A substrate processing equipment

Abstract

This invention relates to the field of substrate processing technology and discloses a substrate processing apparatus. The substrate processing apparatus includes a support frame and a carrying platform, a cutting device, a splitting device, and a feeding device sequentially arranged along the X-direction on the support frame. The apparatus also includes a first driving assembly and a second driving assembly. Substrates are stacked in a housing, which is placed on the carrying platform. The first driving assembly moves the substrates in the housing to the cutting device, which is configured to cut the substrates. The second driving assembly moves the cut substrates to the splitting device, which is configured to split the cut substrates. The second driving assembly further moves the split substrates to the feeding device, which is configured to move the split substrates into a basket. This invention achieves automated substrate processing, improves processing efficiency, reduces labor costs, and increases product yield.

Description

Technical Field

[0001] This invention relates to the field of substrate processing technology, and in particular to a substrate processing apparatus. Background Technology

[0002] Currently, in the electronic paper industry, electronic paper display screens consist of TFT driver backplanes, IC chips, flexible circuit board cables, FPL films, and PS films. The main function of the TFT driver backplane is that it integrates numerous thin-film transistors within the TFT. Due to the photoconductivity of semiconductors, which serves as the voltage drive output carrier, the cleanliness, contamination, and surface scratches and damage requirements of the backplane display surface are extremely high. The substrate itself has a relatively complex manufacturing process and a large size. Currently, the 5.5-generation and 8.5-generation yellow lasers produce large substrates, which are cut into four medium-sized substrates before shipment. Each medium-sized substrate contains multiple small TFT driver backplanes, which need to be cut and split in the factory before they can be put into production. The TFT driver backplanes are packaged by standing them upright in boxes, which can cause scratches if the products come into direct contact. Therefore, the factory needs more space for material storage.

[0003] Furthermore, the current method of receiving TFT driver backplanes is through intermediate wafers. Subsequent processing of TFT driver backplanes is all done manually. When cutting and splitting wafers, operators are prone to scratching the TFT driver backplanes. Dust easily accumulates on the surface during cutting, and operators may touch the product surface when breaking the wafers, which may lead to scratches on the PIN leads. At the same time, operators need to insert the split wafers one by one into the basket. This requires more manpower to handle the intermediate wafers, cut them on the machine, and then transfer them to other personnel for manual wafer splitting and slotting, which greatly increases labor costs and leads to a high risk of product defects.

[0004] Therefore, there is an urgent need for a substrate processing equipment to solve the aforementioned problems. Summary of the Invention

[0005] Based on the above, the purpose of this invention is to provide a substrate processing equipment that realizes automated substrate processing, improves processing efficiency, reduces labor costs, and increases product yield.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A substrate processing apparatus includes a support and a carrying platform, a cutting device, a splitting device, and a feeding device sequentially arranged along the X-direction on the support. The substrate processing apparatus further includes a first driving assembly and a second driving assembly. Substrates are stacked in a housing, which is placed on the carrying platform. The first driving assembly moves the substrates in the housing to the cutting device, which is configured to cut the substrates. The second driving assembly moves the cut substrates to the splitting device, which is configured to split the cut substrates. The second driving assembly also moves the split substrates to the feeding device, which is configured to move the split substrates into a basket.

[0008] As a preferred technical solution for substrate processing equipment, the cutting device includes:

[0009] A first bearing drive assembly is provided, wherein the substrate is placed on the first bearing drive assembly, and the first bearing drive assembly is capable of driving the substrate to move along the Y direction and driving the substrate to rotate.

[0010] A cutting assembly is located above the first bearing drive assembly. The cutting assembly includes a first X-axis drive component, a first Z-axis drive component, a first cylinder, and a roller cutter. The first X-axis drive component is mounted on a bracket, the first Z-axis drive component is mounted on the first X-axis drive component, the first cylinder is disposed on the first Z-axis drive component, and the roller cutter is mounted on the output end of the first cylinder. The first cylinder drives the roller cutter to press against the substrate.

