A thermistor welding method and welding fixing equipment

Abstract

This invention relates to a thermistor welding method and welding fixing equipment, comprising the following steps: using a gripper to fix the thermistor to a preset welding position on a semiconductor module; using laser welding technology to weld the thermistor to the preset welding position on the semiconductor module; and driving the gripper to release and return to its original position. The thermistor welding method and welding fixing equipment provided by this invention effectively fix the thermistor by the gripper during the welding process, reducing the possibility of the thermistor moving during welding, thereby reducing the probability of cold solder joints. Furthermore, the use of laser welding technology for welding the thermistor results in higher welding stability and is more efficient and reliable than traditional welding methods. Therefore, it effectively avoids quality defects caused by thermistor position displacement and solder migration.

Description

Technical Field

[0001] This invention relates to the field of IGBT module welding technology, and in particular to a thermistor welding method and welding fixing equipment. Background Technology

[0002] IGBT modules are modular semiconductor products composed of IGBT (Insulated Gate Bipolar Transistor) chips and FWD (Freewheeling Diode) chips, packaged together using a specific circuit bridge. The packaged IGBT modules are directly applied to equipment such as frequency converters and UPS (Uninterruptible Power Supply). IGBT modules feature energy saving, convenient installation and maintenance, and stable heat dissipation. With the advancement of energy conservation and environmental protection concepts, IGBT modules will become increasingly popular in the market.

[0003] In the design and application of power semiconductor modules (IGBT modules), the chip temperature of the IGBT module is a crucial parameter of the power electronic system. Since the chip temperature cannot be directly measured during system operation, other temperature sensors are needed, such as the NTC resistor built into the IGBT module. Based on the real-time value of the NTC resistor, the chip temperature is indirectly estimated by referring to a pre-measured NTC resistance-temperature relationship curve. Therefore, the reliability of the NTC soldering is particularly important; the number of IGBT modules scrapped due to abnormal NTC soldering accounts for approximately 0.3%.

[0004] In related technologies, the current industry standard for NTC resistor installation is surface mounting followed by reflow soldering. This method suffers from the problem of cold solder joints in NTC resistors. Various methods, such as changing the NTC resistor's shape, slotting the substrate, and applying NTC adhesive, have failed to resolve this issue. Changing the NTC resistor's shape typically involves altering its shape from round to square before reflow soldering. Slotting the substrate involves using a slotted substrate to hold the NTC resistor before reflow soldering. Applying NTC adhesive typically involves using an NTC adhesive application process before reflow soldering.

[0005] Therefore, it is necessary to design a new thermistor welding method and welding fixing equipment to solve the above problems. Summary of the Invention

[0006] This invention provides a thermistor welding method and welding fixing equipment to solve the problem of poor soldering of NTC resistors in related technologies that use reflow soldering after mounting.

[0007] In a first aspect, a thermistor welding method is provided, comprising the following steps: using a gripping mechanism to fix the thermistor to a preset welding position on a semiconductor module; using laser welding technology to weld the thermistor to the preset welding position on the semiconductor module; and driving the gripping mechanism to release and return to its original position.

[0008] In some embodiments, the step of using laser welding technology to weld the thermistor to a preset welding position on the semiconductor module includes: using a solder wire feeding mechanism to move the solder wire to the opposite ends of the thermistor; driving the laser welding head to move to the thermistor and performing laser welding on the thermistor.

[0009] In some embodiments, before using the gripping mechanism to fix the thermistor to a preset welding position on the semiconductor module, the method further includes: using a camera to identify the preset welding position on the semiconductor module; and using the gripping mechanism to move the thermistor to the identified preset welding position.

[0010] In some embodiments, the gripping mechanism includes a gripper and two alignment pins; moving the thermistor to the identified preset welding position using the gripping mechanism includes: using the gripper to grasp the middle position of the thermistor from the feeding mechanism; controlling the gripper to move the thermistor between the two alignment pins, so that the two alignment pins are respectively aligned and abut against the opposite ends of the thermistor; controlling the gripper and the two alignment pins to move synchronously, moving the thermistor to the identified preset welding position, and maintaining this state.

