A flexible panel, a method of manufacturing a flexible panel, and a flexible device

Abstract

This invention discloses a flexible panel, a method for fabricating a flexible panel, and a flexible device. The flexible panel includes a first flexible substrate, a second flexible substrate, and a liquid crystal layer disposed between the first and second flexible substrates, which are disposed opposite each other. The first flexible substrate includes a first bonding region, and the second flexible substrate includes a second bonding region. Along a direction perpendicular to the thickness direction of the flexible panel, the first bonding region and the second flexible substrate are offset from each other. Furthermore, along the thickness direction of the flexible panel, the thickness D1 of the first flexible substrate satisfies D1≥50μm, and the thickness D2 of the second flexible substrate satisfies D2≥50μm. Thus, by setting the thickness of the first flexible substrate to D1≥50μm and the thickness of the second flexible substrate to D2≥50μm, the flexible substrates are relatively thick, allowing for direct cutting during the flexible panel cutting process. This reduces the difficulty of cutting the flexible substrate and the fabrication difficulty of the flexible panel, thereby improving the fabrication efficiency of the flexible panel.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal technology, and in particular to a flexible panel, a method for preparing a flexible panel, and a flexible device. Background Technology

[0002] Currently, existing flexible substrates are made by directly coating flexible substrates (such as PI or PET) onto a rigid substrate, which means they need to be bonded to the rigid substrate for fabrication. Their thickness is generally less than or equal to 30μm. During cutting, the flexible substrate and the rigid substrate are cut simultaneously using cutting wheels, lasers, or other methods to form a bonding area. However, because the flexible substrate has a certain degree of toughness, the cutting wheel cannot completely cut it off, or laser cutting of the flexible substrate will burn the outer edge and it is difficult to control the cutting depth. Therefore, this has caused the fabrication of flexible panels to be quite difficult. Summary of the Invention

[0003] This invention provides a flexible panel, a method for preparing a flexible panel, and a flexible device to reduce the difficulty of preparing a flexible panel.

[0004] In a first aspect, embodiments of the present invention provide a flexible panel, comprising:

[0005] A first flexible substrate, a second flexible substrate, and a liquid crystal layer disposed between the first flexible substrate and the second flexible substrate are disposed opposite to each other;

[0006] The first flexible substrate includes a first bonding region, and the second flexible substrate includes a second bonding region. Along a direction perpendicular to the thickness direction of the flexible panel, the first bonding region and the second flexible substrate are offset from each other, and the second bonding region and the first flexible substrate are offset from each other. Along the thickness direction of the flexible panel, the thickness D1 of the first flexible substrate satisfies D1≥50μm, and the thickness D2 of the second flexible substrate satisfies D2≥50μm.

[0007] In a second aspect, embodiments of the present invention provide a method for fabricating a flexible panel, comprising providing a first flexible substrate and fabricating a plurality of first bonding openings on the first flexible substrate; the first flexible substrate includes a plurality of first flexible substrates, and the first flexible substrate includes a first bonding region;

[0008] A second flexible substrate is provided, and a plurality of second bonding openings are formed on the second flexible substrate; the second flexible substrate includes a plurality of second flexible substrates, and the second flexible substrate includes a second bonding region;

[0009] A flexible panel motherboard is formed by bonding the first flexible substrate and the second flexible substrate in an aligned manner. The flexible panel motherboard includes a plurality of repeating units. Along the thickness direction of the flexible panel, the first bonding opening overlaps with at least a portion of the second bonding area, and the second bonding opening overlaps with at least a portion of the first bonding area. Liquid crystal is injected into the flexible panel motherboard. The flexible panel motherboard is cut based on the first bonding opening and the second bonding opening to obtain a plurality of flexible panels.

[0010] Thirdly, embodiments of the present invention also provide a flexible device, including any of the flexible panels described in the first aspect.

[0011] In the flexible panel provided in this embodiment of the invention, along the thickness direction of the flexible panel, the thickness D1 of the first flexible substrate satisfies D1≥50μm, and the thickness D2 of the second flexible substrate satisfies D2≥50μm. By setting the thickness of the first flexible substrate D1≥50μm and the thickness of the second flexible substrate D2≥50μm, the thickness of the flexible substrate is greater than that of flexible substrates in the prior art that need to be bonded to a rigid substrate. This allows for direct cutting of the flexible panel using a punching method during the cutting process, reducing the difficulty of fabricating the flexible panel. It also avoids the problems in the prior art where the flexible substrate is thinner and bonded to a rigid substrate, requiring simultaneous cutting of the flexible substrate and the rigid substrate using cutting wheels, lasers, etc., to form a bonding area. This can lead to the cutting wheel not completely cutting the flexible substrate, or laser cutting of the flexible substrate burning the edges and making it difficult to control the cutting depth. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a flexible panel provided in an embodiment of the present invention;

[0013] Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction;

[0014] Figure 3 This is a schematic diagram of another flexible panel structure provided in an embodiment of the present invention;

[0015] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along the B-B' direction;

[0016] Figure 5 This is a schematic diagram of another cross-sectional structure along the A-A' direction in diagram 1;

[0017] Figure 6 This is a schematic flowchart of a method for preparing a flexible panel according to an embodiment of the present invention;

[0018] Figure 7 This is a schematic diagram of the structure of a first flexible substrate provided in an embodiment of the present invention;

[0019] Figure 8 This is a schematic diagram of the structure of a second flexible substrate provided in an embodiment of the present invention;

[0020] Figure 9 This is a schematic diagram of the structure of a flexible panel motherboard provided in an embodiment of the present invention;

[0021] Figure 10 This is a schematic flowchart of another method for preparing a flexible panel provided in an embodiment of the present invention;

[0022] Figure 11 This is a schematic diagram of the structure of another flexible panel motherboard provided in an embodiment of the present invention;

[0023] Figure 12 This is a schematic diagram of another first flexible substrate provided in an embodiment of the present invention;

[0024] Figure 13 This is a schematic diagram of another structure of a second flexible substrate provided in an embodiment of the present invention;

[0025] Figure 14 This is a schematic flowchart of another method for preparing a flexible panel provided in an embodiment of the present invention;

[0026] Figure 15 This is a schematic diagram of the structure of a first flexible substrate adhesive provided in an embodiment of the present invention;

[0027] Figure 16 This is a schematic diagram of the structure of a second flexible substrate adhesive provided in an embodiment of the present invention;

[0028] Figure 17 This is a schematic flowchart of another method for preparing a flexible panel provided in an embodiment of the present invention;

[0029] Figure 18 This is a schematic diagram of the structure of another first flexible substrate provided in an embodiment of the present invention;

[0030] Figure 19 This is a schematic diagram of the structure of another second flexible substrate provided in an embodiment of the present invention;

[0031] Figure 20 This is a schematic diagram of the structure of a flexible device plate provided in an embodiment of the present invention. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0033] Figure 1 This is a schematic diagram of the structure of a flexible panel provided in an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction, combined with Figure 1 and Figure 2 As shown, the flexible panel 1 provided in this embodiment of the invention includes a first flexible substrate 10, a second flexible substrate 20 disposed opposite to each other, and a liquid crystal layer 30 disposed between the first flexible substrate 10 and the second flexible substrate 20. The first flexible substrate 10 includes a first bonding region AB, and the second flexible substrate 20 includes a second bonding region AC. Along the direction X perpendicular to the thickness direction of the flexible panel, the first bonding region AB is offset from the second flexible substrate 20, and the second bonding region AC is offset from the first flexible substrate 10. Along the thickness direction of the flexible panel, the thickness D1 of the first flexible substrate 10 satisfies D1≥50μm, and the thickness D2 of the second flexible substrate 20 satisfies D2≥50μm.

