Chip loading structure, analysis device and analysis system

Abstract

A chip loading structure (2), an analysis device (100) and an analysis system (300), the chip loading structure (2) includes a loading plate body (21), and an accommodation space for accommodating a detection chip (1) is provided inside the loading plate body (21); a first hollowed-out area (23) and at least one second hollowed-out area (24) that penetrate through to the accommodation space are provided on the first plate surface (2a) of the loading plate body (21), wherein the first hollowed-out area (23) is used to expose the reaction observation area (24) of the detection chip (1); at least one second hollowed-out area (24) is used to expose at least one reagent port of the detection chip (1); a connection part (27) is further provided on the loading plate body (21), and the connection part (27) can be detachably connected to a transport part (110) for transporting the loading plate body (21) in the analysis device (100).

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a chip loading structure, an analysis device, and an analysis system. Background Art

[0002] Digital polymerase chain reaction chip technology (dPCR) fully dilutes nucleic acid samples so that the number of sample templates in each reaction chamber is less than or equal to 1, thereby achieving absolute quantification of single-molecule DNA. Due to its advantages such as high sensitivity, strong specificity, relatively high detection throughput, and accurate quantification, it is widely used in clinical diagnosis, gene instability analysis, single-cell gene expression, environmental microorganism detection, prenatal diagnosis, and other aspects. Summary of the Invention

[0003] At least one embodiment of the present disclosure provides a chip loading structure, which includes a loading plate body having an accommodation space for accommodating a detection chip.

[0004] A first hollowed-out area and at least one second hollowed-out area that penetrate through to the accommodation space are provided on a first plate surface of the loading plate body. Among them, the first hollowed-out area is used to expose a reaction observation area of the detection chip; at least one of the second hollowed-out areas is used to expose at least one reagent port of the detection chip.

[0005] A connecting portion is further provided on the loading plate body, and the connecting portion can be detachably connected to a transport portion in the analysis device for transporting the loading plate body.

[0006] Optionally, a first recessed portion is provided on the first plate surface and at the position where the first hollowed-out area is located. The orthographic projection area of the first recessed portion on the first plate surface is larger than the orthographic projection area of the first hollowed-out area on the first plate surface, and the orthographic projection of the first recessed portion on the first plate surface completely covers the orthographic projection of the first hollowed-out area on the first plate surface.

[0007] Optionally, the shape of the orthographic projection of the first hollowed-out area on the first plate surface includes a square, a rectangle, or a circle.

[0008] Optionally, there are multiple second hollowed-out areas, which are spaced along a first axis of the first plate surface. The direction of the first axis when the loading plate body is placed on the transport portion is parallel to a first moving direction in which the transport portion moves into the analysis device.

[0009] Optionally, on the first board surface, a second recess is provided at the position of each second hollow area, the orthographic projection area of the second recess on the first board surface is larger than the orthographic projection area of the second hollow area on the first board surface, and the orthographic projection of the second recess on the first board surface completely covers the orthographic projection of the second hollow area on the first board surface.

[0010] Optionally, when the loading board body is placed on the transport part, the orthographic projection area of the second recess at the rear in the first moving direction on the first board surface is larger than the orthographic projection area of the second recess at the front in the first moving direction on the first board surface;

[0011] The orthographic projection of the second recess at the rear in the first moving direction on the first board surface is an oblong hole; the orthographic projection of the second recess at the front in the first moving direction on the first board surface is a round hole.

[0012] Optionally, the detection chip further has a heating electrode; a third hollow area penetrating through to the accommodation space is provided on the first board surface for exposing the heating electrode.

[0013] Optionally, the third hollow area extends to the first side edge of the first board surface;

[0014] The first side edge is perpendicular to the first axis of the first board surface; the direction of the first axis when the loading board body is placed on the transport part is parallel to the first moving direction in which the transport part moves into the analysis device, and the first side edge is the side edge at the front in the first moving direction.

[0015] Optionally, a receiving groove is provided on the second board surface of the loading board body opposite to the first board surface to form the accommodation space, and a protruding structure is provided on the inner side surface of the receiving groove to limit the detection chip in the receiving groove.

[0016] Optionally, the protruding structure includes two groups of convex part groups distributed on both sides of the first axis of the first board surface. Each group of convex part groups includes a plurality of convex parts spaced along the first axis. Each convex part protrudes from the inner side surface of the receiving groove towards the direction close to the first axis to abut against the side surface of the detection chip placed in the receiving groove;

[0017] The direction of the first axis when the loading board body is placed on the transport part is parallel to the first moving direction in which the transport part moves into the analysis device.

[0018] Optionally, the orthographic projection shape of the convex part on the second board surface includes an arc shape.

[0019] Optionally, the accommodating groove extends to the second side edge of the second plate surface;

[0020] The second side edge is perpendicular to the first axis of the first plate surface; the direction of the first axis when the loading plate body is placed on the conveying part is parallel to the first moving direction in which the conveying part moves into the analysis device, and the second side edge is the side edge that is forward in the first moving direction.

[0021] Optionally, slot groups are respectively arranged on two side surfaces of the loading body on both sides of the first axis of the first plate surface, and each slot group includes one or a plurality of slots arranged at intervals along the first axis. The slots are used for the connecting parts to be inserted into the plug-in parts in the conveying part one by one; the direction of the first axis when the loading plate body is placed on the conveying part is parallel to the first moving direction in which the conveying part moves into the analysis device.

[0022] Optionally, an insertion opening communicating with the slot is arranged on the second plate surface of the loading plate body opposite to the first plate surface for the corresponding plug-in part to move into or out of the slot; and, a limiting convex part protruding towards the direction close to the second axis is arranged on the side surface of the slot on one side of its second axis, so as to limit the plug-in part in the slot when the plug-in part moves to the interval position between the limiting convex part and the bottom surface of the slot opposite thereto; the second axis of the slot is parallel to the moving direction of the plug-in part moving into or out of the slot.

[0023] At least one embodiment of the present disclosure further provides an analysis device, including: a loading part, a conveying part, a temperature control part and a signal detection part, wherein,

[0024] The loading part adopts the above-mentioned chip loading structure provided by at least one embodiment of the present disclosure, is used for carrying a detection chip, and can be detachably connected to the conveying part;

[0025] The conveying part is configured to convey the chip loading structure;

[0026] The temperature control part includes a heater and a cooler, wherein the heater is configured to heat the detection chip, and the cooler is configured to cool the detection chip; and

[0027] The signal detection part includes an optical sensor, wherein the optical sensor is configured to receive light from the detection chip and perform detection according to the light.

[0028] Optionally, the conveying part includes:

[0029] A transport structure configured to carry the chip loading structure and capable of being at least partially driven; and

[0030] A driver configured to be able to drive the transport structure to reciprocate the chip loading structure between a first position, a second position, and a third position,

[0031] wherein the first position allows the chip loading structure to be received in the transport structure;

[0032] the second position allows the temperature control unit to adjust the temperature of the detection chip; and

[0033] the third position allows the optical sensor of the signal detection unit to receive the light from the detection chip.

[0034] Optionally, the transport structure includes:

[0035] A stage configured to carry the chip loading structure in use;

[0036] A movable platform configured to be connected to the driver to move under the drive of the driver; and

[0037] A bracket configured to connect the stage and the movable platform, whereby the stage can be driven when the movable platform is driven.

[0038] Optionally, the loading part adopts the above chip loading structure provided by at least one embodiment of the present disclosure;

[0039] An installation groove for accommodating the loading plate body is provided on the bearing surface of the stage, and an installation groove opening communicating with the installation groove is provided on the first side surface of the stage for the loading plate body to move into or out of the installation groove. The first side surface is perpendicular to the first moving direction in which the stage moves into the analysis device and is the side surface facing backward in the first moving direction;

[0040] And, a plug-in member protruding from the side surface of the installation groove toward the direction of the third axis close to the installation groove is further provided on the stage; the third axis is parallel to the first moving direction.

[0041] Optionally, the loading part adopts the above chip loading structure provided by at least one embodiment of the present disclosure;

[0042] The heater includes at least one contact electrode, and at least one of the contact electrodes is configured to be in electrical contact with at least one of the heating electrodes of the detection chip in use one by one;

[0043] The heater is further configured to apply an electrical signal to the heating electrode of the detection chip through the contact electrode, so as to heat the detection chip by the heating electrode.

[0044] Optionally, the contact electrode is fixed on the bearing surface of the stage and located on the side of the mounting groove opposite to the opening of the mounting groove, and one end of the contact electrode protrudes in a direction opposite to the first moving direction in which the stage is moved into the analysis device relative to the side surface of the mounting groove;

[0045] The contact electrode is provided with a contact portion for making electrical contact with the heating electrode, and the contact portion protrudes in a direction close to the heating electrode relative to the surface of the contact electrode opposite to the heating electrode; and, the heater further includes an elastic member, and the elastic member is respectively connected to the contact electrode and the stage to apply a pulling force towards the bearing surface of the stage to the contact electrode.

[0046] Optionally, the elastic member includes a spring.

[0047] Optionally, an electrode slot is provided on the bearing surface of the stage, the contact electrode is inserted into the electrode slot, and the contact electrode and the stage are fixedly connected by a fastener.

[0048] Optionally, the signal detection unit further includes:

[0049] A light source configured to provide light to irradiate the detection chip during use;

[0050] A light transmission unit configured to transmit the light provided by the light source to the detection chip during use and transmit the light emitted by the detection chip to the optical sensor; and

[0051] A bracket for fixing and carrying the light source and the light transmission unit, and a focal length adjustment structure is further provided on the bracket, and the focal length adjustment structure is configured to adjust the distance between the light transmission unit and the detection chip so that the detection chip is located at the focal point of the light transmission unit; and, the focal length adjustment structure has a focal length adjustment knob and a knob extension part connected to the focal length adjustment knob, and the knob extension part extends to a side close to the light transmission unit for easy manual adjustment.

[0052] At least one embodiment of the present disclosure further provides an analysis system, including:

[0053] The above analysis device provided by at least one embodiment of the present disclosure; and

[0054] The detection chip. Description of the Drawings

[0055] To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description only relate to some embodiments of the present disclosure and do not limit the present disclosure.

[0056] Figure 1 is a schematic block diagram of a detection chip according to at least one embodiment of the present disclosure.

[0057] Figure 2A is a front view structure diagram of a chip loading structure according to at least one embodiment of the present disclosure.

[0058] Figure 2B is a back view structure diagram of a chip loading structure according to at least one embodiment of the present disclosure.

[0059] Figure 2C is a three-dimensional structure diagram of a chip loading structure according to at least one embodiment of the present disclosure.

[0060] Figure 2D is a three-dimensional structure diagram of a chip loading structure when carrying a detection chip according to at least one embodiment of the present disclosure.

[0061] Figure 2E is a front view structure diagram of another chip loading structure according to at least one embodiment of the present disclosure.

[0062] Figure 2F is a back view structure diagram of another chip loading structure according to at least one embodiment of the present disclosure.

[0063] Figure 3 is a schematic block diagram of an analysis device according to at least one embodiment of the present disclosure.