[0011] In some embodiments, before identifying the preset welding position of the semiconductor module using a camera, the method further includes: fixing the semiconductor module to a clamping fixture; and using a transverse slide rail to move the clamping fixture so that the semiconductor module is moved below the camera.

[0012] Secondly, a thermistor welding and fixing device is provided, comprising: a main body, on which a clamping fixture is provided for fixing a semiconductor module, and a laser welding head is also mounted on the main body; a gripping mechanism and a controller, wherein the controller is signal-connected to the laser welding head and signal-connected to the gripping mechanism, the controller being used to control the gripping mechanism to grip the thermistor and fix the thermistor to a preset welding position on the semiconductor module; the controller is also used to control the laser welding head to move to the thermistor and perform laser welding on the thermistor.

[0013] In some embodiments, the thermistor welding and fixing equipment further includes a solder wire feeding mechanism, which is signal-connected to the controller. The solder wire feeding mechanism includes a wire feeding rod with a through hole for the solder wire to pass through. The controller is also used to control the wire feeding rod to feed the solder wire to the end of the thermistor.

[0014] In some embodiments, the main body is further equipped with a longitudinal slide rail, on which a first vertical drive mechanism is mounted. Both the longitudinal slide rail and the first vertical drive mechanism are signal-connected to the controller. The thermistor welding and fixing device also includes a camera, which is mounted on the first vertical drive mechanism via a fixing bracket. The controller is also used to control the longitudinal slide rail to drive the camera to move longitudinally and to control the first vertical drive mechanism to drive the camera to move vertically. The controller is also used to control the camera to take pictures of the semiconductor module.

[0015] In some embodiments, the thermistor welding fixing device further includes a solder wire feeding mechanism, and both the solder wire feeding mechanism and the laser welding head are mounted on the fixing bracket.

[0016] In some embodiments, the gripping mechanism includes a fixed plate on which a gripper and two alignment pins are mounted. The gripper is located between the two alignment pins and is mounted on the fixed plate via a second vertical drive mechanism. The gripper is used to grasp the middle position of the thermistor and moves the thermistor between the two alignment pins via the second vertical drive mechanism. The two alignment pins are respectively used to align and abut against the opposite ends of the thermistor.

[0017] In some embodiments, the fixing plate includes a horizontal plate and inclined plates fixed on opposite sides of the horizontal plate; the two alignment pins are respectively mounted on the two inclined plates, such that the tips of the two alignment pins extend inclinedly towards each other.

[0018] In some embodiments, a transverse slide rail is also mounted on the main body, the transverse slide rail is signal-connected to the controller, and the clamping fixture is mounted on the transverse slide rail; the controller is also used to control the transverse slide rail to drive the clamping fixture to move, so that the semiconductor module moves to below the camera.

[0019] The beneficial effects of the technical solution provided by this invention include:

[0020] This invention provides a thermistor welding method and welding fixing equipment. Since the thermistor is effectively fixed by the gripper during the welding process, the possibility of the thermistor moving during the welding process can be reduced, thereby reducing the probability of the thermistor having a cold solder joint. Furthermore, the use of laser welding technology to weld the thermistor results in higher welding stability and is more efficient and reliable than traditional welding methods. Therefore, it can effectively avoid quality defects caused by thermistor position displacement and solder migration. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of a thermistor welding and fixing device provided in an embodiment of the present invention;

[0023] Figure 2 A three-dimensional structural schematic diagram of a thermistor welding and fixing device provided in an embodiment of the present invention from another perspective;

[0024] Figure 3 This is a side view schematic diagram of a thermistor welding and fixing device provided in an embodiment of the present invention;

[0025] Figure 4 This is a front view schematic diagram of a thermistor welding and fixing device provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram from another side of a thermistor welding and fixing device provided in an embodiment of the present invention;

[0027] Figure 6 This is a top view schematic diagram of a thermistor welding and fixing device provided in an embodiment of the present invention.

