Lens module and method for manufacturing lens module

Abstract

A lens module includes a circuit board, an image sensor, a magnet, and a lens. The circuit board includes a first area and a second area connected to each other, the second area and the first area have an angle to form an accommodation space, the second area includes a coil, and the coil is away from the accommodation space; the circuit board also includes a third area and a fourth area connected to each other, the third area is connected to the first area, and the third area is bent; the image sensor is located in the accommodation space and fixedly connected to the first area, and the image sensor is fixedly connected to the coil; the magnet and the coil are arranged at intervals; and the lens is fixedly connected to the magnet and the fourth area; wherein the fixedly connected image sensor and the coil, and the fixedly connected magnet and the lens are elastically connected through the bent third area. The present application also provides a method for manufacturing a lens module.

Description

Technical Field

[0001] The present application relates to the field of lens modules, and in particular to a lens module and a method for manufacturing the lens module. Background Art

[0002] Whether users are shooting in motion or in a non-motion process, the images or videos taken by the lens module are often shaken and blurred due to shaking (such as hand shaking). In order to solve this technical problem, optical image stabilization (OIS) technology has emerged. This technology is a kind of electronic device (such as mobile phones, tablets, etc.) shake detection through structures such as suspension wires, balls or gyroscopes, and then the OIS and voice coil motor (VCM) move the lens in the opposite direction to compensate for the offset of light on the image sensor (CMOS image sensor, CMOS) caused by the shaking of the lens module, thereby effectively overcoming the problem of shaking and blurring of the images or videos taken due to shaking.

[0003] However, the above structure needs to have a separate voice coil motor and an optical image stabilization structure, which results in a larger size of the lens module and does not meet the requirements for component integration. In addition, the pixels of the lens module are related to the size of the image sensor in the lens module. The larger the image sensor size, the higher the pixel. Under the premise that the installation volume of the lens module is limited, the size of the image sensor is limited, which makes it difficult to increase the pixel of the lens module. Summary of the invention

[0004] In view of this, it is necessary to provide a lens module with an anti-shake function and a small size to solve the above technical problems.

[0005] In addition, it is necessary to provide a method for manufacturing a lens module.

[0006] A lens module includes a circuit board, an image sensor, a magnet and a lens. The circuit board includes a first area and a second area connected to each other, the second area and the first area have an angle to form an accommodation space, the second area includes a coil, and the coil is away from the accommodation space; the circuit board also includes a third area and a fourth area connected to each other, the third area is connected to the first area, and the third area is bent; the image sensor is located in the accommodation space and fixedly connected to the first area, and the image sensor is fixedly connected to the coil; the magnet is spaced from the coil; and the lens is fixedly connected to the magnet and the fourth area; wherein the fixedly connected image sensor and the coil, and the fixedly connected magnet and the lens are elastically connected through the bent third area.

[0007] In some embodiments, the bent shape is at least one of a wave shape, a W shape, and an S shape.

[0008] In some embodiments, the circuit board further includes a shaping layer, and the shaping layer is located in a corner area where the third region is bent.

[0009] In some embodiments, the material of the shaping layer is selected from one of polyethylene naphthalate and polyester resin.

[0010] In some embodiments, the lens module further includes a first bracket, the first bracket is accommodated in the accommodating space and fixed on a circuit board located in the first area, and the second area having the coil is fixed on the first bracket.

[0011] In some embodiments, the lens module further includes a second bracket, which is located in a peripheral area of ​​the first bracket and spaced apart from the first bracket, and the circuit board located in the fourth area is fixed on the second bracket.

[0012] In some embodiments, a side of the circuit board located in the fourth region facing away from the coil has a connection pad.

[0013] In some embodiments, the third region is a soft board region.

[0014] A method for manufacturing a lens module includes providing a circuit board, wherein the circuit board includes a first area and a second area connected to each other, the second area is bent toward a side of the first area to form an accommodation space, and the second area has a coil on a side away from the accommodation space; the circuit board also includes a third area and a fourth area connected to each other, the third area is connected to the first area, and the third area is bent; an image sensor is placed in the accommodation space and fixedly connected to the first area, and the image sensor is fixedly connected to the coil; a magnet is spaced apart from the coil; and a lens is fixedly connected to the fourth area and the magnet, so that the image sensor and the coil, and the magnet and the lens are elastically connected through the bent third area.