[0064] Figure 4 is a schematic block diagram of a transport unit according to at least one embodiment of the present disclosure.

[0065] Figure 5A is a structure diagram of a transport structure in a disassembled state according to at least one embodiment of the present disclosure.

[0066] Figure 5B is a structure diagram of a transport structure in an assembled state according to at least one embodiment of the present disclosure.

[0067] Figure 6A is a front view structure diagram of a stage according to at least one embodiment of the present disclosure.

[0068] Figure 6B is a back view structure diagram of a stage according to at least one embodiment of the present disclosure.

[0069] Figure 6CIt is a three-dimensional structure diagram of a stage according to at least one embodiment of the present disclosure.

[0070] Figure 6D It is a structure diagram of a contact electrode and a spring member according to at least one embodiment of the present disclosure.

[0071] Figure 6E It is a structure diagram of the stage when carrying a loading plate according to at least one embodiment of the present disclosure.

[0072] Figure 7A It is a schematic structural diagram of the temperature control unit in a disassembled state according to at least one embodiment of the present disclosure.

[0073] Figure 7B It is a structure diagram of the temperature control unit in an assembled state according to at least one embodiment of the present disclosure.

[0074] Figure 8 It is a schematic block diagram of a signal detection unit according to at least one embodiment of the present disclosure.

[0075] Figure 9A It is a side view of a signal detection unit according to at least one embodiment of the present disclosure.

[0076] Figure 9B It is another side view of a signal detection unit according to at least one embodiment of the present disclosure.

[0077] Figure 10 It is an internal overall structure diagram of an analysis device according to at least one embodiment of the present disclosure.

[0078] Figure 11A It is an external overall structure diagram of an analysis device according to at least one embodiment of the present disclosure.

[0079] Figure 11B It is an external front view of an analysis device according to at least one embodiment of the present disclosure.

[0080] Figure 11C It is an external rear view of an analysis device according to at least one embodiment of the present disclosure.

[0081] Figure 11D It is an external side view of an analysis device according to at least one embodiment of the present disclosure.

[0082] Figure 11E It is another external side view of an analysis device according to at least one embodiment of the present disclosure.

[0083] Figure 11F It is another external side view of the analysis device when the control valve is opened according to at least one embodiment of the present disclosure.

[0084] Figure 11GIt is an external bottom view of an analysis device according to at least one embodiment of the present disclosure.

[0085] Figure 12A It is a state diagram of the analysis device according to at least one embodiment of the present disclosure when the loading valve is opened.

[0086] Figure 12B It is a state diagram of the analysis device according to at least one embodiment of the present disclosure when the loading plate is in the first position.

[0087] Figure 12C It is a state diagram of the analysis device according to at least one embodiment of the present disclosure when the loading plate is in the second position.

[0088] Figure 12D It is a state diagram of the analysis device according to at least one embodiment of the present disclosure when the loading plate is in the third position.

[0089] Figure 13 It is a schematic block diagram of an analysis system according to at least one embodiment of the present disclosure.

[0090] Figure 14 It is a temperature change diagram of a temperature control cycle according to at least one embodiment of the present disclosure.

[0091] Figure 15 It is a schematic contour diagram after expanding a divided reaction chamber according to an embodiment of the present application.

[0092] Figure 16 It is a schematic amplitude diagram of Fourier transform of a biochip image to the frequency domain according to an embodiment of the present application.

[0093] Figure 17 It is a schematic diagram of constructing a filter according to an embodiment of the present application. Detailed implementation manners

[0094] In order to make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0095] Unless otherwise defined, technical or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar words used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "comprising" or "including" mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0096] To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted in this disclosure.

[0097] Some dPCR products usually require multiple sets of supporting equipment to obtain analysis results, which results in long detection time, high detection cost, many operation steps, and a risk of reagent contamination.

[0098] At least one embodiment of this disclosure provides a chip loading structure, an analysis device, and an analysis system. The analysis device of this embodiment integrates a loading unit, a temperature control unit, and a signal detection unit, and realizes the detection of a detection chip with a single device, reducing the number of required supporting equipment, simplifying the operation steps, shortening the detection time, and reducing the risk of reagent contamination. In addition, by using the above chip loading structure to carry the detection chip and being able to be detachably connected to the transport unit in the analysis device, it can not only protect the detection chip and reduce the risk of damage to the detection chip during the process of being placed in the transport unit, but also simplify the loading and unloading process of installing the detection chip on the transport unit and improve the installation convenience of the detection chip.

[0099] Figure 1 is a schematic block diagram of a detection chip according to at least one embodiment of this disclosure. As Figure 1As shown, one side of the detection chip 1 has a reaction observation area 12. For example, for a microfluidic chip such as a digital polymerase chain reaction chip (dPCR), the reaction observation area 12 is, for example, a microporous reaction chamber array area. In addition, the detection chip 1 also has a heating electrode 11, which is, for example, in the shape of a rectangular plate. When receiving an electrical signal, components such as the heating electrode 11 or a resistance trace electrically connected thereto can generate heat to heat the detection chip 1. Of course, in actual applications, depending on the type, there are also detection chips 1 without a heating electrode. In addition, the detection chip 1 can also include electrodes for other purposes, such as electrodes for applying an electrical signal to drive a sample to move in the detection chip 1; as described above, the embodiments of the present disclosure do not limit the type, structure, etc. of the detection chip 1.

[0100] It should be understood that the detection chip 1 described in the embodiments of the present disclosure can be any type of biological detection chip or chemical detection chip, such as various microfluidic chips, and the embodiments of the present disclosure do not limit this.

[0101] Figure 2A is a front structural view of a chip loading structure according to at least one embodiment of the present disclosure. Figure 2B is a back structural view of a chip loading structure according to at least one embodiment of the present disclosure. Figure 2C is a three-dimensional structural view of a chip loading structure according to at least one embodiment of the present disclosure. Please refer to Figures 2A to 2B According to a chip loading structure 2 of at least one example of the present disclosure, it can be detachably connected to the transport part in the analysis device, which can not only protect the detection chip 1 and reduce the risk of damage to the detection chip 1 during the process of being placed in the transport part, but also simplify the loading and unloading process of installing the detection chip 1 on the transport part and improve the installation convenience of the detection chip 1.

[0102] Specifically, the chip loading structure 2 includes a loading plate body 21, which is, for example, a rectangular plate body, and optionally, is made of a high-temperature resistant material to ensure that it will not deform when heating the detection chip 1. The loading plate body 21 is generally a rectangular box body as a whole, and its contour is usually basically the same as the outer shape of the detection chip 1. In addition, the loading plate body 21 has an accommodation space for accommodating the detection chip 1. For example, as Figure 2D shown, at this time, the detection chip 1 is located in the above accommodation space.

[0103] In addition, as Figure 2A shown, a first hollow area 23 and at least one second hollow area 24 that penetrate through to the above accommodation space are provided on the first plate surface 2a of the loading plate body 21. For example, Figure 2A and Figure 2BTwo second hollow areas 24 are shown. Among them, the first hollow area 23 is used to expose the reaction observation area 12 of the detection chip 1; each second hollow area 24 is used to expose each reagent port (not shown in the figure) of the detection chip 1. Optionally, as Figure 2C shown, a first recess 231 may also be provided at the position of the first hollow area 23 on the first plate surface 2a of the loading plate body 21. The orthographic projection area of the first recess 231 on the first plate surface 2a is larger than the orthographic projection area of the first hollow area 23 on the first plate surface 2a, and the orthographic projection of the first recess 231 on the first plate surface 2a completely covers the orthographic projection of the first hollow area 23 on the first plate surface 2a. The setting of the first recess 231 can expand the observation field of view.

[0104] In some embodiments, optionally, the orthographic projection shape of the first hollow area 23 on the first plate surface 2a includes a square, a rectangle or a circle. For example, Figure 2A the orthographic projection shape of the first hollow area 23 shown is a square. Again, as Figure 2E shown, an embodiment of the present disclosure further provides another chip loading structure 2'. A first hollow area 23' is provided on the first plate surface 2a' of its loading plate body 21'. The orthographic projection shape of the first hollow area 23' on the first plate surface 2a' is a circle. It should be noted that in actual applications, corresponding chip loading structures can be equipped for detection chips 1 of different types and structures.

[0105] In some embodiments, optionally, there are multiple second hollow areas 24, which are arranged at intervals along a first axis of the first plate surface 2a. The direction of this first axis when the loading plate body 21 is placed on the above-mentioned transport part is parallel to the first moving direction (i.e., Figure 2A the X direction shown) in which the transport part moves into the interior of the above-mentioned analysis device. For example, Figure 2A and Figure 2B show two second hollow areas 24, which are arranged at intervals along the X direction and are respectively located on both sides of the first hollow area 23. Of course, in actual applications, the two second hollow areas 24 can also be located on the same side of the first hollow area 23.

[0106] In some embodiments, optionally, as Figure 2C shown, a second recess 241 may also be provided at the position of each second hollow area 24 on the first plate surface 2a of the loading plate body 21. The orthographic projection area of the second recess 241 on the first plate surface 2a is larger than the orthographic projection area of the second hollow area 24 on the first plate surface 2a, and the orthographic projection of the second recess 241 on the first plate surface 2a completely covers the orthographic projection of the second hollow area 24 on the first plate surface 2a. The setting of the second recess 241 can prevent the reagent from leaking when filling or discharging the reagent.

[0107] In some embodiments, optionally, as Figure 2A shown, when the loading plate body 21 is placed on the above-mentioned transport part, the orthographic projection area of the second recess 241 that is rearward in the first moving direction (i.e., Figure 2A the X direction shown) on the first plate surface 2a is larger than the orthographic projection area of the second recess 241 that is forward in the first moving direction on the first plate surface 2a. This is because: for some detection chips, such as Figure 1 the detection chip 1 shown, the reagent filling ports in its multiple reagent ports are generally located at a position that is rearward in the first moving direction (i.e., Figure 2A the X direction shown), while the reagent discharge ports are generally located at a position that is forward in the first moving direction (i.e., Figure 2A the X direction shown), and when filling the reagent, the reagent filling port is more likely to leak compared to the reagent discharge port. Therefore, by appropriately increasing the orthographic projection area of the second recess 241 corresponding to the reagent filling port on the first plate surface 2a, the leakage of the reagent can be further avoided. Optionally, the orthographic projection of the second recess 241 that is rearward in the first moving direction on the first plate surface 2a is an oval; the orthographic projection of the second recess 241 that is forward in the first moving direction on the first plate surface 2a is a circle.