[0028] In the picture:

[0029] 1. Main body; 11. Clamping fixture; 12. First drive mechanism; 13. Second drive mechanism; 14. Longitudinal slide rail; 15. First vertical drive mechanism; 16. Transverse slide rail;

[0030] 2. Semiconductor module; 3. Laser welding head; 4. Gripping mechanism; 41. Gripper; 42. Alignment pin; 43. Fixing plate; 431. Horizontal plate; 432. Inclined plate; 5. Feeding mechanism; 6. Solder wire feeding mechanism; 61. Wire feeder; 7. Camera; 8. Fixing bracket. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] In related technologies, the soldering and fixing method for NTC resistors has the following two disadvantages:

[0033] 1. NTC resistors are prone to rolling, causing them to deviate from their solder joint positions and resulting in NTC solder joint defects.

[0034] 2. Current vacuum reflow soldering uses a high-temperature process to melt the NTC resistor pads, which can lead to two soldering anomalies: 1) solder tends to climb, causing solder to accumulate on one side; 2) molten solder remaining in a flowing state for an extended period can cause the NTC resistor to shift. Both anomalies can result in cold solder joints on the NTC resistor.

[0035] This invention provides a thermistor welding method and welding fixing equipment, which can solve the problem of poor soldering of NTC resistors in related technologies that use reflow soldering after mounting.

[0036] See Figures 1 to 2 As shown, this embodiment of the invention provides a thermistor welding method, which may include the following steps:

[0037] S1: Use the gripping mechanism 4 to fix the thermistor to the preset soldering position of the semiconductor module 2.

[0038] The semiconductor module 2 can have pre-reserved positions for soldering thermistors, i.e., preset soldering positions, and the number and distribution of these preset soldering positions can be designed according to actual needs. In this embodiment, the gripping mechanism 4 can be either grippers clamping onto opposite sides of the thermistor or suction cups adsorbed onto the surface of the thermistor, as long as it can grip the thermistor. Furthermore, after placing the thermistor in the preset soldering position, the gripping mechanism 4 can maintain it in that position and apply a certain force to the thermistor, keeping the relative position of the thermistor and the semiconductor module 2 fixed and preventing it from easily moving.

[0039] Furthermore, in this embodiment, the semiconductor module 2 is preferably a power semiconductor module 2 (i.e., an IGBT module), that is, a thermistor is soldered onto the IGBT module, and the thermistor is preferably an NTC resistor. Of course, in other embodiments, if other types of semiconductor modules 2 require soldering thermistors, a similar soldering method to that of this application can be used, which is applicable to the soldering process of various similar small objects.

[0040] S2: The thermistor is welded to the preset welding position of the semiconductor module 2 using laser welding technology. In this embodiment, during the laser welding process of the thermistor, the gripping mechanism 4 keeps the thermistor fixed to prevent displacement.

[0041] S3: Drive the gripping mechanism 4 to release and return to its original position. In this step, after the thermistor welding is completed, the gripping mechanism 4 can be released and returned to its original position, and the welding of the next thermistor can be carried out.

[0042] In this embodiment of the invention, since the thermistor is effectively fixed by the gripping mechanism 4 during the welding process, the relative position of the thermistor and the semiconductor module 2 is maintained, which can reduce the possibility of the thermistor moving during the welding process, thereby reducing the probability of the thermistor having a cold solder joint. Moreover, the use of laser welding technology to weld the thermistor results in higher welding stability and is more efficient and reliable than traditional welding methods. Therefore, it can effectively avoid quality defects caused by thermistor position shift and solder migration.

[0043] In some embodiments, the laser welding technique used to weld the thermistor to a preset welding position on the semiconductor module 2 may include: using a solder wire feeding mechanism 6 to feed the solder wire to the opposite ends of the thermistor; and driving the laser welding head 3 to move to the thermistor to perform laser welding. In this embodiment, the solder wire feeding mechanism 6 is used to achieve automated wire feeding, which has a high degree of automation and strong portability, and can be applied to welding processes for various similar small objects. When welding the thermistor, the laser welding head 3 can first move to one end of the thermistor to perform laser welding on that end, and then move to the other end of the thermistor to perform laser welding on the other end. Of course, two laser welding heads 3 can also be set up, and both laser welding heads 3 can be driven to weld both ends of the thermistor simultaneously.