[0034] For example, a first flexible substrate 10 and a second flexible substrate 20 are disposed facing each other, and a liquid crystal layer 30 is encapsulated between the first flexible substrate 10 and the second flexible substrate 20. The first flexible substrate 10 includes a first bonding region AB, and the second flexible substrate 20 includes a second bonding region AC. Driving elements are bonded to the first bonding region AB and the second bonding region AC. The driving elements may include a driving chip IC and / or a flexible circuit board FPC. The driving elements control the rotation of liquid crystal molecules in the liquid crystal layer 30 by applying a driving voltage to the side of the liquid crystal layer 30 near the first flexible substrate 10 and the side of the liquid crystal layer 30 near the second flexible substrate 20, thereby adjusting the light transmittance and light opacity of the flexible panel 1. Specifically, along the direction X perpendicular to the thickness direction of the flexible panel, the first bonding region AB is offset from the second flexible substrate 20, so that the second flexible substrate 20 exposes the first bonding region AB, thus facilitating the bonding of the driving elements to the first bonding region AB. Similarly, along the direction X perpendicular to the thickness direction of the flexible panel, the second bonding region AC is offset from the first flexible substrate 10, so that the first flexible substrate 10 exposes the second bonding region AC, thus facilitating the bonding of the driving elements to the second bonding region AC.

[0035] As mentioned above, existing flexible substrates are generally less than 30 μm thick and need to be bonded to a rigid substrate for fabrication. Therefore, when forming the bonding area, it is necessary to cut the flexible substrate and the rigid substrate simultaneously using cutting methods such as a cutting wheel or laser. However, due to the certain toughness of the flexible substrate, the cutting wheel may not be able to cut it completely, or laser cutting of the flexible substrate may burn the outer edge and make it difficult to control the cutting depth. To address this, this embodiment of the invention sets the thickness D1 of the first flexible substrate 10 to satisfy D1≥50 μm and the thickness D2 of the second flexible substrate 20 to satisfy D2≥50 μm. This makes the thickness of the first flexible substrate 10 and the second flexible substrate 20 relatively thick, eliminating the need to bond them to a rigid substrate. Instead, a punching method can be used to directly cut the flexible substrate, reducing the cutting difficulty of the flexible substrate and thus reducing the fabrication difficulty of the flexible panel and improving the fabrication efficiency of the flexible panel.

[0036] It should be noted that the flexible panel 1 in this embodiment of the invention can be used for display or not (e.g., for example, a liquid crystal curtain). For instance, if the flexible panel 1 is used to form a liquid crystal curtain, a driving voltage can be applied to the liquid crystal layer, controlling the deflection of the liquid crystal and thus changing the light transmittance, thereby adjusting the refractive index of the liquid crystal layer 30 to achieve a non-uniform distribution of the refractive index, thus achieving a foggy state for the liquid crystal curtain; when the voltage is removed, a linear distribution of the refractive index of the liquid crystal layer 30 is achieved, thus achieving a transparent state for the liquid crystal curtain; or the flexible panel 1 can be used to form a liquid crystal display panel. In this case, the first flexible substrate 10 and the second flexible substrate 20 can be a color filter substrate and a thin-film transistor array substrate, respectively, with the liquid crystal layer 30 disposed between the color filter substrate and the thin-film transistor array substrate. Furthermore, by applying a driving voltage to control the rotation of the liquid crystal molecules within the liquid crystal layer 30, the light source provided by the backlight module passes through the thin-film transistor array substrate of the liquid crystal display panel, is refracted from the liquid crystal layer of the liquid crystal display panel, and generates a color image via the color filter substrate. This invention does not limit the use of the flexible panel; those skilled in the art can configure it according to their needs.

[0037] In summary, this embodiment of the invention sets the thickness D1 of the first flexible substrate to satisfy D1≥50μm and the thickness D2 of the second flexible substrate to satisfy D2≥50μm. This results in relatively thick first and second flexible substrates, eliminating the need for bonding to a rigid substrate. The flexible substrates can be directly cut using a punching method, reducing the difficulty of flexible panel fabrication, cutting the flexible substrate, and fabricating the flexible panel, thus improving the fabrication efficiency. This solves the problems in existing technologies where the flexible substrate is relatively thin and bonded to a rigid substrate, requiring simultaneous cutting of both the flexible and rigid substrates using cutting wheels or lasers. These problems often result in incomplete cutting of the flexible substrate by the cutting wheel, or burns on the edges and difficulty in controlling the cutting depth when laser cutting of the flexible substrate.

[0038] Optionally, based on the above embodiments, see also... Figure 1 The first binding area AB and the second binding area AC are located on different sides of the flexible panel 1.

[0039] Specifically, by setting the first binding area AB and the second binding area AC to be located on different sides of the flexible panel 1, it is convenient for the driving element corresponding to the first flexible substrate 10 to be bound to the first binding area AB, and the driving element corresponding to the second flexible substrate 20 to be bound to the second binding area AC, so that the binding of the first binding area AB and the second binding area AC does not affect each other.

[0040] Optional, Figure 3 This is a schematic diagram of another flexible panel structure provided in an embodiment of the present invention. Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along the B-B' direction, see [reference]. Figure 3 and Figure 4 The first binding area AB and the second binding area AC are located on the same side of the flexible panel 1, and are staggered along the direction X perpendicular to the thickness direction of the flexible panel 1.

[0041] Specifically, such as Figure 3 and Figure 4 As shown, the first binding area AB and the second binding area AC can be located on the same side of the flexible panel 1. Figure 3 The following explanation uses an example where the first bonding area AB and the second bonding area AC are located on the right side of the flexible panel 1. Furthermore, along the direction X, which is perpendicular to the thickness direction of the flexible panel, the first bonding area AB and the second bonding area AC are staggered, so that the second flexible substrate 20 exposes the first bonding area AB, and the first flexible substrate 10 exposes the second bonding area AC. By placing the first bonding area AB and the second bonding area AC on the same side of the flexible panel 1, it is possible to ensure that the driving element can be properly bonded to the corresponding bonding area, thereby reducing the coverage area of ​​the bonding area and facilitating the miniaturization of the flexible panel.

[0042] Furthermore, Figure 5 This is a schematic diagram of another cross-sectional structure along the A-A' direction in diagram 1. See [link / reference]. Figure 5 The flexible panel 1 also includes a first electrode 41, a second electrode 42, a first alignment layer 51, a second alignment layer 52, a first flexible circuit board 61, and a second flexible circuit board 62. The first electrode 41 is located on the side of the first flexible substrate 10 near the liquid crystal layer 30, the second electrode 42 is located on the side of the second flexible substrate 20 near the liquid crystal layer 30, the first alignment layer 51 is located on the side of the first electrode 41 near the liquid crystal layer 30, the second alignment layer 52 is located on the side of the second electrode 42 near the liquid crystal layer 30, the first flexible circuit board 61 is located in the first bonding region AB and is electrically connected to the first electrode 41, and the second flexible circuit board 62 is located in the second bonding region AC and is electrically connected to the second electrode 42.