[0108] In the embodiments of the present disclosure, the detection chip 1 further has a heating electrode 11. In order to enable it to be in electrical contact with the contact electrode in the heater (specifically described below), as Figure 2D shown, a third hollowed-out area 22 that penetrates through to the above-mentioned accommodation space is provided on the first plate surface 2a of the loading plate body 21 for exposing the heating electrode 11. In this way, the above-mentioned contact electrode can be in electrical contact with the heating electrode 11 from the side of the first plate surface 2a of the loading plate body 21 through the third hollowed-out area 22. Optionally, as Figure 2D shown, in order to facilitate the electrical contact between the third hollowed-out area 22 and the heating electrode 11, the third hollowed-out area 22 extends to the first side edge of the loading plate body 21, and this first side edge is perpendicular to the first axis of the first plate surface 2a; the direction of the first axis when the loading plate body 21 is placed on the above-mentioned transport part is parallel to the above-mentioned first moving direction (i.e., Figure 2D the X direction shown), and this first side edge is the side edge that is forward in the above-mentioned first moving direction.

[0109] It should be noted that the embodiments of the present disclosure also provide another chip loading structure 2', and a second hollowed-out area 24' and a third hollowed-out area 22' are also provided on the first plate surface 2a' of the loading plate body 21'. Since their setting manners are the same as those of the above-mentioned second hollowed-out area 24 and third hollowed-out area 22, they will not be elaborated here.

[0110] It should also be noted that in practical applications, depending on the type, the number and position of the reagent ports of the detection chip 1 may also vary. The number and position of the second hollow area 24 in the embodiments of the present disclosure can be adaptively designed according to the number and position of the reagent ports of the detection chip 1. Additionally, according to different types of detection chips 1, hollow areas with other functions can also be provided on the first plate surface 2a of the loading plate body 21, and the embodiments of the present disclosure have no limitations on this.

[0111] In some embodiments of the present disclosure, there can be various structural compositions of the above-mentioned accommodating space. For example, as Figure 2B shown, an accommodating groove 25 is provided on the second plate surface 2b of the loading plate body 21 that is opposite to the first plate surface 2a to form the above-mentioned accommodating space. Since the accommodating groove 25 is open on the second plate surface 2b, the detection chip 1 can be moved into or out of the accommodating groove 25 from the side of the second plate surface 2b. At the same time, the open accommodating groove 25 helps to improve the cooling efficiency of the detection chip 1 and can also prevent the temperature of the loading plate body 21 from being too high. And, a protruding structure is provided on the inner side surface of the accommodating groove 25 to limit the detection chip 1 in the accommodating groove 25.

[0112] The above-mentioned protruding structure can have various structures. For example, as Figure 2B shown, the protruding structure includes two groups of convex part groups distributed on both sides of the above-mentioned first axis (parallel to the X direction) of the first plate surface 2a. Each group of convex part groups includes a plurality of convex parts 26 spaced along the above-mentioned first axis. Each convex part 26 protrudes from the inner side surface of the accommodating groove 25 towards the direction close to the above-mentioned first axis to abut against the side surface of the detection chip 1 placed in the accommodating groove 25, so that the detection chip 1 can be fixed in the accommodating groove 25 under the action of friction. This protruding structure can not only reduce the contact area with the detection chip 1 to facilitate the installation of the detection chip 1, but also ensure the stability of the fixation because the two groups of convex part groups clamp and fix the detection chip 1 on both sides of the detection chip 1. Optionally, in order to prevent the detection chip 1 from rubbing and wearing against the convex part 26, the shape of the positive projection of the convex part 26 on the second plate surface 2b is designed as a circular arc such as a semi-circular shape or a semi-elliptical shape.

[0113] In some embodiments, optionally, the accommodating groove 26 extends to the second side edge of the second plate surface 2b; the second side edge is perpendicular to the above-mentioned first axis (parallel to the X direction), and the second side edge is the side edge that is forward in the above-mentioned first moving direction. In this way, for the detection chip 1 provided with the heating electrode 11, when the loading plate body 21 is placed on the above-mentioned transport part, the heating electrode 11 can correspond to the position of the contact electrode on the transport part to achieve the contact connection between the two.

[0114] It should be noted that another chip loading structure 2' is also provided in the embodiments of the present disclosure. An accommodation groove 25' and a convex portion 26' are also provided on the second plate surface 2b' of the loading plate body 21'. Since their setting manners are the same as those of the above-mentioned accommodation groove 25 and convex portion 26, they will not be described herein again.

[0115] In some embodiments of the present disclosure, such as Figure 2B and Figure 2C shown, a connecting portion 27 is further provided on the loading plate body 21. The connecting portion 27 can be detachably connected to the transport portion in the analysis device for transporting the loading plate body 21. That is to say, the detection chip 1 is not directly mounted on the transport portion, but is mounted on the transport portion by means of the loading plate body 21. In this way, it can not only protect the detection chip 1 and reduce the risk of damage to the detection chip 1 during the process of being placed in the transport portion, but also simplify the loading and unloading process of the detection chip 1 mounted on the transport portion and improve the installation convenience of the detection chip 1.

[0116] The above-mentioned connecting portion 27 can be connected to the above-mentioned transport portion by means of plugging, for example. Specifically, as Figure 2B and Figure 2C shown, slot groups are respectively provided on two side surfaces 2c of the loading plate body 21 located on the above-mentioned first axis (i.e., parallel to the X direction). Each group of slot groups includes one or a plurality of slots arranged at intervals along the first axis. The slots serve as the above-mentioned connecting portion 27. For example, as Figure 2C shown, each slot group provided on each side surface 2c includes two slots (i.e., the connecting portion 27), and each slot is plugged into the plug-in member (described below) in the above-mentioned transport portion one by one, so as to detachably fix the loading plate body 21 on the transport portion. At the same time, this plugging method is very convenient, simplifies the loading and unloading process of the detection chip 1 mounted on the transport portion, and improves the installation efficiency. Of course, in practical applications, other any detachable methods such as snap connection and mechanical fixation can also be used to connect the connecting portion 27 to the above-mentioned transport portion.

[0117] In some embodiments of the present disclosure, optionally, such as Figure 2B shown, an insertion port communicating with the above-mentioned slot is provided on the second plate surface 2b of the loading plate body 21 facing away from the first plate surface 2a, for the corresponding above-mentioned plug-in member to move into or out of the slot. For example, as Figure 2CAs shown, the socket of the above-mentioned slot faces downward, and the plug-in component can be moved into or out of the slot through the socket along the Y direction. In addition, a limiting protrusion 271 is provided on the side of the above-mentioned slot located on the side of the second axis (parallel to the above-mentioned Y direction) thereof, which protrudes relative to the side toward the direction close to the second axis, so as to limit the plug-in component in the slot when the plug-in component in the slot moves relative to the loading plate body 21 to the spacing position between the limiting protrusion 271 and the bottom surface of the slot opposite thereto.

[0118] When the loading plate 21 needs to be installed, Figure 2C As shown, the loading plate body 21 is first moved downward along the Y direction to move the connector through the socket along the Y direction into the slot, and then the loading plate body 21 is translated to the right along the Z direction to translate the connector to the left along the Z direction to above the limiting protrusion 271, that is, to the interval position between the limiting protrusion 271 and the bottom surface of the slot opposite to it. At this time, under the action of the limiting protrusion 271 and the connector, the loading plate body 21 cannot move along the Y direction, that is, the loading plate body 21 is fixed on the above-mentioned transport portion. On the contrary, when it is necessary to unload the loading plate body 21, first translate the loading plate body 21 to the left along the Z direction to translate the connector to the right along the Z direction to a position where it is staggered with the limiting protrusion 271 and opposite to the socket; then move the loading plate body 21 upward along the Y direction to move the connector out of the slot through the socket along the Y direction. At this time, the loading plate body 21 can move along the Y direction, thereby realizing the unloading of the loading plate body 21 from the above-mentioned transport portion.

[0119] It should be noted that the embodiment of the present disclosure also provides another chip loading structure 2', which also has a connecting portion 27' on the second board surface 2b' of the loading board 21'. Since the configuration of the connecting portion 27 is the same as that of the above-mentioned connecting portion 27, it will not be described again.

[0120] At least one embodiment of the present disclosure further provides an analysis device, Figure 3 is a schematic block diagram of an analysis device according to at least one embodiment of the present disclosure. Figure 3 As shown, the analysis device 100 according to at least one example of the present disclosure may include at least a loading unit 140 , a transport unit 110 , a temperature control unit 120 , and a signal detection unit 130 .

[0121] The transporting portion 110 adopts the chip loading structure provided by at least one embodiment of the present disclosure, and is used to carry the detection chip 1 , and can be detachably connected to the transporting portion 110 .

[0122] The transport unit is configured to transport the chip loading structure. The transport unit 110 is configured to receive and carry the loading plate 21 (carrying the detection chip 1 ) in the chip loading structure during use, and allows the loading plate 21 to be moved to the temperature control unit 120 and the signal detection unit 130 .

[0123] The temperature control unit 120 includes a heater 121 and a cooler 122. The heater 121 is configured to heat the detection chip 1 (carried by the loading plate body 21) loaded into the analysis device, and the cooler 122 is configured to cool down the detection chip 1 loaded into the analysis device, thereby realizing the control of the temperature of the detection chip 1.

[0124] The signal detection unit 130 includes an optical sensor 131. The optical sensor 131 is configured to receive light from the detection chip 1 and perform detection based on the light of the detection chip 1.

[0125] Figure 4 It is a schematic block diagram of the transport unit according to at least one embodiment of the present disclosure. The transport unit 110 may include a transport structure 111 and a driver 112.

[0126] The transport structure 111 is configured to carry the above-mentioned chip loading structure (i.e., the loading plate body 21) and can be at least partially driven. The driver 112 is configured to be able to drive the transport structure 111, for example, operably connected to the transport structure 111, and reciprocate the above-mentioned chip loading structure (i.e., the loading plate body 21) between a first position, a second position, and a third position. In at least one embodiment, the first position allows the above-mentioned chip loading structure (i.e., the loading plate body 21) to be received in the transport structure 111, that is, allows the user to put the loading plate body 21 into the transport unit 110, and the detection chip 1 loaded with the detection sample is carried by the loading plate body 21. The second position allows the temperature control unit 120 to adjust the temperature of the detection chip 1. The third position allows the optical sensor 131 of the signal detection unit 130 to receive light from the detection chip 1. For example, an example of the first position in at least one embodiment of the present disclosure is shown in Figure 12B An example of the first position in at least one embodiment of the present disclosure is shown in the following. For example, an example of the second position in at least one embodiment of the present disclosure is shown in Figure 12C An example of the second position in at least one embodiment of the present disclosure is shown in the following. For example, an example of the third position in at least one embodiment of the present disclosure is shown in Figure 12D An example of the third position in at least one embodiment of the present disclosure is shown in the following.

[0127] However, it should be understood that in some embodiments, the transport unit 110 may not include the driver 112, so that the transport structure 111 can be manually moved (such as pushed or pulled), and the embodiments of the present disclosure do not limit this.

[0128] Figure 5A It is a structural diagram of the transport structure in a disassembled state according to at least one embodiment of the present disclosure, and Figure 5B It is a structural diagram of the transport structure in an assembled state according to at least one embodiment of the present disclosure. As shown in Figure 5A and Figure 5BAs shown, the transport structure 111 may include a stage 1111, a movable platform 1112, and a bracket 1113.

