A printed circuit board production data processing method and apparatus

Abstract

The application discloses a printed circuit board production data processing method and device, comprising: obtaining analysis data and user layout instruction of the printed circuit board to be processed, determining the number of layers of the printed circuit board based on the analysis data of the printed circuit board to be processed, processing the related data of the character layer and the drilling layer, extracting the graphic coordinate data of the printed circuit board to be processed, calculating the graphic boundary, combining the user layout instruction to create a layout model, adding the corresponding process edge according to the pre-set requirement, adding the necessary drilling and characters, updating the drilling layer and the character layer, determining the process method according to the number of layers of the printed circuit board, obtaining the final layout model and the corresponding process method. Through the above method, the final layout model and the corresponding process method can be obtained, the production requirement of the subsequent printed circuit board can be met, and compared with manual layout processing of the printed circuit board, the efficiency can be improved to a certain extent, and the error caused by manual operation can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic manufacturing, in particular to a printed circuit board production data processing method and device. BACKGROUND

[0002] With the continuous progress of science and technology, various electronic products begin to affect people's daily life, and each electronic product needs a printed circuit board to provide electrical connection for its electronic components, which makes the production demand of printed circuit board rise sharply. At present, after the engineers complete the design of the printed circuit board, they need to manually create relevant production materials, such as layout, and add layer information, positioning holes, target plates, etc. Manual production not only has low work efficiency, but also is prone to errors. Combined with the current sharp increase in the production of printed circuit boards, these problems will lead to the reduction of the production efficiency and quality of printed circuit boards. Therefore, a printed circuit board production data processing method is urgently needed. SUMMARY

[0003] Therefore, the present application provides a printed circuit board production data processing method and device to improve the production efficiency of printed circuit boards to some extent.

[0004] In order to achieve the above purpose, the present scheme is as follows:

[0005] A printed circuit board production data processing method comprises the following steps:

[0006] Obtaining analysis data and user layout instructions of a printed circuit board to be processed;

[0007] Determining a character layer, a solder resist layer and an inner layer based on the analysis data of the printed circuit board to be processed;

[0008] Obtaining a new character layer by comparing the character layer and the corresponding solder resist layer;

[0009] Determining the drilling type, position and corresponding tool number of each drill hole on a drilling layer based on the analysis data of the printed circuit board to be processed;

[0010] Analyzing the inner layer to determine the number of layers;

[0011] Extracting graphic coordinate data and calculating graphic boundaries based on the analysis data of the printed circuit board to be processed;

[0012] Modifying the original point coordinates based on the graphic coordinate data to obtain new original point coordinates;

[0013] Calculating the position of each graphic in the panel according to the user layout instructions, the graphic boundaries and the new original point coordinates, and creating a layout model;

[0014] judging positive and negative attributes of each inner layer of the printed circuit board to be processed;

[0015] determining parameters of plating edges and stripping strips based on the positive and negative attributes of each inner layer;

[0016] from the printed circuit board to be processed, according to the pre-set process edge addition requirements, finding the layers that need to add process edges, and adding the corresponding process edges to determine the layout size;

[0017] According to the analysis data of the printed circuit board to be processed and the user layout instruction, add the attachment plate hole, the machining positioning hole, the plating through hole, the standby positioning hole and the inner layer alignment hole, and the corresponding tool number on the layout model, and add to the drilling layer to obtain a new drilling layer;

[0018] Get system time, unit and drawing number, and mark the system time, unit and drawing number in the pre-selected layer in the layout model, and update the character layer;

[0019] According to the pre-set instruction, add the target plate, silk screen alignment plate, standby positioning system plate and inner layer alignment target plate on the layout model;

[0020] Based on the attachment plate hole, add the attachment plate cutting hole and the attachment plate cutting direction line on the layout model;

[0021] According to the number of layers, determine the process method and the blanking size;

[0022] Based on the parameters of plating edges and stripping strips, calculate the actual plating area of each layer;

[0023] Mark the layout size, the blanking size and the plating area on the board surface, update the character layer, obtain the final layout model, and the corresponding process method.

[0024] Optionally, the new character layer obtained by comparing the character layer and the corresponding solder mask layer comprises:

[0025] By comparing the character layer and the corresponding solder mask layer, the overlapping part of the character layer and the corresponding solder mask layer is removed;

[0026] Use the cleaned character layer to generate a new layer, and delete the content of the character layer in the analysis data of the printed circuit board to be processed;

[0027] Move the content of the new layer to the character layer in the analysis data of the printed circuit board to be processed to obtain a new character layer.

[0028] Optionally, the method for determining the drilling type, position and corresponding tool number of each drilling hole on the drilling layer based on the analysis data of the printed circuit board to be processed comprises:

[0029] judging whether there is a drill hole based on the analysis data of the printed circuit board to be processed;

[0030] If there is, determining the drill hole type, position and corresponding tool number of each drill hole on the drill hole layer;

[0031] If there is not, an error is reported.

[0032] Optionally, the position of each graphic in the panel is calculated according to the user's layout instruction, the graphic boundary and the new origin coordinate, and a layout model is created, including:

[0033] The total size of the panel is calculated according to the user's layout instruction, the graphic boundary and the new origin coordinate;

[0034] The position of each graphic in the panel is calculated according to the user's layout instruction, the new origin coordinate and the total size of the panel, and a layout model is created.

[0035] Optionally, the total size of the panel is calculated according to the user's layout instruction, the graphic boundary and the new origin coordinate, including:

[0036] The corner line coordinate is calculated according to the graphic boundary and the new origin coordinate, and the corresponding corner line is added;

[0037] The graphic boundary is updated based on the corner line to obtain a new graphic boundary;

[0038] The total size of the panel is calculated based on the user's layout instruction and the new graphic boundary.

[0039] Optionally, after determining the drill hole type, position and corresponding tool number of each drill hole on the drill hole layer based on the analysis data of the printed circuit board to be processed, the method further includes:

[0040] By comparing the types and positions of the drill holes, drill holes with the same type and position are screened and one of them is retained.