[0015] In some embodiments, the step of forming a circuit board includes: providing an intermediate body, including a first copper clad laminate, an adhesive layer, and a second copper clad laminate that are stacked, the intermediate body also includes a cavity that penetrates the adhesive layer and is connected to the first copper clad laminate and the second copper clad laminate, the intermediate body includes a product area and a waste area that are connected to each other, and the connection between the product area and the waste area penetrates the cavity; wherein the intermediate body located in the product area is divided into a first area, a second area, a third area, and a fourth area, the first area is an area corresponding to the outside of the cavity in the product area, and the second area is an area where the first copper clad laminate is located between the waste area and the first area The third area and the fourth area are areas where the second copper clad laminate is located between the waste area and the first area, the third area connects the first area and the fourth area, and the fourth area connects the third area and the waste area; the first copper clad laminate and the second copper clad laminate are subjected to circuit manufacturing to obtain a first circuit substrate including a coil, and the coil is located in the product area; insulating layers are covered on two opposite surfaces of the first circuit substrate, and the insulating layers cover at least part of the projection area of ​​the cavity; a part of the first copper clad laminate and a part of the second copper clad laminate corresponding to the cavity are removed; the waste area is removed; and the third area is bent to form a circuit board in which the third area is bent.

[0016] In some embodiments, when the first copper-clad laminate is subjected to circuit fabrication, a coil is formed in the second region; when the second copper-clad laminate is subjected to circuit fabrication, a connection pad is formed in the fourth region.

[0017] In some embodiments, the step of forming a circuit board includes: providing an intermediate body, including a first copper clad laminate, an adhesive layer, and a second copper clad laminate that are stacked, the intermediate body also including a cavity that penetrates the adhesive layer and is connected to the first copper clad laminate and the second copper clad laminate, the intermediate body includes a product area and a waste area that are connected to each other, and the connection between the product area and the waste area penetrates the cavity, wherein the intermediate body located in the product area is divided into a first area, a second area, a third area, and a fourth area, wherein the first area is an area corresponding to the cavity outside the product area, the second area is an area where the first copper clad laminate is located between the waste area and the first area, and the third area and the fourth area are areas where the second copper clad laminate is located between the waste area and the first area. The third area connects the first area and the fourth area, and the fourth area connects the third area and the waste area; the first copper clad laminate and the second copper clad laminate are subjected to circuit making to obtain a first circuit substrate including a coil, and the coil is located in the product area; insulating layers are covered on two opposite surfaces of the first circuit substrate, and the insulating layers cover at least a portion of the projection area of ​​the cavity; the third copper clad laminate and the fourth copper clad laminate are covered on two opposite surfaces of the first circuit substrate, and circuit making is performed on the third copper clad laminate and the fourth copper clad laminate; a portion of the third copper clad laminate and the fourth copper clad laminate corresponding to the cavity is removed to expose the insulating layer; the waste area is removed; and the third area is bent to form a circuit board in which the third area is bent.

[0018] In some embodiments, when the first copper-clad laminate is subjected to circuit fabrication, a coil is formed in the second region; when the fourth copper-clad laminate is subjected to circuit fabrication, a connection pad is formed in the fourth region.

[0019] In some embodiments, the bent shape is at least one of a wave shape, a W shape, and an S shape.

[0020] In some embodiments, the manufacturing method further comprises the step of forming a shaping layer in a corner region located at a bend in the third zone.

[0021] In some embodiments, the material of the shaping layer is selected from one of polyethylene naphthalate and polyester resin.

[0022] In some embodiments, the manufacturing method further includes: accommodating a first bracket in the accommodating space and fixing it in the first area, and fixing the second area on the first bracket.

[0023] In some embodiments, the manufacturing method further includes: placing a second bracket in the peripheral area of ​​the first bracket and spaced apart from the first bracket, fixing a magnet on a side of the second bracket facing the coil, and fixing the fourth area and the lens on the second bracket.

[0024] The lens module provided by the present application includes a circuit board, an image sensor, a magnet and a lens. Among them, there is a coil on the circuit board, the coil is fixedly connected to the image sensor, the magnet is fixedly connected to the lens, the fixedly connected image sensor and the coil, and the fixedly connected magnet and the lens are elastically connected through a bent soft board area. When the lens module is shaken by an external force, the lens and the magnet shake synchronously and drive the image sensor and the coil to move synchronously through the bent soft board area, compensating for the offset of the light on the image sensor caused by the shaking of the lens module, thereby effectively overcoming the problem of shaking and blurring of the captured image or video caused by shaking. The coil is formed on the circuit board, and the magnet and the coil are spaced and correspondingly arranged. On the premise of meeting the function of the lens module, it replaces the additionally arranged voice coil motor, effectively reducing the volume of the lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic cross-sectional view of an intermediate provided in an embodiment of the present application.