[0129] The stage 1111 is configured to carry the above chip loading structure (i.e., the loading plate 21) during use. In Figures 6A to 6E the illustrated example, the stage 1111 is a rectangular plate and can be movably mounted on the bracket 1113 (as Figure 5B shown). Figure 6A is a front structural view of the stage according to at least one embodiment of the present disclosure. As Figure 6A shown, the stage 1111 can be connected to the connecting portion 27 on the loading plate 21 in the above chip loading structure by means of plugging. Specifically, an installation groove 31 for accommodating the above loading plate 21 is provided on the bearing surface 1111a of the stage 1111, and an installation groove opening 31a communicating with the installation groove 31 is provided on the first side surface of the stage 1111 for the loading plate 21 to move into or out of the installation groove 31, as Figure 6A shown. The first side surface is perpendicular to the first moving direction (i.e., Figure 6A the X direction shown) in which the stage 1111 moves into the analysis device and is the side surface facing backward in the above first moving direction.

[0130] Moreover, a plug-in member 32 protruding in the direction of the third axis (parallel to the X direction) closer to the side surface of the installation groove 31 is provided on the stage 1111. Combining Figure 2C and Figure 6E shown, the part of the plug-in member 32 protruding relative to the side surface of the installation groove 31 can move into or out of the slot (i.e., the connecting portion 27) along the Y direction from the socket. It should be understood that by means of the installation groove opening 31a, the loading plate 21 placed in the installation groove 31 can be translated along the X direction so that the plug-in member 32 can be translated to the right or left along the Figure 2C Z direction shown. Since the plugging method of the plug-in member 32 and the above slot has been described in detail above, it will not be elaborated here.

[0131] In some embodiments of the present disclosure, optionally, the stage 1111 can be formed by a high-temperature resistant material, which can be, for example, metal, plastic, ceramic, rubber, resin, etc. The heat distortion temperature of the high-temperature resistant material forming the stage 1111 can be, for example, above 100°C, 200°C, 300°C, 400°C, 500°C. The stage 1111 can also be formed by a high-temperature resistant and poor heat-conducting material. For example, in a specific embodiment, the stage 1111 can be formed by ceramic, so that it has both a light weight and can resist high temperatures.

[0132] In some embodiments of the present disclosure, Figure 6BFIG. 4 is a back structural diagram of a stage according to at least one embodiment of the present disclosure. Figure 6B As shown, four through holes 36 are provided in the stage 1111, which extend from the back surface 1111b to the bearing surface 1111a, and are used to fix the stage 1111 to the bracket 1113 by fasteners (such as screws or bolts). Optionally, the stage 1111 and the bracket 1113 can be connected by four compression springs to apply elastic force toward the two to keep them away from each other. By utilizing the elastic action of the compression springs, the distance between the stage 1111 and the bracket 1113 can be adjusted by tightening or loosening the fasteners, thereby adjusting the levelness of the stage 1111. Optionally, the above-mentioned four compression springs can be sleeved on the above-mentioned fasteners. Of course, in actual applications, the levelness of the stage 1111 can also be adjusted by setting other leveling structures, and the embodiments of the present disclosure are not limited to this.

[0133] Optionally, the stage 1111 may further include a level to detect whether the stage 1111 is horizontal. The level may be adhered to the stage 1111 by an adhesive or the like, which is not limited in the embodiments of the present disclosure. The level may be, for example, a bubble level, an inductive level, a capacitive level, etc., which is not limited in the embodiments of the present disclosure. The level may be used to detect whether the stage 1111 is horizontal, and the level of the stage 1111 may be adjusted using the above-mentioned leveling structure according to the detection result, thereby improving the accuracy of the leveling, so that the detection chip 1 (carried by the loading plate 21) carried on the stage 1111 remains horizontal, thereby facilitating the optical sensor 131 to receive light from the detection chip 1.

[0134] like Figure 6A As shown, the loading platform 1111 may have a hollow area 34, so that when the loading plate 21 is placed on the loading platform 1111, the contact surface between the loading plate 21 and the loading platform 1111 is at least partially exposed, for example, exposed to the cooler 122 of the temperature control unit 120. Optionally, as Figure 2B As shown, since the receiving groove 25 on the loading plate body 21 is open on the second plate surface 2b, the detection chip 1 carried by the loading plate body 21 can be exposed to the cooler 122 of the temperature control unit 120, thereby improving the cooling efficiency of the detection chip 1. According to actual requirements, the hollow area 34 can have any suitable shape, such as a circle, triangle, rectangle, pentagon, hexagon or other irregular shapes; for example, the hollow area 34 can have one or more openings, which is not limited in the embodiments of the present disclosure. The size of the projection of the loading plate body 21 on the plane where the hollow area 34 is located is larger than the size of the hollow area 34, so that the loading plate body 21 will not separate from the stage 1111 from the hollow area 34.

[0135] In some embodiments of the present disclosure,Figure 6D As shown, the heater 121 may include at least one contact electrode 33, which may be formed of a high-temperature resistant metal material, for example. The at least one contact electrode 33 is configured to be in one-to-one electrical contact with at least one heating electrode 11 of the detection chip 1 during use. The heater 121 is further configured to apply an electrical signal to the heating electrode 11 of the detection chip 1 through the contact electrode 33 to heat the detection chip 1 by the heating electrode 11.

[0136] In some embodiments of the present disclosure, as Figure 6C shown, the contact electrode 33 is fixed on the bearing surface 1111a of the stage 1111 and is located on the side opposite to the opening 31a of the mounting groove, and one end of the contact electrode 33 protrudes in a direction opposite to the X direction with respect to the side surface of the mounting groove 31, that is, the contact electrode 33 extends from one side of the mounting groove 31 to the inside of the mounting groove 31 to allow electrical contact with the exposed heating electrode 11 of the detection chip 1 during use, so as to apply an electrical signal (such as a DC voltage or an AC voltage) to the heating electrode 11 of the detection chip 1. After the detection chip 1 is placed on the stage 1111, the contact electrode 33 is in electrical contact with the heating electrode 11 of the detection chip 1, so that an electrical signal can be transmitted. The contact electrode 33 may be electrically connected to a power source or a controller through a line passing through the stage 1111 to receive a control signal.

[0137] Optionally, a contact portion 331 for electrical contact with the heating electrode 11 is provided on the contact electrode 33, and the contact portion 331 protrudes in a direction closer to the heating electrode 11 with respect to the surface of the contact electrode 33 opposite to the heating electrode 11. For example, as Figure 6D shown, the contact portion 331 is a convex portion formed by bending one end of the contact electrode 33, and the convex portion preferably forms an acute angle with the contact electrode 33 to facilitate the insertion of the heating electrode 11 of the detection chip 1 into the inside of the contact electrode 33. By making the contact portion 331 protrude with respect to the surface of the contact electrode 33 opposite to the heating electrode 11, after the loading plate body 21 is placed on the stage 1111, the contact electrode 33 can be elastically deformed to a certain extent due to the extrusion of the loading plate body 21, so that the contact electrode 33 can be kept in close contact with the heating electrode 11 to achieve good electrical contact. And, as Figure 6DAs shown, the heater 121 further includes an elastic member 35, which is respectively connected to the contact electrode 33 and the stage 1111, and is used to apply a pulling force to the contact electrode 33 towards the bearing surface 1111a of the stage 1111. With the help of the elastic member 35, the elastic connection between the contact electrode 33 and the stage 1111 can be realized, and the contact electrode 33 can be reset when the loading plate 21 is removed from the installation groove 31. Optionally, the elastic member 35 is a spring, such as a tension spring. Further, a limit groove 333 can be provided on the contact electrode 33 to limit the position of the elastic member 35 on the contact electrode 33.

[0138] In addition, optionally, as Figure 6C shown, an electrode slot 312 is provided on the bearing surface 1111a of the stage 1111, the contact electrode 33 is inserted into the electrode slot 312, and the contact electrode 33 and the stage 1111 are fixedly connected by fasteners. For example, as Figure 6D shown, an installation hole 332 can be provided at one end of the contact electrode 33 away from the contact portion 331, and is fixedly connected to the stage 1111 by fasteners (such as screws or bolts).

[0139] Optionally, as Figure 6A shown, limit steps 311 are further provided at two corners of the side surface of the installation groove 31 opposite to the installation groove opening 31a, which are used to limit the position of the loading plate 21 in the installation groove 31, and at the same time can reserve a certain contact space for the heating electrode 11 and the contact electrode 33 of the detection chip 1 carried by it.

[0140] In some other embodiments, the detection chip 1 may not have a heating electrode, and the heater 121 can be configured to provide infrared rays or air flow for heating to the detection chip 1 to heat the detection chip 1. For example, the heater 121 can be an infrared heater or a gas heater (such as heating air through resistance and driving the heated air to flow through a fan), etc., and the embodiments of the present disclosure are not limited thereto.

[0141] The movable platform 1112 is configured to be operably connected to the driver 112 to move under the drive of the driver 112. The driver 112 can be, for example, a motor, and the movable platform 1112 is, for example, connected to the driving end of the motor. For example, as Figure 5A and Figure 5BAs shown, the driver 112 can be a rotary motor. The driving end of the rotary motor is connected to the lead screw S, so that the lead screw S can be rotated. The movable platform 1112 is connected to the lead screw S through a nut that is threadedly engaged with the lead screw S, so that the rotation of the lead screw S can be converted into a horizontal movement, enabling the movable platform 1112 to move by the drive of the driver 112. In addition, a guide rod G parallel to the lead screw S can be provided. The movable platform 1112 is movably connected to the guide rod G. The guide rod G serves to constrain the movable platform 1112. It should be understood that Figure 5A and Figure 5B the number of the guide rod G and the lead screw S shown in Figure 5B is exemplary, and the embodiments of the present disclosure do not limit this. For example, the driver 112 can be a linear motor, and the mover of the linear motor can be connected to the movable platform 1112 to drive the movable platform 1112 to move. The embodiments of the present disclosure do not limit how the driver 112 drives the movable platform 1112. For example, the rotational motion can also be converted into a horizontal movement through a combination of a gear and a rack.

[0142] The movable platform 1112 can be formed of any rigid material, such as metal, plastic, ceramic, rubber, resin, etc., and the embodiments of the present disclosure do not limit this. In addition, it should be understood that Figure 5A and Figure 5B the shape of the movable platform 1112 shown in Figure 5B is also only exemplary. According to actual requirements, the movable platform 1112 can have any suitable shape.

[0143] The bracket 1113 is configured to connect the stage 1111 and the movable platform 1112, so that when the movable platform 1112 is driven, the stage 1111 can be driven.

[0144] As Figure 5A shown by the dashed box in Figure 5A , the bracket 1113 can include a first part 1113A and a second part 1113B. The first part 1113A is configured to carry the stage 1111 in use. The second part 1113B is configured to be connected to the movable platform 1112 in use. The first part 1113A extends in a first direction, the second part 1113B extends in a second direction, and the first direction is perpendicular to the second direction. The bracket 1113 is formed in an L shape or a T shape, so as to reduce the size in a single direction and help reduce the overall volume of the analysis device.