[0041] Optionally, before marking the layout size, the cutting size and the electroplating area on the panel surface, updating the character layer to obtain the final layout model and the corresponding process method, the method further includes:

[0042] From the analysis data of the printed circuit board to be processed, the D code corresponding to the smallest line and the layer where the smallest line is located are screened;

[0043] The layout size, the cutting size and the electroplating area are marked on the panel surface, the character layer is updated to obtain the final layout model and the corresponding process method, including:

[0044] The plate size, the cutting size and the plating area are marked on the plate surface, and the character layer is updated to obtain a final plate layout model, a corresponding process method, a D code corresponding to the minimum line and a layer where the minimum line is located.

[0045] Optionally, after adding the attached board hole, the machining positioning hole, the plating threading hole, the standby positioning hole and the inner layer alignment hole, and the corresponding tool number to the plate layout model according to the analysis data of the printed circuit board to be processed and the user plate layout instruction, and adding them to the drilling layer to obtain a new drilling layer, the method further comprises:

[0046] judging a hole diameter size corresponding to each drilling hole in the new drilling layer;

[0047] if the hole diameter size is less than 0, an error is reported, and the program is exited;

[0048] if the last digit of the hole diameter size is less than 0.0025, the last digit of the hole diameter size is removed;

[0049] if the last digit of the hole diameter size is greater than 0.0075, the last digit of the hole diameter size is carried over;

[0050] otherwise, the last digit of the hole diameter size is modified to 0.05.

[0051] Optionally, the method further comprises:

[0052] performing compliance detection on the printed circuit board to be processed according to a preset limited condition in combination with the analysis data of the printed circuit board to be processed, and generating a compliance detection report;

[0053] the plate size, the cutting size and the plating area are marked on the plate surface, and the character layer is updated to obtain a final plate layout model, a corresponding process method, comprising:

[0054] the plate size, the cutting size and the plating area are marked on the plate surface, and the character layer is updated to obtain a final plate layout model, a corresponding process method and a compliance detection report.

[0055] A printed circuit board production data processing device comprises:

[0056] an information acquisition module configured to acquire analysis data of a printed circuit board to be processed and a user plate layout instruction;

[0057] a layer determination module configured to determine a character layer, a solder mask layer and an inner layer based on the analysis data of the printed circuit board to be processed;

[0058] a first character layer updating module configured to obtain a new character layer by comparing the character layer and the corresponding solder mask layer;

[0059] a drill hole determination module configured to determine, based on the analysis data of the printed circuit board to be processed, a drill hole type, a drill hole position, and a corresponding tool number of each drill hole on a drill hole layer;

[0060] a layer number determination module configured to analyze the inner layers and determine a layer number;

[0061] a graphic boundary calculation module configured to extract graphic coordinate data and calculate a graphic boundary based on the analysis data of the printed circuit board to be processed;

[0062] an origin coordinate updating module configured to modify an origin coordinate based on the graphic coordinate data and obtain a new origin coordinate;

[0063] a layout model creation module configured to calculate a position of each graphic in a panel and create a layout model according to the user layout instruction, the graphic boundary, and the new origin coordinate;

[0064] an inner layer attribute determination module configured to determine a positive or negative attribute of each inner layer of the printed circuit board to be processed;

[0065] a parameter addition module configured to determine parameters of a plating edge and a glue removal strip based on the positive or negative attribute of each inner layer;

[0066] a layout size determination module configured to add a process edge to a layer requiring the process edge according to a pre-set process edge addition requirement and determine a layout size;

[0067] a drill hole addition module configured to add, according to the analysis data of the printed circuit board to be processed and the user layout instruction, an attachment plate hole, a machining positioning hole, a plating threading hole, a backup positioning hole, and an inner layer alignment hole, and a corresponding tool number to the layout model and add them to the drill hole layer to obtain a new drill hole layer;

[0068] a second character layer updating module configured to obtain a system time, a unit, and a drawing number, and mark the system time, the unit, and the drawing number on a pre-selected layer in the layout model and update a character layer;

[0069] a pad addition module configured to add, according to a pre-set instruction, a target pad, a silk screen alignment pad, a backup positioning system pad, and an inner layer alignment target pad to the layout model;

[0070] an attachment plate processing module configured to add, based on the attachment plate hole, an attachment plate cutting hole and an attachment plate cutting direction line to the layout model;

[0071] a process method and blanking size determination module configured to determine a process method and a blanking size according to the layer number;

[0072] A plating area calculation module is configured to calculate actual plating areas of each layer based on parameters of plating edges and stripping strips;

[0073] A final layout determination module is configured to mark the layout size, the cutting size and the plating area on a board surface, update the character layer, obtain a final layout model and a corresponding process method.

[0074] As can be seen from the above technical solution, the printed circuit board production data processing method provided by the embodiment of the present application comprises the following steps: obtaining analysis data of a printed circuit board to be processed and a user layout instruction; determining a character layer, a solder mask layer and an inner layer based on the analysis data of the printed circuit board to be processed; obtaining a new character layer by comparing the character layer and the corresponding solder mask layer; determining a drilling type, a position and a corresponding tool number of each drill hole on a drilling layer based on the analysis data of the printed circuit board to be processed; analyzing the inner layer to determine a layer number; extracting graphic coordinate data and calculating a graphic boundary based on the analysis data of the printed circuit board to be processed; modifying an original point coordinate based on the graphic coordinate data to obtain a new original point coordinate; calculating a position of each graphic in a panel and creating a layout model according to the user layout instruction, the graphic boundary and the new original point coordinate; judging positive and negative properties of each inner layer of the printed circuit board to be processed; determining parameters of plating edges and stripping strips based on the positive and negative properties of each inner layer; adding a process edge to a layer requiring the process edge according to a pre-set process edge addition requirement, adding a corresponding process edge to determine a layout size; adding an attachment plate hole, a machining positioning hole, a plating threading hole, a standby positioning hole and an inner layer alignment hole and a corresponding tool number to the drilling layer based on the analysis data of the printed circuit board to be processed and the user layout instruction to obtain a new drilling layer; obtaining a system time, a unit and a drawing number, marking the system time, the unit and the drawing number on a pre-selected layer in the layout model and updating the character layer; adding a target plate, a silk screen alignment plate, a standby positioning system plate and an inner layer alignment target plate on the layout model according to a pre-set instruction; adding an attachment plate cutting hole and an attachment plate cutting direction line on the layout model based on the attachment plate hole; determining a process method and a cutting size according to the layer number; calculating actual plating areas of each layer based on the parameters of the plating edges and the stripping strips; marking the layout size, the cutting size and the plating area on the board surface and updating the character layer to obtain a final layout model and a corresponding process method. Through the above method, the final layout model and the corresponding process method can be obtained, the production demand of the printed circuit board can be met, the efficiency can be improved to a certain extent and the error caused by manual work can be reduced compared to manual layout processing of the printed circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0075] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art without creative effort based on the provided drawings are within the scope of the present application.