[0044] In some alternative embodiments, see Figure 4 and Figure 5As shown, before fixing the thermistor to the preset welding position of the semiconductor module 2 using the gripping mechanism 4, the method may further include: using a camera 7 to identify the preset welding position of the semiconductor module 2; wherein, the camera 7 can take a picture of the semiconductor module 2, and then accurately obtain the position information of the preset welding position from the captured image; then, the gripping mechanism 4 is used to move the thermistor to the identified preset welding position. In this embodiment, the camera 7 ensures the uniqueness of the preset welding position, and the thermistor is placed according to the identified position and fixed by the gripping mechanism 4, which not only ensures the accuracy of the thermistor placement position, but also reduces the possibility of the thermistor movement, making the position of the thermistor more accurate after welding.

[0045] In some embodiments, see Figure 3 and Figure 5 As shown, the gripping mechanism 4 includes a gripper 41 and two alignment pins 42. Moving the thermistor to the identified preset welding position using the gripping mechanism 4 may include: using the gripper 41 to grasp the middle position of the thermistor from the feeding mechanism 5, where the middle position can be understood as any position between the two ends of the thermistor; controlling the gripper 41 to move the thermistor between the two alignment pins 42, so that the two alignment pins 42 are respectively aligned and abut against the opposite ends of the thermistor. In this embodiment, one alignment pin 42 abuts against the front end of the thermistor, and one alignment pin 42 abuts against the rear end of the thermistor, ensuring accurate front-to-back alignment of the thermistor; controlling the gripper 41 and the two alignment pins 42 to move synchronously, moving the thermistor to the identified preset welding position, and maintaining this state. Since the gripper 41 may grip the thermistor in different positions each time, the thermistor may not be placed accurately in the preset welding position. In this embodiment, the gripper 41 is used in conjunction with two front and rear alignment pins 42 to align and clamp the thermistor together. This not only ensures the clamping and fixing of the thermistor, but also further ensures the accurate alignment of the front and rear positions of the thermistor with the preset welding position, thereby improving the welding accuracy of the thermistor.

[0046] Further, see Figure 6 As shown, before using the camera 7 to identify the preset welding position of the semiconductor module 2, the process may further include: fixing the semiconductor module 2 onto the clamping fixture 11. This can be done manually by placing the semiconductor module 2 onto the clamping fixture 11 and fixing it with the clamping jaws of the clamping fixture 11, or by using a robotic arm to move the semiconductor module 2 onto the clamping fixture 11. Then, the horizontal slide rail 16 can be used to drive the clamping fixture 11 to move laterally, so that the semiconductor module 2 is moved below the camera 7, so that the camera 7 can take pictures and identify the semiconductor module 2, further improving the automation of the welding method.

[0047] The thermistor welding method provided in this embodiment of the invention can be performed using any of the following embodiments of the welding and fixing equipment, and the specific structure of the welding and fixing equipment will not be described in detail here.

[0048] See Figure 1 As shown, this embodiment of the invention also provides a thermistor welding and fixing device, which may include: a main body 1, on which a clamping fixture 11 is provided, wherein the position of the clamping fixture 11 may be fixed or movable on the main body 1, the clamping fixture 11 is used to fix a semiconductor module 2, the clamping fixture 11 may have a clamp, and when the semiconductor module 2 is placed on the clamping fixture 11, the semiconductor module 2 can be clamped and fixed by the clamp; a laser welding head 3 may also be installed on the main body 1, the laser welding head 3 can perform laser welding on the thermistor; a gripping mechanism 4, the gripping mechanism 4 may be installed on the main body 1 or set in other positions outside the main body 1, and may be located on the adjacent side of the main body 1; and a controller, the controller may be signal connected to the laser welding head 3 and the gripping mechanism 4, the controller is used to control the gripping mechanism 4 to grip the thermistor and fix the thermistor to a preset welding position of the semiconductor module 2; the controller is also used to control the laser welding head 3 to move to the thermistor and perform laser welding on the thermistor.

[0049] In this embodiment of the invention, the thermistor is effectively fixed by the gripping mechanism 4 during the welding process, maintaining the relative position of the thermistor and the semiconductor module 2. This reduces the possibility of the thermistor moving during welding, thereby reducing the probability of cold solder joints. Furthermore, the use of laser welding technology for thermistor welding results in higher welding stability and is more efficient and reliable than traditional welding methods. Therefore, it effectively avoids quality defects caused by thermistor displacement and solder migration. Moreover, the entire welding process can be automated using a controller, making the automation design simpler, more portable, and applicable to welding processes for various similar small objects.

