Laser die bonder

Abstract

A laser die bonding apparatus includes a fixed laser emitter, at least one optical mask located on a light path of the fixed laser emitter, a carrier stage, and a getter that is transparent to light. The carrier stage is used to carry a substrate and is movable relative to the fixed laser emitter so that the substrate is located on the light path. The getter is used to pick up a die and adhere the die to a glue, and further attach the die to the substrate on the light path through the glue. When the die is attached to the substrate on the light path through the glue, the fixed laser emitter is capable of emitting a laser beam that passes through at least one of the optical masks and the getter along the light path and is projected on the die. Accordingly, the laser die bonding apparatus effectively improves operation and production efficiency by using a fixed laser emitter that does not move.

Description

Technical Field

[0001] This invention relates to a die bonding device, and more particularly to a laser die bonding device employing a fixed laser emitter. Background Technology

[0002] Existing die bonding equipment includes a pre-bonding unit and a die bonding unit located downstream of the pre-bonding unit. The pre-bonding unit of the existing die bonding equipment is used to sequentially deposit colloids and chips on multiple carriers, while the die bonding unit is used to cure multiple colloids by heating at ambient temperature (e.g., baking). However, there is clearly room for improvement in the operating mechanism or production efficiency of existing die bonding equipment.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved. He devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] An embodiment of the present invention provides a laser-based die bonding device that can effectively improve the defects that may occur in existing production equipment.

[0005] An embodiment of the present invention discloses a laser-type die bonding apparatus, comprising: a fixed laser emitter located at a predetermined position and defining a light emission path; at least one photomask located on the light emission path of the fixed laser emitter; a support stage for supporting a substrate, and the support stage is movable relative to the fixed laser emitter to position the substrate on the light emission path; and

[0006] A sensor, which is light-transmitting, is used to acquire a chip and adhere the chip to an adhesive; wherein the sensor is capable of moving the chip with the adhesive attached so that the chip is attached to a substrate located on a light-emitting path through the adhesive; wherein when the chip is attached to the substrate located on the light-emitting path with the adhesive, a fixed laser emitter can emit a laser beam that passes through at least one photomask along the light-emitting path and through the sensor and is projected onto the chip.

[0007] Preferably, at least one photomask is provided, and the multiple photomasks have different patterns, and the multiple photomasks allow one of the photomasks to be selectively moved onto the light output path of the fixed laser emitter.

[0008] Preferably, when the chip is attached to the substrate located on the light emission path with an adhesive, multiple photomasks can be moved sequentially onto the light emission path so that the laser beam emitted by the self-fixed laser emitter can pass through at least two photomasks at different times, and pass through the collector and be projected onto the chip with different light shapes.

[0009] Preferably, the acquirer has a head for acquiring the chip, and at least one photomask is disposed within the acquirer and adjacent to the head.

[0010] Preferably, the acquirer has a head for acquiring the chip, and the acquirer is formed with a slot adjacent to the head, at least one photomask being detachably inserted into the slot of the acquirer.

[0011] Preferably, the laser die bonding apparatus includes a substrate camera adjacent to the fixed laser emitter for acquiring the position of the substrate located on the support stage.

[0012] Preferably, the laser die bonding device includes a chip calibrator located upstream of a fixed laser emitter for calibrating the position of the chip with the adhesive attached.

[0013] Preferably, the acquirer includes a chip heater for heating the chip before the acquirer attaches the chip to the substrate.

[0014] Preferably, the carrier stage includes a substrate heater, which heats the substrate before the acquirer attaches the chip to the substrate.

[0015] An embodiment of the present invention also discloses a laser-type die bonding apparatus, comprising: a fixed laser emitter located at a predetermined position and defining a light emission path; at least one photomask located on the light emission path of the fixed laser emitter; a support stage for supporting a substrate, and the support stage is movable relative to the fixed laser emitter to position the substrate on the light emission path; and a cyclic workstation having multiple stations arranged on a circular path, the cyclic workstation including multiple pickups that move along the circular path, and each pickup being transparent and capable of sequentially moving along the circular path. The process passes through multiple stations, including: a chip supply station for any acquirer that moves there to acquire a chip; an adhesive station for any acquirer that moves there to adhere the acquired chip to an adhesive; and a die bonding station, located corresponding to a fixed laser emitter, for any acquirer that moves there to press the acquired chip and attach the chip to a substrate located on the light emission path through the adhesive; in the die bonding station, the fixed laser emitter emits a laser beam that passes along the light emission path through at least one photomask and through an acquirer to project onto the chip.