[0145] The first part 1113A of the bracket 1113 can be connected to the stage 1111 through, for example, springs, such as four springs corresponding to the four corners of the stage 1111, so that the horizontal state of the stage 1111 can be adjusted by adjusting the corresponding springs.

[0146] The second part 1113B of the bracket 1113 can be detachably connected or fixedly connected to the movable platform 1112, for example, by screws or the like, to allow the movable platform 1112 to drive the bracket 1113 to move together. Alternatively, the second part 1113B can be integrally formed with the movable platform 1112.

[0147] The bracket 1113 can be formed of any rigid material, for example, metal, plastic, ceramic, rubber, resin, etc., and the embodiments of the present disclosure are not limited thereto. In addition, it should be understood that Figure 5A and Figure 5B The shape of the bracket 1113 shown in

[0148] Figure 7A is a schematic structural diagram of the disassembled state of the temperature control part according to at least one embodiment of the present disclosure. Figure 7B is a structural diagram of the assembled state of the temperature control part according to at least one embodiment of the present disclosure. As Figure 7A and Figure 7B shown, the temperature control part 120 can include, for example, a temperature sensor 123. The temperature sensor 123 is configured to detect the temperature of the detection chip 1. The temperature sensor 123 can employ a conventional temperature sensor, and the embodiments of the present disclosure will not elaborate thereon. For example, the temperature sensor 123 can include an infrared temperature sensor or a thermocouple temperature sensor. It should be understood that in some embodiments of the present disclosure, if the detection chip 1 includes a temperature sensor, there is no need to further provide a temperature sensor 123 in the analysis device.

[0149] As Figure 7B shown, the temperature sensor 123 and the cooler 122 are configured to be spaced apart from each other to allow the detection chip 1 to be clamped between the temperature sensor 123 and the cooler 122. As Figure 7A and Figure 7B shown, the temperature control part 120 can further include a temperature control bracket 124, and the temperature sensor 123 and the cooler 122 are connected to the temperature control bracket 124 to be spaced apart from each other. It should be understood that Figure 7A and Figure 7B the positions of the temperature sensor 123 and the cooler 122 in

[0150] are only exemplary, and the embodiments of the present disclosure are not limited thereto. For example, in some other embodiments, the temperature sensor 123 can be above or below the detection chip 1 during use, and the cooler 122 can be on the side of the detection chip 1 during use. Figure 7BAs shown, the cooler 122 may be, by way of example, a fan that is generally circular in shape and is fixed in the temperature control bracket 124 by four mounting posts 122a provided at the four corners. Specifically, as Figure 7A shown, four through holes 124a are provided on the base of the temperature control bracket 124 for mounting the four mounting posts 122a on the base of the temperature control bracket 124 one by one by means of screws.

[0151] As Figure 7A and Figure 7B shown, the temperature control bracket 124 is composed of a base plate and a vertical plate and a horizontal plate provided on the base plate. The horizontal plate is relatively arranged above the base plate and is supported by the vertical plate. The cooler 122 is supported by the base plate. The temperature sensor 123 is provided on the horizontal plate and is relatively located above the cooler 122. When the detection chip 1 is located between the temperature sensor 123 and the cooler 122 during use, the temperature sensor 123 can detect the temperature of the detection chip 1; the cooler 122 can cool the detection chip 1.

[0152] Optionally, as Figure 7A shown, a rib plate 124b is also provided at the angle between the above-mentioned horizontal plate and the vertical plate for strengthening the connection stability between the horizontal plate and the vertical plate. The rib plate 124b is perpendicular to the above-mentioned horizontal plate and the vertical plate, and the two side surfaces are at right angles so as to be able to fit with the above-mentioned horizontal plate and the vertical plate respectively, and the rib plate 124b also has a wavy side surface for providing an installation space for the cooler 122.

[0153] The temperature control bracket 124 can be formed of any rigid material, for example, metal, plastic, ceramic, rubber, resin, etc., and the embodiments of the present disclosure are not limited thereto. In addition, it should be understood that Figure 7A and Figure 7B the shape of the temperature control bracket 124 shown in

[0154] Figure 8 is a schematic block diagram of a signal detection unit according to at least one embodiment of the present disclosure. As Figure 8 shown, in at least one embodiment of the present disclosure, in addition to the optical sensor 131, the signal detection unit 130 may further include a light source 132 and an optical transmission unit 133.

[0155] The optical sensor 131 is, for example, an image sensor, configured to acquire an image of the detection chip (such as a biochip image) for analysis. For example, the optical sensor 131 may include a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, it should be understood that in other embodiments, the optical sensor 131 may also be a photodiode, a photoresistor, an infrared sensor, a ultraviolet sensor, etc., and the embodiments of the present disclosure are not limited thereto.

[0156] The light source 132 can be configured to provide light for irradiating the detection chip during use. The light transmission part 133 can be configured to transmit the light provided by the light source 132 to the detection chip and transmit the light emitted by the detection chip to the optical sensor 131 during use.

[0157] For example, the light source 132 can be of various types that can emit visible light, infrared light, etc., and for example, includes a laser or a fluorescent light source. The wavelengths of the laser and the fluorescent light source can be selected according to actual needs, and the embodiments of the present disclosure are not limited thereto.

[0158] Figure 9A is a side view of a signal detection part according to at least one embodiment of the present disclosure. Figure 9B is another side view of a signal detection part according to at least one embodiment of the present disclosure. As Figure 9A and Figure 9B shown, in some embodiments of the present disclosure, the light transmission part 133 may include a 90° steering prism system 1331 and a reflection optical path system 1332. The 90° steering prism system 1331 can be configured to transmit the light from the detection chip to the optical sensor 131. The reflection optical path system 1332 can be configured to transmit the light from the light source 132 to irradiate the detection chip, and the reflection optical path system 1332 may further include a filter, which is on the optical path from the detection chip to the optical sensor 131 to filter the light transmitted on this optical path and only allow light of a set wavelength to pass through. Both the 90° steering prism system 1331 and the reflection optical path system 1332 can adopt conventional designs in the art, and the present disclosure will not elaborate thereon.

[0159] As Figure 9A and Figure 9B shown, in some embodiments, the signal detection part 130 may further include an objective lens 134. The objective lens 134 is configured to collect the light from the detection chip. For example, the objective lens 134 may include a lens.

[0160] As Figure 9A and Figure 9BAs shown, in some embodiments, the signal detection unit 130 may further include a bracket 135. The bracket 135 is used to fix and carry at least some components in the information detection unit 130, such as the light source 132, the optical transmission unit 133, etc. In some embodiments, a focal length adjustment structure is further provided on the bracket 135, and the focal length adjustment structure is configured to adjust the distance between the optical transmission unit 133 and the detection chip so that the detection chip is at the focal point of the optical transmission unit 133. And, as Figure 9B shown, the focal length adjustment structure has a focal length adjustment knob 136 and a knob extension 1361 connected to the focal length adjustment knob 136. The knob extension 1361 extends to the side close to the optical transmission unit 133 for easy manual adjustment. The bracket 135 can adopt a conventional design in the art, and the present disclosure will not elaborate on this.

[0161] In some embodiments, the signal detection unit 130 may further include a spirit level (not shown in the figure) to detect whether the signal detection unit 130 is level. For example, the spirit level can be connected to the optical transmission unit 133, the optical sensor 131, the light source 132, etc. As an example, the spirit level can be connected to the 90° steering prism system 1331. However, it should be understood that the embodiments of the present disclosure are not limited thereto. The spirit level is connected to other components of the signal detection unit 130 in any suitable manner, such as bonding, magnetic adsorption, threaded connection, etc., and the embodiments of the present disclosure do not limit this. The spirit level can be, for example, a bubble spirit level, an inductive spirit level, a capacitive spirit level, etc., and the embodiments of the present disclosure do not limit this. By using the spirit level, for example, the light transmitted from the optical transmission unit 133 to the detection chip can be perpendicular to the detection chip or the light from the detection chip can enter the optical transmission unit 133 vertically, thereby facilitating subsequent signal processing. For example, the step of angle correction of the image of the detection chip can be omitted.

[0162] Figure 10 is the internal overall structure diagram of the analysis device according to at least one embodiment of the present disclosure. As Figure 10 shown, the analysis device may include a base 101, and the transport unit 110, the temperature control unit 120, and the signal detection unit 130 are all provided on the base 101, for example, fixed on the base 101 by screws, clamps, adhesives, etc. The temperature control unit 120 and the signal detection unit 130 can be arranged along the moving path of the movable platform 1112 in the transport unit 110 so that the movement of the movable platform 1112 can drive the loading plate body 21 carried on the stage 1111 to move to the temperature control unit 120 for temperature control and move to the signal detection unit 130 to collect the light from the detection chip.

[0163] However, it should be understood that Figure 10The illustrated arrangement is exemplary. Depending on the structures and shapes of the transport unit 110, the temperature control unit 120, and the signal detection unit 130, different arrangements can be adopted, and the embodiments of the present disclosure do not limit this.

[0164] In some embodiments of the present disclosure, the analysis device 100 further includes one or more controllers. The one or more controllers can be configured to perform at least one of the following operations:

[0165] Signal-connected to the transport unit 110 to control the movement of the transport unit 110;

[0166] Signal-connected to the heater 121 to control the heater 121 to heat the detection chip;

[0167] Signal-connected to the cooler 122 to control the cooler 122 to cool the detection chip; and

[0168] Signal-connected to the optical sensor 131 to analyze the light from the detection chip.

[0169] The above-mentioned controller can be implemented, for example, by a central processing unit (CPU), a digital signal processor (DSP), a single-chip microcomputer, a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), an application-specific integrated circuit (ASIC), etc., and the embodiments of the present disclosure do not limit this.

[0170] It should be understood that in some embodiments of the present disclosure, the controller can be implemented as multiple sub-controllers, and the multiple sub-controllers can respectively perform at least one of the above operations. The multiple sub-controllers can be separately provided or integrated in one controller, and the embodiments of the present disclosure do not limit this.

[0171] In some embodiments of the present disclosure, the analysis device 100 may further include a communication unit. The communication unit is configured to form a signal connection with a mobile terminal, a server, etc. The signal connection can be a wired connection or a wireless connection, and the embodiments of the present disclosure do not limit this. Exemplary wireless connections include Wi-Fi, Bluetooth, Wireless Direct, and infrared. Exemplary wired connections include Universal Serial Bus (USB), FireWire, Thunderbolt, or any connection that requires a physical cable.

[0172] Figures 11A to 11G They are respectively a perspective view and six-sided views (except the top surface) of the housing 200 of the analysis device according to at least one embodiment of the present disclosure. As Figure 11BAs shown, the analysis device according to at least one embodiment of the present disclosure may further include a display screen 201. The display screen 201 is, for example, disposed on the front of the housing 200 and configured to perform display. For example, it may be a liquid crystal display screen, an organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a micro light-emitting diode display screen, an electronic ink screen, an electronic paper display screen, etc. The embodiments of the present disclosure are not limited thereto. For example, the display screen 201 may be a touch display screen to receive user input. However, it should be understood that in some embodiments, the analysis device may not include the display screen 201, but is connected to a separately provided display screen or outputs data such as analysis results in the form of digital files or physical files. The embodiments of the present disclosure are not limited thereto.