[0026] Figure 2 For Figure 1 The schematic cross-sectional view of the first circuit substrate formed by circuit fabrication of the intermediate shown.

[0027] Figure 3 For Figure 2 The schematic cross-sectional view of the surface of the first circuit substrate being covered with an insulating layer is shown.

[0028] Figure 4For Figure 3 The schematic cross-sectional view of the surface of the first circuit substrate covered with the third copper clad laminate and the fourth copper clad laminate is shown.

[0029] Figure 5 For Figure 4 The third copper clad laminate and the fourth copper clad laminate are schematic cross-sectional views after circuits are fabricated and the laminate is covered with a solder mask.

[0030] Figure 6 This is a cross-sectional schematic diagram of the third copper clad laminate and the fourth copper clad laminate after parts of the circuits are removed.

[0031] Figure 7 for Figure 6 A schematic cross-sectional view of the circuit board obtained after the scrap area is shown.

[0032] Figure 8 for Figure 7 A top view of the circuit board is shown.

[0033] Fig. 9 For an embodiment Figure 7 The schematic diagram of the bent structure formed after the circuit board located in the third zone is bent is shown.

[0034] Fig.10 For another embodiment Figure 7 The schematic diagram of the bent structure formed after the circuit board located in the third zone is bent is shown.

[0035] Fig.11 To combine the image sensor with Figure 7 A cross-sectional schematic diagram showing the second zone being fixedly connected and the magnet being fixedly connected to the fourth zone.

[0036] Fig.12 To combine the lens with Fig.11 The cross-sectional schematic diagram of the lens module obtained after the structure shown is assembled.

[0037] Fig.13 In one embodiment, Fig.12 A top view of a lens module connected to a connector.

[0038] Fig.14 For another embodiment Fig.12 A top view of a lens module connected to a connector.

[0039] Main component symbols

[0040]

[0041]

[0042] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0043] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0045] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0046] See also Figures 1 to 14 The present application embodiment provides a method for manufacturing a lens module 200 with an anti-shake function and a small size, comprising the following steps:

[0047] Step S1: Please refer to Figure 7 and Figure 8 A circuit board 100 is provided. The circuit board 100 includes a first region I and a second region II connected to each other. The second region II is bent toward one side of the first region I to form an accommodation space 70 (see Fig.11 ), the second zone II has a coil 212 on one side away from the accommodating space 70; the circuit board 100 also includes a third zone III and a fourth zone IV connected to each other, and the fourth zone IV and the second zone II are respectively located on both sides of the circuit board 100; the third zone III is connected to the first zone I, and the third zone III is bent.

[0048] The circuit board 100 includes a dielectric layer and a circuit layer that are stacked. The number of circuit layers is at least two, and the multiple circuit layers can be electrically connected to each other.

[0049] The circuit board 100 can be a flexible board or a rigid-flexible board, wherein the third area III is a flexible board area.

[0050] See also Figures 1 to 10 , the circuit board 100 can be formed by the following steps:

[0051] Step S11: Please refer to Figure 1 , providing an intermediate 10, including a first copper clad laminate 11, an adhesive layer 13 and a second copper clad laminate 15 which are stacked, the intermediate 10 also includes a cavity 132 that penetrates the adhesive layer 13 and is connected to the first copper clad laminate 11 and the second copper clad laminate 15, the intermediate 10 includes a product area A and a waste area B that are connected to each other, and the connection between the product area A and the waste area B penetrates the cavity 132.

[0052] The intermediate 10 located in the product area A is divided into a first area I, a second area II, a third area III and a fourth area IV. The first area I is the area corresponding to the area outside the cavity 132 in the product area A; the second area II is the area where the first copper clad laminate 11 is located between the waste area B and the first area I; the third area III and the fourth area IV are the areas where the second copper clad laminate 15 is located between the waste area B and the first area I, the third area III connects the first area I and the fourth area IV, and the fourth area IV connects the third area III and the waste area B, that is, the third area III and the fourth area IV are adjacent, and the third area III and the fourth area IV are spaced apart from the second area II by the cavity 132. In this embodiment, the projection area of ​​the third area III and the fourth area IV on the bonding layer 13 coincides with the projection area of ​​the second area II on the plane where the bonding layer 13 is located, which is not limited in other embodiments.