[0016] Preferably, the plurality of stations includes a chip calibration station located between the adhesive station and the die bonding station, and the laser die bonding equipment includes a chip calibrator positioned corresponding to the chip calibration station for calibrating the position of a chip moved to any of the pickers at the chip calibration station.

[0017] Preferably, at least one photomask is provided, and the multiple photomasks have different patterns, and the multiple photomasks allow one of the photomasks to be selectively moved onto the light output path of the fixed laser emitter.

[0018] Preferably, in the die bonding station, multiple photomasks can be moved sequentially onto the light output path so that the laser beam emitted from the fixed laser emitter can pass through at least two photomasks at different times, and pass through the collector and be projected onto the chip with different light shapes.

[0019] Preferably, the laser die bonding equipment includes a substrate camera positioned corresponding to the die bonding station, for acquiring the position of the substrate located on the support stage.

[0020] Preferably, the laser die bonding equipment includes a chip supply device located at a chip supply station, for any acquirer that moves to the chip supply station to acquire a chip.

[0021] Preferably, multiple acquirers can operate synchronously at multiple sites.

[0022] Preferably, the number of at least one photomask is equal to the number of multiple acquirers, each acquirer having a head for acquiring the chip, and each photomask is disposed within an acquirer and adjacent to the head.

[0023] Preferably, each acquirer has a head for acquiring chips, and each acquirer forms a slot adjacent to the head, with at least one photomask detachably inserted into the slot of any acquirer.

[0024] Preferably, the acquirer includes a chip heater for heating the chip before the acquirer attaches the chip to the substrate.

[0025] Preferably, the carrier stage includes a substrate heater, which heats the substrate before the acquirer attaches the chip to the substrate.

[0026] In summary, the laser die bonding equipment disclosed in the embodiments of the present invention presses the chip against the substrate using the pickup device and cures the colloid located between the chip and the substrate using the fixed laser emitter, thereby improving the curing method of the heating environment temperature and effectively enhancing the operation and production efficiency of the laser die bonding equipment.

[0027] Furthermore, the laser die bonding equipment disclosed in the embodiments of the present invention uses a fixed laser emitter that does not move, which reduces the alignment difficulty in the colloid curing process and facilitates the use of a larger and more powerful laser emitter, thereby further improving the operation and production efficiency of the laser die bonding equipment.

[0028] To further understand the features and technical content of this invention, please refer to the following detailed description and drawings of this invention. However, these descriptions and drawings are only for illustrating this invention and are not intended to limit the scope of protection of this invention in any way. Attached Figure Description

[0029] Figure 1 This is a top view schematic diagram of the laser die bonding device according to Embodiment 1 of the present invention.

[0030] Figure 2A for Figure 1 The diagram shows the subsequent actions.

[0031] Figure 2B This is a side view of the adhesive station of the laser-type die bonding equipment.

[0032] Figure 2C for Figure 2B The diagram shows the subsequent actions.

[0033] Figure 3 for Figure 2A The diagram shows the subsequent actions.

[0034] Figure 4A for Figure 3 The diagram shows the subsequent actions.

[0035] Figure 4B This is a side view of the die bonding station of the laser die bonding equipment.

[0036] Figure 4C for Figure 4B The diagram shows the subsequent actions.

[0037] Figure 4D for Figure 4C The diagram shows the subsequent actions.

[0038] Figure 5 This is a side view of the die bonding station of the laser die bonding equipment according to Embodiment 2 of the present invention.

[0039] Figure 6 This is a side view of the die bonding station of the laser die bonding equipment according to Embodiment 3 of the present invention.

[0040] Figure 7 This is a side view of the die bonding station of the laser die bonding device according to Embodiment 4 of the present invention. Detailed Implementation

[0041] The following specific embodiments illustrate the implementation of the "laser-type die bonding device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0042] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0043] [Example 1]

[0044] Please see Figures 1 to 4D As shown, this is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a laser die bonding device 1000, which includes a cyclic workstation S and multiple devices D located corresponding to the cyclic workstation S. The cyclic workstation S has multiple stations S' along a circular path, and the cyclic workstation S includes multiple acquisition devices S1 that move along the circular path. Each acquisition device S1 is light-transmitting and can pass through multiple stations S' one by one along the circular path.