[0011] As a preferred technical solution for substrate processing equipment, the first bearing drive assembly includes a first Y-axis drive component, a rotary motor, and a first bearing platform. The rotary motor is mounted on the first Y-axis drive component, and the first bearing platform is mounted on the output end of the rotary motor.

[0012] As a preferred technical solution for substrate processing equipment, the splitting device includes:

[0013] The second carrier drive assembly, on which the cut substrate is placed, is capable of driving the substrate to move along the Y direction and to rotate the substrate.

[0014] A splitting assembly is located above the second bearing drive assembly. The splitting assembly includes a second Z-axis drive component and a splitting strip. The second Z-axis drive component is mounted on a bracket, and the splitting strip is mounted on the output end of the second Z-axis drive component. The second Z-axis drive component drives the splitting strip to split and cut the substrate.

[0015] As a preferred technical solution for substrate processing equipment, the feeding device includes:

[0016] The second support platform, on which the split substrate is placed;

[0017] The feeding assembly includes a second X-axis driving component, a third Z-axis driving component, a rotary driving component, and a suction nozzle. The second X-axis driving component is mounted on a bracket, the third Z-axis driving component is mounted on the second X-axis driving component, the rotary driving component is disposed on the third Z-axis driving component, and the suction nozzle is disposed on the rotary driving component.

[0018] The basket is located on one side of the feeding device along the X direction.

[0019] As a preferred technical solution for substrate processing equipment, the unloading device further includes a second Y-axis driving component. The second support platform and the unloading assembly are both in two sets. The two sets of the second support platforms are installed on the second Y-axis driving component, and the two sets of the unloading assembly are respectively located above the second Y-axis driving component and at both ends of the second Y-axis driving component.

[0020] As a preferred technical solution for substrate processing equipment, the unloading assembly further includes a fourth Z-axis driving component, a cleaning roller, and a waste box. The fourth Z-axis driving component is mounted on the second X-axis driving component, the cleaning roller is mounted on the fourth Z-axis driving component, and the waste box is disposed on one side of the second support platform along the X-axis.

[0021] As a preferred technical solution for substrate processing equipment, the cutting device, the splitting device, the feeding device, the first driving component, and the second driving component are equipped with CCD cameras.

[0022] As a preferred technical solution of substrate processing equipment, the first driving component includes a third X-axis driving component and a fifth Z-axis driving component. The third X-axis driving component is mounted on the bracket, and the fifth Z-axis driving component is mounted on the third X-axis driving component. The output end of the fifth Z-axis driving component is provided with a suction cup, which is capable of picking up the substrate.

[0023] As a preferred technical solution for substrate processing equipment, the surface of the substrate is covered with a protective film.

[0024] The beneficial effects of this invention are as follows:

[0025] This invention provides a substrate processing device. During operation, substrates are first stacked in a housing, which is then placed on a support platform. The stacked arrangement facilitates the gripping of substrates by a first driving component and increases the load-bearing capacity within the housing, reducing incoming material packaging costs. Next, the first driving component moves the substrates from the housing to a cutting device, which cuts the substrates without breaking them. Then, a second driving component moves the cut substrates to a splitting device, which splits the substrates along the cutting lines. Finally, the second driving component moves the split substrates to a feeding device, which then moves them into a basket. This invention achieves automated substrate processing, improves processing efficiency, reduces labor costs, and increases product yield. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0027] Figure 1 This is one of the structural schematic diagrams of the substrate processing equipment provided in a specific embodiment of the present invention;

[0028] Figure 2 This is a second schematic diagram of the structure of the substrate processing equipment provided in a specific embodiment of the present invention;

[0029] Figure 3 yes Figure 1 Enlarged view at point A;

[0030] Figure 4 yes Figure 2 Enlarged view at point B;

[0031] Figure 5 yes Figure 1 Enlarged view at point C;

[0032] Figure 6 yes Figure 1 Enlarged view at point D;

[0033] Figure 7 yes Figure 2 Enlarged view at point E;

[0034] Figure 8 yes Figure 1 Enlarged view at point F.

