Flexible heater

Abstract

The present disclosure is and includes a flexible heater comprising: a conformal substrate; a matched set of deposited materials comprising a matched set of additively printed matching functional inks, this is achieved by matching each ink in the matched set of deposited materials to at least: conformal substrate acceptability of each ink printed onto the conformal substrate; electrical conductivity between the conformal substrate and each ink; chemical reactivity between the conformal substrate and each ink; different printing and curing methods between each ink; each ink printed in successive additional printed layers onto at least one substantially planar face of the substrate to form at least: at least one electrically conductive layer; at least one electrically resistive layer; at least one dielectric layer; wherein the matching between each ink to each other and between each ink and the conformal substrate is to provide an approximation of a subtractive process when the conformal substrate is not sensitive to subtractive properties.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 201880084718.X, filed December 3, 2018, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A CONFORMABLE HEATER SYSTEM,” which claims priority to and is related to and incorporates by reference U.S. Application No. 15 / 829,666, filed December 1, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A CONFORMABLE HEATER SYSTEM,” which is a continuation-in-part of U.S. Application No. 15 / 683,437, filed August 22, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A FLUID BAG HEATER,” and U.S. Application No. 15 / 689,611, filed August 29, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A CONFORMABLE HEATER IN WEARABLES.”

[0002] Cross Reference to Related Applications

[0003] This application claims the benefit of, is related to, and incorporates by reference U.S. Application No. 15 / 829,666, filed December 1, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A CONFORMABLE HEATER SYSTEM,” which is a continuation-in-part of U.S. Application No. 15 / 683,437, filed August 22, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A FLUID BAG HEATER,” and U.S. Application No. 15 / 689,611, filed August 29, 2017, entitled “APPARATUS, SYSTEM AND METHOD OF PROVIDING A CONFORMABLE HEATER IN WEARABLES.” TECHNICAL FIELD

[0004] The present disclosure relates generally to printed electronics, and more particularly to conformable heaters, for example, for use in wearables. BACKGROUND

[0005] Printed electronics use printing or “additive” methods to produce electrical (and other) devices on a variety of substrates. Printing generally defines a pattern on a variety of substrate materials, for example, using screen printing, flexographic printing, gravure printing, lithographic printing, and inkjet. Electrical functional electronic or optical inks are deposited on a substrate using one or more of these printing techniques, thereby producing active or passive devices such as transistors, capacitors, resistors, and inductive coils.

[0006] Printed electronics can use inorganic or organic inks. These ink materials can be deposited by solution-based, vacuum-based, or other processes. Ink layers can be applied one on top of another. Printed electronic features can include or be semiconductors, metallic conductors, nanoparticles, nanotubes, etc.

[0007] Rigid substrates, such as glass and silicon, are suitable for printed electronics. Poly(ethylene terephthalate) foil (PET) is a common substrate, partly due to its low cost and moderate high-temperature stability. Poly(ethylene naphthalate)-(PEN) and poly(imide)-foil (PI) are alternative substrates. Alternative substrates include paper and fabric, although the high surface roughness and high absorbency of such substrates may pose problems in printed electronics. In short, typically, a suitable substrate for printed electronics preferably has minimal roughness, suitable wettability, and low absorbency.

[0008] Printed electronics offer low-cost, high-volume manufacturing. The lower cost enables its use in many applications, but typically results in reduced performance compared to "conventional electronics." Furthermore, manufacturing methods on a variety of substrates allow for the use of electronics in ways previously unknown, at least substantially without increasing costs. For example, printing on flexible substrates allows electronics to be placed on curved surfaces without the additional costs that would be required in such cases using conventional electronics.

[0009] Furthermore, conventional electronics typically have lower limitations on feature size. In contrast, printed electronics can provide higher resolution and smaller structures, thus offering circuit density, precise layering, and variability in functionality that are unavailable with conventional electronics.

[0010] In printed electronics, controlling thickness, aperture, and material compatibility is essential. In practice, the choice of one or more printing methods can be determined by requirements related to the properties of the printed layers, layer characteristics, and printed materials (such as the aforementioned thickness, aperture, and material type), as well as by economic and technical considerations of the final printed product.

[0011] Generally, sheet-based inkjet and screen printing are best suited for low-volume, high-precision printing of electronic products. Gravure, offset, and flexographic printing are more common for high-volume production. Offset and flexographic printing are typically used for inorganic and organic conductors and dielectric materials, while gravure printing is highly suitable for quality-sensitive layers, such as within transistors, due to the high-quality layers it provides.

[0012] Inkjet printing is very versatile, but generally offers lower throughput and is better suited for low-viscosity, soluble materials due to potential nozzle clogging. Screen printing is typically used to produce patterned, thick layers from paste-like materials. Aerosol jet printing atomizes the ink and uses an airflow to focus the printed droplets into a tightly aligned beam.

[0013] Evaporation printing combines high-precision screen printing with material evaporation. Material is deposited through a high-precision template that is "aligned" with the substrate. Other printing methods can be used, such as microcontact printing and photolithography, such as nanoimprint lithography.

[0014] Electronic functionality and printability can be balanced and forced to be optimized to allow for the best results. For example, a higher molecular weight in a polymer increases electrical conductivity but reduces solubility. Furthermore, viscosity, surface tension, and solids content must be strictly selected and controlled during printing. Interlayer interactions, as well as post-deposition processes and layers, also affect the properties of the final product.

[0015] Printed electronics can provide patterns with widths ranging from 3-10 μm or less and layer thicknesses ranging from tens of nanometers to greater than 10 μm. Once printing and patterning are complete, post-processing of the substrate may be required to achieve the final electrical and mechanical properties. Post-processing can be largely driven by specific ink and substrate combinations.

[0016] Typical heaters for wearable devices (such as clothing or accessories) are manufactured using conventional electronics technology and manual labor. For example, rigid, thick, and bulky heaters are typically provided, such as those associated with printed circuit boards. Wiring that typically allows these thick, bulky heaters to operate is sewn into the wearable device, for example, between layers of fabric, to enclose the heating element within the fabric.

[0017] Furthermore, smaller heaters manufactured using atypical processing methods are typically expensive, partly due to the complex manufacturing steps required. Therefore, these heaters cannot be used in wearable applications. Moreover, if, for example, the wearable device associated with the heater is to be cleaned, either of the aforementioned atypical or conventional heater types must have an extremely high level of encapsulation. This is especially true if the wearable device is to be cleaned multiple times throughout its lifespan. In other words, the limiting factor throughout the wearable's lifespan should not be the heater supplied in conjunction with the wearable device.