[0053] The number of the second area II, the third area III and the fourth area IV is equal, and they are multiple. In this embodiment, the number of the second area II, the third area III and the fourth area IV are all four areas, and the four second areas II, the third area III and the fourth area IV extend along four different extension directions of the intermediate body 10, so that the multiple second areas II of the circuit board 100 formed subsequently can be bent along one side of the first area I to enclose the accommodation space 70.

[0054] The first copper clad board 11 includes a first dielectric layer 112 and a first copper layer 114. The first copper layer 114 is located on the surface of the first dielectric layer 112 away from the bonding layer 13. The second copper clad board 15 includes a second dielectric layer 152 and a second copper layer 154. The second copper layer 154 is located on the surface of the second dielectric layer 152 away from the bonding layer 13.

[0055] The material of the first dielectric layer 112 and the second dielectric layer 152 can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), so that the subsequently formed circuit board 100 has flexibility.

[0056] The step of forming the intermediate body 10 can be formed by respectively pressing the first copper clad laminate 11 and the second copper clad laminate 15 on the opposite surfaces of an adhesive layer 13 having a through hole (not shown). The first copper clad laminate 11 and the second copper clad laminate 15 cover both sides of the through hole so that the through hole forms a cavity 132. The cavity 132 is provided to facilitate subsequent cutting in the area where the cavity 132 is located, so that the formed circuit board 100 has two parts separated from each other.

[0057] Among them, the waste area B has an adhesive layer 13. In the step of pressing the first copper clad laminate 11, the insulating layer 30 and the second copper clad laminate 15, the adhesive layer 13 located in the waste area B has a supporting function to prevent the first dielectric layer 112 and / or the second dielectric layer 152 from filling the cavity 132, which makes it difficult to separate the first dielectric layer 112 and the second dielectric layer 152 subsequently.

[0058] Step S12: Please refer to Figure 2 , circuits are fabricated on the first copper clad laminate 11 and the second copper clad laminate 15 to obtain a first circuit substrate 20 including a coil 212 , and the coil 212 is located in the product area A.

[0059] The first copper layer 114 is subjected to circuit fabrication to form the first circuit layer 21. The step of forming the first circuit layer 21 also includes fabricating thick copper thin circuits to form a coil 212, and the area of ​​the coil 212 corresponds to the area of ​​the cavity 132, that is, the coil 212 is located in the second area II, and is located in the area where the product area A is adjacent to the waste area B.

[0060] The second copper layer 154 is subjected to circuit fabrication to form a second circuit layer 23. The second circuit layer 23 and the first circuit layer 21 may be electrically connected via a conductive via 25. In this embodiment, the conductive via 25 is located in the first region I.

[0061] In some embodiments, for example, when no circuit layer is formed on the side where the second copper clad board 15 is located later, the step of forming the second circuit layer 23 may include the step of forming a connection pad 532, and the connection pad 532 is used to connect the circuit board 100 to the external circuit. The connection pad 532 roughly corresponds to the position of the coil 212, that is, the connection pad 532 is located in the fourth area IV, the area of ​​the connection pad 532 corresponds to the area of ​​the cavity 132, and the connection pad 532 is located in the area of ​​the product area A adjacent to the waste area B. In this embodiment, there is a step of forming a circuit layer on a surface where the second copper clad board 15 is located later, so in this embodiment, when the second circuit layer 23 is formed, no connection pad (not shown) for connecting to the external circuit is formed.

[0062] Step S13: Please refer to Figure 3 The insulating layer 30 is covered on two opposite surfaces of the first circuit substrate 20 , and the insulating layer 30 covers at least a portion of the projection area of ​​the cavity 132 .

[0063] In this embodiment, the insulating layer 30 located on one surface of the first circuit substrate 20 is located in part of the first area I and the entire second area II, and also extends to the waste area B, and the insulating layer 30 located on the other surface of the first circuit substrate 20 is located in part of the first area I and the entire third area III and fourth area IV, and also extends to the waste area B. In other embodiments, the area covered by the insulating layer 30 can be adjusted as needed to cover at least part of the projection area of ​​the cavity 132. The insulating layer 30 is used to facilitate the subsequent uncapping process in the area where the insulating layer 30 is located, such as facilitating the removal of the copper clad plate covering the surface of the insulating layer 30; and it is also convenient to protect the first circuit layer 21 and the second circuit layer 23 after uncapping to prevent the first circuit layer 21 and the second circuit layer 23 from being oxidized.

[0064] Step S14: Please refer to Figure 4 The third copper clad laminate 45 and the fourth copper clad laminate 55 are covered on two opposite surfaces of the first circuit substrate 20 .