[0043] Specifically, a first electrode 41 is disposed on the side of the first flexible substrate 10 near the liquid crystal layer 30, and a second electrode 42 is disposed on the side of the second flexible substrate 20 near the liquid crystal layer 30. The first electrode 41 is electrically connected to a first flexible circuit board 61 located in the first bonding region AB, and the second electrode 42 is electrically connected to a second flexible circuit board 62 located in the second bonding region AC. Driving signals are applied to the first electrode 41 and the second electrode 42 through the first and second flexible circuit boards 61 and 62, and the driving voltage controls the deflection of the liquid crystal, thereby changing the light transmittance. This achieves the adjustment of the refractive index of the liquid crystal layer 30, thus adjusting the light transmittance and opacity of the flexible panel 1. Furthermore, the flexible panel 1 also includes a first alignment layer 51 located between the first electrode 41 and the liquid crystal layer 30, and a second alignment layer 52 located between the second electrode 42 and the liquid crystal layer 30. The first alignment layer 51 and the second alignment layer 52 are used to arrange the liquid crystal molecules in the liquid crystal layer 30 in an orderly manner along a plane parallel to the first flexible substrate 10 or the second flexible substrate 20 when no potential is applied to the first electrode 41 and the second electrode 42 (i.e., to make the long axis direction of the liquid crystal molecules in the liquid crystal layer 30 parallel to the alignment direction of the alignment layer). Furthermore, the flexible panel 1 also includes a sealant 53 located between the first flexible substrate 10 and the second flexible substrate 20. The sealant 53 is used to encapsulate the flexible panel 1 and prevent liquid crystal from overflowing from the flexible panel.

[0044] Based on the above embodiments, see below. Figure 5 The first electrode 41 is integrally formed, or the first electrode 41 includes multiple independently formed first sub-electrodes (not shown in the figure), and the second electrode 42 is integrally formed, or the second electrode 42 includes multiple independently formed second sub-electrodes (not shown in the figure).

[0045] Specifically, the first electrode 41 and the second electrode 42 are integrally set, meaning that the first electrode 41 and the second electrode 42 together control the deflection of liquid crystal molecules in the liquid crystal layer 30, making the setting of the first electrode 41 and the second electrode 42 simple and the control method of the liquid crystal layer 30 simple.

[0046] Alternatively, the first electrode 41 may include multiple independently configured first sub-electrodes, and the second electrode 42 may include multiple independently configured second sub-electrodes. This can be understood as dividing the liquid crystal layer 30 into multiple regions, with each region individually controlling the deflection of its liquid crystal molecules through the corresponding first and second sub-electrodes. In this way, different potential signals can be used to adjust the different light transmittance of different regions within the liquid crystal layer, which is beneficial for realizing diversified light transmittance designs of flexible panels.

[0047] Based on the same inventive concept, embodiments of the present invention also provide a method for preparing a flexible panel. Figure 6 This is a schematic flowchart of a method for preparing a flexible panel according to an embodiment of the present invention. Figure 7 This is a schematic diagram of the structure of a first flexible substrate provided in an embodiment of the present invention. Figure 8 This is a schematic diagram of the structure of a second flexible substrate provided in an embodiment of the present invention. Figure 9 This is a schematic diagram of the structure of a flexible panel motherboard provided in an embodiment of the present invention. See also: Figure 6 , Figure 7 , Figure 8 and Figure 9 The method for preparing a flexible panel provided in this embodiment of the invention includes:

[0048] S110. A first flexible substrate is provided and a plurality of first bonding openings are formed on the first flexible substrate. The first flexible substrate includes a plurality of first flexible substrates and the first flexible substrates include first bonding regions.

[0049] For example, such as Figure 7 As shown, the first flexible substrate 100 can be a large plate, and its material can be ultra-thin glass, metal foil, or polymer plastic material. Ultra-thin glass may include ultra-thin alkali-free glass, metal foil may include stainless steel foil, aluminum foil, copper foil, etc., and polymer plastic material may include polyimide (PI), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), etc. Multiple arrayed first flexible substrates 10 can be formed on the first flexible substrate 100, and each first flexible substrate 10 includes a first bonding region AB. A first bonding opening 110 is formed on one side of each first flexible substrate 10. The first bonding opening 110 can be disposed on one side of the first flexible substrate 10, wherein... Figure 7The first bonding opening 110 is only exemplarily described as being formed on the right side of the corresponding first flexible substrate 10. In addition, the first bonding opening 110 may also be formed on the left, upper or lower side of the corresponding first flexible substrate 10. The embodiments of the present invention do not limit this.

[0050] Furthermore, the thickness of the first flexible substrate 100 is greater than or equal to 50 μm. Compared with the prior art where the thickness of the flexible substrate is less than 30 μm, the thickness of the first flexible substrate 100 is thicker. When cutting the first bonding opening 110 in the first flexible substrate 100, it is not necessary to attach the first flexible substrate 100 to the rigid substrate. The first flexible substrate 100 can be cut directly, which reduces the cutting difficulty of the first flexible substrate 100.

[0051] S120. A second flexible substrate is provided and a plurality of second bonding openings are formed on the second flexible substrate. The second flexible substrate includes a plurality of second flexible substrates and the second flexible substrates include second bonding regions.

[0052] For example, such as Figure 8 As shown, the second flexible substrate 200 can be a large plate, and its material can be ultra-thin glass, metal foil, or polymer plastic material. Ultra-thin glass may include ultra-thin alkali-free glass, metal foil may include stainless steel foil, aluminum foil, copper foil, etc., and polymer plastic material may include polyimide (PI), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), etc. Multiple arrayed second flexible substrates 20 can be formed on the second flexible substrate 200, and each second flexible substrate 20 includes a second bonding region AC. A second bonding opening 210 is formed on one side of each second flexible substrate 20. The second bonding opening 210 can be disposed on one side of the second flexible substrate 20, wherein... Figure 8 The second bonding opening 210 is only illustrated by way of example, which is formed on the left side of the corresponding second flexible substrate 20. In addition, the second bonding opening 210 may also be formed on the right side, the upper side or the lower side of the corresponding second flexible substrate 20. The embodiments of the present invention do not limit this.

[0053] Furthermore, the thickness of the second flexible substrate 200 is greater than or equal to 50 μm. Compared with the prior art where the thickness of the flexible substrate is less than 30 μm, the thickness of the second flexible substrate 200 is thicker. When cutting the second bonding opening 210 in the second flexible substrate 200, it is not necessary to attach the second flexible substrate 200 to the rigid substrate. The second flexible substrate 200 can be cut directly, which reduces the cutting difficulty of the second flexible substrate 200.

[0054] S130. A flexible panel motherboard is formed by bonding a first flexible substrate and a second flexible substrate in an aligned manner. The flexible panel motherboard includes multiple repeating units. Along the thickness direction of the flexible panel, a first bonding opening overlaps with at least a portion of a second bonding area, and a second bonding opening overlaps with at least a portion of a first bonding area.