[0018] Additionally, in exemplary cases, medical bags, such as medical fluid bags or blood bags, typically require heating. In the prior art, this heating is usually provided by an electronic heating hardware unit that must hold the medical bag inside. Therefore, in known embodiments, relatively large and / or substantially immobile devices constitute the means of providing heat to the medical fluid bag.

[0019] Smaller heaters manufactured using atypical processing methods can offer enhanced mobility, but they are typically very expensive, partly because manufacturing such heaters requires complex steps and is not usually highly reliable. Therefore, these heaters cannot currently be used to heat wearable devices or medical bags.

[0020] Therefore, smaller heaters can be assembled using in-line and / or high-volume processes (such as additional printing processes), and are thus less complex to manufacture, resulting in more cost-effective manufacturing, longer lifespan of the heater and wearable device, and other significant advantages. Such heaters should be formed in a thin, smaller, more conformal, and flexible form, and molded on a moldable substrate, to not only address the aforementioned issues but also allow for integration into a wider range of applications.

[0021] Furthermore, currently, components detached from the bag are commonly used to monitor the characteristics (e.g., temperature) of fluid bags such as medical fluid bags. As a non-limiting example, these detached components include thermocouples or infrared guns that include the bag. However, such methods can frequently result in inappropriate temperature measurements of the bag due to factors such as human error, environmental or electrical interference between the bag and the temperature reader, and component failures caused by the need for various additional components to establish the electrical connection from the bag to the reader.

[0022] Furthermore, existing methods for indicating the fluid level in a bag, such as a medical fluid bag, are limited to weight measurement, for example, in which the bag, placed on an IV stand, has a pull-down hook that is electrically connected to a measuring scale. However, this method of measuring the fluid level remaining in the bag is highly inaccurate, at least due to the possibility of human error, such as someone pulling the bag down, environmental and / or usage factors, such as shaking of the measuring hook when the IV stand is moved, or disconnection of the electrical connection when the IV stand is moved.

[0023] Furthermore, methods for transmitting temperature and level data to one or more parties of interest are currently inadequate, partly due to the inaccuracies of temperature and level sensors used in conjunction with fluid bags. For example, readings on the infrared gun may be inaccurate due to human error, such as equipment or body parts entering between the IR gun and the bag, for the reasons mentioned above. Additionally, for example, scale readings and attempts to sense the level in the bag may need to be converted by a human user, or may be inaccurate due to all the foregoing reasons and, additionally, due to a lack of consideration for the weight of the bag itself.

[0024] Therefore, not only are improved design and printing methods needed to place the heater in association with a fluid bag, such as a medical fluid bag, but also improved methods are needed to associate bag characteristic measurements, such as temperature measurement and level sensing, with the fluid bag, and the recorded data associated with such temperature and level sensing needs to be made available to one or more interested users. Summary of the Invention

[0025] Therefore, this disclosure provides at least one apparatus, system, and method for a flexible heater. The flexible heater includes a conformal substrate; a matching functional ink set printed on at least one substantially flat surface of the substrate to form at least one conductive layer capable of receiving current from at least one power source; a resistive layer electrically associated with the at least one conductive layer and including a plurality of heating elements capable of generating heat upon receiving the current; and a dielectric layer capable of at least partially insulating the at least one resistive layer, wherein the matching ink set is matched to prevent harmful interactions between the printed inks of each of the at least one conductive layer, the resistive layer, and the dielectric layer, and to prevent harmful interactions with the conformal substrate.

[0026] The flexible heater may additionally include an encapsulation that at least partially seals a conformal substrate with matching ink groups on it, protecting it from environmental factors. The flexible heater may also be integrated into a wearable device with a conformal substrate having matching ink groups on it.

[0027] The flexible heater may also include a driver circuit grounded to at least one conductive layer. The driver circuit may include a control system, wherein the heat transferred by the heating element is controlled by the control system.

[0028] This disclosure also includes at least one apparatus, system, and method for a flexible heater sensor adapted for association with a fluid bag. The apparatus, system, and method may include a conformal substrate on a sheet of the fluid bag opposite to a printed flexible heater; and a matching ink group printed on at least one substantially flat surface of the substrate. The matching ink group forms: at least one conductive layer capable of receiving current from at least one power source; and at least one dielectric layer capable of at least partially insulating the at least one conductive layer and at least partially limiting the conductivity of the at least one conductive layer; wherein the matching ink group is matched to prevent harmful interactions between the printed inks of each of the at least one conductive layer and the dielectric layer, and to prevent harmful interactions with the conformal substrate; and wherein the at least one conductive layer and the at least one dielectric layer include sensing circuitry that senses at least the temperature of the fluid within the fluid bag.

[0029] Therefore, this disclosure provides improved design and printing methods for placing a heater in association with a fluid bag (e.g., a medical fluid bag) or a wearable device, and further provides improved methods for associating bag characteristic measurements such as temperature sensing and liquid level sensing with the fluid bag, and further provides providing data recorded in association with such temperature sensing and liquid level sensing to one or more interested users. Attached Figure Description

[0030] Exemplary combinations, systems, and methods will be described below with reference to the accompanying drawings, which are given by way of non-limiting example only, wherein:

[0031] Figure 1 This is a schematic block diagram illustrating a heater according to an embodiment;

[0032] Figure 2 This is a schematic block diagram illustrating a heater according to an embodiment;

[0033] Figure 3 This is an exemplary example of an embodiment having a conductor layer with contact points at the upper right and lower left of the heating system;

[0034] Figure 4 This is an exemplary example of a heating system with conductive and resistive layers;

[0035] Figure 5 This is an exemplary example of an embodiment having an enlarged conductive layer associated with a contact pad on the top of the device;

[0036] Figure 6 An exemplary example of a heating system enclosed in an encapsulation layer is shown;

[0037] Figure 7 An exemplary example is shown in which the heating system is laminated onto the fabric;

[0038] Figure 8 This is a flowchart illustrating an exemplary method of providing, for example, a conformal heater for wearable devices;

[0039] Figure 9 This is a flowchart illustrating a method for using a conformal heater system within a wearable device;

[0040] Figure 10 This is a schematic diagram of an exemplary sensing circuit;

[0041] Figures 11A-11D This is a schematic diagram of an exemplary heating circuit;

[0042] Figure 12 This is a schematic diagram of an exemplary sensing circuit;

[0043] Figures 13A-13BThis is a schematic diagram of an exemplary sensing circuit;

[0044] Figures 14A-14C This is a schematic diagram of an exemplary mobile application for sensor data;

[0045] Figure 15 This is a schematic diagram of an exemplary sensing circuit;

[0046] Figure 16 This is a schematic diagram of an exemplary sensing circuit; and

[0047] Figures 17A-17C This is a schematic diagram of an exemplary sensing circuit. Detailed Implementation

[0048] The accompanying drawings and descriptions provided herein are simplified to illustrate aspects relevant to a clear understanding of the apparatus, systems, and methods described herein, while other aspects that may be found in typical similar devices, systems, and methods have been omitted for clarity. Therefore, those skilled in the art will recognize that other elements and / or operations may be desirable and / or necessary for implementing the devices, systems, and methods described herein. However, because such elements and operations are known in the art and because they are detrimental to a better understanding of this disclosure, a discussion of these elements and operations may not be provided herein for the sake of brevity. Nevertheless, this disclosure is still considered to include all such elements, variations, and modifications to the aspects described that are known to those skilled in the art.