[0065] The third copper clad laminate 45 includes a third dielectric layer 41 and a third copper layer 452 stacked together, and the third dielectric layer 41 covers the first circuit layer 21 and the first dielectric layer 112; the fourth copper clad laminate 55 includes a fourth dielectric layer 51 and a fourth copper layer 552 stacked together, and the fourth dielectric layer 51 covers the second circuit layer 23 and the second dielectric layer 152.

[0066] The material of the third dielectric layer 41 and the fourth dielectric layer 51 can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), or can be selected from one of hard materials such as polypropylene (PP) and polytetrafluoroethylene (PTFE).

[0067] Step S15: Please refer to Figure 5 , circuits are fabricated on the third copper clad laminate 45 and the fourth copper clad laminate 55 .

[0068] The third copper layer 452 is processed to form a third circuit layer 43, and the fourth copper layer 552 is processed to form a fourth circuit layer 53. In this embodiment, the step of forming the fourth circuit layer 53 also includes the step of forming the fourth copper layer 552 located in the fourth region IV into a connection pad 532.

[0069] In step S5 , a step of forming a solder mask layer 60 may be further included. The solder mask layer 60 covers the third dielectric layer 41 and the third circuit layer 43 , and also covers the fourth dielectric layer 51 and the fourth circuit layer 53 .

[0070] In some embodiments, when covering the third copper clad laminate 45 and the fourth copper clad laminate 55 is omitted, the solder mask 60 covers the first dielectric layer 112 and the first circuit layer 21 , and also covers the second dielectric layer 152 and the second circuit layer 23 .

[0071] Step S16: Please refer to Figure 6 , a portion of the third copper clad laminate 45 corresponding to the cavity 132 and a portion of the fourth copper clad laminate 55 corresponding to the cavity 132 are removed to expose the insulating layer 30 .

[0072] Specifically, after partially removing the third copper clad laminate 45 located in the second zone II, the second circuit substrate 40 is obtained to expose the insulating layer 30 and retain the portion corresponding to the coil 212; after completely removing the fourth copper clad laminate 55 located in the third zone III, the third circuit substrate 50 is obtained to expose the insulating layer 30, so that the circuit substrate located in the third zone III has flexibility.

[0073] It is understandable that the number of circuit layers in the second circuit substrate 40 and the third circuit substrate 50 is not limited to one layer, and can be multiple layers, that is, in some embodiments, the step of covering the third copper clad plate 45 and forming the third circuit layer 43 can be omitted according to the number of circuit layers required, or the step of covering the third circuit substrate 50 and forming the third circuit layer 43 can be repeated. Similarly, the step of forming the connection pad 532 located in the fourth area IV can be formed in other steps. The above steps of forming the second circuit substrate 40 and the third circuit substrate 50 are only illustrative and are not intended to be limiting.

[0074] Step S17: Please refer to Figure 7 , remove waste area B.

[0075] The waste area B is cut and removed along the connection between the waste area B and the product area A, and the cut area passes through the cavity 132, so that the second area II and the fourth area IV can be separated.

[0076] Step S18: Please refer to Figure 8 , the third region III is bent to form a circuit board 100 in which the third region III is bent.

[0077] In this embodiment, the third circuit substrate 50 located in the third area III is bent to form a bent circuit board 100. The bent shape includes but is not limited to a wave shape, a W shape, and an S shape.

[0078] See also Fig. 9 as well as Fig.10 In some embodiments, the manufacturing method further includes the step of forming a shaping layer 80 in the third region III, and the shaping layer 80 is located in the corner area of ​​the third region III, so as to facilitate shaping after the third region III is bent. Then, the material of the shaping layer 80 needs to have a certain hardness, and the hardness of the material of the shaping layer 80 is greater than the hardness of the dielectric layer (i.e., the third dielectric layer 41) in the bending area, so as to avoid restoring deformation under its own force. It can be understood that the material of the shaping layer 80 itself also needs to have a certain toughness, and under the effect of shaping, when the third region III is deformed by external force, the original bending state of the third region III can be restored, so that the third region III has an elastic effect. The material of the shaping layer 80 can be selected from resin materials such as polyethylene naphthalate diformic acid glycol ester (PEN), polyester resin (PET), etc.

[0079] Step S2: Please refer to Fig.11, an image sensor 210 is placed in the accommodating space 70 and fixedly connected to the first area I, and the image sensor 210 is fixedly connected to the coil 212.

