein the adhesiveness of the first adhesive layer is less than that of the second adhesive layer.

4. The repair method according to claim 1, characterized in that, The replacement component is attached to the replacement chip via electrostatic adsorption or vacuum adsorption; the step of setting the second surface opposite to the first surface and attaching the replacement chip to the corresponding replacement area includes: The second surface is positioned opposite to the first surface, and the filling chip is made to contact and adhere to the filling area; Reduce the electrostatic or vacuum adsorption force between the filler and the filler chip to be less than the adhesion force between the filler chip and the filler area.

5. The repair method according to claim 1, characterized in that, The second surface of the filler substrate is provided with a plurality of filler elements, and the arrangement of the filler chips on the second surface is the same as the arrangement of the filler regions on the first surface.

6. The repair method according to any one of claims 1-5, characterized in that, The orthographic projection of the filling element on the filling substrate is less than or equal to the orthographic projection of the filling chip on the filling substrate, and the orthographic projection of the filling chip in the filling region is less than or equal to the filling region.

7. A repair method, characterized in that, include: Multiple LED chips are disposed on the first surface of the receiving substrate; The multiple LED chips are inspected to determine the location of the abnormal LED chip; A transfer substrate is disposed above the first surface, and the transfer head disposed on the transfer substrate corresponds to the position of the abnormal LED chip. The transfer head is brought into contact with the abnormal LED chip at the corresponding position, wherein the bonding force between the abnormal LED chip and the transfer head is greater than the bonding force between the abnormal LED chip and the receiving substrate; Remove the transfer head to separate the abnormal LED chip from the receiving substrate and form a replacement area on the receiving substrate; A replacement component is provided; the replacement component includes a replacement substrate and at least one replacement member disposed on the second surface of the replacement substrate, and at least a portion of the replacement member is provided with a replacement chip on the side away from the replacement substrate; the replacement member is capable of undergoing positive deformation and returning to its original shape, and the positive deformation increases the length of the replacement member in the direction perpendicular to the replacement substrate. The second surface is positioned opposite to the first surface, and the replacement chip is attached to the corresponding replacement area, comprising: positioning the second surface opposite to the first surface, and setting the distance between the replacement chip and the replacement area to a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the replacement component in the direction perpendicular to the replacement substrate; causing the replacement component to undergo the positive deformation until the replacement chip is attached to the replacement area; wherein the adhesion force between the replacement chip and the replacement component is less than the adhesion force between the replacement chip and the replacement area; Separating the filler from the filler chip includes: restoring the filler to its original shape to separate the filler from the filler chip.

8. The repair method according to claim 7, characterized in that, The transfer head is capable of undergoing positive deformation and returning to its original shape, and the positive deformation increases the length of the transfer head in the direction perpendicular to the transfer substrate; The step of attaching the transfer head to the abnormal LED chip at the corresponding position includes: The distance between the transfer head and the abnormal LED chip is set to a preset spacing; wherein the preset spacing is less than or equal to the maximum deformation of the transfer head in the direction perpendicular to the transfer substrate; The transfer head undergoes the positive deformation until it adheres to the abnormal LED chip; The step of removing the transfer head to separate the abnormal LED chip from the receiving substrate and forming the replacement region on the receiving substrate includes: The transfer head is restored to its original shape to separate the abnormal LED chip from the receiving substrate.

9. The repair method according to claim 7, characterized in that, Before the step of setting a transfer substrate above the first surface and aligning the transfer head on the transfer substrate with the position of the abnormal LED chip, the method further includes: A plurality of the transfer heads are disposed on one side surface of the transfer substrate, wherein the arrangement of the transfer heads on the transfer substrate is the same as the arrangement of the LED chips on the receiving substrate; A third adhesive layer is provided on at least a portion of the transfer head on the side opposite to the transfer substrate.

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