[0045] In this embodiment, the ring path is circular, the number of multiple acquisition devices S1 is not less than (e.g., equal to) the number of multiple stations S', and the multiple acquisition devices S1 can operate synchronously at the multiple stations S' respectively, thereby improving the overall operating efficiency of the laser die bonding device 1000, but the present invention is not limited thereto.

[0046] More specifically, each of the stations S' is, for example, a work area, and the multiple stations S' have different but related functions and distinct area sizes. In this embodiment, the multiple stations S' sequentially include a chip supply station S100, an adhesive station S200, a chip calibration station S300, and a die bonding station S400 along the circular path (that is, the chip calibration station S300 is located between the adhesive station S200 and the die bonding station S400), but the invention is not limited thereto. For example, in other embodiments not shown in this invention, the number and order of the multiple stations S' can be increased or decreased according to requirements.

[0047] Furthermore, in this embodiment, the plurality of devices D include a chip supply device 100 located at the chip supply station S100, an adhesive supply device 200 located at the adhesive station S200, a chip calibrator 300 located at the chip calibration station S300, and a die bonding device 400 located at the die bonding station S400, but the present invention is not limited thereto.

[0048] For example, in other embodiments of the present invention not shown, a portion of the plurality of stations S' (e.g., the chip calibration station S300) and their corresponding devices D (e.g., the chip calibrator 300) may be reduced according to design requirements; or, the laser die bonding device 1000 may also be equipped with new stations and their corresponding devices according to design requirements.

[0049] To facilitate understanding of the specific operation of the laser-type die bonding device 1000 in this embodiment, the function and purpose of each device D and its corresponding station S' are described below. The operation process of multiple acquisition devices S1 is the same, so the accompanying drawings of this embodiment only illustrate the operation of one acquisition device S1, but the present invention is not limited thereto.

[0050] like Figure 1 As shown, the chip supply device 100 can continuously supply chips C for any of the acquirers S1 to acquire; that is, the chip supply device 100 corresponds to the chip supply station S100 by its position, so that any of the acquirers S1 that moves to the chip supply station S100 can acquire one chip C.

[0051] Furthermore, such as Figures 2A to 2CAs shown, the glue supply 200 is located downstream of the chip supply station S100, and the glue supply 200 corresponds to the adhesive station S200 in its position, so that any of the pickers S1 moving to the adhesive station S200 can adhere a chip C to a glue G (that is, the picker S1 is used to pick up a chip C and adhere it with glue G). More specifically, in this embodiment, the glue supply 200 may be a container filled with glue, and the picker S1 can move the chip C it has picked up toward the glue supply 200 to adhere the glue G.

[0052] like Figure 3 As shown, the chip calibrator 300 is located downstream of the adhesive supply 200, and its position corresponds to the chip calibration station S300, used to correct the position of the chip C that has moved to any of the pickups S1 at the chip calibration station S300. The chip calibrator 300 can be used to correct the chip C with the adhesive G adhered to it (e.g., ...). Figure 2C The location of the crystal is such that it facilitates the precise execution of subsequent crystal bonding operations.

[0053] like Figures 4A to 4D As shown, the die bonding device 400 includes a fixed laser emitter 1, a support stage 2, a substrate camera 3, and a photomask unit 4. The fixed laser emitter 1 is, for example, a laser-assisted bonder (LAB) system, and is located downstream of the chip calibrator 300 (i.e., the chip calibrator 300 is upstream of the fixed laser emitter 1). Furthermore, the fixed laser emitter 1 is located at a predetermined position and defines a light emission path P. That is, in this embodiment, the fixed laser emitter 1 will not move away from the predetermined position, excluding any moving laser emitters.

[0054] The support platform 2 is used to support at least one substrate B, and in the accompanying drawings of this embodiment, the support platform 2 is used to support multiple substrates B. However, for ease of explanation, the following only describes the case where the support platform 2 supports one substrate B. The support platform 2 is movable relative to the fixed laser emitter 1 so that one substrate B is located on the light emission path of the fixed laser emitter 1. Furthermore, the position of the substrate camera 3 corresponds to the die bonding station S400, and is used to obtain the position of the substrate B located on the support platform 2.