[0080] In this embodiment, the image sensor 210 is fixed to a side located in the first area I and having the coil 212, and then the four second areas II are bent toward the side where the image sensor 210 is located to form a receiving space 70 for receiving the image sensor 210, and the coil 212 is away from the receiving space 70, wherein the image sensor 210 is electrically connected to the circuit board 100.

[0081] It is understandable that in some implementations, the accommodating space 70 may be formed first, and then the image sensor 210 may be placed in the accommodating space 70 and electrically connected to the circuit board 100 .

[0082] In some embodiments, a first bracket 240 is accommodated in the accommodating space 70 and fixed on the solder mask 60 located in the first area I, that is, the first bracket 240 is located on the side of the first area I having the image sensor 210; and then the second area II having the coil 212 is fixed on the first bracket 240, so that the image sensor 210 is fixedly connected to the coil 212.

[0083] In some embodiments, the manufacturing method further includes the step of fixing a filter 260 on the first bracket 240 , where the filter 260 is located on a side of the image sensor 210 facing away from the circuit board 100 and is spaced apart from the image sensor 210 .

[0084] Step S3: Please refer to Fig.12 , a magnet 220 is spaced apart from the coil 212 .

[0085] In this embodiment, a second bracket 250 is provided, the second bracket 250 is located in the peripheral area of ​​the first bracket 240 and is spaced apart from the first bracket 240, the magnet 220 is fixed to the side of the second bracket 250 facing the coil 212, and the magnet 220 is spaced apart from the coil 212. The first dielectric layer 112 on the surface of the coil 212 facing the magnet 220 can be removed to prevent other substances between the coil 212 and the magnet 220 from affecting the anti-shake performance of the lens module 200.

[0086] Step S4: Please refer again Fig.12 , a lens 230 is fixedly connected to the fourth area IV and the magnet 220, so that the image sensor 210 and the coil 212 and the magnet 220 and the lens 230 are elastically connected through the bent third area III.

[0087] The lens 230 is fixed to the second bracket 250, so that the magnet 220 is fixedly connected to the lens 230. In addition, the circuit board 100 located in the fourth area IV is fixed to the second bracket 250. The fourth area IV is connected to the first area I through the bent third area III, and the fourth area IV is elastically connected to the first area I, so that the fixedly connected image sensor 210 and the coil 212 and the fixedly connected magnet 220 and the lens 230 are elastically connected through the bent third area III.

[0088] In some embodiments, see Fig.13 and Fig.14 The manufacturing method also includes the step of forming a connector 90 on the circuit board 100. The formation of the connector 90 can be similar to the step of forming the circuit board 100 located in the second zone II, the third zone III and the fourth zone IV. The position of the connector 90 is not limited, and it can be electrically connected to the circuit board 100.

[0089] See also Fig.12 The embodiment of the present application also provides a lens module 200 with an anti-shake function and a small size. The lens module 200 can be manufactured by the above manufacturing method.

[0090] The lens module 200 includes a circuit board 100, an image sensor 210, a magnet 220 and a lens 230. The circuit board 100 has a coil 212, the coil 212 is fixedly connected to the image sensor 210, the magnet 220 is fixedly connected to the lens 230, and the fixedly connected image sensor 210 and the coil 212 and the fixedly connected magnet 220 and the lens 230 are elastically connected.

[0091] The circuit board 100 includes a first area I and a second area II connected to each other. The number of the second areas II is multiple, and the multiple second areas II are respectively arranged on the periphery of the first area I and are symmetrically arranged. In this embodiment, the number of the second areas II is four, and the four second areas II and the first area I have an angle to form an accommodating space 70. The second area II includes a coil 212, and the coil 212 is away from the accommodating space 70.

[0092] The circuit board 100 further includes a third area III and a fourth area IV connected to each other, the third area III is connected to the first area I, the third area III is bent, and the bent shape includes but is not limited to a wave shape, a W shape, and an S shape. The number of the third area III and the fourth area IV is the same as the number of the second area II, and in this embodiment, both are four.

[0093] The circuit board 100 can be a soft board or a hard-soft board, wherein the third area III is a soft board area. The circuit board 100 is a multi-layer circuit board 100, and the circuit board 100 includes a dielectric layer and a circuit layer stacked in layers, and the circuit layers are electrically connected.