[0049] Throughout this disclosure, embodiments are provided to make the disclosure thorough and fully convey the scope of the disclosed embodiments to those skilled in the art. Numerous specific details, such as examples of particular components, devices, and methods, are set forth to provide a thorough understanding of embodiments of the disclosure. However, it will be apparent to those skilled in the art that certain specific details of the disclosure are not required, and that embodiments may be embodied in different forms. Therefore, the embodiments should not be construed as limiting the scope of the disclosure. As noted above, in some embodiments, well-known processes, well-known apparatus structures, and well-known techniques may not be described in detail.

[0050] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. For example, the singular forms “a,” “an,” and “the” as used herein may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms “comprising,” “including,” “containing,” and “having” are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless expressly indicated as a preferred or required order of execution, the steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown. It should also be understood that additional or alternative steps may be employed in place of or in combination with the disclosed aspects.

[0051] When an element or layer is referred to as being “on,” “above,” “connected to,” or “coupled to” another element or layer, unless otherwise expressly stated, it may be directly on, above, connected to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). Furthermore, as used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0052] Furthermore, although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms, when used herein, do not imply order or sequence. Therefore, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion without departing from the teachings of the embodiments.

[0053] Historically, and as discussed throughout this text, the formation of many small aspects of a device or miniature device has often been integrated with deposition and etching processes. That is, traces such as conductive traces, dielectric traces, and insulating traces that form device features such as waveguides, vias, and connectors are typically formed by subtractive processes, i.e., by preparing layers, which are later etched to remove portions of those layers to form the desired topology and features of the device.

[0054] An additive printing process has been developed to additionally form device features and aspects, i.e., to form device features and aspects by “printing” desired features at desired locations and in desired shapes. This allows many devices and device elements previously formed using subtractive processes to be formed through additive processes, including but not limited to printed transistors, carbon resistance heating elements, piezoelectric elements and audio elements, photodetectors and transmitters, and devices for medical applications such as glucose strips and ECG strips.

[0055] In short, the printing process of such a device depends on many factors, including matching the deposited material (such as ink) to the substrate used for a specific application. This ability to use multiple substrates can provide printing equipment with unique properties previously unknown in etching equipment, such as the ability to stretch and bend the device, and can be used in previously unknown or harsh environments, such as as a conformal heater in wearable devices that need to be cleaned. As a non-limiting example, the ability to print electronic traces on plasticized substrates allows those substrates to be conformalized after printing has occurred.

[0056] However, the known additional properties do indeed limit the properties achievable using the subtractive process previously. For example, conductive traces formed using the additional process typically have more limited conductivity than those formed using the subtractive process previously. This is partly because pure copper traces provided by the subtractive process cannot currently be printed using modern additional processes. Therefore, some devices and components, such as heaters, can be substantially modified to accommodate the modified properties achievable using printed traces in the additional process compared to conventional electronics forming techniques.

[0057] In the embodiments, a multitude of factors must be balanced in each unique application to best approximate properties that were previously only obtainable in subtractive processes. For example, in the disclosed apparatus and methods of preparing such apparatus, compatibility must be evaluated between the printing substrate and its acceptability, the inks used and their conductivity, the fineness of the printed traces used, the spacing, density, and consistency of the printed inks, the type of printing performed (i.e., screen printing versus other types of printing), the thickness of the printed layers, etc. Furthermore, since a variety of inks can be used to prepare the disclosed heating elements, the compatibility of the inks used with each other is also an aspect of the embodiments. For example, for all inks in a given ink group, the chemical reactions between the inks, the different curing methods between the inks, and the deposition modes between the inks must be evaluated. It should also be noted that, based on the discussion herein, those skilled in the art will understand that different inks in an ink group may have different properties even after deposition. For example, some inks may suffer from a valley effect at the center of the ink's deposition trace, while using the ink produces peaks at the outer edge of the trace. Therefore, since the thickness of the traces deposited using this ink can allow for mitigation or enhancement of the aforementioned effects, the application method and consistency of each ink within the ink group are noteworthy in the implementation.

[0058] In known technologies that incorporate heaters, printed circuit boards (PCBs) require mechanical integration, thus necessitating consideration of this mechanical integration into each product. However, the ability to use printed electronics on substrates with flexible bases and non-uniform topologies allows for the integration of printed electronics as part of the product, rather than requiring mechanical integration. Needless to say, this can include using printed electronics on substrates unsuitable for electronics fabricated using subtractive processes, such as fabrics, plastics that do not provide a "sticky" surface, organic substrates, etc. For example, this can occur because additional processes allow for different printing types within each subsequent printed layer of the printing apparatus; therefore, the functionality provided by each layer, such as mechanical, electrical, structural, or other functionalities, can vary between printed layers throughout the deposition process.

[0059] Various solutions balancing the above factors can be provided using additional processes. For example, a flexible substrate can be provided, on which printing is performed, such as on one or both sides of a medical bag. Thus, traces can be created on one or both sides of the bag to form a heater unit, or heaters connected in series or parallel. In this case, one or more through-holes can be formed between the sides of the bag, thereby creating one or more heating systems on opposite sides of the bag, which can pass through or surround the contents of the bag.

[0060] The embodiments provide at least one printed heater on a fluid bag substrate, such as a medical-grade substrate suitable for intravenous fluids, blood bags, or similar applications, or on a flexible substrate for use with wearable devices. The printed heater is formed from one or more layers of functional inks (e.g., conductive, resistive, and insulating inks), which are then traced using additional processes to realize the heater unit. Additional printed electronics, such as sensors, antennas (e.g., RF, NFC, etc.), thermometers, thermocouples, fluid sensors, etc., can also be provided using the same or similar additional processes.