[0076] Figure 1 A flow chart of a printed circuit board production data processing method provided by an embodiment of the present application;

[0077] Figure 2 A user imposition instruction input box schematic diagram provided by an embodiment of the present application;

[0078] Figure 3 A bottom surface character overlapping removal schematic diagram provided by an embodiment of the present application;

[0079] Figure 4 A hole type schematic diagram provided by an embodiment of the present application;

[0080] Figure 5 An information identification schematic diagram provided by an embodiment of the present application;

[0081] Figure 6 An attachment plate and its cutout hole schematic diagram provided by an embodiment of the present application;

[0082] Figure 7 Another information identification schematic diagram provided by an embodiment of the present application;

[0083] Figure 8 An imposition layout diagram provided by an embodiment of the present application;

[0084] Figure 9 A printed circuit board production data processing device structure schematic diagram provided by an embodiment of the present application. DETAILED DESCRIPTION

[0085] The technical solutions in the embodiments of the present application will be described clearly and completely below with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of the present application.

[0086] Figure 1 A flow chart of a printed circuit board production data processing method provided by an embodiment of the present application, which can include the following steps:

[0087] Step S100, obtaining analysis data of a printed circuit board to be processed and user layout instruction.

[0088] Specifically, the analysis data of the printed circuit board to be processed can be obtained by CAM350 software, and the attributes of the corresponding layers can be defined in CAM350 according to the specific data of each layer. For example, the top layer is defined as top, the bottom layer is defined as bottom, the top solder resist layer is defined as mask top, the bottom solder resist layer is defined as mask bottom, the top character layer is defined as silk top, the bottom character layer is defined as silk bottom, the machining layer is defined as Temporary, and the drilling layer is defined as NCPrimary. The user layout instruction can include user input unit, drawing number, X direction layout number, Y direction layout number, layout spacing, board thickness, punching hole, attached plate, aperture enlargement value option, process operator name, minimum line width D code size, minimum line width layer, etc. According to actual use requirements, the variables can be defined and initialized in advance. The user layout instruction can be obtained in the form of a pop-up dialog box, and the required content is listed in the dialog box for the user to fill in or select, as shown in Figure 2 Figure 2 A user layout instruction input box provided by an embodiment of the present application.

[0089] Step S101, determining the character layer, solder resist layer and inner layer based on the analysis data of the printed circuit board to be processed.

[0090] Specifically, in the analysis data of the printed circuit board to be processed, the data of each layer of the printed circuit board to be processed can be obtained, including the character layer, the solder resist layer and the inner layer.

[0091] Step S102, obtaining a new character layer by comparing the character layer and the corresponding solder resist layer.

[0092] Specifically, the character layer and the solder resist layer can be obtained through the above steps. For the character layer and the corresponding solder resist layer, a fixed layer order can be used for arrangement, for example, the bottom surface character layer, the bottom surface solder resist layer, the top surface character layer and the top surface solder resist layer can be arranged in order, the bottom surface character layer and the bottom surface solder resist layer are compared to obtain a new bottom surface character layer, and the top surface character layer and the top surface solder resist layer are compared to obtain a new top surface character layer. When there is only a top surface character layer, the order from top to bottom is changed to top surface character layer, top surface solder resist layer and bottom surface solder resist layer, as shown in Figure 3 Figure 3 A bottom surface character removal diagram provided by an embodiment of the present application.​​

[0093] In step S103, based on the analysis data of the printed circuit board to be processed, the drilling type, position and corresponding tool number of each drill hole on the drilling layer are determined.

[0094] Specifically, the drilling type can be determined by judging the hole diameter type of the drill hole, extracting the pre-set drilling table and hole diameter size, performing formula calculation on the hole diameter size, and assigning the tool number by using the calculation result, so as to finally realize the classification of the hole diameter of each drill hole in the drilling layer, and determine the drilling type, position and corresponding tool number of each drill hole.

[0095] In step S104, the inner layer is analyzed to determine the number of layers.

[0096] Specifically, in this step, the inner layer attribute can be analyzed to determine whether the inner layer is a positive or negative sheet, thereby assigning a value. By analyzing the inner layer, the number of layers of the printed circuit board to be processed can be determined.

[0097] In step S105, based on the analysis data of the printed circuit board to be processed, the graphic coordinate data is extracted, and the graphic boundary is calculated.

[0098] In step S106, based on the graphic coordinate data, the original point coordinate is modified to obtain a new original point coordinate.

[0099] Specifically, in order to facilitate the layout, the original original point coordinate can be modified based on the graphic coordinate data to obtain a new original point coordinate for facilitating the layout processing.

[0100] In step S107, according to the user layout instruction, the graphic boundary and the new original point coordinate, the position of each graphic in the panel is calculated, and a layout model is created.

[0101] Specifically, according to the user layout instruction, the graphic boundary and the new original point coordinate, the X-direction layout number, the Y-direction layout number and the layout spacing parameter required by the user are used for coordinate operation, so as to complete the construction of the layout layout, and finally the data obtained in the above steps create a layout model.