[0035] The markings in the image are as follows:

[0036] 1. Bracket;

[0037] 2. Supporting platform;

[0038] 3. Cutting device; 31. First bearing drive assembly; 311. First Y-axis drive component; 312. Rotary motor; 313. First bearing platform; 32. Cutting assembly; 321. First X-axis drive component; 322. First Z-axis drive component; 323. First cylinder; 324. Roller cutter;

[0039] 4. Splitting device; 41. Second bearing drive assembly; 42. Splitting assembly; 421. Second Z-axis drive component; 422. Splitting strip;

[0040] 5. Feeding device; 51. Second support platform; 52. Feeding assembly; 521. Second X-axis drive component; 522. Third Z-axis drive component; 5221. Second cylinder; 5222. Sliding plate; 5223. Second slide rail; 523. Connecting frame; 524. Suction nozzle; 525. Fourth Z-axis drive component; 526. Cleaning roller; 527. Trash box; 528. Basket; 53. Second Y-axis drive component;

[0041] 6. First drive component; 61. Third X-axis drive component; 62. Fifth Z-axis drive component; 63. Suction cup;

[0042] 7. Second drive component;

[0043] 8. CCD camera. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0045] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0048] like Figure 1 and Figure 2 As shown, this embodiment provides a substrate processing equipment, which includes a support 1 and a carrying platform 2, a cutting device 3, a splitting device 4, and a feeding device 5, which are mounted on the support 1 and arranged sequentially along the X direction. The substrate processing equipment also includes a first driving component 6 and a second driving component 7. The substrates are stacked in a box, and the box is placed on the carrying platform 2. The first driving component 6 is used to move the substrates in the box into the cutting device 3, which is configured to cut the substrates. The second driving component 7 is used to move the cut substrates into the splitting device 4, which is configured to split the cut substrates. The second driving component 7 is also used to move the split substrates into the feeding device 5, which is configured to move the split substrates into a basket 528.

[0049] During operation, the substrates are first stacked inside the housing, which is then placed on the support platform 2. This stacking method facilitates the gripping of the substrates by the first drive component 6 and increases the load-bearing capacity within the housing. Multiple housings can be stacked vertically for storage, reducing incoming material packaging costs. Next, the first drive component 6 moves the substrates from the housing to the cutting device 3, which cuts the substrates. At this point, the cut portion of the substrate is not broken. Then, the second drive component 7 moves the cut substrates to the splitting device 4, which splits the substrates along the cutting lines. Finally, the second drive component 7 moves the split substrates to the unloading device 5, which then moves them into the basket 528. This embodiment achieves automated substrate processing, improving processing efficiency, reducing labor costs, and increasing product yield.

[0050] Preferably, a protective film is applied to the surface of the substrate, which prevents scratches on the product surface during handling, cutting, splitting, and unloading. In this embodiment, the protective film is a blue film, and the substrate is a TFT driving backplane.