[0094] In this embodiment, the circuit board 100 includes a first circuit substrate 20, and a second circuit substrate 40 and a third circuit substrate 50 respectively located on two opposite surfaces of the first circuit substrate 20. The coil 212 is disposed on the first circuit substrate 20 located in the second area II; the third circuit substrate 50 is located in the first area I and the fourth area IV, and a connection pad 532 for connecting to an external circuit is disposed on the third circuit substrate 50 located in the fourth area IV.

[0095] In some implementations, the second circuit substrate 40 and the third circuit substrate 50 may be omitted, and the coil 212 and the connection pad 532 may be disposed on the first circuit substrate 20 .

[0096] The material of the dielectric layer in the first circuit substrate 20 can be selected from one of the flexible materials such as polyimide, liquid crystal polymer and modified polyimide; the dielectric layer in the second circuit substrate 40 and the third circuit substrate 50 can be selected from one of the flexible materials such as polyimide, liquid crystal polymer and modified polyimide, or can be selected from one of the hard materials such as polypropylene and polytetrafluoroethylene.

[0097] The image sensor 210 is accommodated in the accommodation space 70 and fixed to the surface of the circuit board 100 located in the first area I. The image sensor 210 is electrically connected to the circuit board 100 .

[0098] The coil 212 can be fixedly connected to the image sensor 210 through the first bracket 240. Specifically, the first bracket 240 is accommodated in the accommodation space 70 and fixed to the surface of the circuit board 100 located in the first area I, and the second area II including the coil 212 is fixed on the first bracket 240 and away from the side of the accommodation space 70, so that the coil 212 and the image sensor 210 are fixedly connected.

[0099] The magnet 220 can be fixedly connected to the lens 230 through a second bracket 250 and spaced apart from the coil 212. Specifically, the second bracket 250 is disposed in the peripheral area of ​​the first bracket 240 and spaced apart from the first bracket 240, the circuit board 100 is passed through the second bracket 250, the first area I is inside the second bracket 250, the magnet 220 is fixed to the side of the second bracket 250 facing the coil 212 and spaced apart from the coil 212. The lens 230 is fixed to the second bracket 250, and the lens 230 is located on the side of the image sensor 210 away from the circuit board 100, so as to achieve a fixed connection between the magnet 220 and the lens 230.

[0100] The circuit board 100 located in the fourth area IV is fixed to the second bracket 250 from the outside of the second bracket 250. The fourth area IV is elastically connected to the first area I through the bent third area III, so that the fixedly connected image sensor 210 and the coil 212 and the fixedly connected magnet 220 and the lens 230 are elastically connected through the bent third area III. In other embodiments, the method of fixing the first bracket 240 and the second bracket 250 can be adjusted as needed, and is not limited thereto.

[0101] In some embodiments, the circuit board 100 further includes a shaping layer 80, which is located in the corner area of ​​the third zone III and on the surface of the insulating layer 30. The material of the shaping layer 80 needs to have a certain hardness, and the hardness of the material of the shaping layer 80 is greater than the hardness of the dielectric layer (i.e., the third dielectric layer 41) in the bending area to avoid restoring deformation under its own force. It can be understood that the material of the shaping layer 80 itself also needs to have a certain toughness. Under the shaping effect, when the third zone III is deformed by an external force, the original bending state of the third zone III can be restored, thereby making the third zone III have an elastic effect. The material of the shaping layer 80 can be selected from resin materials such as polyethylene naphthalate, polyester resin, etc.

[0102] In some embodiments, the lens module 200 further includes a filter 260 , which can be fixed to the first bracket 240 . The filter 260 is located between the image sensor 210 and the lens 230 , and is spaced apart from the image sensor 210 and the lens 230 , respectively.

[0103] In some embodiments, the lens module 200 further includes a connector 90 , and the connector 90 is electrically connected to the circuit board 100 . The position of the connector 90 is not limited, and it only needs to be electrically connected to the circuit board 100 .

[0104] The lens module 200 provided in the present application includes a circuit board 100, an image sensor 210, a magnet 220 and a lens 230. Among them, the circuit board 100 has a coil 212, the coil 212 is fixedly connected to the image sensor 210, the magnet 220 is fixedly connected to the lens 230, the fixedly connected image sensor 210 and the coil 212, and the fixedly connected magnet 220 and the lens 230 are elastically connected through a bent soft board area. When the lens module 200 is shaken by an external force, the lens 230 and the magnet 220 shake synchronously and drive the image sensor 210 and the coil 212 to move synchronously through the bent soft board area, compensating for the offset of the light on the image sensor 210 caused by the shaking of the lens module 200, thereby effectively overcoming the problem of shaking and blurring of the image or video shot due to shaking. The coil 212 is formed on the circuit board 100 , and the magnet 220 is spaced apart from and correspondingly arranged to replace the additionally arranged voice coil motor while satisfying the functions of the lens module 200 , thereby effectively reducing the volume of the lens module 200 .