[0061] Therefore, embodiments can provide not only heaters for heating, such as wearable heaters or heaters for fluid within the bag, but also additional sensors integrated with the bag, for example, to allow traceability, network connectivity, and patient care reporting. According to embodiments, this traceability, connectivity, and reporting can be manual or automatic, and can be incidental, periodic, semi-continuous, and / or continuous. These features can, for example, allow for a reduction in human error in patient monitoring and reporting.

[0062] Based on the foregoing, the embodiments provide heating devices that are not bulky, allowing for optimized conditions in confined spaces, such as inside clothing, or in operating rooms or ambulances. Furthermore, the embodiments provide improved patient care by regulating the heating of medical fluids to ensure that the fluid is not overheated or underheated, and that this does not lead to patient discomfort, injury, or death. Additionally, this heater can provide improved user comfort and ease of use.

[0063] Medical bags provide unique impediments to allow for the use of associated additional processes, such as electroprinting. For example, because medical bags typically have an associated texture and are highly tear- and puncture-resistant, the texture is associated with thickness and high flexibility, providing a unique substrate for additional processes. Furthermore, medical bags must be inert in their properties to allow for the maintenance of hygienic conditions associated with patient care. The disclosed embodiments can be used in conjunction with any such fluid bag, or with any other bag or substrate having such impediments on which printing is applied, such as flexible substrates for inclusion in wearable devices. Moreover, the disclosed embodiments can be used with any substrate of any size or shape.

[0064] More specifically, in embodiments, the flexible heater for wearable devices or fluid bags can be printed onto a flexible and conformal organic or inorganic substrate, for example, using a "matching function" ink set. The flexible heater can consist of multiple layers of inks or substances forming the matching function set. For example, such as Figure 1As shown in the heating system 10, a conductive layer 12 can be printed on the substrate 14 to allow current 16 to flow to the heater. A resistive layer 18 can also be printed, or subsequently printed, to allow a heating effect 20 to occur when the resistor is heated due to the flow of current 16. Furthermore, a dielectric layer 22 can be printed to isolate the resistive elements 18a from short-circuiting due to the conformal, flexible nature of the substrate 14, and to provide thermal insulation from the heating elements 18a to prevent localized overheating.

[0065] Of course, dielectric layer 22 may be additionally disposed under or between other layers 12, 18. For example, in a particular exemplary embodiment, a printed heater excluding dielectric layer 106 may be limited to a temperature range of 45 to 50 degrees Celsius during operation; however, the same heater including dielectric layer 22 may operate in a temperature range of 45 to 65 degrees Celsius without concern that excessive heat may be inappropriately dissipated from the heater and exposed to the environment, such as by placing a hand on or near the fluid bag 50.

[0066] The substrate 14 printed thereon on layers 12, 18, and 22 may include organic and inorganic substrates, but is limited to the fact that the substrate may be flexible and / or conformable to a wearable or fluid bag placed in or on the heating system 10. Suitable substrates may include, but are not limited to, PET, PC, TPU, nylon, glass, fabric, PEN, and ceramics.

[0067] As described above, various inks and ink groups can be used to form layers 12, 18, 22 or aspects thereof in the heating system 10, and the inks within the group can be matched with each other to avoid undesirable chemical interactions during deposition, curing, etc., and / or the inks within the group can be matched with the ink to be printed onto the substrate. As a non-limiting example, the conductive and resistive inks used may include silver, carbon, PEDOT:PSS, CNT, or various other printable, conductive, dielectric, and / or resistive materials, which will be apparent to those skilled in the art from the discussion herein.

[0068] In some embodiments, particularly those exposed to the natural environment and / or intended for use in washing or in harsh or sterile operating room conditions, the heating system 10 may preferably be encapsulated to increase durability. In this case, isolation from environmental conditions 30, such as humid conditions (including rain, snow, or moisture), and / or isolation from wash and dry cycles and / or general robustness treatment may be performed. Optionally, an encapsulation 32, such as a laminated bag, may be provided to encapsulate the heating system 10, and in this case, the encapsulation 32 may include connections and / or through-throughs to allow power 40 to be supplied to the heating system 10 through the encapsulation 32. Finally, the heating system 10, including the encapsulation 32, may be integrated into a wearable device or bag 50 via any known method, such as by stitching, lamination, etc.

[0069] Therefore, the encapsulation 32 can provide waterproofing, airtightness, etc., to protect the heating system and related systems from any adverse environmental factors 30. Various known techniques can be employed to provide the encapsulation 32. For example, acrylic resin can be laminated to each side of the heater substrate 14 to create a sealing laminated lip around the substrate 14, wherein only the protrusions extending therefrom have an acrylic resin laminated seal surrounding them. Furthermore, such a laminated bag can be treated with, for example, ultraviolet radiation, so that the laminate is sealed to the heating system 10 and provides maximum protection for the heating system. However, it is worth noting that the more layers attached to the heating system, such as including the encapsulation 32, the less conformable the heating system becomes to wearable devices, especially when the attached layers are of considerable thickness.

[0070] In some embodiments, the package 32, which protects against environmental conditions 30, may require no additional effort beyond the production of the heating system 10. For example, the selected substrate and ink combination may be wettable and conformable, or a single acrylic laminate may be used, for example, to seal only the portion of the substrate with printed electronics to provide the heating system, thus protecting it from environmental conditions.

[0071] As described above, the heating system 10, with or without package 32, is connected to one or more drive circuits 52. In some embodiments, interconnects 54 to, for example, the drive circuits 52 and / or the power supply 40 may include a high contact area to enable the heating system 10 to draw effective current 16 from the power supply 40. Also as described above, interconnects 54 may include or contain printed electronic surfaces. As a non-limiting example, such interconnects 54 may additionally include conventional wiring, micro-connection, and / or electromechanical connection technologies.

[0072] Various interconnects 54 may extend outward from the heating system 10, including interconnects from the driver circuitry 52 to an external control system (if any) and / or to a power supply 56. These interconnects 54, as well as data and power requirements, may depend on the unique configuration of a given heating system 10. For example, different carbon inks applied in the formulation of the heating system 10 may have different power requirements, such as 5-15 volts, or more specifically, as a non-limiting example, 5, 9, or 12 volts.

[0073] Similarly, interconnect 54 may also be or include one or more general-purpose connectors known in the art for connection to, for example, the voltage described above. Furthermore, such general-purpose connectors may be or include other known connector types, such as USB, micro USB, mini USB, Lightning connectors, and other known interconnects. Alternatively, proprietary interconnect 54 may be provided in conjunction with embodiments.