[0050] Furthermore, a feeding mechanism 5 can be installed on the main body 1. The feeding mechanism 5 can store multiple thermistors. The thermistors can be fixed on the material strip, and the material strip can be wound around the feeding mechanism 5. By rotating the feeding mechanism 5, the thermistors arranged on the material strip can be sequentially conveyed to the discharge port. The discharge port can be equipped with a limit device to limit the position of the thermistors. The gripping mechanism 4 can move to the limit device to grip the thermistor each time. By setting the limit device, it can be ensured that the gripping mechanism 4 accurately grips the thermistor each time.

[0051] In this embodiment, the gripping mechanism 4 is preferably installed on the main body 1, and the gripping mechanism 4 can be installed on the main body 1 through the first driving mechanism 12, which can drive the gripping mechanism 4 to move longitudinally.

[0052] Furthermore, the gripping mechanism 4 can be mounted on the first drive mechanism 12 via the second drive mechanism 13. The first drive mechanism 12 can drive the second drive mechanism 13 together with the gripping mechanism 4 to move longitudinally, and the second drive mechanism 13 can drive the gripping mechanism 4 to move up and down in the vertical direction.

[0053] In some embodiments, see Figure 3 and Figure 5 As shown, the gripping mechanism 4 may include a fixed plate 43, on which a gripper 41 and two alignment pins 42 are mounted. The gripper 41 is located between the two alignment pins 42, and the gripper 41 can be mounted on the fixed plate 43 by a second vertical drive mechanism. The second vertical drive mechanism can drive the gripper 41 to move up and down, so that the gripper 41 moves downward to the limiting device of the feeding mechanism 5 to grip the thermistor, and then the gripper 41 can move upward. The gripper 41 is used to grip the middle position of the thermistor and move the thermistor between the two alignment pins 42 through the second vertical drive mechanism. The middle position can be understood as any position between the two ends of the thermistor. The two alignment pins 42 are respectively used to align and hold the thermistor against the opposite ends. Since the gripper 41 may grip the thermistor in different positions each time, the thermistor may not be placed accurately in the preset welding position. In this embodiment, the gripper 41 is used in conjunction with two front and rear alignment pins 42 to align and clamp the thermistor together. This not only ensures the clamping and fixing of the thermistor, but also further ensures the accurate alignment of the front and rear positions of the thermistor with the preset welding position, thereby improving the welding accuracy of the thermistor.

[0054] Of course, in other embodiments, a separate gripper 41 can also be provided to grip the thermistor.

[0055] In some alternative embodiments, see Figure 3 As shown, the fixing plate 43 may include a horizontal plate 431 and inclined plates 432 fixed on opposite sides of the horizontal plate 431, with the inclined plates 432 and the horizontal plate 431 forming a preset angle. Two alignment pins 42 are respectively mounted on the two inclined plates 432, with the tips of the two alignment pins 42 extending inclinedly towards each other. This arrangement allows the two alignment pins 42 to abut against the ends of the thermistor from both sides, limiting and fixing the thermistor while also providing sufficient space for the laser welding head 3.

[0056] Furthermore, in this embodiment, the alignment pin 42 is preferably conical, and becomes more pointed closer to the free end, so that the alignment pin 42 is less likely to collide with other surrounding components during the clamping process of the thermistor, thereby further reducing the risk of the thermistor displacement.

[0057] See Figure 4 As shown, in some embodiments, the thermistor welding and fixing equipment may further include a solder wire feeding mechanism 6. The solder wire feeding mechanism 6 may be installed on the main body 1 or disposed on the adjacent side of the main body 1. The solder wire feeding mechanism 6 is signal-connected to the controller. The solder wire feeding mechanism 6 may include a wire feeding rod 61, which has a through hole for the welding wire to pass through. The controller is also used to control the wire feeding rod 61 to feed the welding wire to the end of the thermistor. The welding wire can extend from the end of the wire feeding rod 61 to the thermistor.