[0173] Optionally, a loading valve 202 may also be provided on the front of the housing 200, which allows the stage 1111 to extend therefrom when opened to receive the loading plate 21.

[0174] As Figure 11C shown, the analysis device according to at least one embodiment of the present disclosure may further include a power interface 203. The power interface 203 is, for example, disposed on the back of the housing 200, and the analysis device is connected to a power source through the power interface 203 to obtain electrical energy. However, it should be understood that in some embodiments, the analysis device may not have the power interface 203, but is built-in with a primary battery or a secondary battery, or a built-in solar cell. The embodiments of the present disclosure are not limited thereto.

[0175] As Figure 11C shown, the analysis device according to at least one embodiment of the present disclosure may further include a data transmission interface 204. The data transmission interface 204 is, for example, disposed on the back of the housing 200 and configured to output data of the analysis device, such as analysis results, to an external device, or transmit data from an external device to the analysis device. The data transmission interface 204 may be, for example, a universal serial bus (USB) interface, a serial advanced technology attachment (SATA) interface, etc. In at least one embodiment, the data transmission interface and the power interface may be combined into one interface, such as a USB interface, which can be used for both data transmission and power transmission. The analysis device according to at least one embodiment of the present disclosure may further include a button. The button is configured to obtain a user input instruction, and may be, for example, a mechanical button, an optical button, etc. The embodiments of the present disclosure are not limited thereto.

[0176] As Figure 11D shown, the analysis device according to at least one embodiment of the present disclosure may further include a power switch 207 and an indicator light 208, which are, for example, disposed on one side of the housing 200.

[0177] As Figure 11EAs shown, the analysis device according to at least one embodiment of the present disclosure may further include a control valve 209, which is disposed, for example, on one side of the housing 200 (which may be on a different side from the above-mentioned power switch 207 and indicator light 208). As Figure 11F shown, after removing the control valve 209, a magnetic patch 211 is provided on its inner side for fixing the control valve 209 in a magnetic adsorption manner. Of course, in practical applications, other methods may also be used to detachably fix the control valve 209 to the housing 200, or the control valve 209 may be movably connected to the housing 200 to open or close the control opening. Moreover, after removing the control valve 209, the filter wheel 212 is exposed from the control opening to enable manual selection of the fluorescence channel. Also, the knob extension 1361 may be exposed for manual focus adjustment.

[0178] It should be noted that there are two working modes for selecting the fluorescence channel: one is manual adjustment through the above-mentioned method, and the other is automatic selection of the fluorescence channel by the built-in automatic control unit. Similarly, there are two working modes for focus adjustment: one is manual adjustment using the knob extension 1361, and the other is automatic focus adjustment by the built-in automatic control unit.

[0179] As Figure 11G shown, the analysis device according to at least one embodiment of the present disclosure may further include four support feet 213, which are disposed on the bottom surface of the housing 200. Optionally, the four support feet 213 have a level adjustment structure (such as including screws and elastic members) to enable adjustment of the level of the entire analysis device.

[0180] As Figure 11C 、 Figure 11D and Figure 11E shown, the analysis device according to at least one embodiment of the present disclosure may further include a heat dissipation port 205, a heat dissipation port 206, and a heat dissipation port 210, which are respectively disposed on the back and both sides of the housing 200 and can be used to release the heat of the controller or the temperature control unit 120. These heat dissipation ports may be hermetically sealed to prevent dust from entering the interior of the analysis device.

[0181] The analysis device according to at least one embodiment of the present disclosure may further include a touch sensor. The touch sensor is configured to receive and detect a user's touch operation and convert the user's touch operation into an electrical signal for transmission to a controller or other control devices, such as a controller or an external server, etc. The touch sensor may be, for example, a capacitive touch sensor, a resistive touch sensor, etc., and the embodiments of the present disclosure are not limited thereto. It should be understood that when the display screen 201 is a touch display screen or the analysis device includes other forms of input devices (such as buttons, microphones, etc.), the analysis device may not include a touch sensor.

[0182] Figures 12A to 12D The state diagrams of the analysis device according to at least one embodiment of the present disclosure are shown when the loading plate 21 is in different positions. As Figure 12A shown, the loading valve 202 of the analysis device according to at least one embodiment of the present disclosure is opened, and the stage 1111 extends out from the chip loading port of the analysis device to receive the loading plate 21. As Figure 12B shown, the loading plate 21 (carrying the detection chip) is at the first position, where the loading plate 21 is received and carried on the stage 1111. As Figure 12C shown, the loading plate 21 is at the second position, at this time the loading plate 21 is located between the temperature sensor 123 and the cooler 122 on the temperature measurement support 124. The temperature sensor 123 can detect the temperature of the detection chip; the cooler 122 can cool the detection chip. This second position allows the temperature control unit 120 to adjust the temperature of the detection chip. As Figure 12D shown, the loading plate 21 is at the third position, at this time the loading plate 21 is located below the objective lens 134, so that the objective lens 134 can collect light from the detection chip.

[0183] At least one embodiment of the present disclosure also provides an analysis system. Figure 13 It is a schematic block diagram of the analysis system according to at least one embodiment of the present disclosure. As Figure 13 shown, the analysis system 300 includes an analysis device 310 and a detection chip 320. For example, the analysis device 310 and the unused detection chip 320 can be provided to the user in combination for the user to use. The analysis device 310 can be any of the above analysis devices. The detection chip 320 can be any of the above detection chips.

[0184] It should be understood that in some embodiments of the present disclosure, the analysis system 300 may further include more components or parts, and the embodiments of the present disclosure do not limit this. For the detailed description and technical effects of the analysis device 310 and the detection chip 320, reference can be made to the description of the reaction device above, and details will not be repeated here.

[0185] At least one embodiment of the present disclosure also provides a method for operating an analysis device. This method is applicable to the analysis device according to any embodiment of the present disclosure. The method for operating an analysis device according to at least one embodiment of the present disclosure may include the following steps:

[0186] Step 1, move the transport part carrying the loading part (i.e., the loading plate carrying the detection chip in the chip loading structure) to the temperature control part.

[0187] In step 1, the above-mentioned transport unit can be manually moved to the temperature control unit. When the transport unit includes a transport structure configured to carry a loading plate body and capable of being at least partially driven, and a driver configured to drive the transport structure, step 1 may include driving the transport structure carrying the loading plate body through the driver to move the loading plate body to the temperature control unit.

[0188] Figures 12A to 12D The state diagrams of the analysis device according to at least one embodiment of the present disclosure when the loading plate body 21 is in different positions are shown. As Figure 12A shown, the loading valve 202 of the analysis device according to at least one embodiment of the present disclosure is opened, and the stage 1111 extends out from the chip loading port of the analysis device to receive the loading plate body 21. As Figure 12B shown, the loading plate body 21 (carrying the detection chip) is at the first position, where the loading plate body 21 is received and carried on the stage 1111. As Figure 12C shown, the loading plate body 21 is at the second position, at this time the loading plate body 21 is located between the temperature sensor 123 and the cooler 122 on the temperature measurement bracket 124. The temperature sensor 123 can detect the temperature of the detection chip; the cooler 122 can cool the detection chip. This second position allows the temperature control unit 130 to adjust the temperature of the detection chip.

[0189] The method for operating the analysis device according to at least one embodiment of the present disclosure may further include:

[0190] Step 2, adjusting the temperature of the detection chip through the heater and the cooler.

[0191] When the detection chip has a heating electrode and the heater includes a contact electrode, step 2 may include applying an electrical signal to the heating electrode of the detection chip through the contact electrode to heat the detection chip with the heating electrode.

[0192] In some embodiments, step 2 further includes: cyclically maintaining the detection chip at at least two temperatures through the heater and the cooler. For example, heating the detection chip through the heater and cooling the detection chip through the cooler, performing a plurality of temperature control cycles on the detection chip, such as 30 temperature control cycles, so that the detection chip performs PCR thermal cycle amplification. Each temperature control cycle includes: maintaining the detection chip at 95 °C for 10 seconds; maintaining the detection chip at 50 °C for 10 seconds; maintaining the detection chip at 72 °C for 10 seconds. It should be understood that the above temperature control cycles are only exemplary, and the embodiments of the present disclosure are not limited thereto. Figure 14 is a temperature change diagram of the temperature control cycle according to at least one embodiment of the present disclosure. In Figure 14 it, the horizontal axis represents time, the unit is minute, and the vertical axis represents temperature, the unit is degree Celsius.

[0193] The method of operating an analysis device according to at least one embodiment of the present disclosure may further include:

[0194] Step 3: Move the above-mentioned transport unit to the signal detection unit and obtain light from the detection chip through an optical sensor.

[0195] In step 3, the above-mentioned transport unit can be manually moved to the signal detection unit. When the transport unit includes a transport structure configured to carry a loading plate and capable of being at least partially driven, and a driver configured to drive the transport structure, step 3 may include driving the transport unit through the driver to move the detection chip to the signal detection unit.

[0196] As Figure 12D shown, the loading plate 21 is in the third position, at this time the loading plate 21 is located below the objective lens 134, so that the objective lens 134 can collect light from the detection chip.

[0197] Step 3 may further include: irradiating the detection chip with light and receiving the light emitted by the detection chip through the optical sensor as the light from the detection chip.

[0198] When the optical sensor includes an image sensor, step 3 may include obtaining an image of the detection chip through the image sensor. In addition, when the signal detection unit further includes a light source and a light transmission unit, step 3 may include: providing light through the light source; transmitting the light provided by the light source through the light transmission unit to irradiate the detection chip; and transmitting the light emitted by the detection chip as the light from the detection chip to the optical sensor (or the image sensor included in the optical sensor) through the light transmission unit.

[0199] The method of operating an analysis device according to at least one embodiment of the present disclosure may further include:

[0200] Step 4: Analyze the light from the detection chip to obtain an analysis result.

[0201] It should be understood that one or more steps and at least some sub-steps in the above method may be executed by software or firmware, for example, executed by a mobile terminal, a server, etc. that are signal-connected to the analysis device. The embodiments of the present disclosure do not limit this.

[0202] In some embodiments, when obtaining the light from the detection chip through the optical sensor includes obtaining an optical image of the detection chip through the image sensor, taking the optical image as a biochip image as an example, step 4 may adopt the following analysis method of the biochip image to identify a matrix-type biochip fluorescence image with high throughput and low signal-to-noise ratio, and realize automatic analysis of chamber position positioning and sample positive / negative determination.

[0203] In some embodiments, the analysis method of the biochip image includes:

[0204] Step 41, obtain a biochip image and perform preprocessing to obtain a preprocessed image;

[0205] Step 42, perform angle deflection correction on the preprocessed image to obtain a deflection-corrected image;

[0206] Step 43, perform enhancement processing on the deflection-corrected image and identify the positive and negative of the region of interest in the preprocessed image based on the enhanced image.