[0055] The photomask unit 4 includes at least one photomask 41 located on the light emission path P. In this embodiment, the number of photomasks 41 included in the photomask unit 4 is described as multiple, but the invention is not limited thereto. The multiple photomasks 41 have different patterns, and one of the multiple photomasks 41 can be selectively moved onto the light emission path P of the fixed laser emitter 1.

[0056] The positions of the fixed laser emitter 1, the carrier stage 2, the substrate camera 3, and the photomask unit 4 described above all correspond to the die bonding station S400, so that the die bonding station S400, by being positioned corresponding to the fixed laser emitter 1, allows any of the acquisition devices S1 that move there to press the chip C it has acquired, and causes the chip C to adhere to the substrate B located on the light emission path P through the colloid G (that is, the acquisition device S1 can be used to move the chip C with the colloid G adhered to it, so that the colloid G adheres to the substrate B located on the light emission path).

[0057] In the die bonding station S400, the fixed laser emitter 1 emits a laser beam that passes through at least one photomask 41 along the light emission path P and through one of the pickups S1 before being projected onto the chip C. Alternatively, when the chip C is attached to the substrate B located on the light emission path P with the colloid G, the pickup S1 presses the chip C against the substrate B, and the fixed laser emitter 1 emits a laser beam that passes through at least one photomask 41 along the light emission path P and through the pickup S1 before being projected onto the chip C.

[0058] Accordingly, the laser die bonding equipment 1000 disclosed in this embodiment presses the chip C against the substrate B through the acquisition device S1, and uses the fixed laser emitter 1 in conjunction with at least one photomask 41 to cure the colloid G located between the chip C and the substrate B, thereby replacing the curing method of heating the ambient temperature, and thus effectively improving the operation and production efficiency of the laser die bonding equipment 1000.

[0059] Furthermore, the laser die bonding equipment 1000 disclosed in this embodiment uses a fixed laser emitter 1 that does not move, which reduces the alignment difficulty during the curing process of the colloid G and facilitates the use of a larger and more powerful laser emitter, thereby further improving the operation and production efficiency of the laser die bonding equipment 1000.

[0060] Furthermore, in the die bonding station S400, multiple photomasks 41 can be moved sequentially onto the light emission path P, so that the laser beam emitted from the fixed laser emitter 1 can pass through at least two photomasks 41 at different times, and pass through the collector S1 with different light shapes and be projected onto the chip C. In other words, when the chip C is attached to the substrate B located on the light emission path P with the colloid G, multiple photomasks 41 can be moved sequentially onto the light emission path P, so that the laser beam emitted from the fixed laser emitter 1 can pass through at least two photomasks 41 at different times, and pass through the collector S1 with different light shapes (e.g., at least two light shapes) and be projected onto the chip C.

[0061] Furthermore, in this embodiment, the plurality of photomasks 41 are configured according to design requirements and allow the laser beam to pass through to form various light shapes with different functions. For example, among at least two light shapes that pass through the acquisition unit S1 and are projected onto the chip C, the first light shape is used to focus and solidify the outer portion of the colloid G, while the second light shape is used to focus and solidify the inner portion of the colloid G, thereby enabling the colloid G to be solidified gradually and stably from the outside in.

[0062] It should be further noted that, in this embodiment, the laser die bonding device 1000 is described using a cyclic workstation S in conjunction with a plurality of corresponding devices D, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the laser die bonding device 1000 may also include the fixed laser emitter 1, at least one photomask 41, the support stage 2, and the acquisition device S1; that is, the laser die bonding device 1000 may operate through at least one acquisition device S1 but may not have the cyclic workstation S.

[0063] [Example 2]

[0064] Please see Figure 5 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0065] In this embodiment, the die bonding device 400 does not include any of the photomasks 41, and the cyclic workstation S preferably includes a plurality of photomasks S2, the number of which is equal to the number of the plurality of acquirers S1. Each acquirer S1 has a head S11 for acquiring the chip C, and each acquirer S1 forms a slot S12 adjacent to the head S11, and any photomask S2 can be detachably inserted into the slot S12 of one acquirer S1.