[0055] For example, a flexible panel motherboard 300 is formed by bonding a first flexible substrate 10 and a second flexible substrate 20 together in an aligned manner. The flexible panel motherboard 300 includes a plurality of repeating units 310, each of which includes a first flexible substrate 10 and a second flexible substrate 20 that are aligned and bonded together. Along the thickness direction of the flexible panel, a first bonding opening 110 overlaps with at least a portion of a second bonding area AC, so that the first bonding opening 110 exposes at least a portion of the second bonding area AC, thereby facilitating the subsequent bonding of a second flexible circuit board to the second bonding area AC. Similarly, along the thickness direction of the flexible panel, a second bonding opening 210 overlaps with at least a portion of a first bonding area AB, so that the second bonding opening 210 exposes at least a portion of the first bonding area AB, thereby facilitating the subsequent bonding of a first flexible circuit board to the first bonding area AB.

[0056] S140. Inject liquid crystal into the flexible panel motherboard, and cut the flexible panel motherboard based on the first binding opening and the second binding opening to obtain multiple flexible panels.

[0057] For example, liquid crystal can be injected into the flexible panel using One Drop Filling (ODF) or liquid crystal can be injected into the flexible panel motherboard using vacuum crystal filling. This invention does not limit the specific method. Those skilled in the art can set it as needed. After injecting liquid crystal into the flexible panel motherboard, the flexible panel motherboard is cut based on the first binding opening and the second binding opening to obtain multiple flexible panels.

[0058] Furthermore, by cutting the flexible panel motherboard based on the first and second binding openings, multiple flexible panels can be obtained. This can be understood as the first and second binding openings coinciding with the cutting trajectory of the flexible panel motherboard. Thus, cutting the flexible panel motherboard based on the first and second binding openings to obtain multiple flexible panels can simultaneously yield both flexible panels and binding openings within them. Compared to the existing technology that first cuts the flexible panel and then performs a secondary cut to obtain the binding openings, this method saves the number of cutting operations. Moreover, since the first and second flexible substrates are relatively thick, they can be cut directly, further reducing the cutting difficulty and improving the cutting efficiency of the flexible substrate, thereby further improving the fabrication efficiency of the flexible panels.

[0059] Furthermore, by pre-setting bonding openings in the flexible substrate, the bonding area between the flexible substrate and the rigid substrate can be reduced, avoiding warping problems caused by stress differences between the flexible and rigid substrates during subsequent high-temperature processes, thereby improving the yield of flexible panel fabrication.

[0060] In summary, the flexible panel fabrication method provided by the embodiments of the present invention pre-fabricates multiple first bonding openings on a first flexible substrate and multiple second bonding openings on a second flexible substrate. When the first and second flexible substrates are aligned and bonded, in each repeating unit, the first bonding opening exposes at least a portion of the second bonding area, and the second bonding opening exposes at least a portion of the first bonding area. This eliminates the need to cut and expose the bonding areas in subsequent processes, avoiding the problem of high cutting difficulty that occurs when the flexible substrate is first fabricated on a rigid substrate and then cut by a cutting wheel or laser. This reduces the fabrication difficulty of the flexible panel. Furthermore, by pre-fabricating multiple first bonding openings on the first flexible substrate and multiple second bonding openings on the second flexible substrate, and then cutting the flexible substrate motherboard based on the first and second bonding openings, the number of cutting operations is reduced and the cutting difficulty is lowered compared to the prior art method of obtaining bonding openings through secondary cutting. In addition, pre-fabricating multiple first bonding openings on the first flexible substrate and multiple second bonding openings on the second flexible substrate can also reduce the bonding area between the flexible substrate and the rigid substrate in the subsequent process, thereby avoiding the warping problem caused by the different stresses of the flexible substrate and the rigid substrate in the subsequent high-temperature process, and improving the yield of flexible panel fabrication.

[0061] Based on the above embodiments, and in conjunction with the following specific implementation methods, the method for preparing a flexible panel provided by the present invention will be described in detail.

[0062] As a feasible implementation method, Figure 10 This is a schematic flowchart of another method for fabricating a flexible panel provided in an embodiment of the present invention. See also... Figure 10 The method for preparing a flexible panel provided in this embodiment of the invention includes:

[0063] S210. A first flexible substrate is provided and a plurality of first bonding openings are formed on the first flexible substrate. The first flexible substrate includes a plurality of first flexible substrates and the first flexible substrates include first bonding regions.

[0064] Specifically, multiple first bonding openings 110 can be prepared on the first flexible substrate 100 by punching, which simplifies the cutting process and reduces the difficulty of preparing the flexible panel.

[0065] S220. A second flexible substrate is provided and a plurality of second bonding openings are formed on the second flexible substrate. The second flexible substrate includes a plurality of second flexible substrates and the second flexible substrates include second bonding regions.

[0066] Specifically, multiple second bonding openings 210 can be prepared on the second flexible substrate 200 by punching, which simplifies the cutting process and reduces the difficulty of preparing the flexible panel.

[0067] S230. A flexible panel motherboard is formed by bonding a first flexible substrate and a second flexible substrate in an aligned manner. The flexible panel motherboard includes multiple repeating units. Along the thickness direction of the flexible panel, a first bonding opening overlaps with at least a portion of a second bonding area, and a second bonding opening overlaps with at least a portion of a first bonding area.

[0068] S240. Inject liquid crystal into the flexible panel motherboard and cut the flexible panel motherboard according to the preset cutting path to obtain multiple flexible panels, wherein the preset cutting path overlaps with the first binding opening and the second binding opening.

[0069] Specifically, the flexible panel motherboard 300 is cut based on the first binding opening 110 and the second binding opening 210. The flexible panel motherboard 300 can be cut according to a preset cutting path. The preset cutting path overlaps with the first binding opening 110 and the second binding opening 210. That is, whichever of the first binding opening 110 and the second binding opening 210 is located on the cutting path of the flexible panel motherboard, no further cutting is required at that location, thus reducing the cutting difficulty. Furthermore, compared to the prior art's two-stage cutting method for obtaining the binding opening, this invention saves the number of cutting operations. A single cut can simultaneously obtain the flexible panel and the binding opening within the flexible panel, reducing cutting difficulty. Moreover, pre-preparing multiple first binding openings on the first flexible substrate and multiple second binding openings on the second flexible substrate can reduce the subsequent bonding area between the flexible substrate and the rigid substrate, thereby mitigating warping problems caused by stress differences between the flexible and rigid substrates during subsequent high-temperature processes and improving the yield rate of the flexible panel.

[0070] Optional, see below Figure 9 The first bonding opening 110 and the second bonding opening 210 are located on different sides of the repeating unit 310. Specifically, the first bonding opening 110 and the second bonding opening 210 being located on different sides of the repeating unit 310 allows the exposed first bonding area AB and the second bonding area AC to be located on different sides of the repeating unit, thereby allowing the driving element corresponding to the first flexible substrate 10 to be bonded to the first bonding area AB, and the driving element corresponding to the second flexible substrate 20 to be bonded to the second bonding area AC. The bonding of the first bonding area AB and the second bonding area AC does not affect each other. Figure 10This description is merely exemplified by the example of the first binding opening 110 and the second binding opening 210 being located on the left and right sides of the repeating unit 310. In other real-world examples, the first binding opening 110 and the second binding opening 210 may be located on the left and right sides, the top and bottom sides, the top left sides, and the bottom right sides of the repeating unit 310, etc. The present invention does not limit this, and those skilled in the art can set it as needed.