[0102] In step S108, the positive and negative attributes of each inner layer of the printed circuit board to be processed are determined.

[0103] In step S109, based on the positive and negative attributes of each inner layer, the parameters of the electroplating edge and the glue removal strip are determined.

[0104] In step S110, from the printed circuit board to be processed, according to the pre-set process edge addition requirement, the layer requiring the addition of the process edge is found, and the corresponding process edge is added, and the layout size is determined.

[0105] Specifically, according to the pre-set process edge addition requirement, the top layer and the bottom layer can be set as entity filling process edges, and the remaining inner layers are dot matrix pattern process edges. The width of the process edge can be set to 30 mm.

[0106] In step S111, according to the analysis data of the printed circuit board to be processed and the user's layout instruction, the attachment plate hole, the machining positioning hole, the electroplating threading hole, the standby positioning hole and the inner layer alignment hole are added on the layout model, and the corresponding tool number is added to the drilling layer to obtain a new drilling layer.

[0107] Specifically, after adding the attachment plate hole, the machining positioning hole, the electroplating threading hole, the standby positioning hole and the inner layer alignment hole on the layout model, all the drilling holes can be arranged in order from small to large according to the hole diameter size on the left side of the layout, and only one drilling hole with the same size hole diameter is selected. The stepping value between the discs is 4 mm, and the disc diameter variable is set to be 1 mm larger than the hole diameter. At the same time, in order to facilitate inspection, the hole diameter size can be added above each hole as a label. The character used for labeling is established by a new D code table, as shown in Figure 4 Figure 4 A kind of hole schematic diagram provided in the embodiment of the application.

[0108] The positioning hole can be distributed outside the angle line and can be arranged at the upper left, lower left, upper right and lower right of the layout, and the number generally required is 4 to 6 groups, which can be pre-set according to actual requirements. Each group of positioning holes consists of one 2.55 mm diameter exposure positioning hole and two 1.2 mm diameter silk screen positioning holes. The standby positioning hole consists of only one 2.55 mm positioning hole. The attachment hole diameter can be assigned as 2 mm.

[0109] In step S112, the system time, unit and drawing number are obtained, and the system time, unit and drawing number are identified in the pre-selected layer of the layout model, and the character layer is updated.

[0110] Specifically, the system time, unit and drawing number can be identified in the pre-selected layer of the layout model by adding a character command and cooperating with the space coordinates. At the same time, different layers can be changed accordingly.

[0111] The pre-selected layer can be the top layer and the bottom layer, and the character can be determined whether to be mirrored according to different layers. For example, when identifying the bottom layer, all the characters can be mirrored. When identifying the inner layer, the specific attributes of the inner layer need to be further judged. Figure 5 Figure 5 A kind of information identification schematic diagram provided in the embodiment of the application. ​​

[0112] Step S113, according to the preset instruction, adding target plate, silk screen positioning plate, backup positioning system plate and inner layer positioning target plate on the layout model.

[0113] Specifically, by adding target D code at the spatial coordinate position, based on the target D code, adding target plate, silk screen positioning plate, backup positioning system plate and inner layer positioning target plate on the layout model.

[0114] Step S114, based on the attachment plate hole, adding attachment plate cutting hole and attachment plate cutting direction line on the layout model.

[0115] Specifically, the attachment plate cutting hole can be set as 4 groups, the distribution position can be the right middle part of the layout layout diagram, the coordinates of the attachment plate cutting hole can be determined by assignment and calculation, and the hole diameter can be set as 1mm. The cutting direction line diameter can be assigned as 0.2mm, as shown in Figure 6 Figure 6 An attachment plate and its cutting hole schematic diagram provided by the embodiment of the present application.

[0116] Step S115, determining the process method and the blanking size according to the number of layers.

[0117] Specifically, for each layer, combined with the actual processing approach, the optional blanking size can be obtained, for example, there may be more than 6 layers of multi-layer plate due to the limitation of processing mold, and the output blanking size only has two cases of "360mmx310mm" and "460mmx410mm", at this time, only can be selected from them.

[0118] Step S116, calculating the actual electroplating area of each layer based on the parameters of the electroplating edge and the glue removal strip.

[0119] Step S117, marking the layout size, blanking size and electroplating area on the plate surface, and updating the character layer to obtain the final layout model and the corresponding process method.

[0120] Specifically, by marking the layout size, blanking size and electroplating area on the plate surface, the above data can be checked and confirmed, as shown in Figure 7 Figure 7 Another information marking schematic diagram provided by the embodiment of the present application, the electroplating area, the blanking size and the layout size are marked on the layout. In the above layout model, the processing data of each layer such as the final layout layout diagram, the drilling layer and the character layer is contained, so that in subsequent processing, the printed circuit board can be manufactured according to the data, as shown in Figure 8 Figure 8 A layout layout diagram provided by the embodiment of the present application.