[0051] Furthermore, such as Figure 3 and Figure 4As shown, the cutting device 3 includes a first bearing drive assembly 31 and a cutting assembly 32. The substrate is placed on the first bearing drive assembly 31, which can drive the substrate to move along the Y direction and can also drive the substrate to rotate. The cutting assembly 32 is located above the first bearing drive assembly 31. The cutting assembly 32 includes a first X-direction drive component 321, a first Z-direction drive component 322, a first cylinder 323, and a roller cutter 324. The first X-direction drive component 321 is mounted on the bracket 1, the first Z-direction drive component 322 is mounted on the first X-direction drive component 321, the first cylinder 323 is disposed on the first Z-direction drive component 322, and the roller cutter 324 is mounted on the output end of the first cylinder 323. The first cylinder 323 drives the roller cutter 324 to press against the substrate. During operation, the substrate is first placed on the first support drive assembly 31. Then, the first X-axis drive component 321 of the cutting assembly 32 drives the roller cutter 324 to move to a preset position, aligning it with the cutting mark on the substrate. The first Z-axis drive component 322 drives the roller cutter 324 to descend. At this time, the distance between the roller cutter 324 and the substrate is small. The first cylinder 323 drives the roller cutter 324 to continue descending. The first cylinder 323 controls the contact pressure between the roller cutter 324 and the substrate, improving the substrate cutting yield. After cutting, the first cylinder 323 retracts, and the first X-axis drive component 321 drives the roller cutter 324 to move to the cutting position of the next station. The above actions are repeated until all longitudinal cutting lines on the substrate are processed. At this time, the first support drive assembly 31 drives the substrate to rotate, repeating the above actions to cut the substrate along the transverse cutting lines until all transverse cutting lines on the substrate are processed. The first support drive assembly 31 drives the cut substrate to reset, waiting for the second drive assembly 7 to pick it up.

[0052] In this embodiment, the first X-axis driving component 321 is a linear motor. The structure and working principle of the linear motor are existing technologies and will not be described in detail here. The first Z-axis driving component 322 is a motor screw drive mechanism. The motor screw drive mechanism includes a connecting plate, a driving component, a screw, a first slide rail, a slider, and a support plate. The connecting plate is fixed to the output end of the linear motor. The driving component and the first slide rail are both fixed to the connecting plate. The driving component is driven and connected to the screw. The screw rotates along the Z-axis and is connected to the connecting plate. A slider is threaded onto the screw. The slider is fixedly connected to the support plate. The first cylinder 323 is fixed to the support plate. The driving component is a motor, and the screw is directly connected to the output end of the motor. Alternatively, the driving component can be a structure of a motor with a synchronous pulley and a synchronous belt. A first synchronous pulley is installed at one end of the screw, and a second synchronous pulley is installed at the output end of the motor. The first and second synchronous pulleys are connected by a synchronous belt. Both of these structures can enable the driving component to drive the screw to rotate. During operation, the linear motor drives the connecting plate to move along the X-axis to a preset position, enabling the first X-axis driving component 321 to drive the roller cutter 324 to move along the X-axis. The motor screw drive mechanism then drives the roller cutter 324 to move along the Z-axis. Preferably, the motor screw drive mechanism can also be equipped with a grating ruler structure to improve the movement accuracy of the driven component.

[0053] Preferably, the first Z-axis driving component 322, the first cylinder 323, and the roller cutter 324 are in multiple sets. The first Z-axis driving component 322 is mounted on a linear motor, and the linear motor can drive each first Z-axis driving component 322 individually. Therefore, the multiple sets of first Z-axis driving components 322 are in an independent driving state, and the spacing of the multiple sets of first Z-axis driving components 322 can be adjusted to meet the position requirements of the cutting line on the substrate. Multiple roller cutters 324 cut simultaneously, improving cutting efficiency.

[0054] In this embodiment, the first bearing drive assembly 31 includes a first Y-axis drive component 311, a rotary motor 312, and a first bearing platform 313. The rotary motor 312 is mounted on the first Y-axis drive component 311, and the first bearing platform 313 is mounted on the output end of the rotary motor 312. In this embodiment, the first Y-axis drive component 311 is also a motor screw drive mechanism. The structure of the motor screw drive mechanism is not the focus of protection, so the specific structure and principle of the first Y-axis drive component 311 will not be described in detail. The connecting plate of the motor screw drive mechanism is mounted on the workbench, the screw is arranged along the Y-axis, and the rotary motor 312 is mounted on the bearing plate of the motor screw drive mechanism. The motor screw drive mechanism can drive the first bearing platform 313 to move along the Y-axis, and the rotary motor 312 can drive the first bearing platform 313 to rotate.

[0055] Preferably, the cutting device 3 is equipped with a CCD camera 8, which can identify the position to be cut on the substrate. Based on the identification information, the control system automatically controls the position and spacing of multiple roller cutters 324 to achieve automatic cutting.