[0071] Optional, Figure 11 This is a schematic diagram of the structure of another flexible panel motherboard provided in an embodiment of the present invention. See also... Figure 11 The first binding opening 110 and the second binding opening 210 are located on the same side of the repeating unit 310, and are staggered along a direction perpendicular to the thickness direction of the flexible panel motherboard 300. Specifically, the first binding opening 110 and the second binding opening 210 being located on the same side of the repeating unit 310 and being staggered allows the exposed first binding area AB and the second binding area AC to be located on the same side of the repeating unit 310. This allows the driving element corresponding to the first flexible substrate 10 to be bound to the first binding area AB, and the driving element corresponding to the second flexible substrate 20 to be bound to the second binding area AC. In other words, the driving elements are bound to the same side of the repeating unit 310, which ensures that the driving elements can be properly bound to the corresponding binding areas, reduces the coverage area of ​​the binding areas, and is beneficial for miniaturizing the flexible panel. Figure 11 This description is merely exemplified by the example of the first binding opening 110 and the second binding opening 210 being located in the lower half and upper half of the right side of the repeating unit 310, respectively. In other real-world examples, the first binding opening 110 and the second binding opening 210 may also be located in the upper left half and right half of the repeating unit 310, etc. The present invention does not limit this, and those skilled in the art can set it as needed.

[0072] Based on the above embodiments, Figure 12 This is a schematic diagram of another first flexible substrate provided in an embodiment of the present invention. Figure 13 This is a schematic diagram of another second flexible substrate provided in an embodiment of the present invention, combined with... Figure 12 and Figure 13 As shown, in the plurality of first flexible substrates 10, each first bonding region AB has the same relative positional relationship with its corresponding first flexible substrate 10, and there are two adjacent second bonding openings 210 that are interconnected along the long axis extension direction Y of the second bonding opening 210; and / or, in the plurality of second flexible substrates 20, the second bonding region AC has the same relative positional relationship with the second flexible substrate 20; and there are two adjacent first bonding openings that are interconnected along the long axis extension direction of the first bonding opening 110.

[0073] Specifically, the first flexible substrate 100 includes multiple first flexible substrates 10, each first flexible substrate 10 including a first bonding region AB. The relative positions of the first bonding regions AB in each first flexible substrate 10 are the same. Therefore, when the first flexible substrate 100 and the second flexible substrate 200 are aligned and bonded, the positions of the second bonding openings 210 on the second flexible substrate 200 corresponding to the exposed first bonding regions AB are the same. Thus, along the long axis Y of the second bonding opening 210, two adjacent second bonding openings 210 are interconnected, forming a large bonding opening. This reduces the difficulty of cutting the second bonding opening 210, further reduces the bonding area between the flexible substrate and the rigid substrate, and reduces stress. Furthermore, the interconnection of two adjacent second bonding openings 210 can be two, three, or more. This embodiment of the invention does not limit this; in actual processes, the number of interconnected second bonding openings 210 can be reasonably set based on the difficulty of cutting the second bonding opening 210, the bonding area between the flexible substrate and the rigid substrate, and the support capacity of the second flexible substrate 200.

[0074] Similarly, the second flexible substrate 200 includes a plurality of second flexible substrates 20, each of which includes a second bonding region AC. The relative positions of the second bonding regions AC in each second flexible substrate 20 are the same. Thus, when the first flexible substrate 100 and the second flexible substrate 200 are aligned and bonded, the positions of the first bonding openings 110 on the first flexible substrate 100 that expose the second bonding regions AC are the same. In this way, along the long axis Y of the first bonding openings 110, there are two adjacent first bonding openings 110 that are interconnected, forming a large bonding opening. This can reduce the difficulty of cutting the second bonding openings 210, further reduce the bonding area between the flexible substrate and the rigid substrate, and reduce stress. Furthermore, there are two adjacent first binding openings 110 that are interconnected, which can be two second binding openings 210 that are interconnected, or three or more second binding openings 210 that are interconnected. This embodiment of the invention does not limit this. In actual process, the number of interconnected first binding openings 110 can be reasonably set according to the cutting difficulty of the second binding openings 210, the attachment area between the flexible substrate and the rigid substrate, and the support capacity of the first flexible substrate 100.

[0075] Based on the above embodiments, the first flexible substrate includes a first edge region and a first central region, with the first edge region surrounding the first central region; the second flexible substrate includes a second edge region and a second central region, with the second edge region surrounding the second central region. Therefore, Figure 14 This is a schematic flowchart of another method for preparing a flexible panel provided in an embodiment of the present invention, as shown below. Figure 14 As shown, the method for preparing a flexible panel provided in this embodiment of the invention includes:

[0076] S310. A first flexible substrate is provided and a plurality of first bonding openings are formed on the first flexible substrate. The first flexible substrate includes a plurality of first flexible substrates and the first flexible substrates include first bonding regions.

[0077] S320. A second flexible substrate is provided and a plurality of second bonding openings are formed on the second flexible substrate. The second flexible substrate includes a plurality of second flexible substrates and the second flexible substrates include second bonding regions.

[0078] S330. A first adhesive and a second adhesive are disposed on one side of the first flexible substrate. The first adhesive is located in at least a portion of the first edge region, and the second adhesive is located in at least a portion of the first center region. At least at a first temperature, the adhesive strength of the first adhesive is greater than that of the second adhesive. A first rigid substrate is disposed on the side of the first adhesive and the second adhesive away from the first flexible substrate. The first flexible substrate and the first rigid substrate are bonded together by the first adhesive and the second adhesive.

[0079] For example, Figure 15 This is a schematic diagram of the structure of a first flexible substrate adhesive provided in an embodiment of the present invention. See also... Figure 15The first flexible substrate 100 includes a first edge region M1 and a first central region M2. The first edge region M1 surrounds the first central region M2. A first adhesive 120 is disposed in at least a portion of the first edge region M1, and a second adhesive 130 is disposed in at least a portion of the first central region M2. A first rigid substrate 140 is disposed on the side of the first adhesive 120 and the second adhesive 130 away from the first flexible substrate 100. The first flexible substrate 100 and the first rigid substrate 140 are bonded together by the first adhesive 120 and the second adhesive 130. The adhesive strength of the first adhesive 120 is greater than that of the second adhesive 130. For example, the first adhesive 120 has strong tack, which can be greater than or equal to 100gf / 25mm; the second adhesive 130 has weak tack, which can be less than or equal to 20gf / 25mm. Alternatively, at a first temperature (wherein the first temperature is a relatively high temperature, for example, greater than or equal to 120°C), the tack of the first adhesive 120 is greater than the tack of the second adhesive 130. For example, the second adhesive 130 has strong tack, but its tack is weakened at the first temperature. For instance, the tack of the second adhesive 130 at room temperature is greater than or equal to 100gf / 25mm, while at the first temperature it is less than or equal to 20gf / 25mm. Because flexible panels involve high-temperature processes such as electrode fabrication and alignment layer preparation, the second adhesive 130 is designed to have reduced tackiness at high temperatures. This reduces the bonding stress between the first flexible substrate 100 and the first rigid substrate 140, as well as the internal stress generated at high temperatures. This avoids issues such as internal stress in the adhesive, expansion and contraction due to high and low temperatures, and warping of the first rigid substrate 140. For example, the curing temperature of the alignment layer can be 120°C, at which point the tackiness of the second adhesive can be 10 gf / 25 mm. Specifically, the second adhesive can be a high-temperature resistant UV-resistant adhesive, which can reduce its tackiness by being exposed to ultraviolet light.