[0121] ​​​In the above step, a printed circuit board production data processing method is provided, which can include: obtaining analysis data of a printed circuit board to be processed and user layout instructions; determining a character layer, a solder mask layer and an inner layer based on the analysis data of the printed circuit board to be processed; obtaining a new character layer by comparing the character layer and the corresponding solder mask layer; determining the drilling type, position and corresponding tool number of each drill hole on the drilling layer based on the analysis data of the printed circuit board to be processed; analyzing the inner layer to determine the number of layers; extracting graphic coordinate data based on the analysis data of the printed circuit board to be processed, and calculating the graphic boundary; modifying the origin coordinates based on the graphic coordinate data to obtain new origin coordinates; calculating the position of each graphic in the panel according to the user layout instructions, the graphic boundary and the new origin coordinates, and creating a layout model; judging the positive and negative properties of each inner layer of the printed circuit board to be processed; determining the parameters of the electroplating edge and the glue removal strip based on the positive and negative properties of each inner layer; from the printed circuit board to be processed, according to the pre-set process edge addition requirement, finding the layer that needs to add the process edge, and adding the corresponding process edge to determine the layout size; according to the analysis data of the printed circuit board to be processed and the user layout instructions, adding the attachment plate hole, the machining positioning hole, the electroplating threading hole, the standby positioning hole and the inner layer alignment hole and the corresponding tool number on the layout model, and adding them to the drilling layer to obtain a new drilling layer; obtaining system time, unit and drawing number, and marking the system time, unit and drawing number on the pre-selected layer in the layout model, and updating the character layer; according to the pre-set instructions, adding the target plate, the silk screen alignment plate, the standby positioning system plate and the inner layer alignment target plate on the layout model; based on the attachment plate hole, adding the attachment plate cutting hole and the attachment plate cutting direction line on the layout model; according to the number of layers, determining the process method and the blanking size; based on the parameters of the electroplating edge and the glue removal strip, calculating the actual electroplating area of each layer; marking the layout size, the blanking size and the electroplating area on the board surface, updating the character layer to obtain the final layout model, and the corresponding process method. Through the above method, the final layout model and the corresponding process method can be obtained, which meets the subsequent production requirements of the printed circuit board, and compared with manual layout processing of the printed circuit board, the efficiency can be improved to a certain extent and the error caused by manual operation can be reduced.

[0122] In some embodiments of the present application, the above step S102, the process of obtaining a new character layer by comparing the character layer and the corresponding solder mask layer, can include:

[0123] S10, by comparing the character layer and the corresponding solder mask layer, the overlapping part of the character layer and the corresponding solder mask layer is removed.

[0124] Specifically, first, the character layer and its corresponding solder mask layer are retrieved by using a fixed sequence, and the overlapping part of the character layer and its corresponding solder mask layer is removed in the character layer.

[0125] S11, a new layer is generated by using the cleared character layer, and the content of the character layer in the analysis data of the printed circuit board to be processed is deleted.

[0126] Specifically, through the above steps, the cleared pattern is obtained, a new layer is generated, and the content of the character layer in the analysis data of the printed circuit board to be processed is deleted.

[0127] S12, the content of the new layer is moved to the character layer in the analysis data of the printed circuit board to be processed to obtain a new character layer.

[0128] Specifically, since the printed circuit board can have a single-sided character layer or a double-sided character layer, during the comparison process, the number of character layers to be processed can be first judged. If it exists, after comparing the first group of character layers and the corresponding solder mask layer, the previous comparison logic is continued to compare the second group of character layers and the corresponding solder mask layer. If it exists, the subsequent steps are directly executed.

[0129] Through the above steps, the content of the character layer can be avoided to be printed on the solder mask layer during the manufacturing process of the printed circuit board, thereby affecting the actual use of the printed circuit board.

[0130] In some embodiments of the present application, the above step S103 is introduced, which determines the drilling type, position and corresponding tool number of each drilling on the drilling layer based on the analysis data of the printed circuit board to be processed.

[0131] In this embodiment, it can be judged whether the drilling layer has drilling. The judgment process can include:

[0132] S20, whether the drilling layer exists is judged based on the analysis data of the printed circuit board to be processed.

[0133] Specifically, by searching the drilling layer in the analysis data of the printed circuit board to be processed, it is judged whether the drilling layer exists in the printed circuit board to be processed. If it exists, S21 is executed; if it does not exist, S22 is executed.

[0134] S21, the drilling type, position and corresponding tool number are determined.

[0135] S22, error is reported.

[0136] Specifically, in order to avoid unnecessary errors, the drilling layer can be set as data error if it does not exist, so as to directly exit the program. Therefore, if there is a printed circuit board task without drilling, a new empty layer needs to be manually created and defined as a drilling layer.

[0137] In some embodiments of the present application, the process of calculating the position of each graphic in the panel and creating the layout model according to the user layout instruction, the graphic boundary and the new origin coordinate is introduced. In an optional manner, the process can include:

[0138] S30, calculating the total size of the panel according to the user layout instruction, the graphic boundary and the new origin coordinate.

[0139] S31, calculating the position of each graphic in the panel and creating the layout model according to the user layout instruction, the new origin coordinate and the total size of the panel.

[0140] In an optional manner, the process of S30, calculating the total size of the panel according to the user layout instruction, the graphic boundary and the new origin coordinate, can include:

[0141] S40, calculating the corner line coordinate and adding the corresponding corner line according to the graphic boundary and the new origin coordinate.

[0142] Specifically, the calculated corner line coordinate is associated with the maximum size coordinate of the printed circuit board to be processed, and the corner line can be added to the top surface and designed to be perpendicular to each other. The corner line can be two perpendicular solid lines with a length of 5 mm. The position of the corner line can be the four corners of a rectangle formed by extending the actual printed circuit board outer frame by 2 mm on each side. Adding the corner line can facilitate the identification of the actual effective area of the printed circuit board.

[0143] S41, updating the graphic boundary based on the corner line to obtain a new graphic boundary.

[0144] S42, calculating the total size of the panel based on the user layout instruction and the new graphic boundary.

[0145] Specifically, the user layout instruction includes the user's requirements for layout, so the total size of the panel after layout can be calculated in combination with the new graphic boundary.

[0146] In some embodiments of the present application, after step S103, determining the drilling type, position and corresponding tool number of each drill hole on the drilling layer based on the analysis data of the printed circuit board to be processed, can further include:

[0147] By comparing the types and positions of the drill holes, drill holes with the same type and position are filtered and only one drill hole is retained.

[0148] Specifically, drill holes with the same type and position can be filtered according to the drilling type and position. In order to save manufacturing efficiency and reduce the influence of processing errors, only one drill hole can be retained.

[0149] In some embodiments of the present application, before the step S117 of marking the layout size, the cutting size and the plating area on the board surface and updating the character layer to obtain the final layout model and the corresponding process method, the method can further comprise:

[0150] Screening the D code corresponding to the minimum line and the layer where the minimum line is located from the analysis data of the printed circuit board to be processed.

[0151] Specifically, in this step, all the lines in the analysis data of the printed circuit board to be processed can be screened to obtain the minimum line, so as to obtain the D code corresponding to the minimum line and the layer number of the layer where the minimum line is located.