[0074] The aforementioned drive circuit 52 may or may not be directly physically associated with the heating system 10 and the interconnection 54. For example, the drive circuit 52 may be included as a standalone system in the electrical path between the power supply 40 and the heating system 10. The drive circuit 52 may include a connection to a control system 52a or a control system 52b to allow remote and / or wireless control of the heating system 10, and / or to provide limitations on the heating system, such as the amount of heat delivered, the amount of current delivered or the power drawn, differences between different heat delivery levels, etc. As a non-limiting example, such a remote connection may include a wireless connection, such as using NFC, Bluetooth, WiFi, or cellular connectivity, such as linking to an application app 60 on a user's mobile device 62.

[0075] It is worth noting that control systems 52a and 52b, such as Bluetooth-based control systems, can allow for automatic or manual temperature changes, as mentioned herein. Therefore, control systems 52a and 52b can communicate with auxiliary control devices (such as applications on mobile devices or medical monitoring systems) via, for example, Bluetooth, radio frequency (RF), or near field communication (NFC).

[0076] The aforementioned changes may only occur for a period of time, which could be brief, especially if the control system indicates that a large amount of power will be consumed at the desired settings. For example, it may be manually or automatically selected that the user has preset the heater to heat to 85 degrees for 90 seconds, for instance, only when the user is briefly walking the dog outside in 10-degree weather, as it is understandable that the user can fully recharge the system immediately after short-term use. However, if the user is jogging for an hour in the same 10-degree weather, the user might prefer the heater to operate at 45 degrees for 50 minutes before fully depleting its power.

[0077] If local public power is unavailable, the power source 40, which supplies power to the heating system 10 via the driver circuit 52, may be battery-powered, as described above. In this case, the power source may preferably provide, for example, a battery life of 2-10 hours, or more specifically, 4-8 hours. For example, this power may be provided from a permanent power delivery system embedded in clothing, a bag, or an intravenous infusion stand. As a non-limiting example, it may be provided via a rechargeable, removable, replaceable, or permanent battery, or via an auxiliary power source adapted to be inserted into the driver circuit system, such as a power source embedded or associated with a utility-supplied power source, medical device, mobile device, or other mobile power source via proprietary or non-proprietary connectors (such as via micro-USB, Lightning connectors, etc.). As mentioned, typical power supply elements may include batteries, such as rechargeable batteries, such as lithium-ion batteries. Such batteries can typically provide a high level of heating very quickly and then allow for a rapid decrease in heat delivery to avoid unnecessary power consumption during the rise or fall phases of power supply.

[0078] Atypical power sources can be additionally used to power the heating system 10 40. For example, power sources such as those based on motion-stored electricity and / or other similar magnetic and / or piezoelectric power systems can be embedded in or connected to the wearable device to provide primary, secondary, permanent, or temporary power to the heating system 10 via the driver circuitry 52. ​​Similarly, primary, secondary, and / or typical power sources 40 can work together and be combined with the aforementioned system controls, such as those embedded in or communicatively associated with the driver circuitry 52, to deliver power only upon specific triggering. For example, a wearable device equipped with heaters at multiple locations, such as the elbows and upper back areas of a sweatshirt, can allow individual locations among those locations to be activated only upon certain events indicated by a board, such as a printed electronic sensor 70, which can be additionally associated with the substrate 14. For example, a kinetic sensor can sense movement and can activate the heater at a given location, such as the upper back area in the previous example, during a phase of movement. However, when the kinetic sensor senses that the movement has stopped, the heating element at the elbow of the sweatshirt can be activated. This can be accomplished for any of the various reasons understood by those skilled in the art, such as a pitcher stopping pitching between innings but wanting to keep his or her elbow “warm” to avoid injury.

[0079] This variation in heating elements can occur not only in wearable devices with multiple heaters, but also similarly in variable heater designs for different purposes. For example, smaller heaters consume significantly less power than larger heaters and therefore require a lower level of power. Thus, in the previous example of the pitcher's jersey, the small heater located only near the "Tommy John" ligament in the pitcher's elbow might require very little power to activate, but still could have a significant impact on the wearer's health, such as keeping the injured ligament warm after inactivity for more than 10 minutes.

[0080] Furthermore, variability in heat levels, such as that indicated by the driver circuitry, can be made manually by the user or automatically based on system characteristics. For example, if the temperature is low, only a specific temperature difference from the ambient conditions is needed to make the user feel "warm." For instance, a hand-warming system embedded in a sweatshirt pocket or a user's gloves requires only a lower temperature. That is, if the user's gloves are heated to 40 degrees Fahrenheit instead of continuously heating to the maximum level of 65 degrees Fahrenheit, the user might feel warmer in an environment of 10 degrees Fahrenheit. However, in an ambient temperature of 35 degrees, the user might need the heating element to reach 65 degrees for the user to feel the same level of "warmth."

[0081] Based on the usage of the wearable device and the heater, additional considerations may arise regarding the power delivered to the heater and / or the heat delivered. For example, where the heater may be in substantially direct contact with or very close to the user's skin, the control system associated with the driver circuit 52 discussed herein must limit the power so that the heating is insufficient to burn the user, cause discomfort, or otherwise harm the user. In some exemplary embodiments, this problem can be partially addressed by using self-adjusting ink to provide the heating element.

[0082] For example, a positive temperature coefficient (PTC) heater can provide a self-regulating heater. When current flows through the heater, a self-regulating heater stabilizes at a specific temperature. That is, as the temperature increases, the resistance of the self-regulating heater also increases, which causes the current to decrease, and therefore the heater cannot continue to rise in temperature. Conversely, if the temperature decreases, the resistance decreases, allowing more current to flow through the device. In a typical embodiment, the self-regulating / PTC heater thus provides a stable temperature that is independent of the voltage applied to the heater.

[0083] The secondary system can be integrated with the heating system 10 to maintain warmth, such as... Figure 2As shown. For example, in an embodiment of a sweatshirt with transverse cross pockets 204, individual pockets on the sweatshirt may have a lining 202 on their inner portion and may have a heating element disposed inside the pocket lining in order to retain the heat generated by the heating system 10 within the pocket 204 of the sweatshirt to the greatest extent possible.

[0084] As mentioned above, conformability of the heating system and / or other associated systems is advantageous, especially for certain types of wearable devices or fluid bags. This conformability can be applied by forces exerted by the user or based on activity, conforming to the physical contours of the wearable device / bag itself, or similar situations. Additional considerations may arise due to the conformability of the heating system and / or its associated systems. For example, the level of heat transferred may vary based on the physical construction of the heating element; that is, when the heating system is bent or partially folded, it may transfer more or less heat at certain points than expected. Needless to say, this variation may be due to the use of the protective dielectric layer 22 as described above.