[0080] Furthermore, along the thickness direction of the first flexible substrate, both the first adhesive and the second adhesive are staggered from the first bonding opening, so that no adhesive is applied to the position corresponding to the first bonding opening on the first flexible substrate, thereby ensuring that the position of the first bonding opening can be cut normally in the future.

[0081] S340. A first electrode is prepared on the side of the first flexible substrate away from the first rigid substrate; a first alignment layer is prepared on the side of the first electrode away from the first rigid substrate.

[0082] For example, see [link to example]. Figure 15A first electrode 41 is formed on the side of the first flexible substrate 100 away from the first rigid substrate 140, and a first alignment layer 51 is formed on the side of the first electrode 41 away from the first rigid substrate 140. A voltage is applied to the liquid crystal layer through the first electrode 41 to achieve liquid crystal deflection; the initial deflection direction of the liquid crystal layer is set through the first alignment layer 51.

[0083] Furthermore, the first electrode may be integrally formed, or the first electrode may comprise multiple independently formed sub-electrodes.

[0084] Specifically, the first electrode can be integrated into a single unit, meaning that the first electrode as a whole controls the deflection of liquid crystal molecules in the liquid crystal layer. This simplifies the setup of the first electrode and the control of the liquid crystal layer. Alternatively, the first electrode can comprise multiple independently configured first sub-electrodes. This can be understood as dividing the liquid crystal layer into multiple regions, each of which is individually controlled by a corresponding first sub-electrode to control the deflection of its liquid crystal molecules. Consequently, different potential signals can be used to adjust the light transmittance of different regions within the liquid crystal layer, facilitating diverse light transmission designs for flexible panels.

[0085] It should be noted that the present invention does not limit the preparation method of the first electrode 41 and the first alignment layer 51, and those skilled in the art can set it as needed.

[0086] S350, a third adhesive and a fourth adhesive are disposed on one side of the second flexible substrate, the third adhesive being located in at least a portion of the second edge region and the fourth adhesive being located in at least a portion of the second center region, and at least at a first temperature, the adhesive strength of the third adhesive is greater than that of the fourth adhesive; a second rigid substrate is disposed on the side of the third adhesive and the fourth adhesive away from the second flexible substrate, and the second flexible substrate and the second rigid substrate are bonded together by the third adhesive and the fourth adhesive.

[0087] For example, Figure 16 This is a schematic diagram of the structure of a second flexible substrate adhesive provided in an embodiment of the present invention. See also... Figure 16The second flexible substrate 200 includes a second edge region M3 and a second central region M4. The second edge region M3 surrounds the second central region M4. A third adhesive 220 is provided in at least a portion of the second edge region M3, and a fourth adhesive 230 is provided in at least a portion of the second central region M4. A second rigid substrate 240 is provided on the side of the third adhesive 220 and the fourth adhesive 230 away from the second flexible substrate 200. The second flexible substrate 200 and the second rigid substrate 240 are bonded together by the third adhesive 220 and the fourth adhesive 230. The third adhesive 220 has a stronger tack than the fourth adhesive 230. For example, the third adhesive 220 has strong tack, which can be greater than or equal to 100 gf / 25 mm. The fourth adhesive 230 has weak tack, which can be less than or equal to 20 gf / 25 mm. Alternatively, at a first temperature (where the first temperature is a relatively high temperature, for example, greater than or equal to 120°C), the third adhesive 220 has a stronger tack than the fourth adhesive 230. For example, the fourth adhesive 230 has strong tack, but its tack is weakened at the first temperature. For instance, the fourth adhesive 230 has a tack greater than or equal to 100 gf / 25 mm at room temperature, but less than or equal to 20 gf / 25 mm at the first temperature. Because flexible panels involve high-temperature processes such as electrode fabrication and alignment layer preparation, the fourth adhesive 230 is designed to have reduced tackiness at high temperatures. This reduces the bonding stress between the second flexible substrate 200 and the second rigid substrate 240, as well as the internal stress generated at high temperatures. This avoids issues such as internal stress in the adhesive, expansion and contraction due to high and low temperatures, and warping of the second rigid substrate 240. For example, the curing temperature of the alignment layer can be 120°C, at which point the tackiness of the fourth adhesive can be 10 gf / 25 mm. Specifically, the fourth adhesive can be a high-temperature resistant UV-resistant adhesive, whose tackiness can be reduced by exposure to ultraviolet light.

[0088] Furthermore, along the thickness direction of the second flexible substrate, the third adhesive and the fourth adhesive are both staggered from the second bonding opening, so that no adhesive is applied to the position corresponding to the second bonding opening on the second flexible substrate, thereby ensuring that the position of the second bonding opening can be cut normally in the future.

[0089] S360. A second electrode is prepared on the side of the second flexible substrate away from the second rigid substrate; a second alignment layer is prepared on the two sides of the second electrode away from the second rigid substrate.

[0090] For example, see [link to example]. Figure 16A second electrode 42 is formed on the side of the second flexible substrate 200 away from the second rigid substrate 240, and a second alignment layer 52 is formed on the side of the second electrode 42 away from the second rigid substrate 240. A voltage is applied to the liquid crystal layer through the second electrode 42 to achieve liquid crystal deflection; the initial deflection direction of the liquid crystal layer is set through the second alignment layer 52.

[0091] Furthermore, the second electrode may be integrally formed, or the second electrode may comprise multiple independently formed sub-electrodes.

[0092] Specifically, the second electrode can be integrated into a single unit, meaning that the second electrode as a whole controls the deflection of liquid crystal molecules in the liquid crystal layer. This simplifies the setup of the second electrode and the control of the liquid crystal layer. Alternatively, the second electrode can comprise multiple independently configured sub-electrodes. This can be understood as dividing the liquid crystal layer into multiple regions, each of which is individually controlled by a corresponding sub-electrode to control the deflection of its liquid crystal molecules. Furthermore, different potential signals can be used to adjust the light transmittance of different regions within the liquid crystal layer, facilitating diverse light transmission designs for flexible panels.

[0093] It should be noted that the present invention does not limit the preparation method of the second electrode 42 and the second alignment layer 52, and those skilled in the art can set them as needed.

[0094] S370. A flexible panel motherboard is formed by bonding a first flexible substrate and a second flexible substrate in an aligned manner. The flexible panel motherboard includes multiple repeating units. Along the thickness direction of the flexible panel, a first bonding opening overlaps with at least a portion of a second bonding area, and a second bonding opening overlaps with at least a portion of a first bonding area.

[0095] S380. Inject liquid crystal into the flexible panel motherboard, peel off the first rigid substrate and the second rigid substrate, and cut the flexible panel motherboard based on the first binding opening and the second binding opening to obtain multiple flexible panels.

[0096] Specifically, before cutting the flexible panel motherboard based on the first and second binding openings, the first and second rigid substrates can be peeled off first to ensure that the flexible panel cutting process is simple.