[0207] In some embodiments, the above-mentioned step 41 includes:

[0208] Step 411, obtain an original image, an in-camera parameter matrix, and distortion coefficients; and

[0209] Step 412, correct the original image according to the in-camera parameter matrix and the distortion coefficients to obtain a biochip image.

[0210] It can be understood that by obtaining the in-camera parameter matrix and the distortion coefficients, the distortion generated in the original image captured by the camera can be corrected, so that the corrected biochip image can more truly display the characteristics of the biochip. In this way, it is beneficial to ensure the effectiveness and accuracy of biochip analysis.

[0211] In some examples, the biochip can be quadrilateral, and a plurality of reaction chambers are arranged in an array on the biochip. It should be noted that in the embodiments of the present application, the region where the reaction chambers are located in the biochip image is used as the region of interest for description.

[0212] In certain embodiments, the analysis method of the biochip image includes: using a calibration board, calibrating the camera used for shooting by the traditional calibration method to obtain the in-camera parameter matrix and the distortion coefficients.

[0213] Among them, when calibrating the camera parameters through the calibration board, the calibration board can have a predetermined pattern, such as a grid pattern or a black and white square pattern, etc. The camera captures an image of the calibration board at a certain shooting distance. In this way, the image of the calibration board can be compared with the pattern of the calibration board, and according to the offset of the corresponding feature points in the calibration board image and the pattern of the calibration board, the in-camera parameter matrix and the distortion parameters related to the camera shooting are obtained in combination with the shooting distance.

[0214] It should be noted that, in some embodiments, the camera internal parameter matrix and distortion coefficients can be pre-calibrated and pre-stored in the camera or the analysis device for the biochip images. In this way, the analysis device can obtain the corresponding camera internal parameter matrix and distortion coefficients from the camera, or determine the camera internal parameter matrix and distortion coefficients according to the number or model of the camera. Of course, in other embodiments, the analysis device can also detect the camera internal parameter matrix and distortion coefficients corresponding to the respective cameras before each acquisition of the biochip images, so as to ensure the effectiveness of the camera internal parameter matrix and distortion coefficients.

[0215] In certain embodiments, the original image is a fluorescence image of a biochip that has undergone a biochemical reaction.

[0216] Among them, when the biological sample to be detected is loaded onto the biochip and a biochemical reaction occurs, a corresponding fluorescence image of the biochip can be acquired using a specific device. It can be understood that in the fluorescence image, the colors and brightnesses displayed in different reaction chambers are usually the same or different.

[0217] In some embodiments, the preprocessed image includes a high-frequency component image, and step 41 includes:

[0218] Step 413, performing Gaussian filtering on the biochip image to obtain a low-frequency component image; and

[0219] Step 414, subtracting the low-frequency component image from the biochip image to obtain a high-frequency component image.

[0220] In this way, the low-frequency component image is obtained by Gaussian filtering, and then the low-frequency component in the biochip image is subtracted to obtain the high-frequency component image, thereby implementing high-frequency filtering and solving the problem of uneven fluorescence illumination of the microchip.

[0221] Of course, in other embodiments, the preprocessed image may not be limited to the high-frequency component image discussed above, but may be a grayscale image, a low-frequency component image, an edge detection image, etc. according to actual needs. The grayscale image can be obtained by image grayscale processing, the low-frequency component image can be obtained by low-frequency component extraction processing, and the edge detection image can be obtained by image edge extraction processing. In addition, the preprocessed image can also be obtained by processing one or more of the above processing methods in a preset order, which is not specifically limited herein.

[0222] In some embodiments, step 42 above includes:

[0223] Step 421, selecting a preset number of detection regions in the preprocessed image;

[0224] Step 422, using the Hough circle transform to detect the center and radius of the region of interest in the detection region; and

[0225] Step 423: Draw a circle based on the center and radius of the region of interest to determine the region of interest and segment the region of interest.

[0226] Taking the region of interest as the region where the reaction chamber is located in the image as an example, when detecting the arrangement of reaction chambers, it is necessary to determine the positions of the reaction chambers in the detection region. Since the reaction chambers are generally circular, in this way, the detection of the chamber center and radius can be realized through the Hough transform. Further, after determining the positions of the reaction chambers according to the chamber center and radius, the segmentation of the reaction chambers can be realized.

[0227] In some embodiments, the above step 421 includes: selecting a corresponding detection region within a predetermined region of the preprocessed image.

[0228] Among them, the preset region can be set by the user according to experience or automatically selected according to an algorithm. Of course, the detection region can also be a region randomly selected in the preprocessed image, and no specific limitation is made here.

[0229] In some embodiments, the detection region is a rectangular region, and the detection region includes at least two rows or at least two columns of partial regions of interest.

[0230] It can be understood that when performing deflection correction on the high-frequency component image to obtain the deflection-corrected image, it is necessary to determine the deflection angle of the high-frequency component image. Since the reaction chambers on the biochip are generally arranged in an array, that is, the regions of interest are generally arranged in an array, in this way, the detection of the image deflection angle can be realized through the arrangement direction of the chambers. Using a rectangular region is beneficial to determining the relative deflection angle between the long side direction of the selected detection region and the arrangement direction of the reaction chambers.

[0231] Among them, including at least two rows or at least two columns of partial regions of interest in the detection region can ensure the detection of the reaction chamber arrangement direction.

[0232] It should be noted that the size of the detection region can be flexibly configured according to the region spacing of the regions of interest and the radius of the regions of interest, etc., and no specific limitation is made here.

[0233] Of course, in other embodiments, the shape of the detection region may not be limited to the above-discussed rectangle, but other suitable shapes such as a square, a triangle, a circle, a parallelogram, etc. can be selected according to actual needs, and no specific limitation is made here.

[0234] In some embodiments, the preset number of detection regions selected each time can be multiple, and the directions of the multiple detection regions can be different, so as to improve the efficiency and accuracy of image deflection angle detection. For example, the preset number of detection regions selected each time can be 9.

[0235] In some embodiments, the above step 42 includes:

[0236] Step 424, performing dilation processing on the segmented image to connect adjacent regions of interest in a preset direction;

[0237] Step 425, taking the largest contour in the detection region after dilation processing and performing principal component analysis to obtain the contour direction; and

[0238] Step 426, determining the image deflection angle according to the contour direction and correcting the preprocessed image to obtain a deflection-corrected image.

[0239] In step 424, the segmented regions of interest can be dilated in a preset direction so that the contours of the regions of interest extend along the preset direction, and thus the contours of adjacent regions of interest are connected to each other. In one example, the preset direction can be the long side direction of the rectangular detection region. Figure 15 The figure shows a schematic diagram of the contour obtained by performing dilation processing on the regions of interest in 9 chambers in a preset direction when the number of detection regions is 9.

[0240] After the contours of the regions of interest are connected, in step 425, the largest contour in the detection region is selected for PCA principal component analysis to obtain the contour direction. It can be understood that since the largest contour is generally formed by connecting adjacent multiple regions of interest, in one example, the obtained contour direction can be used as the arrangement direction of the reaction chambers. In particular, when there are multiple detection regions, the largest contours in multiple detection regions can be selected for PCA principal component analysis to obtain the contour direction.

[0241] Thus, step 425 can determine the image deflection angle of the biochip image and the preprocessed image, and perform deflection angle correction on the biochip image and / or the preprocessed image to obtain a deflection-corrected image.

[0242] In this way, the present application can solve the problem of detecting the deflection angle by forming the largest contour from adjacent co-directional regions of interest and then using the PCA principal component analysis method.

[0243] In some embodiments, the above step 42 includes:

[0244] Step 427, enlarging the selected region by a preset ratio and randomly selecting a preset number of detection regions again in the preprocessed image; and

[0245] Step 428, repeatedly iterating to detect the image deflection angle until the image deflection angle is less than a preset angle threshold to obtain a deflection-corrected image.

[0246] In this way, the image deflection angle is repeatedly iteratively detected through detection regions of different sizes, thereby ensuring the accuracy of the image deflection angle.

[0247] In some embodiments, the value range of the preset angle threshold can be determined by the following conditional expression:

[0248]

[0249] Where θ is the preset angle threshold, dist is the regional spacing of the region of interest, rad is the regional radius of the region of interest, m is the number of rows of the regions of interest in the detection region, and n is the number of columns of the regions of interest in the detection region.

[0250] It should be noted that in some embodiments, the biochip image can be accurately aligned by means of hardware instrument equipment during shooting, so that the deflection correction image can be directly determined according to the biochip image taken after accurate alignment. At this time, the process of detecting the deflection angle of the image can be omitted. In other embodiments, a flag bit can also be set on the biochip entity. After obtaining the biochip image, a relative coordinate system can be constructed by identifying the flag bit on the biochip, the deflection angle of the chip relative to the camera can be obtained, and then the deflection correction image can be obtained through correction.

[0251] Of course, the angle deflection correction is not limited to the above-discussed embodiments, and a suitable correction method can be selected according to the actual situation, so that the analysis device can determine that the regions of interest on the chip satisfy the relative positions of horizontal or vertical arrangement according to the deflection correction image, and no specific limitation is made here.

[0252] In some embodiments, step 42 above includes:

[0253] Step 427', randomly select a preset number of detection regions in the preprocessed image by increasing the selected region by a preset ratio; and

[0254] Step 428', repeat the detection of the image deflection angle a preset number of times to obtain the deflection correction image.

[0255] In this way, by repeatedly detecting the image deflection angle a preset number of times with detection regions of different sizes, the accuracy of the image deflection angle can also be ensured. In one example, the preset number of times can be preset by the system or set by the user according to the actual situation. For example, the preset number of times can be 6 times.

[0256] In some embodiments, step 43 above includes:

[0257] Step 431, construct a notch filter; and

[0258] Step 432, perform filtering processing on the deflection correction image by using the notch filter to obtain a periodic pattern enhanced image.

[0259] Thus, by utilizing the periodic pattern prior of the matrix-type biochip and constructing a notch filter, the noise caused by surface stains, the sample injection process, and the reaction process is minimized.

[0260] In one example, as Figure 16 shown in the amplitude diagram obtained by Fourier-transforming the biochip image in the frequency domain, most of the image information is concentrated in the low-frequency part. Therefore, most of the image noise can be removed by filtering out the image information in the central part. At the same time, the information in the central vertical and central horizontal directions is the most easily filtered periodic pattern information. Thus, the notch filter constructed in step 431 can be as Figure 17 shown to be used to remove the image noise of non-periodic patterns.

[0261] Using a notch filter can make the time and space complexity of the algorithm for the biochip image analysis method in the embodiments of the present application lower, and the performance requirements for hardware devices are more relaxed, thereby reducing costs and improving operation efficiency while ensuring the effect.

[0262] In some embodiments, the above step 433 includes:

[0263] Step 4331, performing a smoothing filtering process on the periodic pattern enhanced image using a box filter;

[0264] Step 4332, integrating the pixel values of the smoothed image in the horizontal and vertical directions to obtain a first integral curve in the horizontal direction and a second integral curve in the vertical direction, and taking the set of minimum value points of the first integral curve and the second integral curve to determine the grid interval lines; and

[0265] Step 4333, dividing the grid regions according to the grid interval lines.