[0085] As discussed throughout, additional sensors, integrated circuits, memories, etc., may also be associated with the heating system 10 discussed, and may be printed on its substrate 14, and / or formed on or within its associated systems, and / or formed on its substrate. It goes without saying that in such embodiments, associated electronics can be decoupled from the heating system and those associated with it, but can still be similarly conformable to wearable devices, the substrate of the heating system, etc. Furthermore, those skilled in the art will understand that such other electronic circuits may be formed, or may not be formed, on the same substrate of the heating system, or on physically adjacent substrates, through a printing process.

[0086] Furthermore, embodiments may include additional layers (not shown) in addition to the layers described above. For example, the heater substrate may be provided in the form of a highly adhesive sheet, wherein the adhesive sheet may or may not be provided with a substrate suitable for receiving printed electronics on one side of the "adhesive sheet". In this case, a compatible adhesive surface may be applied to the reverse side of the adhesive sheet, for example by additional processes such as printing, lamination, deposition, etc.

[0087] It is worth noting that, in order to associate the printed electronic layers with the substrate throughout the disclosure, the ink set can be selected based on process parameters to form the heater and the operating environment in which the bag will be used. For example, not only is the application and curing of each ink important, but also the influence of operating conditions on each ink must be considered, depending on the function imparted to the bag. In short, material compatibility must be maintained, and chemical inertness must exist between additional process elements. As a non-limiting example, the ink solvents used in conjunction with the ink set may need to be inert to the intravenous bag, as well as the hygienic properties of the bag and the operating environment. Furthermore, if necessary, sterilization of the bag using radioactive or ultraviolet methods should not degrade the printed electronic materials in the ink set or the function thereby provided. In addition, the surface energy of the substrate must be matched with the inks, layers, and / or coatings applied to the substrate and in the ink set. Furthermore, the curing temperature of any ink or layer in the ink set must be considered based on the melting or degradation temperature of the bag itself. For example, bags formed from certain polymers cannot withstand the heat levels sufficient to cure certain types of frequently used printed electronic inks.

[0088] To address some of the aforementioned problems and to achieve adequate curing of the ink and additional process layers, different types of curing methods can be used in the embodiments. For example, convection curing using a convection box or conveyor belt can be used to apply sufficient curing energy; similarly, infrared or near-infrared energy can be applied; ultraviolet curing can also be used; and photonic curing can also be employed. Furthermore, heating can be used to provide a sufficient level of curing, for example, by employing high or low temperatures to increase the energy of the printed substrate to withstand more heat or energy than in other cases.

[0089] Figure 3 , 4 Figures 5 and 6 illustrate exemplary implementations of the disclosed embodiments. More specifically, Figure 3 A conductor layer 12 with contact points at the upper right and lower left of the heating system is shown. Further shown are discrete heater elements 18a of the resistive layer 18, such as... Figure 3 As shown in the enlarged image.

[0090] Figure 4 Another exemplary embodiment of the heating system with conductive layer 12 and resistive layer 18 is shown. Figure 5 Another embodiment is shown, wherein compensation is achieved by increasing the size of the conductive layer 12 associated with the contact pads at the top of the device. Figure 4 The current suppression point is 502. It is worth noting that... Figure 3 , 4 Each embodiment of 5 shows a dielectric layer 22 printed on conductive layer 12 and resistive layer 18, wherein contact points extend beyond dielectric layer 22 to allow interconnects 54 discussed herein.

[0091] Figure 6 The enclosed package 32 is shown. Figure 5 An exemplary embodiment of the heating system 10. As mentioned throughout, the package 32 protects the heating system 10 from environmental conditions.

[0092] Figure 7 An exemplary embodiment is shown, in which the heating system 10 has been laminated to the fabric 702. Suitable fabrics may include, as non-limiting examples, nylon, cotton, etc.

[0093] Figure 8 This is a flowchart illustrating an exemplary method 800 for providing a conformal heater. In step 802, ink groups are matched to each other for printing a compatible ink layer within the ink groups and to a received organic or inorganic conformal substrate. In step 804, a conductive layer formed from at least one ink from the ink groups is printed on the substrate.

[0094] In step 806, a resistive layer is printed from the ink assembly, wherein the resistive layer provides at least a plurality of heating elements that are in electronic communication with the conductive layer. In step 808, a dielectric layer is printed from the ink assembly to insulate the conductive layer and the resistive layer.

[0095] In optional step 810, a substrate having at least a conductive layer and a resistive layer printed thereon is at least partially encapsulated. In optional step 812, one or more sensors associated with the operation of the heater may be integrated with and / or printed on the substrate.

[0096] In step 814, the heater is integrated with the wearable device or bag. Integration can be achieved through stitching, lamination, adhesive, or any similar method, including printing on the bag. Furthermore, in step 816, the heater may be associated with one or more driver circuits having a control system communicating therewith, and with one or more power connections to allow power to be supplied to the heating element via a conductive layer. As an example, step 816 may include printing or other methods of interconnecting one or more electrical connections to the heater.

[0097] Figure 9 This is a flowchart illustrating a method 900 using a conformal heater system. In the illustration, in step 902, the conformal heater may be associated with a power source. This association may include a permanent association, such as by permanently embedding a rechargeable battery, or a detachable association, such as where an external power source, such as a battery, mobile device, etc., may be detachably associated with the heater.

[0098] In step 904, the driver circuit supplying power from the power source to the heater can be variably controlled. Optionally, in step 904a, wireless control can be achieved via a wireless connection, such as from a mobile device to the driver circuit. As a non-limiting example, the wireless or wired connection can be controlled using a user interface provided by an "application" on the mobile device. The control thus provided can be automated based on predetermined triggering or operational constraints, manual operation, or a combination thereof. Wireless control can be provided through any known type of wireless interface.

[0099] Optionally, in step 904b, wired control can be achieved via a wired connection from the mobile device to the driver circuitry, such as via a microUSB connection to the heater. As those skilled in the art will understand, in alternative embodiments, power can also be supplied via this connection.

[0100] Figure 10 An exemplary heater base is shown, such as a fluid bag 1002, e.g., a medical fluid bag 1002, for completely containing one or more fluids within a bag between opposing layers 1004, 1006. The fluid contained within the bag may be, for example, blood or a saline solution. Of course, in embodiments, other liquids or gases may be present "within the bag," such as air in wearable device embodiments. Layers 1004, 1006 may be sealed together by any method known in the art to form a liquid (and / or gas) sealed bag.