[0066] [Example 3]

[0067] Please see Figure 6 As shown, this is Embodiment 3 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 1 are roughly explained as follows:

[0068] In this embodiment, the die bonding device 400 does not include any of the photomasks 41, and the cyclic workstation S preferably includes a plurality of photomasks S2, the number of which is equal to the number of the plurality of acquirers S1. Each acquirer S1 has a head S11 for acquiring the chip C, and each photomask S2 is disposed within one acquirer S1 and adjacent to the head S11.

[0069] [Example 4]

[0070] Please see Figure 7 As shown, this is Embodiment Four of the present invention. Since this embodiment is similar to Embodiments One to Three described above, the similarities between these embodiments will not be repeated. The differences between this embodiment and the above embodiments are roughly explained as follows:

[0071] In this embodiment, each of the acquisition devices S1 further includes a chip heater S13 adjacent to the head S11, and the chip heater S13 is annular and disposed outside the light emission path P, so that the acquisition device S1 can heat the chip C by the chip heater S13 before the acquisition device S1 presses the chip C against (or attaches it to) the substrate 2.

[0072] Furthermore, the carrier stage 2 may also be provided with a substrate heater 21, so that the carrier stage 2 can heat the substrate B by the substrate heater 21 before the acquirer S1 presses the chip C against (or attaches it to) the substrate 2.

[0073] Accordingly, the chip C and the substrate B can be heated to a default temperature by the chip heater S13 and the substrate heater 21, respectively. Then, the acquirer S1 presses the chip C against the substrate 2 so that the chip C and the substrate 2 can be connected at the default temperature, thereby improving the efficiency, stability and accuracy of the connection.

[0074] Furthermore, in this embodiment, the laser die bonding apparatus 1000 is described with both the chip heater S13 and the substrate heater 21 simultaneously provided, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the laser die bonding apparatus 1000 may only have one of the chip heater S13 and the substrate heater 21. Furthermore, the chip heater S13 may also be configured in any of the acquisition devices S1 described in Embodiment 1 or Embodiment 2.

[0075] [Technical Effects of Embodiments of the Invention]

[0076] In summary, the laser die bonding equipment disclosed in the embodiments of the present invention presses the chip against the substrate using the pickup device and cures the colloid located between the chip and the substrate using the fixed laser emitter, thereby improving the curing method of the heating environment temperature and effectively improving the operation and production efficiency of the laser die bonding equipment.

[0077] Furthermore, the laser die bonding equipment disclosed in the embodiments of the present invention uses a fixed laser emitter that does not move, which reduces the alignment difficulty in the colloid curing process and facilitates the use of a larger and more powerful laser emitter, thereby further improving the operation and production efficiency of the laser die bonding equipment.

[0078] Furthermore, the at least one photomask of the laser die bonding device disclosed in the embodiments of the present invention, which is used in conjunction with the fixed laser emitter, can be constructed according to design requirements (e.g., multiple photomasks allow one of the photomasks to be selectively moved onto the light output path; or, at least one photomask can be detachably inserted into the slot of the acquirer; or, at least one photomask is disposed within the acquirer), thereby enabling the laser die bonding device to have a wider range of applications.

[0079] The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included in the patent scope of the present invention.

Claims

1. A laser-type die bonding device, characterized in that, The laser-type die bonding equipment includes: A fixed laser emitter is located at a predetermined position and has a defined light emission path; At least one photomask is located on the light output path of the fixed laser emitter; A support platform for supporting a substrate, and the support platform is movable relative to the fixed laser emitter to position the substrate in the light emission path; and A sensor, the sensor being light-transmitting, is used to acquire a chip and adhere the chip to an adhesive; wherein the sensor is capable of moving the chip with the adhesive attached, so that the chip passes through the adhesive and adheres to the substrate located on the light emission path; When the chip is attached to the substrate located on the light emission path with the colloid, the fixed laser emitter can emit a laser beam that passes through at least one photomask along the light emission path and through the collector before being projected onto the chip.

2. The laser die bonding device according to claim 1, characterized in that, At least one of the photomasks is multiple, and the multiple photomasks have different patterns, and the multiple photomasks allow one of the photomasks to be selectively moved onto the light output path of the fixed laser emitter.

3. The laser die bonding device according to claim 2, characterized in that, When the chip is attached to the substrate located on the light emission path with the colloid, a plurality of photomasks can be moved sequentially onto the light emission path so that the laser beam emitted from the fixed laser emitter can pass through at least two of the photomasks at different times, and pass through the collector with different light shapes and be projected onto the chip.