[0152] At this time, the step S117 of marking the layout size, the cutting size and the plating area on the board surface and updating the character layer to obtain the final layout model and the corresponding process method can comprise:

[0153] Marking the layout size, the cutting size and the plating area on the board surface and updating the character layer to obtain the final layout model and the corresponding process method, the D code corresponding to the minimum line and the layer where the minimum line is located.

[0154] Specifically, in order to facilitate the operation of the technician, the minimum line D code finally output can not be the size of the original minimum line, but the size after adding the process compensation value, wherein the process compensation value can be set according to actual needs.

[0155] In some embodiments of the present application, after the step S111 of adding the attached board hole, the machining positioning hole, the plating threading hole, the standby positioning hole and the inner layer alignment hole and the corresponding tool number on the layout model according to the analysis data of the printed circuit board to be processed and the user layout instruction, and adding them to the drilling layer to obtain a new drilling layer, the method can further comprise:

[0156] S50, judging the hole diameter size corresponding to each drilling hole in the new drilling layer.

[0157] Specifically, the hole diameter size corresponding to each drilling hole can be judged first, if the hole diameter size of the drilling hole is less than 0, S51 is executed; if the last digit of the hole diameter size is less than 0.0025, S52 is executed; if the last digit of the hole diameter size is greater than 0.0075, S53 is executed; otherwise, S54 is executed.

[0158] S51, error reporting and program exit;

[0159] Specifically, when the drilling hole diameter size is less than 0, it can be considered that an error occurs at this time, an error report can be generated, and the program is exited. After the user modifies according to the error report, the processing is performed again.

[0160] S52, discard the last digit of the aperture size.

[0161] S53, carry the last digit of the aperture size.

[0162] S54, modify the last digit of the aperture size to 0.05.

[0163] In some embodiments of the present application, in order to ensure that the electrical parameters meet the national standards, the limit conditions can be set in advance to detect the compliance of the printed circuit board to be processed, and a compliance detection report is generated for user analysis. The specific process can include:

[0164] According to the pre-set limit conditions, the analysis data of the printed circuit board to be processed is combined to detect the compliance of the printed circuit board to be processed, and a compliance detection report is generated.

[0165] Specifically, the compliance detection can include detecting the spacing between the minimum lines of each layer and the lines, detecting the spacing between the minimum lines and the discs, detecting the spacing between the minimum discs and the discs, and detecting whether there are character layers that do not meet the 0.127mm line. By analyzing the final output compliance detection report, problems that may exist in the printed circuit board can be found early, so as to facilitate early processing.

[0166] At this time, step S117, the layout size, the cutting size and the electroplating area are marked on the board surface, and the character layer is updated to obtain the final layout model and the corresponding process method, which can include:

[0167] The layout size, the cutting size and the electroplating area are marked on the board surface, and the character layer is updated to obtain the final layout model, the corresponding process method and the compliance detection report.

[0168] Next, a printed circuit board production data processing device provided by an embodiment of the present application is described. The printed circuit board production data processing device described below can be correspondingly referred to the printed circuit board production data processing method described above.

[0169] Figure 9 A structure example of a printed circuit board production data processing device provided by the present application is shown in the figure. The device can include:

[0170] The information acquisition module 100 is configured to acquire analysis data of a printed circuit board to be processed and user layout instructions.

[0171] The layer determination module 101 is configured to determine a character layer, a solder mask layer, an inner layer and a drilling layer based on the analysis data of the printed circuit board to be processed.

[0172] The first character layer updating module 102 is configured to obtain a new character layer by comparing the character layer with the corresponding solder resist layer.

[0173] The drill hole determination module 103 is configured to determine a drill hole type, a drill hole position, and a corresponding tool number of a drill hole on a drill hole layer based on analysis data of the printed circuit board to be processed.

[0174] The layer number determination module 104 is configured to analyze the inner layers and determine a layer number.

[0175] The graphic boundary calculation module 105 is configured to extract graphic coordinate data and calculate a graphic boundary based on the analysis data of the printed circuit board to be processed.

[0176] The origin coordinate updating module 106 is configured to modify an origin coordinate based on the graphic coordinate data and obtain a new origin coordinate.

[0177] The layout model creation module 107 is configured to calculate a position of each graphic in a panel and create a layout model according to a user layout instruction, the graphic boundary, and the new origin coordinate.

[0178] The inner layer attribute determination module 108 is configured to determine positive and negative attributes of each inner layer of the printed circuit board to be processed.

[0179] The parameter adding module 109 is configured to determine parameters of a plating edge and a glue removal strip based on the positive and negative attributes of each inner layer.

[0180] The layout size determination module 110 is configured to find a layer requiring a process edge to be added from the printed circuit board to be processed according to a pre-set process edge addition requirement, add a corresponding process edge, and determine a layout size.

[0181] The drill hole adding module 111 is configured to add an attachment plate hole, a machining positioning hole, a plating threading hole, a standby positioning hole, and an inner layer alignment hole, and a corresponding tool number to the layout model according to the analysis data of the printed circuit board to be processed and the user layout instruction, and add them to a drill hole layer to obtain a new drill hole layer.

[0182] The second character layer updating module 112 is configured to obtain a system time, a unit, and a drawing number, and mark the system time, the unit, and the drawing number on a pre-selected layer in the layout model, and update a character layer.

[0183] The pad adding module 113 is configured to add a target pad, a silk screen alignment pad, a standby positioning system pad, and an inner layer alignment target pad on the layout model according to a pre-set instruction.

[0184] The attachment plate processing module 114 is configured to add an attachment plate cutting hole and an attachment plate cutting direction line on the layout model based on the attachment plate hole.

[0185] The process method and the blanking size determining module 115 is used to determine the process method and the blanking size according to the number of layers;

[0186] The electroplating area calculating module 116 is used to calculate the actual electroplating area of each layer based on the parameters of the electroplating edge and the glue removal strip;

[0187] The final layout determining module 117 is used to mark the layout size, the blanking size and the electroplating area on the board surface, update the character layer, obtain the final layout model and the corresponding process method.