[0101] In the illustrated embodiment, a layer 1004 of the bag may have an associated printed heater 1008 (as discussed throughout), which is associated with the outward-facing side 1004a of the first layer 1004 of the bag, and the sensing circuit 1010 includes a sensing chip 1012 printed on the outward-facing side 1006a of the opposite layer 1006 of the fluid bag. In the illustrated embodiment, the IC chip 1012 may be a temperature sensor, the sensing circuit 1010 may be a temperature sensing circuit, and the sensing circuit 1010 may include one or more inputs and outputs 1020 that can read data, write data, and / or be associated with a power source and / or at least one network connection, such as via a wired or wireless interface.

[0102] In the illustrated embodiment, either or both of the printed heater 1008 and the sensing circuit 1010 may be printed circuits and may be printed directly onto the fluid pouch 1002, or may be printed onto a separate substrate (not shown) that is then adhered to the fluid pouch 1002, for example, by lamination or epoxy resin. As a non-limiting example, the sensing circuit 1010 associated with the fluid pouch 1002 may be a printed antenna 1024, such as an RFID or NFC antenna, and the printed sensing circuit 1010 may include one or more chipsets 1012, or may include one or more inputs or outputs from or to one or more external chipsets.

[0103] As a non-limiting example, the provided sensor circuit 1010 may be a printed liquid level sensor circuit. Alternatively, as a non-limiting example, the provided sensor circuit 1010 may be one or more printed or laminated temperature sensor circuits. Furthermore, the provided printed sensor circuit 1010 may be a combined temperature sensor and liquid level sensing circuit, which may or may not be associated with one or more other sensing circuits for sensing additional characteristics of the fluid within the bag 1002.

[0104] The sensing circuit 1010 may be communicatively associated with one or more external "applications" or applications, for example, via one or more networks and network connections (e.g., using antenna 1024), which may provide a human-machine interface to acquire data sensed by the printed sensing circuit 1010. As a non-limiting example, the "application" or application may be provided on one or more mobile devices, desktop or laptop computers, dedicated medical monitoring consoles, etc. Data may be provided from the sensing circuit to one or more applications via wired or wireless means, for example using the printed RF or NFC antenna 1024 described above.

[0105] Figure 11A , 11B Figures 11C and 11D illustrate several alternative printed heater data circuit designs 1008a, 1008b, 1008c, and 1008d for physical association with a sheet 1006 of the fluid bag 1002. More specifically, Figure 11A and 11B Circuit designs 1008a and 1008b for fixed resistance heaters are shown, while Figure 11C and 11DExemplary circuit designs 1008c and 1008d for a so-called "railway pattern" heater are shown, providing uniform heating and self-limiting temperature. As discussed throughout, the printed heater 1008 can be directly associated with a printed layer on the bag, such as a substrate resistive layer, or it can be printed onto a substrate associated with the bag after the heater is printed. In both cases, various inks well known to those skilled in the art can be used to print the heater 1008 and / or the sensor circuit 1010, such as, as a non-limiting example, Henkel PTC120°C carbon for the resistive layer, EMS CL-1036 silver for the conductive layer, and Henkel PF455B green for the dielectric layer. Furthermore, as will be understood, the printing process performed in the embodiments may necessarily include drying, pre-shrinking, and / or curing steps, such as UV curing steps, as will be apparent to those skilled in the art based on the discussion herein.

[0106] Figure 12 This is an exemplary illustration of the sensor (and data recording / transmission circuitry 1010, which can be printed on the sheet 1006 of the bag opposite the heating sheet 1004). Figure 12 In the illustration, thermocouple circuit 1202 can be directly printed on bag 1002 and / or otherwise bonded to bag 1002, for example using conductive epoxy resin, to partially provide temperature sensing circuit 1010. More specifically, carbon strips 1202a, 1202b, ... can be screen-printed on the bag and conductively bonded to leads extending outside the bag, allowing reading of the temperature of the fluid inside bag 1002. It is worth noting that for Figure 12 The embodiments shown and other sensing embodiments discussed herein, each external data "reading" system can be associated with a single medical bag or multiple fluid bags, wherein multiple fluid bags can be read, and based on the data received from there by a single "master" reading device, the sensing output data can then be provided to the human-machine interface applications discussed throughout.

[0107] In one alternative embodiment, Figure 13A and 13B The printed circuit layout for sensor circuits 1010e and 1010f associated with fluid bag 1002 is shown. In each illustration, silver ink may be used for, for example, two different conductive layers, and the design of sensor circuits 1010e and 1010f as shown may include two different dielectric layers, which may include two different printing inks. Two alternative antennas 1024a and 1024b are also included in the illustration, allowing the illustrated sensing circuits 1010e and 1010f to communicate with the outside of the bag.

[0108] It is worth noting that, as discussed throughout, and as... Figure 13A and13B As specifically shown, sensor circuits 1010e and 1010f can be printed layer by layer onto the bag 1002. Therefore, the sensor circuit 1010 of the embodiment includes an ink group with specific characteristics related to the bag 1002 or the printing substrate, and related to other inks within the ink group.

[0109] As a non-limiting example, these characteristics may include at least the ability of any ink layer that must be associated with the bag, the ink layer being composed of inks suitable for gripping the material constituting the bag. Alternatively, the base layer / substrate of the sensing circuitry may be adapted to be associated with an epoxy resin that will also be permanently adhered to the outer surface of the bag sheet. Furthermore, each successive ink layer must be adhered in a suitable manner to the ink layer below, and, if necessary, to an ink layer disposed on top of the successive layers.

[0110] Furthermore, environmental factors must not adversely affect the performance of the individual layers of the ink assembly. For example, bag "sweating," i.e., condensation, must not adversely affect any inks that will be printed or adhered to the bag in direct physical contact. Additionally, external factors must not affect the electrical interactions between layers to cause any undesirable electrical interference or interactions. Of course, one or more protective layers can be printed on or under any layer of the circuitry or circuitry; however, in the same manner as described above, such protective layers must be consistent with each layer of the ink assembly placed below and above, and must not cause undesirable interactions or circuit attenuation. In certain embodiments, the ink assembly may include any type of dielectric ink, such as those discussed herein, and conductive ink layers, such as the copper and silver inks discussed herein.

[0111] exist Figures 13A-13B In the illustrations, the print width can be carefully monitored and controlled, as will be apparent to those skilled in the art from the discussion herein. For example, the width of conductive, i.e., silver traces can be varied according to Table 1, provided below:

[0112] Table 1

[0113]

[0114] Figure 14A , 14B 14C illustrates, by way of non-limiting example, human-computer interface applications / applications as discussed herein 1402. Figures 14A-14CIn the application described herein, the application is associated with a mobile device 1404, such as a smartphone. As shown, the sensing circuit in the illustrated embodiment is a temperature sensing circuit, and the user has multiple options to start, stop, clear, or reset the temperature sensing associated with one or more fluid bags. The user can also use other options, such as changes in temperature measurements, measurement history over a given time period, such as a searchable time period, etc. Furthermore, and as... Figure 14B and 14C As specifically shown, temperature data may be provided in digital format or graphically, by way of non-limiting example, and may be provided on one or more predetermined or selected time frames.