[0097] In summary, the flexible panel fabrication method provided by the embodiments of the present invention, by pre-fabricating multiple first bonding openings on a first flexible substrate and multiple second bonding openings on a second flexible substrate, further provides a first adhesive and a second adhesive for bonding the first flexible substrate and a first rigid substrate, wherein the first adhesive is located in a first edge region and the second adhesive is located in a first central region, and at least at a first temperature, the adhesive strength of the first adhesive is greater than that of the second adhesive; and provides a third adhesive and a fourth adhesive for bonding the second flexible substrate and the second rigid substrate, wherein the third adhesive is located in a second edge region and the fourth adhesive is located in a second central region, and at least at a first temperature, the adhesive strength of the third adhesive is greater than that of the fourth adhesive. This reduces the difficulty of fabricating the flexible panel, reduces the bonding stress between the flexible substrate and the rigid substrate, and reduces the internal stress generated at high temperatures, avoiding the problem of warping of the rigid substrate due to the internal stress of the adhesive and the expansion and contraction caused by high and low temperatures.

[0098] As a feasible implementation method, Figure 17 This is a schematic flowchart of another method for preparing a flexible panel provided in an embodiment of the present invention. Figure 18 This is a schematic diagram of another type of first flexible substrate provided in an embodiment of the present invention. Figure 19 This is a schematic diagram of the structure of another second flexible substrate provided in an embodiment of the present invention. The method for preparing a flexible panel provided in an embodiment of the present invention includes:

[0099] S410. A first flexible substrate is provided and a plurality of first bonding openings are formed on the first flexible substrate. The first flexible substrate includes a plurality of first flexible substrates and the first flexible substrates include first bonding regions.

[0100] S420. A second flexible substrate is provided and a plurality of second bonding openings are formed on the second flexible substrate. The second flexible substrate includes a plurality of second flexible substrates and the second flexible substrates include second bonding regions.

[0101] S430. At least one first additional opening is formed on the first flexible substrate, the first additional opening penetrating the first flexible substrate; at least one second additional opening is formed on the second flexible substrate, the second additional opening penetrating the second flexible substrate.

[0102] For details, see Figure 18 and Figure 19Furthermore, multiple first additional openings 160 can be formed on the first flexible substrate 100, with the first additional openings 160 penetrating the first flexible substrate 100. This can reduce the adhesion area between the first flexible substrate 100 and the rigid substrate, thereby reducing stress. Similarly, multiple second additional openings 260 can be formed on the second flexible substrate 200, with the second additional openings 260 penetrating the second flexible substrate 200. This can reduce the adhesion area between the second flexible substrate 200 and the rigid substrate, thereby reducing stress.

[0103] Furthermore, the preset cutting path of the flexible panel motherboard can overlap with the first additional opening 160 and the second additional opening 260, so that the positions of the first additional opening 160 and the second additional opening 260 do not need to be cut, thus reducing the cutting difficulty.

[0104] It should be noted that the first additional opening 160 can be prepared in the same process as the first binding opening, ensuring that the preparation process of the first additional opening is simple; the second additional opening 260 can be prepared in the same process as the second binding opening, ensuring that the preparation process of the second additional opening is simple.

[0105] It should also be noted that when two first additional openings have the same long axis extension direction and are located on the same side of the flexible substrate, the two first additional openings can be connected to each other, thus forming a large additional opening. This reduces the difficulty of cutting the first additional openings, further reduces the adhesion area between the flexible substrate and the rigid substrate, and reduces stress. Similarly, when two second additional openings have the same long axis extension direction and are located on the same side of the flexible substrate, the two second additional openings can be connected to each other, thus forming a large additional opening. This reduces the difficulty of cutting the second additional openings, further reduces the adhesion area between the flexible substrate and the rigid substrate, and reduces stress.

[0106] S440. A flexible panel motherboard is formed by bonding a first flexible substrate and a second flexible substrate in an aligned manner. The flexible panel motherboard includes multiple repeating units. Along the thickness direction of the flexible panel, a first bonding opening overlaps with at least a portion of a second bonding area, and a second bonding opening overlaps with at least a portion of a first bonding area.

[0107] S450: Inject liquid crystal into the flexible panel motherboard, and cut the flexible panel motherboard based on the first binding opening and the second binding opening to obtain multiple flexible panels.

[0108] In summary, the flexible panel fabrication method provided by the embodiments of the present invention, by pre-fabricating multiple first bonding openings on a first flexible substrate and multiple second bonding openings on a second flexible substrate, further prepares at least one first additional opening on the first flexible substrate, the first additional opening penetrating the first flexible substrate, and prepares at least one second additional opening on the second flexible substrate, the second additional opening penetrating the second flexible substrate. This reduces the fabrication difficulty of the flexible panel, reduces the bonding area between the first flexible substrate and the rigid substrate, and thus reduces stress.

[0109] Based on the above embodiments, the preparation method provided by the present invention may further include binding a first flexible circuit board in a first binding area and binding a second flexible circuit board in a second binding area, wherein both the first flexible circuit board and the second flexible circuit board are electrically connected to the driving motherboard.

[0110] Specifically, the drive motherboard provides drive signals to the first flexible circuit board and the second flexible circuit board, and then applies drive voltages to the first electrode and the second electrode, which are electrically connected to the first flexible circuit board and the second flexible circuit board respectively, so as to adjust the refractive index of the liquid crystal layer, realize the light transmission and light opacity of the flexible panel, and ensure the normal operation of the flexible panel.

[0111] Based on the same inventive concept, embodiments of the present invention also provide a flexible device 400, which includes any of the flexible panels provided in the above embodiments. For example, Figure 19 This is a schematic diagram of the structure of a flexible device plate provided in an embodiment of the present invention, with reference to... Figure 19 The flexible device 400 includes a flexible panel 1. Therefore, this flexible device also possesses the beneficial effects of the flexible panel described in the above embodiments. The similarities can be understood by referring to the explanation of the flexible panel above, and will not be repeated below. The flexible device 400 provided in this embodiment can be a liquid crystal curtain without a display function, or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, automotive displays, industrial control equipment, medical displays, touch interactive terminals, etc. This embodiment does not impose any special limitations on these categories.

[0112] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A flexible panel, characterized in that, It includes a first flexible substrate, a second flexible substrate, and a liquid crystal layer disposed between the first flexible substrate and the second flexible substrate, which are disposed opposite to each other. The first flexible substrate includes a first bonding region, and the second flexible substrate includes a second bonding region; along a direction perpendicular to the thickness direction of the flexible panel, the first bonding region and the second flexible substrate are offset from each other, and the second bonding region and the first flexible substrate are offset from each other; and along the thickness direction of the flexible panel, the thickness D1 of the first flexible substrate satisfies D1≥50µm, and the thickness D2 of the second flexible substrate satisfies D2≥50µm. The first flexible substrate includes a plurality of first flexible substrates, and the second flexible substrate includes a plurality of second flexible substrates; The first flexible substrate includes a first edge region and a first central region, wherein the first edge region surrounds the first central region; The second flexible substrate includes a second edge region and a second central region, wherein the second edge region surrounds the second central region; One side of the first flexible substrate includes a first adhesive and a second adhesive. The first adhesive is located in at least a portion of the first edge region, and the second adhesive is located in at least a portion of the first center region. At a first temperature, the adhesive strength of the first adhesive is greater than that of the second adhesive, and the second adhesive has strong adhesiveness, which weakens at the first temperature. The first rigid substrate is located on the side of the first adhesive and the second adhesive away from the first flexible substrate; The first flexible substrate and the first rigid substrate are bonded together by the first adhesive and the second adhesive, and the first temperature is ≥120°C.