4. The laser die bonding equipment according to claim 1, characterized in that, The acquirer has a head for acquiring the chip, and at least one of the photomasks is disposed within the acquirer and adjacent to the head.

5. The laser die bonding device according to claim 1, characterized in that, The acquirer has a head for acquiring the chip, and the acquirer has a slot adjacent to the head, and at least one of the photomasks can be detachably inserted into the slot of the acquirer.

6. The laser die bonding device according to claim 1, characterized in that, The laser die bonding apparatus includes a substrate camera adjacent to the fixed laser emitter for acquiring the position of the substrate located on the support platform.

7. The laser die bonding device according to claim 1, characterized in that, The laser-type die bonding device includes a chip calibrator located upstream of the fixed laser emitter for calibrating the position of the chip to which the colloid is adhered.

8. The laser die bonding device according to claim 1, characterized in that, The acquirer includes a chip heater for heating the chip before attaching it to the substrate.

9. The laser die bonding device according to claim 1, characterized in that, The carrier stage includes a substrate heater, which heats the substrate before the acquirer attaches the chip to the substrate.

10. A laser-type die bonding device, characterized in that, The laser-type die bonding equipment includes: A fixed laser emitter is located at a predetermined position and has a defined light emission path; At least one photomask is located on the light output path of the fixed laser emitter; A support platform for supporting a substrate, and the support platform is movable relative to the fixed laser emitter so that the substrate is positioned on the light emission path; A circular workstation has multiple stations along a circular path. The circular workstation includes multiple sensors that move along the circular path, and each sensor is translucent and can pass through the multiple stations sequentially along the circular path. The multiple stations include: A chip supply station for enabling any of the acquirers that move there to acquire a chip; An adhesive station for allowing any of the acquirers moved thereto to adhere an adhesive to the chip acquired by that acquirer; and A die bonding station, positioned corresponding to the fixed laser emitter, is provided for any of the acquirers moved there to press the chip acquired by the acquirer and for the chip to be attached to the substrate located on the light emission path via the colloid; in the die bonding station, the fixed laser emitter can emit a laser beam that passes along the light emission path through at least one of the photomasks and through one of the acquirers and is projected onto the chip.

11. The laser die bonding device according to claim 10, characterized in that, The plurality of stations include a chip calibration station located between the adhesive station and the die bonding station, and the laser die bonding device includes a chip calibrator positioned corresponding to the chip calibration station for calibrating the position of the chip moved to any of the acquirers at the chip calibration station.

12. The laser die bonding device according to claim 10, characterized in that, At least one of the photomasks is multiple, and the multiple photomasks have different patterns, and the multiple photomasks allow one of the photomasks to be selectively moved onto the light output path of the fixed laser emitter.

13. The laser die bonding device according to claim 12, characterized in that, In the die bonding station, multiple photomasks can be moved sequentially onto the light output path so that the laser beam emitted from the fixed laser emitter can pass through at least two photomasks at different times, and pass through the collector with different light shapes and be projected onto the chip.

14. The laser die bonding device according to claim 10, characterized in that, The laser die bonding equipment includes a substrate camera positioned corresponding to the die bonding station, for acquiring the position of the substrate located on the support platform.

15. The laser die bonding device according to claim 10, characterized in that, The laser die bonding equipment includes a chip supply device located at the chip supply station, for any of the acquirers that moves to the chip supply station to acquire a chip.

16. The laser die bonding device according to claim 10, characterized in that, Multiple acquisition devices can operate synchronously at multiple sites.

17. The laser die bonding device according to claim 10, characterized in that, The number of at least one photomask is equal to the number of multiple acquisition devices, each acquisition device having a head for acquiring the chip, and each photomask being disposed within and adjacent to one of the acquisition devices.

18. The laser die bonding device according to claim 10, characterized in that, Each of the acquirers has a head for acquiring the chip, and each of the acquirers forms a slot adjacent to the head, and at least one of the photomasks can be detachably inserted into the slot of any of the acquirers.

19. The laser die bonding device according to claim 10, characterized in that, The acquirer includes a chip heater for heating the chip before attaching it to the substrate.

20. The laser die bonding device according to claim 10, characterized in that, The carrier stage includes a substrate heater, which heats the substrate before the acquirer attaches the chip to the substrate.

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