[0058] The welding wire feeding mechanism 6 may also include a turntable, a guide mechanism and a motor. The welding wire can be wound on the turntable, and the motor can drive the turntable to rotate around its axis, so that the welding wire on the turntable can move forward. The guide mechanism can guide the welding wire into the wire feeding rod 61.

[0059] In some embodiments, see Figure 1 and Figure 2 As shown, a longitudinal slide rail 14 can also be installed on the main body 1. A first vertical drive mechanism 15 is installed on the longitudinal slide rail 14, and the first vertical drive mechanism 15 can move along the longitudinal slide rail 14. Both the longitudinal slide rail 14 and the first vertical drive mechanism 15 are signal connected to the controller. The thermistor welding and fixing device also includes a camera 7, which is mounted on the first vertical drive mechanism 15 via a fixing bracket 8, so that the camera 7 can move together with the first vertical drive mechanism 15. The controller is also used to control the longitudinal slide rail 14 to drive the camera 7 to move longitudinally, and to control the first vertical drive mechanism 15 to drive the camera 7 to move vertically. That is, the first vertical drive mechanism 15 can drive the camera 7 to move vertically, and the first vertical drive mechanism 15 can also move along the longitudinal slide rail 14, thereby driving the camera 7 to achieve longitudinal movement.

[0060] In this embodiment, the controller is also used to control the camera 7 to take pictures of the semiconductor module 2, and to identify the preset welding position of the semiconductor module 2 using the camera 7. After the camera 7 takes a picture of the semiconductor module 2, the position information of the preset welding position can be accurately obtained from the captured image. Then, the gripping mechanism 4 can be used to move the thermistor to the preset welding position identified by the camera 7. In this embodiment, the camera 7 ensures the uniqueness of the preset welding position. Placing the thermistor according to the identified position and fixing it with the gripping mechanism 4 ensures the accuracy of the thermistor placement and reduces the possibility of thermistor movement, making the position of the thermistor more precise after welding.

[0061] In this embodiment, multiple clamping fixtures 11 can be set on the main body 1. For example, two clamping fixtures 11 can be set to fix two semiconductor modules 2 at the same time. The camera 7 can be driven to move from one semiconductor module 2 to another semiconductor module 2 through the longitudinal slide rail 14, so that one camera 7 can take pictures of multiple semiconductor modules 2.

[0062] In some alternative embodiments, see Figure 5 As shown, the laser welding head 3 can be mounted on the fixed bracket 8, that is, the laser welding head 3 can move together with the camera 7. In addition, the aforementioned wire feeder 61 can also be mounted on the fixed bracket 8. This arrangement not only reduces the number of drive mechanisms used, but also ensures the relative positional relationship between the wire feeder 61 and the laser welding head 3.

[0063] In some embodiments, see Figure 6 As shown, a transverse slide rail 16 can also be installed on the main body 1. The transverse slide rail 16 is perpendicular to the longitudinal slide rail 14. The transverse slide rail 16 can be signal-connected to the controller. The clamping fixture 11 is installed on the transverse slide rail 16. The controller is also used to control the transverse slide rail 16 to move the clamping fixture 11, so that the semiconductor module 2 moves below the camera 7. That is, the initial position of the clamping fixture 11 may not be below the camera 7, but may be on one side of the camera 7, which facilitates the fixing of the semiconductor module 2 upon arrival.

[0064] Furthermore, the main body 1 is preferably provided with two transverse slide rails 16, and each transverse slide rail 16 can be provided with at least one clamping fixture 11. Each clamping fixture 11 can fix a semiconductor module 2, thereby enabling the simultaneous welding of thermistors to multiple semiconductor modules 2.