[0056] Furthermore, such as Figure 5 As shown, the splitting device 4 includes a second support driving assembly 41 and a splitting assembly 42. The cut substrate is placed on the second support driving assembly 41, which can drive the substrate to move along the Y direction and can also drive the substrate to rotate. The splitting assembly 42 is located above the second support driving assembly 41. The splitting assembly 42 includes a second Z-direction driving component 421 and a splitting strip 422. The second Z-direction driving component 421 is mounted on the bracket 1, and the splitting strip 422 is mounted on the output end of the second Z-direction driving component 421. The second Z-direction driving component 421 drives the splitting strip 422 to split the cut substrate. During operation, the cut substrate is placed on the second support drive assembly 41. Then, the second support drive assembly 41 drives the substrate to move below the splitting pressure bar 422. The splitting pressure bar 422 is aligned with the cutting line of the substrate. The second Z-axis drive component 421 drives the splitting pressure bar 422 to descend so that the splitting pressure bar 422 presses against the cutting line, thereby splitting the substrate. After the cutting is completed, the second Z-axis drive component 421 drives the splitting pressure bar 422 to rise. The second support drive assembly 41 drives the substrate to continue moving along the Y-axis so that the cutting line of the next station of the substrate is aligned with the splitting pressure bar 422. The above actions are repeated to split the substrate until the substrate is split along the longitudinal cutting line. At this time, the second support drive assembly 41 drives the substrate to rotate and repeats the above actions to split the substrate along the transverse cutting line until the substrate is split along the transverse cutting line. After the substrate is split, it has been separated into multiple small pieces (i.e., sub-substrates). The second support drive assembly 41 drives the cut substrate to reset, waiting for the second drive assembly 7 to pick it up.

[0057] In this embodiment, the second load-bearing drive component 41 has the same structure and principle as the first load-bearing drive component 31, and will not be described again here. The second Z-axis drive component 421 is a linear motor. The structure and working principle of the linear motor are existing technologies, and will not be described again here.

[0058] Preferably, the splitting device 4 is equipped with a CCD camera 8, which can identify the position of the cutting line on the substrate. Based on the identification information, the control system automatically controls the cutting line of the substrate to move below the alignment strip 422.

[0059] Furthermore, such as Figure 6As shown, the unloading device 5 includes a second support platform 51 and an unloading assembly 52. ​​The split substrate is placed on the second support platform 51. The unloading assembly 52 includes a second X-axis driving component 521, a third Z-axis driving component 522, a rotary driving component (not shown) and a suction nozzle 524. The second X-axis driving component 521 is mounted on the bracket 1, the third Z-axis driving component 522 is mounted on the second X-axis driving component 521, the rotary driving component is disposed on the third Z-axis driving component 522, and the suction nozzle 524 is disposed on the rotary driving component. The basket 528 is disposed on one side of the unloading device 5 along the X-axis. During operation, the split substrate is placed on the second support platform 51 by the second driving assembly 7. At this time, the second X-axis driving component 521 drives the third Z-axis driving component 522 to move along the X-axis, so that the suction nozzle 524 is positioned above the sub-substrate to be moved. The third Z-axis driving component 522 drives the suction nozzle 524 to descend and pick up the sub-substrate. The third Z-axis driving component 522 drives the suction nozzle 524 to rise. The second X-axis driving component 521 continues to drive the third Z-axis driving component 522 to move along the X-axis, so that the suction nozzle 524 is positioned above the basket 528. Then, the rotation driving component drives the suction nozzle 524 to rotate, so that the sub-substrate changes from horizontal to vertical. Finally, the third Z-axis driving component 522 drives the suction nozzle 524 to descend and vertically install the sub-substrate in the basket 528. The above actions are repeated until all sub-substrates are unloaded. Of course, in other embodiments, the rotation driving component can be omitted, and the unloading assembly stacks the sub-substrates in the basket 528.