2. The flexible panel according to claim 1, characterized in that, The first binding area and the second binding area are located on different sides of the flexible panel.

3. The flexible panel according to claim 1, characterized in that, The first binding area and the second binding area are located on the same side of the flexible panel, and are staggered along a direction perpendicular to the thickness direction of the flexible panel.

4. The flexible panel according to claim 1, characterized in that, The flexible panel further includes a first electrode, a second electrode, a first alignment layer, a second alignment layer, a first flexible circuit board, and a second flexible circuit board; The first electrode is located on the side of the first flexible substrate closer to the liquid crystal layer; The second electrode is located on the side of the second flexible substrate closer to the liquid crystal layer; The first alignment layer is located on the side of the first electrode closer to the liquid crystal layer; The second alignment layer is located on the side of the second electrode closer to the liquid crystal layer; The first flexible circuit board is located in the first bonding area and is electrically connected to the first electrode; The second flexible circuit board is located in the second bonding area and is electrically connected to the second electrode.

5. The flexible panel according to claim 4, characterized in that, The first electrode is integrally formed, or the first electrode comprises multiple independently formed first sub-electrodes; The second electrode is integrally formed, or the second electrode includes multiple independently formed second sub-electrodes.

6. A method for preparing a flexible panel, characterized in that, include: A first flexible substrate is provided, and a plurality of first bonding openings are formed on the first flexible substrate; The first flexible substrate includes a plurality of first flexible substrates, and the first flexible substrate includes a first bonding region; the thickness D1 of the first flexible substrate satisfies D1≥50µm; A second flexible substrate is provided, and a plurality of second bonding openings are formed on the second flexible substrate; the second flexible substrate includes a plurality of second flexible substrates, and the second flexible substrates include second bonding regions; the thickness D2 of the second flexible substrates satisfies D2≥50µm; A flexible panel motherboard is formed by bonding the first flexible substrate and the second flexible substrate in an aligned manner. The flexible panel motherboard includes a plurality of repeating units. Along the thickness direction of the flexible panel, the first bonding opening overlaps with at least a portion of the second bonding area, and the second bonding opening overlaps with at least a portion of the first bonding area. Liquid crystal is injected into the flexible panel motherboard; The flexible panel motherboard is cut based on the first binding opening and the second binding opening to obtain multiple flexible panels; The first flexible substrate includes a first edge region and a first central region, wherein the first edge region surrounds the first central region; The second flexible substrate includes a second edge region and a second central region, wherein the second edge region surrounds the second central region; Before forming a flexible panel motherboard by aligning the first flexible substrate and the second flexible substrate, the method further includes: A first adhesive and a second adhesive are disposed on one side of the first flexible substrate. The first adhesive is located in at least a portion of the first edge region, and the second adhesive is located in at least a portion of the first center region. At a first temperature, the adhesive strength of the first adhesive is greater than that of the second adhesive. A first rigid substrate is disposed on the side of the first adhesive and the second adhesive away from the first flexible substrate, the first flexible substrate and the first rigid substrate are bonded by the first adhesive and the second adhesive, and the first temperature is ≥120℃; The second adhesive has strong adhesion, which weakens at the first temperature.

7. The preparation method according to claim 6, characterized in that, Cutting the flexible panel motherboard based on the first binding opening and the second binding opening includes: The flexible panel motherboard is cut according to a preset cutting path, and the preset cutting path overlaps with the first binding opening and the second binding opening.

8. The preparation method according to claim 6, characterized in that, The first binding opening and the second binding opening are located on different sides of the repeating unit.

9. The preparation method according to claim 6, characterized in that, The first binding opening and the second binding opening are located on the same side of the repeating unit and are staggered along a direction perpendicular to the thickness direction of the flexible panel motherboard.

10. The preparation method according to claim 6, characterized in that, In the plurality of first flexible substrates, each first bonding region has the same relative positional relationship with its corresponding first flexible substrate; Along the long axis of the second binding opening, there are two adjacent second binding openings that are interconnected. And / or, in a plurality of the second flexible substrates, the second bonding region has the same relative positional relationship with the second flexible substrate; Along the long axis of the first binding opening, there are two adjacent first binding openings that are interconnected.

11. The preparation method according to claim 6, characterized in that, Before forming a flexible panel motherboard by aligning the first flexible substrate and the second flexible substrate, the method further includes: A third adhesive and a fourth adhesive are disposed on one side of the second flexible substrate. The third adhesive is located in at least a portion of the second edge region, and the fourth adhesive is located in at least a portion of the second center region. At least at the first temperature, the adhesive strength of the third adhesive is greater than that of the fourth adhesive. A second rigid substrate is disposed on the side of the third adhesive and the fourth adhesive away from the second flexible substrate, and the second flexible substrate and the second rigid substrate are bonded together by the third adhesive and the fourth adhesive.

12. The preparation method according to claim 11, characterized in that, After the first rigid substrate is disposed on the side of the first adhesive and the second adhesive away from the first flexible substrate, the method further includes: A first electrode is fabricated on the side of the first flexible substrate away from the first rigid substrate; A first alignment layer is prepared on the side of the first electrode away from the first rigid substrate; After the second rigid substrate is disposed on the side of the third adhesive and the fourth adhesive away from the second flexible substrate, the method further includes: A second electrode is fabricated on the side of the second flexible substrate away from the second rigid substrate; A second alignment layer is prepared on the side of the second electrode away from the second rigid substrate.

13. The preparation method according to claim 12, characterized in that, The first electrode is integrally formed, or the first electrode comprises multiple independently formed sub-electrodes; The second electrode is integrally formed, or the second electrode comprises multiple independently formed sub-electrodes.

14. The preparation method according to claim 11, characterized in that, Along a direction perpendicular to the thickness direction of the first flexible substrate, both the first adhesive and the second adhesive are staggered from the first bonding opening; Along a direction perpendicular to the thickness direction of the second flexible substrate, both the third adhesive and the fourth adhesive are offset from the second bonding opening.

15. The preparation method according to claim 6, characterized in that, Before forming the flexible panel motherboard by aligning the first flexible substrate and the second flexible substrate, the method further includes: At least one first additional opening is formed on the first flexible substrate, the first additional opening penetrating the first flexible substrate; At least one second additional opening is formed on the second flexible substrate, the second additional opening penetrating the second flexible substrate.

16. The preparation method according to claim 6, characterized in that, The preparation method further includes: A first flexible circuit board is bonded to the first bonding area; A second flexible circuit board is bonded in the second bonding area, and both the first and second flexible circuit boards are electrically connected to the drive motherboard.

17. The preparation method according to claim 6, characterized in that, Multiple first bonding openings are fabricated on the first flexible substrate, specifically including: The plurality of first bonding openings are prepared on the first flexible substrate by a punching method; Multiple second bonding openings are fabricated on the second flexible substrate, specifically including: The plurality of second bonding openings are prepared on the second flexible substrate by punching.

18. A flexible device, characterized in that, Includes the flexible panel as described in any one of claims 1-5.

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