[0188] In the above embodiment, a printed circuit board production data processing device is provided, which can include: an information acquisition module 100 acquires analysis data of a printed circuit board to be processed and user layout instructions; a layer determination module 101 determines a character layer, a solder mask layer and an inner layer based on the analysis data of the printed circuit board to be processed; a first character layer updating module 102 obtains a new character layer by comparing the character layer and the corresponding solder mask layer; a drilling determination module 103 determines the drilling type, position and corresponding tool number of each drill hole on the drilling layer based on the analysis data of the printed circuit board to be processed; a layer number determination module 104 analyzes the inner layer to determine the layer number; a graphic boundary calculation module 105 extracts graphic coordinate data based on the analysis data of the printed circuit board to be processed, and calculates the graphic boundary; an origin coordinate updating module 106 modifies the origin coordinate based on the graphic coordinate data to obtain a new origin coordinate; a layout model creation module 107 calculates the position of each graphic in the panel according to the user layout instructions, the graphic boundary and the new origin coordinate, and creates a layout model; an inner layer attribute determination module 108 determines the positive and negative attributes of each inner layer of the printed circuit board to be processed; a parameter adding module 109 determines the parameters of the electroplating edge and the glue removal strip based on the positive and negative attributes of each inner layer; a layout size determination module 110 adds the process edge to the layer that needs to add the process edge according to the pre-set process edge addition requirement from the printed circuit board to be processed, adds the corresponding process edge, and determines the layout size; a drilling adding module 111 adds the attachment plate hole, the machining positioning hole, the electroplating threading hole, the standby positioning hole and the inner layer alignment hole, and the corresponding tool number to the drilling layer on the layout model according to the analysis data of the printed circuit board to be processed and the user layout instructions, and obtains a new drilling layer; a second character layer updating module 112 obtains the system time, unit and drawing number, and marks the system time, unit and drawing number on the pre-selected layer in the layout model, and updates the character layer; a pad adding module 113 adds the target pad, the silk screen alignment pad, the standby positioning system pad and the inner layer alignment target pad on the layout model according to the pre-set instructions; an attachment plate processing module 114 adds the attachment plate cutting hole and the attachment plate cutting direction line on the layout model based on the attachment plate hole; a process method and blanking size determination module 115 determines the process method and blanking size according to the layer number; an electroplating area calculation module 116 calculates the actual electroplating area of each layer based on the parameters of the electroplating edge and the glue removal strip; a final layout determination module 117 marks the layout size, the blanking size and the electroplating area on the board surface, updates the character layer, obtains the final layout model, and the corresponding process method. Through the above method, the final layout model and the corresponding process method can be obtained, which meets the production requirements of the subsequent printed circuit board, and compared with manual layout processing of the printed circuit board, the efficiency can be improved to a certain extent, and the error caused by manual work can be reduced.

[0189] Finally, it should be noted that the terms "first", "second", and the like, herein do not denote any order, quantity, combination, or importance, but rather are used to distinguish one element from another, and are not necessarily intended to denote the temporal or chronological sequence of the elements. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0190] The various embodiments in the specification are described in progressive order with reference to the drawings. Each embodiment can be combined with the other embodiments, and the same or similar parts can be referred to each other.

[0191] The above description of disclosed embodiments provides enabling disclosure sufficient for one of ordinary skill in the art to practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for processing printed circuit board production data, characterized in that, include: Acquire analysis data and user panelization instructions for the printed circuit board to be processed; Based on the analysis data of the printed circuit board to be processed, the character layer, solder mask layer, and inner layer are determined; A new character layer is obtained by comparing the character layer with the corresponding solder mask layer; Based on the analysis data of the printed circuit board to be processed, the drilling type, location and corresponding tool number of each hole on the drilling layer are determined. The inner layer is analyzed to determine the number of layers; Based on the analysis data of the printed circuit board to be processed, the graphic coordinate data is extracted and the graphic boundary is calculated; Based on the aforementioned graphic coordinate data, the origin coordinates are modified to obtain new origin coordinates; Based on the user's layout instructions, the graphic boundaries, and the new origin coordinates, calculate the position of each graphic in the panel and create a layout model; Determine the positive and negative properties of each inner layer of the printed circuit board to be processed; Based on the positive and negative properties of each inner layer, the parameters of the electroplated edge and the adhesive strip are determined; From the printed circuit board to be processed, according to the pre-set process edge addition requirements, find the layer that needs to have process edges added, add the corresponding process edges, and determine the panel size; Based on the analysis data of the printed circuit board to be processed and the user's panelization instructions, add attachment board holes, machined positioning holes, electroplated wire holes, spare positioning holes and inner layer alignment holes, as well as corresponding tool numbers, to the panelization model, and add them to the drilling layer to obtain a new drilling layer. Obtain the system time, unit, and drawing number, and assign the system time, unit, and drawing number to a pre-selected layer in the layout model, and update the character layer; According to the preset instructions, target disks, silkscreen alignment disks, spare positioning system disks, and inner alignment target disks are added to the panel model. Based on the holes in the attachment plate, add the cutting holes and cutting direction lines of the attachment plate to the assembly model; Based on the number of layers, determine the process method and blanking dimensions; Based on the parameters of the electroplating edge and the adhesive strip, calculate the actual electroplating area of ​​each layer; The panel size, the blanking size, and the electroplating area are marked on the board surface, and the character layer is updated to obtain the final panel model and the corresponding process method.

2. The method according to claim 1, characterized in that, The process of obtaining a new character layer by comparing the character layer with the corresponding solder mask layer includes: By comparing the character layer and the corresponding solder mask layer, the overlapping portion of the character layer with the corresponding solder mask layer is removed; A new layer is generated using the cleared character layer, and the content of the character layer in the analysis data of the printed circuit board to be processed is deleted. The content of the new layer is moved to the character layer in the analysis data of the printed circuit board to be processed, resulting in a new character layer.