[0065] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0066] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0067] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for welding thermistors, characterized in that, It includes the following steps: The thermistor is fixed to the preset soldering position of the semiconductor module (2) using the gripping mechanism (4); The thermistor is welded to the preset welding position of the semiconductor module (2) using laser welding technology; wherein during the laser welding process of the thermistor, the gripping mechanism (4) keeps the thermistor fixed to prevent the thermistor from shifting. Drive the gripping mechanism (4) to release and return to its original position; The gripping mechanism (4) includes a gripper (41), two alignment pins (42), and a fixing plate (43). The gripper (41) and the two alignment pins (42) are mounted on the fixing plate (43). The gripper (41) is located between the two alignment pins (42), and the gripper (41) is mounted on the fixing plate (43) via a second vertical drive mechanism. The fixing plate (43) includes a horizontal plate (431) and inclined plates (432) fixed on opposite sides of the horizontal plate (431). The two alignment pins (42) are respectively mounted on the two inclined plates (432), so that the tips of the two alignment pins (42) extend inclinedly towards each other. The step of using the gripping mechanism (4) to move the thermistor to the identified preset welding position includes: Use the gripper (41) to clamp the thermistor at the middle position from the feeding mechanism (5); Control the gripper (41) to move the thermistor between the two alignment pins (42), so that the two alignment pins (42) are respectively aligned and abut against the opposite ends of the thermistor; The gripper (41) and the two alignment pins (42) are controlled to move synchronously, moving the thermistor to the identified preset welding position and maintaining this state.

2. The thermistor welding method as described in claim 1, characterized in that, The step of welding the thermistor to the preset welding position of the semiconductor module (2) using laser welding technology includes: The solder wire is fed to the opposite ends of the thermistor using the solder wire feeding mechanism (6); Drive the laser welding head (3) to move to the thermistor and perform laser welding on the thermistor.

3. The thermistor welding method as described in claim 1, characterized in that, Before using the gripping mechanism (4) to fix the thermistor to the preset welding position of the semiconductor module (2), the method further includes: The camera (7) is used to identify the preset welding position of the semiconductor module (2); The thermistor is moved to the identified preset welding position using the gripping mechanism (4).

4. A thermistor welding and fixing device, characterized in that, It includes: The main body (1) is provided with a clamping fixture (11) for fixing the semiconductor module (2), and a laser welding head (3) is also installed on the main body (1). The gripping mechanism (4) and the controller are connected to the laser welding head (3) and the gripping mechanism (4). The controller is used to control the gripping mechanism (4) to grip the thermistor and fix the thermistor to the preset welding position of the semiconductor module (2). The controller is also used to control the laser welding head (3) to move to the thermistor and perform laser welding on the thermistor; The gripping mechanism (4) includes a fixed plate (43), on which a gripper (41) and two alignment pins (42) are mounted. The gripper (41) is located between the two alignment pins (42), and the gripper (41) is mounted on the fixed plate (43) by a second vertical drive mechanism. The fixed plate (43) includes a horizontal plate (431) and inclined plates (432) fixed on opposite sides of the horizontal plate (431). The two alignment pins (42) are respectively mounted on the two inclined plates (432), so that the tips of the two alignment pins (42) extend inclinedly towards each other. The gripper (41) is used to clamp the middle position of the thermistor and move the thermistor between the two alignment pins (42) through the second vertical driving mechanism; and the two alignment pins (42) are respectively used to align and hold the thermistor at opposite ends.

5. The thermistor welding and fixing equipment as described in claim 4, characterized in that: The thermistor welding and fixing equipment also includes a solder wire feeding mechanism (6), which is connected to the controller. The solder wire feeding mechanism (6) includes a wire feeding rod (61), which has a through hole for the solder wire to pass through. The controller is also used to control the wire feeder (61) to feed the welding wire to the end of the thermistor.

6. The thermistor welding and fixing equipment as described in claim 5, characterized in that: The main body (1) is also equipped with a longitudinal slide rail (14), and a first vertical drive mechanism (15) is installed on the longitudinal slide rail (14). Both the longitudinal slide rail (14) and the first vertical drive mechanism (15) are connected to the controller signal. The thermistor welding and fixing device also includes a camera (7), which is mounted on the first vertical drive mechanism (15) via a fixing bracket (8). The controller is also used to control the longitudinal slide rail (14) to drive the camera (7) to move longitudinally, and to control the first vertical drive mechanism (15) to drive the camera (7) to move vertically; The controller is also used to control the camera (7) to take pictures of the semiconductor module (2).

7. The thermistor welding and fixing equipment as described in claim 6, characterized in that: The thermistor welding fixing equipment also includes a solder wire feeding mechanism (6), and the solder wire feeding mechanism (6) and the laser welding head (3) are both installed on the fixing bracket (8).

Images