[0060] In this embodiment, the second X-axis driving component 521 is a linear module. The structure and working principle of the linear module are existing technologies and will not be described in detail here. The third Z-axis driving component 522 is a cylinder driving mechanism, which includes a second cylinder 5221, a connecting frame 523, and a sliding plate 5222. The sliding plate 5222 is L-shaped. One side of the second cylinder 5221 is mounted to the output end of the linear module through the connecting frame 523, and the other side is provided with a second slide rail 5223. The sliding plate 5222 is slidably connected to the second slide rail 5223 and is connected to the output end of the second cylinder 5221. A rotary driving component is mounted on the sliding plate 5222. When the second cylinder 5221 extends or retracts, it can drive the sliding plate 5222 to move along the Z-axis. In this embodiment, the rotary driving component is a rotary cylinder, which is mounted on the sliding plate 5222.

[0061] Preferably, the unloading device 5 is equipped with a CCD camera 8, which can identify the sub-substrate on the second support platform 51. Based on the identification information, the control system automatically controls multiple suction nozzles 524 to pick up the processed sub-substrate, while leaving the defective sub-substrate on the second support platform 51.

[0062] More preferably, the unloading assembly 52 further includes a fourth Z-axis driving component 525, a cleaning roller 526, and a waste container 527. The fourth Z-axis driving component 525 is mounted on the second X-axis driving component 521, the cleaning roller 526 is mounted on the fourth Z-axis driving component 525, and the waste container 527 is disposed on one side of the second support platform 51 along the X-axis. After the unloading device 5 moves the processed sub-substrate to the basket 528, the fourth Z-axis driving component drives the cleaning roller 526 to move downward, and the second X-axis driving component 521 drives the cleaning roller 526 to move along the X-axis, thereby enabling the cleaning roller 526 to clean the second support platform 51 and sweep impurities and waste on the second support platform 51 into the waste container 527.

[0063] In this embodiment, the fourth Z-axis drive component 525 has the same structure as the third Z-axis drive component 522 and also adopts a cylinder drive mechanism. The specific structure and principle of the fourth Z-axis drive component 525 will not be described in detail here. The cleaning roller 526 is installed at the output end of the cylinder drive mechanism, and the cylinder drive mechanism is installed at the output end of the linear module.

[0064] To improve the efficiency of sub-substrate cutting, such as Figure 7 As shown, the unloading device 5 also includes a second Y-axis driving component 53. There are two sets of second support platforms 51 and unloading components 52. The two sets of second support platforms 51 are mounted on the second Y-axis driving component 53, and the two sets of unloading components 52 are respectively located above and at both ends of the second Y-axis driving component 53. The two second support platforms 51 sequentially connect to the split sub-substrate. The two sets of unloading components 52 simultaneously sort and unload, improving sorting efficiency. Furthermore, since the unloading component 52 does not have Y-axis movement capability, when the unloading component 52 picks up the sub-substrate, the second Y-axis driving component 53 can drive the sub-substrate to move along the Y-axis, so that the suction nozzle 524 can pick up sub-substrates at any position in the X and Y directions. In this embodiment, the second Y-axis driving component 53 consists of two symmetrically arranged motor screw drive mechanisms. The two sets of motor screw drive mechanisms share a first slide rail, and the two second support platforms 51 are respectively mounted on the support plates of the two motor screw drive mechanisms.

[0065] Furthermore, such as Figure 8As shown, the first driving assembly 6 includes a third X-axis driving component 61 and a fifth Z-axis driving component 62. The third X-axis driving component 61 is mounted on the bracket 1, and the fifth Z-axis driving component 62 is mounted on the third X-axis driving component 61. A suction cup 63 is provided at the output end of the fifth Z-axis driving component 62, which can pick up the substrate. During operation, the third X-axis driving component 61 drives the fifth Z-axis driving component 62 to move above the support platform 2. The fifth Z-axis driving component 62 drives the suction cup 63 to descend and pick up the substrate in the housing. Then, the fifth Z-axis driving component 62 drives the suction cup 63 to rise. The third X-axis driving component 61 drives the fifth Z-axis driving component 62 to move above the first support driving assembly 31. The fifth Z-axis driving component 62 drives the suction cup 63 to descend and place the substrate on the first support driving assembly 31, thus realizing that the first driving assembly 6 moves the substrate in the housing into the cutting device 3.