[0266] Thus, smoothing using a box filter is beneficial for weakening the interference of other noise existing in the image, and then dividing the grid regions.

[0267] In certain embodiments, the length and width of the operator of the box filter satisfy the following conditional formula:

[0268]

[0269] where b is the length and width of the operator of the box filter, dist is the region spacing of the region of interest, and rad is the region radius of the region of interest.

[0270] In some embodiments, the above step 43 includes:

[0271] Step 434, detecting the region of interest in the deflection-corrected image using the Hough circle transform; and

[0272] Step 435: Draw a circle based on the detected region of interest for approximation to divide and obtain grid regions.

[0273] That is to say, for the division of grid regions, the Hough transform can also be used to detect the region of interest in the deflection-corrected image, and then draw a circle based on the detected region of interest for approximation to obtain grid regions, thereby achieving the division of grid regions.

[0274] Of course, for the division of grid regions, it is not limited to the above-discussed implementation manners, and other division methods can be used according to needs, which are not specifically limited herein.

[0275] In some embodiments, the above step 44 includes:

[0276] Step 441: Traverse the grid regions and calculate the mean square error of pixel values for each grid region corresponding to the preprocessed image;

[0277] Step 442: When the mean square error is greater than the variance threshold, mark the corresponding region of interest sample as positive; and

[0278] Step 443: When the mean square error is not greater than the variance threshold, mark the corresponding region of interest sample as negative.

[0279] In this way, by comparing the mean square error of pixel values of each grid with the variance threshold, the division of positive and negative is achieved.

[0280] In certain implementation manners, the method for analyzing a biochip image includes: outputting the positive and negative recognition results of the reaction chamber.

[0281] The method for analyzing a biochip image according to the embodiments of the present application can effectively identify the fluorescence image of a high-throughput low signal-to-noise ratio matrix biochip. Specifically, the problem of uneven fluorescence illumination of the microscopic chip is solved by high-frequency filtering; the problem of detecting the deflection angle is solved by the maximum contour PCA principal component analysis method of adjacent co-directional chambers; by using the periodic pattern prior of the matrix biochip, the noise caused by surface stains, the injection process, and the reaction process is minimized by constructing a notch filter, and the automatic analysis of chamber position positioning and sample positive and negative determination is successfully realized.

[0282] The following points need to be noted:

[0283] (1) The attached drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0284] (2) Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0285] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. An analysis device, comprising: A loading part and a transporting part, wherein the loading part adopts a chip loading structure for carrying a detection chip and can be detachably connected to the transporting part; the chip loading structure includes a loading plate body, and the loading plate body has an accommodating space for accommodating the detection chip; On the first surface of the loading plate body, there are provided a first hollowed-out area and at least one second hollowed-out area that penetrate through to the accommodating space. Among them, the first hollowed-out area is used to expose the reaction observation area of the detection chip; at least one of the second hollowed-out areas is used to expose at least one reagent port of the detection chip; A connecting part is further provided on the loading plate body, and the connecting part can be detachably connected to the transporting part in the analysis device for transporting the loading plate body; The transporting part is configured to transport the chip loading structure. The transporting part includes: a transporting structure configured to carry the chip loading structure and can be at least partially driven; the transporting structure includes: a carrier table configured to carry the chip loading structure during use; on the bearing surface of the carrier table, there is provided an installation groove for accommodating the loading plate body, and on the first side surface of the carrier table, there is provided an installation groove opening communicating with the installation groove for the loading plate body to be moved into or out of the installation groove. The first side surface is perpendicular to the first moving direction in which the carrier table moves into the analysis device and is the side surface facing backward in the first moving direction; And, a plug-in part protruding from the side surface of the installation groove toward the direction of the third axis close to the installation groove is further provided on the carrier table; the third axis is parallel to the first moving direction; Slot groups are respectively provided on two side surfaces of the loading plate body located on both sides of the first axis on the first surface. Each slot group includes one or a plurality of slots spaced along the first axis. The slots are used for the connecting part to be plugged into the plug-in part in the transporting part one by one; the direction of the first axis when the loading plate body is placed on the transporting part is parallel to the first moving direction in which the transporting part moves into the analysis device; On the second surface of the loading plate body facing away from the first surface, there is provided a socket communicating with the slot for the corresponding plug-in part to be moved into or out of the slot; and, on the side surface of the slot located on one side of its second axis, there is provided a limiting convex part protruding toward the direction close to the second axis relative to the side surface for limiting the plug-in part in the slot when the plug-in part moves to the interval position between the limiting convex part and the bottom surface of the slot opposite thereto; the second axis of the slot is parallel to the moving direction of the plug-in part moving into or out of the slot; 2. The analysis device according to claim 1, wherein, On the first surface and at the position where the first hollowed-out area is located, there is provided a first recess. The orthographic projection area of the first recess on the first surface is larger than the orthographic projection area of the first hollowed-out area on the first surface, and the orthographic projection of the first recess on the first surface completely covers the orthographic projection of the first hollowed-out area on the first surface.

3. The analysis device according to claim 1, wherein The orthographic projection shape of the first hollow area on the first plate surface includes a square, a rectangle or a circle.

4. The analysis device according to claim 1, wherein There are a plurality of the second hollow areas, which are arranged at intervals along a first axis of the first plate surface. The direction of the first axis when the loading plate body is placed on the conveying part is parallel to a first moving direction in which the conveying part moves into the analysis device.

5. The analysis device according to claim 4, wherein, On the first plate surface and at the position of each of the second hollow areas, a second recessed part is provided. The orthographic projection area of the second recessed part on the first plate surface is larger than the orthographic projection area of the second hollow area on the first plate surface, and the orthographic projection of the second recessed part on the first plate surface completely covers the orthographic projection of the second hollow area on the first plate surface.

6. The analysis device according to claim 5, wherein, When the loading plate body is placed on the conveying part, the orthographic projection area of the second recessed part at the rear in the first moving direction on the first plate surface is larger than the orthographic projection area of the second recessed part at the front in the first moving direction on the first plate surface; The orthographic projection of the second recessed part at the rear in the first moving direction on the first plate surface is an oblong shape; The orthographic projection of the second recessed part at the front in the first moving direction on the first plate surface is a circular shape.

7. The analysis device according to claim 1, wherein The detection chip further has a heating electrode; a third hollow area penetrating through to the accommodation space is provided on the first plate surface for exposing the heating electrode.

8. The analysis device according to claim 7, wherein, The third hollow area extends to a first side edge of the first plate surface; The first side edge is perpendicular to the first axis of the first plate surface; the direction of the first axis when the loading plate body is placed on the conveying part is parallel to the first moving direction in which the conveying part moves into the analysis device, and the first side edge is the side edge at the front in the first moving direction.

9. The analysis device according to claim 1, wherein, An accommodation groove is provided on a second plate surface of the loading plate body opposite to the first plate surface to form the accommodation space, and a protruding structure is provided on an inner side surface of the accommodation groove to limit the detection chip in the accommodation groove.

10. The analysis device according to claim 9, wherein, The protruding structure includes two groups of convex part groups distributed on both sides of the first axis of the first plate surface. Each group of convex part groups includes a plurality of convex parts distributed at intervals along the first axis. Each convex part protrudes from the inner side surface of the accommodation groove towards the direction close to the first axis to abut against the side surface of the detection chip placed in the accommodation groove; The direction of the first axis when the loading plate body is placed on the conveying part is parallel to the first moving direction in which the conveying part moves into the analysis device.

11. The analysis device according to claim 10, wherein, The orthographic projection shape of the convex part on the second plate surface includes an arc shape.

12. The analysis device according to claim 9, wherein, The accommodation groove extends to a second side edge of the second plate surface; The second side edge is perpendicular to the first axis of the first plate surface; the direction of the first axis when the loading plate body is placed on the conveying part is parallel to the first moving direction in which the conveying part moves into the analysis device, and the second side edge is the side edge at the front in the first moving direction.

13. The analysis device according to claim 7 further comprises: A temperature control part and a signal detection part, wherein, The temperature control unit includes a heater and a cooler. Among them, the heater is configured to heat the detection chip, and the cooler is configured to cool down the detection chip; and The signal detection unit includes an optical sensor. Among them, the optical sensor is configured to receive light from the detection chip and perform detection based on the light.

14. The analysis device according to claim 13, wherein, The transport unit further includes: A driver configured to be able to drive the transport structure to reciprocate the chip loading structure between a first position, a second position, and a third position, wherein the first position allows the chip loading structure to be received in the transport structure; the second position allows the temperature control unit to adjust the temperature of the detection chip; and the third position allows the optical sensor of the signal detection unit to receive the light from the detection chip.

15. The analysis device according to claim 14, wherein, The transport structure further includes: A movable platform configured to be connected to the driver to move under the drive of the driver; and A bracket configured to connect the stage and the movable platform, so that when the movable platform is driven, the stage can be driven.

16. The analysis device according to claim 13, wherein, The heater includes at least one contact electrode, and at least one of the contact electrodes is configured to be in one-to-one electrical contact with at least one of the heating electrodes of the detection chip during use; The heater is further configured to apply an electrical signal to the heating electrode of the detection chip through the contact electrode, so that the heating electrode heats the detection chip.

17. The analysis device according to claim 16, wherein, The contact electrode is fixed on the bearing surface of the stage and is located on the side of the mounting groove opposite to the opening of the mounting groove, and one end of the contact electrode protrudes in a direction opposite to the first moving direction in which the stage is moved into the analysis device relative to the side surface of the mounting groove; The contact electrode is provided with a contact portion for electrical contact with the heating electrode, and the contact portion protrudes in a direction close to the heating electrode relative to the surface of the contact electrode opposite to the heating electrode; and the heater further includes an elastic member, and the elastic member is respectively connected to the contact electrode and the stage to apply a pulling force towards the bearing surface of the stage to the contact electrode.

18. The analysis device according to claim 17, wherein, The elastic member includes a spring.

19. The analysis device according to claim 16, wherein, An electrode slot is provided on the bearing surface of the stage, the contact electrode is inserted into the electrode slot, and the contact electrode and the stage are fixedly connected by a fastener.

20. The analysis device according to claim 13, wherein, The signal detection unit further includes: A light source configured to provide light to irradiate the detection chip during use; A light transmission unit configured to transmit the light provided by the light source to the detection chip during use and transmit the light emitted by the detection chip to the optical sensor; and A bracket is used to fix and carry the light source and the optical transmission part, and a focal length adjustment structure is further provided on the bracket. The focal length adjustment structure is configured to adjust the distance between the optical transmission part and the detection chip so that the detection chip is located at the focal point of the optical transmission part. Moreover, the focal length adjustment structure has a focal length adjustment knob and a knob extension part connected to the focal length adjustment knob, and the knob extension part extends to the side close to the optical transmission part for easy manual adjustment.

21. An analysis system, comprising: The analysis device according to any one of claims 1 to 20; And The detection chip.

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