[0115] As those skilled in the art will understand, this is not to associate a particular filter with the printed sensing circuitry or firmware discussed herein, but rather as... Figures 14A-14C The adjustment algorithm shown is included in an application, or similar external, remote, and / or human-machine interface application. For example, as a non-limiting example, the adjustment algorithm may take into account the thickness or composition of a particular brand of fluid bag, a particular heating circuit that may be associated with the fluid bag, etc.

[0116] As discussed from beginning to end, and as... Figure 15 and 16 As shown, one or more additional protective layers 1502 may be provided above the sensing circuit 1010. This outermost protective layer may be similar to those discussed above regarding the protection of heating circuitry printed on another sheet of the bag. As a non-limiting example, this protective layer 1502 may be formed of a dielectric, thereby preventing oxidation of the conductive layer 1504 of the sensing circuit, protecting the circuitry, traces, and electrical connections from physical damage, and enhancing the appropriate conductivity of the traces, particularly at the edges of the encapsulation area.

[0117] More specifically, specific and / or broader protective printed layers may be associated with particularly delicate portions of the printed sensing circuitry, and / or with particularly complex applications of circuitry 1010. As an example, due to the change in the curvature of an intravenous (IV) bag as it is filled relative to the curvature of an empty bag, a more rigid auxiliary underlayer or cover layer 1702 may be provided in association with the printed antenna 1024 of the sensing circuitry 1010. This keeps the antenna 1024 as flat as possible, thereby maximizing the communication integrity and readout range of the printed sensing circuitry 1010. Figure 17A , 17B Such embodiments are shown by way of non-limiting example in 17C.

[0118] In addition to the temperature sensing circuit discussed throughout the text, a liquid level sensing circuit has also been mentioned. This circuit can monitor the liquid level inside the bag and thus allow for automatic indication of when the bag needs to be replaced, etc. Although not specifically shown here, this sensing can have access to it through human-machine interface applications also discussed throughout the text.

[0119] As an example, the liquid level sensing circuit may include a self-capacitance sensing circuit, such as multiple silver traces for measuring the bag capacitance at various locations on the bag. Additionally and optionally, in addition to the capacitance strip, capacitance buttons may be positioned along specific areas of the fluid bag's layers. Each button can function as a capacitance detector to indicate whether the fluid has reached that level. Of course, other methods of printing liquid level sensing circuits, such as capacitive liquid level sensors, will be apparent to those skilled in the art based on the discussion herein and may be limited to the ink group discussed herein.

[0120] As a non-limiting example, the sensing circuit 1010 may include one or more conductive inks, such as EMS CL-1036 silver ink, and one or more dielectric layer inks, such as EMS DL-7540 blue ink. The conductive adhesive used for certain layers may consist of any conductive adhesive known to those skilled in the art for incorporation into embodiments of the invention, such as Henkel QML516LE, Henkel 2030 SC, and Henkel SL-5421. The encapsulation layer may be made of any known primary material, such as laminated VE 529610.

[0121] Furthermore, the description provided in this disclosure is intended to enable any person skilled in the art to make or use the disclosed embodiments. Various modifications to the invention will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the invention. Therefore, this disclosure is not intended to limit itself to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A flexible heater suitable for embedding in a wearable device, comprising: Conformal substrate; A matching deposition material group includes matching additionally printed matching functional inks, wherein when the conformal substrate does not possess properties achievable using a subtractive process, the inks are selected to achieve specific fineness, spacing, density, and uniformity, and each ink is matched to each other and to the conformal substrate with at least several of the following to provide properties achievable using a subtractive process: The conformal substrate's acceptance of each ink, wherein the matching functional ink is printed onto the conformal substrate; The electrical conductivity between the conformal substrate and each ink; as well as The chemical reactivity between the conformal substrate and each ink, and the different printing and curing methods between each ink; Each ink is printed in successive additional printing layers onto at least one flat surface of the substrate to form at least: At least one conductive layer is capable of receiving current from at least one power source; At least one resistive layer, associated with the at least one conductive layer and including a plurality of heating elements capable of generating heat when receiving the current; as well as At least one dielectric layer is capable of at least partially insulating the at least one resistive layer.

2. The flexible heater as described in claim 1, wherein, The substrate includes an inorganic substrate.

3. The flexible heater as described in claim 1, wherein, The substrate includes one selected from the group consisting of PET, PC, TPU, nylon, glass, fabric, PEN and ceramic.

4. The flexible heater as claimed in claim 1, wherein, Each of these includes one selected from the group consisting of silver, carbon, PEDOT:PSS, and CNT inks.

5. The flexible heater as described in claim 1, wherein, At least one of the inks is resistant to environmental factors including at least moisture.

6. The flexible heater of claim 1, further comprising an encapsulation that at least partially seals the conformal substrate having at least each of the inks thereon, thereby protecting it from environmental factors.

7. The flexible heater of claim 6, wherein the encapsulation comprises a laminated bag.

8. The flexible heater as claimed in claim 1, further comprising: Integration of the wearable device with the conformal substrate having each of the inks thereon.

9. The flexible heater as claimed in claim 8, wherein, The integration includes one selected from the group consisting of stitching, lamination, and adhesive.

10. The flexible heater of claim 1, further comprising: A driver circuit is connected and associated with the at least one conductive layer.

11. The flexible heater of claim 10, wherein, The driver circuit includes a control system, and the heat transferred by the heating element is controlled by the control system.

12. The flexible heater of claim 11, wherein, The control system includes a wireless receiver.

13. The flexible heater of claim 12, wherein, The wireless receiver includes at least one of Bluetooth, WiFi, NFC, cellular, and RF receivers.

14. The flexible heater of claim 12, wherein, The remote portion of the control system includes a mobile device application.

15. The flexible heater of claim 1, further comprising: At least one power source is connected and associated with the driver circuitry; The driver circuit is capable of variably controlling the supply of power from the at least one power source to the at least one conductive layer.

16. The flexible heater of claim 15, wherein, The power source includes a rechargeable battery.

17. The flexible heater as claimed in claim 1, wherein, The dielectric layer insulates the heating elements among the plurality of heating elements from short-circuiting each other due to the conformal nature of the conformal substrate.

18. The flexible heater as claimed in claim 1, wherein, The dielectric layer provides thermal insulation from the heating element to prevent localized overheating.

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