[0066] In this embodiment, the third X-axis driving component 61 is a motor-screw drive mechanism. The specific structure and principle of the third X-axis driving component 61 are not detailed here. A first slide rail is provided on the bracket 1. The third X-axis driving component 61 is slidably mounted on the first slide rail via a support frame. The screw is arranged along the X-axis within the first slide rail. The motor-screw drive mechanism can drive the fifth Z-axis driving component 62 to move along the X-axis. The fifth Z-axis driving component 62 is a linear module, arranged along the Z-axis. A suction cup 63 is mounted on the output end of the linear module.

[0067] Preferably, the first driving component 6 is equipped with a CCD camera 8, which can identify the position of the substrate inside the box. Based on the identification information, the control system automatically controls the suction cup 63 to align with the top of the substrate.

[0068] Furthermore, the second drive assembly 7 has the same structure and working principle as the first drive assembly 6, and a CCD camera 8 is also provided on the second drive assembly 7. The structure and working principle will not be described in detail here. Of course, in other embodiments, the second drive assembly 7 and the first drive assembly 6 can also be robotic arms.

[0069] like Figures 1-8As shown, in this embodiment, substrates with protective films are stacked inside a box; the box is manually placed on the support platform 2; the CCD camera 8 of the first drive assembly 6 illuminates and takes pictures to confirm the position of the first substrate; after being identified by the CCD camera 8, the first drive assembly 6 uses surface adsorption to pick up the substrate and places it on the first support drive assembly 31. The first support drive assembly 31 moves the substrate to the cutting position, and the CCD camera 8 of the cutting device 3 identifies and acquires the position of the product to be cut. According to the cutting requirements, the roller cutter 324 performs position correction and performs automatic film-coated cutting; after cutting, the second drive assembly 7 directly picks up the cut substrate and places it on the splitting device 4; the CCD camera 8 acquires the splitting cutting line of the substrate, and the control system automatically corrects the position and sends it to the splitting assembly 42 for pressing and splitting. The board has been separated into small pieces (i.e., sub-substrates). After the splitting is completed, the second bearing drive component 41 is reset, and the second drive component 7 uses surface adsorption to pick up all the split sub-substrates and waste materials and transfer them to the second bearing platform 51 of the unloading device 5. The unloading device 5 uses a CCD camera 8 to visually identify the positions of the waste materials and the separated sub-substrates. Then, the suction nozzle 524 of the unloading component 52 picks up the sub-substrates and inserts them directly into the set basket 528. They are inserted into the basket 528 one by one as required. After the basket 528 is full, it will automatically insert other empty baskets 528. Then, automatic unloading is performed. Finally, the cleaning roller 526 cleans the second bearing platform 51. This embodiment realizes fully automatic equipment operation of the substrate, effectively solving the problems of labor-intensive loading and handling of splitting actions, reducing labor costs, reducing the risk of product defects, improving yield and efficiency, and reducing costs.