3. The method according to claim 1, characterized in that, The step of determining the drill type, location, and corresponding tool number of each drill hole on the drill layer based on the analysis data of the printed circuit board to be processed includes: Based on the analysis data of the printed circuit board to be processed, determine whether a drill hole exists; If it exists, determine the drilling type, location, and corresponding tool number of each hole on the drilling layer; If it does not exist, an error will be reported.

4. The method according to claim 1, characterized in that, The step of calculating the position of each graphic in the panel and creating a layout model based on the user's layout instructions, the graphic boundaries, and the new origin coordinates includes: Calculate the total size of the panel based on the user's layout instructions, the graphic boundaries, and the new origin coordinates; Based on the user's layout instructions, the new origin coordinates, and the total size of the panel, the position of each graphic in the panel is calculated, and a layout model is created.

5. The method according to claim 4, characterized in that, The step of calculating the total size of the panel based on the user's layout instructions, the graphic boundaries, and the new origin coordinates includes: Based on the graphic boundary and the new origin coordinates, calculate the corner coordinates and add the corresponding corners; Based on the aforementioned angle, update the graphic boundary to obtain a new graphic boundary; The total size of the panel is calculated based on the user's layout instructions and the new graphic boundaries.

6. The method according to any one of claims 1-5, characterized in that, After determining the drill type, location, and corresponding tool number of each drill hole on the drill layer based on the analysis data of the printed circuit board to be processed, the method further includes: By comparing the type and location of each borehole, boreholes with the same type and location are selected, and one of them is retained.

7. The method according to any one of claims 1-5, characterized in that, Before marking the panel size, the blanking size, and the electroplating area on the board surface, and updating the character layer to obtain the final panel model and corresponding process method, the process also includes: From the analysis data of the printed circuit board to be processed, filter out the D code corresponding to the smallest line and the layer in which the smallest line is located; The process of marking the panel size, the blanking size, and the electroplating area on the board surface, and updating the character layer to obtain the final panel model, and the corresponding process method, includes: The process involves marking the panel size, the blanking size, and the electroplating area on the board surface, updating the character layer, and obtaining the final panel model, as well as the corresponding process method, the D-code corresponding to the smallest line, and the layer where the smallest line is located.

8. The method according to any one of claims 1-5, characterized in that, Based on the analysis data of the printed circuit board to be processed and the user's layout instructions, after adding attachment holes, machined positioning holes, electroplated wire holes, spare positioning holes, and inner layer alignment holes, along with corresponding tool numbers, to the layout model and adding them to the drilling layer to obtain a new drilling layer, the process further includes: Determine the diameter of each borehole in the new borehole layer; If the aperture size is less than 0, an error will be reported and the program will exit. If the last digit of the aperture size is less than 0.0025, then discard the last digit of the aperture size. If the last digit of the aperture size is greater than 0.0075, then carry over the last digit of the aperture size. For the rest, change the last digit of the aperture size to 0.

05.

9. The method according to any one of claims 1-5, characterized in that, Also includes: Based on pre-set constraints and combined with the analysis data of the printed circuit board to be processed, a compliance test is performed on the printed circuit board to be processed, and a compliance test report is generated. The process of marking the panel size, the blanking size, and the electroplating area on the board surface, and updating the character layer to obtain the final panel model, and the corresponding process method, includes: The process involves marking the panel size, the blanking size, and the electroplating area on the board surface, updating the character layer, and obtaining the final panel model, along with the corresponding process method and compliance test report.

10. A printed circuit board production data processing device, characterized in that, include: The information acquisition module is used to acquire the analysis data of the printed circuit board to be processed and the user's layout instructions; The layer determination module is used to determine the character layer, solder mask layer, and inner layers based on the analysis data of the printed circuit board to be processed. The first character layer update module is used to obtain a new character layer by comparing the character layer with the corresponding solder mask layer; The drilling determination module is used to determine the drilling type, location, and corresponding tool number of each hole on the drilling layer based on the analysis data of the printed circuit board to be processed. The layer number determination module is used to analyze the inner layer and determine the number of layers; The graphic boundary calculation module is used to extract graphic coordinate data and calculate graphic boundaries based on the analysis data of the printed circuit board to be processed. The origin coordinate update module is used to modify the origin coordinates based on the graphic coordinate data to obtain new origin coordinates; The layout model creation module is used to calculate the position of each graphic in the panel and create a layout model based on the user's layout instructions, the graphic boundaries, and the new origin coordinates. The inner layer attribute determination module is used to determine the positive and negative attributes of each inner layer of the printed circuit board to be processed. The parameter addition module is used to determine the parameters of the electroplated edge and the adhesive strip based on the positive and negative properties of each inner layer; The panel size determination module is used to find the layers that need to have process edges added from the printed circuit board to be processed according to the pre-set process edge addition requirements, add the corresponding process edges, and determine the panel size. The drilling addition module is used to add attachment board holes, machined positioning holes, electroplated wire holes, spare positioning holes and inner layer alignment holes, as well as corresponding tool numbers, to the panelization model based on the analysis data of the printed circuit board to be processed and the user panelization instructions, and add them to the drilling layer to obtain a new drilling layer. The second character layer update module is used to obtain the system time, unit, and drawing number, and to mark the system time, unit, and drawing number in a pre-selected layer in the layout model, and to update the character layer; The pad adding module is used to add target pads, silkscreen alignment pads, spare positioning system pads and inner layer alignment target pads on the panel model according to preset instructions. The attachment plate processing module is used to add attachment plate cutting holes and attachment plate cutting direction lines to the assembly model based on the attachment plate holes. The process method and blanking size determination module is used to determine the process method and blanking size based on the number of layers; The electroplating area calculation module is used to calculate the actual electroplating area of ​​each layer based on the parameters of the electroplating edge and the adhesive strip. The final layout determination module is used to mark the layout size, the cutting size and the electroplating area on the board surface, and update the character layer to obtain the final layout model and the corresponding process method.

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