[0105] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A lens module, characterized in that: include: A circuit board, comprising a first area and a second area connected to each other, wherein the second area and the first area have an angle to form an accommodation space, and the second area comprises a coil, and the coil is away from the accommodation space; the circuit board also comprises a third area and a fourth area connected to each other, the third area is connected to the first area, and the third area is bent; An image sensor is located in the accommodating space and fixedly connected to the first area, and the image sensor is fixedly connected to the coil; A magnet is spaced apart from the coil; as well as A lens, fixedly connected to the magnet and the fourth area; The fixedly connected image sensor and the coil as well as the fixedly connected magnet and the lens are elastically connected via the bent third area.

2. The lens module according to claim 1, characterized in that: The circuit board further includes a shaping layer, and the shaping layer is located at a corner area where the third area is bent.

3. The lens module according to claim 1, characterized in that: The lens module also includes a first bracket, which is accommodated in the accommodating space and fixed on the circuit board located in the first area, and the second area having the coil is fixed on the first bracket.

4. The lens module according to claim 3, characterized in that: The lens module also includes a second bracket, which is located in the peripheral area of ​​the first bracket and is spaced apart from the first bracket. The circuit board located in the fourth area is fixed on the second bracket.

5. The lens module according to claim 4, characterized in that: A side of the circuit board located in the fourth area facing away from the coil has a connection pad.

6. A method for manufacturing a lens module, characterized in that: include: A circuit board is provided, the circuit board comprising a first area and a second area connected to each other, the second area is bent toward a side of the first area to form an accommodation space, and a side of the second area away from the accommodation space has a coil; the circuit board also comprises a third area and a fourth area connected to each other, the third area is connected to the first area, and the third area is bent; Placing an image sensor in the accommodating space and fixedly connected to the first area, wherein the image sensor is fixedly connected to the coil; Disposing a magnet spaced apart from the coil; and A lens is fixedly connected to the fourth area and the magnet, so that the image sensor and the coil, and the magnet and the lens are elastically connected through the bent third area.

7. The method for manufacturing a lens module according to claim 6, characterized in that: The steps of forming the circuit board include: An intermediate is provided, comprising a first copper clad laminate, an adhesive layer and a second copper clad laminate which are stacked, the intermediate further comprising a cavity penetrating the adhesive layer and connected to the first copper clad laminate and the second copper clad laminate, the intermediate comprising a product area and a waste area connected to each other, the connection between the product area and the waste area penetrating the cavity; wherein the intermediate located in the product area is divided into a first area, a second area, a third area and a fourth area, the first area being an area corresponding to the outside of the cavity in the product area, the second area being an area between the waste area and the first area where the first copper clad laminate is located, the third area and the fourth area being areas between the waste area and the first area where the second copper clad laminate is located, the third area connecting the first area and the fourth area, and the fourth area connecting the third area and the waste area; Performing circuit fabrication on the first copper-clad laminate and the second copper-clad laminate to obtain a first circuit substrate including a coil, wherein the coil is located in the product area; Covering two opposite surfaces of the first circuit substrate with an insulating layer, wherein the insulating layer covers at least a portion of a projection area of ​​the cavity; Removing a portion of the first copper clad laminate and a portion of the second copper clad laminate corresponding to the cavity; removing the waste area; and The third area is subjected to a bending process to form the circuit board in which the third area is in a bent shape.

8. The method for manufacturing a lens module according to claim 7, characterized in that: When the first copper-clad laminate is subjected to circuit manufacturing, the coil is formed in the second region; when the second copper-clad laminate is subjected to circuit manufacturing, a connection pad is formed in the fourth region.

9. The method for manufacturing a lens module according to claim 6, characterized in that: The manufacturing method further comprises the step of forming a shaping layer in a corner region located at a bend of the third zone.

10. The method for manufacturing a lens module according to claim 6, characterized in that: The production method further comprises: A first bracket is accommodated in the accommodation space and fixed in the first area, and the second area is fixed on the first bracket.

11. The method for manufacturing a lens module according to claim 10, characterized in that: The production method further comprises: A second bracket is placed in the peripheral area of ​​the first bracket and spaced apart from the first bracket, the magnet is fixed to a side of the second bracket facing the coil, and the fourth area and the lens are fixed to the second bracket.

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