[0070] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A substrate processing equipment, characterized in that, The substrate processing equipment includes a support (1) and a support platform (2), a cutting device (3), a splitting device (4), and a feeding device (5) mounted on the support (1) and arranged sequentially along the X direction. The substrate processing equipment also includes a first driving component (6) and a second driving component (7). The substrate is stacked in a box, and the box is placed on the support platform (2). The first driving component (6) is used to move the substrate in the box to the cutting device (3), which is configured to cut the substrate. The second driving component (7) is used to move the cut substrate to the splitting device (4), which is configured to split the cut substrate. The second driving component (7) is also used to move the split substrate to the feeding device (5), which is configured to move the split substrate to a basket (528). The cutting device (3) includes: First bearing drive assembly (31), the substrate is placed on the first bearing drive assembly (31), the first bearing drive assembly (31) can drive the substrate to move along the Y direction and can drive the substrate to rotate; A cutting assembly (32) is located above the first bearing drive assembly (31). The cutting assembly (32) includes a first X-axis drive component (321), a first Z-axis drive component (322), a first cylinder (323), and a roller cutter (324). The first X-axis drive component (321) is mounted on the bracket (1). The first Z-axis drive component (322) is mounted on the first X-axis drive component (321). The first cylinder (323) is disposed on the first Z-axis drive component (322). The roller cutter (324) is mounted on the output end of the first cylinder (323). The first cylinder (323) drives the roller cutter (324) to press against the substrate. The splitting device (4) includes: The second carrier drive assembly (41) is used to place the cut substrate on the second carrier drive assembly (41). The second carrier drive assembly (41) can drive the substrate to move along the Y direction and can drive the substrate to rotate. A splitting assembly (42) is located above the second bearing drive assembly (41). The splitting assembly (42) includes a second Z-axis drive component (421) and a splitting strip (422). The second Z-axis drive component (421) is mounted on the bracket (1). The splitting strip (422) is mounted at the output end of the second Z-axis drive component (421). The second Z-axis drive component (421) drives the splitting strip (422) to split the cut substrate.

2. The substrate processing equipment according to claim 1, characterized in that, The first load-bearing drive assembly (31) includes a first Y-axis drive component (311), a rotary motor (312), and a first load-bearing platform (313). The rotary motor (312) is mounted on the first Y-axis drive component (311), and the first load-bearing platform (313) is mounted on the output end of the rotary motor (312).

3. The substrate processing equipment according to claim 1, characterized in that, The feeding device (5) includes: The second support platform (51) is on which the split substrate is placed; The feeding assembly (52) includes a second X-axis driving component (521), a third Z-axis driving component (522), a rotary driving component, and a suction nozzle (524). The second X-axis driving component (521) is mounted on the bracket (1), the third Z-axis driving component (522) is mounted on the second X-axis driving component (521), the rotary driving component is disposed on the third Z-axis driving component (522), and the suction nozzle (524) is disposed on the rotary driving component. The basket (528) is located on one side of the feeding device (5) along the X direction.

4. The substrate processing equipment according to claim 3, characterized in that, The feeding device (5) further includes a second Y-direction driving component (53). The second support platform (51) and the feeding assembly (52) are both in two sets. The two sets of the second support platform (51) are installed on the second Y-direction driving component (53). The two sets of the feeding assembly (52) are respectively located above the second Y-direction driving component (53) and at both ends of the second Y-direction driving component (53).

5. The substrate processing equipment according to claim 3, characterized in that, The feeding assembly (52) further includes a fourth Z-axis drive component (525), a cleaning roller (526), ​​and a waste container (527). The fourth Z-axis drive component (525) is mounted on the second X-axis drive component (521), the cleaning roller (526) is mounted on the fourth Z-axis drive component (525), and the waste container (527) is disposed on one side of the second support platform (51) along the X-axis.

6. The substrate processing equipment according to any one of claims 1-5, characterized in that, CCD cameras (8) are respectively provided on the cutting device (3), the splitting device (4), the feeding device (5), the first driving component (6) and the second driving component (7).

7. The substrate processing equipment according to any one of claims 1-5, characterized in that, The first driving component (6) includes a third X-axis driving component (61) and a fifth Z-axis driving component (62). The third X-axis driving component (61) is mounted on the bracket (1), and the fifth Z-axis driving component (62) is mounted on the third X-axis driving component (61). The output end of the fifth Z-axis driving component (62) is provided with a suction cup (63), which can pick up the substrate.

8. The substrate processing equipment according to claim 1, characterized in that, The surface of the substrate is covered with a protective film.

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